WO2013145202A1 - Système de collecte de données de carte de tranche et procédé de collecte de données de carte de tranche - Google Patents

Système de collecte de données de carte de tranche et procédé de collecte de données de carte de tranche Download PDF

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Publication number
WO2013145202A1
WO2013145202A1 PCT/JP2012/058316 JP2012058316W WO2013145202A1 WO 2013145202 A1 WO2013145202 A1 WO 2013145202A1 JP 2012058316 W JP2012058316 W JP 2012058316W WO 2013145202 A1 WO2013145202 A1 WO 2013145202A1
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WO
WIPO (PCT)
Prior art keywords
wafer
image
map data
wafer map
die
Prior art date
Application number
PCT/JP2012/058316
Other languages
English (en)
Japanese (ja)
Inventor
英希 保坂
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to CN201280071771.9A priority Critical patent/CN104246999B/zh
Priority to JP2014507168A priority patent/JP5761771B2/ja
Priority to PCT/JP2012/058316 priority patent/WO2013145202A1/fr
Publication of WO2013145202A1 publication Critical patent/WO2013145202A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Definitions

  • the present invention relates to a wafer map data collation system and a wafer map data collation method for collating wafer images and wafer map data images.
  • a wafer is bonded to a dicing sheet, diced, and divided into a large number of dies (semiconductor chips). Since one wafer contains defective dies, the die inspection process inspects the quality of each die, attaches a bad mark with ink to the defective dies, and the die mounting process images each die with a camera. Then, the presence / absence of a bad mark is image-recognized, and only good dies (good chips) are picked up sequentially from the wafer and mounted on the substrate.
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-250834
  • wafer map data indicating the quality of the die at each position of the wafer after dicing
  • the die mounting process a method of picking up only non-defective dies (non-defective chips) from the wafer in order using the wafer map data and mounting them on the substrate has become mainstream.
  • Patent Document 2 Japanese Patent Laid-Open No. 2008-31430
  • a technique for automatically comparing an actual wafer and wafer map data using a pattern matching technique has been proposed.
  • a camera and an illumination light source are arranged on opposite sides of a dicing sheet with a wafer attached thereto, and an image is taken by illuminating with an illumination light source from the back side of the wafer (dicing sheet) when viewed from the camera side. This facilitates image recognition of each die on the wafer.
  • Patent Document 2 the camera and the illumination light source are arranged opposite to each other with the dicing sheet interposed therebetween, but the dicing sheet adsorbed below the dicing sheet of the die pickup device is picked up. Since it is necessary to arrange a push-up mechanism that pushes up the sticking part of the die to be pushed up with a push-up pin and partially peels off the sticking part of the die from the dicing sheet, an illumination light source (or camera) is provided below the dicing sheet. ) Is difficult to arrange (see Patent Document 3).
  • the actual wafer image and the wafer map data image are displayed side by side on the screen of the display device, and the operator visually checks the actual wafer image and the wafer map data image to determine the suction start die.
  • the collation work requires skill, and if a less skilled worker performs the collation work, the position of the die will shift. May be collated. If the matching position of the die is shifted, picking up the die according to the wafer map data will pick up the die while shifting the position of the non-defective / defective product, resulting in a defective substrate. It will be.
  • the problem to be solved by the present invention is to provide a wafer map data collation system and wafer map data in which an operator can easily and accurately collate an actual wafer image displayed on a screen of a display device with a wafer map data image. It is to provide a verification method.
  • the present invention provides a wafer image obtained by imaging at least a part of a wafer diced so as to be divided into a plurality of dies, and wafer map data indicating the quality of dies at each position of the wafer
  • a wafer map data collation system comprising: a display device that displays an image; and an operation unit that performs an operation of collating the wafer image and the wafer map data image.
  • the wafer map data image is the same as the wafer image. Displayed as an array image of dies, and the operation means moves the display position of the wafer image or the wafer map data image on the screen of the display device to superimpose the wafer image and the wafer map data image. By matching, the wafer image and the wafer map data image are collated. And it is characterized in Rukoto.
  • the display position of the wafer image or wafer map data image is moved on the screen of the display device, and the wafer image and the wafer map data image are overlapped and matched to thereby match the wafer image and the wafer map data image. Since the collation can be performed, the operator can easily and accurately collate the actual wafer image displayed on the screen of the display device and the wafer map data image visually.
  • the operator may operate the operation means and designate the suction start die in a state where the wafer image and the wafer map data image are overlapped and matched. As a result, the operator can easily and accurately specify the suction start die visually.
  • the part without the die and the part with the die may be divided by different backgrounds (color display, gray display, pattern, etc.).
  • the operator can easily and accurately determine the die at the peripheral edge of the wafer displayed in the wafer map data image.
  • the wafer map data image it is preferable to display a mark (a symbol, a character, a mark, a color display, a gray display, etc.) on a defective die section.
  • a mark a symbol, a character, a mark, a color display, a gray display, etc.
  • the operator can easily visually confirm the position of the defective die on the screen of the display device.
  • a bad mark is attached to the defective die on the wafer, it is easy to visually confirm that the bad mark position on the wafer image matches the defective die mark position on the wafer map data image. Can do.
  • FIG. 1 is an external perspective view of a die supply apparatus according to an embodiment of the present invention.
  • FIG. 2 is an external perspective view of the push-up unit and its peripheral part.
  • FIG. 3 is an external perspective view of the wafer pallet.
  • FIG. 4 is a partially broken enlarged view showing a state in which the push-up pot is raised to the suction position during the push-up operation.
  • FIG. 5 is a partially broken enlarged view showing a state in which the push-up pin is protruded from the push-up pot during the push-up operation.
  • FIG. 6 shows an example of wafer map data.
  • FIG. 7A shows an example of a wafer image
  • FIG. 7B shows an example of a wafer map data image.
  • FIG. 8A is a diagram showing a state in the middle of the image overlay operation
  • FIG. 8B is a diagram showing a state in which the image overlay operation is completed.
  • the die pick-up device 11 includes a magazine holding unit 22 (tray tower), a pallet drawer table 23, an XY moving mechanism 25, a push-up unit 28 (see FIG. 2), and the like, and the pallet drawer table 23 is a component mounter (not shown). Is set to the state where it is plugged in.
  • wafer pallets 32 equipped with wafer extending bodies 30 are stacked in multiple stages.
  • the pallet 32 is pulled out on the pallet drawer table 23.
  • the wafer extending body 30 is formed by attaching an expandable / shrinkable dicing sheet 34 with a die 31 formed by dicing the wafer into a grid pattern on a wafer mounting plate 33 having a circular opening.
  • the wafer mounting plate 33 is mounted in an expanded state, and the wafer mounting plate 33 is attached to the pallet main body 35 by screws or the like.
  • the push-up unit 28 (see FIG. 2) is configured to be movable in the XY direction in a space area below the dicing sheet 34 of the wafer pallet 32. And the sticking part of the die 31 to be picked up (sucked) in the dicing sheet 34 is pushed up from below and pushed up locally by a push-up pin 39 (see FIGS. 4 and 5) of the pot 37, so that the die The sticking part of 31 is partly peeled off from the dicing sheet 34 so that the die 31 can be easily lifted.
  • the push-up unit 28 is configured such that the push-up unit 28 as a whole moves up and down using a servo motor (not shown) as a drive source.
  • a servo motor not shown
  • the stopper unit not shown
  • the push-up pin 39 protrudes upward from the upper surface of the push-up pot 37, and the sticking portion of the die 31 to be picked up in the dicing sheet 34 To come up.
  • the push-up height position (push-up amount) of the push-up pin 39 can be adjusted by adjusting the rotation amount of the servo motor serving as the drive source.
  • the suction head 41 and the camera 42 are assembled to the XY movement mechanism 25, and the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY movement mechanism 25. ing.
  • the suction head 41 is provided with a suction nozzle 43 (see FIGS. 4 and 5) that sucks the die 31 on the dicing sheet 34 so as to move up and down.
  • the camera 42 can recognize the position of the die 31 to be sucked by the suction nozzle 43 by picking up an image of the die 31 on the dicing sheet 34 from above and processing the picked-up image.
  • a control device (not shown) of the die pick-up device 11 processes an image obtained by picking up the die 31 to be attracted by the camera 42 out of the dies 31 on the dicing sheet 34 and positions the die 31. , The push-up position and suction position of the die 31 are determined, and the sticking portion of the die 31 to be picked up (sucked) out of the dicing sheet 34 is pushed up from below as shown in FIG. The sticking portion of the die 31 is lifted locally by the push-up pins 39 of the die 37 so that the die 31 is lifted to a state where it can be easily picked up by partially peeling the die 31 from the dicing sheet 34. Adsorb and pick up.
  • a wafer manufacturer / manufacturer manufactures wafer map data (figure) indicating the quality of the die 31 at each position of the wafer after dicing based on the die inspection result. 6) and provide the wafer map data together with the wafer to the die mounting board manufacturing company.
  • a die mounting board manufacturing company uses the die pick-up device 11 to sequentially pick up only non-defective dies (non-defective chips) from the wafer according to the wafer map data and mount them on the substrate.
  • the actual wafer image and wafer map data image captured by the camera 42 are displayed on the screen of a display device (not shown), and both images are displayed as follows. To verify.
  • the bad die of the wafer is marked with a bad mark with ink so that the operator can visually confirm the defective die.
  • the defective die is not marked with a bad mark. Also good.
  • the wafer map data image is the same die arrangement image as the wafer image, and the sections of each die partitioned by grid lines are displayed in the same size as each die of the wafer image.
  • the wafer map data image is divided into different backgrounds (color display, gray display, pattern, etc.) where there are no dies and where there are dies, and the peripheral dies on the wafer displayed in the wafer map data image are displayed. An operator can easily and accurately discriminate visually.
  • the wafer map data image has marks (symbols, characters, marks, color display, gray display, etc.) displayed on the defective die sections, and the operator can easily visually check the position of the defective die on the display device screen. It can be confirmed.
  • the operation of collating the actual wafer image displayed on the screen of the display device with the wafer map data image is performed by an operator operating an input device (operation means) such as a mouse or a keyboard, or the screen of the display device is
  • an input device operation means
  • the operator touches the screen of the display device with a finger or the like, and the wafer image or wafer map data is displayed on the screen of the display device as shown in FIG.
  • FIG. 8B the display position of the image is moved and overlapped so that each die of the wafer image and each die section of the wafer map data image are matched.
  • a bad mark in the wafer is marked with a bad mark, it is easy to visually confirm that the position of the bad mark in the wafer image matches the position of the defective die in the wafer map data image. Can be confirmed.
  • the operator operates the input device such as a mouse or a keyboard or the touch panel to designate the suction start die. Thereafter, production is started, and only good dies are picked up in order from the suction start die according to the wafer map data and mounted on the substrate.
  • an operator operates an input device such as a mouse or a touch panel to move the display position of the wafer image or the wafer map data image on the screen of the display device, so that the wafer image and the wafer are moved.
  • the wafer image and the wafer map data image can be collated, so that the operator can visually check the actual wafer image and the wafer map data image displayed on the display device screen.
  • the workability of collation work is good and the setup time can be shortened.
  • the operator can easily and accurately specify the suction start die by visual observation, it is possible to prevent erroneous suction of the defective die and to prevent the production of defective substrates.
  • the image of the entire wafer and the entire image of the wafer map data are displayed on the screen of the display device.
  • the display device A part of the wafer image captured by the camera 42 is displayed on the screen, and a part of the wafer map data corresponding to the display part is displayed, and one of the images is moved to superimpose both images. By matching them together, the wafer image and the wafer map data image may be collated.
  • the display magnification of the wafer image and wafer map data image displayed on the screen of the display device has a function to adjust the display magnification of the wafer image and wafer map data image displayed on the screen of the display device, and the display magnification of the wafer image and wafer map data image can be adjusted on the screen of the display device by the operator's operation. It may be possible to adjust.
  • the die pickup apparatus 11 of the present embodiment is configured such that the suction head 41 and the camera 42 are integrally moved in the XY direction by the XY moving mechanism 25. However, the suction head 41 and the camera 42 are moved only in the X direction. In addition, the wafer pallet 32 may be moved in the Y direction on the pallet drawer table 23 so that the position of the die 31 to be imaged / sucked moves in the XY direction.
  • the present invention can be implemented with various modifications within a range not departing from the gist, such as the configuration of the die pick-up device 11 and the configuration of the wafer pallet 32 may be appropriately changed.

Abstract

Selon la présente invention, par rapport à une image de données de carte de tranche, dans une image réseau des puces qui est identique à l'image de la tranche capturée par une caméra, le compartiment de chaque puce divisé par des lignes en forme de treillis est affiché à la même dimension que celle de chaque puce de l'image de la tranche. Un travailleur agit sur un écran tactile ou dispositif de saisie tel qu'une souris ou un clavier, déplace la position d'affichage de l'image de la tranche ou de l'image de données de carte de tranche sur l'écran du dispositif d'affichage et provoque le chevauchement et l'alignement de l'image de la tranche et de l'image des données de carte de tranche, ce qui permet de recueillir l'image de tranche et l'image de données de carte de tranche et de concevoir une puce de début d'aspiration. Par la suite, la production est commencée et, selon les données de carte de tranche, seules les puces favorables sont prélevées de manière séquentielle de la puce de début d'aspiration et sont montées sur un substrat.
PCT/JP2012/058316 2012-03-29 2012-03-29 Système de collecte de données de carte de tranche et procédé de collecte de données de carte de tranche WO2013145202A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280071771.9A CN104246999B (zh) 2012-03-29 2012-03-29 晶片图数据核对系统以及晶片图数据核对方法
JP2014507168A JP5761771B2 (ja) 2012-03-29 2012-03-29 ウエハマップデータ照合システム
PCT/JP2012/058316 WO2013145202A1 (fr) 2012-03-29 2012-03-29 Système de collecte de données de carte de tranche et procédé de collecte de données de carte de tranche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/058316 WO2013145202A1 (fr) 2012-03-29 2012-03-29 Système de collecte de données de carte de tranche et procédé de collecte de données de carte de tranche

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WO2013145202A1 true WO2013145202A1 (fr) 2013-10-03

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CN (1) CN104246999B (fr)
WO (1) WO2013145202A1 (fr)

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JP2018088449A (ja) * 2016-11-28 2018-06-07 株式会社Ｆｕｊｉ 吸着開始ダイ教示システム
TWI656065B (zh) * 2014-09-24 2019-04-11 日商湯山製作所股份有限公司 分藥裝置及散劑調劑業務支援系統
EP3553813A4 (fr) * 2016-12-06 2020-01-01 Fuji Corporation Dispositif de fourniture d'éléments de matrice
US10930037B2 (en) 2016-02-25 2021-02-23 Fanuc Corporation Image processing device for displaying object detected from input picture image

Families Citing this family (2)

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WO2016157356A1 (fr) * 2015-03-30 2016-10-06 富士機械製造株式会社 Dispositif de gestion d'informations et procédé de gestion d'informations
CN109449096B (zh) * 2018-11-08 2021-12-03 科为升视觉技术（苏州）有限公司 识别检测晶元芯片的方法

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JP2006100352A (ja) * 2004-09-28 2006-04-13 Renesas Technology Corp 半導体チップの故障解析方法
JP2011061069A (ja) * 2009-09-11 2011-03-24 Renesas Electronics Corp 半導体装置の製造方法

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US8060330B2 (en) * 2008-12-12 2011-11-15 Lam Research Corporation Method and system for centering wafer on chuck
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer

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JP2005032827A (ja) * 2003-07-08 2005-02-03 Sharp Corp 半導体チップのピックアップ方法及びピックアップ装置
JP2006100352A (ja) * 2004-09-28 2006-04-13 Renesas Technology Corp 半導体チップの故障解析方法
JP2011061069A (ja) * 2009-09-11 2011-03-24 Renesas Electronics Corp 半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656065B (zh) * 2014-09-24 2019-04-11 日商湯山製作所股份有限公司 分藥裝置及散劑調劑業務支援系統
US10930037B2 (en) 2016-02-25 2021-02-23 Fanuc Corporation Image processing device for displaying object detected from input picture image
JP2018088449A (ja) * 2016-11-28 2018-06-07 株式会社Ｆｕｊｉ 吸着開始ダイ教示システム
EP3553813A4 (fr) * 2016-12-06 2020-01-01 Fuji Corporation Dispositif de fourniture d'éléments de matrice
US10879096B2 (en) 2016-12-06 2020-12-29 Fuji Corporation Die component supply device

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JP5761771B2 (ja) 2015-08-12
JPWO2013145202A1 (ja) 2015-08-03
CN104246999B (zh) 2018-05-08
CN104246999A (zh) 2014-12-24

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