WO2013145202A1 - Wafer map data collation system and wafer map data collation method - Google Patents

Wafer map data collation system and wafer map data collation method Download PDF

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Publication number
WO2013145202A1
WO2013145202A1 PCT/JP2012/058316 JP2012058316W WO2013145202A1 WO 2013145202 A1 WO2013145202 A1 WO 2013145202A1 JP 2012058316 W JP2012058316 W JP 2012058316W WO 2013145202 A1 WO2013145202 A1 WO 2013145202A1
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wafer
image
map data
wafer map
die
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PCT/JP2012/058316
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French (fr)
Japanese (ja)
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英希 保坂
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富士機械製造株式会社
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Priority to JP2014507168A priority Critical patent/JP5761771B2/en
Priority to PCT/JP2012/058316 priority patent/WO2013145202A1/en
Priority to CN201280071771.9A priority patent/CN104246999B/en
Publication of WO2013145202A1 publication Critical patent/WO2013145202A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

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  • the present invention relates to a wafer map data collation system and a wafer map data collation method for collating wafer images and wafer map data images.
  • a wafer is bonded to a dicing sheet, diced, and divided into a large number of dies (semiconductor chips). Since one wafer contains defective dies, the die inspection process inspects the quality of each die, attaches a bad mark with ink to the defective dies, and the die mounting process images each die with a camera. Then, the presence / absence of a bad mark is image-recognized, and only good dies (good chips) are picked up sequentially from the wafer and mounted on the substrate.
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-250834
  • wafer map data indicating the quality of the die at each position of the wafer after dicing
  • the die mounting process a method of picking up only non-defective dies (non-defective chips) from the wafer in order using the wafer map data and mounting them on the substrate has become mainstream.
  • Patent Document 2 Japanese Patent Laid-Open No. 2008-31430
  • a technique for automatically comparing an actual wafer and wafer map data using a pattern matching technique has been proposed.
  • a camera and an illumination light source are arranged on opposite sides of a dicing sheet with a wafer attached thereto, and an image is taken by illuminating with an illumination light source from the back side of the wafer (dicing sheet) when viewed from the camera side. This facilitates image recognition of each die on the wafer.
  • Patent Document 2 the camera and the illumination light source are arranged opposite to each other with the dicing sheet interposed therebetween, but the dicing sheet adsorbed below the dicing sheet of the die pickup device is picked up. Since it is necessary to arrange a push-up mechanism that pushes up the sticking part of the die to be pushed up with a push-up pin and partially peels off the sticking part of the die from the dicing sheet, an illumination light source (or camera) is provided below the dicing sheet. ) Is difficult to arrange (see Patent Document 3).
  • the actual wafer image and the wafer map data image are displayed side by side on the screen of the display device, and the operator visually checks the actual wafer image and the wafer map data image to determine the suction start die.
  • the collation work requires skill, and if a less skilled worker performs the collation work, the position of the die will shift. May be collated. If the matching position of the die is shifted, picking up the die according to the wafer map data will pick up the die while shifting the position of the non-defective / defective product, resulting in a defective substrate. It will be.
  • the problem to be solved by the present invention is to provide a wafer map data collation system and wafer map data in which an operator can easily and accurately collate an actual wafer image displayed on a screen of a display device with a wafer map data image. It is to provide a verification method.
  • the present invention provides a wafer image obtained by imaging at least a part of a wafer diced so as to be divided into a plurality of dies, and wafer map data indicating the quality of dies at each position of the wafer
  • a wafer map data collation system comprising: a display device that displays an image; and an operation unit that performs an operation of collating the wafer image and the wafer map data image.
  • the wafer map data image is the same as the wafer image. Displayed as an array image of dies, and the operation means moves the display position of the wafer image or the wafer map data image on the screen of the display device to superimpose the wafer image and the wafer map data image. By matching, the wafer image and the wafer map data image are collated. And it is characterized in Rukoto.
  • the display position of the wafer image or wafer map data image is moved on the screen of the display device, and the wafer image and the wafer map data image are overlapped and matched to thereby match the wafer image and the wafer map data image. Since the collation can be performed, the operator can easily and accurately collate the actual wafer image displayed on the screen of the display device and the wafer map data image visually.
  • the operator may operate the operation means and designate the suction start die in a state where the wafer image and the wafer map data image are overlapped and matched. As a result, the operator can easily and accurately specify the suction start die visually.
  • the part without the die and the part with the die may be divided by different backgrounds (color display, gray display, pattern, etc.).
  • the operator can easily and accurately determine the die at the peripheral edge of the wafer displayed in the wafer map data image.
  • the wafer map data image it is preferable to display a mark (a symbol, a character, a mark, a color display, a gray display, etc.) on a defective die section.
  • a mark a symbol, a character, a mark, a color display, a gray display, etc.
  • the operator can easily visually confirm the position of the defective die on the screen of the display device.
  • a bad mark is attached to the defective die on the wafer, it is easy to visually confirm that the bad mark position on the wafer image matches the defective die mark position on the wafer map data image. Can do.
  • FIG. 1 is an external perspective view of a die supply apparatus according to an embodiment of the present invention.
  • FIG. 2 is an external perspective view of the push-up unit and its peripheral part.
  • FIG. 3 is an external perspective view of the wafer pallet.
  • FIG. 4 is a partially broken enlarged view showing a state in which the push-up pot is raised to the suction position during the push-up operation.
  • FIG. 5 is a partially broken enlarged view showing a state in which the push-up pin is protruded from the push-up pot during the push-up operation.
  • FIG. 6 shows an example of wafer map data.
  • FIG. 7A shows an example of a wafer image
  • FIG. 7B shows an example of a wafer map data image.
  • FIG. 8A is a diagram showing a state in the middle of the image overlay operation
  • FIG. 8B is a diagram showing a state in which the image overlay operation is completed.
  • the die pick-up device 11 includes a magazine holding unit 22 (tray tower), a pallet drawer table 23, an XY moving mechanism 25, a push-up unit 28 (see FIG. 2), and the like, and the pallet drawer table 23 is a component mounter (not shown). Is set to the state where it is plugged in.
  • wafer pallets 32 equipped with wafer extending bodies 30 are stacked in multiple stages.
  • the pallet 32 is pulled out on the pallet drawer table 23.
  • the wafer extending body 30 is formed by attaching an expandable / shrinkable dicing sheet 34 with a die 31 formed by dicing the wafer into a grid pattern on a wafer mounting plate 33 having a circular opening.
  • the wafer mounting plate 33 is mounted in an expanded state, and the wafer mounting plate 33 is attached to the pallet main body 35 by screws or the like.
  • the push-up unit 28 (see FIG. 2) is configured to be movable in the XY direction in a space area below the dicing sheet 34 of the wafer pallet 32. And the sticking part of the die 31 to be picked up (sucked) in the dicing sheet 34 is pushed up from below and pushed up locally by a push-up pin 39 (see FIGS. 4 and 5) of the pot 37, so that the die The sticking part of 31 is partly peeled off from the dicing sheet 34 so that the die 31 can be easily lifted.
  • the push-up unit 28 is configured such that the push-up unit 28 as a whole moves up and down using a servo motor (not shown) as a drive source.
  • a servo motor not shown
  • the stopper unit not shown
  • the push-up pin 39 protrudes upward from the upper surface of the push-up pot 37, and the sticking portion of the die 31 to be picked up in the dicing sheet 34 To come up.
  • the push-up height position (push-up amount) of the push-up pin 39 can be adjusted by adjusting the rotation amount of the servo motor serving as the drive source.
  • the suction head 41 and the camera 42 are assembled to the XY movement mechanism 25, and the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY movement mechanism 25. ing.
  • the suction head 41 is provided with a suction nozzle 43 (see FIGS. 4 and 5) that sucks the die 31 on the dicing sheet 34 so as to move up and down.
  • the camera 42 can recognize the position of the die 31 to be sucked by the suction nozzle 43 by picking up an image of the die 31 on the dicing sheet 34 from above and processing the picked-up image.
  • a control device (not shown) of the die pick-up device 11 processes an image obtained by picking up the die 31 to be attracted by the camera 42 out of the dies 31 on the dicing sheet 34 and positions the die 31. , The push-up position and suction position of the die 31 are determined, and the sticking portion of the die 31 to be picked up (sucked) out of the dicing sheet 34 is pushed up from below as shown in FIG. The sticking portion of the die 31 is lifted locally by the push-up pins 39 of the die 37 so that the die 31 is lifted to a state where it can be easily picked up by partially peeling the die 31 from the dicing sheet 34. Adsorb and pick up.
  • a wafer manufacturer / manufacturer manufactures wafer map data (figure) indicating the quality of the die 31 at each position of the wafer after dicing based on the die inspection result. 6) and provide the wafer map data together with the wafer to the die mounting board manufacturing company.
  • a die mounting board manufacturing company uses the die pick-up device 11 to sequentially pick up only non-defective dies (non-defective chips) from the wafer according to the wafer map data and mount them on the substrate.
  • the actual wafer image and wafer map data image captured by the camera 42 are displayed on the screen of a display device (not shown), and both images are displayed as follows. To verify.
  • the bad die of the wafer is marked with a bad mark with ink so that the operator can visually confirm the defective die.
  • the defective die is not marked with a bad mark. Also good.
  • the wafer map data image is the same die arrangement image as the wafer image, and the sections of each die partitioned by grid lines are displayed in the same size as each die of the wafer image.
  • the wafer map data image is divided into different backgrounds (color display, gray display, pattern, etc.) where there are no dies and where there are dies, and the peripheral dies on the wafer displayed in the wafer map data image are displayed. An operator can easily and accurately discriminate visually.
  • the wafer map data image has marks (symbols, characters, marks, color display, gray display, etc.) displayed on the defective die sections, and the operator can easily visually check the position of the defective die on the display device screen. It can be confirmed.
  • the operation of collating the actual wafer image displayed on the screen of the display device with the wafer map data image is performed by an operator operating an input device (operation means) such as a mouse or a keyboard, or the screen of the display device is
  • an input device operation means
  • the operator touches the screen of the display device with a finger or the like, and the wafer image or wafer map data is displayed on the screen of the display device as shown in FIG.
  • FIG. 8B the display position of the image is moved and overlapped so that each die of the wafer image and each die section of the wafer map data image are matched.
  • a bad mark in the wafer is marked with a bad mark, it is easy to visually confirm that the position of the bad mark in the wafer image matches the position of the defective die in the wafer map data image. Can be confirmed.
  • the operator operates the input device such as a mouse or a keyboard or the touch panel to designate the suction start die. Thereafter, production is started, and only good dies are picked up in order from the suction start die according to the wafer map data and mounted on the substrate.
  • an operator operates an input device such as a mouse or a touch panel to move the display position of the wafer image or the wafer map data image on the screen of the display device, so that the wafer image and the wafer are moved.
  • the wafer image and the wafer map data image can be collated, so that the operator can visually check the actual wafer image and the wafer map data image displayed on the display device screen.
  • the workability of collation work is good and the setup time can be shortened.
  • the operator can easily and accurately specify the suction start die by visual observation, it is possible to prevent erroneous suction of the defective die and to prevent the production of defective substrates.
  • the image of the entire wafer and the entire image of the wafer map data are displayed on the screen of the display device.
  • the display device A part of the wafer image captured by the camera 42 is displayed on the screen, and a part of the wafer map data corresponding to the display part is displayed, and one of the images is moved to superimpose both images. By matching them together, the wafer image and the wafer map data image may be collated.
  • the display magnification of the wafer image and wafer map data image displayed on the screen of the display device has a function to adjust the display magnification of the wafer image and wafer map data image displayed on the screen of the display device, and the display magnification of the wafer image and wafer map data image can be adjusted on the screen of the display device by the operator's operation. It may be possible to adjust.
  • the die pickup apparatus 11 of the present embodiment is configured such that the suction head 41 and the camera 42 are integrally moved in the XY direction by the XY moving mechanism 25. However, the suction head 41 and the camera 42 are moved only in the X direction. In addition, the wafer pallet 32 may be moved in the Y direction on the pallet drawer table 23 so that the position of the die 31 to be imaged / sucked moves in the XY direction.
  • the present invention can be implemented with various modifications within a range not departing from the gist, such as the configuration of the die pick-up device 11 and the configuration of the wafer pallet 32 may be appropriately changed.

Abstract

In the present invention, with respect to a wafer map data image, in an array image of dies that is the same as a wafer image captured by a camera, the compartment of each die partitioned by lattice-shaped lines is displayed at the same size as each die of the wafer image. A worker operates a touch panel or an input device such as a mouse or keyboard, moves the display position of the wafer image or the wafer map data image over the screen of a display device, and causes the overlapping and alignment of the wafer image and the wafer map data image, thereby collating the wafer image and the wafer map data image, and designating a suction start die. Thereafter, production is started, and in accordance with wafer map data, only favorable dies are picked up sequentially from the suction start die, and are mounted to a substrate.

Description

ウエハマップデータ照合システム及びウエハマップデータ照合方法Wafer map data collation system and wafer map data collation method
　本発明は、ウエハ画像とウエハマップデータ画像とを照合するウエハマップデータ照合システム及びウエハマップデータ照合方法に関する発明である。 The present invention relates to a wafer map data collation system and a wafer map data collation method for collating wafer images and wafer map data images.
　一般に、ウエハは、ダイシングシートに貼着されてダイシングされ、多数のダイ（半導体チップ）に分割されている。１枚のウエハの中には、不良ダイが含まれるため、ダイ検査工程でダイ毎に良否を検査して不良ダイにインクでバッドマークを付し、ダイ実装工程で、ダイ毎にカメラで撮像してバッドマークの有無を画像認識し、ウエハから良品ダイ（良品チップ）のみを順番にピックアップして基板に実装するようにしていた。 Generally, a wafer is bonded to a dicing sheet, diced, and divided into a large number of dies (semiconductor chips). Since one wafer contains defective dies, the die inspection process inspects the quality of each die, attaches a bad mark with ink to the defective dies, and the die mounting process images each die with a camera. Then, the presence / absence of a bad mark is image-recognized, and only good dies (good chips) are picked up sequentially from the wafer and mounted on the substrate.
　しかし、この方法では、ダイ毎にカメラで撮像してバッドマークの有無を画像認識しなければならず、生産効率が悪いという欠点があった。 However, this method has a drawback that production efficiency is poor because each die must be imaged with a camera to recognize the presence or absence of bad marks.
　そこで、近年では、特許文献１（特開２００１－２５０８３４号公報）に記載されているように、ダイ検査工程で、ダイシング後のウエハの各位置のダイの良否を示すウエハマップデータを作成し、ダイ実装工程で、ウエハマップデータを使用して、ウエハから良品ダイ（良品チップ）のみを順番にピックアップして基板に実装する方法が主流となってきている。 Therefore, in recent years, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2001-250834), in the die inspection process, wafer map data indicating the quality of the die at each position of the wafer after dicing is created, In the die mounting process, a method of picking up only non-defective dies (non-defective chips) from the wafer in order using the wafer map data and mounting them on the substrate has become mainstream.
　この方法では、実際のウエハとウエハマップデータとを照合して、実際のウエハの各位置のダイの良否をウエハマップデータと正確に対応させる必要がある。 In this method, it is necessary to collate the actual wafer with the wafer map data, and accurately match the quality of the die at each position of the actual wafer with the wafer map data.
　そこで、特許文献２（特開２００８－３１１４３０号公報）に記載されているように、パターンマッチング技術を使用して、実際のウエハとウエハマップデータとを自動的に照合する技術が提案されている。このものは、ウエハが貼着されたダイシングシートを挟んで、カメラと照明光源を互いに反対側に配置し、カメラ側から見てウエハ（ダイシングシート）の裏面側から照明光源で照明して撮像することで、ウエハの各ダイを画像認識しやすくするようにしている。 Therefore, as described in Patent Document 2 (Japanese Patent Laid-Open No. 2008-31430), a technique for automatically comparing an actual wafer and wafer map data using a pattern matching technique has been proposed. . In this device, a camera and an illumination light source are arranged on opposite sides of a dicing sheet with a wafer attached thereto, and an image is taken by illuminating with an illumination light source from the back side of the wafer (dicing sheet) when viewed from the camera side. This facilitates image recognition of each die on the wafer.
特開２００１－２５０８３４号公報JP 2001-250834 A 特開２００８－３１１４３０号公報JP 2008-31430 A 特開２０１０－１２９９４９号公報JP 2010-129949 A
　しかし、上記特許文献２では、ダイシングシートを挟んでカメラと照明光源を互いに反対側に配置する構成であるが、ダイピックアップ装置のダイシングシートの下方には、ダイのピックアップ時にダイシングシートのうちの吸着しようとするダイの貼着部分を突き上げピンで突き上げて該ダイの貼着部分を該ダイシングシートから部分的に剥離させる突き上げ機構を配置する必要があるため、ダイシングシートの下方に照明光源（又はカメラ）を配置することが困難である（特許文献３参照）。 However, in the above-mentioned Patent Document 2, the camera and the illumination light source are arranged opposite to each other with the dicing sheet interposed therebetween, but the dicing sheet adsorbed below the dicing sheet of the die pickup device is picked up. Since it is necessary to arrange a push-up mechanism that pushes up the sticking part of the die to be pushed up with a push-up pin and partially peels off the sticking part of the die from the dicing sheet, an illumination light source (or camera) is provided below the dicing sheet. ) Is difficult to arrange (see Patent Document 3).
　しかも、ダイは小形・微小化しているため、製造ばらつきの影響を受けやすく、ウエハの周縁部のダイを正確に画像認識することが難しい。このため、特許文献２の方法を用い
ても、実際のウエハとウエハマップデータとの自動照合が困難であり、ダイの位置を誤認識する可能性がある。 In addition, since the die is small and small, it is easily affected by manufacturing variations, and it is difficult to accurately recognize the die on the peripheral edge of the wafer. For this reason, even if the method of Patent Document 2 is used, it is difficult to automatically collate an actual wafer and wafer map data, and there is a possibility that the position of the die is erroneously recognized.
　このため、現状は、表示装置の画面に実際のウエハ画像とウエハマップデータ画像を横並びに表示して、作業者が目視で実際のウエハ画像とウエハマップデータ画像とを照合して吸着開始ダイを指定するようにしているが、ウエハマップデータ画像のイメージが実際のウエハ画像と異なるため、照合作業には熟練を要し、熟練度が低い作業者が照合作業を行うと、ダイの位置がずれて照合されてしまう可能性がある。ダイの照合位置がずれている場合は、ウエハマップデータに従ってダイをピックアップしていくと、良品／不良品の位置もずれたままダイをピックアップしていくことになり、不良基板を生産してしまうことになる。 For this reason, at present, the actual wafer image and the wafer map data image are displayed side by side on the screen of the display device, and the operator visually checks the actual wafer image and the wafer map data image to determine the suction start die. Although it is specified, since the wafer map data image image is different from the actual wafer image, the collation work requires skill, and if a less skilled worker performs the collation work, the position of the die will shift. May be collated. If the matching position of the die is shifted, picking up the die according to the wafer map data will pick up the die while shifting the position of the non-defective / defective product, resulting in a defective substrate. It will be.
　そこで、本発明が解決しようとする課題は、表示装置の画面に表示した実際のウエハ画像とウエハマップデータ画像を作業者が目視で簡単に且つ正確に照合できるウエハマップデータ照合システム及びウエハマップデータ照合方法を提供することである。 Therefore, the problem to be solved by the present invention is to provide a wafer map data collation system and wafer map data in which an operator can easily and accurately collate an actual wafer image displayed on a screen of a display device with a wafer map data image. It is to provide a verification method.
　上記課題を解決するために、本発明は、複数のダイに分割するようにダイシングされたウエハの少なくとも一部をカメラで撮像したウエハ画像と前記ウエハの各位置のダイの良否を示すウエハマップデータ画像とを表示する表示装置と、前記ウエハ画像と前記ウエハマップデータ画像とを照合する操作を行う操作手段とを備えたウエハマップデータ照合システムにおいて、前記ウエハマップデータ画像は、前記ウエハ画像と同じダイの配列イメージで表示され、前記操作手段は、前記表示装置の画面上で前記ウエハ画像又は前記ウエハマップデータ画像の表示位置を移動させて前記ウエハ画像と前記ウエハマップデータ画像とを重ね合わせて合致させることで、前記ウエハ画像と前記ウエハマップデータ画像とを照合するように構成されていることを特徴とするものである。 In order to solve the above-described problems, the present invention provides a wafer image obtained by imaging at least a part of a wafer diced so as to be divided into a plurality of dies, and wafer map data indicating the quality of dies at each position of the wafer In a wafer map data collation system, comprising: a display device that displays an image; and an operation unit that performs an operation of collating the wafer image and the wafer map data image. The wafer map data image is the same as the wafer image. Displayed as an array image of dies, and the operation means moves the display position of the wafer image or the wafer map data image on the screen of the display device to superimpose the wafer image and the wafer map data image. By matching, the wafer image and the wafer map data image are collated. And it is characterized in Rukoto.
　この構成では、表示装置の画面上でウエハ画像又はウエハマップデータ画像の表示位置を移動させてウエハ画像とウエハマップデータ画像とを重ね合わせて合致させることで、ウエハ画像とウエハマップデータ画像とを照合することができるため、表示装置の画面に表示した実際のウエハ画像とウエハマップデータ画像を作業者が目視で簡単に且つ正確に照合できる。 In this configuration, the display position of the wafer image or wafer map data image is moved on the screen of the display device, and the wafer image and the wafer map data image are overlapped and matched to thereby match the wafer image and the wafer map data image. Since the collation can be performed, the operator can easily and accurately collate the actual wafer image displayed on the screen of the display device and the wafer map data image visually.
　作業者は、操作手段を操作して、ウエハ画像とウエハマップデータ画像とを重ね合わせて合致させた状態で吸着開始ダイを指定すれば良い。これにより、作業者が目視で吸着開始ダイを簡単に且つ正確に指定できる。 The operator may operate the operation means and designate the suction start die in a state where the wafer image and the wafer map data image are overlapped and matched. As a result, the operator can easily and accurately specify the suction start die visually.
　また、ウエハマップデータ画像は、ダイの無い部分とダイの有る部分とが異なる背景（カラー表示、グレー表示、模様等）で区分けするようにすれば良い。これにより、ウエハマップデータ画像に表示されたウエハの周縁部のダイを作業者が目視で簡単に且つ正確に判別できる。 Also, in the wafer map data image, the part without the die and the part with the die may be divided by different backgrounds (color display, gray display, pattern, etc.). Thus, the operator can easily and accurately determine the die at the peripheral edge of the wafer displayed in the wafer map data image.
　また、ウエハマップデータ画像は、不良ダイの区画に印（記号、文字、マーク、カラー表示、グレー表示等）を表示するようにすると良い。これにより、作業者が表示装置の画面上で不良ダイの位置を目視で簡単に確認できる。また、ウエハの不良ダイにバッドマークが付されている場合は、ウエハ画像のバッドマークの位置とウエハマップデータ画像の不良ダイの印の位置が合致していることを目視で簡単に確認することができる。 In the wafer map data image, it is preferable to display a mark (a symbol, a character, a mark, a color display, a gray display, etc.) on a defective die section. Thereby, the operator can easily visually confirm the position of the defective die on the screen of the display device. Also, if a bad mark is attached to the defective die on the wafer, it is easy to visually confirm that the bad mark position on the wafer image matches the defective die mark position on the wafer map data image. Can do.
図１は本発明の一実施例におけるダイ供給装置の外観斜視図である。FIG. 1 is an external perspective view of a die supply apparatus according to an embodiment of the present invention. 図２は突き上げユニットとその周辺部分の外観斜視図である。FIG. 2 is an external perspective view of the push-up unit and its peripheral part. 図３はウエハパレットの外観斜視図である。FIG. 3 is an external perspective view of the wafer pallet. 図４は突き上げ動作時に突き上げポットを吸着位置まで上昇させた状態を示す一部破断拡大図である。FIG. 4 is a partially broken enlarged view showing a state in which the push-up pot is raised to the suction position during the push-up operation. 図５は突き上げ動作時に突き上げポットから突き上げピンを突出させた状態を示す一部破断拡大図である。FIG. 5 is a partially broken enlarged view showing a state in which the push-up pin is protruded from the push-up pot during the push-up operation. 図６はウエハマップデータの一例を示す図である。FIG. 6 shows an example of wafer map data. 図７（ａ）はウエハ画像の一例を示す図、同図（ｂ）はウエハマップデータ画像の一例を示す図である。FIG. 7A shows an example of a wafer image, and FIG. 7B shows an example of a wafer map data image. 図８（ａ）は画像重ね合わせ操作の途中の状態を示す図、同図（ｂ）は画像重ね合わせ操作完了の状態を示す図である。FIG. 8A is a diagram showing a state in the middle of the image overlay operation, and FIG. 8B is a diagram showing a state in which the image overlay operation is completed.
　以下、本発明を実施するための形態を具体化した一実施例を説明する。
　まず、図１を用いてダイピックアップ装置１１の構成を概略的に説明する。 Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the structure of the die pick-up apparatus 11 is demonstrated roughly using FIG.
　ダイピックアップ装置１１は、マガジン保持部２２（トレイタワー）、パレット引き出しテーブル２３、ＸＹ移動機構２５、突き上げユニット２８（図２参照）等を備え、パレット引き出しテーブル２３を部品実装機（図示せず）に差し込んだ状態にセットされる。 The die pick-up device 11 includes a magazine holding unit 22 (tray tower), a pallet drawer table 23, an XY moving mechanism 25, a push-up unit 28 (see FIG. 2), and the like, and the pallet drawer table 23 is a component mounter (not shown). Is set to the state where it is plugged in.
　ダイピックアップ装置１１のマガジン保持部２２内に上下動可能に収納されたマガジン（図示せず）には、ウエハ張設体３０を装着したウエハパレット３２が多段に積載され、生産中にマガジンからウエハパレット３２がパレット引き出しテーブル２３上に引き出されるようになっている。図３に示すように、ウエハ張設体３０は、ウエハを碁盤目状にダイシングして形成したダイ３１を貼着した伸縮可能なダイシングシート３４を、円形の開口部を有するウエハ装着板３３にエキスパンドした状態で装着したものであり、該ウエハ装着板３３がパレット本体３５にねじ止め等により取り付けられている。 In a magazine (not shown) housed in a magazine holding portion 22 of the die pick-up device 11 so as to be movable up and down, wafer pallets 32 equipped with wafer extending bodies 30 are stacked in multiple stages. The pallet 32 is pulled out on the pallet drawer table 23. As shown in FIG. 3, the wafer extending body 30 is formed by attaching an expandable / shrinkable dicing sheet 34 with a die 31 formed by dicing the wafer into a grid pattern on a wafer mounting plate 33 having a circular opening. The wafer mounting plate 33 is mounted in an expanded state, and the wafer mounting plate 33 is attached to the pallet main body 35 by screws or the like.
　突き上げユニット２８（図２参照）は、ウエハパレット３２のダイシングシート３４下方の空間領域をＸＹ方向に移動可能に構成されている。そして、ダイシングシート３４のうちのピックアップ（吸着）しようとするダイ３１の貼着部分をその下方から突き上げポット３７の突き上げピン３９（図４、図５参照）で局所的に突き上げることで、当該ダイ３１の貼着部分をダイシングシート３４から部分的に剥離させてダイ３１をピックアップしやすい状態に浮き上がらせるようにしている。 The push-up unit 28 (see FIG. 2) is configured to be movable in the XY direction in a space area below the dicing sheet 34 of the wafer pallet 32. And the sticking part of the die 31 to be picked up (sucked) in the dicing sheet 34 is pushed up from below and pushed up locally by a push-up pin 39 (see FIGS. 4 and 5) of the pot 37, so that the die The sticking part of 31 is partly peeled off from the dicing sheet 34 so that the die 31 can be easily lifted.
　この突き上げユニット２８は、サーボモータ（図示せず）を駆動源として突き上げユニット２８全体が上下動するように構成されている。ダイピックアップ動作時には、突き上げユニット２８が上昇して突き上げポット３７の上面がウエハパレット３２のダイシングシート３４にほぼ接触する所定のシート吸着位置まで上昇すると、ストッパ機構（図示せず）によって突き上げユニット２８の上昇が止まり、更に上昇動作を続けると、突き上げポット３７の上面から突き上げピン３９（図４、図５参照）が上方に突出して、ダイシングシート３４のうちのピックアップしようとするダイ３１の貼着部分を突き上げるように
なっている。この場合、駆動源となるサーボモータの回転量を調整することで、突き上げピン３９の突き上げ高さ位置（突き上げ量）を調整できるようになっている。 The push-up unit 28 is configured such that the push-up unit 28 as a whole moves up and down using a servo motor (not shown) as a drive source. During the die pick-up operation, when the push-up unit 28 is raised and the upper surface of the push-up pot 37 rises to a predetermined sheet suction position where it substantially contacts the dicing sheet 34 of the wafer pallet 32, the stopper unit (not shown) When the ascent is stopped and the ascending operation is continued, the push-up pin 39 (see FIGS. 4 and 5) protrudes upward from the upper surface of the push-up pot 37, and the sticking portion of the die 31 to be picked up in the dicing sheet 34 To come up. In this case, the push-up height position (push-up amount) of the push-up pin 39 can be adjusted by adjusting the rotation amount of the servo motor serving as the drive source.
　図１に示すように、ＸＹ移動機構２５には、吸着ヘッド４１とカメラ４２とが組み付けられ、該ＸＹ移動機構２５によって吸着ヘッド４１とカメラ４２が一体的にＸＹ方向に移動するように構成されている。吸着ヘッド４１には、ダイシングシート３４上のダイ３１を吸着する吸着ノズル４３（図４、図５参照）が上下動するように設けられている。カメラ４２は、ダイシングシート３４上のダイ３１を上方から撮像してその撮像画像を画像処理することで、吸着ノズル４３で吸着しようとするダイ３１の位置を認識できるようになっている。 As shown in FIG. 1, the suction head 41 and the camera 42 are assembled to the XY movement mechanism 25, and the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY movement mechanism 25. ing. The suction head 41 is provided with a suction nozzle 43 (see FIGS. 4 and 5) that sucks the die 31 on the dicing sheet 34 so as to move up and down. The camera 42 can recognize the position of the die 31 to be sucked by the suction nozzle 43 by picking up an image of the die 31 on the dicing sheet 34 from above and processing the picked-up image.
　ダイピックアップ装置１１の制御装置（図示せず）は、ダイシングシート３４上のダイ３１のうち、吸着しようとするダイ３１をカメラ４２で撮像して得られた画像を処理して該ダイ３１の位置を認識して、該ダイ３１の突き上げ位置及び吸着位置を決定し、図５に示すように、ダイシングシート３４のうちのピックアップ（吸着）しようとするダイ３１の貼着部分をその下方から突き上げポット３７の突き上げピン３９で局所的に突き上げることで、当該ダイ３１の貼着部分をダイシングシート３４から部分的に剥離させてダイ３１をピックアップしやすい状態に浮き上がらせながら、該ダイ３１を吸着ノズル４３で吸着してピックアップする。 A control device (not shown) of the die pick-up device 11 processes an image obtained by picking up the die 31 to be attracted by the camera 42 out of the dies 31 on the dicing sheet 34 and positions the die 31. , The push-up position and suction position of the die 31 are determined, and the sticking portion of the die 31 to be picked up (sucked) out of the dicing sheet 34 is pushed up from below as shown in FIG. The sticking portion of the die 31 is lifted locally by the push-up pins 39 of the die 37 so that the die 31 is lifted to a state where it can be easily picked up by partially peeling the die 31 from the dicing sheet 34. Adsorb and pick up.
　一般に、１枚のウエハの中には、不良ダイが含まれるため、ウエハ製造製造会社では、ダイ検査結果に基づいて、ダイシング後のウエハの各位置のダイ３１の良否を示すウエハマップデータ（図６参照）を作成して、このウエハマップデータをウエハをと一緒にダイ実装基板製造会社に提供する。ダイ実装基板製造会社では、ダイピックアップ装置１１を使用して、ウエハマップデータに従って、ウエハから良品ダイ（良品チップ）のみを順番にピックアップして基板に実装する。 In general, since a defective wafer is included in one wafer, a wafer manufacturer / manufacturer manufactures wafer map data (figure) indicating the quality of the die 31 at each position of the wafer after dicing based on the die inspection result. 6) and provide the wafer map data together with the wafer to the die mounting board manufacturing company. A die mounting board manufacturing company uses the die pick-up device 11 to sequentially pick up only non-defective dies (non-defective chips) from the wafer according to the wafer map data and mount them on the substrate.
　このように、ウエハマップデータを使用する場合は、実際のウエハとウエハマップデータとを照合して、実際のウエハの各位置のダイの良否をウエハマップデータと正確に対応させる必要がある。 As described above, when using the wafer map data, it is necessary to collate the actual wafer with the wafer map data and to accurately correspond the quality of the die at each position of the actual wafer with the wafer map data.
　そこで、本実施例では、図７に示すように、表示装置（図示せず）の画面に、カメラ４２で撮像した実際のウエハ画像とウエハマップデータ画像を表示し、両画像を次のようにして照合する。 Therefore, in this embodiment, as shown in FIG. 7, the actual wafer image and wafer map data image captured by the camera 42 are displayed on the screen of a display device (not shown), and both images are displayed as follows. To verify.
　本実施例では、作業者が目視で不良ダイを確認できるように、ウエハのうちの不良ダイにインクでバッドマークが付されているが、不良ダイにバッドマークが付されていないウエハを用いても良い。 In this embodiment, the bad die of the wafer is marked with a bad mark with ink so that the operator can visually confirm the defective die. However, the defective die is not marked with a bad mark. Also good.
　また、ウエハマップデータ画像は、ウエハ画像と同じダイの配列イメージで、格子状の線で仕切られた各ダイの区画がウエハ画像の各ダイと同じサイズで表示される。また、ウエハマップデータ画像は、ダイの無い部分とダイの有る部分とが異なる背景（カラー表示、グレー表示、模様等）で区分けされ、ウエハマップデータ画像に表示されたウエハの周縁部のダイを作業者が目視で簡単に且つ正確に判別できるようになっている。 Also, the wafer map data image is the same die arrangement image as the wafer image, and the sections of each die partitioned by grid lines are displayed in the same size as each die of the wafer image. In addition, the wafer map data image is divided into different backgrounds (color display, gray display, pattern, etc.) where there are no dies and where there are dies, and the peripheral dies on the wafer displayed in the wafer map data image are displayed. An operator can easily and accurately discriminate visually.
　また、ウエハマップデータ画像は、不良ダイの区画に印（記号、文字、マーク、カラー表示、グレー表示等）が表示され、作業者が表示装置の画面上で不良ダイの位置を目視で簡単に確認できるようになっている。 In addition, the wafer map data image has marks (symbols, characters, marks, color display, gray display, etc.) displayed on the defective die sections, and the operator can easily visually check the position of the defective die on the display device screen. It can be confirmed.
　表示装置の画面に表示された実際のウエハ画像とウエハマップデータ画像を照合する操
作は、作業者がマウス、キーボード等の入力装置（操作手段）を操作したり、或は、表示装置の画面がタッチパネル（操作手段）で構成されている場合は、作業者が表示装置の画面に指等でタッチして、図８（ａ）に示すように、表示装置の画面上でウエハ画像又はウエハマップデータ画像の表示位置を移動させて重ね合わせて、図８（ｂ）に示すように、ウエハ画像の各ダイとウエハマップデータ画像の各ダイの区画とを合致させる。本実施例では、ウエハのうちの不良ダイにバッドマークが付されているため、ウエハ画像のバッドマークの位置とウエハマップデータ画像の不良ダイの印の位置が合致していることを目視で簡単に確認することができる。 The operation of collating the actual wafer image displayed on the screen of the display device with the wafer map data image is performed by an operator operating an input device (operation means) such as a mouse or a keyboard, or the screen of the display device is In the case of a touch panel (operation means), the operator touches the screen of the display device with a finger or the like, and the wafer image or wafer map data is displayed on the screen of the display device as shown in FIG. As shown in FIG. 8B, the display position of the image is moved and overlapped so that each die of the wafer image and each die section of the wafer map data image are matched. In this embodiment, since a bad mark in the wafer is marked with a bad mark, it is easy to visually confirm that the position of the bad mark in the wafer image matches the position of the defective die in the wafer map data image. Can be confirmed.
　以上のようにして、ウエハ画像とウエハマップデータ画像とを重ね合わせて合致させた状態で、作業者がマウス、キーボード等の入力装置又はタッチパネルを操作して吸着開始ダイを指定する。この後、生産を開始して、ウエハマップデータに従って、吸着開始ダイから良品ダイのみを順番にピックアップして基板に実装する。 As described above, in a state where the wafer image and the wafer map data image are overlapped and matched, the operator operates the input device such as a mouse or a keyboard or the touch panel to designate the suction start die. Thereafter, production is started, and only good dies are picked up in order from the suction start die according to the wafer map data and mounted on the substrate.
　以上説明した本実施例によれば、作業者がマウス等の入力装置やタッチパネル等を操作して、表示装置の画面上でウエハ画像又はウエハマップデータ画像の表示位置を移動させてウエハ画像とウエハマップデータ画像とを重ね合わせて合致させることで、ウエハ画像とウエハマップデータ画像とを照合することができるため、表示装置の画面に表示した実際のウエハ画像とウエハマップデータ画像を作業者が目視で簡単に且つ正確に照合することができ、作業者が目視で吸着開始ダイを簡単に且つ正確に指定できる。これにより、照合作業の作業性が良く、セットアップ時間を短縮することができる。しかも、作業者が目視で吸着開始ダイを簡単に且つ正確に指定できるため、不良ダイを誤吸着することを防止でき、不良基板の生産を防止することができる。 According to the present embodiment described above, an operator operates an input device such as a mouse or a touch panel to move the display position of the wafer image or the wafer map data image on the screen of the display device, so that the wafer image and the wafer are moved. By overlapping and matching the map data image, the wafer image and the wafer map data image can be collated, so that the operator can visually check the actual wafer image and the wafer map data image displayed on the display device screen. Thus, it is possible to easily and accurately collate, and the operator can easily and accurately designate the suction start die visually. Thereby, the workability of collation work is good and the setup time can be shortened. In addition, since the operator can easily and accurately specify the suction start die by visual observation, it is possible to prevent erroneous suction of the defective die and to prevent the production of defective substrates.
　尚、本実施例では、表示装置の画面にウエハ全体の画像とウエハマップデータ全体の画像を表示するようにしたが、カメラ４２の視野が狭くて、ウエハの一部分しか撮像できない場合は、表示装置の画面に、カメラ４２で撮像したウエハの一部分の画像を表示すると共に、その表示部分に対応するウエハマップデータの一部分の画像を表示して、いずれか一方の画像を移動させて両画像を重ね合わせて合致させることで、ウエハ画像とウエハマップデータ画像とを照合するようにしても良い。 In this embodiment, the image of the entire wafer and the entire image of the wafer map data are displayed on the screen of the display device. However, if the field of view of the camera 42 is narrow and only a part of the wafer can be imaged, the display device A part of the wafer image captured by the camera 42 is displayed on the screen, and a part of the wafer map data corresponding to the display part is displayed, and one of the images is moved to superimpose both images. By matching them together, the wafer image and the wafer map data image may be collated.
　また、表示装置の画面に表示したウエハ画像やウエハマップデータ画像の表示倍率を調整する機能を持たせて、作業者の操作により表示装置の画面上でウエハ画像やウエハマップデータ画像の表示倍率を調整できるようにしても良い。 In addition, it has a function to adjust the display magnification of the wafer image and wafer map data image displayed on the screen of the display device, and the display magnification of the wafer image and wafer map data image can be adjusted on the screen of the display device by the operator's operation. It may be possible to adjust.
　また、本実施例のダイピックアップ装置１１は、ＸＹ移動機構２５によって吸着ヘッド４１とカメラ４２が一体的にＸＹ方向に移動するように構成したが、吸着ヘッド４１とカメラ４２がＸ方向のみに移動し、且つ、ウエハパレット３２がパレット引き出しテーブル２３上をＹ方向に移動することで、撮像対象・吸着対象となるダイ３１の位置がＸＹ方向に移動するように構成しても良い。 The die pickup apparatus 11 of the present embodiment is configured such that the suction head 41 and the camera 42 are integrally moved in the XY direction by the XY moving mechanism 25. However, the suction head 41 and the camera 42 are moved only in the X direction. In addition, the wafer pallet 32 may be moved in the Y direction on the pallet drawer table 23 so that the position of the die 31 to be imaged / sucked moves in the XY direction.
　その他、本発明は、ダイピックアップ装置１１の構成やウエハパレット３２の構成を適宜変更しても良い等、要旨を逸脱しない範囲内で種々変更して実施できることは言うまでもない。 In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as the configuration of the die pick-up device 11 and the configuration of the wafer pallet 32 may be appropriately changed.
　１１…ダイピックアップ装置、２２…マガジン保持部、２３…パレット引き出しテーブル、２５…ＸＹ移動機構、２８…突き上げユニット、３０…ウエハ張設体、３１…ダイ、３２…ウエハパレット、３３…ウエハ装着板、３４…ダイシングシート、３７…突き上げポット、３９…突き上げピン、４１…吸着ヘッド、４２…カメラ、４３…吸着ノズル DESCRIPTION OF SYMBOLS 11 ... Die pick-up apparatus, 22 ... Magazine holding part, 23 ... Pallet drawer table, 25 ... XY movement mechanism, 28 ... Push-up unit, 30 ... Wafer extension body, 31 ... Die, 32 ... Wafer pallet, 33 ... Wafer mounting plate 34 ... Dicing sheet, 37 ... Push-up pot, 39 ... Push-up pin, 41 ... Suction head, 42 ... Camera, 43 ... Suction nozzle

Claims (5)

  1. 　複数のダイに分割するようにダイシングされたウエハの少なくとも一部をカメラで撮像したウエハ画像と前記ウエハの各位置のダイの良否を示すウエハマップデータ画像とを表示する表示装置と、前記ウエハ画像と前記ウエハマップデータ画像とを照合する操作を行う操作手段とを備えたウエハマップデータ照合システムにおいて、
    　前記ウエハマップデータ画像は、前記ウエハ画像と同じダイの配列イメージで表示され、
    　前記操作手段は、前記表示装置の画面上で前記ウエハ画像又は前記ウエハマップデータ画像の表示位置を移動させて前記ウエハ画像と前記ウエハマップデータ画像とを重ね合わせて合致させることで、前記ウエハ画像と前記ウエハマップデータ画像とを照合するように構成されていることを特徴とするウエハマップデータ照合システム。     A display device for displaying a wafer image obtained by imaging at least a part of a wafer diced so as to be divided into a plurality of dies, and a wafer map data image indicating the quality of the die at each position of the wafer; and the wafer image And a wafer map data collation system comprising operation means for performing an operation of collating the wafer map data image with the wafer map data image,
    The wafer map data image is displayed in the same die array image as the wafer image,
    The operation means moves the display position of the wafer image or the wafer map data image on the screen of the display device to superimpose the wafer image and the wafer map data image so as to match the wafer image. And a wafer map data image, wherein the wafer map data verification system is configured to verify the wafer map data image.
  2. 　前記操作手段は、前記ウエハ画像と前記ウエハマップデータ画像とを重ね合わせて合致させた状態で吸着開始ダイを指定する手段を有することを特徴とする請求項１に記載のウエハマップデータ照合システム。 2. The wafer map data collating system according to claim 1, wherein the operation means includes means for designating a suction start die in a state where the wafer image and the wafer map data image are overlapped and matched.
  3. 　前記ウエハマップデータ画像は、ダイの無い部分とダイの有る部分とが異なる背景で区分けされていることを特徴とする請求項１又は２に記載のウエハマップデータ照合システム。 The wafer map data collation system according to claim 1 or 2, wherein the wafer map data image is divided by a background in which a portion without a die and a portion with a die are different.
  4. 　前記ウエハマップデータ画像は、不良ダイの区画に印が表示されることを特徴とする請求項１乃至３のいずれかに記載のウエハマップデータ照合システム。 4. The wafer map data collating system according to claim 1, wherein a mark is displayed on a defective die section in the wafer map data image.
  5. 　複数のダイに分割するようにダイシングされたウエハの少なくとも一部をカメラで撮像したウエハ画像と前記ウエハの各位置のダイの良否を示すウエハマップデータ画像とを表示装置に表示して、前記ウエハ画像と前記ウエハマップデータ画像とを照合するウエハマップデータ照合方法において、
    　前記ウエハマップデータ画像は、前記ウエハ画像と同じダイの配列イメージで表示され、
    　前記表示装置の画面上で前記ウエハ画像又は前記ウエハマップデータ画像の表示位置を移動させて前記ウエハ画像と前記ウエハマップデータ画像とを重ね合わせて合致させることで、前記ウエハ画像と前記ウエハマップデータ画像とを照合することを特徴とするウエハマップデータ照合方法。     A wafer image obtained by capturing at least a part of a wafer diced so as to be divided into a plurality of dies with a camera and a wafer map data image indicating the quality of the dies at each position of the wafer are displayed on a display device, and the wafer is displayed. In a wafer map data collating method for collating an image and the wafer map data image,
    The wafer map data image is displayed in the same die array image as the wafer image,
    By moving the display position of the wafer image or the wafer map data image on the screen of the display device so that the wafer image and the wafer map data image are overlapped and matched, the wafer image and the wafer map data are matched. A wafer map data collating method characterized by collating with an image.
PCT/JP2012/058316 2012-03-29 2012-03-29 Wafer map data collation system and wafer map data collation method WO2013145202A1 (en)

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