WO2013107305A1 - 集成模块、集成系统板和电子设备 - Google Patents

集成模块、集成系统板和电子设备 Download PDF

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Publication number
WO2013107305A1
WO2013107305A1 PCT/CN2013/070094 CN2013070094W WO2013107305A1 WO 2013107305 A1 WO2013107305 A1 WO 2013107305A1 CN 2013070094 W CN2013070094 W CN 2013070094W WO 2013107305 A1 WO2013107305 A1 WO 2013107305A1
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Prior art keywords
module
pad
integrated
integrated module
pcb
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Application number
PCT/CN2013/070094
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English (en)
French (fr)
Inventor
丁海幸
谢桂福
Original Assignee
华为终端有限公司
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Application filed by 华为终端有限公司 filed Critical 华为终端有限公司
Publication of WO2013107305A1 publication Critical patent/WO2013107305A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present invention relates to communication technologies, and in particular, to an integrated module, an integrated system board, and an electronic device.
  • BACKGROUND With the continuous development and advancement of technology, more and more integrated modules are widely used in electronic products in the communication field, and the integrated modules are directly assembled on the whole machine board, and the application of the whole machine product is provided. Greater convenience and versatility. Conventional integrated modules are typically designed for contact array packages
  • LGA Land Grid Array
  • LCC Leadless Chip Carrier
  • the LGA has an array of electrode contacts on the bottom surface, and the metal contact type package replaces the conventional pin-shaped pins, thereby overcoming the signal interference caused by the stitch contact; LCC means that only four sides of the ceramic substrate are in contact with each other.
  • the integrated module is assembled by Surface Mounted Technology (SMT), and a set of pins is designed around the bottom surface of the printed circuit board (PCB) of the integrated module.
  • the pad, the module device is mounted on the front side of the PCB.
  • Embodiments of the present invention provide an integrated module, an integrated system board, and an electronic device, which eliminates the need for additional test lines and improves the convenience of the test integration module.
  • a first aspect of an embodiment of the present invention provides an integrated module including a printed circuit board PCB and a module device, wherein
  • the module device is mounted on the PCB, a set of front surface pin pads are disposed around a front surface of the PCB, and the front surface pin pads are located around a mounting position of the module device, the PCB a set of bottom surface pad pads disposed around the bottom surface;
  • the position of the front surface pin pad is set to be symmetrical with the position at which the bottom surface pin pad is disposed, and the front pin pad has the same network property as the bottom surface pin pad.
  • Another aspect of an embodiment of the present invention is to provide an integrated module including a printed circuit board PCB and a module device, wherein
  • the module device is integrally molded with the PCB, and a set of front surface pin pads are disposed around the front surface of the integrated module, and the front surface pin pads are located around the mounting position of the module device. a set of bottom surface pad pads is disposed around the bottom surface of the integrated module;
  • the position of the front surface pin pad is set to be symmetrical with the position at which the bottom surface pin pad is disposed, and the front pin pad has the same network property as the bottom surface pin pad.
  • Another aspect of the embodiments of the present invention provides an integrated system board including an integrated module and a motherboard, wherein the integrated module includes a printed circuit board PCB and a module device, where
  • the module device is mounted on the PCB, a front side of the front surface of the PCB is provided with a set of front surface lead pads, and a bottom surface of the bottom surface of the PCB is provided with a set of bottom surface lead pads;
  • the position of the front surface pin pad is set to be symmetrical with the position of the bottom surface pin pad, and the front pin pad has the same network property as the bottom surface pin pad;
  • the motherboard is provided with a motherboard pin pad, and the integrated module is assembled on the motherboard through the motherboard pin pad.
  • Yet another aspect of an embodiment of the present invention is to provide an electronic device including the above integrated system board.
  • the technical effect of the embodiment of the present invention is: by providing a set of front surface pin pads around the front side of the PCB, a set of bottom surface pin pads are arranged around the bottom surface of the PCB, and the front side surface pads and the bottom surface pins are provided.
  • the network properties of the pads are the same.
  • the present embodiment can directly test through the front pin pad or the bottom pin pad without adding additional test lines, thereby improving the convenience of the test integrated module. Since the front and bottom pin pads of the integrated module can be assembled with the main board, the present embodiment increases the convenience of assembly.
  • FIG. 1 is a top plan view of an integrated module in the first embodiment of the integrated module of the present invention
  • 2 is a bottom view of the integrated module in the first embodiment of the integrated module of the present invention
  • FIG. 3 is a schematic diagram of assembly of an integrated module and a motherboard in the first embodiment of the integrated module of the present invention
  • FIG. 4 is a second schematic diagram of assembly of the integrated module and the motherboard in the first embodiment of the integrated module of the present invention
  • a front view of the integrated module
  • FIG. 6 is a bottom view of the integrated module in the second embodiment of the integrated module of the present invention.
  • Embodiment 7 is a schematic structural view of Embodiment 1 of an integrated system board according to the present invention.
  • FIG. 8 is a schematic structural diagram of Embodiment 2 of an integrated system board according to the present invention.
  • FIG. 1 and 2 are respectively a top view and a bottom view of an integrated module in the first embodiment of the integrated module of the present invention.
  • the embodiment provides an integrated module, which may specifically include a PCB 10 And module device 20.
  • the module device 20 is mounted on the PCB 10, and specifically can be mounted in the prior art, such as SMT, and the module device 20 is mounted on the front side of the PCB 10, that is, the module module is mounted in the integrated module.
  • One side of the 20 is the front side and the other side is the bottom side.
  • Figure 1 is a top view of the integrated module, that is, a view from the front of the integrated module
  • Figure 2 is a bottom view of the integrated module, that is, a view seen from the bottom of the integrated module, therefore, the mounting can be displayed in Figure 1.
  • Module device 20 on PCB 10 while module device 20 is not shown in the figure.
  • a set of front side lead pads 11 are disposed around the front side of the PCB 10, and the front side lead pads 11 are located around the mounting position of the module device 20, that is, the front side pins are attached around the module device 20.
  • a set of bottom surface pin pads 12 is disposed around the bottom surface of the PCB 10, where the periphery is specifically around the position of the mounting module device 20 of the PCB 10, and the module device 20 is mounted on the PCB 10.
  • the area around the front pin pad 11 or the bottom pad pad 12 is included.
  • One of the front side lead pad 11 and the bottom side lead pad 12 in this embodiment is used to assemble the integrated module on the main board of the integrated system board, the front side lead pad 11 and the bottom side lead pad 12 The other is used to test the pin, which is tested by the pin during subsequent testing.
  • the position of the front surface pin pad 11 is set to be symmetrical with the position of the bottom surface pin pad 12, that is, the front side pin is disposed at a position symmetrical with the position where the bottom surface pin pad 12 is disposed.
  • Pad 11 The mesh of the front side lead pad 11 and the bottom side pin pad 12 in this embodiment.
  • the network attributes are the same, and the network attributes are the same here.
  • each of the new front pin pads 11 in the integrated module corresponds to each of the bottom pin pads 12, and the two sets of pins.
  • the remaining structures and functions are identical, and each pair of corresponding pins are connected together.
  • the bottom pin pad 12 can be used for functional testing; when the bottom pin pad 12 is used for assembly with the motherboard of the integrated system board
  • the front pin pad 11 can be used for functional testing. Therefore, when it is required to test the integrated module in this embodiment, it is not necessary to add an additional line to connect the integrated module and the test circuit, directly to the front pin pad 11 or the bottom pin pad 12 used as a test point. Test each pin.
  • FIG. 3 is a schematic diagram of the assembly of the integrated module and the main board in the first embodiment of the integrated module of the present invention.
  • the bottom surface pin pad 12 (not shown) in this embodiment is specifically used for
  • the integrated module 1 is assembled on the main board 2 of the integrated system board. Since the front side of the PCB 10 in the integrated module of Fig. 3 faces upward, and the bottom surface pad pad 12 is located on the bottom surface of the PCB 10 in the integrated module 1, it cannot be displayed in Fig. 3.
  • the integrated module 1 is assembled with the main board 2 through the bottom surface pad, and the front side lead pad 11 can be used to test the integrated module 1, that is, as a test point for the functional test.
  • FIG. 4 is a schematic diagram of the assembly of the integrated module and the main board in the first embodiment of the integrated module of the present invention.
  • the front surface pad 11 (not shown) in this embodiment is specifically used for
  • the integrated module 1 is assembled on the main board 2 of the integrated system board. Since the bottom side of the PCB 10 in the integrated module 1 of Fig. 4 faces upward, and the front side lead pad 11 is located on the front side of the PCB 10 in the integrated module 1, it is not shown in Fig. 4.
  • the integrated module 1 is assembled with the main board 2 through the front pin pads, and the bottom surface pad 12 is used to test the integrated module 1, that is, as a test point for the functional test.
  • the integrated module 1 is reversely assembled with the main board, and the module device 20 is sunk into the assembly slot 22 on the main board, thereby reducing the overall integrated system board formed after assembly. thickness.
  • the embodiment provides an integrated module, wherein a set of front surface pin pads are disposed around the front surface of the PCB, and a set of bottom surface pin pads are disposed around the bottom surface of the PCB, and the front surface of the lead pad and the bottom surface are The network properties of the foot pads are the same.
  • this embodiment can directly test through the front pin pad or the bottom pin pad without adding additional test lines, thereby improving the convenience of testing the integrated module. Since the front and bottom pin pads of the integrated module can be assembled with the main board, the present embodiment increases the convenience of assembly.
  • FIG. 5 and FIG. 6 are respectively a front view and a bottom surface of the integrated module in the second embodiment of the integrated module of the present invention.
  • the embodiment provides an integrated module, which may include a PCB 10 and a module device 20.
  • the integrated module in this embodiment is a plastic module, wherein the module device 20 Plasticized with PCB 10 as a whole.
  • a plurality of front surface pin pads 11 are disposed around the front surface of the integrated module of the embodiment, and a set of bottom surface pin pads 12 are disposed around the bottom surface of the integrated module, and the position of the front surface pin pad 11 and the bottom surface pin are set.
  • the locations of the pads 12 are symmetrical with each other, and the front pin pads have the same network properties as the bottom pin pads.
  • the bottom surface pin pad 12 in this embodiment is specifically used to assemble the integrated module on the main board of the integrated system board.
  • the integrated module is assembled with the motherboard through the bottom pin pad, and the front pin pad 11 can be used to test the integrated module, that is, as a test for functional testing.
  • the front surface pad 11 in this embodiment is specifically used to assemble the integrated module on the main board of the integrated system board.
  • the integrated module is assembled with the motherboard through the front pin pads, and the bottom pin pad 12 is used to test the integrated module as a test point for functional testing.
  • the embodiment provides an integrated module, wherein a set of front surface pin pads are disposed around the bottom surface of the integrated module by providing a set of front surface pin pads around the front surface of the integrated module, and the front surface pin pads are The network properties of the bottom pin pad are the same. Compared with the prior art, this embodiment can be tested directly through the front pin pad or the bottom pin pad without adding additional test lines, thereby improving the test integration module. Convenience; Since the front and bottom pin pads of the integrated module can be assembled with the main board, the present embodiment increases the convenience of assembly.
  • the embodiment further provides an integrated system board, which may specifically include an integrated module and a motherboard.
  • the integrated module may be specifically as shown in FIG. 1 and FIG. 2 above, and specifically includes a printed circuit board PCB 10 and a module device 20, wherein the module device 20 is mounted on the PCB 10, and a front side of the front side of the PCB 10 is provided.
  • a set of bottom surface pin pads 12 are disposed around the bottom surface of the lead pad 11 and the bottom surface of the PCB 10; and the position of the front surface pin pad 11 in the PCB 10 is symmetrical with the position of the bottom surface pin pad 12, the front side
  • the pin pad 11 has the same network properties as the bottom pad pad 12.
  • the motherboard of the integrated system board is provided with a motherboard pin pad, and the integrated module is assembled on the motherboard through the motherboard pin pad.
  • FIG. 7 is a schematic structural diagram of Embodiment 1 of the integrated system board of the present invention.
  • the embodiment provides an integrated system board, which may specifically include an integrated module and a motherboard.
  • the integrated module includes a PCB 10 and a module device 20.
  • the structure of the integrated module can be as shown in FIG. 1 or FIG. 2 above, and the assembly manner of the integrated module and the main board can be as shown in FIG. 3 above. Referring to FIG. 1, FIG. 2 and FIG.
  • the module device 20 in the integrated module 1 is mounted on the PCB 10, and a set of front surface pin pads 11 are disposed around the front surface of the PCB 10, and the front surface pin pads 11 are located around the mounting position of the module device 20, that is, the front side
  • the pins are disposed around the mounting position of the module device 20, and a set of bottom surface pin pads 12 are disposed around the bottom surface of the PCB 10, and the positions of the front surface pin pads 11 and the positions of the bottom surface pin pads 12 are set.
  • the front pin pad 11 has the same network properties as the bottom pad pad 12.
  • the main board 2 of the integrated system board is provided with a main board pin pad 21 for assembling the integrated module 1 on the main board 2. As can be seen from FIG.
  • the integrated module in the assembled integrated system board in this embodiment faces upward.
  • the integrated module 1 is assembled on the main board 2 by soldering the bottom surface lead pads in the integrated module 1 to the main board pin pads 21 on the main board 2.
  • the front side lead pad 11 in the integrated module 1 is used to test the integrated module, so that no additional test connection circuit is required to lead to the bottom surface pad pad.
  • FIG. 8 is a schematic structural diagram of Embodiment 2 of the integrated system board of the present invention.
  • the embodiment provides an integrated system board, which may specifically include an integrated module and a motherboard.
  • the integrated module includes a PCB 10 and a module device 20.
  • the structure of the integrated module can be as shown in FIG. 1 or FIG. 2 above, and the assembly manner of the integrated module and the main board can be as shown in FIG. 4 above. Referring to FIG. 1, FIG. 2 and FIG.
  • the integrated module 1 The module device 20 is mounted on the PCB 10, and a set of front surface pin pads 11 are disposed around the front surface of the PCB 10, and a set of bottom surface pin pads 12 are disposed around the bottom surface of the PCB 10, and the front surface pin pads 11 are disposed.
  • the position is symmetrical with the position at which the bottom pin pad 12 is disposed, and the front pin pad 11 and the bottom pin pad 12 have the same network property.
  • the main board 2 of the integrated system board is provided with a main board pin pad 21 for assembling the integrated module 1 on the main board 2.
  • the main board 2 in this embodiment is provided with an assembly groove 22, and the assembly groove 22 is opened in a region surrounded by the main board pin pad 21.
  • the integrated module 1 is facing downward, that is, the integrated module 1 is reversely assembled with the main board 2, and the main board 2 is provided with The module device 20 mates with the assembly slot 22.
  • the front side of the integrated module 1 faces downward, and the front surface pin pads in the integrated module 1 are soldered together with the main board pin pads 21 on the main board 2, and the module device 20 is disposed on the main board 2
  • the insertion here is such that the size of the assembly slot 22 matches the module device 20.
  • the module device 20 on the PCB 10 just sinks in the assembly slot 22, thereby enabling the integration module 1 to pass through.
  • the assembly groove 22 is assembled on the main board 2.
  • the overall thickness of the assembled integrated system board in this embodiment is significantly reduced compared to the conventional upward integration of the integrated module shown in FIG. 7, which is equivalent to the reduction of the module device. thickness of.
  • the bottom surface pin pad 12 in the integrated module 1 is used to integrate the integrated module. The test is performed so that no additional test connection circuitry is required to draw the bottom pad.
  • the embodiment provides an integrated system board, which is composed of an integrated module and a motherboard.
  • a set of front surface pins are disposed around the front surface of the PCB of the integrated module, and a set of bottom surface pins are disposed around the bottom surface of the PCB.
  • the pad, and the front pin pad and the bottom pin pad have the same network property.
  • this embodiment does not need to add additional test lines, directly through the front pin pad or the bottom pin pad. Testing can be done to improve the convenience of the test integration module.
  • this embodiment by providing pin pads on both the front and the bottom of the integrated module, two assembly modes of the integrated system board are realized, and the face-down assembly mode of the integrated module can significantly reduce the overall integrated system board.
  • the thickness is such that miniaturization of the electronic device is achieved.
  • the embodiment further provides an electronic device, which may specifically include the integrated system board shown in FIG. 7 or FIG. 8 above.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

提供一种集成模块、集成系统板和电子设备。集成模块包括印刷电路板（PCB）（10）和模块器件（20），其中，所述模块器件（20）贴装在所述PCB（10）上。所述PCB（10）的正面的四周设置一组正面引脚焊盘（11），且所述正面引脚焊盘（11）位于所述模块器件（20）的贴装位置周围，所述PCB（10）的底面的四周设置一组底面引脚焊盘（12）；设置所述正面引脚焊盘（11）的位置与设置所述底面引脚焊盘（12）的位置互为对称，所述正面引脚焊盘（11）与所述底面引脚焊盘（12）的网络属性相同。集成系统板包括集成模块和主板，所述集成模块包括印刷电路板（10）和模块器件（20）。电子设备包括上述集成系统板。本实施例无需增加额外的测试线路，提高了测试集成模块的便利性。

Description

集成模块、 集成系统板和电子设备 技术领域 本发明涉及通信技术， 尤其涉及一种集成模块、 集成系统板和电子设备。 背景技术 随着科技的不断发展和进步， 通信领域中的电子产品中越来越多地采用集 成度较高的集成模块， 直接将集成模块组装到整机主板上， 对整机产品的应用 提供了较大的便利性和通用性。 常规的集成模块的设计一般为触点阵列封装
( Land Grid Array;以下简称： LGA )或者无引脚芯片载体（Leadless Chip Carrier; 以下简称： LCC )城堡式封装。 LGA在底面制作有阵列状态的电极触点， 其釆 用金属触点式封装取代以往的针状插脚， 从而可以克服针脚接触造成的信号干 扰； LCC是指陶瓷基板的四个侧面只有电极接触而无引脚的表面贴装型封装， 用于封装高速和高频集成电路（ Integrated Circuit; 以下简称： IC ), 由于这种封 装方式四侧无引脚， 贴装占有面积较小， 高度较低。 通常通过集成模块进行进 一步的小型化封装， 即形成类似于芯片的系统级封装（ System In Package; 以下 筒称： SIP )。
现有技术中集成模块采用表面贴装技术 （Surface Mounted Technology; 以 下简称： SMT )进行组装， 在集成模块的印刷电路板 ( Printed Circuit Board; 以 下筒称： PCB )的底面四周设计一组引脚焊盘， 将模块器件贴装在 PCB的正面。
然而， 当对现有技术中的集成模块进行测试时， 需要通过增加额外的线路， 以连接集成模块与测试电路， 加大了测试过程的复杂度。
发明内容 本发明实施例提供一种集成模块、 集成系统板和电子设备， 无需增加额外 的测试线路， 提高测试集成模块的便利性。 本发明实施例的第一个方面是提供一种集成模块， 包括印刷电路板 PCB和 模块器件， 其中，
所述模块器件贴装在所述 PCB上，所述 PCB的正面的四周设置一组正面引 脚焊盘， 且所述正面引脚焊盘位于所述模块器件的贴装位置周围， 所述 PCB的 底面的四周设置一组底面引脚焊盘； 设置所述正面引脚焊盘的位置与设置所述底面引脚焊盘的位置互为对称， 所述正面引脚焊盘与所述底面引脚焊盘的网络属性相同。
本发明实施例的另一个方面是提供一种集成模块， 包括印刷电路板 PCB和 模块器件， 其中，
所述模块器件与所述 PCB塑封为一个整体， 所述集成模块的正面的四周设 置一组正面引脚焊盘， 且所述正面引脚焊盘位于所述模块器件的贴装位置周围， 所述集成模块的底面的四周设置一组底面引脚焊盘；
设置所述正面引脚焊盘的位置与设置所述底面引脚焊盘的位置互为对称， 所述正面引脚焊盘与所述底面引脚焊盘的网络属性相同。
本发明实施例的另一个方面是提供一种集成系统板， 包括集成模块和主板， 所述集成模块包括印刷电路板 PCB和模块器件， 其中，
所述模块器件贴装在所述 PCB上，所述 PCB的正面的四周设置一组正面引 脚焊盘， 所述 PCB的底面的四周设置一组底面引脚焊盘；
设置所述正面引脚焊盘的位置与设置所述底面引脚焊盘的位置互为对称， 所述正面引脚焊盘与所述底面引脚焊盘的网络属性相同；
所述主板上设置有主板引脚焊盘， 所述集成模块通过所述主板引脚焊盘组 装在所述主板上。
本发明实施例的又一个方面是提供一种电子设备， 包括上述集成系统板。 本发明实施例的技术效果是： 通过在 PCB的正面的四周设置一组正面引脚 焊盘， 在 PCB的底面的四周设置一组底面引脚焊盘， 且正面引脚焊盘与底面引 脚焊盘的网络属性相同， 本实施例与现有技术相比， 无需增加额外的测试线路， 直接通过正面引脚焊盘或底面引脚焊盘进行测试即可， 提高了测试集成模块的 便利性； 由于集成模块的正面引脚焊盘和底面引脚焊盘均可以与主板进行組装， 因此本实施例增加了组装的便利性。
附图说明 为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实施 例或现有技术描述中所需要使用的附图作一简单地介绍， 显而易见地， 下面描 述中的附图是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出 创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。 图 1为本发明集成模块实施例一中集成模块的俯视图; 图 2为本发明集成模块实施例一中集成模块的仰视图；
图 3为本发明集成模块实施例一中集成模块与主板的组装示意图一； 图 4为本发明集成模块实施例一中集成模块与主板的组装示意图二； 图 5为本发明集成模块实施例二中集成模块的正面视图；
图 6为本发明集成模块实施例二中集成模块的底面视图；
图 7为本发明集成系统板实施例一的结构示意图；
图 8为本发明集成系统板实施例二的结构示意图。
具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发明 实施例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描述， 显然， 所描述的实施例是本发明一部分实施例， 而不是全部的实施例。 基于本发明中 的实施例， 本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其 他实施例， 都属于本发明保护的范围。
图 1和图 2分别为本发明集成模块实施例一中集成模块的俯视图和仰视图， 如图 1和图 2所示， 本实施例提供了一种集成模块， 该集成模块可以具体包括 PCB 10和模块器件 20。 其中， 模块器件 20贴装在 PCB 10上， 具体可以采用现 有技术中的贴装方式，如 SMT等贴装方式，模块器件 20贴装在 PCB 10的正面， 即集成模块中贴装模块器件 20的一面为正面， 另一面即为其底面。 由于图 1为 集成模块的俯视图， 即从集成模块的正面看到的视图， 图 2 为集成模块的仰视 图， 即从集成模块的底面看到的视图， 因此， 在图 1中可以显示贴装在 PCB 10 上的模块器件 20, 而在图 中无法显示模块器件 20。 在本实施例中， 在 PCB 10 的正面的四周设置一组正面引脚焊盘 11 , 且正面引脚焊盘 11位于模块器件 20 的贴装位置周围， 即正面引脚围绕模块器件 20的贴装位置而设置， 在 PCB 10 的底面的四周设置一组底面引脚焊盘 12，此处的四周具体为 PCB 10的贴装模块 器件 20的位置的四周， 模块器件 20贴装在 PCB 10的正面引脚焊盘 11或底面 引脚焊盘 12围绕的区域内。 本实施例中的正面引脚焊盘 11和底面引脚焊盘 12 中的一个用于将集成模块组装在集成系统板的主板上， 正面引脚焊盘 11和底面 引脚焊盘 12中的另外一个则用于测试引脚， 后续测试过程中通过该引脚对集成 模块进行测试。 另外， 本实施例中设置正面引脚焊盘 11的位置与设置底面引脚 焊盘 12的位置互为对称， 即在与设置底面引脚焊盘 12的位置互为对称的位置 设置正面引脚焊盘 11。 本实施例中的正面引脚焊盘 11与底面引脚焊盘 12的网 络属性相同， 此处的网络属性相同具体指在集成模块中新增的正面引脚焊盘 11 中每一个引脚分别对应于底面引脚焊盘 12中每一个引脚， 这两组引脚焊盘除了 位置不同之外， 其余的结构、 功能等均一致， 每对相互对应的引脚连通在一起。 当正面引脚焊盘 11用于与集成系统板的主板进行组装时， 底面引脚焊盘 12则 可以用于功能测试； 当底面引脚焊盘 12用于与集成系统板的主板进行组装时， 正面引脚焊盘 11则可以用于功能测试。 因此， 当需要对本实施例中的集成模块 进行测试时， 无需增加额外的线路来连接集成模块与测试电路， 直接对用作测 试点的正面引脚焊盘 11或底面引脚焊盘 12中的各引脚进行测试即可。
具体地， 图 3 为本发明集成模块实施例一中集成模块与主板的组装示意图 一， 如图 3所示， 本实施例中的底面引脚焊盘 12 (图中未示出） 具体用于将集 成模块 1组装在集成系统板的主板 2上。 由于图 3中集成模块中 PCB 10的正面 朝上， 而底面引脚焊盘 12位于集成模块 1中 PCB 10的底面， 因此图 3中无法 显示。 在本实施例中， 通过底面引脚焊盘将集成模块 1 与主板 2组装在一起， 而正面引脚焊盘 11则可以用于对集成模块 1进行测试， 即作为功能测试的测试 点。
具体地， 图 4 为本发明集成模块实施例一中集成模块与主板的组装示意图 二， 如图 4所示， 本实施例中的正面引脚焊盘 11 (图中未示出） 具体用于将集 成模块 1组装在集成系统板的主板 2上。 由于图 4中集成模块 1中 PCB 10的底 面朝上， 而正面引脚焊盘 11位于集成模块 1中 PCB 10的正面， 因此图 4中无 法显示。 在本实施例中， 通过正面引脚焊盘将集成模块 1与主板 2组装在一起， 而底面引脚焊盘 12用于对集成模块 1进行测试， 即作为功能测试的测试点。 从 图 4 中可以看出， 本实施例中将集成模块 1反过来与主板进行组装， 将模块器 件 20下沉到主板上的组装槽 22中， 从而可以降低组装后形成的集成系统板的 整体厚度。
本实施例提供了一种集成模块， 通过在 PCB的正面的四周设置一组正面引 脚焊盘， 在 PCB的底面的四周设置一组底面引脚焊盘， 且正面引脚焊盘与底面 引脚焊盘的网络属性相同， 本实施例与现有技术相比， 无需增加额外的测试线 路， 直接通过正面引脚焊盘或底面引脚焊盘进行测试即可， 提高了测试集成模 块的便利性； 由于集成模块的正面引脚焊盘和底面引脚焊盘均可以与主板进行 组装， 因此本实施例增加了组装的便利性。
图 5和图 6分别为本发明集成模块实施例二中集成模块的正面视图和底面 视图， 如图 5和图 6所示， 本实施例提供了一种集成模块， 该集成模块可以包 括 PCB 10和模块器件 20， 本实施例中的集成模块为一个塑封模块， 其中， 模块 器件 20与 PCB 10塑封为一个整体。 本实施例的集成模块的正面的四周设置一 组正面引脚焊盘 11 , 集成模块的底面的四周设置一组底面引脚焊盘 12, 设置正 面引脚焊盘 11 的位置与设置底面引脚焊盘 12的位置互为对称， 所述正面引脚 焊盘与所述底面引脚烊盘的网络属性相同。
具体地， 本实施例中的底面引脚焊盘 12具体用于将集成模块组装在集成系 统板的主板上。 在本实施例中， 通过底面引脚焊盘将集成模块与主板组装在一 起， 而正面引脚焊盘 11则可以用于对集成模块进行测试， 即作为功能测试的测 试点。
具体地， 本实施例中的正面引脚焊盘 11具体用于将集成模块组装在集成系统 板的主板上。 在本实施例中， 通过正面引脚焊盘将集成模块与主板组装在一起， 而底面引脚焊盘 12用于对集成模块进行测试， 即作为功能测试的测试点。
本实施例提供了一种集成模块， 通过在集成模块的正面的四周设置一组正 面引脚焊盘， 在集成模块的底面的四周设置一组底面引脚焊盘， 且正面引脚焊 盘与底面引脚焊盘的网络属性相同， 本实施例与现有技术相比， 无需增加额外 的测试线路， 直接通过正面引脚焊盘或底面引脚焊盘进行测试即可， 提高了测 试集成模块的便利性； 由于集成模块的正面引脚焊盘和底面引脚烊盘均可以与 主板进行组装， 因此本实施例增加了组装的便利性。
本实施例还提供了一种集成系统板， 该集成系统板可以具体包括集成模块 和主板。 其中， 集成模块可以具体如上述图 1和图 2所示， 具体包括印刷电路 板 PCB 10和模块器件 20, 其中， 模块器件 20贴装在 PCB 10上， PCB 10的正 面的四周设置一组正面引脚焊盘 11， PCB 10的底面的四周设置一组底面引脚焊 盘 12;且 PCB 10中设置正面引脚焊盘 11的位置与设置底面引脚焊盘 12的位置 互为对称， 正面引脚焊盘 11 与底面引脚焊盘 12的网络属性相同。 在本实施例 中， 集成系统板的主板上设置有主板引脚焊盘， 集成模块通过该主板引脚焊盘 组装在主板上。
图 Ί为本发明集成系统板实施例一的结构示意图， 如图 7所示， 本实施例 提供了一种集成系统板， 可以具体包括集成模块和主板， 集成模块包括 PCB 10 和模块器件 20。 其中， 集成模块的结构可以如上述图 1或图 2所示， 而集成模 块与主板的组装方式可以如上述图 3所示， 继续参照上述图 1、 图 2以及图 3 , 集成模块 1中的模块器件 20贴装在 PCB 10上， PCB 10的正面的四周设置一组 正面引脚焊盘 11， 且正面引脚焊盘 11位于模块器件 20的贴装位置周围， 即正 面引脚围绕模块器件 20的贴装位置而设置， PCB 10的底面的四周设置一组底面 引脚焊盘 12, 且设置正面引脚焊盘 11的位置与设置底面引脚焊盘 12的位置互 为对称， 正面引脚焊盘 11与底面引脚焊盘 12的网络属性相同。 在本实施例中， 集成系统板的主板 2上设置有主板引脚焊盘 21 ,该主板引脚焊盘 21用于将集成 模块 1组装在主板 2上。 从图 3中可以看出， 本实施例中组装后的集成系统板 中集成模块的正面朝上。本实施例通过将集成模块 1中的底面引脚焊盘与主板 2 上的主板引脚焊盘 21焊接在一起， 从而实现将集成模块 1组装在主板 2上。 在 本实施例中， 集成模块 1中的正面引脚焊盘 11用于对集成模块进行测试， 从而 无需再增加额外的测试连接电路， 以引出底面引脚焊盘。
图 8为本发明集成系统板实施例二的结构示意图， 如图 8所示， 本实施例 提供了一种集成系统板， 可以具体包括集成模块和主板， 集成模块包括 PCB 10 和模块器件 20。 其中， 集成模块的结构可以如上述图 1或图 2所示， 而集成模 块与主板的组装方式可以如上述图 4所示， 继续参照上述图 1、 图 2以及图 4 , 集成模块 1中的模块器件 20贴装在 PCB 10上， PCB 10的正面的四周设置一组 正面引脚焊盘 11， PCB 10的底面的四周设置一组底面引脚焊盘 12，且设置正面 引脚焊盘 11的位置与设置底面引脚焊盘 12的位置互为对称， 正面引脚焊盘 11 与底面引脚焊盘 12的网络属性相同。 在本实施例中， 集成系统板的主板 2上设 置有主板引脚焊盘 21 , 该主板引脚焊盘 21用于将集成模块 1组装在主板 2上。
另外， 本实施例中的主板 2上设置有组装槽 22， 组装槽 22开设在主板引脚 焊盘 21围设的区域中。 从图 4中可以看出， 本实施例中组装后的集成系统板中 集成模块 1的正面朝下， 即本实施例将集成模块 1反过来与主板 2进行组装， 且主板 2上设置有与模块器件 20相匹配的组装槽 22。本实施例将集成模块 1的 正面朝下， 通过将集成模块 1中的正面引脚焊盘与主板 2上的主板引脚焊盘 21 焊接在一起， 而模块器件 20穿设在主板 2上设置的组装槽 22中， 此处的穿设 即为组装槽 22的大小与模块器件 20 相匹配， 位于 PCB 10上的模块器件 20正 好下沉在组装槽 22中， 从而实现将集成模块 1穿过组装槽 22组装在主板 2上。 从图 8中可以看出， 相比于图 7所示的传统的集成模块正面朝上的组装方式， 本实施例中组装后的集成系统板的整体厚度明显降低， 即相当于减少了模块器 件的厚度。 在本实施例中， 集成模块 1中的底面引脚焊盘 12用于对集成模块进 行测试， 从而无需再增加额外的测试连接电路， 以引出底面引脚焊盘。
本实施例提供了一种集成系统板， 由集成模块和主板组装构成， 通过在集 成模块的 PCB的正面的四周设置一组正面引脚焊盘，在 PCB的底面的四周设置 一组底面引脚焊盘， 且正面引脚焊盘与底面引脚焊盘的网络属性相同， 本实施 例与现有技术相比， 无需增加额外的测试线路， 直接通过正面引脚焊盘或底面 引脚焊盘进行测试即可， 提高了测试集成模块的便利性。 另外， 本实施例通过 在集成模块的正面和底面均设置引脚焊盘， 从而实现了集成系统板的两种组装 方式， 且集成模块的正面朝下的组装方式可以明显降低集成系统板的整体厚度， 从而实现了电子设备的小型化。
本实施例还提供了一种电子设备， 可以具体包括上述图 7或图 8所示的集 成系统板。
最后应说明的是： 以上各实施例仅用以说明本发明的技术方案， 而非对其 限制； 尽管参照前述各实施例对本发明进行了详细的说明， 本领域的普通技术 人员应当理解： 其依然可以对前述各实施例所记载的技术方案进行修改， 或者 对其中部分或者全部技术特征进行等同替换； 而这些修改或者替换， 并不使相 应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims

权 利 要 求
1、 一种集成模块， 其特征在于， 包括印刷电路板 PCB和模块器件， 其中， 所述模块器件贴装在所述 PCB上，所述 PCB的正面的四周设置一组正面引 脚焊盘， 且所述正面引脚焊盘位于所述模块器件的贴装位置周围， 所述 PCB的 底面的四周设置一组底面引脚焊盘；
设置所述正面引脚焊盘的位置与设置所述底面引脚焊盘的位置互为对称， 所述正面引脚焊盘与所述底面引脚焊盘的网络属性相同。
2、 根据权利要求 1所述的集成模块， 其特征在于， 所述底面引脚焊盘用于 将所述集成模块组装在集成系统板的主板上， 所述正面引脚焊盘用于对所述集 成模块进行测试。
3、 根据权利要求 1所述的集成模块， 其特征在于， 所述正面引脚焊盘用于 将所述集成模块组装在集成系统板的主板上， 所述底面引脚焊盘用于对所述集 成模块进行测试。
4、 一种集成系统板， 其特征在于， 包括集成模块和主板， 所述集成模块包 括印刷电路板 PCB和模块器件， 其中，
所述模块器件贴装在所述 PCB上，所述 PCB的正面的四周设置一组正面引 脚焊盘， 且所述正面引脚焊盘位于所述模块器件的贴装位置周围， 所述 PCB的 底面的四周设置一组底面引脚焊盘；
设置所述正面引脚焊盘的位置与设置所述底面引脚焊盘的位置互为对称， 所述正面引脚焊盘与所述底面引脚焊盘的网络属性相同；
所述主板上设置有主板引脚焊盘， 所述集成模块通过所述主板引脚焊盘组 装在所述主板上。
5、根据权利要求 4所述的集成系统板， 其特征在于， 所述集成模块通过所 述主板引脚焊盘与所述底面引脚焊盘之间的焊接连接而组装在所述主板上； 所述正面引脚焊盘用于对所述集成模块进行测试。
6、 根据权利要求 4所述的集成系统板， 其特征在于， 所述主板上设置有组 装槽， 所述组装槽开设在所述主板引脚焊盘围设的区域中；
所述集成模块通过所述主板引脚焊盘与所述正面引脚焊盘之间的焊接连接 而组装在所述主板上 , 所述模块器件穿设在所述主板上设置的组装槽中； 所述底面引脚焊盘用于对所述集成模块进行测试。
7、 一种电子设备， 其特征在于， 包括权利要求 4-6中任一项所述的集成系 统板。
8、 一种集成模块， 其特征在于， 包括印刷电路板 PCB和模块器件， 其中， 所述模块器件与所述 PCB塑封为一个整体， 所述集成模块的正面的四周设 置一组正面引脚焊盘， 所述集成模块的底面的四周设置一组底面引脚焊盘； 设置所述正面引脚焊盘的位置与设置所述底面引脚焊盘的位置互为对称， 所述正面引脚焊盘与所述底面引脚焊盘的网络属性相同。
9、 根据权利要求 8所述的集成模块， 其特征在于， 所述底面引脚焊盘用于 将所述集成模块组装在集成系统板的主板上， 所述正面引脚焊盘用于对所述集 成模块进行测试。
10、 根据权利要求 8 所述的集成模块， 其特征在于， 所述正面引脚焊盘用 于将所述集成模块组装在集成系统板的主板上， 所述底面引脚焊盘用于对所述 集成模块进行测试。
PCT/CN2013/070094 2012-01-17 2013-01-06 集成模块、集成系统板和电子设备 WO2013107305A1 (zh)

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