WO2013084416A1 - Convertisseur de puissance - Google Patents

Convertisseur de puissance Download PDF

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Publication number
WO2013084416A1
WO2013084416A1 PCT/JP2012/007307 JP2012007307W WO2013084416A1 WO 2013084416 A1 WO2013084416 A1 WO 2013084416A1 JP 2012007307 W JP2012007307 W JP 2012007307W WO 2013084416 A1 WO2013084416 A1 WO 2013084416A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
heat
transfer support
circuit component
mounting substrate
Prior art date
Application number
PCT/JP2012/007307
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English (en)
Japanese (ja)
Inventor
泰仁 田中
鳥羽　章夫
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201280055468.XA priority Critical patent/CN103947095A/zh
Publication of WO2013084416A1 publication Critical patent/WO2013084416A1/fr

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Definitions

  • the present invention supports a mounting board on which a circuit component including a heat generating circuit component for driving the semiconductor switching element is mounted at a predetermined interval on a semiconductor power module including a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device.
  • a power change device described in Patent Document 1 As this type of power conversion device, a power change device described in Patent Document 1 is known.
  • a water cooling jacket is disposed in a casing, and a semiconductor power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket to cool the power conversion apparatus.
  • a control circuit board is disposed in the housing at a predetermined distance on the opposite side of the semiconductor power module from the water-cooling jacket, and the heat generated by the control circuit board is supported by the heat dissipation member. The heat transmitted to the metal base plate is further transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
  • the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path. In order to solve this unsolved problem, it is also necessary to dissipate the heat generated by the substrate and mounted components by natural convection from the case and case cover, increasing the surface area of the case and case cover. For this reason, the outer shape of the housing and the housing lid is increased, and the power converter is increased in size.
  • the present invention has been made paying attention to the unsolved problems of the above conventional example, and efficiently dissipates the heat of the heat generating circuit components mounted on the substrate to the cooling body, and also the insulating performance of the heat transfer member. It aims at providing the power converter device which can ensure.
  • a first aspect of a power conversion device includes a semiconductor power module in which one surface is joined to a cooling body and a circuit component including a heat generating circuit component that drives the semiconductor power module.
  • the circuit component mounted on the mounting board is a surface mount connection type circuit component.
  • the heat generated by the heat generating circuit component mounted on the mounting board can be radiated to the cooling body via the heat transfer support member by the heat conduction path, and the heat generating circuit component can be efficiently radiated. Furthermore, by making the circuit component to be mounted on the mounting board into a surface mount connection type circuit component, no protrusion such as a lead protrudes on the heat transfer member side, and insulation of the heat transfer member can be ensured. .
  • the said heat-transfer support member is comprised with the metal material with high heat conductivity.
  • the heat transfer support member is made of a metal material such as aluminum, aluminum alloy, or copper having high thermal conductivity, so that heat can be radiated to the cooling body more efficiently.
  • the 3rd aspect of the power converter device which concerns on this invention is comprised by the said heat-transfer member in any one of the insulator which has heat conductivity, and the elastic body which has heat conductivity, and has elasticity. ing.
  • the heat transfer member is made of an elastic body having heat conductivity and stretchability, the heat transfer member has stretchability, so that the heat transfer member is brought into contact with the surroundings of a heat-generating component mounted on the mounting board. It is possible to increase the contact area and improve the heat dissipation effect.
  • the said heat-transfer member is comprised with the elastic body which has thermal conductivity and has a stretching property, and the said elastic body is the said mounting substrate and the said heat-transfer. It is fixed in a compressed state with the support plate.
  • the heat transfer member is formed of an elastic body having thermal conductivity and stretchability, and the elastic body is fixed in a compressed state between the mounting substrate and the heat transfer support plate portion. ing.
  • the 5th aspect of the power converter device which concerns on this invention is provided with the space
  • the compression rate of the elastic body can be determined by the interval adjusting member, and the compression rate of the elastic body can be easily adjusted to a constant value.
  • a semiconductor power module in which one surface is joined to a cooling body, a mounting board on which circuit components including a heat generating circuit component for driving the semiconductor power module are mounted, and a transmission board.
  • a heat transfer support member that supports the mounting substrate via a heat member; and a heat conduction path that transfers heat of the mounting substrate to the cooling body via the heat transfer support member.
  • the circuit component mounted on the mounting substrate is a circuit component having a solder connection lead and soldering the solder connection lead, and at least the heat transfer member corresponding to the insertion position of the solder connection lead and the heat transfer member.
  • An electrically insulating member is interposed between the heat supporting member.
  • the heat generated by the heat generating circuit component mounted on the mounting substrate can be radiated to the cooling body via the heat transfer support member through the heat conduction path, and the heat generating circuit component can be efficiently radiated.
  • the solder connection leads of the circuit components protrude from the mounting board and pierce into the heat transfer member, a hole is opened, and this hole expands due to vibration or the like to form a space in the heat transfer member, resulting in a decrease in insulation performance
  • at least the electrical insulating member is interposed in the region corresponding to the insertion region of the solder connection lead of the circuit component, it is possible to secure the necessary insulating performance by compensating for the decrease in the insulating performance of the heat transfer member with the electrical insulating member.
  • a seventh aspect of the power conversion device is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a cooling member that contacts the cooling body is formed on one surface of the case body. And a mounting substrate on which circuit components including a heat generating circuit component that drives the semiconductor switching element are mounted, and a heat transfer support plate portion that supports the mounting substrate via a heat transfer member, the semiconductor power module, A heat transfer support member that forms a heat conduction path independent of the casing that surrounds both of the mounting substrates and contacts the cooling body.
  • the circuit component mounted on the mounting board is a circuit component having a solder connection lead and soldering the solder connection lead, and at least the heat transfer member corresponding to the insertion position of the solder connection lead and the heat transfer member.
  • An electrically insulating member is interposed between the heat support plate portion.
  • the heat generated by the heat generating circuit components mounted on the mounting board can be radiated to the cooling body via the heat transfer support member independent of the housing, It is possible to efficiently radiate circuit components.
  • the plurality of heat conduction paths between the mounting substrate and the cooling body are formed independently of the housing surrounding both the semiconductor power module and each mounting substrate, the heat conductivity of the housing is taken into consideration.
  • the housing can be formed without increasing the design freedom.
  • the electrically insulating member is formed in a region facing the solder connection lead insertion region of the circuit component in a range wider than the solder connection lead insertion region. ing. According to this configuration, the formation range of the electrical insulation member is wider than the solder connection lead insertion range of the circuit component, so the necessary insulation performance is compensated for the deterioration of insulation performance caused by the piercing of the solder connection lead to the heat transfer member. Can be ensured.
  • the heat transfer support member is made of a metal material having high thermal conductivity. According to this configuration, since the heat transfer support member is made of a metal material such as aluminum, aluminum alloy, or copper having high thermal conductivity, heat dissipation to the cooling body can be performed more efficiently.
  • a tenth aspect of the power conversion device is such that the heat transfer member is one of an insulator having thermal conductivity and an elastic body having thermal conductivity and stretchability. ing.
  • the heat transfer member is one of an insulator having thermal conductivity and an elastic body having thermal conductivity and stretchability.
  • the heat transfer member is made of an elastic body having thermal conductivity and stretchability, so that the heat transfer member can be brought into contact with the surroundings of a heat generating component mounted on the mounting board. By increasing the contact area, the heat dissipation effect can be improved.
  • the heat transfer member is formed of an elastic body having thermal conductivity and elasticity, and the elastic body includes the mounting substrate and the heat transfer. It is fixed in a compressed state with the support plate. According to this configuration, since the elastic body is fixed in a compressed state by the mounting substrate and the heat transfer support plate portion, the contact with the heat-generating component mounted on the mounting substrate can be performed better, and the heat dissipation effect is improved. be able to.
  • an interval adjusting member that determines a compressibility of the elastic body is provided between the mounting substrate and the heat transfer support plate portion. According to this configuration, the compression rate of the elastic body can be determined by the interval adjusting member, and the compression rate of the elastic body can be easily adjusted to a constant value.
  • the heat generated by the mounting board on which the circuit components including the heat generating circuit components are mounted is radiated to the cooling body through the heat transfer support plate portion through the heat conduction path, so that the heat resistance is suppressed and the heat with good cooling efficiency is obtained. Cooling can be performed. Furthermore, by making the circuit component to be mounted on the mounting substrate into a surface mount connection type circuit component, it is possible to reliably prevent the protrusion of protrusions such as leads to the heat transfer member, and the heat transfer member and the heat transfer support plate The insulation performance between the parts can be ensured.
  • the circuit component to be mounted on the mounting board is configured to have a solder connection lead
  • an electrical insulating member is interposed between the heat transfer member and the heat transfer support plate portion, so that the solder connection lead, etc. Even when the insulation performance of the heat transfer member due to the protrusions sticking into the heat transfer member is reduced, the decrease in the insulation performance can be compensated by the electrical insulation member, and the necessary insulation performance can be ensured.
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
  • reference numeral 1 denotes a power converter
  • the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower housing 2A is covered with a cooling body 3 at the open top, and a film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 has a cooling water supply port 3 a and a drain port 3 b opened to the outside of the housing 2.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity. And as for the cooling body 3, the lower surface is made into a flat surface, and the upper surface is formed with the square-frame-shaped peripheral groove 3d leaving the center part 3c. Further, the cooling body 3 is formed with an insertion hole 3e through which the positive and negative connection terminals 4a with insulation coating of the film capacitor 4 held in the lower housing 2A are inserted vertically.
  • the power conversion apparatus 1 includes a semiconductor power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion.
  • the semiconductor power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal cooling member 13 is formed on the lower surface of the case body 12.
  • the case body 12 and the cooling member 13 are formed with insertion holes 15 through which fixing screws 14 as fixing members are inserted at the four corners when viewed from the plane.
  • substrate fixing portions 16 having a predetermined height are formed to project at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted.
  • a control circuit board 22 as a mounting board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the semiconductor power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. ing.
  • the drive circuit board 21 inserts the male screw part 24a of the joint screw 24 into the insertion hole 21a formed at a position facing the board fixing part 16, and the male screw part 24a is inserted into the board fixing part. It is fixed by screwing into a female screw portion 16a formed on the upper surface of 16. Further, the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into the insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by being screwed into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 is mounted with a heat generating circuit component 27 a on the lower surface side that comes into contact with a heat transfer member 35 to be described later, and a surface mount connection type on the upper surface side opposite to the heat transfer member 35.
  • a circuit component 27b is mounted.
  • the electrical connection with the control circuit board 22 is performed by the solder layer 28 formed on the lower surface. For this reason, in the surface mount connection type circuit component 27b, there is no solder connection lead that becomes a protrusion protruding to the lower surface side through a through hole formed in the control circuit board 22 unlike a lead connection type circuit component described later.
  • a heat generating circuit component 39a is mounted on the lower surface side that comes into contact with a heat transfer member 37 described later, and a surface mount connection type circuit component 39b is mounted on the upper surface side opposite to the heat transfer member 37.
  • the control circuit board 22 and the power circuit board 23 are supported by the heat transfer support members 32 and 33 so as to form a heat radiation path to the cooling body 3.
  • These heat transfer support members 32 and 33 are formed of a metal having a high thermal conductivity such as aluminum, an aluminum alloy, or copper.
  • the heat transfer support member 32 is fixed by a fixing screw 32b on the heat transfer support plate portion 32a on the flat plate and the right end side of the heat transfer support plate portion 32a along the long side of the semiconductor power module 11 as seen in FIG. It is comprised with the heat-transfer support side board part 32c.
  • the heat transfer support side plate portion 32 c is connected to a square frame-shaped common bottom plate portion 34 disposed in the circumferential groove 3 d of the cooling body 3.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a plate-shaped heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As the heat transfer member 35, a member having improved heat transfer property by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support side plate portion 32 c is integrally connected to the outer peripheral edge on the long side of the common bottom plate portion 34 arranged in the circumferential groove 3 d of the cooling body 3 and extends upward.
  • the connecting plate portion 32d and the upper plate portion 32e extending leftward from the upper end of the connecting plate portion 32d are formed in an inverted L-shaped cross section.
  • the connecting plate portion 32 d extends upward through the right side surface on the long side of the semiconductor power module 11.
  • the heat transfer support member 33 is fixed by a fixing screw 33b on the heat transfer support plate portion 33a on the flat plate and the left end side of the heat transfer support plate portion 33a along the long side of the semiconductor power module 11 as seen in FIG. It is comprised with the heat-transfer support side board part 33c.
  • the heat transfer support side plate portion 33 c is connected to the common bottom plate portion 34.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • the heat transfer support side plate portion 33 c is integrally connected to the outer peripheral edge on the long side of the common bottom plate portion 34 disposed in the circumferential groove 3 d of the cooling body 3.
  • the connecting plate portion 33d extending upward and the upper plate portion 33e extending leftward from the upper end of the connecting plate portion 33d are formed in an inverted L-shaped cross section.
  • the connecting plate portion 33 d extends upward through the left side surface on the long side of the semiconductor power module 11.
  • connection part with the bottom board part 34 and the upper board part 33e of the connection board part 33d is formed in the cylindrical curved surface.
  • the connecting portion between the connecting plate portion 33d and the bottom plate portion 34 and the upper plate portion 33e is formed into a cylindrical curved surface, so that the connecting portion between the connecting plate portion 33d and the bottom plate portion 34 and the upper plate portion 33e is perpendicular.
  • the heat conduction path can be shortened as compared with the L-shape. For this reason, the heat conduction path from the heat transfer support plate portion 33a to the cooling body 3 is shortened, and efficient heat cooling becomes possible.
  • a heat generating circuit component 39a is mounted on the lower surface side as shown in FIGS. Then, the control circuit board 22 and the power supply circuit board 23 are connected to the heat transfer members 35 and 37 and the heat transfer support plate portions 32a and 33a as shown in FIG.
  • the connection between the control circuit board 22 and the power circuit board 23 and the heat transfer support plate portions 32a and 33a is substantially the same except that the left and right are reversed.
  • the plate portion 33a will be described as a representative.
  • the power supply circuit board 23 and the heat transfer support plate portion 33 a are connected to each other by an interval adjusting member having a heat transfer plate portion management height H lower than the thickness T of the heat transfer member 37.
  • a spacer 40 is used.
  • the spacer 40 is temporarily fixed by bonding or the like to the outer peripheral side of the female screw portion 41 into which the fixing screw 38 formed on the heat transfer support plate portion 33a is screwed.
  • the heat transfer plate portion management height H of the spacer 40 is set so that the compression rate of the heat transfer member 37 is about 5 to 30%.
  • the thermal resistance is reduced and an efficient heat transfer effect can be exhibited.
  • the heat transfer member 37 is formed with an insertion hole 37 a through which the joint screw 25 can be inserted and an insertion hole 37 b through which the spacer 40 can be inserted.
  • the heat transfer member 37 is placed on the heat transfer support plate 33a so that the spacer 40 temporarily fixed to the heat transfer support plate 33a is inserted into the insertion hole 37b.
  • the power supply circuit board 23 is placed thereon so that the heat generating circuit component 39 a is in contact with the heat transfer member 37.
  • the fixing screw 38 is screwed into the female screw portion 41 of the heat transfer support plate portion 33a through the insertion hole 23b of the power circuit board 23 and the central opening of the spacer 40. Then, the fixing screw 38 is tightened until the upper surface of the heat transfer member 37 substantially coincides with the upper surface of the spacer 40. For this reason, the heat transfer member 37 is compressed at a compression rate of about 5 to 30%, and the heat resistance is reduced and an efficient heat transfer effect can be exhibited. At this time, since the compression rate of the heat transfer member 37 is managed by the height H of the spacer 40, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
  • the heat generating circuit component 39 a mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39a and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37, the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
  • the surface mount connection type circuit component 39b is mounted on the power circuit board 23 on the upper surface side opposite to the heat transfer member 37, it is formed on the power supply circuit board 23 like a lead connection type circuit component. There is no solder connection lead protruding to the lower surface side through the through hole. For this reason, the solder connection lead is pierced into the heat transfer member 37 and a hole is opened, and the hole is enlarged due to the influence of vibration or the like, so that the space is formed in the layer of the heat transfer member 37 and the insulation performance is not deteriorated. .
  • connection through the heat transfer member 35 between the control circuit board 22 and the heat transfer support plate portion 32a is performed in the same manner as described above. Further, as shown in FIGS. 2 and 3, the common bottom plate portion 34 of the heat transfer support members 32 and 33 is inserted through the fixing member at a position facing the insertion hole 15 through which the fixing screw 14 of the semiconductor power module 11 is inserted. A hole 34a is formed. Further, an elastic member 45 is interposed between the upper surface of the bottom plate portion 34 and the lower surface of the cooling member 13 formed in the semiconductor power module 11.
  • the fixing screw 14 is inserted into the insertion hole 15 of the semiconductor power module 11 and the cooling member 13 and the fixing member insertion hole 34 a of the bottom plate portion 34, and the fixing screw 14 is screwed into the female screw portion 3 f formed in the cooling body 3. By doing so, the semiconductor power module 11 and the bottom plate portion 34 are fixed to the cooling body 3.
  • the power supply circuit board 23 is superposed on the heat transfer support plate portion 33a of the heat transfer support member 33 via the heat transfer member 37, and the heat transfer member 37 is placed on the heat transfer member 37 by the fixing screw 38.
  • the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate 33a are fixed in a state compressed at a compression rate of about% to form the power supply circuit unit U3.
  • the surface mount connection type circuit component 39b is mounted on the upper surface side of the power circuit board 23, there is no solder connection lead protruding on the lower surface side of the power circuit board 23.
  • control circuit board 22 is superposed on the heat transfer support plate portion 32a of the heat transfer support member 32 via the heat transfer member 35, and the heat transfer member 35 is compressed by a fixing screw 36 at a compression ratio of about 5 to 30%.
  • the control circuit board 22, the heat transfer member 35, and the heat transfer support plate 32a are fixed to form the control circuit unit U2.
  • the surface mount connection type circuit component 27b is mounted on the upper surface side of the control circuit board 22, there is no solder connection lead protruding on the lower surface side of the control circuit board 22.
  • the semiconductor power module 11 is fixed with the fixing screw 14.
  • the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above. And the heat-transfer support plate part 32a is connected with the heat-transfer support side plate part 32c with the fixing screw 32b.
  • control circuit board 22 of the control circuit unit U 2 is placed on the upper surface of the joint screw 24 and fixed by the four joint screws 25.
  • power supply circuit board 23 of the power supply circuit unit U 3 is placed on the upper surface of the joint screw 25 and fixed by the four fixing screws 26.
  • heat-transfer support plate part 33a is connected with the heat-transfer support side plate part 33c by the fixing screw 33b.
  • a bus bar 50 is connected to the positive and negative DC input terminals of the semiconductor power module 11 to 11 a, and the positive and negative connection terminals of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 50.
  • 4a is connected with a fixing screw 51.
  • a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the DC input terminal 11 a of the semiconductor power module 11.
  • a bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 fixed to the tip of a motor cable 58 connected to an external three-phase electric motor (not shown) is connected to the other end of the bus bar 55 with a fixing screw 60.
  • the lower housing 2A and the upper housing 2B are fixed to the lower surface and the upper surface of the cooling body 3 via a sealing material, and the assembly of the power conversion device 1 is completed.
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the semiconductor power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the semiconductor power module 11 generates heat.
  • the generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the central portion 3 c of the cooling body 3.
  • the control circuit and the power circuit mounted on the control circuit board 22 and the power circuit board 23 include heat generating circuit components 27a and 39a, and the heat generating circuit components 27a and 39a generate heat.
  • the heat generating circuit components 27 a and 39 a are mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33 are provided on the lower surface sides of the control circuit board 22 and the power supply circuit board 23 through heat transfer members 35 and 37 having high thermal conductivity and elasticity. Is provided. For this reason, the contact area between the heat generating circuit components 27a and 39a and the heat transfer members 35 and 37 increases, and the heat resistance between the heat generating circuit components 27a and 39a and the heat transfer members 35 and 37 decreases. Therefore, the heat generated by the heat generating circuit components 27a and 39a is efficiently transferred to the heat transfer members 35 and 37.
  • the heat transfer members 35 and 37 themselves are compressed at a compression rate of about 5 to 30% to increase the thermal conductivity, the heat transfer members 35 and 37 are transferred to the heat transfer members 35 and 37 as shown in FIG. Heat is efficiently transmitted to the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33.
  • the heat transfer support side plate portions 32c and 33c are connected to the heat transfer support plate portions 32a and 33a, the heat transferred to the heat transfer support plate portions 32a and 33a is transferred to the heat transfer support side plate portions 32c and 33a. It is transmitted to the common bottom plate part 34 through 33c. Since the bottom plate portion 34 is in direct contact with the circumferential groove 3 d of the cooling body 3, the transmitted heat is radiated to the cooling body 3. Further, the heat transmitted to the bottom plate portion 34 is transmitted from the upper surface side to the cooling member 13 of the semiconductor power module 11 via the elastic member 45, and is transmitted to the central portion 3 c of the cooling body 3 via this cooling member 13. Is dissipated.
  • the heat generation of the heat generating circuit components 27a and 39a mounted on the control circuit board 22 and the power supply circuit board 23 directly occurs without passing through the control circuit board 22 and the power supply circuit board 23 having a large thermal resistance. Since heat is transferred to the heat transfer members 35 and 37, efficient heat dissipation can be performed. The heat transferred to the heat transfer members 35 and 37 is transferred to the heat transfer support plate portions 32a and 33a, and further transferred to the heat transfer support side plate portions 32c and 33c. At this time, the heat transfer support side plate portions 32 c and 33 c are provided along the long side of the semiconductor power module 11.
  • the bent portions of the heat transfer support side plate portions 32c and 33c are cylindrical curved portions, the heat transfer distance to the cooling body 3 is shortened as compared with the case where the bent portions are L-shaped. Can do. Further, since the heat transfer support side plate portions 32c and 33c of the heat transfer support members 32 and 33 are integrated by the common bottom plate portion 34, the components are arranged between the heat transfer support side plate portions 32c and 33c and the bottom plate portion 34. The heat resistance can be suppressed.
  • the housing 2 is not included in the heat dissipation path from the control circuit board 22 and the power circuit board 23 on which the heat generating circuit components 27a and 39a are mounted to the cooling body 3, the housing 2 is made of high conductivity aluminum or the like. It is not necessary to use the above metal and can be made of a synthetic resin material, so that the weight can be reduced. Furthermore, since the heat dissipation path can be formed by the power conversion device 1 alone without the heat dissipation path being dependent on the housing 2, the semiconductor power module 11, the drive circuit board 21, the control circuit board 22, and the power supply circuit board 23. Can be applied to the housing 2 and the cooling body 3 in various different forms.
  • the metal heat transfer support plate portions 32a and 33a are fixed to the control circuit board 22 and the power circuit board 23, the rigidity of the control circuit board 22 and the power circuit board 23 can be increased. For this reason, even when the power converter 1 is applied as a motor drive circuit that drives a motor for driving a vehicle, even when the vertical vibration or roll shown in FIG.
  • the members 32 and 33 can increase the rigidity. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.
  • the surface mount connection type circuit components 27b and 39b are mounted on the control circuit board 22 and the power supply circuit board 23 on the upper surface side opposite to the heat transfer members 35 and 37.
  • 27b and 39b there are no conductive elongated protrusions such as solder connection leads protruding to the heat transfer members 35 and 37 on the lower surface side, so that the metal fillers of the heat transfer members 35 and 37 are conducted and insulation performance is maintained. Can be reliably prevented from decreasing.
  • the surface mount connection type circuit components 27b and 39b are mounted on the opposite side of the control circuit board 22 and the power supply circuit board 23 on which the heat generating circuit components 27a and 39a are mounted from the heat transfer members 35 and 37.
  • the present invention is not limited to the above-described configuration.
  • the lead connection type circuit component 46 is provided on the opposite side of the control circuit board 22 and the power supply circuit board 23 from the heat transfer members 35 and 37. You may make it mount.
  • the electrically insulating member 47 is interposed between the heat transfer members 35 and 37 and the heat transfer support plate portions 32a and 33a facing the protruding region of the solder connection lead 46a formed to protrude from the lead connection type circuit component 46. Place.
  • the electrical insulating member 47 is preferably formed in a region wider than the width of the protruding region of the solder connection lead 46a.
  • solder connection lead 46 a of the lead connection type circuit component 46 mounted on the upper surface opposite to the heat transfer members 35 and 37 on the control circuit board 22 and the power supply circuit board 23 is the control circuit board 22. And it protrudes to the lower surface side through a through hole formed in the power supply circuit board 23.
  • the solder connection leads 46a are soldered and fixed on the lower surface sides of the control circuit board 22 and the power circuit board 23.
  • solder connection leads 46a are shown in FIG. 10 when the control circuit board 22, the power supply circuit board 23, and the heat transfer support plate portions 32a and 33a are compressed by the fixing screws 36 and 38 as described in the above embodiment.
  • the heat transfer members 35 and 37 are pierced so that holes are formed in the heat transfer members 35 and 37, and the holes are enlarged due to the influence of vibration or the like so that a space is formed in the layers of the heat transfer members 35 and 37 and insulated. Performance decreases.
  • the electrical insulating member 47 is disposed between the heat transfer members 35 and 37 and the heat transfer support plate portions 32a and 33a corresponding to the protruding regions of the solder connection leads 46a. Therefore, the electrical insulation member 47 can compensate for the decrease in insulation resistance of the heat transfer members 35 and 37 caused by the solder connection leads 46a, and the control circuit board 22, the power supply circuit board 23, the heat transfer support plate portion 32a, The required insulation performance can be ensured between 33a.
  • the present invention is not limited to the above configuration, and the heat transfer members 35 and 37 may be provided only at locations where the heat generating circuit components 27a and 39a exist as shown in FIG.
  • the cooling member 13 of the semiconductor power module 11 contacted the cooling body 3
  • it is not limited to this, As shown in FIG. 11, it can also comprise. That is, the cooling member 13 formed in the semiconductor power module 11 is provided with a cooling fin 61 that directly contacts the cooling water flowing through the cooling body 3, and the cooling fin 61 is provided at the center of the cooling body 3 accordingly. Is formed in the cooling water passage.
  • a sealing member 66 such as an O-ring is disposed between the peripheral wall 63 surrounding the immersion part 62 and the cooling member 13.
  • the cooling fins 61 are formed on the cooling member 13 of the semiconductor power module 11, and the cooling fins 61 are immersed in the cooling water in the cooling water at the immersion part 62, so that the semiconductor power module 11 is more efficiently used. Can be cooled.
  • the case where the heat-transfer support plate part 32a and 33a of the heat-transfer support members 32 and 33 and the heat-transfer support side plate part 32c and 33c were comprised separately was demonstrated.
  • the present invention is not limited to the above configuration, and the heat transfer support plate portions 32a and 33a and the heat transfer support side plate portions 32c and 33c may be configured integrally.
  • the heat resistance is reduced and more efficient heat dissipation is performed. Can do.
  • the power converter device by this invention was applied to an electric vehicle
  • it is not limited to this, It can apply this invention also to the rail vehicle which drive
  • the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • a power conversion device that can efficiently dissipate heat of a heat generating circuit component mounted on a substrate to a cooling body and ensure insulation performance of a heat transfer member.

Abstract

La présente invention a trait à un convertisseur de puissance qui est en mesure de dissiper de façon efficace la chaleur vers un corps de refroidissement en isolant du châssis une trajectoire de dissipation de la chaleur destinée à la chaleur provenant d'un composant de circuit produisant de la chaleur qui est monté sur un substrat, et de garantir une performance d'isolation d'un élément de transfert de chaleur. Le convertisseur de puissance est équipé d'un bloc de puissance à semi-conducteur (11) qui est joint sur une surface d'un corps de refroidissement (3), d'un substrat de montage (23) sur lequel est monté un composant de circuit qui comprend un composant de circuit produisant de la chaleur en vue d'entraîner le bloc de puissance à semi-conducteur, d'un élément de support de transfert de chaleur (33a) permettant de supporter le substrat de montage par l'intermédiaire d'un élément de transfert de chaleur (37), et d'une trajectoire de transmission de la chaleur (33c) permettant de transférer la chaleur depuis le substrat de montage jusqu'au corps de refroidissement par l'intermédiaire de l'élément de support de transfert de chaleur ; et composant de circuit est monté sur le substrat de montage en tant que composant de circuit de type connexion monté en surface (39).
PCT/JP2012/007307 2011-12-05 2012-11-14 Convertisseur de puissance WO2013084416A1 (fr)

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JP2011-266234 2011-12-05

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US10074841B2 (en) 2013-05-15 2018-09-11 Kureha Corporation Structure for non-aqueous electrolyte secondary battery, non-aqueous electrolyte secondary battery, and method for manufacturing same structure
WO2022209953A1 (fr) * 2021-03-30 2022-10-06 ダイキン工業株式会社 Composant électrique et dispositif de réfrigération
JP7183373B1 (ja) 2021-11-15 2022-12-05 三菱電機株式会社 電力変換装置

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JP2023072804A (ja) * 2021-11-15 2023-05-25 三菱電機株式会社 電力変換装置

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