WO2014024361A1 - Structure de refroidissement et dispositif de conversion de puissance - Google Patents

Structure de refroidissement et dispositif de conversion de puissance Download PDF

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Publication number
WO2014024361A1
WO2014024361A1 PCT/JP2013/003048 JP2013003048W WO2014024361A1 WO 2014024361 A1 WO2014024361 A1 WO 2014024361A1 JP 2013003048 W JP2013003048 W JP 2013003048W WO 2014024361 A1 WO2014024361 A1 WO 2014024361A1
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WO
WIPO (PCT)
Prior art keywords
ring
heat
cooling body
heat transfer
circumferential groove
Prior art date
Application number
PCT/JP2013/003048
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English (en)
Japanese (ja)
Inventor
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201380024913.0A priority Critical patent/CN104303295A/zh
Priority to JP2014529253A priority patent/JPWO2014024361A1/ja
Publication of WO2014024361A1 publication Critical patent/WO2014024361A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device that supports a mounted substrate.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a water cooling jacket through which a coolant passes is arranged in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is arranged on the water cooling jacket for cooling.
  • a control circuit board is disposed in the housing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board is supported through the heat dissipation member. The heat transmitted to the metal base plate and further transferred to the metal base plate is transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
  • the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and can provide a cooling structure, a heat radiating member, and cooling that can ensure a liquid-tight seal between the first heating element and the cooling body. It aims at providing the power converter device which can ensure the liquid-tight sealing between bodies.
  • a cooling structure includes a first heating element, a cooling body joined to the first heating element, a second heating element, and the first heating element.
  • a heat transfer plate for transferring the heat of the two heating elements to the cooling body, and the first heating element has a liquid contact portion formed so as to protrude to the side joined to the cooling body,
  • the cooling body is formed so as to open on the side to be joined to the first heating element, and is formed so as to surround the immersion part in which the liquid contact part is immersed in the flowing coolant and the opening of the immersion part.
  • the cross-sectional diameter of the O-ring is such that the O-ring is elastically deformed and the first heating element is in close contact with the O-ring, and the O-ring is elastically deformed. It was greater than the distance between the joint surface of the circumferential groove in close contact with.
  • the O-ring is in close contact with the joint surface between the first heating element and the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing.
  • a power conversion device includes a semiconductor power module in which a heat dissipation member is formed on one surface, a cooling body joined to the heat dissipation member, and a heat generating circuit component that drives the semiconductor power module.
  • a heat transfer plate that transfers heat of the mounting board on which the circuit component is mounted to the cooling body, and the heat dissipation member has a liquid contact portion that protrudes toward the side to be joined to the cooling body.
  • the cooling body is formed so as to open on the side to be joined to the heat radiating member, and is formed so as to surround the immersion part in which the liquid contact part is immersed in the flowing coolant and the opening of the immersion part.
  • the O-ring has a larger value than the distance between the joint surface of the circumferential groove in close contact while being elastically deformed. According to the power conversion device according to this aspect, the O-ring is in close contact with the joining surface of the heat radiating member and the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member is bonded to the heat dissipation member. And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board.
  • the cooling body is formed to open on the side to be joined to the heat radiating member, and is formed on the outer side of the immersion part, an immersion part for immersing the liquid contact part in the flowing coolant.
  • a circumferential groove on which an O-ring is mounted, and the heat dissipation member and the cooling body are joined to each other by sandwiching the metal plate for heat transfer support at a joint surface outside the circumferential groove.
  • the cross-sectional diameter was set to a value larger than the value obtained by adding the thickness of the heat transfer supporting metal plate and the depth of the circumferential groove.
  • the cross-sectional diameter of the O-ring is for heat transfer support. Since the value is larger than the sum of the thickness of the metal plate and the depth of the circumferential groove, the O-ring is in close contact with the heat sink and the joint surface of the cooling body while being elastically deformed with an optimal crushing amount, and is liquid-tightly sealed. I do.
  • an O-ring holding protrusion that holds the O-ring is formed at an edge of the opening of the circumferential groove, and the O-ring holding protrusion is When the O-ring is brought into close contact with the joint surface of the heat dissipation member while being elastically deformed, a gap is provided between the O-ring and the joint surface.
  • the O-ring holding protrusion formed at the edge of the opening of the circumferential groove functions as a guide member for the O-ring that is crushed by the joining surface of the heat dissipation member and the cooling body.
  • the O-ring holding protrusion is formed on at least an outer peripheral edge of the opening of the peripheral groove. According to the cooling structure according to this aspect, since the cooling water sealing O-ring is disposed at a position close to the outer peripheral side of the circumferential groove, the O-ring holding protrusion is not provided with the cooling water sealing O-ring. Make sure to guide when crushing.
  • the height from the bottom of the circumferential groove to the top of the O-ring holding protrusion is set to a value larger than the radius of the O-ring. According to the cooling structure according to this aspect, it is difficult for the O-ring mounted in the circumferential groove to come out, and the circumferential groove installation state of the ring during assembly can be made favorable.
  • the height from the bottom of the circumferential groove to the joint surface of the heat dissipation member when the O-ring is in close contact with the joint surface of the heat dissipation member. Is set to the height when the O-ring is crushed with an allowable crushing rate.
  • the compression set and cracking of the O-ring 7 can be prevented by using the O-ring that is crushed at an allowable crushing rate.
  • the O-ring is in close contact with the joint surface of the first heating element and the cooling body while elastically deforming with an optimal crushing amount and performing liquid-tight sealing, thereby ensuring reliability.
  • High cooling structure can be obtained.
  • the O-ring is in close contact with the heat dissipation member and the joint surface of the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing, so that reliability is ensured.
  • a high power conversion device can be provided.
  • FIG. 1 is a cross-sectional view showing the overall configuration of the present invention
  • FIG. 2 is an enlarged view of the main part of FIG.
  • Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • an immersion part 5 that opens in a square shape communicating with the water supply port 3 a and the drainage port 3 b is formed at the center of the upper surface of the cooling body 3.
  • a square frame-shaped circumferential groove 6 is formed, and an O-ring 7 is attached to the circumferential groove 6.
  • An O-ring holding projection 8 is formed on the periphery of the opening of the circumferential groove 6 so as to protrude upward from the other flat upper surface (reference numeral 3 c in FIG. 2) of the cooling body 3.
  • the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 ⁇ / b> A are inserted vertically.
  • the power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion.
  • the power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13.
  • the liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a. Many cooling fins 17a are immersed in water.
  • the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from above.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13.
  • the support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions.
  • the connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions.
  • a heat generating circuit component 39 is mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are laminated by a fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency.
  • the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
  • a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG.
  • three rectangular insertion holes 33i are formed.
  • a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13 and the fixing member insertion holes 32 c 1 and 33 c 1 of the cooling body contact plate portions 32 c and 33 c, and the fixing screw 14 is formed in the cooling body 3. Screwed into the female thread portion.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are brought into contact with the lower surface 13a of the heat radiating member 13 of the power module 11 and the upper surface 3c of the cooling body 3, thereby It is clamped by the body 3 and fixed.
  • a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11. Further, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated. Since the member has a low resistance, as shown in FIG. 5, the heat transferred to the heat transfer supporting metal plates 32 and 33 is cooled from the cooling body contact plate portions 32c and 33c that are in direct contact with the upper surface 3c of the cooling body 3. The heat is dissipated by 3 and efficient heat dissipation can be performed.
  • FIG. 6 shows the O-ring 7 in a free state, and the cross-sectional diameter is D.
  • FIG. 7 shows the liquid-tight sealing structure of the first embodiment.
  • the cross-sectional diameter D of the O-ring 7 of this embodiment is larger than the distance F1 between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6 to which the O-ring 7 attached to the circumferential groove 6 comes into close contact while being elastically deformed. Is set to a value.
  • the cross-sectional diameter D of the O-ring 7 is set such that the distance F1 between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6 with which the O-ring 7 attached to the circumferential groove 6 comes into close contact while being elastically deformed.
  • the liquid-tight sealing structure of the cooling liquid according to the present embodiment can ensure the reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1. Can be provided.
  • FIG. 8 shows a liquid-tight sealing structure of the second embodiment.
  • an inexpensive sheet metal member is used for the heat transfer supporting metal plates 32 and 33 of the power converter 1 described above for the purpose of low cost, and the heat transfer supporting metal plates 32 and 32 made of such a sheet metal member are used.
  • No. 33 has a variation of about ⁇ 10% in the plate thickness. If an O-ring having a predetermined cross-sectional diameter is selected without considering variations in the thickness of the cooling body contact plate portions 32c and 33c of the heat transfer support metal plates 32 and 33, the plate thickness of the heat transfer support metal plates 32 and 33 is selected.
  • the cross-sectional diameter D (see FIG. 6) of the O-ring 7 of the present embodiment includes the plate thickness T of the heat transfer support metal plate 33 that causes a variation of about ⁇ 10% and the depth L of the circumferential groove 6. It is set to a value larger than the added value. Further, the depth L of the circumferential groove 6 is set to a value larger than the radius R of the O-ring 7 (see FIG. 6). Further, an O-ring protrusion 8a is formed on the inner peripheral side of the opening of the circumferential groove 6 and an O-ring protrusion 8b is projected on the outer peripheral side of the opening of the circumferential groove 6 (height from the upper surface 3c of the cooling body 3).
  • the protrusion amount M of the O-ring protrusions 8a and 8b is elastically deformed while the O-ring 7 is in close contact between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6. Sometimes it projects to the extent that a gap is provided between the lower surface 13a.
  • the heat transfer support metal plate 33 has been described with reference to FIG. 8, the heat transfer support metal plate 32 has the same structure.
  • the cross-sectional diameter D of the O-ring 7 is a value obtained by adding the plate thickness T of the heat transfer supporting metal plates 32 and 33 that cause a variation of about ⁇ 10% and the depth L of the circumferential groove 6. Since the larger value is set, even if the thickness T of the heat transfer supporting metal plates 32 and 33 varies in the minus direction, the O-ring 7 is not excessively crushed by the bottom surface 6a and the bottom surface 13a, and is liquid-tightly sealed. In addition, even if the thickness T of the heat transfer supporting metal plates 32 and 33 varies in the plus direction, the O-ring 7 can be liquid-tightly sealed with an optimal crushing amount. Therefore, the liquid-tight sealing structure of the cooling liquid of the present embodiment can also ensure a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1 can be obtained. Can be provided.
  • the depth L of the circumferential groove 6 is set to a value larger than the radius R of the O-ring 7, it becomes difficult for the O-ring 7 mounted in the circumferential groove 6 to go out.
  • the ring 7 of the circumferential groove 6 can be installed well.
  • the O-ring 7 of the present embodiment for sealing the cooling water is disposed at a position close to the outer peripheral side of the circumferential groove 6, but the O-ring protrusion 8 b is at least on the outer peripheral side of the opening of the circumferential groove 6.
  • This O-ring protrusion 8b is formed so as to make the O-ring 7 installed in the circumferential groove 6 in the middle of assembling good, and when the O-ring 7 is crushed, it can be used as a crushing guide. Function.
  • FIG. 9 shows a liquid-tight sealing structure of the coolant according to the third embodiment.
  • the recommended value of the allowable crushing rate of the O-ring 7 ((cross-sectional diameter in the free state ⁇ cross-sectional diameter in the assembled state) / cross-sectional diameter in the free state) is generally 8% or more and 30% or less. Therefore, in the O-ring 7 of the present embodiment, the distance F2 between the lower surface 13a of the heat radiating member 13 that the O-ring 7 attached to the circumferential groove 6 contacts and the bottom surface 6a of the circumferential groove 6 has an allowable crushing rate (8%). More than 30%) is selected as the dimensions when squeezed.
  • the liquid-tight sealing structure of the cooling liquid of the present embodiment can also ensure a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1 can be obtained. Can be provided.
  • corresponds to the heat radiating member 13
  • corresponds to the control circuit board 22 and the power supply circuit board 23, and the heat exchanger plate of this invention supports heat transfer.
  • the heat transfer plate sandwiched between the joining surfaces of the first heating element and the cooling body of the present invention is the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33. It corresponds to.
  • the control circuit unit U2 and the power supply circuit unit U3 shown in FIGS. 1 and 2 the case where the heat transfer members 35 and 37 have the same outer shape as the control circuit board 22 and the power supply circuit board 23 has been described.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists.
  • the heating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back side by the control circuit board 22 and the power circuit board 23 has been described.
  • the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
  • the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive
  • the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the cooling structure according to the present invention is useful for securing a liquid-tight seal between the first heating element and the cooling body
  • the power conversion device according to the present invention includes the heat dissipation member and the cooling member. Useful for ensuring a fluid tight seal with the body.
  • SYMBOLS 1 Power converter device, 2 ... Housing
  • Case body 13 ... Radiation member, 14 ... Fixing screw, 15 ... Insertion hole, 16 ... Substrate fixing
  • Cooling body contact plate, 32c1, 33c1 Fixed member insertion hole, 32i ... Insertion hole 33a ... Heat transfer support plate portion, 33b ... Heat transfer support side plate portion, 33c ... Cooling body contact plate portion, 33i ... Insertion hole, 35 ... Heat transfer member, 37 ... Heat transfer member, 39 ... Heat generation circuit component, 42 ... Insulating sheet, 43 ... Insulating sheet, 51 ... Fixing screw, 52 ... Connection cord, 53, 59 ... Crimp terminal, 55 ... Bus bar, 57 ... Current sensor, 58 ... Motor connection cable, 60 ... Fixing screw

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dc-Dc Converters (AREA)

Abstract

La présente invention concerne un dispositif de conversion de puissance comportant : un module (11) de puissance à semiconducteur dans lequel un élément (13) de dissipation thermique est formé sur une surface d'un corps de coffret ; un corps (3) de refroidissement qui est joint à l'élément de dissipation thermique ; des cartes (22, 23) de montage qui comprennent des composants de circuits générant de la chaleur ; et des plaques porteuses métalliques (32, 33) transmettant la chaleur destinées à soutenir les cartes de montage à des écartements prescrits par rapport au module de puissance à semiconducteur. L'élément de dissipation thermique est doté d'une section saillante (17) de contact pour liquide qui est formé du côté joint au corps de refroidissement, et ledit corps de refroidissement est doté d'une section (5) d'immersion destinée à immerger la section de contact pour liquide dans un agent de refroidissement et d'une rainure circonférentielle (6) qui est formé du côté extérieur de la section d'immersion et dans laquelle est monté un joint torique. L'élément de dissipation thermique et le corps de refroidissement prennent en sandwich les plaques porteuses métalliques transmettant la chaleur, les surfaces de jonction étant situées du côté extérieur de la rainure circonférentielle. Le diamètre en section droite du joint torique est fixé à une valeur supérieure à la valeur combinée de l'épaisseur des plaques porteuses métalliques transmettant la chaleur et de la profondeur de la rainure circonférentielle.
PCT/JP2013/003048 2012-08-08 2013-05-13 Structure de refroidissement et dispositif de conversion de puissance WO2014024361A1 (fr)

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CN201380024913.0A CN104303295A (zh) 2012-08-08 2013-05-13 冷却构造体和电力转换装置
JP2014529253A JPWO2014024361A1 (ja) 2012-08-08 2013-05-13 冷却構造体及び電力変換装置

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JP2012175827 2012-08-08
JP2012-175827 2012-08-08

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JP6143980B1 (ja) * 2016-03-02 2017-06-07 三菱電機株式会社 電力変換装置
WO2019031172A1 (fr) * 2017-08-09 2019-02-14 株式会社デンソー Dispositif de conversion de puissance électrique
CN113225992A (zh) * 2021-05-06 2021-08-06 蚌埠市科达电器有限公司 一种具有导流散热结构的色线膜检测器

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JP2009004666A (ja) * 2007-06-25 2009-01-08 Hitachi Ltd パワー半導体モジュールおよびその製造方法

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Publication number Priority date Publication date Assignee Title
JP6143980B1 (ja) * 2016-03-02 2017-06-07 三菱電機株式会社 電力変換装置
WO2019031172A1 (fr) * 2017-08-09 2019-02-14 株式会社デンソー Dispositif de conversion de puissance électrique
JP2019033624A (ja) * 2017-08-09 2019-02-28 株式会社デンソー 電力変換装置
JP2021065089A (ja) * 2017-08-09 2021-04-22 株式会社デンソー 電力変換装置
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CN113225992A (zh) * 2021-05-06 2021-08-06 蚌埠市科达电器有限公司 一种具有导流散热结构的色线膜检测器
CN113225992B (zh) * 2021-05-06 2023-09-12 蚌埠市科达电器有限公司 一种具有导流散热结构的色线膜检测器

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