WO2013080440A1 - Dispositif de conversion de puissance - Google Patents

Dispositif de conversion de puissance Download PDF

Info

Publication number
WO2013080440A1
WO2013080440A1 PCT/JP2012/007066 JP2012007066W WO2013080440A1 WO 2013080440 A1 WO2013080440 A1 WO 2013080440A1 JP 2012007066 W JP2012007066 W JP 2012007066W WO 2013080440 A1 WO2013080440 A1 WO 2013080440A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat transfer
heat
circuit board
transfer support
cooling body
Prior art date
Application number
PCT/JP2012/007066
Other languages
English (en)
Japanese (ja)
Inventor
泰仁 田中
美里 柴田
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201280049621.8A priority Critical patent/CN103858223A/zh
Publication of WO2013080440A1 publication Critical patent/WO2013080440A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a power conversion apparatus for supporting a mounting substrate on which a circuit component including a heat generating circuit component for driving a semiconductor switching element is mounted on a semiconductor power module incorporating a semiconductor switching element for power conversion.
  • the power conversion device described in Patent Document 1 As this type of power conversion device, the power conversion device described in Patent Document 1 is known.
  • a water cooling jacket is disposed in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket for cooling.
  • a control circuit board and a drive circuit board are arranged in the casing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board and the drive circuit board is transferred to the heat dissipation member. The heat is transmitted to the metal base plate supporting the control circuit board and the drive circuit board through the metal base plate, and the heat transmitted to the metal base plate is transmitted to the water cooling jacket through the side wall of the housing supporting the metal base plate. I have to.
  • the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path. In order to solve this unsolved problem, it is also necessary to dissipate the heat generated by the substrate and mounted components by natural convection from the case and case cover, increasing the surface area of the case and case cover. For this reason, the outer shape of the housing and the housing lid is increased, and the power converter is increased in size.
  • the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and can efficiently dissipate the heat of the heat generating circuit components mounted on the substrate to the cooling body, and can be downsized. It aims at providing a simple power converter.
  • a first aspect of a power conversion device includes a semiconductor power module in which one surface is joined to a cooling body and a circuit component including a heat generating circuit component that drives the semiconductor power module. And a heat conduction path for transferring heat from the plurality of mounting boards to the cooling body. Then, at least a pair of mounting substrates facing each other among the plurality of mounting substrates is stacked in a solid state with a heat transfer member interposed therebetween.
  • the second aspect of the power conversion device is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, a cooling body disposed on one surface of the semiconductor power module, And a plurality of mounting boards on which circuit components including a heat generating circuit component for driving the semiconductor switching element supported on the other surface of the semiconductor power module are mounted.
  • a pair of mounting substrates facing each other at least among the plurality of mounting substrates are stacked in a solid state with a heat transfer member and a heat transfer support plate interposed therebetween, and the heat transfer member and the heat transfer member Heat is radiated to the cooling body through the heat transfer support plate and through a plurality of heat conduction paths independent of the casing surrounding the semiconductor power module and the mounting boards.
  • the pair of mounting substrates on which the heat generating circuit components facing each other are stacked in a solid state with the heat transfer member and the heat transfer support plate interposed, an air layer is formed between the pair of mounting substrates. Therefore, the heat generated by the heat generating circuit component can be efficiently radiated to the cooling body through the heat transfer member and the heat transfer support plate, and further through the heat conduction path.
  • the plurality of heat conduction paths between the mounting board and the cooling body are formed independently of the housing surrounding the module and each mounting board, the housing is considered without considering the heat conductivity of the housing. A body can be formed and the degree of freedom in design can be improved.
  • the 3rd aspect of the power converter device which concerns on this invention has arrange
  • the 5th aspect of the power converter device which concerns on this invention is provided with the space
  • the compression rate of the elastic body can be determined by the interval adjusting member, and the compression rate of the elastic body can be easily adjusted to a constant value.
  • the said heat-transfer member is comprised with the insulator which has thermal conductivity. According to this configuration, since the heat transfer member is formed of an insulator, it is possible to set the interval between the mounting boards facing each other to be narrow, and to reduce the size of the power conversion device.
  • the 7th aspect of the power converter device which concerns on this invention is comprised with the elastic body in which the said heat-transfer member has heat conductivity and has a stretching property.
  • the heat transfer member since the heat transfer member has elasticity, the heat transfer member can be brought into contact with the periphery of a heat-generating component or the like mounted on the mounting substrate, the contact area can be increased, and the heat dissipation effect can be improved.
  • these heat conduction paths are comprised with the heat-transfer support side plate which connects the said heat-transfer support plate and the said cooling body.
  • the heat transfer support side plate is connected between the heat transfer support plate and the cooling body disposed between the pair of mounting boards, so that the thermal resistance is reduced by increasing the cross-sectional area of the heat conduction path. And heat dissipation to the cooling body can be performed more efficiently.
  • the heat transfer support plate and the heat transfer support side plate are made of a metal material having high thermal conductivity. According to this configuration, since the mounting substrate is made of aluminum, aluminum alloy, copper, or the like having high thermal conductivity, heat dissipation to the cooling body can be performed more efficiently.
  • a pair of mounting substrates facing each other on which circuit components including a heat generating circuit component are mounted are stacked in a solid state with at least a heat transfer member interposed therebetween, so The heat generated by the heat generating circuit components can be efficiently radiated to the cooling body without forming an air layer that becomes a heat reservoir.
  • the pair of mounting substrates is integrated at least through the heat transfer member, the rigidity against vertical vibration and roll can be increased.
  • a case that surrounds both the semiconductor power module and the mounting substrate in which the heat generation of the heat generating circuit components mounted on the pair of mounting substrates is conducted via the heat transfer member and the heat transfer support member, and the semiconductor switching element is incorporated in the case body.
  • the cooling body By connecting to the cooling body through an independent heat conduction path, heat generated on the front and back of the mounting board can be efficiently radiated to the cooling body. For this reason, the combined use with the heat dissipation action from the housing and the housing lid can be reduced, and an inexpensive power conversion device that is reduced in size by suppressing the size of the housing and the housing lid can be provided.
  • the casing does not require good heat conductivity, a lightweight material such as a resin can be used for the casing, and the casing can be reduced in weight and an inexpensive power conversion device can be provided.
  • FIG. 2 It is an expanded sectional view similar to FIG. 2 which shows the 2nd Embodiment of this invention. It is an expanded sectional view similar to FIG. 2 which shows the 3rd Embodiment of this invention. It is an expanded sectional view similar to FIG. 2 which shows the 4th Embodiment of this invention. It is sectional drawing which shows the modification of the cooling member of a power module.
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
  • reference numeral 1 denotes a power converter
  • the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • a cooling water supply port 3 a and a drainage port 3 b are opened to the outside of the housing 2, and a cooling water passage 3 c is formed between the water supply port 3 a and the drainage port 3 b.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity (for example, 100 W ⁇ m ⁇ 1 ⁇ K ⁇ 1 or more).
  • the cooling body 3 has a flat bottom surface, and a concave portion 3d having a square shape when viewed from the plane is formed in the center on the top surface.
  • a rectangular protruding base 3e as viewed from above is formed, and a rectangular frame-shaped peripheral groove 3f is formed around the protruding base 3e.
  • the height of the protruding base 3e is lower than the upper surface of the cooling body 3, and is set substantially equal to the thickness of the bottom plates 39 of the heat transfer support side plates 35 and 37 described later.
  • the cooling body 3 is formed with an insertion hole 3g through which the positive and negative electrodes 4a covered with insulation of the film capacitor 4 held by the lower housing 2A are vertically inserted.
  • the power conversion apparatus 1 includes a semiconductor power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion.
  • the semiconductor power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal cooling member 13 is formed on the lower surface of the case body 12.
  • the case body 12 and the cooling member 13 are formed with insertion holes 15 through which the fixing screws 14 as the fixing members are inserted at the four corners when viewed from the plane.
  • the semiconductor power module 11 is mounted on the upper surface of the cooling body 3 by inserting the fixing screw 14 into the insertion holes 15 and screwing the tip of the male screw portion of the fixing screw into the cooling body 3.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted.
  • a control circuit board 22 as a mounting board and a power circuit board 42 as a mounting board on which a power circuit including a heat generating circuit component and the like are mounted are fixed.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 46a of the joint screw 46 into the insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24.
  • the male screw portion 46 a of the joint screw 46 is fixed by being screwed into the female screw portion 24 b of the joint screw 24.
  • the drive circuit board 21 is mounted with a circuit component that does not require cooling by the cooling body 3 and that generates a small amount of heat.
  • circuit components 26 including heat generating circuit components that require cooling by a cooling body are mounted on the front and back surfaces of the control circuit board 22.
  • a heat generating circuit component that requires cooling by the cooling body is mounted on the back surface side, and a circuit component that does not require cooling by the cooling body and that generates a small amount of heat is mounted on the front surface side.
  • the control circuit board 22 has heat transfer members 27 and 28 arranged on the front and back sides. These heat transfer members 27 and 28 are elastic bodies having elasticity, and have the same outer dimensions as the control circuit board 22. As these heat transfer members 27 and 28, for example, a member having improved heat transfer performance while exhibiting insulation performance by interposing a metal filler inside silicon rubber as an elastic body is applied. These heat transfer members 27 and 28 are compressed to about 5 to 30% in the thickness direction, for example, so that the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • plate-like heat transfer support plates 29 and 30 are arranged on the opposite sides of the heat transfer members 27 and 28 from the control circuit board 22.
  • These heat transfer support plates 29 and 30 are formed of a metal material such as aluminum, an aluminum alloy, or copper having high thermal conductivity (for example, 100 W ⁇ m ⁇ 1 ⁇ K ⁇ 1 or more) and rigidity.
  • a heat transfer member 41 having the same configuration as the heat transfer members 27 and 28 is disposed on the upper surface side of the heat transfer support plate 29, and a power supply circuit is provided on the opposite side of the heat transfer support plate 29 from the heat transfer support plate 29.
  • a substrate 42 is disposed.
  • the control circuit board 22 and the heat transfer support plate 30 are fixed by a fixing screw 43 that is screwed into the female screw 30 c formed on the heat transfer support plate 30 from the upper surface side of the control circuit board 22 through the heat transfer member 28. .
  • a spacer 33 through which the fixing screw 43 is inserted is provided in the heat transfer member 28.
  • the spacer 33 is an interval adjusting member having a heat transfer member management height H lower than the thickness T of the heat transfer member 28.
  • the height of the spacer 33 compresses the heat transfer member 28 in the thickness direction by about 5 to 30%. It is set to the height you want. Therefore, when the control circuit board 22 and the heat transfer support plate 30 are fixed with the fixing screw 43, the heat transfer member 28 is accurately compressed and fixed to about 5 to 30% in the thickness direction, and the heat of the heat transfer member 28 is fixed. The resistance is reduced and an efficient heat transfer effect can be exhibited. At this time, since the compression ratio of the heat transfer member 28 is managed by the height H of the spacer 33, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
  • control circuit board 22 is formed at the lower end of the joint screw 46 on the female screw portion 24 b formed on the upper surface of the joint screw 24 with the back surface in contact with the upper surface of the joint screw 24.
  • the male screw portion 46a is screwed and tightened to be fixed to the upper surface of the joint screw 24.
  • the heat transfer member 27 is disposed so that the joint screw 46 is inserted into the insertion hole 27 a formed in the heat transfer member 27, and the heat transfer support plate 29 is disposed on the upper surface side of the heat transfer member 27,
  • the heat transfer member 41 is arranged on the upper surface side of the heat transfer support plate 29 so that the joint screw 46 is inserted into an insertion hole 41 a formed in the heat transfer member 41, and further the power source is connected to the upper surface side of the heat transfer member 41.
  • a circuit board 42 is disposed.
  • the power circuit board 42 and the heat transfer support plate 29 are fixed by a fixing screw 44 that is screwed into the female screw 29c formed on the heat transfer support plate 29 from the upper surface side of the power circuit board 42 through the heat transfer member 41. .
  • a spacer 45 through which the fixing screw 44 is inserted is provided in the heat transfer member 41 as shown in FIG.
  • the spacer 45 is an interval adjusting member having a heat transfer member management height H lower than the thickness T of the heat transfer member 41, and the height of the spacer 45 compresses the heat transfer member 41 by about 5 to 30% in the thickness direction. It is set to the height you want. Therefore, when the power circuit board 42 and the heat transfer support plate 29 are fixed with the fixing screws 44, the heat transfer member 41 is accurately compressed and fixed to about 5 to 30% in the thickness direction, and the heat of the heat transfer member 41 is fixed. The resistance is reduced and an efficient heat transfer effect can be exhibited. At this time, since the compression rate of the heat transfer member 41 is managed by the height H of the spacer 45, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
  • the power supply circuit board 42 is inserted into the upper surface of the joint screw 46 by inserting the fixing screw 47 from the upper surface side and screwing the male screw portion into the female screw portion 46 b formed on the upper surface of the joint screw 46. It is fixed.
  • the compression rate of the heat transfer member 27 interposed between the control circuit board 22 and the heat transfer support plate 29 is defined by the height of the joint screw 46. That is, the space between the heat transfer support plate 29 and the power supply circuit board 42 is fixed so that the spacer 45 is screwed into the female screw portion 29c formed on the heat transfer support plate 29 through the spacer 45 from above the power supply circuit board 42. And a screw 44. Therefore, the height H2 between the upper surface and the lower surface of the joint screw 46 is about 5 to 30% of the height of the spacer 45, the thickness of the heat transfer support plate 29, and the heat transfer member 27, as shown in FIG. It is set to the height obtained by adding the height when compressed.
  • the mounting height position of the control circuit board 22 is defined by screwing the male screw portion 46 a formed on the lower surface of the joint screw 46 with the female screw portion 24 b formed on the upper end of the joint screw 24.
  • the heat transfer member 27 is arranged in the joint screw 46 through the insertion hole 27a formed in the heat transfer member 27, and the heat transfer support plate 29 and the power source integrated with the fixing screw 44 on the upper surface of the heat transfer member 27.
  • a circuit board 42 is disposed.
  • the heat transfer member 27 can be compressed and fixed at a compression rate of about 5 to 30% by fixing the power supply circuit board 42 to the upper surface of the joint screw 46 with the fixing screw 47.
  • control circuit board 22 and the power supply circuit board 42 are laminated in a solid state without an air layer with the heat transfer member 27, the heat transfer support plate 29, and the heat transfer member 41 interposed therebetween.
  • the heat transfer members 27 and 28 are brought into close contact with the circuit components including the heat generating circuit components mounted on the control circuit board 22, and the heat generation of the circuit components is transmitted through the heat transfer members 27 and 28. Heat is dissipated to 29 and 30.
  • the heat transfer support plate 29 has the left end at the same position as the left end of the control circuit board 22 and the heat transfer members 27 and 28, but the right end has the control circuit.
  • a connecting portion 29 a is formed to protrude rightward from the right ends of the substrate 22 and the heat transfer members 27 and 28.
  • a connecting hole 29b is formed through the connecting portion 29a.
  • the heat transfer support plate 30 has the right end portion at the same position as the right end of the control circuit board 22 and the heat transfer members 27 and 28, but the left end portion is controlled.
  • a connecting portion 30a is formed that protrudes to the left from the left ends of the circuit board 22 and the heat transfer members 27 and 28.
  • a connecting hole 30b is formed through the connecting portion 30a.
  • a heat transfer support side plate 35 that forms a heat conduction path independent of the upper housing 2 ⁇ / b> B is fixed and connected to the connecting portion 29 a of the heat transfer support plate 29 with a fixing screw 36.
  • the fixing screw 36 is screwed into a female screw (not shown) formed on the heat transfer support side plate 35 through the connection hole 29b from above the heat transfer support plate 29.
  • a heat transfer support side plate 37 that forms a heat conduction path independent of the upper housing 2 ⁇ / b> B is fixed and connected to the connecting portion 30 a of the heat transfer support plate 30 by a fixing screw 38.
  • the fixing screw 38 is also screwed from above the heat transfer support plate 30 to a female screw (not shown) formed on the heat transfer support side plate 37 through the connection hole 30b.
  • the heat transfer support side plate 35 is formed in an inverted L shape by a vertical plate portion 35a and a connecting plate portion 35b extending leftward from the upper end of the vertical plate portion 35a.
  • the heat transfer support side plate 35 has a curved surface (R chamfer) 35c in which the connecting portion between the vertical plate portion 35a and the connecting plate portion 35b is a part of the cylindrical surface.
  • the heat transfer support side plate 37 is also formed in an inverted L shape by a vertical plate portion 37a and a connecting plate portion 37b extending rightward from the state of the vertical plate portion 37a.
  • the heat transfer support side plate 37 has a curved surface 37c (R chamfer) in which the connecting portion between the vertical plate portion 37a and the connecting plate portion 37b is a part of the cylindrical surface.
  • the heat transfer support side plates 35 and 37 are integrated by connecting the lower end sides of the vertical plate portions 35 a and 37 a with a common bottom plate 39.
  • the bottom plate 39 is formed in a square frame shape in which a square hole 39a is formed in the center portion to insert the protruding base portion 3e of the cooling body 3 and is accommodated in the circumferential groove 3f of the cooling body 3.
  • the curved plates (R chamfers) 35d and 37d in which the lower plates of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 and the bottom plate 39 are connected to each other, are part of the cylindrical surface.
  • the upper and lower ends of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 are formed as cylindrical curved surfaces 35c, 35d and 37c, 37d. For this reason, when vertical vibration or roll is transmitted to the power converter 1, stress concentration generated in the connecting portions of the vertical plate portions 35a and 37a, the connecting plate portions 35b and 37b, and the bottom plate 39 can be reduced. . Therefore, the heat resistance support side plates 35 and 37 can improve the vibration resistance against vertical vibration and roll when the control circuit board 22 is supported.
  • the vertical plate portions 35a and 37a are connected to the bottom plate 39, and the vertical plate portions 35a and 37a and the connection portions of the connection plate portions 35c and 37c are formed as cylindrical curved surfaces.
  • the heat conduction path can be shortened as compared to the case where the connecting portions between the connecting portions 37a and the bottom plate 39 and the connecting portions between the vertical plate portions 35a and 37a and the connecting plate portions 35b and 37b have a right-angled L shape. For this reason, the heat conduction path from the heat transfer support plates 29 and 30 to the cooling body 3 can be shortened to enable efficient heat cooling.
  • An insulating sheet 40 is attached to the lower surface of the heat transfer support plate 30 facing the drive circuit board 21 in order to shorten the insulation distance.
  • the heat transfer support side plates 35 and 37 and the bottom plate 39 have black surfaces.
  • the surface may be coated with a black resin or painted with a black paint.
  • the heat emissivity becomes larger than the metal material color, and the amount of radiant heat transfer can be increased.
  • surroundings of the heat-transfer support side plates 35 and 37 and the bottom plate 39 is activated, and the heat cooling of the control circuit board 22 can be performed efficiently.
  • a bottom plate 39 common to the heat transfer support side plates 35 and 37 is disposed in the circumferential groove 3f of the cooling body 3, and the lower surface of the cooling member 13 formed on the semiconductor power module 11 is brought into contact with the upper surface of the bottom plate 39, and The semiconductor power module 11 and the bottom plate 39 are integrally fixed to the cooling body 3 with the fixing screw 14 in a state where the cooling member 13 is in contact with the protruding base portion 3 e of the cooling body 3.
  • the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above.
  • At least three spacers that maintain an insulation distance between the drive circuit board 21 and the insulating sheet 40 are placed on a portion of the upper surface of the drive circuit board 21 where the circuit components at the peripheral edge are not mounted. Then, the heat transfer support plate 30, the heat transfer member 28, and the control circuit board 22 in which the insulating sheet 40 is bonded to the lower surface with the joint screw 24 as a reference are laminated in this order. At this time, the spacer 33 is inserted through the insertion portion of the fixing screw 43 of the heat transfer member 28.
  • the male screw portion 46a formed at the lower end of the joint screw 46 is inserted through the insertion hole 22a from the upper surface of the control circuit board 22, and screwed into the female screw portion 24b formed on the upper surface of the joint screw 24.
  • the substrate 22 is fixed to the upper end of the joint screw 24.
  • the heat transfer member 27 is placed on the upper surface of the control circuit board 22 so that the joint screw 46 is inserted into the insertion hole 27a. Then, an assembly in which the heat transfer support plate 29 is fixed to the power circuit board 42 via the heat transfer member 41 with the fixing screw 44 on the upper surface of the heat transfer member 27 in advance, and the lower surface of the heat transfer support plate 29 has heat transfer.
  • the joint screw 46 is mounted so as to pass through the insertion holes of the heat transfer support plate 29 and the heat transfer member 41 so as to contact the upper surface of the member 27.
  • a bus bar 50 is connected to the positive and negative DC input terminals of the semiconductor power module 11 to 11 a, and the positive and negative connection terminals of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 50. 4a is connected with a fixing screw 51.
  • the upper housing 2B from which the lid 2b is removed is mounted on the upper surface of the cooling body 3 through a sealing material.
  • the rectangular tube 2a of the upper housing 2B is connected to a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) and an external three-phase electric motor (not shown).
  • a crimp terminal 59 fixed to the tip of the connected motor cable 58 is inserted and supported in a liquid-tight manner.
  • the crimp terminal 53 fixed to the tip of the connection cord 52 is fixed to the DC input terminal 11 a of the semiconductor power module 11.
  • a bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 fixed to the tip of the motor cable 58 is fixed to the other end of the bus bar 55 with a fixing screw 60 and connected.
  • the upper open end of the rectangular tube 2a is sealed with a lid 2b via a sealing material.
  • the lower housing 2A is fixed to the lower surface of the cooling body 3 via a sealing material, and the assembly of the power converter 1 is completed.
  • the DC power is supplied to the semiconductor power module 11 from an external converter (not shown) via the connection cord 52, and the power supply circuit, the control circuit, and the like mounted on the control circuit board 22 are operated. Then, a gate signal composed of, for example, a pulse width modulation signal is supplied from the control circuit to the semiconductor power module 11 via the drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the external three-phase electric motor (not shown) via the bus bar 55 and further via the motor cable 58, and this three-phase electric motor (not shown) is supplied. Drive control.
  • heat is generated in the IGBT built in the semiconductor power module 11.
  • the generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the protruding base 3 e of the cooling body 3.
  • the circuit components 26 of the control circuit mounted on the control circuit board 22 include heat generating circuit components, and these heat generating circuit components generate heat.
  • the heat generating circuit components are mounted on the upper and lower surfaces of the control circuit board 22.
  • Heat transfer support plates 29 and 30 are provided on the upper and lower surfaces of the control circuit board 22 via heat transfer members 27 and 28 having high heat conductivity and elasticity.
  • the heat transfer members 27 and 28 are compressed at a compression rate of about 5 to 30% by fastening the fixing screw 43 and the power supply circuit board 42 to the upper surface of the joint screw 46 with the fixing screw 47. Therefore, the thermal resistance can be reduced, and an efficient heat transfer effect can be exhibited, and the contact area between the heat generating circuit component and the heat transfer members 27 and 28 is increased. Therefore, heat generated by the heat generating circuit components is efficiently transferred to the heat transfer members 27 and 28. Therefore, as shown in FIG. 4, the heat transferred to the heat transfer members 27 and 28 is efficiently transferred to the heat transfer support plates 29 and 30.
  • the heat transfer support plates 29 and 30 are connected to the heat transfer support plates 29 and 30, the heat transferred to the heat transfer support plates 29 and 30 passes through the heat transfer support plates 35 and 37. It is transmitted to the common bottom plate 39. Since the bottom plate 39 is in direct contact with the circumferential groove 3 f of the cooling body 3, the transmitted heat is radiated to the cooling body 3. Further, the heat transmitted to the bottom plate 39 is transmitted from the upper surface side to the cooling member 13 of the semiconductor power module 11, and is transmitted to the projecting base 3 e of the cooling body 3 through the cooling member 13 to be radiated.
  • the heat generating circuit component is also mounted on the back side of the power circuit board 42, and the heat generated by the heat generating circuit component is transmitted to the heat transfer support plate 29 through the heat transfer member 41 as shown in FIG. Therefore, the heat is radiated to the cooling body 3 through the heat transfer support plate 29 and the heat transfer support side plate 35 in the same manner as the heat generation of the heat generating circuit components on the surface side of the control circuit board 22.
  • the control circuit board 22 and the power supply circuit board 42 as a pair of mounting boards opposed to each other include the heat transfer members 27 and 41 and the heat transfer support plate 29 therebetween. Are stacked in a solid state with intervening. For this reason, since an air layer does not exist between the control circuit board 22 and the power supply circuit board 42, a heat reservoir is not formed unlike the case where the air layer is formed, and the control circuit board 22 and the power supply Heat generated by the heat generating circuit component mounted on the circuit board 42 can be efficiently radiated to the cooling body 3.
  • the control circuit board 22 and the power supply circuit board 42 on which the heat generating circuit components are mounted have the air layer with the heat transfer members 27 and 41 and the heat transfer support plate 29 interposed therebetween. Therefore, it is possible to reliably prevent heat accumulation from occurring. Therefore, the heat generated by the heat generating circuit components mounted on the control circuit board 22 and the power supply circuit board 42 can be efficiently radiated to the cooling body 3.
  • the heat transfer members 27 and 28 are arranged on both the front and back surfaces of the control circuit board 22, and the heat transfer support plates 29 and 30 are arranged on the opposite side of the heat transfer members 27 and 28 from the control circuit board 22.
  • the heat generated by the heat generating circuit components mounted on the control circuit board 22 is directly transferred to the heat transfer support plates 29 and 30 via the heat transfer members 27 and 28 without passing through the control circuit board 22 having a large thermal resistance. Since it is heated, efficient heat dissipation can be performed.
  • the heat transmitted to the heat transfer members 27 and 28 is transferred to the heat transfer support plates 29 and 30 and further transferred to the heat transfer support side plates 35 and 37. At this time, the heat transfer support side plates 35 and 37 are provided along the long side of the semiconductor power module 11.
  • the heat transfer support side plates 35 and 37 are cylindrical curved portions 35c, 35d and 37c, 37d, the heat transfer support side plates 35 and 37 are transferred to the cooling body 3 as compared with the case where the bent portions are L-shaped. The thermal distance can be shortened. For this reason, the heat dissipation efficiency can be further improved.
  • the heat transport amount Q can be expressed by the following equation (1).
  • T is the temperature difference [° C.] substrate temperature T 1 -cooling body temperature T 2
  • A is the minimum heat transfer cross section [m 2 ]
  • L is the heat transfer length [m ].
  • the housing 2 is not included in the heat dissipation path from the control circuit board 22 on which the heat generating circuit components are mounted to the cooling body 3, it is not necessary to use a metal such as aluminum having high thermal conductivity for the housing 2. Since it can be made of a synthetic resin material, the weight can be reduced. Furthermore, since the heat dissipation path can be formed by the power converter 1 alone without the heat dissipation path depending on the housing 2, the semiconductor power module 11, the drive circuit board 21, and the control circuit board 22 are configured. The power conversion device 1 can be applied to various types of housings 2 and cooling bodies 3.
  • the heat transfer support plate 29 is fixed via the heat transfer members 27 and 41 compressed between the control circuit board 22 and the power supply circuit board 42, the rigidity of the control circuit board 22 and the power supply circuit board 42 is increased. be able to. For this reason, even when the power converter 1 is applied as a motor drive circuit for driving a vehicle driving motor, the vertical vibration or roll shown in FIG. And rigidity against rolling can be increased. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.
  • the heat transfer members 27, 28, and 41 are formed of an insulator having heat transfer properties, the control circuit board 22 and the heat transfer support plates 29 and 30 can be insulated, so A distance can be shortened and the whole can be reduced in size.
  • the heat generating circuit components are arranged in a portion close to the heat transfer support side plates 35 and 37, so that the heat dissipation path to the cooling body 3 is improved. The distance may be shortened. In this case, since the distance of the heat radiation path to the cooling body 3 of the heat generating circuit component is shortened, efficient heat radiation can be performed.
  • the heat transfer members 41 and 61 are arranged on the front and back of the power circuit board 42 in the same manner as the control circuit board 22.
  • the heat transfer support plate 62 may be arranged on the opposite side of the power supply circuit board 42 of 61.
  • the fixing screw 63 is inserted from above the heat transfer support plate 62 and screwed into the female screw portion 29 c formed on the heat transfer support plate 29, and spacers 64 and 65 are provided around the fixing screw 63.
  • the heat transfer members 41 and 61 can be compressed by about 5 to 30%.
  • extension part 35e extended above the connection plate part 35c and the connection plate part 35f extended to the left from the upper end of this extension part 35e are formed in the heat-transfer support side plate 35, and it connects with the extension part 35e.
  • An extended portion 35e and a curved surface 35g that is a part of a cylindrical surface in contact with the connecting plate portion 35f are formed at the connecting portion with the plate portion 35f.
  • the connecting portion 62 a of the heat transfer support plate 62 is fixed to the connecting plate portion 35 f with a fixing screw 66.
  • the power circuit board 42 also transfers heat generated by the heat generating circuit components to the heat transfer support plates 29 and 62 by the heat transfer members 41 and 61 on the front and back sides, similarly to the control circuit board 22. Heat can be radiated from the heat transfer support plates 29 and 62 to the cooling body 3 via the heat transfer support side plate 35.
  • FIG. 8 a second embodiment of the present invention will be described with reference to FIG.
  • three mounting boards are stacked in a solid state with a heat transfer member and a heat transfer support plate interposed therebetween. That is, in the third embodiment, as shown in FIG. 8, the drive circuit board 21 and the control circuit board 22 described above are also solid with the heat transfer member 71, the heat transfer member 28, and the heat transfer support plate 30 interposed therebetween.
  • the configuration is the same as that of the first embodiment except that the layers are stacked in a state. 2 corresponding to those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the drive circuit board 21 and the control circuit board 22 are stacked in a solid state with the heat transfer members 71 and 28 and the heat transfer support plate 30 interposed therebetween. For this reason, the heat generation of the circuit component with a small amount of heat mounted on the drive circuit board 21 can be transferred to the heat transfer support plate 30 via the heat transfer member 71, and the heat transfer support plate 30 can support the heat transfer. Heat can be radiated to the cooling body 3 through the side plate 37.
  • control circuit board 22 and the power supply circuit board 42 are solid with the heat transfer members 27 and 28 and the heat transfer support plate 29 interposed therebetween, as in the first embodiment described above. They are stacked in a state.
  • the heat generating circuit components mounted on the control circuit board 22 and the power circuit board 42 are mounted on the upper surface side of the control circuit board 22 and mounted on the lower surface side of the power circuit board 42.
  • the heat transfer support plate 29 is connected to the connection plate portions 35b and 37b of the heat transfer support side plates 35 and 37 in which connection portions 29a and 29d are formed at both ends, and both the connection portions 29a and 29d are formed in a symmetrical shape.
  • the compression of the heat transfer members 27 and 28 is performed by adjusting the distance of about 5 to 30% of the thickness of the heat transfer members 27 and 28 fixed to the heat transfer support plate 29 by fixing means such as welding or brazing.
  • the fixing is performed by screwing the fixing screws 83 and 84 into the board fixing portions 81 and 82 as members.
  • the control circuit board 22 and the power supply circuit board 42 are inserted into the female screw portion formed on the upper surface of the joint screw 24 by inserting a fixing screw 85 from the upper surface side of the power supply circuit board 42 and screwed together.
  • the control circuit board 22 is fixed in contact with the upper surface.
  • the heat transfer members 27 and 28 and the heat transfer support plate 29 are interposed only between the control circuit board 22 and the power supply circuit board 42, and the power supply circuit is provided from the lower surface of the control circuit board 22.
  • the thickness up to the upper surface of the substrate 42 can be reduced as compared with the first and second embodiments described above. For this reason, the power converter device 1 whole can be further reduced in size.
  • connecting portions 29a and 29d are formed at the left and right end portions of the heat transfer support plate 29, and symmetrical heat transfer support side plates 35 and 37 are connected to the connection portions 29a and 29d. Since the lower part of 37 is integrated with the common bottom plate 39 and fixed to the cooling body 3, the rigidity against vertical vibration and roll can be further increased. For this reason, the power converter device 1 which improved the vibration resistance with respect to a vertical vibration or a roll can be provided.
  • the control circuit board 22 and the power supply circuit board 42 are stacked in a solid state only by a heat transfer member. It is. That is, in the fourth embodiment, in the configuration of FIG. 7, the control circuit board 22 and the power circuit are omitted by omitting the heat transfer support plate 29, the connecting plate portion 35 b and the curved surface 35 c of the heat transfer support side plate 35. Only the heat transfer member 27 is interposed between the substrate 42 and the control circuit board 22 and the power supply circuit board 42 are stacked in a solid state where no air layer is present.
  • the heating circuit component is mounted on the lower surface side in the control circuit board 22 and the heating circuit component is mounted on the upper side in the power circuit board 42. Further, it is preferable to embed a metal member having a high thermal conductivity such as copper for connecting the front and back surfaces of the control circuit board 22 and the power circuit board 42 to form a heat conduction path on the front and back sides.
  • the control circuit board 22 is supported by the heat transfer support side plate 37 via the heat transfer support plate 30 disposed on the lower side, and a heat conduction path to the cooling body 3 is formed.
  • the circuit board 42 is supported by the heat transfer support side plate 35 via the heat transfer support plate 62 disposed on the upper side, and a heat conduction path to the cooling body 3 is formed. Therefore, by mounting the heat generating circuit component on the lower surface side of the control circuit board 22, the heat generated by the heat generating circuit component is radiated to the cooling body 3 via the heat transfer support plate 30 and the heat transfer support side plate 37. .
  • the heat generated by the heat generating circuit component is radiated to the cooling body 3 via the heat transfer support plate 62 and the heat transfer support side plate 35. Further, the heat generated by the circuit components mounted on the upper surface side of the control circuit board 22 and the heat generated by the circuit components mounted on the lower surface side of the power circuit board 42 are transmitted via the heat transfer member 27 and the control circuit board 22 and the power circuit board 42. Heat is transferred to the cooling body via the heat transfer support side plates 37 and 35 by transferring heat to the heat transfer support plates 30 and 62 via the heat transfer members 28 and 61 on the opposite side via the metal member embedded in be able to.
  • the cooling member 13 formed in the semiconductor power module 11 includes cooling fins 91 that directly contact the cooling water flowing through the cooling body 3. You may make it set it as the structure provided. In this case, an immersion part 92 for immersing the cooling fin 91 in the passage of the cooling water is formed in the central part of the cooling body 3.
  • a sealing member 96 such as an O-ring is disposed between the peripheral wall 93 surrounding the immersion part 92 and the cooling member 13. According to this configuration, the cooling fins 91 are formed in the cooling member 13 of the semiconductor power module 11, and the cooling fins 91 are immersed in the cooling water in the cooling water at the immersion part 92, so that the semiconductor power module 11 is more efficiently used. Can be cooled.
  • the present invention is not limited to the above configuration, and the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 may be configured integrally. In this case, since no seam is formed between the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37, more efficient heat dissipation can be achieved by reducing the thermal resistance. it can.
  • the present invention is not limited to the above configuration, and an elastic body such as synthetic rubber or natural rubber other than silicon rubber can be applied.
  • a heat transfer member that does not have elasticity, such as an insulating coated metal plate, can also be applied.
  • the heat transfer support plates 30, 29 and 62 are connected to the cooling body 3 via the heat transfer support side plates 37 and 35 to separate the heat transfer path from the housing 2.
  • the case of forming is described.
  • the present invention is not limited to the above configuration, and when the casing 2 is formed of a member having high thermal conductivity, the casing 2 can be used as a heat conduction path to the cooling body 3.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor is applied. Also good.
  • the case where the power conversion device according to the present invention is applied to an electric vehicle has been described.
  • the present invention is not limited to this, and the present invention is also applied to a rail vehicle traveling on a rail.
  • the invention can be applied and can be applied to any electric drive vehicle.
  • the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the present invention it is possible to provide a power conversion device that can efficiently dissipate heat of a heat generating circuit component mounted on a substrate to a cooling body and can be miniaturized.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)

Abstract

La présente invention a trait à un dispositif de conversion de puissance qui est en mesure d'être miniaturisé et de rayonner de façon efficace, dans un corps de refroidissement, la chaleur provenant d'un composant de circuit thermogène qui est monté sur un substrat. Ce dispositif de conversion de puissance (1) est équipé d'un bloc de puissance à semi-conducteur (11) dont une surface est collée au corps de refroidissement (3), de multiples substrats de montage (21, 22, 42) sur lesquels les composants de circuit sont montés qui incluent un composant de circuit thermogène qui entraîne le bloc de puissance à semi-conducteur et de trajectoires de transmission de chaleur (35, 37) qui transfèrent la chaleur depuis les multiples substrats de montage jusque dans le corps de refroidissement (3), au moins la paire de substrats se faisant face (22, 42) des multiples substrats de montage étant stratifiée à l'état solide, un élément de transmission de chaleur (27) étant disposé entre ceux-ci.
PCT/JP2012/007066 2011-11-30 2012-11-05 Dispositif de conversion de puissance WO2013080440A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280049621.8A CN103858223A (zh) 2011-11-30 2012-11-05 电力转换装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011263011 2011-11-30
JP2011-263011 2011-11-30

Publications (1)

Publication Number Publication Date
WO2013080440A1 true WO2013080440A1 (fr) 2013-06-06

Family

ID=48534944

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/007066 WO2013080440A1 (fr) 2011-11-30 2012-11-05 Dispositif de conversion de puissance

Country Status (3)

Country Link
JP (1) JPWO2013080440A1 (fr)
CN (1) CN103858223A (fr)
WO (1) WO2013080440A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016008526A (ja) * 2014-06-23 2016-01-18 アイシン精機株式会社 電動ポンプ
JP2017216838A (ja) * 2016-06-01 2017-12-07 日立オートモティブシステムズ株式会社 電動駆動装置及び電動パワーステアリング装置
EP3522691A1 (fr) * 2018-02-02 2019-08-07 Kabushiki Kaisha Toyota Jidoshokki Appareil à semiconducteur

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104039119B (zh) * 2014-06-24 2017-01-11 大洋电机新动力科技有限公司 一种电机控制器的igbt模块及其应用的电机控制器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001211663A (ja) * 2000-01-28 2001-08-03 Sanden Corp モータ駆動用インバータ装置
JP2004282804A (ja) * 2003-03-12 2004-10-07 Toshiba Corp インバータ装置
JP2006121861A (ja) * 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP2010035347A (ja) * 2008-07-29 2010-02-12 Hitachi Ltd 電力変換装置および電動車両

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101942197B (zh) * 2009-07-09 2012-06-27 昆山伟翰电子有限公司 导热硅橡胶复合材料及其制作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001211663A (ja) * 2000-01-28 2001-08-03 Sanden Corp モータ駆動用インバータ装置
JP2004282804A (ja) * 2003-03-12 2004-10-07 Toshiba Corp インバータ装置
JP2006121861A (ja) * 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP2010035347A (ja) * 2008-07-29 2010-02-12 Hitachi Ltd 電力変換装置および電動車両

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016008526A (ja) * 2014-06-23 2016-01-18 アイシン精機株式会社 電動ポンプ
JP2017216838A (ja) * 2016-06-01 2017-12-07 日立オートモティブシステムズ株式会社 電動駆動装置及び電動パワーステアリング装置
EP3522691A1 (fr) * 2018-02-02 2019-08-07 Kabushiki Kaisha Toyota Jidoshokki Appareil à semiconducteur
JP2019134647A (ja) * 2018-02-02 2019-08-08 株式会社豊田自動織機 半導体装置
US20190244874A1 (en) * 2018-02-02 2019-08-08 Kabushiki Kaisha Toyota Jidoshokki Semiconductor apparatus

Also Published As

Publication number Publication date
CN103858223A (zh) 2014-06-11
JPWO2013080440A1 (ja) 2015-04-27

Similar Documents

Publication Publication Date Title
JP5794306B2 (ja) 電力変換装置
WO2014061178A1 (fr) Structure de refroidissement et corps thermogène
WO2014020806A1 (fr) Structure de refroidissement et convertisseur d'énergie
WO2014057622A1 (fr) Convertisseur de puissance
WO2013111234A1 (fr) Dispositif de conversion de courant
WO2013088642A1 (fr) Dispositif de conversion de puissance
WO2013145508A1 (fr) Appareil de conversion de puissance
JP2010135697A (ja) 積層モジュール構造
WO2013105166A1 (fr) Appareil de conversion de puissance
US20220256730A1 (en) Power supply device with a heat generating component
WO2013080440A1 (fr) Dispositif de conversion de puissance
WO2014125548A1 (fr) Structure de refroidissement et dispositif de conversion de puissance
WO2013084416A1 (fr) Convertisseur de puissance
WO2014024361A1 (fr) Structure de refroidissement et dispositif de conversion de puissance
WO2013084417A1 (fr) Appareil de conversion électrique
WO2013080441A1 (fr) Dispositif de conversion de puissance
JP5768902B2 (ja) 電力変換装置
WO2014020808A1 (fr) Structure de refroidissement et convertisseur d'énergie
WO2013080442A1 (fr) Dispositif de conversion de puissance
JP5682713B2 (ja) 電力変換装置
JP6187582B2 (ja) 電力変換装置
WO2014020807A1 (fr) Structure de refroidissement et convertisseur d'énergie
WO2013118223A1 (fr) Dispositif de conversion de courant électrique
WO2013140703A1 (fr) Dispositif de conversion de puissance
JP2017060292A (ja) 電力変換装置

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2013529245

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12852937

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12852937

Country of ref document: EP

Kind code of ref document: A1