WO2013145508A1 - Appareil de conversion de puissance - Google Patents

Appareil de conversion de puissance Download PDF

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Publication number
WO2013145508A1
WO2013145508A1 PCT/JP2013/000165 JP2013000165W WO2013145508A1 WO 2013145508 A1 WO2013145508 A1 WO 2013145508A1 JP 2013000165 W JP2013000165 W JP 2013000165W WO 2013145508 A1 WO2013145508 A1 WO 2013145508A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
transfer support
heat
plate portion
insulation
Prior art date
Application number
PCT/JP2013/000165
Other languages
English (en)
Japanese (ja)
Inventor
奨平 馬渕
泰仁 田中
小高　章弘
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201380005264.XA priority Critical patent/CN104040865A/zh
Publication of WO2013145508A1 publication Critical patent/WO2013145508A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Definitions

  • the present invention supports a plurality of mounting boards on which a circuit component including a heat generating circuit component for driving the semiconductor switching element is mounted at a distance on a semiconductor power module incorporating a semiconductor switching element for power conversion.
  • the present invention relates to a power converter.
  • Patent Document 1 As this type of power conversion device, as shown in Patent Document 1, a mounting board on which a heat generating circuit component is mounted is connected to a cooling body via a housing, and heat generated by the mounting board is radiated to the cooling body.
  • a power conversion device having a configuration is known.
  • a semiconductor power module 101 including a semiconductor switching element for power conversion is disposed on a cooling body 100 as shown in FIG.
  • a mounting substrate 102 is supported by a heat transfer support member 106 connected to a housing 105 via a heat transfer material 104 provided on the bottom surface.
  • the mounting substrate 102 can be cooled.
  • Reference numeral 107 denotes a capacitor disposed at the bottom of the housing 105.
  • Reference numeral 108 denotes an auxiliary machine inverter installed at the bottom of the cooling body.
  • the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path.
  • the apparatus can be made compact by adopting a structure that ensures cooling performance so that the temperature in the housing does not rise.
  • the cooling capacity in the housing there is a limit to improving the cooling capacity in the housing, and in order to achieve compactness, it is necessary to limit the height of the power converter. For this purpose, the distance between the mounting boards arranged in the housing becomes a problem.
  • circuit components with different heights are mounted between each mounting board, it is meaningless to determine the distance between the mounting boards without mounting the circuit parts. It is necessary to assume. At this time, if the distance between the mounting boards is set to the required insulation distance between the circuit component with the maximum height and the other mounting board facing it, there is no problem from the point of insulation. If there is a circuit component that does not have sufficient insulation distance even if there is a single distance between them, the distance will be determined according to this circuit component, and the distance between each mounting board will become longer, so Will also increase in size.
  • a first aspect of a power conversion device includes a semiconductor power module in which one surface is joined to a cooling body and a circuit component including a heat generating circuit component that drives the semiconductor power module. Insulating insulation formed in an insulation distance shortage region where the insulation distance is insufficient between the plurality of mounting boards and the heat transfer support member by transferring the heat of the plurality of mounting boards to the cooling body and the plurality of mounting boards. And an area.
  • the insulation securing area is a part of a heat transfer support member that secures an insulation distance by partially attaching an insulating sheet to the mounting board facing the insufficient insulation area, or dissipates the heat generated by the heating circuit components to the cooling body.
  • the insulating distance is secured by removing the insulating layer, or the insulating distance is secured by inserting an insulative heat transfer member between the circuit component that becomes the insufficient insulation region and the mounting substrate facing the circuit board.
  • the insulation distance between parts of the mounting circuit boards is insufficient, the insulation distance can be secured in the insufficient insulation securing area, and the entire configuration is made by making the distance between the mounting boards shorter than the required insulation distance. Can be made compact.
  • the 2nd aspect of the power converter device which concerns on this invention makes the said insulation ensuring area
  • the insulating heat transfer member is interposed between the mounting substrate and the heat transfer support member, so that heat is dissipated while ensuring insulation between the mounting substrate and the heat transfer support member. The effect can be improved.
  • the 3rd aspect of the power converter device which concerns on this invention makes the said insulation ensuring area
  • the insulating sheet is disposed not only on the entire surface of the heat transfer support member but only at a position facing the insufficient insulation region, the heat transfer support members other than the insulating sheet are disposed facing each other. Exposed to heat generating circuit components. For this reason, it becomes possible to absorb the heat generated by the heat generating circuit component facing the heat transfer support member, and it is possible to reliably prevent heat from being generated between the mounting boards.
  • the 4th aspect of the power converter device which concerns on this invention WHEREIN:
  • region is made into the area
  • the heat transfer support member includes a heat transfer support plate portion that supports the mounting substrate via the heat transfer member, and a side surface of the heat transfer support plate portion. And a heat transfer support side plate portion connected to the cooling body.
  • the heat transfer support member is composed of the heat transfer support plate portion and the heat transfer support side plate portion, the heat transfer support plate portion is integrated with the mount substrate when the mounting substrate is assembled.
  • the heat transfer support side plate portion can be connected to the cooling body, and finally the heat transfer support plate portion and the heat transfer support side plate portion can be connected to form a heat transfer support member.
  • the said heat-transfer support plate part and the said heat-transfer support side plate part are integrally formed.
  • the said heat-transfer member is comprised with the insulator which has insulation.
  • the heat transfer member since the heat transfer member has insulation, insulation between the mounting substrate and the heat transfer support member can be reliably performed.
  • the 8th aspect of the power converter device which concerns on this invention has fixed the said mounting substrate and the heat-transfer support plate part of the said heat-transfer support member with the clamping fixing member via the said heat-transfer member.
  • the assembly can be easily performed.
  • a ninth aspect of the power conversion device according to the present invention is an interval adjustment that maintains the interval between the mounting substrate and the heat transfer support plate portion of the heat transfer support member at a predetermined value around the tightening fixing member. A member is inserted.
  • the heat transfer member is an elastic body, the compression rate of the heat transfer member can be accurately defined.
  • the present invention even when an insulation distance shortage region in which the insulation distance is partially insufficient between the mounting boards is formed, insulation can be secured in the insulation secured region, and this insulation secured region is insufficient in the insulation distance. Since the heat transfer support member is exposed at a position facing the heat generating circuit component and the heat generation of the heat generating circuit component on the opposite surface side is not accumulated, the heat can be radiated to the cooling body. Therefore, the heat dissipation effect can be improved and the distance between the mounting boards can be made shorter than the required insulation distance, and the housing can be made compact. In addition, since the casing does not require good heat conductivity, a lightweight material such as a resin can be used for the casing, and the casing can be reduced in weight and an inexpensive power conversion device can be provided.
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
  • reference numeral 1 denotes a power converter
  • the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 has a cooling water supply port 3 a and a drain port 3 b opened to the outside of the housing 2.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • the cooling body 3 is integrally formed by casting aluminum or aluminum alloy having high thermal conductivity, such as die casting. And as for the cooling body 3, the lower surface is made into a flat surface, and the upper surface is formed with the square-frame-shaped peripheral groove 3d leaving the center part 3c.
  • the power conversion device 1 includes a semiconductor power module 11 including, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion.
  • the semiconductor power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which fixing screws 14 as fixing members are inserted at the four corners when viewed from above.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted.
  • a control circuit board 22 as a mounting board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the semiconductor power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. ing.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 25 a of the joint screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24, and this male screw portion 25 a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 a formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 a of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 and the power circuit board 23 are uniquely formed with a heat dissipation path to the cooling body 3 by the heat transfer support members 32 and 33 without passing through the housing 2.
  • These heat transfer support members 32 and 33 are formed of a metal having a high thermal conductivity, such as aluminum or an aluminum alloy.
  • the heat transfer support members 32 and 33 have a square frame-shaped common bottom plate portion 34 that is disposed in the circumferential groove 3d of the cooling body 3 that supports the control circuit board 22 and serves as a cooling body contact plate portion. Therefore, the heat transfer support members 32 and 33 are integrally connected by the bottom plate portion 34. And the heat-transfer support members 32 and 33 and the baseplate part 34 have a black surface. In order to blacken the surfaces of the heat transfer support members 32 and 33 and the bottom plate portion 34, the surface may be coated with a black resin or painted with a black paint.
  • the heat transfer support member 32 includes a heat transfer support plate portion 32a on a flat plate, and a heat transfer support side plate portion fixed to the right end side of the heat transfer support plate portion 32a along the long side of the semiconductor power module 11 with a fixing screw 32b. 32c.
  • the heat transfer support side plate portion 32 c is connected to the common bottom plate portion 34.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support side plate portion 32c is integrally connected to the outer peripheral edge on the long side of the common bottom plate portion 34 disposed in the circumferential groove 3d of the cooling body 3, and extends upward.
  • An upper plate portion 32e extending leftward from the upper end of the connecting plate portion 32d is formed in an inverted L-shaped cross section.
  • the connecting plate portion 32 d extends upward through the right side surface on the long side of the semiconductor power module 11.
  • the heat transfer support member 33 includes a heat transfer support plate portion 33a on a flat plate, and a heat transfer support side plate portion fixed to the left end side of the heat transfer support plate portion 33a along the long side of the semiconductor power module 11 with a fixing screw 33b. 33c.
  • the heat transfer support side plate portion 33 c is connected to the common bottom plate portion 34.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above. Further, the heat transfer support side plate portion 33c is integrally connected to the outer peripheral edge on the long side of the common bottom plate portion 34 disposed in the circumferential groove 3d of the cooling body 3, and extends upward. An upper plate portion 33e extending leftward from the upper end of the connecting plate portion 33d is formed in an inverted L-shaped cross section. The connecting plate portion 33 d extends upward through the left side surface on the long side of the semiconductor power module 11.
  • connection part with the bottom board part 34 and the upper board part 33e of the connection board part 33d is formed in the curved surfaces 33f and 33g which are a part of cylindrical surface, for example.
  • the connecting portions of the connecting plate portion 33d, the bottom plate portion 34, and the upper plate portion 33e into cylindrical curved surfaces 33f and 33g, it is possible to improve vibration resistance against vertical vibration and roll. . That is, it is possible to alleviate the stress concentration generated in the connecting portion between the connecting plate portion 33d, the bottom plate portion 34, and the upper plate portion 33e when vertical vibration or roll is transmitted to the power conversion device 1.
  • the connecting plate portion 33d to the bottom plate portion 34 and the upper plate portion 33e with cylindrical curved surfaces 33f and 33g, the connecting portion between the connecting plate portion 33d and the bottom plate portion 34 and the upper plate portion 33e.
  • the heat conduction path can be shortened as compared with the case of forming a right-angle L-shape. For this reason, the heat conduction path from the heat transfer support plate portion 33a to the cooling body 3 is shortened, and efficient heat cooling becomes possible.
  • a heat generating circuit component 39 is mounted on the upper surface side as shown in FIGS. Then, the control circuit board 22 and the power supply circuit board 23 are connected to the heat transfer members 35 and 37 and the heat transfer support plate portions 32a and 33a as shown in FIG.
  • the connection between the control circuit board 22 and the power circuit board 23 and the heat transfer support plate portions 32a and 33a is substantially the same except that the left and right are reversed.
  • the plate portion 33a will be described as a representative.
  • the connection between the power supply circuit board 23 and the heat transfer support plate 33 a has a heat transfer plate portion management height H lower than the thickness T of the heat transfer member 37.
  • a spacer 40 is used.
  • the spacer 40 is temporarily fixed by bonding or the like to the outer peripheral side of the female screw portion 41 into which the fixing screw 38 formed on the heat transfer support plate portion 33a is screwed.
  • the heat transfer plate portion management height H of the spacer 40 is set so that the compression rate of the heat transfer member 37 is about 5 to 30%.
  • the thermal resistance is reduced and an efficient heat transfer effect can be exhibited.
  • the heat transfer member 37 is formed with an insertion hole 37 a through which the joint screw 25 can be inserted and an insertion hole 37 b through which the spacer 40 can be inserted.
  • the heat transfer member 37 is placed on the heat transfer support plate 33a so that the spacer 40 temporarily fixed to the heat transfer support plate 33a is inserted into the insertion hole 37b.
  • the power supply circuit board 23 is placed thereon so that the heat generating circuit component 39 is in contact with the heat transfer member 37.
  • the fixing screw 38 is screwed into the female screw portion 41 of the heat transfer support plate portion 33a through the insertion hole 23b of the power circuit board 23 and the central opening of the spacer 40. Then, the fixing screw 38 is tightened until the upper surface of the heat transfer member 37 substantially coincides with the upper surface of the spacer 40. For this reason, the heat transfer member 37 is compressed at a compression rate of about 5 to 30%, and the heat resistance is reduced and an efficient heat transfer effect can be exhibited. At this time, since the compression rate of the heat transfer member 37 is managed by the height H of the spacer 40, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
  • the connection through the heat transfer member 35 between the control circuit board 22 and the heat transfer support plate portion 32a is performed in the same manner as described above.
  • the distance between the control circuit board 22 and the power supply circuit board 23 is such that the upper end of the circuit component 42 mounted on the control circuit board 22 and serving as a reference is relatively low and the heat transfer support member of the power supply circuit board 23.
  • the distance from the lower surface of the 33 heat transfer support plate portion 33a is set to a necessary insulation distance L1.
  • the distance L2 is shorter than the necessary insulation distance L1
  • the heat generating circuit component 39 and the heat transfer support plate portion 33a of the power circuit board 23 are connected to each other.
  • the gap is an insufficient insulation distance region.
  • an insulation securing region is formed in the insulation distance shortage region.
  • an insulating sheet 43 larger than the planar shape of the heat generating circuit component 39 is attached to the heat transfer support plate 33 a of the power circuit board 23 facing the upper surface of the heat generating circuit component 39. Etc. are arranged.
  • the common bottom plate portion 34 of the heat transfer support members 32 and 33 is inserted through the fixing member at a position facing the insertion hole 15 through which the fixing screw 14 of the semiconductor power module 11 is inserted.
  • a hole 34a is formed.
  • a plate-like elastic member 45 is interposed between the upper surface of the bottom plate portion 34 and the lower surface of the heat dissipation member 13 formed in the semiconductor power module 11. Then, the fixing screw 14 is inserted into the insertion hole 15 of the semiconductor power module 11 and the heat radiating member 13 and the fixing member insertion hole 34 a of the bottom plate portion 34, and the fixing screw 14 is screwed into the female screw portion 3 f formed in the cooling body 3. By doing so, the semiconductor power module 11 and the bottom plate portion 34 are fixed to the cooling body 3.
  • the power supply circuit board 23 is superposed on the heat transfer support plate portion 33a of the heat transfer support member 33 via the heat transfer member 37, and the heat transfer member 37 is placed on the heat transfer member 37 by the fixing screw 38.
  • the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate 33a are fixed in a state compressed at a compression rate of about%, and the power supply circuit unit U3 is formed as shown in FIG.
  • control circuit board 22 is superposed on the heat transfer support plate portion 32a of the heat transfer support member 32 via the heat transfer member 35, and the heat transfer member 35 is compressed by a fixing screw 36 at a compression ratio of about 5 to 30%. In this state, the control circuit board 22, the heat transfer member 35, and the heat transfer support plate 32a are fixed to form the control circuit unit U2.
  • a bottom plate portion 34 common to the heat transfer support members 32 and 33 is provided between the upper surface and the lower surface of the heat radiating member 13 formed in the semiconductor power module 11. In the state where 45 is interposed, it is fixed with the fixing screw 14 together with the semiconductor power module 11.
  • the semiconductor power module 11 and the common bottom plate portion 34 of the heat transfer support members 32 and 33 can be fixed to the cooling body 3 at the same time, the number of assembling steps can be reduced.
  • the plate-like elastic member 45 is interposed between the bottom plate portion 34 and the heat dissipation member 13 of the semiconductor power module 11 when the bottom plate portion 34 is fixed to the cooling body 3, the plate-like elastic member 45 causes the bottom plate portion 34 to be interposed. Is pressed against the bottom of the circumferential groove 3d of the cooling body 3, and the bottom plate portion 34 is reliably brought into contact with the cooling body 3, thereby ensuring a wide contact area.
  • the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above. And the heat-transfer support plate part 32a is connected with the heat-transfer support side plate part 32c with the fixing screw 32b. Then, the control circuit board 22 of the control circuit unit U ⁇ b> 2 is placed on the upper surface of the joint screw 24 and is fixed by the four joint screws 25. Further, the power supply circuit board 23 of the power supply circuit unit U 3 is placed on the upper surface of the joint screw 25 and fixed by the four fixing screws 26. And the heat-transfer support plate part 33a is connected with the heat-transfer support side plate part 33c by the fixing screw 33b.
  • a DC power source such as an external converter is connected to the positive and negative DC input terminals of the semiconductor power module 11 and the positive and negative terminals of the film capacitor 4 are connected. Furthermore, a load such as a three-phase electric motor outside the three-phase AC output terminal (not shown) of the semiconductor power module 11 is connected. Thereafter, the lower housing 2A and the upper housing 2B are fixed to the lower surface and the upper surface of the cooling body 3 via a sealing material, and the assembly of the power conversion device 1 is completed.
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the semiconductor power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power.
  • the converted AC power drives and controls a load (not shown) such as a three-phase electric motor from a three-phase AC output terminal.
  • the IGBT built in the semiconductor power module 11 generates heat.
  • This heat generation is cooled by the cooling water supplied to the cooling body 3 because the heat radiating member 13 formed in the semiconductor power module 11 is in direct contact with the central portion 3 c of the cooling body 3.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat.
  • the heat generating circuit component 39 is mounted on the upper surface side of the control circuit board 22 and the power supply circuit board 23.
  • the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33 are provided on the lower surface sides of the control circuit board 22 and the power supply circuit board 23 through heat transfer members 35 and 37 having high thermal conductivity and elasticity. Is provided. For this reason, the heat generated by the heat generating circuit component 39 is efficiently transferred to the heat transfer members 35 and 37. Since the heat transfer members 35 and 37 themselves are compressed at a compression rate of about 5 to 30% to increase the thermal conductivity, the heat transferred to the heat transfer members 35 and 37 is efficiently supported by the heat transfer. It is transmitted to the heat transfer support plate portions 32a and 33a of the members 32 and 33.
  • the heat transfer support side plate portions 32c and 33c are connected to the heat transfer support plate portions 32a and 33a, the heat transferred to the heat transfer support plate portions 32a and 33a is transferred to the heat transfer support side plate portions 32c and 33a. It is transmitted to the common bottom plate part 34 through 33c. Since the bottom plate portion 34 is in direct contact with the circumferential groove 3 d of the cooling body 3, the transmitted heat is radiated to the cooling body 3. Further, the heat transmitted to the bottom plate portion 34 is transmitted from the upper surface side to the heat radiating member 13 of the semiconductor power module 11 via the plate-like elastic member 45, and the central portion 3 c of the cooling body 3 is transmitted via the heat radiating member 13. It is transmitted to and dissipated.
  • the heat generation of the heat generating circuit component 39 mounted on the control circuit board 22 and the power circuit board 23 is caused by the heat transfer member 35 and the heat transfer member 35 via the control circuit board 22 and the power circuit board 23. Since heat is transferred to 37, efficient heat dissipation can be performed.
  • the heat transferred to the heat transfer members 35 and 37 is transferred to the heat transfer support plate portions 32a and 33a, and further transferred to the heat transfer support side plate portions 32c and 33c. At this time, the heat transfer support side plate portions 32 c and 33 c are provided along the long side of the semiconductor power module 11.
  • the heat transport amount Q can be expressed by the following equation (1).
  • Q ⁇ ⁇ (A / L) ⁇ T (1)
  • T the temperature difference [° C.] substrate temperature T 1 -cooling body temperature T 2
  • A the minimum heat transfer cross section [m 2 ]
  • L the heat transfer length [m ].
  • the housing 2 is not included in the heat dissipation path from the control circuit board 22 and the power circuit board 23 on which the heat generating circuit component 39 is mounted to the cooling body 3, the housing 2 is required to have heat conductivity. Absent. Therefore, it is not necessary to use a metal having a high thermal conductivity such as aluminum as a constituent material of the casing 2, and the casing 2 can be configured with a synthetic resin material, and the weight can be reduced. Further, since the heat dissipation path can be formed by the power conversion device 1 alone without the heat dissipation path being dependent on the housing 2, the semiconductor power module 11, the drive circuit board 21, the control circuit board 22, and the power supply circuit board 23. Can be applied to the housing 2 and the cooling body 3 in various different forms.
  • the metal heat transfer support plate portions 32a and 33a are fixed to the control circuit board 22 and the power circuit board 23, the rigidity of the control circuit board 22 and the power circuit board 23 can be increased. For this reason, the heat transfer support members 32 and 33 can be used even when vertical vibration or roll is applied to the power conversion device 1 as in the case where the power conversion device 1 is applied as a motor drive circuit for driving a vehicle driving motor. Can increase the rigidity. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.
  • the heat generated by the heat generating circuit component 39 mounted on the upper surface of the control circuit board 22 is also radiated to the space between the control circuit board 22 and the power supply circuit board 23, and this heat dissipation is transferred to the power supply circuit board 23 facing the heat supply circuit board 23.
  • the heat is absorbed by the support plate portion 33a and radiated to the cooling body 3 through the heat transfer support side plate portion 33c. Therefore, heat generated by the heat generating circuit component 39 is not dissipated between the control circuit board 22 and the power supply circuit board 23 and is radiated to the cooling body 3.
  • the distance between the control circuit board 22 and the power supply circuit board 23 is set to the necessary insulation distance L1 between the upper surface of the reference circuit component 42 and the heat transfer support plate 33a of the power supply circuit board 23. Yes. Therefore, insulation is ensured between the circuit component 42 and the heat transfer support plate portion 33a of the power supply circuit board 23, but the insulation distance is higher for the circuit component 39 that is higher than the reference circuit component 42. It cannot be secured.
  • the insulation sheet 43 when the insulation distance shortage region occurs, the insulation sheet 43 is disposed on the opposing surface of the heat transfer support plate portion of the power supply circuit board 23 facing the insulation distance shortage region. A necessary heat transfer distance is secured by the sheet 43.
  • the distance between the control circuit board 22 and the power supply circuit board 23 is a distance obtained by adding the necessary insulation distance L1 to the height of the reference circuit part 42, and the heat generating circuit part 39 having the shortest insulation distance.
  • the distance can be sufficiently shorter than the distance obtained by adding the necessary insulation distance L1 to the height.
  • the distance from the semiconductor power module 11 to the uppermost power circuit board 23 can be shortened, and the height of the upper casing 2B surrounding them can also be lowered, so that compactness can be achieved. .
  • the present invention is not limited to the above-described configuration, and the present invention can be applied even when the substrate on which the heat generating circuit component 39 is mounted is, for example, only one control circuit substrate 22 or three or more substrates. Is something that can be done.
  • an insulating heat transfer member is interposed in the region facing the insufficient insulation region to ensure insulation. It is a thing. That is, in the second embodiment, as shown in FIG. 4, the insulating sheet 43 in the first embodiment described above is omitted, and instead, the circuit component having the highest height mounted on the control circuit board 22. Insulation having insulation properties similar to those of the heat transfer members 35 and 37 in the first embodiment described above in a region where the insulation distance is insufficient between 39 and the heat transfer support plate portion 33a of the power supply circuit board 23 opposed thereto. An insulation ensuring region is formed by interposing the heat transfer member 51. Since the configuration other than this is the same as that of the first embodiment described above, the same reference numerals are given to the corresponding parts in FIG. 4 with FIG. 1, and the detailed description thereof will be omitted.
  • insulation is performed in an insufficient insulation distance region between the circuit component 39 having the highest height between the control circuit board 22 and the power circuit board 23 and the heat transfer support plate portion 33a of the power circuit board 23. Since the heat conductive member 51 is interposed, the insulating heat transfer member 51 can ensure insulation in the region where the insulation distance is insufficient.
  • the insulating heat transfer member 51 is interposed between the circuit component 39 and the heat transfer support plate portion 33a of the power circuit board 23, the insulation is not only ensured but also the insulating property.
  • the heat transfer member 51 can be used as a heat dissipation path and the circuit component 39 having the highest height is a heat generating circuit component, the heat generation is directly transmitted through the insulating heat transfer member 51. Heat can be transferred to 33a, and heat dissipation of the heat generating circuit components can be performed more effectively.
  • the insulating heat transfer member 51 is applied as the insulation securing region has been described.
  • the present invention is not limited to this, and an insulating member having a low thermal conductivity is used. You may do it.
  • the heat transfer support plate portion 33a of the power supply circuit board 23 facing the insulation distance shortage region is removed as the insulation ensuring region. That is, in the third embodiment, as shown in FIG. 5, the upper end of the highest circuit component 39 mounted on the control circuit board 22 and the heat transfer support plate portion 33a of the power circuit board 23 are arranged. As shown in FIG. 6 (a) or (b), the heat transfer support plate portion 33a at the position facing the circuit component 39 in the region where the insulation distance is short between is a rectangular cut portion larger than the planar shape of the circuit component 39. The insulating distance is ensured by forming 61a or forming a circular cut portion 61b larger than the planar shape of the circuit component 39 to expose the heat transfer member 37.
  • the case where the shape of the heat transfer support plate 33a to be cut out is a rectangle or a circle.
  • the shape is not limited to this, and a predetermined insulation distance can be secured. It can be of any shape.
  • the case where there are two types of substrates on which the heat generating circuit component 39 is mounted has been described.
  • the present invention is not limited to the above-described configuration, and the present invention can be applied even when the substrate on which the heat generating circuit component 39 is mounted is, for example, only one control circuit substrate 22 or three or more substrates. Is something that can be done.
  • the heat transfer support members 32 and 33 are composed of separate heat transfer support plate portions 32a and 33a and heat transfer support side plate portions 32c and 33c. Although it demonstrated, it is not limited to this, You may make it form the heat-transfer support plate part 32a, 33a and the heat-transfer support side plate part 32c, 33c integrally. In this case, since there is no seam between the heat transfer support plate portions 32a and 33a and the heat transfer support side plate portions 32c and 33c, the thermal resistance can be reduced and the heat dissipation effect can be further improved. .
  • the present invention is not limited to this, and the present invention is also applied to a rail vehicle traveling on a rail.
  • the invention can be applied and can be applied to any electric drive vehicle.
  • the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the present invention even when an insulation distance shortage region where the insulation distance is partially insufficient between the mounting boards is formed, insulation is ensured in the insulation ensuring region, so that heat transfer is performed at a position facing the heating circuit component. It is possible to dissipate heat to the cooling body without exposing the heat generation of the heat generating circuit components on the opposite surface by exposing the support member, improving the heat dissipation effect and the insulation distance that requires the distance between the mounting boards It is possible to provide a power conversion device that can be shortened and can be made compact.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention se rapporte à un appareil de conversion de puissance, qui est rendu compact, tout en éliminant l'insuffisance de distance d'isolation. Un appareil de conversion de puissance (1) est pourvu des éléments suivants : un module de puissance semi-conducteur (11) ayant une surface liée à un corps de refroidissement (3) ; une pluralité de substrats de montage (22, 23), possédant chacun, montés sur eux, des composants de circuit y compris un composant de circuit générant de la chaleur qui commande le module de puissance semi-conducteur ; des éléments de support de transmission de chaleur (32, 33), qui transmettent la chaleur des substrats de montage au corps de refroidissement ; et une région assurant l'isolation (43), qui est formée dans une région à distance d'isolation insuffisante où la distance d'isolation est insuffisante entre les substrats de montage.
PCT/JP2013/000165 2012-03-28 2013-01-16 Appareil de conversion de puissance WO2013145508A1 (fr)

Priority Applications (1)

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CN201380005264.XA CN104040865A (zh) 2012-03-28 2013-01-16 功率转换装置

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JP2012-073284 2012-03-28
JP2012073284 2012-03-28

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
JPWO2016047212A1 (ja) * 2014-09-25 2017-04-27 日立オートモティブシステムズ株式会社 電力変換装置
US10867980B2 (en) 2018-10-15 2020-12-15 Fuji Electric Co., Ltd. Semiconductor equipment
JP7516294B2 (ja) 2021-03-08 2024-07-16 株式会社日立製作所 電力変換ユニットおよび電力変換装置

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JP6701701B2 (ja) * 2015-12-04 2020-05-27 富士電機株式会社 インバータ装置
CN110178302B (zh) * 2017-01-17 2021-09-10 日立汽车系统株式会社 电力转换装置
CN110959239B (zh) * 2017-04-07 2021-09-14 法雷奥西门子新能源汽车(深圳)有限公司 用于电动车辆或混合动力车辆中的电压转换器
CN110417309A (zh) * 2019-08-02 2019-11-05 北斗航天汽车（北京）有限公司 新型电机控制器、电机控制器制造方法及电动汽车

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JPS63209197A (ja) * 1987-02-25 1988-08-30 松下電器産業株式会社 制御機器
JPH1126660A (ja) * 1997-06-30 1999-01-29 Pfu Ltd 高発熱素子の放熱構造
JPH1174427A (ja) * 1997-09-01 1999-03-16 Sharp Corp 回路素子の放熱構造
JP2007159204A (ja) * 2005-12-01 2007-06-21 Ishikawajima Harima Heavy Ind Co Ltd インバータ装置
JP2008029117A (ja) * 2006-07-21 2008-02-07 Hitachi Ltd 電力変換装置
JP2008125240A (ja) * 2006-11-13 2008-05-29 Hitachi Ltd 電力変換装置
JP2010035347A (ja) * 2008-07-29 2010-02-12 Hitachi Ltd 電力変換装置および電動車両

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JPS63209197A (ja) * 1987-02-25 1988-08-30 松下電器産業株式会社 制御機器
JPH1126660A (ja) * 1997-06-30 1999-01-29 Pfu Ltd 高発熱素子の放熱構造
JPH1174427A (ja) * 1997-09-01 1999-03-16 Sharp Corp 回路素子の放熱構造
JP2007159204A (ja) * 2005-12-01 2007-06-21 Ishikawajima Harima Heavy Ind Co Ltd インバータ装置
JP2008029117A (ja) * 2006-07-21 2008-02-07 Hitachi Ltd 電力変換装置
JP2008125240A (ja) * 2006-11-13 2008-05-29 Hitachi Ltd 電力変換装置
JP2010035347A (ja) * 2008-07-29 2010-02-12 Hitachi Ltd 電力変換装置および電動車両

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016047212A1 (ja) * 2014-09-25 2017-04-27 日立オートモティブシステムズ株式会社 電力変換装置
US10867980B2 (en) 2018-10-15 2020-12-15 Fuji Electric Co., Ltd. Semiconductor equipment
JP7516294B2 (ja) 2021-03-08 2024-07-16 株式会社日立製作所 電力変換ユニットおよび電力変換装置

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CN104040865A (zh) 2014-09-10

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