WO2013118223A1 - Dispositif de conversion de courant électrique - Google Patents

Dispositif de conversion de courant électrique Download PDF

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Publication number
WO2013118223A1
WO2013118223A1 PCT/JP2012/007879 JP2012007879W WO2013118223A1 WO 2013118223 A1 WO2013118223 A1 WO 2013118223A1 JP 2012007879 W JP2012007879 W JP 2012007879W WO 2013118223 A1 WO2013118223 A1 WO 2013118223A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat transfer
transfer support
cooling
plate portion
Prior art date
Application number
PCT/JP2012/007879
Other languages
English (en)
Japanese (ja)
Inventor
美里 柴田
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201280061317.5A priority Critical patent/CN103999212B/zh
Publication of WO2013118223A1 publication Critical patent/WO2013118223A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the heat transfer support plate is fixedly supported by a plurality of heat transfer path forming members. According to this configuration, since the heat transfer support plate portion is fixedly supported by the plurality of heat transfer path forming members, it is possible to increase the heat transfer cross-sectional area to the cooling body and to efficiently dissipate heat generating circuit components. it can.
  • the said heat-transfer member is comprised with the insulator.
  • the heat transfer member is formed of an insulator, the insulation between the circuit component mounted on the mounting board and the heat transfer support plate can be reliably performed, and the distance between the two is reduced.
  • the heat transfer support plate can be formed of a metal material having a high thermal conductivity.
  • a fourteenth aspect of the power conversion device includes a housing that is disposed on the cooling body and seals the semiconductor power module, the mounting substrate, and the heat transfer support member. According to the fourteenth aspect, since the semiconductor power module, the mounting board, and the heat transfer support member are sealed by the casing disposed on the cooling body, the temperature is generated by the heat generated by the heat generating circuit components mounted on the mounting board. The temperature rise of the sealed gas can be suppressed by absorbing heat from the sealed gas in which the temperature rises in the heat absorbing portion.
  • the cooling body 3 has a cooling water supply port 3 a and a drain port 3 b opened to the outside of the housing 2.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity. And as for the cooling body 3, the lower surface is made into a flat surface, and the upper surface is formed with the square-frame-shaped peripheral groove 3d leaving the center part 3c. Further, the cooling body 3 is formed with an insertion hole 3e through which the positive and negative external connection electrodes 4a covered with insulation of the film capacitor 4 held in the lower housing 2A are vertically inserted.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted.
  • a control circuit board 22 as a mounting board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the semiconductor power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. ing.
  • the heat transfer support side plate portion 33 c is integrally connected to the outer peripheral edge on the long side of the common bottom plate portion 34 disposed in the circumferential groove 3 d of the cooling body 3.
  • the connecting plate portion 33d extending upward and the upper plate portion 33e extending rightward from the upper end of the connecting plate portion 33d are formed in an inverted L-shaped cross section.
  • the connecting plate portion 33 d extends upward through the left side surface on the long side of the semiconductor power module 11.
  • the heat transfer support side plate portion 32c of the heat transfer support member 32 that supports the control circuit board 22 is provided on the right end of the upper surface of the case body 12 of the semiconductor power module 11, as shown in FIGS.
  • An opening 32h is formed at a position facing the formed two positive and negative DC input terminals 11a.
  • the opening 32h is a connection for electrically connecting the DC input terminal 11a of the case body 12 and the two positive and negative external connection electrodes 4a of the film capacitor 4 individually.
  • Two bus bars 50p and 50n as conductors are inserted.
  • a crimp terminal 53 connected to the ends of two positive and negative power cables 52 for supplying DC power to the DC input terminal 11a is inserted through the opening 32h.
  • the heat transfer support side plate portion 33 c of the heat transfer support member 33 that supports the power circuit board 23 has an upper left end on the upper surface of the case body 12 of the semiconductor power module 11. Openings 33h, 33i, and 33j are formed at positions facing the three U-phase, V-phase, and W-phase AC output terminals 11b. In these openings 33h, 33i and 33j, there are U-phase, V-phase and W AC output terminals 11b formed on the upper surface of the case body 12, and crimp terminals 59 attached to the tips of the three motor connection cables 58. Busbars 55u, 55v, and 55w are inserted as three connection conductors that connect the two.
  • the power supply circuit board 23 and the heat transfer support plate portion 33 a are connected to each other by an interval adjusting member having a heat transfer plate portion management height H lower than the thickness T of the heat transfer member 37.
  • a spacer 40 is used.
  • the spacer 40 is temporarily fixed by bonding or the like to the outer peripheral side of the female screw portion 41 into which the fixing screw 38 formed on the heat transfer support plate portion 33a is screwed.
  • the heat transfer plate portion management height H of the spacer 40 is set so that the compression rate of the heat transfer member 37 is about 5 to 30%.
  • the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • the connection of the control circuit board 22 and the heat transfer support plate portion 32a through the heat transfer member 35 is performed in the same manner as the heat transfer member 37.
  • Insulating sheets 42 and 43 are attached to the lower surfaces of the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33 in order to shorten the insulation distance.
  • the common bottom plate portion 34 of the heat transfer support members 32 and 33 has a fixing member insertion hole 34 a at a position facing the insertion hole 15 through which the fixing screw 14 of the semiconductor power module 11 is inserted. Is formed.
  • an opening 34b that passes through the central portion 3c of the cooling body 3 is formed in the central portion of the bottom plate portion 34, as clearly shown in FIG.
  • a plate-like elastic member 45 is interposed between the upper surface of the bottom plate portion 34 and the lower surface of the cooling member 13 formed in the semiconductor power module 11.
  • the fixing screw 14 is inserted into the insertion hole 15 of the semiconductor power module 11 and the cooling member 13 and the fixing member insertion hole 34 a of the bottom plate portion 34, and the fixing screw 14 is screwed into the female screw portion 3 f formed in the cooling body 3. By doing so, the semiconductor power module 11 and the bottom plate portion 34 are fixed to the cooling body 3.
  • control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32a are fixed in a state where the heat transfer member 35 is compressed at a compression rate of about 5 to 30% by the fixing screw 36, and the control circuit unit U2 is fixed. Is formed.
  • the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above. And the heat-transfer support plate part 32a is connected with the heat-transfer support side plate part 32c with the fixing screw 32b. Then, the control circuit board 22 of the control circuit unit U ⁇ b> 2 is placed on the upper surface of the joint screw 24 and is fixed by the four joint screws 25. Further, the power supply circuit board 23 of the power supply circuit unit U 3 is placed on the upper surface of the joint screw 25 and fixed by the four fixing screws 26. And the heat-transfer support plate part 33a is connected with the heat-transfer support side plate part 33c by the fixing screw 33b.
  • two positive and negative bus bars 50p and 50n are connected to the positive and negative DC input terminals of the semiconductor power module 11 through the opening 32h of the heat transfer support member 32, and the bus bars 50p and 50n are connected.
  • a positive and negative external connection electrode 4 a of the film capacitor 4 that penetrates the cooling body 3 is connected to the other end by a fixing screw 51.
  • a crimp terminal 53 fixed to the ends of two connection cables 52 connected to an external converter (not shown) is fixed to the DC input terminal 11 a of the semiconductor power module 11.
  • the IGBT built in the semiconductor power module 11 generates heat.
  • the generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the central portion 3 c of the cooling body 3.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat.
  • the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • Heat transfer support plate portions 32a and 33a of heat transfer support members 32 and 33 are provided on the lower surfaces of the control circuit board 22 and the power supply circuit board 23 through heat transfer members 35 and 37 having high thermal conductivity and elasticity. It has been. Therefore, the heat generated by the heat generating circuit component 39 is transferred to the heat transfer support plate portions 32a and 33a via the heat transfer members 35 and 37 as shown in FIG. And since the heat transfer support side plate portions 32c and 33c are connected to the heat transfer support plate portions 32a and 33a, the heat transferred to the heat transfer support plate portions 32a and 33a is as shown in FIG. It is transmitted to the common bottom plate portion 34 through the heat transfer support side plate portions 32c and 33c. Since the bottom plate portion 34 is in direct contact with the circumferential groove 3 d of the cooling body 3, the transmitted heat is radiated to the cooling body 3.
  • the heat transmitted to the bottom plate portion 34 is transmitted from the upper surface side to the cooling member 13 of the semiconductor power module 11 via the plate-like elastic member 45, and the central portion 3 c of the cooling body 3 via this cooling member 13. It is transmitted to and dissipated.
  • the heat transfer support side plate portion 33c of the heat transfer support member 33 has a U-shape at the lower side edge position connecting the front and rear side edges and the lower portions of the front and rear side edges to form openings 33h to 33j.
  • a slit 33k is formed by forming a slit, and the openings 33h to 33j are formed by bending outward with reference to the upper edge portion of the tongue 33k, and a bent portion 33m serving as a heat absorbing portion is formed. Forming.
  • the bent portions 33m projecting outward are formed on the upper sides of the openings 33h to 33j, the surface area of the side surface of the heat transfer support side plate portion 33c can be increased at each bent portion 33m. Can do. Therefore, as shown by an arrow in a dotted line shown in FIG. 10, in the bent portion 33m, it absorbs heat better efficiency of heat of the air sealed by the surrounding upper housing 2B of the control circuit board 22 and the power supply circuit board 23 be able to. Therefore, the temperature of the control circuit board 22 and the power supply circuit board 23 can be reduced.
  • the piece 33k was bent outward to form the bent portions 33mu to 33mw.
  • the outer surface area of the heat transfer support side plate portion 33c can be enlarged by the bent portions 33mu to 33mw, and heat is absorbed from the atmosphere around the heat transfer support side plate portion 33c sealed by the upper housing 2B. Heat can be radiated to the cooling body 3. Therefore, an increase in the ambient temperature around the heat transfer support side plate portion 33c can be suppressed, and an increase in the temperature of the control circuit board 22 and the power supply circuit board 23 can also be suppressed.
  • the bent portion 33mu ⁇ 33mw since its upper edge is directly connected to the heat transfer support plate portion 33c, it is possible to suppress the thermal resistance at the connection portion may efficiency endothermic of the ambient atmosphere It can be carried out. Since the heat transfer members 35 and 37 themselves are compressed at a compression rate of about 5 to 30% to increase the thermal conductivity, the heat transfer members 35 and 37 are transferred to the heat transfer members 35 and 37 as shown in FIG. Heat is efficiently transmitted to the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33.
  • heat generated by the heat generating circuit component 39 mounted on the control circuit board 22 and the power supply circuit board 23 is directly transferred to the heat transfer members 35 and 37 without passing through the control circuit board 22 and the power supply circuit board 23 having a large thermal resistance. Therefore, efficient heat dissipation can be performed.
  • the heat transferred to the heat transfer members 35 and 37 is transferred to the heat transfer support plate portions 32a and 33a, and further transferred to the heat transfer support side plate portions 32c and 33c. At this time, the heat transfer support side plate portions 32 c and 33 c are provided along the long side of the semiconductor power module 11.
  • the heat transport amount Q can be expressed by the following equation (1).
  • Q ⁇ ⁇ (A / L) ⁇ T (1)
  • T the temperature difference [° C.] substrate temperature T 1 -cooling body temperature T 2
  • A the minimum heat transfer cross section [m 2 ]
  • L the heat transfer length [m ].
  • the housing 2 is not included in the heat dissipation path from the control circuit board 22 and the power circuit board 23 on which the heat generating circuit component 39 is mounted to the cooling body 3, the housing 2 is required to have heat conductivity. Absent. Therefore, it is not necessary to use a metal having a high thermal conductivity such as aluminum as a constituent material of the casing 2, and the casing 2 can be configured with a synthetic resin material, and the weight can be reduced.
  • the metal heat transfer support plate portions 32a and 33a are fixed to the control circuit board 22 and the power circuit board 23, the rigidity of the control circuit board 22 and the power circuit board 23 can be increased.
  • bent portions 33mu to 33mw are formed on the side surfaces of the heat transfer support side plate portion 33c of the heat transfer support member 33, and the rigidity of the heat transfer support side plate portion 33c can be increased by the bent portions 33mu to 33mw. .
  • the members 32 and 33 can increase the rigidity. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.
  • the present invention is not limited to the above-described configuration.
  • the configuration as shown in FIG. May be. That is, the heat transfer support side plates 32c and 32L are provided on both the left and right sides of the control circuit board 22, respectively, and the heat radiation paths are formed on both sides of the heat transfer support plate 32a.
  • the thermal radiation effect can be improved more by forming the thermal radiation path in the both sides of the heat-transfer support plate part 32a.
  • the cooling fins 61 are formed on the cooling member 13 of the semiconductor power module 11, and the cooling fins 61 are immersed in the cooling water in the cooling water at the immersion part 62, so that the semiconductor power module 11 is more efficiently used. Can be cooled.
  • the case where the heat-transfer support plate part 32a and 33a of the heat-transfer support members 32 and 33 and the heat-transfer support side plate part 32c and 33c were comprised separately was demonstrated.
  • the present invention is not limited to the above configuration, and as shown in FIG. 15, the heat transfer support plate portions 32a and 33a and the heat transfer support side plate portions 32c and 33c may be configured integrally. Good.
  • the heat resistance is reduced and more efficient heat dissipation is performed. Can do.
  • the present invention is not limited to the above-described configuration.
  • an insulating layer 72 is provided on a heat dissipation plate 71 mainly composed of aluminum or an aluminum alloy as the control circuit board 22 and the power supply circuit board.
  • a metal base circuit board 74 on which a circuit pattern 73 is formed can be applied. In this case, as shown in FIG.
  • the heat transfer members 35 and 37 and the heat transfer support plate portions 32a and 33a are omitted, and the heat dissipation plate 71 of the metal base circuit board 74 is directly connected to the heat transfer support side plate portion 32c and What is necessary is just to make it connect to 33c.
  • the control circuit board 22 and the power supply circuit board 23 on which the heat generating circuit component 39 is mounted are connected to the heat transfer member 35 and the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33.
  • the case where it supports via 37 was demonstrated.
  • the present invention is not limited to the above configuration. As shown in FIG. 17, the heat transfer members 35 and 37 are omitted, and the control circuit board 22 and the power supply circuit board are provided on the heat transfer support plates 32a and 33a.
  • the heat transfer substrate support 75 that directly supports the heat transfer substrate 23 may be integrally formed.
  • the heat transfer substrate support portion 75 is formed integrally with the heat transfer support plate portions 32a and 33a, the thermal resistance between the heat transfer substrate support portion 75 and the heat transfer support plate portions 32a and 33a. It can be made into the state which has almost no. For this reason, by disposing the heat transfer substrate support portion 75 in the vicinity of the heat generating circuit component 39, it is possible to efficiently dissipate the heat generating circuit component 39.
  • An insulating sheet 76 is provided on the upper surface of the heat transfer support plate portion 33a.
  • the base is located at the front and back positions sandwiching the openings 32h and 33h to 33j in the heat transfer support side plates 32c and 33c of the heat transfer support members 32 and 33.
  • a plurality of heat absorption fins 82 extending in the vertical direction on 81 are arranged in the front-rear direction at a predetermined interval to form a heat absorption portion 83.
  • the base 81 of the heat absorption part 83 is being fixed to the heat-transfer support side board parts 32c and 33c using joining methods, such as welding and brazing.
  • the heat absorbing portions 83 having the plurality of heat absorbing fins 82 are formed at the front and rear end positions of the heat transfer supporting side plate portions 32c and 33c, the outer side surfaces of the heat transfer supporting side plate portions 32c and 33c are formed.
  • the surface area can be remarkably increased as compared with the bent portions 33mu to 33mw in the first embodiment described above. For this reason, the temperature of the surrounding atmosphere of the heat-transfer support side plate parts 32c and 33c can be absorbed more efficiently, and the temperature rise of the surrounding atmosphere can be reliably suppressed.
  • the heat absorbing fins 82 are formed at the front and rear end positions of the heat transfer support side plates 32c and 33c has been described. However, the lower side and the upper side of the openings 32h and 33h to 33j. Alternatively, an endothermic fin 82 may be disposed.
  • a cooling rib is applied instead of the cooling fin as the heat absorbing portion. That is, in the third embodiment, as shown in FIGS. 21 and 22, the heat absorbing portion 83 configured by the base 81 and the cooling fin 82 in the second embodiment described above is omitted, and instead of these, A plurality of triangular cylindrical cooling ribs 91 extending in the direction are arranged at predetermined intervals in the front-rear direction. In this case, the cooling rib 91 is formed by rib processing integrally when the heat transfer support members 32 and 33 are press-molded.
  • the heat absorbing ribs 91 are formed by rib processing on the front and rear end sides of the heat transfer support side plates 32c and 33c of the heat transfer support members 32 and 33. For this reason, the surface areas of the heat transfer support side plates 32c and 33c can be increased in the same manner as in the first embodiment described above, and the heat absorption effect by the heat transfer support side plates 32c and 33c can be improved. And since the heat absorption rib 91 is integrally formed in the heat-transfer support side plate part 32c and 33c, the thermal resistance in the connection part of the cooling rib 91 and the heat-transfer support side plate part 32c and 33c can be made small. Therefore, by forming the cooling rib 91, a good endothermic effect can be exhibited by the heat transfer support side plate portions 32c and 33c.
  • the cooling rib 91 is formed in a triangular cylindrical shape.
  • the present invention is not limited to this, and an arbitrary shape such as a semicircular cross section, a trapezoidal cross section, etc. It can be formed in a cross-sectional shape.
  • the case where the bent portions 33mu to 33mw, the cooling fins 82, and the cooling ribs 91 are individually provided as the cooling portions has been described.
  • the present invention is not limited to this.
  • the bent portions 33 mu to 33 mw and one of the cooling fins 82 and the cooling ribs 91 may be provided simultaneously.
  • the present invention is not limited to this, and the present invention is also applied to a rail vehicle traveling on a rail.
  • the invention can be applied and can be applied to any electric drive vehicle.
  • the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the heat of the heat generating circuit component mounted on the substrate is efficiently dissipated to the cooling body through the heat conduction path, and the heat absorbing portion is provided in the heat conduction path, so that the heat generating circuit component is surrounded by the heat. It is possible to provide a power converter that can suppress an increase in temperature.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de conversion de courant électrique dans lequel la chaleur produite par un composant de circuit chauffant qui est monté sur un substrat peut être efficacement dissipée vers un corps de refroidissement sans interposer un boîtier sur le trajet de dissipation de la chaleur produite par le composant de circuit dégageant de la chaleur, et grâce auquel il est possible d'éviter une augmentation de la température ambiante à cause de la chaleur du composant de circuit chauffant. Un élément semiconducteur de commutation utilisé pour la conversion du courant électrique est logé dans un boîtier, et un module semiconducteur de puissance doté d'un élément de refroidissement destiné à refroidir l'élément semiconducteur de commutation est monté sur un côté du boîtier. Sur son substrat de montage est monté un composant de circuit comprenant un composant de circuit chauffant destiné à attaquer l'élément semiconducteur de commutation, un corps de refroidissement destiné à refroidir l'élément de refroidissement du module semiconducteur de puissance, et un élément porteur de transfert thermique destiné à transférer directement vers le corps de refroidissement la chaleur produite par l'élément de circuit chauffant placé sur le substrat monté. L'élément porteur de transfert thermique est configuré à partir d'une plaque porteuse de transfert thermique destinée à supporter le substrat monté et une plaque porteuse latérale de transfert thermique destinée à former un trajet de transfert thermique entre la plaque porteuse de transfert thermique et le corps de refroidissement, et une partie de puits thermique destinée à absorber de la chaleur provenant de l'atmosphère ambiante est formée dans la plaque porteuse latérale de transfert thermique.
PCT/JP2012/007879 2012-02-07 2012-12-10 Dispositif de conversion de courant électrique WO2013118223A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280061317.5A CN103999212B (zh) 2012-02-07 2012-12-10 功率转换装置

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JP2012024318 2012-02-07
JP2012-024318 2012-02-07

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WO2013118223A1 true WO2013118223A1 (fr) 2013-08-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015107870A1 (ja) * 2014-01-16 2017-03-23 パナソニックＩｐマネジメント株式会社 半導体装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0626772A (ja) * 1992-07-09 1994-02-04 Mitsubishi Cable Ind Ltd ヒートパイプ
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
JPH1126660A (ja) * 1997-06-30 1999-01-29 Pfu Ltd 高発熱素子の放熱構造
JP2004282804A (ja) * 2003-03-12 2004-10-07 Toshiba Corp インバータ装置
JP2005036753A (ja) * 2003-07-17 2005-02-10 Denso Corp 電動圧縮機
JP2005036773A (ja) * 2003-07-18 2005-02-10 Denso Corp 車両用インバータ一体型電動コンプレッサ
JP2006121861A (ja) * 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP2007159204A (ja) * 2005-12-01 2007-06-21 Ishikawajima Harima Heavy Ind Co Ltd インバータ装置
JP2008125240A (ja) * 2006-11-13 2008-05-29 Hitachi Ltd 電力変換装置
JP2009026784A (ja) * 2007-07-17 2009-02-05 Furukawa Electric Co Ltd:The 放熱部品
JP2010073998A (ja) * 2008-09-19 2010-04-02 Toshiba Tec Corp 電子機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4657329B2 (ja) * 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0626772A (ja) * 1992-07-09 1994-02-04 Mitsubishi Cable Ind Ltd ヒートパイプ
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
JPH1126660A (ja) * 1997-06-30 1999-01-29 Pfu Ltd 高発熱素子の放熱構造
JP2004282804A (ja) * 2003-03-12 2004-10-07 Toshiba Corp インバータ装置
JP2005036753A (ja) * 2003-07-17 2005-02-10 Denso Corp 電動圧縮機
JP2005036773A (ja) * 2003-07-18 2005-02-10 Denso Corp 車両用インバータ一体型電動コンプレッサ
JP2006121861A (ja) * 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP2007159204A (ja) * 2005-12-01 2007-06-21 Ishikawajima Harima Heavy Ind Co Ltd インバータ装置
JP2008125240A (ja) * 2006-11-13 2008-05-29 Hitachi Ltd 電力変換装置
JP2009026784A (ja) * 2007-07-17 2009-02-05 Furukawa Electric Co Ltd:The 放熱部品
JP2010073998A (ja) * 2008-09-19 2010-04-02 Toshiba Tec Corp 電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015107870A1 (ja) * 2014-01-16 2017-03-23 パナソニックＩｐマネジメント株式会社 半導体装置
US10453776B2 (en) 2014-01-16 2019-10-22 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

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