WO2013088642A1 - Dispositif de conversion de puissance - Google Patents

Dispositif de conversion de puissance Download PDF

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Publication number
WO2013088642A1
WO2013088642A1 PCT/JP2012/007309 JP2012007309W WO2013088642A1 WO 2013088642 A1 WO2013088642 A1 WO 2013088642A1 JP 2012007309 W JP2012007309 W JP 2012007309W WO 2013088642 A1 WO2013088642 A1 WO 2013088642A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
heat
transfer support
plate portion
circuit board
Prior art date
Application number
PCT/JP2012/007309
Other languages
English (en)
Japanese (ja)
Inventor
美里 柴田
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201280055474.5A priority Critical patent/CN103931094A/zh
Publication of WO2013088642A1 publication Critical patent/WO2013088642A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Definitions

  • the present invention supports a mounting board on which a circuit component including a heat generating circuit component for driving the semiconductor switching element is mounted at a predetermined interval on a semiconductor power module including a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a water cooling jacket is disposed in a casing, and a semiconductor power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket to cool the power conversion apparatus.
  • a control circuit board is disposed in the housing at a predetermined distance on the opposite side of the semiconductor power module from the water-cooling jacket, and the heat generated by the control circuit board is supported by the heat dissipation member.
  • the heat transmitted to the metal base plate is further transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
  • the assembly which can mount the semiconductor power module described in Patent Document 2 describes that a plurality of semiconductor power modules are arranged in parallel and obliquely in a housing.
  • the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path.
  • a plurality of mounting boards are arranged in parallel, and the heat generated by the heat generating circuit components of the lower mounting board rises as hot air, but the increased hot air rises to the lower surface of the upper mounting board.
  • heat does not escape to the upper side of the circuit board, and heat is accumulated, which adversely affects circuit components on the upper mounting board.
  • each of the plurality of semiconductor power modules is arranged in parallel and obliquely in the casing, and all the plates for mounting the semiconductor power modules are obliquely disposed. Therefore, an extra space is required in the housing, and it becomes difficult to individually arrange a cooling body such as a water cooling jacket for cooling the semiconductor power module in each semiconductor power module. Therefore, the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and provides a power conversion device capable of preventing the occurrence of heat accumulation by activating natural convection between mounting boards. The purpose is to do.
  • a first aspect of a power conversion device includes a semiconductor power module in which one surface is joined to a cooling body, and is laminated on the other surface side of the semiconductor power module via an air layer. And a plurality of mounting boards on which circuit components including heat generating circuit components for driving the semiconductor power module are mounted. The plurality of mounting boards are inclined with respect to a plane orthogonal to the weight direction.
  • the mounting board since the mounting board is inclined, when the hot air released from the heat generating circuit components mounted on the lower mounting board reaches the lower surface of the upper mounting board, the upper mounting board When the lower surface is an inclined surface, hot air rises along the inclined surface. For this reason, natural convection is activated between the mounting boards, and the occurrence of heat accumulation can be prevented.
  • a second aspect of the power conversion device is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a cooling member that contacts the cooling body is formed on one surface of the case body. And a plurality of mounting boards on which circuit components including heat generating circuit components for driving the semiconductor switching elements arranged in layers via air layers are mounted on the side opposite to the cooling member of the semiconductor power module.
  • the mounting board is supported while being inclined with respect to a plane perpendicular to the direction of gravity.
  • the mounting board since the mounting board is inclined, when the hot air released from the heat generating circuit components mounted on the lower mounting board reaches the lower surface of the upper mounting board, the upper mounting board When the lower surface is an inclined surface, hot air rises along the inclined surface. For this reason, natural convection is activated between the mounting boards, and the occurrence of heat accumulation can be prevented.
  • a third aspect of the power conversion device is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a cooling member that contacts the cooling body is formed on one surface of the case body.
  • a plurality of mounting boards mounted with circuit components including heat generating circuit components for driving the semiconductor switching elements that are stacked and disposed on the opposite side of the cooling member of the semiconductor power module via an air layer, and at least the semiconductor power A module and a housing surrounding the plurality of mounting boards.
  • the mounting board is supported while being inclined with respect to a plane perpendicular to the direction of gravity. According to this configuration, natural convection can be activated between the mounting boards as in the first aspect described above, heat accumulation can be prevented, and temperature unevenness within the housing can be eliminated.
  • the semiconductor power module is arranged in parallel to a plane perpendicular to the direction of gravity, and the plurality of mounting boards are supported by a support member on a plane perpendicular to the direction of gravity. Tilt and support. According to this configuration, since the semiconductor power module is disposed in a horizontal plane and the mounting substrate itself is supported by being inclined, the mounting substrate is easily inclined and supported by inclining the upper surface of the support member that supports the mounting substrate. be able to.
  • a surface of the cooling body that contacts the cooling member of the semiconductor power module is formed on an inclined surface that is inclined with respect to a plane orthogonal to the direction of gravity.
  • the semiconductor power module and the plurality of mounting boards are arranged in parallel on the inclined surface. According to this configuration, the mounting substrate can be tilted only by making the upper surface of the cooling body an inclined surface, and the configuration for tilting the mounting substrate can be simplified.
  • the housing includes an upper housing that covers an outer peripheral surface of the upper surface of the cooling body, an outer peripheral surface of the lower surface of the cooling body, and an internal capacitor.
  • the upper surface of the lower housing is formed on an inclined surface that is inclined with respect to a plane orthogonal to the direction of gravity, and the cooling body, the semiconductor power module, and the plurality of the plurality of lower housings are formed on the inclined surface.
  • the mounting boards are arranged in parallel. According to this configuration, the mounting substrate can be tilted only by making the upper surface of the lower housing an inclined surface, and the configuration for tilting the mounting substrate can be simplified.
  • a heat radiating portion is formed on the inner wall surface of the housing at a position facing natural convection from the mounting board. According to this configuration, according to this configuration, the hot air carried by the natural convection reaches the heat radiating portion, and it is possible to exchange heat with the outside by this heat radiating portion, and it is possible to suppress the temperature rise in the housing. .
  • the 8th aspect of the power converter device which concerns on this invention is comprised by the radiation fin with which the said thermal radiation part was formed in the inner wall surface of a housing
  • the heat radiating portion is constituted by the heat radiating fins, the surface area can be increased and heat can be efficiently radiated.
  • the 9th aspect of the power converter device which concerns on this invention is comprised by the several groove part in which the said thermal radiation part was formed in the housing
  • the plurality of mounting boards are supported by a heat transfer support plate portion via a heat transfer member, and the case body of the semiconductor power module is a rectangular flat surface.
  • the heat transfer support plate portion is connected to the cooling body through a heat conduction path independent of a housing surrounding both the semiconductor power module and each mounting board, and The conduction path was arranged so as to pass through the side surface on the long side of the case body.
  • the heat generated by the heat generating circuit component mounted on the mounting board can be dissipated to the cooling body via the heat transfer member, the heat transfer support plate, and the heat conduction path, and the heat generated by the heat generating circuit component can be efficiently generated. It can dissipate heat well.
  • the casing since the heat conduction path is independent of the casing, the casing can be formed without considering the thermal conductivity of the casing, and the degree of freedom in design can be improved.
  • the heat conduction path is configured by a heat transfer support side plate portion that connects the heat transfer support plate portion and the cooling body. According to this configuration, the width of the heat supporting side plate portion can be widened and the heat transfer cross-sectional area can be increased, so that the amount of heat transferred can be increased.
  • the said heat-transfer support plate part and the said heat-transfer support side plate part are comprised with the metal material with high heat conductivity. According to this configuration, since the mounting substrate is made of aluminum, aluminum alloy, copper, or the like having high thermal conductivity, heat dissipation to the cooling body can be performed more efficiently.
  • the 13th aspect of the power converter device which concerns on this invention is the heat-transfer support plate which supports the said lower mounting board
  • the upper part is connected to the upper part, and the lower part is connected to the heat transfer support plate part that supports the upper mounting board.
  • the heat transfer support plate and the heat transfer support plate are integrated. According to this configuration, since the heat transfer support plate portion and the heat transfer support side plate portion are integrated, there is no joint between them, and the heat transfer effect can be enhanced by reducing the thermal resistance.
  • a fifteenth aspect of the power conversion device is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a cooling member that contacts the cooling body is formed on one surface of the case body.
  • a plurality of mounting boards mounted with circuit components including heat generating circuit components for driving the semiconductor switching elements that are stacked and disposed on the opposite side of the cooling member of the semiconductor power module via an air layer, and at least the semiconductor power
  • a module and a housing surrounding the plurality of mounting boards, and the housing is inclined so that the plurality of mounting boards in the housing are inclined with respect to a plane perpendicular to the direction of gravity.
  • the power conversion device itself has a normal configuration, and the mounting substrate can be tilted simply by tilting the housing itself, and the configuration for tilting the mounting substrate is further simplified. can do.
  • the 16th aspect of the power converter device which concerns on this invention has a thermal radiation part which the said housing
  • the 17th aspect of the power converter device which concerns on this invention is comprised with the radiation fin with which the said thermal radiation part was formed in the housing
  • the heat radiating portion is constituted by the heat radiating fins, the surface area can be increased and heat can be efficiently radiated.
  • the 18th aspect of the power converter device which concerns on this invention is comprised by the several groove part in which the said thermal radiation part was formed in the housing
  • the plurality of mounting boards are supported by a heat transfer support plate portion via heat transfer members, and the case body of the semiconductor power module is a rectangular flat surface.
  • the heat transfer support plate portion is connected to the cooling body through a heat conduction path independent of a housing surrounding both the semiconductor power module and each mounting board, and The conduction path is disposed so as to pass through the side surface on the long side of the case body.
  • the heat generated by the heat generating circuit component mounted on the mounting board can be dissipated to the cooling body via the heat transfer member, the heat transfer support plate, and the heat conduction path, and the heat generated by the heat generating circuit component can be efficiently generated. It can dissipate heat well.
  • the casing since the heat conduction path is independent of the casing, the casing can be formed without considering the thermal conductivity of the casing, and the degree of freedom in design can be improved.
  • the heat conduction path includes a heat transfer support side plate portion that connects the heat transfer support plate portion and the cooling body. According to this configuration, the width of the heat supporting side plate portion can be widened and the heat transfer cross-sectional area can be increased, so that the amount of heat transferred can be increased.
  • the said heat-transfer support plate part and the said heat-transfer support side plate part are comprised with the metal material with high heat conductivity. According to this configuration, since the mounting substrate is made of aluminum, aluminum alloy, copper, or the like having high thermal conductivity, heat dissipation to the cooling body can be performed more efficiently.
  • a twenty-second aspect of the power conversion device provides a heat transfer support plate that supports the lower mounting board when the heat transfer support side plate portion supports a pair of upper and lower mounting boards. It is connected to the upper end side with respect to the part, and is connected to the lower end side with respect to the heat transfer support plate part that supports the upper mounting substrate. According to this configuration, the hot air rising along the heat transfer support plate portion is not shielded by the heat transfer support side plate portion, and natural convection can be efficiently formed.
  • the heat transfer support plate and the heat transfer support plate are integrated. According to this configuration, since the heat transfer support plate portion and the heat transfer support side plate portion are integrated, there is no joint between them, and the heat transfer effect can be enhanced by reducing the thermal resistance.
  • the mounting board is supported in an inclined state with respect to a plane perpendicular to the direction of gravity, when a plurality of mounting boards for mounting the heat generating circuit components are arranged in parallel, the lower mounting board Even if the generated hot air rises and reaches the upper mounting board, the upper mounting board is inclined with respect to a plane perpendicular to the direction of gravity, that is, a horizontal plane, so that the hot air flows along the lower surface of the upper mounting board. Will rise. For this reason, natural convection is activated and the occurrence of heat accumulation can be reliably prevented.
  • FIG. 10 is an enlarged cross-sectional view showing a modification of the sixth to ninth embodiments.
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
  • reference numeral 1 denotes a power converter, and the power converter 1 is housed in a housing 2.
  • the casing 2 is made of a synthetic resin material or a material having high thermal conductivity, and is composed of a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a configuration of a water cooling jacket interposed therebetween. Has been.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed in a flat rectangular parallelepiped shape whose lower surface and upper surface are flat surfaces.
  • a water supply port 3a and a water discharge port 3b are directly opened to the outside of the housing 2, and a cooling water passage 3c is formed between the water supply port 3a and the water discharge port 3b.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity. Further, the cooling body 3 is formed with an insertion hole 3d through which the positive and negative connection terminals 4a covered with insulation of the film capacitor 4 held in the lower housing 2A are vertically inserted.
  • the power conversion apparatus 1 includes a semiconductor power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion.
  • the semiconductor power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal cooling member 13 is formed on the lower surface of the case body 12.
  • the case body 12 and the cooling member 13 are formed with insertion holes 15 through which the fixing screws 14 as the fixing members are inserted at the four corners when viewed from the plane.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted.
  • a control circuit board 22 as a mounting board is fixed to the horizontal plane perpendicular to the direction of gravity at a predetermined angle, for example, an inclination angle ⁇ in the range of 5 to 20 °, for example, tilted upwards left.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heat generating circuit component for supplying power to the IGBT built in the semiconductor power module 11 is mounted at a predetermined interval above the control circuit board 22 is similarly provided.
  • the control circuit board 22 is supported by being inclined upward, for example, at an inclination angle ⁇ in the range of 5 ° to 20 °, for example, with respect to a horizontal plane orthogonal to the direction of gravity.
  • a pair of screw shafts 17a is screwed into a female screw portion 16a formed at the upper ends of the pair of front and rear substrate fixing portions 16 on the left side and extended in the vertical direction.
  • a pair of screw shafts 17b are screwed into a female screw portion 16b formed at the upper ends of the pair of front and rear substrate fixing portions 16 on the right side and are extended in the vertical direction.
  • the four screw shafts 17a and 17b are driven. With the insertion hole 21 a formed in the circuit board 21 inserted, the lower surface of the drive circuit board 21 is in contact with the upper end of the board fixing portion 16.
  • cylindrical spacers 18a and 18b having different lengths are attached to the screw shafts 17a and 17b so that the screw shafts 17a and 17b are inserted through the inner peripheral surface.
  • the spacers 18a and 18b are set so that the spacer 18a is longer than the spacer 18b.
  • each of the spacers 18a and 18b has a lower end surface that is a horizontal plane Fh and an upper end surface that is the inclined surface Fi having the inclination angle ⁇ described above.
  • the lower surface of the control circuit board 22 is in contact with the inclined surface Fi on the upper surface of each spacer 18a and 18B.
  • the control circuit board 22 has elongated holes 22a and 22b through which the screw shafts 17a and 17b are inserted.
  • the control circuit board 22 is brought into contact with the inclined surface Fi at the upper ends of the spacers 18a and 18b by inserting and lowering the screw shafts 17a and 17b into the elongated holes 22a and 22b from above the screw shafts 17a and 17b. ing.
  • the control circuit board 22 is mounted at an inclination angle ⁇ upward.
  • spacers 19 a and 19 b similar to the spacers 18 a and 18 b are attached to the screw shafts 17 a and 17 b protruding from the control circuit board 22.
  • the spacers 19a and 19b are formed with inclined surfaces Fi each having an inclination angle ⁇ on the upper and lower surfaces.
  • the spacers 19a and 19b are set to the same height. Then, the screw shafts 17a and 17b protrude from the spacers 19a and 19b, and the screw shafts 17a and 17b are inserted into the long holes 23a and 23b similar to the control circuit substrate 22 from above the screw shafts 17a and 17b.
  • the power supply circuit board 23 is also mounted leftward at an inclination angle ⁇ and is parallel to the control circuit board 22.
  • spacers 20a and 20b as support members are mounted on the screw shafts 17a and 17b protruding from the power circuit board 23.
  • the spacers 20a and 20b are formed in a cylindrical shape whose lower surface is an inclined surface Fi inclined at an inclination angle ⁇ and whose upper surface is a horizontal plane Fh. Then, by bringing the inclined surfaces Fi on the lower surfaces of the spacers 20a and 20b into contact with the power circuit board 23, the horizontal surface Fh on the upper surface becomes horizontal.
  • the nuts 24 a and 24 b are screwed onto the screw shafts 17 a and 17 b protruding upward from the spacers 20 a and 20 b, and the drive circuit board 21, the control circuit board 22, and the power supply circuit board 23 are connected to the semiconductor power module 11. It is fixedly supported on the substrate fixing part 16.
  • the screw shafts 17a, 17b, spacers 18a, 18b, 19a, 19b, 20a, 20b and nuts 24a, 24b constitute a support member.
  • the screw shafts 17a and 17b are screwed into the female screw portion 16a of the substrate fixing portion 16 fixed to the case body 12 of the semiconductor power module 11 .
  • the present invention is not limited to this.
  • the screw shafts 17a and 17b may be formed integrally with the substrate fixing portion 16.
  • a vertical shaft in which a male screw portion is formed only at portions protruding from the spacers 20a and 20b may be integrally formed.
  • the semiconductor power module 11 brings the cooling member 13 on the lower surface thereof into contact with the upper surface of the cooling body 3 on the cooling body 3 arranged in a horizontal state in the housing 2 arranged on a horizontal plane. Arranged in a state.
  • the drive circuit board 21 is arranged in a horizontal state, and the control circuit board 22 and the power circuit board 23 are arranged so as to be inclined upward to the left at an inclination angle ⁇ . Yes.
  • Heat generating circuit components are mounted on the control circuit board 22 and the power supply circuit board 23.
  • a bus bar 50 is connected to the positive and negative DC input terminals 11a of the semiconductor power module 11, and the positive and negative electrodes 4a of the film capacitor 4 penetrating the cooling body 3 are connected to the other end of the bus bar 50.
  • a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the DC input terminal 11 a of the semiconductor power module 11 with a fixing screw 54.
  • a bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. Then, a crimp terminal 59 fixed to the tip of a motor connection cable 58 connected to an external three-phase electric motor (not shown) is fixed to the other end of the bus bar 55 with a fixing screw 60.
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the semiconductor power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the semiconductor power module 11 generates heat.
  • This generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the cooling body 3.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 28, and the heat generating circuit component 28 generates heat.
  • the heat generating circuit component 28 is mounted on the upper surface side of the control circuit board 22 and the power supply circuit board 23.
  • the heat generated by the heat generated by the heat generating circuit component 28 is increased on the control circuit board 22 and the power circuit board 23, and the heat generated by the heat generated by the circuit component is slightly increased also on the drive circuit board 21.
  • the hot air generated by the heat generated in the drive circuit board 21 and the control circuit board 22 rises and reaches the lower surfaces of the control circuit board 22 and the power supply circuit board 23.
  • the control circuit board 22 and the power supply circuit board 23 are inclined at an inclination angle ⁇ (for example, 5 to 20 °). For this reason, the hot air that has reached the control circuit board 22 and the power supply circuit board 23 rises along the lower surfaces of the control circuit board 22 and the power supply circuit board 23, and natural convection is activated. By activating natural convection in this way, temperature irregularities in the upper housing 2 ⁇ / b> B are eliminated without causing heat accumulation on the lower surfaces of the control circuit board 22 and the power supply circuit board 23.
  • the drive circuit board 21, the control circuit board 22, and the power supply circuit board 23 are arranged in parallel on the upper surface side of the case body 12 of the semiconductor power module 11. .
  • the heat generated by the heat generated by the heat generating circuit board on the upper surface side of the drive circuit board 21, the control circuit board 22, and the power circuit board 23 rises, and this hot air flows to the control circuit board 22, the power circuit board 23, and the upper housing 2B.
  • the lid 2b is reached.
  • the control circuit board 22, the power supply circuit board 23, and the lid 2b are in a horizontal state. For this reason, there is no escape space for the hot air reaching the control circuit board 22, the power supply circuit board 23, and the lid body 2b, and it becomes a heat reservoir, thereby reducing the thermal cooling efficiency. Accordingly, only the periphery of the drive circuit board 21, the control circuit board 22, the power supply circuit board 23, and the lid body 2b becomes high temperature, and since it is cooled by the cooling body 3 outside these, it becomes relatively low temperature, and within the upper housing 2B. Causes temperature unevenness.
  • natural convection can be activated by inclining the control circuit board 22 and the power supply circuit board 23 by a predetermined angle ⁇ with respect to a plane orthogonal to the direction of gravity. For this reason, it is possible to prevent heat accumulation from occurring in the drive circuit board 21, the control circuit board 22, the power supply circuit board 23, and the lid 2b, and to reduce the temperature in the upper housing 2B, and to reduce the temperature distribution. It can be made uniform.
  • the drive circuit board 21, the control circuit board 22, and the power supply circuit board 23 are fixed by screwing the nuts 24a and 24b to the uppermost parts of the screw shafts 17a and 17b.
  • the present invention is not limited to the above configuration, and can be configured as shown in FIG. That is, spacers 25a and 25b similar to the spacers 20a and 20b are mounted on the screw shafts 17a and 17b protruding from the control circuit board 22, and nuts are mounted on the screw shafts 17a and 17b protruding from the horizontal plane Fh at the upper ends of the spacers 25a and 25b. 26a and 26b are screwed and tightened.
  • spacers 27a and 27b similar to the spacers 25a and 25b are mounted upside down on the screw shafts 17a and 17b protruding from the nuts 26a and 26b.
  • the power supply circuit board 23 is attached to the screw shafts 17a and 17b protruding from the horizontal plane Fh of the spacers 27a and 27b
  • the spacers 20a and 20b are attached to the screw shafts 17a and 17b protruding from the power supply circuit board 23, and finally the screw The nuts 24a and 24b are screwed onto the shafts 17a and 17b and tightened.
  • control circuit board 22 is temporarily fastened and fixed with nuts 26a and 26b, and the power circuit board 23 is fastened and fixed again with nuts 24a and 24b on its upper side. For this reason, the control circuit board 22 and the power supply circuit board 23 can be firmly fixed, and the vibration resistance against vertical vibration and roll can be improved.
  • the entire housing 2 is tilted instead of tilting only the control circuit board and the power circuit board. That is, in the second embodiment, the semiconductor power module 11 is disposed horizontally in the upper housing 2B constituting the housing 2 as in the conventional example of FIG. 5 and FIG.
  • the driving circuit board 21, the control circuit board 22, and the power supply circuit board 23 are horizontally arranged on the 11 board fixing portions 16 with predetermined intervals.
  • the mounting brackets 31 a and 31 b formed to protrude in the left-right direction on the lower casing 2 ⁇ / b> A are attached to the fixing portion 30.
  • bolts 33 and nuts 34 are fixed to the fixing brackets 32a and 32b extending in the mounting surface shape of the inclination angle ⁇ (for example, 5 to 30 °) in the first embodiment.
  • the casing 2 itself is fixed to the fixing portion 30 in a state where the casing 2 is inclined by an inclination angle ⁇ with respect to a horizontal plane orthogonal to the direction of gravity.
  • the drive circuit board 21, the control circuit board 22, the power supply circuit board 23, and the lid 2b are inclined by the inclination angle ⁇ . Therefore, as shown in FIG.
  • the natural convection between the laminated substrates is activated, so that cooling can be performed without using a forced circulation method using a fan, and the number of parts can be reduced and the apparatus can be downsized.
  • the housing 2 itself can be applied to the conventional example only by providing the mounting bracket and the fixing bracket.
  • the configuration can be simplified without using a special substrate support member.
  • the bottom surface of the cooling body 3 is inclined to the right. That is, in the third embodiment, as shown in FIG. 10, the bottom surface 3e of the cooling body 3 is an inclined surface that inclines upward at the inclination angle ⁇ described above. For this reason, when the lower housing 2A is arranged on a horizontal plane, the upper housing 2B is inclined by the inclination angle ⁇ , which is the same state as in the second embodiment described above.
  • the upper housing 2B is inclined in the same manner as in the second embodiment described above, so that the same operational effects as those in the second embodiment described above can be obtained and driven. Natural convection among the circuit board 21, the control circuit board 22, and the power supply circuit board 23 can be activated. For this reason, while being able to eliminate the heat accumulation between board
  • the present invention is not limited to this, and as shown in FIG. 11, the lower surface 2Aa of the lower housing 2A is You may make it incline to the left downward. Also in this case, the upper housing 2B is inclined in the same manner as in the second embodiment described above, and the same effects as those in the second and third embodiments can be obtained.
  • FIG. 12 a larger effect of lowering the temperature in the housing is exhibited in the first embodiment described above. That is, in the fourth embodiment, as shown in FIG. 12, in the configuration of FIG. 1 in the first embodiment described above, hot air is carried by natural convection from the control circuit board 22 and the power supply circuit board 23 that are disposed in an inclined manner. 1 has the same configuration as that shown in FIG. 1 except that the heat dissipating fins 41 constituting the heat dissipating portion are arranged at the lower surface position serving as the inner wall surface of the lid 2b of the upper housing 2B. Therefore, in FIG. 12, the same reference numerals are given to the parts corresponding to those in FIG. 1, and the detailed description thereof will be omitted.
  • the heat radiated from the control circuit board 22 and the power supply circuit board 23 arranged in an inclined manner by natural convection arrives at the position of the lid 2b where the maximum temperature is reached in the upper housing 2B.
  • the radiation fin 41 is arranged. For this reason, the surface area of the upper space of the upper housing 2B where warm and light air gathers can be increased by the radiation fins 41. Therefore, the heat radiation fin 41 can actively exchange heat with the outside to reduce the inside air temperature in the upper housing 2B.
  • the upper housing 2B is connected to the cooling body 3, it is cooled to a constant temperature, and the inside air temperature can be lowered more effectively.
  • the radiating fins 41 are applied as the radiating portions.
  • the present invention is not limited to this, and a plurality of radiating fins are provided on at least one of the inner walls of the lid body 2b and the rectangular cylinder body 2a. You may make it comprise the thermal radiation part which increased the surface area by forming this groove
  • FIG. 13 in the configuration of FIG. 8 in the second embodiment described above, the angle at which hot air conveyed by natural convection from the control circuit board 22 and the power supply circuit board 23 arrives. Except that the heat dissipating fins 42 constituting the heat dissipating portion are arranged on the inner wall of the cylindrical body 2a, the structure is the same as that of FIG. Therefore, in FIG. 13, the same reference numerals are given to portions corresponding to those in FIG. 8, and detailed description thereof is omitted.
  • hot air carried by natural convection from the inclined control circuit board 22 and power supply circuit board 23 built in the inclined housing 2 reaches the highest temperature in the upper housing 2B.
  • the heat radiation fin 42 as a heat radiation part is disposed above the rectangular tube body 2a. For this reason, the surface area of the connection position between the upper casing 2B where the warm and light air gathers by the radiating fins 42 and the rectangular tube 2a can be increased. Accordingly, the heat radiation fin 42 can actively exchange heat with the outside to reduce the inside air temperature in the upper housing 2B.
  • the upper housing 2B is connected to the cooling body 3, it is cooled to a constant temperature, and the inside air temperature can be lowered more effectively.
  • the radiation fin 42 and a cooling body A heat transfer body that forms a heat transfer path independent from the rectangular tube 2 a may be disposed between the heat transfer body 3 and the square tube body 2 a. In this case, since a dedicated heat transfer path is formed with respect to the radiation fins 42, the cooling effect by the radiation fins 42 can be further enhanced.
  • the radiation fin 42 was applied as a thermal radiation part
  • a plurality is provided in at least one of the inner wall of the cover body 2b and the square cylinder body 2a. You may make it comprise the thermal radiation part which increased the surface area by forming this groove
  • the heat dissipation effect of the heat generating circuit components mounted on the control circuit board and the power supply circuit board in the first embodiment described above is further improved. That is, in the sixth embodiment, as shown in FIG. 14, in the configuration of FIG. 2 in the first embodiment described above, the control circuit board 22 is replaced by the heat transfer support member 62 via the heat transfer member 61. I support it.
  • the heat transfer support member 62 includes a heat transfer support plate portion 62a that is in contact with the heat transfer member 61, and a heat transfer support side plate portion 62c that is connected to a connection portion 62b on the right end side of the heat transfer support plate portion 62a. ing.
  • the lower end of the heat transfer support side plate portion 62 c is in contact with the cooling body 3.
  • the heat transfer support member 65 includes a heat transfer support plate portion 65a that is in contact with the heat transfer member 61, and a heat transfer support side plate portion 65c that is connected to a connection portion 65b on the right end side of the heat transfer support plate portion 65a. ing.
  • the lower end of the heat transfer support side plate portion 65 c is in contact with the cooling body 3.
  • the lower ends of the heat transfer support side plates 62 c and 65 c in the heat transfer support members 62 and 65 are integrally connected by a common bottom plate 66.
  • the bottom plate portion 66 is accommodated in a rectangular frame-shaped annular groove 67 formed on the upper surface of the cooling body 3, and is fixed by the fixing screw 14 together with the cooling body 3.
  • the heat transfer members 61 and 64 for example, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber as an elastic body is applied.
  • These heat transfer members 61 and 64 can be compressed to about 5 to 30% in the thickness direction, thereby reducing the thermal resistance and exhibiting an efficient heat transfer effect. For this reason, when the control circuit board 22 sandwiching the heat transfer member 61 and the heat transfer support plate 62a are fixed by the fixing screws 68, the heat transfer member 61 is compressed and fixed at a compression rate of about 5 to 30%. ing. Similarly, when the power supply circuit board 23 sandwiching the heat transfer member 64 and the heat transfer support plate portion 65a are fixed by the fixing screw 69, the heat transfer member 64 is compressed and fixed at a compression rate of about 5 to 30%. ing.
  • the control circuit board 22 and the power supply circuit board 23 on which the heat generating circuit components are mounted are supported by the heat transfer support plates 62a and 65a via the heat transfer members 61 and 64, respectively.
  • the heat support plate portions 62a and 65a are connected to the cooling body 3 via the heat transfer support side plate portions 62c and 65c.
  • the heat generated by the heat generating circuit components mounted on the control circuit board 22 is transferred to the heat transfer support plate 62a via the heat transfer member 61, and the heat transfer support side plate 62c is transferred from the heat transfer support plate 62a.
  • the heat is transferred to the cooling body 3 through the heat to be dissipated.
  • the heat generated by the heat generating circuit components mounted on the power circuit board 23 is transferred to the heat transfer support plate 65a via the heat transfer member 64, and the heat transfer support side plate 65c is transferred from the heat transfer support plate 65a.
  • the heat is transferred to the cooling body 3 through the heat to be dissipated. Therefore, since the heat transfer path independent of the upper casing 2B that radiates heat generated by the heat generating circuit components of the control circuit board 22 and the power circuit board 23 to the cooling body 3 is formed, the control circuit board 22 and the power circuit board The heat of 23 can be efficiently radiated. For this reason, the temperature rise in the upper housing
  • the heat transfer support side plate portions 62c and 65c are integrated by the common bottom plate portion 66, there is no joint between the components between the heat transfer support side plate portions 62c and 65c and the bottom plate portion 66, and the heat resistance is reduced. Can be suppressed. Furthermore, since the heat dissipation path from the control circuit board 22 on which the heat generating circuit components are mounted to the cooling body 3 is independent from the upper casing 2B, it is necessary to use a metal such as aluminum having high thermal conductivity for the upper casing 2B. Since it can be made of a synthetic resin material, the weight can be reduced.
  • the heat dissipation path can be formed by the power converter 1 alone without the heat dissipation path being dependent on the housing 2, the semiconductor power module 11, the drive circuit board 21, and the control circuit board 22 are configured.
  • the power conversion device 1 can be applied to various types of housings 2 and cooling bodies 3.
  • the above-described sixth embodiment is applied to the above-described third embodiment. That is, in the seventh embodiment, as shown in FIG. 15, the control circuit board 22 and the power supply circuit board 23 in the above-described third embodiment are respectively connected to the heat transfer support members via the heat transfer members 61 and 64. 62 and 65 are supported. These heat transfer support members 62 and 65 are heat transfer support plate portions 62 a and 65 a that are in contact with the heat transfer members 61 and 64, and heat transfer support that connects the heat transfer support plate portions 62 a and 65 a and the cooling body 3. Support side plate portions 62c and 65c are provided, and the heat transfer support side plate portions 62c and 65c are connected to each other by a common bottom plate portion 66.
  • heat generated by the heat generating circuit components mounted on the control circuit board 22 and the power supply circuit board 23 is transmitted to the heat transfer support plate portions 62a and 65a via the heat transfer members 61 and 64, and Heat is radiated to the cooling body 3 through the heat transfer support side plate portions 62c and 65c. Therefore, the heat from the control circuit board 22 and the power supply circuit board 23 can be reduced, and the temperature rise in the upper housing 2B can be significantly suppressed.
  • the heat transfer support member of the sixth embodiment described above is applied to the second embodiment described above.
  • the heat transfer support member 62 and the control circuit board 22 and the power supply circuit board 23 are respectively connected via the heat transfer members 61 and 64. It is made to support with 65.
  • These heat transfer support members 62 and 65 are heat transfer support plate portions 62 a and 65 a that are in contact with the heat transfer members 61 and 64, and heat transfer support that connects the heat transfer support plate portions 62 a and 65 a and the cooling body 3.
  • Support side plate portions 62c and 65c are provided, and the heat transfer support side plate portions 62c and 65c are connected to each other by a common bottom plate portion 66.
  • heat generated by the heat generating circuit components mounted on the control circuit board 22 and the power supply circuit board 23 is transmitted to the heat transfer support plate portions 62a and 65a via the heat transfer members 61 and 64, and Heat is radiated to the cooling body 3 through the heat transfer support side plate portions 62c and 65c. Therefore, the heat from the control circuit board 22 and the power supply circuit board 23 can be reduced, and the temperature rise in the upper housing 2B can be significantly suppressed.
  • the entire housing 2 is tilted as in the second and fifth embodiments.
  • the control circuit board 22 and the power circuit board 23 are supported while being inclined, so that natural convection is activated.
  • the heat accumulation can be eliminated and the cooling effect of the control circuit board 22 and the power circuit board 23 can be improved.
  • the ninth embodiment is an improvement of the above-described sixth embodiment. That is, in the ninth embodiment, in the configuration of FIG. 14 in the sixth embodiment described above, the connecting portion 62b is provided at the left end of the heat transfer support plate portion 62a that supports the control circuit board 22 via the heat transfer member 61. The heat transfer support side plate portion 62c is connected to the connecting portion 62b. Further, a connecting portion 65b is formed at the right end of the heat transfer support plate portion 65a that supports the power supply circuit board 23 via the heat transfer member 64, and the heat transfer support side plate portion 65c is connected to the connection portion 65b. Since the ninth embodiment has the same configuration as that of FIG. 14 except for the above configuration, the same reference numerals are given to the corresponding portions to those of FIG. 14, and the detailed description thereof will be omitted.
  • the heat transfer support plate portion 62a that supports the lower control circuit board 22 on which the heat generating circuit components are mounted is connected to the heat transfer support side plate portion 62c at the left end that is the upper end side
  • the heat transfer support plate portion 65a that supports the upper power supply circuit board 23 on which the heat generating circuit components are mounted is connected to the heat transfer support side plate portion 65c at the right end that is the lower end side. For this reason, the left end side between the control circuit board 22 and the power supply circuit board 23 is opened without being blocked by the heat transfer support member 65.
  • the hot air discharged from the control circuit board 22 with a large amount of heat generation can smoothly move to the upper left part of the upper casing 2B. Therefore, air resistance can be reduced while improving the cooling effect of the control circuit board 22 and the power supply circuit board 23, and natural convection can be further activated.
  • the case where the heat transfer support plate portions 62a and 65a and the heat transfer support side plate portions 62c and 65c of the heat transfer support members 62 and 65 are configured separately is described.
  • the present invention is not limited to the above configuration, and the heat transfer support plate portions 62a and 65a and the heat transfer support side plate portions 62c and 65c may be configured integrally as shown in FIG. Good.
  • the heat resistance is reduced and more efficient heat dissipation is performed. Can do.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor is applied. Also good.
  • the case where the power conversion device according to the present invention is applied to an electric vehicle has been described.
  • the present invention is not limited to this, and the present invention is also applied to a rail vehicle traveling on a rail.
  • the invention can be applied and can be applied to any electric drive vehicle.
  • the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • a plurality of mounting boards on which circuit components including a heat generating circuit part are mounted are inclined with respect to a plane orthogonal to the direction of gravity, thereby activating natural convection between the mounting boards and generating heat pools. Therefore, it is possible to provide a power conversion device that can prevent the above.
  • SYMBOLS 1 Power converter device, 2 ... Housing
  • fixing part 31a, 31b ... mounting bracket, 32a, 32b ... fixing bracket, 41, 42 ... radiation fin, 61, 64 ... heat transfer member 62 ... Heat transfer support member, 62a ... Heat transfer support plate portion, 62b ... Connection portion, 62c ... Heat transfer support side plate portion, 65 ... Heat transfer support member, 65a ... Heat transfer support plate portion, 5b ... connecting portion, 65c ... heat transfer support plate portion, 66 ... bottom plate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)

Abstract

L'invention concerne un dispositif de conversion de puissance capable d'empêcher l'occurrence de poches de chaleur par l'activation d'une convexion naturelle entre des substrats montés. Un dispositif de conversion de puissance (1) est pourvu d'un module de puissance à semi-conducteur (11) présentant une surface reliée à un corps de refroidissement (3), et d'une pluralité de substrats montés (22, 23) stratifiés sur l'autre surface dudit module de puissance à semi-conducteur par le biais d'une couche d'air, et sur lesquels sont montés des composants de circuit comprenant un composant de circuit de chauffage (28) destiné à exciter ledit module de puissance à semi-conducteur. Lesdits plusieurs substrats montés sont basculés par rapport à une surface plate perpendiculaire au sens de gravité.
PCT/JP2012/007309 2011-12-13 2012-11-14 Dispositif de conversion de puissance WO2013088642A1 (fr)

Priority Applications (1)

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JP2011272565 2011-12-13
JP2011-272565 2011-12-13

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WO2013088642A1 true WO2013088642A1 (fr) 2013-06-20

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CN104918441A (zh) * 2015-06-25 2015-09-16 苏州市龙源电力科技股份有限公司 一种梯度散热电气控制柜
TWI558075B (zh) * 2015-04-03 2016-11-11 Toshiba Kk Power conversion device
JP2017038454A (ja) * 2015-08-07 2017-02-16 株式会社神戸製鋼所 インバータ装置
CN112601428A (zh) * 2020-12-24 2021-04-02 北京机电工程研究所 一种电驱动与电控制集成装置

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JP6701701B2 (ja) * 2015-12-04 2020-05-27 富士電機株式会社 インバータ装置
FR3074011B1 (fr) * 2017-11-21 2019-12-20 Safran Electronics & Defense Module electrique de puissance
KR102626277B1 (ko) * 2018-02-22 2024-01-17 교세라 에이브이엑스 컴포넌츠 코포레이션 누설이 개선된 슈퍼 커패시터를 포함하는 전기 회로
CN110337217B (zh) * 2019-04-29 2020-10-09 中磊电子（苏州）有限公司 具有倾斜设计的无风扇通信装置

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