WO2014020807A1 - Structure de refroidissement et convertisseur d'énergie - Google Patents

Structure de refroidissement et convertisseur d'énergie Download PDF

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Publication number
WO2014020807A1
WO2014020807A1 PCT/JP2013/003050 JP2013003050W WO2014020807A1 WO 2014020807 A1 WO2014020807 A1 WO 2014020807A1 JP 2013003050 W JP2013003050 W JP 2013003050W WO 2014020807 A1 WO2014020807 A1 WO 2014020807A1
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WO
WIPO (PCT)
Prior art keywords
cooling body
heat
joined
liquid
heat transfer
Prior art date
Application number
PCT/JP2013/003050
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English (en)
Japanese (ja)
Inventor
泰仁 田中
Original Assignee
富士電機株式会社
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Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP2014527955A priority Critical patent/JPWO2014020807A1/ja
Priority to CN201380024911.1A priority patent/CN104303294A/zh
Publication of WO2014020807A1 publication Critical patent/WO2014020807A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device that supports a mounted substrate.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a water cooling jacket through which a coolant passes is disposed in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket.
  • this power converter device is provided with an immersion part that opens on the side to be joined to the power module in the water cooling jacket and allows the coolant to flow, and the liquid contact with the power module that protrudes toward the water cooling jacket and is immersed in the immersion part.
  • a direct cooling system with a part is adopted.
  • a circumferential groove is formed on one of the joint surfaces of the power module and the water cooling jacket, an O-ring is attached to the circumferential groove, and the O-ring is crushed between the joint surfaces to achieve liquid-tight sealing.
  • a structure is provided.
  • the general shape of the circumferential groove is a square shape, but the O-ring may come out of the circumferential groove before the O-rings are crushed between the joining surfaces, which is problematic in terms of assembly efficiency.
  • the present invention has been made paying attention to the above-mentioned unsolved problems of the conventional example, and is intended to reduce the machining cost and improve the assembly efficiency by making the O-ring difficult to come out from the circumferential groove. It is an object of the present invention to provide a cooling structure and a power conversion device that can perform the above.
  • a cooling structure includes a heating element and a cooling body bonded to the heating element, and the cooling body is a side bonded to the heating element.
  • the heating element is provided with a dipping part that is formed to open to the cooling liquid.
  • the liquid-tight sealing part which liquid-tightly seals an immersion part is provided.
  • the power converter device which concerns on 1 aspect of this invention is equipped with the semiconductor power module by which the heat radiating member was formed in one surface, and the cooling body joined to the said heat radiating member,
  • the said cooling body is in the said heat radiating member.
  • An immersion part that is open on the side to be joined and has a immersion liquid flowing therethrough is provided, and the heat radiating member is formed by protruding a liquid contact part that is inserted and arranged in the immersion part on the side to be joined to the cooling body.
  • a liquid-tight sealing part that liquid-tightly seals the immersion part is provided.
  • the heat radiating member is easy to handle at the time of processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. Processing costs are reduced.
  • the power conversion device includes a semiconductor power module having a heat dissipation member formed on one surface, a cooling body bonded to the heat dissipation member, and a circuit component that drives the semiconductor power module.
  • the heat dissipating member includes a protruding liquid contact portion inserted and arranged in the immersion portion on a side to be joined to the cooling body, and a circumferential groove formed so as to surround the opening of the immersion portion and fitted with an O-ring.
  • the heat dissipating member and the cooling body are joined to each other with the heat transfer plate sandwiched between the flat joining surfaces on the outer peripheral side of the circumferential groove, and the cross-sectional diameter of the O-ring is the same as that of the O-ring and the cooling member.
  • the contact surface with the body, the O-ring and the circumferential groove It is greater than the distance between the contact surfaces. According to the power conversion device according to this aspect, the heat dissipating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. The processing cost when forming the groove is reduced.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board.
  • the cooling body is opened to the side to be joined to the heat radiating member, and an immersion portion is formed to immerse the liquid contact portion in a flowing coolant.
  • Part was provided a liquid-tight seal portion for fluid-tight seal from the outside.
  • the heat radiating member is easy to handle at the time of processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. Processing costs are reduced.
  • the power conversion device includes a circumferential groove formed on a side where the liquid-tight sealing portion is joined to the cooling body of the heat radiating member so as to surround an outer side of the immersion portion. And an O-ring mounted on the circumferential groove while being prevented from coming off.
  • the liquid-tight sealing portion can be formed with a simple configuration.
  • the circumferential groove includes a first inclined inner wall extending in an inclined manner from one side in the width direction of the groove bottom to the opening, and a width direction of the groove bottom. It is formed in a dovetail groove shape including a second inclined inner wall that extends from the other side to the opening. According to the power conversion device according to this aspect, the O-ring does not fall out from the dovetail-shaped peripheral groove even when the circumferential groove opening portion to which the O-ring is attached is directed downward, greatly increasing the assembly efficiency of the power conversion device. Can be improved.
  • the circumferential groove has an inclined inner wall that extends from the groove bottom to the opening, and a vertical inner wall that extends vertically from the groove bottom to the opening. It is a one-sided groove shape provided with. According to the power converter according to this aspect, the O-ring does not fall out from the circumferential groove having a single groove even when the circumferential groove opening portion to which the O-ring is attached is directed downward, greatly increasing the assembly efficiency of the power converter. Can be improved.
  • cooling structure and the power conversion device it is possible to reduce the processing cost and improve the assembly efficiency by adopting a structure in which the O-ring does not easily come out from the circumferential groove.
  • FIG. 1 is a cross-sectional view showing the overall configuration of the present invention
  • FIG. 2 is an enlarged view of the main part of FIG.
  • Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • a dipping part 5 In the center of the upper surface of the cooling body 3 is formed a dipping part 5 that opens in a square shape communicating with the water supply port 3a and the drainage port 3b.
  • An O-ring contact portion 8 that protrudes upward from a flat upper surface (reference numeral 3c in FIG. 2) and that contacts an O-ring 7 described later is formed.
  • the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 ⁇ / b> A are inserted vertically.
  • the power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion.
  • the power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13.
  • the liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a. Many cooling fins 17a are immersed in water.
  • a square frame-shaped circumferential groove 18 is formed around the liquid contact portion 17 on the lower surface 13 a of the heat radiating member 13, and an O-ring 19 is attached to the circumferential groove 18.
  • the cross-sectional shape of the circumferential groove 18 includes a first inclined inner wall 18c extending inclined from one side in the width direction of the groove bottom 18a to the opening 18b and the other side in the width direction of the groove bottom 18a. And a second inclined inner wall 18d extending in an inclined manner from the opening 18b to the opening 18b.
  • the cross-sectional diameter of the O-ring 19 is a value larger than the vertical height dimension from the groove bottom 18a of the circumferential groove 18 to the opening 18b.
  • the O-ring 19 has a cross-sectional diameter set to a value larger than the width of the opening 18b, and is mounted inside the dovetail-shaped peripheral groove 18 while being elastically deformed.
  • the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners as viewed from above.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing unit 16.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13.
  • the support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions.
  • the connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions.
  • the heat circuit component 39 is mounted on the lower surface side of the power circuit board 23, and the power circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are stacked by the fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency.
  • the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
  • a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG.
  • three rectangular insertion holes 33i are formed.
  • a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiation member 13 and the fixing member insertion holes 32c1 and 33c1 of the cooling body contact plate portions 32c and 33c, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are brought into contact with the lower surface 13a of the heat radiating member 13 of the power module 11 and the upper surface 3c of the cooling body 3, thereby It is clamped by the body 3 and fixed.
  • a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.
  • one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60.
  • the crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated. Since the member has a small resistance, as shown in FIG. 6, the heat transferred to the heat transfer supporting metal plates 32 and 33 is cooled from the cooling body contact plate portions 32c and 33c that are in direct contact with the upper surface 3c of the cooling body 3. The heat is dissipated by 3 and efficient heat dissipation can be performed.
  • the heating element of the present invention corresponds to the heat radiating member 13.
  • the 0-ring 19 attached to the circumferential groove 18 of the lower surface 13a of the heat radiating member 13 is an O-ring contact portion provided on the periphery of the upper opening of the immersion portion 5 of the cooling body 3. 8 is crushed while being elastically deformed, so that a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3 can be secured, and the highly reliable power conversion device 1 can be provided. .
  • the heat radiating member 13 is easy to handle at the time of processing even when assembled to a processing machine, the processing cost when forming the peripheral groove 18 in the heat radiating member 13 is reduced as compared with the cooling body 3 which is a large and heavy object. Can be achieved.
  • FIG. 7 shows the process of assembling the power module 11 and the cooling body 3, and the heat radiation member 13 of the power module 11 is located at the lower part and is assembled to the cooling body 3 at the lower position.
  • the O-ring 19 mounted while being elastically deformed inside the dovetail-shaped circumferential groove 18 does not fall out of the circumferential groove 18, the crushing operation can be easily performed, and the assembly efficiency of the power conversion device 1 is improved. Can be greatly improved.
  • the O-ring 19 attached to the dovetail-shaped circumferential groove 18 does not fall out of the circumferential groove 18 even when the power module 11 and the cooling body 3 are assembled together from the horizontal direction.
  • the shape of the circumferential groove to which the O-ring 19 is mounted is the dovetail-shaped circumferential groove 18 as shown in FIG. 3, but as shown in FIG. 8, the groove is opened from one side in the width direction of the groove bottom 20a.
  • the inner wall 20c is inclined and extends to the portion 20b, and the vertical inner wall 20d extends vertically from the other widthwise side of the groove bottom 20a to the opening 20b.
  • the O-ring 19 can be held inside the circumferential groove 30 on the inclined inner wall 20c side regardless of the orientation of the heat dissipation member 13.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists. 1 and 2, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
  • the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive
  • the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the cooling structure and the power conversion device according to the present invention are useful for reducing the machining cost and improving the assembly efficiency by making the O-ring difficult to escape from the circumferential groove. .
  • Insertion hole 16 ... Substrate fixing part, 16a ... Female screw part, 17 ... Liquid contact part, 17a DESCRIPTION OF SYMBOLS Cooling fan, 18 ... Circumferential groove of dovetail shape, 18a ... Groove bottom, 18b ... Opening, 18c ... First inclined inner wall, 18d ... Second inclined inner wall, 19 ... O-ring, 20 ... One-side groove shape 20a ... groove bottom, 20b ... opening, 20c ... inclined inner wall, 20d ... vertical inside 21 ... Drive circuit board, 21a ... insertion hole, 22 ... control circuit board, 22a ... insertion hole, 23 ... power supply circuit board, 23a ... insertion hole, 24a ...

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention porte sur un convertisseur d'énergie, lequel convertisseur comporte : un module d'alimentation à semi-conducteurs (11) dans lequel un élément de dissipation de chaleur (13) est formé sur une surface d'un boîtier (12); un corps de refroidissement (3) réuni à l'élément de dissipation de chaleur; des plaques de montage (22, 23) sur lesquelles des composants de circuit comprenant des composants de circuit générant de la chaleur qui attaquent un élément de commutation à semi-conducteurs sont montés; et une tôle métallique supportant un transfert de chaleur (32) qui supporte les plaques de montage à une distance prescrite par rapport au module d'alimentation à semi-conducteurs, et qui vient en contact avec le corps de refroidissement, de telle sorte que la chaleur transmise à partir des plaques de montage jusqu'au corps de refroidissement est dissipée sans passer à travers le boîtier. L'élément de dissipation de chaleur comporte des parties de contact de fluide (17) qui font saillie vers le côté où l'élément de dissipation de chaleur est réuni au corps de refroidissement. Le corps de refroidissement comporte une partie d'immersion (5) qui s'ouvre vers le côté où le corps de refroidissement est réuni à l'élément de dissipation de chaleur et qui immerge les parties de contact de fluide dans un agent de refroidissement s'écoulant à travers le corps de refroidissement. L'élément de dissipation de chaleur comporte des parties d'étanchéité (18, 19) qui scellent hermétiquement la partie d'immersion vis-à-vis de l'extérieur d'une manière étanche.
PCT/JP2013/003050 2012-08-03 2013-05-13 Structure de refroidissement et convertisseur d'énergie WO2014020807A1 (fr)

Priority Applications (2)

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JP2014527955A JPWO2014020807A1 (ja) 2012-08-03 2013-05-13 冷却構造体及び電力変換装置
CN201380024911.1A CN104303294A (zh) 2012-08-03 2013-05-13 冷却构造体和电力转换装置

Applications Claiming Priority (2)

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JP2012173141 2012-08-03
JP2012-173141 2012-08-03

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WO2014020807A1 true WO2014020807A1 (fr) 2014-02-06

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JP6977495B2 (ja) * 2017-11-14 2021-12-08 トヨタ自動車株式会社 電力制御装置とその車載構造

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JP2005033140A (ja) * 2003-07-11 2005-02-03 Nissan Motor Co Ltd 半導体装置
JP2007103413A (ja) * 2005-09-30 2007-04-19 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2009004666A (ja) * 2007-06-25 2009-01-08 Hitachi Ltd パワー半導体モジュールおよびその製造方法

Cited By (3)

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Publication number Priority date Publication date Assignee Title
WO2021140586A1 (fr) * 2020-01-08 2021-07-15 三菱電機株式会社 Dispositif à semi-conducteur et procédé de fabrication de dispositif à semi-conducteur
JPWO2021140586A1 (fr) * 2020-01-08 2021-07-15
JP7241923B2 (ja) 2020-01-08 2023-03-17 三菱電機株式会社 半導体装置および半導体装置の製造方法

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JPWO2014020807A1 (ja) 2016-07-21

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