WO2014125548A1 - Structure de refroidissement et dispositif de conversion de puissance - Google Patents

Structure de refroidissement et dispositif de conversion de puissance Download PDF

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Publication number
WO2014125548A1
WO2014125548A1 PCT/JP2013/007591 JP2013007591W WO2014125548A1 WO 2014125548 A1 WO2014125548 A1 WO 2014125548A1 JP 2013007591 W JP2013007591 W JP 2013007591W WO 2014125548 A1 WO2014125548 A1 WO 2014125548A1
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WO
WIPO (PCT)
Prior art keywords
liquid
heat radiating
cooling body
cooling
heat
Prior art date
Application number
PCT/JP2013/007591
Other languages
English (en)
Japanese (ja)
Inventor
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201380069628.0A priority Critical patent/CN104904008A/zh
Publication of WO2014125548A1 publication Critical patent/WO2014125548A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Definitions

  • the present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device that supports a mounted substrate.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a cooling jacket through which a coolant passes is disposed in a housing, and a power module including an IGBT as a semiconductor switching element for power conversion is disposed on the cooling jacket.
  • the cooling jacket of this power converter is provided with an immersion part that opens on the side to be joined to the power module and allows the coolant to flow.
  • the power module protrudes toward the water cooling jacket and is immersed in the immersion part.
  • This direct cooling type power converter has a circumferential groove formed on one of the joint surfaces of the power module and the water cooling jacket, and an O-ring is attached to the circumferential groove, and the O-ring is crushed between the joint surfaces to provide a liquid-tight seal. It has a structure.
  • the operation for forming the circumferential groove for mounting the O-ring on the joint surface of the cooling jacket is difficult to handle when assembling the cooling jacket, which is a large heavy object, to the processing machine. Cost may increase.
  • the O-ring attached to the circumferential groove may come out of the circumferential groove before being crushed by the joint surface of the power module and the water cooling jacket, which causes a problem in terms of assembly efficiency.
  • the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and provides a cooling structure and a power conversion device capable of reducing processing costs and improving assembly efficiency. It is an object.
  • a cooling structure includes a heating element having a heat dissipation member formed on one surface thereof, and a cooling body joined to the heat dissipation member.
  • the cooling fluid passage through which the liquid flows is formed to open on the side joined to the heat radiator, and the heat radiation member is formed on the side joined to the cooling body with the liquid contact portion inserted and disposed in the cooling fluid passage protruding and cooled.
  • a liquid-tight sealing member that liquid-tightly seals the liquid passage is disposed. The liquid-tight sealing member engages with a seal portion that is in close contact between the cooling body and the heat radiating member, and an outer surface of the heat radiating member.
  • the cooling body which has a positioning part for positioning and the sealing part of the liquid-tight sealing member and the sealing surface of the heat radiating member are formed on a flat surface. According to the cooling structure according to one aspect of the present invention, it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing liquid tightness to the cooling body or the heat radiating member.
  • the liquid-tight sealing can be performed while achieving the reduction, and since the positioning part of the seal part is provided in the liquid-tight sealing member, the seal part can be prevented from moving from the seal surface.
  • the cooling structure includes a heating element and a heat radiating member formed on one surface of the heating element, and the heat radiating member has an opening in a coolant passage through which the coolant flows.
  • a sealing member that closes the coolant passage is joined to the heat dissipation member, and a liquid-tight sealing member that liquid-tightly seals the coolant passage is disposed, and the liquid-tight sealing member includes the heat dissipation member and the closing member.
  • a sealing part closely contacting between the sealing member and a positioning part engaging the outer surface of the heat radiating member to position the sealing part; It is formed on a flat surface.
  • the cooling structure it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing the liquid tightness to the heat radiating member or the closing member.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power converter device which concerns on 1 aspect of this invention is equipped with the semiconductor power module by which the heat radiating member was formed in the one surface, and the cooling body joined to a heat radiating member, and a cooling body flows a cooling fluid.
  • the coolant passage is formed to open on the side that joins the radiator, and the heat dissipation member is formed on the side that joins the coolant to protrude the liquid contact portion that is inserted into the coolant passage, and the coolant passage is liquid-tight
  • a liquid-tight sealing member is disposed, and the liquid-tight sealing member includes a seal portion that is in close contact between the cooling body and the heat radiating member, and a positioning portion that is engaged with the outer surface of the heat radiating member to position the seal portion.
  • the cooling body to which the seal portion of the liquid-tight sealing member is in close contact and the sealing surface of the heat dissipation member are formed on a flat surface.
  • the power conversion device it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing liquid tightness to the cooling body or the heat radiating member.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power converter device which concerns on 1 aspect of this invention has a semiconductor power module and the heat radiating member formed in one surface of this semiconductor power module, and a heat radiating member is a cooling fluid channel
  • a sealing part closely contacting between the closing member and a positioning part engaging the outer surface of the heat radiating member to position the sealing part;
  • the sealing surface is formed on a flat surface.
  • the power conversion device it is only necessary to form a flat sealing surface without providing a circumferential groove for sealing the liquid tightness to the heat dissipating member or the closing member, thereby reducing processing costs.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation device is joined to the power dissipation apparatus.
  • a cooling substrate, a mounting substrate on which circuit components including a heat generating circuit component for driving a semiconductor switching element are mounted, and the mounting substrate are supported at a predetermined interval between the semiconductor power module and the heat generation of the mounting substrate is cooled.
  • a heat transfer support metal plate that contacts the cooling body so as to dissipate heat without passing through the housing, and the cooling body opens to a side where a cooling fluid passage through which the cooling liquid flows is joined to the radiator.
  • the heat dissipating member is formed by protruding a liquid contact portion inserted and arranged in the coolant passage on the side joined to the cooling body, and a liquid tight seal member for liquid tightly sealing the coolant passage is disposed.
  • Sealing member A cooling body having a seal part closely contacting between the cooling body and the heat radiating member, and a positioning part engaging the outer surface of the heat radiating member to position the seal part, wherein the seal part of the liquid-tight sealing member is in close contact And the sealing surface of the heat radiating member is formed in the flat surface.
  • the power conversion device it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing liquid tightness to the cooling body or the heat radiating member.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body.
  • a cooling liquid passage through which the cooling liquid flows is formed to be open, a closing member for closing the cooling liquid path is joined to the heat radiating member, and a liquid-tight sealing member for liquid-tightly sealing the cooling liquid path is disposed,
  • the liquid-tight sealing member has a seal portion that is in close contact between the heat-dissipating member and the closing member, and a positioning portion that engages with the outer surface of the heat-dissipating member to position the seal portion.
  • the sealing surfaces of the heat dissipating member and the closing member that are in close contact with each other are formed flat. According to the power conversion device according to one aspect of the present invention, it is only necessary to form a flat sealing surface without providing a circumferential groove for sealing the liquid tightness to the heat dissipating member or the closing member, thereby reducing processing costs.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • a liquid seal convex portion that extends in an endless annular shape so as to surround the opening of the coolant passage is formed in the seal portion and protrudes in the thickness direction of the seal plate portion. Has been. According to the power conversion device according to one aspect of the present invention, the liquid seal convex portion of the seal portion interposed between the two seal surfaces is crushed to sufficiently secure the liquid tight seal of the coolant passage. Can do.
  • the liquid-tight sealing member is a metal packing formed by die-drawing a metal plate material, and the positioning portion is sealed from the outer peripheral edge portion of the plate-like seal portion.
  • a plate-like engagement piece that extends in a direction perpendicular to the portion and engages the outer surface of the heat dissipation member.
  • a cooling structure includes a heating element having a heat radiating member formed on one surface thereof, and a cooling body joined to the heat radiating member.
  • the liquid passage is formed to open on the side to be joined to the radiator, and the heat radiation member is formed on the side to be joined to the cooling body by protruding a liquid contact portion that is inserted into the coolant passage, and the coolant passage is liquid-tightly sealed.
  • the liquid-tight sealing member is arranged, and the liquid-tight sealing member is engaged with a seal portion that is in close contact between the cooling body and the heat radiating member, and an opening portion of a cooling liquid passage provided in the cooling body.
  • the cooling body to which the sealing portion of the liquid-tight sealing member is in close contact and the sealing surface of the heat radiating member are formed on a flat surface. According to the cooling structure according to one aspect of the present invention, it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing liquid tightness to the cooling body or the heat radiating member.
  • the liquid-tight sealing can be performed while achieving the reduction, and since the positioning part of the seal part is provided in the liquid-tight sealing member, the seal part can be prevented from moving from the seal surface.
  • the cooling structure includes a heating element and a heat radiating member formed on one surface of the heating element, and the heat radiating member has an opening in a coolant passage through which the coolant flows.
  • a sealing member that closes the coolant passage is joined to the heat dissipation member, and a liquid-tight sealing member that liquid-tightly seals the coolant passage is disposed, and the liquid-tight sealing member includes the heat dissipation member and the closing member.
  • a heat-dissipating member having a sealing part closely contacting between the liquid-tight sealing member and a positioning part engaging with an opening of a coolant passage provided in the heat-dissipating member to position the sealing part
  • the sealing surface of the closing member is formed as a flat surface.
  • the cooling structure it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing the liquid tightness to the heat radiating member or the closing member.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power converter device which concerns on 1 aspect of this invention is equipped with the semiconductor power module by which the heat radiating member was formed in the one surface, and the cooling body joined to a heat radiating member, and a cooling body flows a cooling fluid.
  • the coolant passage is formed to open on the side that joins the radiator, and the heat dissipation member is formed on the side that joins the coolant to protrude the liquid contact portion that is inserted into the coolant passage, and the coolant passage is liquid-tight
  • a liquid-tight sealing member is disposed, and the liquid-tight sealing member engages and seals with a seal portion that is in close contact between the cooling body and the heat radiating member and an opening portion of a coolant passage provided in the cooling body.
  • the cooling body to which the seal portion of the liquid-tight sealing member is in close contact and the sealing surface of the heat dissipation member are formed on a flat surface.
  • the power conversion device it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing liquid tightness to the cooling body or the heat radiating member.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power converter device which concerns on 1 aspect of this invention has a semiconductor power module and the heat radiating member formed in one surface of this semiconductor power module, and a heat radiating member is a cooling fluid channel
  • the sealing surfaces of the heat dissipating member and the closing member are formed as flat surfaces.
  • the power conversion device it is only necessary to form a flat sealing surface without providing a circumferential groove for sealing the liquid tightness to the heat dissipating member or the closing member, thereby reducing processing costs.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation device is joined to the power dissipation apparatus.
  • a cooling substrate, a mounting substrate on which circuit components including a heating circuit component for driving the semiconductor switching element are mounted, and the mounting substrate are supported at a predetermined interval between the semiconductor power module, and the mounting substrate generates heat.
  • a heat transfer support metal plate that is brought into contact with the cooling body so as to dissipate heat without passing through the casing, and the cooling body is disposed on a side where the cooling liquid passage through which the cooling liquid flows joins the heat dissipation body.
  • the heat dissipation member is formed with a liquid contact portion inserted into the coolant passage projecting on the side where the heat dissipation member is joined to the cooling body, and a liquid tight seal member for fluid tightly sealing the coolant passage is disposed.
  • the hermetic seal member has a seal portion that is in close contact between the cooling body and the heat dissipation member, and a positioning portion that engages with an opening of a coolant passage provided in the cooling body to position the seal portion, and is liquid-tight
  • the cooling body to which the sealing portion of the stop member is in close contact and the sealing surface of the heat radiating member are formed as flat surfaces.
  • the power conversion device it is only necessary to form a flat sealing surface without providing a peripheral groove for sealing liquid tightness to the cooling body or the heat radiating member.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body.
  • a cooling liquid passage through which the cooling liquid flows is formed to be open, a closing member for closing the cooling liquid path is joined to the heat radiating member, and a liquid-tight sealing member for liquid-tightly sealing the cooling liquid path is disposed,
  • the liquid-tight sealing member has a seal portion that is in close contact between the heat dissipation member and the closing member, and a positioning portion that engages with an opening of a coolant passage provided in the heat dissipation member to position the seal portion.
  • the heat dissipating member and the sealing surface of the closing member to which the seal portion of the liquid-tight sealing member is in close contact are formed on a flat surface.
  • the power conversion device it is only necessary to form a flat sealing surface without providing a circumferential groove for sealing the liquid tightness to the heat dissipating member or the closing member, thereby reducing processing costs.
  • the liquid-tight seal can be performed while the liquid-tight seal member is provided, and the positioning portion of the seal portion is provided in the liquid-tight seal member, so that the seal portion can be prevented from moving from the seal surface to improve assembly efficiency. Can do.
  • a liquid seal convex portion that extends in an endless annular shape so as to surround the opening of the coolant passage is formed in the seal portion and protrudes in the thickness direction of the seal plate portion. Has been. According to the power conversion device according to one aspect of the present invention, the liquid seal convex portion of the seal portion interposed between the two seal surfaces is crushed to sufficiently secure the liquid tight seal of the coolant passage. Can do.
  • the liquid-tight sealing member is a metal packing formed by die-drawing a metal plate material, and the positioning portion is sealed from the outer peripheral edge of the plate-like seal portion.
  • a plate-like engagement piece that extends in a direction orthogonal to the portion and engages with the opening of the coolant passage.
  • the cooling structure and the power conversion device it is only necessary to form the sealing surface that closely contacts the liquid-tight sealing member as a flat surface, so that the processing cost can be reduced and the liquid-tight sealing member can be reduced. Since the positioning portion of the seal portion is provided in the seal portion, the assembly portion can be improved by preventing the seal portion from moving from the seal surface.
  • FIG.4 (a) is a top view of a liquid-tight sealing member
  • FIG.4 (b) is A of FIG.4 (a) figure.
  • FIG.12 (a) is a top view of a liquid-tight sealing member
  • FIG.12 (b) is A of Fig.12 (a) figure FIG.
  • FIG. It is the figure which positioned and arrange
  • FIG.12 (a) figure FIG.
  • FIG.12 (a) figure FIG.
  • FIG.12 (a) It is the figure which positioned and arrange
  • 3rd Embodiment which concerns on this invention.
  • FIG. 1 to 5 show a power conversion apparatus according to a first embodiment of the present invention.
  • the power conversion device 1 according to the present embodiment is housed in a housing 2, and the housing 2 sandwiches a cooling body 3 formed of a synthetic resin material and having a water cooling jacket configuration.
  • the upper casing 2B is divided into a lower casing 2A and an upper casing 2B.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity, the upper surface is a flat surface, and the cooling water supply port 3 a and the drain port 3 b are located outside the housing 2. It is open.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • a dipping portion 5 In the center of the upper surface of the cooling body 3, there is formed a dipping portion 5 that communicates with the water supply port 3a and the drainage port 3b and opens in a rectangular shape.
  • a sealing surface 6 is formed.
  • the cooling body 3 is formed with an insertion hole 3e through which the positive and negative electrodes 4a covered with insulation of the film capacitor 4 held in the lower housing 2A are vertically inserted.
  • a power module 11 is joined to the upper portion of the cooling body 3 with a metal packing 7 interposed.
  • the power module 11 includes, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion, and incorporates an IGBT in a rectangular parallelepiped insulating case body 12.
  • IGBT insulated gate bipolar transistor
  • a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13, and the heat radiating member 13 is cooled by the cooling body 3 by a direct cooling method. . As shown in FIGS.
  • the liquid contact portion 17 is composed of a large number of cooling fins 17 a that protrude from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other.
  • a large number of cooling fins 17 a are immersed in the cooling water that has flowed into the immersion part 5.
  • a flat heat dissipating member-side seal surface 13a that abuts against 7b is formed.
  • the metal packing 7 is a member formed by die-drawing a metal plate material, and surrounds a rectangular opening 7a that opens substantially in the same shape as the upper surface opening of the immersion part 5 of the cooling body 3, as shown in FIG.
  • the metal packing 7 is arranged so that all the long side outer engagement pieces 7 d and the short side outer engagement pieces 7 e are engaged with the outer surface of the heat radiating member 13.
  • the screw through hole 7f corresponds to the insertion hole 15 provided in the module 11 (heat dissipating member 13), and the rectangular frame-shaped seal plate portion 7b surrounds the liquid contact portion 17 of the heat dissipating member 13, while the heat dissipating member 13 It is in contact with the flat heat radiating member side sealing surface 13 a and is positioned and disposed on the heat radiating member 13.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13, and the fixing screw 14 is screwed into the female screw 10 formed in the cooling body 3, whereby the heat radiating member 13 is cooled to the cooling body 3.
  • the case body 12 and the heat dissipation member 13 of the power module 11 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from the plane.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing unit 16.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heat generating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the drive circuit board 21 is fixed. Yes.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the power supply circuit board 23 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 16 a formed on the upper surface of the board fixing part 16. It is fixed by being screwed onto.
  • the power supply circuit board 23 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and the male screw portion 25a is inserted into the joint screw 24. It is fixed by being screwed into the female screw portion 24b.
  • the control circuit board 22 inserts a fixing screw 26 into an insertion hole 23 a formed at a position opposite to the female screw portion 25 b formed at the upper end of the joint screw 25, and the fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by being screwed onto.
  • control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 includes a heat transfer support plate portion 32a on a flat plate and a fixing screw 32b on the right end side of the heat transfer support plate portion 32a along the long side of the power module 11. And a fixed heat transfer support side plate 32c.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support side plate portion 32c is bent to the left from the upper end of the connection plate portion 32d on the right end side along the long side of the power module 11 and the upper end of the connection plate portion 32d, and is transferred by the fixing screw 32b.
  • the upper plate portion 32e is connected to the heat support plate portion 32a, and the lower plate portion 32f is bent to the right from the lower end of the connection plate portion 32d.
  • An insertion hole 32g through which the fixing screw 34 is inserted is formed in the lower plate portion 32f of the heat transfer support side plate portion 32c.
  • the heat transfer support metal plate 33 includes a heat transfer support plate portion 33a on a flat plate, and a heat transfer support side plate fixed to the left end along the long side of the power module 11 of the heat transfer support plate portion 33a by a fixing screw 33b. Part 33c.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • the heat transfer support side plate portion 33c is bent to the right from the upper end of the connection plate portion 33d and the connection plate portion 33d extending in the vertical direction on the left end side along the long side of the power module 11, and transferred by the fixing screw 33b.
  • the upper plate portion 33e is connected to the heat support plate portion 33a, and the lower plate portion 33f is bent leftward from the lower end of the connection plate portion 33d.
  • An insertion hole 33g through which the fixing screw 34 is inserted is formed in the lower plate portion 33f of the heat transfer support side plate portion 33c.
  • the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 37, and the heat transfer support plate portion 33 a are stacked by the fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance.
  • these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component 39 mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37.
  • the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess and deficiency, and the contact between the heat transfer member 37 and the control circuit board 22 and the heat transfer support plate portion 33a is performed satisfactorily.
  • the thermal resistance between the member 37 and the control circuit board 22 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 35, and the heat transfer support plate portion 32a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35.
  • the contact between the power circuit board 23 and the heat transfer member 35 is performed without excess and deficiency, and the contact between the heat transfer member 35 and the power circuit board 23 and the heat transfer support plate portion 32a is satisfactorily performed.
  • the thermal resistance between the member 35 and the power supply circuit board 23 and the heat transfer support plate portion 32a can be reduced.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3. Further, a plurality of male screw portions 3d are formed on the outer peripheral side plane 3c on the upper surface of the cooling body 3, and through these insertion holes 32g formed in the lower plate portion 32f of the heat transfer supporting metal plate 32, the heat transfer supporting metal plate 3d is transmitted. The insertion hole 33g formed in the lower plate portion 33f of the heat-supporting metal plate 33 is made to correspond. Then, the fixing screw 34 inserted through the insertion holes 32g, 33g is screwed into the male screw portion 3d of the outer peripheral side plane 3c. Thus, the heat transfer support metal plates 32 and 33 are fixed to the cooling body 3 in a state where the lower plate portions 32f and 33f of the heat transfer support metal plates 32 and 33 are in contact with the outer peripheral side plane 3c by surface bonding.
  • the bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 at 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 55 are fixed screws 51. It is connected with. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11. Further, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • control circuit and the power circuit mounted on the control circuit board 22 and the power circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat.
  • the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of the heat transfer support metal plates 32 and 33 are provided via heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transmitted to the heat transfer support metal plates 32 and 33 is radiated to the cooling body 3 from the lower plate portions 32f and 33f that are in direct surface contact with the outer peripheral side plane 3c on the upper surface of the cooling body 3, and is supported by the heat transfer. Efficient heat dissipation of the metal plates 32 and 33 is performed.
  • the heating element according to the present invention corresponds to the power module 11
  • the semiconductor power module according to the present invention corresponds to the power module 11
  • the coolant passage according to the present invention corresponds to the immersion part 5.
  • the sealing surface of the cooling body corresponds to the cooling body side sealing surface 6, the sealing surface of the heat radiating member according to the present invention corresponds to the heat radiating member side sealing surface 13 a, and the liquid-tight sealing member according to the present invention corresponds to the metal packing 7.
  • the engagement piece according to the present invention corresponds to the long side outer engagement piece 7d and the short side outer engagement piece 7e, and the seal portion according to the present invention corresponds to the seal plate part 7b.
  • the effect of the power converter of this embodiment is demonstrated.
  • the liquid contact portion 17 provided at the center of the lower surface of the heat dissipation member 13 of the power module 11 is immersed in the cooling unit 3. Since it enters and is immersed in the cooling liquid and directly cooled, the power module 11 can be efficiently cooled.
  • the lower plate portions 32 f and 33 f of the heat transfer supporting metal plates 32 and 33 are directly surface-bonded to the outer peripheral side plane 3 c on the upper surface of the cooling body 3, the heat transfer is supported from the control circuit board 22 and the power supply circuit board 23.
  • the heat transmitted to the heat-supporting metal plates 32 and 33 is radiated from the lower plate portions 32f and 33f to the cooling body 3, so that efficient heat radiation can be performed.
  • the sealing plate portion 7b of the metal packing 7 is sandwiched between the cooling body side sealing surface 6 of the cooling body 3 and the heat radiating member side sealing surface 13a of the heat radiating member 13, and is a liquid seal convex portion formed on the sealing plate portion 7b. 7c is crushed by the cooling body side sealing surface 6 and the heat radiating member side sealing surface 13a, so that a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3 can be secured, and highly reliable power conversion.
  • a device 1 can be provided.
  • the cooling body 3 of a large and heavy object that is difficult to assemble to a processing machine is not formed with a circumferential groove or the like for mounting an O-ring, but only a flat cooling body side sealing surface 6 is formed. Can be reduced.
  • the long side outer engagement piece 7 d of the metal packing 7 is engaged with the outer side surface of the heat dissipation member 13 in the longitudinal direction
  • the short side outer engagement piece 7 e is engaged with the outer side surface of the heat dissipation member 13 in the short direction.
  • a liquid-tight sealing structure can be obtained with the metal packing 7 formed by die-drawing a metal plate material, and the long side outer engagement piece 7d and the short side for positioning the seal plate portion 7 with a simple configuration. Since the outer engagement piece 7e can be formed, the processing cost of the liquid-tight sealing structure can be reduced.
  • FIGS. 6 to 8 show a main part of the power conversion device according to the second embodiment of the present invention.
  • the same components as those shown in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted.
  • a radiating member 70 made of copper having a rectangular parallelepiped shape with high thermal conductivity is integrally provided on the lower surface of the case body 12.
  • a closing member 71 is fixed to the lower surface.
  • the heat radiating member 70 is formed with a cooling chamber 70a that opens in a rectangular shape at the center of the lower surface of the heat radiating member 70, and the water supply of a water supply path 70b formed inside the heat radiating member 70 on one wall portion in the longitudinal direction of the cooling chamber 70a.
  • a mouth is opened, and a drainage port of a drainage channel 70c formed inside the heat radiating member 70 is opened on the other wall portion in the longitudinal direction of the cooling chamber 70a.
  • the water supply channel 70b and the drainage channel 70c are connected to a cooling water supply source (not shown) via a flexible hose, for example.
  • the closing member 71 is a member that closes the open upper portion of the lower housing 2A in which the smoothing film capacitor 4 is housed, like the cooling body 3 of the first embodiment.
  • aluminum having a high thermal conductivity It is formed by injection molding of an aluminum alloy.
  • a metal is provided between the heat radiating member side seal surface 70 f of the heat radiating member 70 and the upper surface of the closing member 71.
  • a seal plate portion 7b of the packing 7 is interposed.
  • the metal packing 7 is the same as the structure shown in FIG. 4 of the first embodiment.
  • the upper surface where the sealing plate portion 7b of the metal packing 7 of the closing member 71 is in surface contact is formed as a flat closing member side sealing surface 71a.
  • the heat dissipating member 70 is arranged so that the flat heat dissipating member side seal surface 70f faces upward, and the long side outer engaging piece 7d and the short side outer engaging piece 7e are engaged with the outer surface of the heat dissipating member 70.
  • the metal packing 7 is disposed. Accordingly, the screw through hole 7f corresponds to the insertion hole 15 provided in the heat radiating member 70, the square frame-shaped seal plate portion 7b contacts the heat radiating member side seal surface 70f, and the metal packing 7 is positioned on the heat radiating member 70. To be placed.
  • the fixing screw 14 is inserted into the insertion hole 15 formed in the case body 12 and the heat radiating member 70 from below, and the fixing screw 14 is screwed into the female screw portion 71 b formed in the closing member 71 to close the heat radiating member 70.
  • the member 71 is fixed.
  • the liquid seal convex portion 7c formed on the seal plate portion 7b of the metal packing 7 is sandwiched between the heat radiating member side sealing surface 70f of the heat radiating member 70 and the closing member side sealing surface 71a of the closing member 71 and is crushed and cooled. Liquid-tight sealing is performed to prevent the cooling water accumulated in the chamber 70a from leaking outside.
  • the heating element according to the present invention corresponds to the power module 11
  • the semiconductor power module according to the present invention corresponds to the power module 11
  • the coolant passage according to the present invention corresponds to the cooling chamber 70a.
  • the sealing surface of the heat radiating member corresponds to the heat radiating member side sealing surface 70f
  • the sealing surface of the closing member according to the present invention corresponds to the closing member side sealing surface 71a
  • the liquid tight sealing member according to the present invention corresponds to the metal packing 7.
  • the engagement piece of the metal packing according to the present invention corresponds to the long side outer engagement piece 7d and the short side outer engagement piece 7e
  • the seal portion according to the present invention corresponds to the seal plate portion 7b.
  • the effect of the power converter device of this embodiment is demonstrated.
  • the coolant flows into the cooling chamber 70a provided at the center of the lower surface of the heat dissipation member 70 of the power module 11, and directly cools the heat dissipation member 70. Therefore, the power module 11 can be efficiently cooled.
  • the heat transfer support metal plates 32 and 33 are directly surface-bonded to the upper surface of the closing member 71, the heat transfer support metal plates are supplied from the control circuit board 22 and the power supply circuit board 23. The heat transmitted to 32 and 33 is radiated from the lower plate portions 32f and 33f to the closing member 71, so that efficient heat radiation can be performed.
  • the sealing plate portion 7b of the metal packing 7 is sandwiched between the heat radiating member side sealing surface 70f of the heat radiating member 70 and the closing member side sealing surface 71a of the closing member 71, and is formed on the sealing plate portion 7b.
  • the portion 7c is crushed by the heat radiating member side sealing surface 70f and the closing member side sealing surface 71a, so that a reliable liquid-tight sealing of the cooling water accumulated in the cooling chamber 70a can be secured, and the highly reliable power conversion device 1 Can be provided.
  • the peripheral groove for mounting the O-ring is not formed on both the heat radiating member 70 and the closing member 71, and only the flat heat radiating member side sealing surface 70f and the closing member side sealing surface 71a are formed. Can be reduced.
  • the long side outer engagement piece 7 d of the metal packing 7 is engaged with the outer side surface of the long side of the heat radiating member 70, and the short side outer engagement piece 7 e of the metal packing 7 is connected to the outer side surface of the short side of the heat radiating member 70.
  • the metal packing 7 is prevented from being detached from the heat radiating member 70, and the assembly efficiency can be improved.
  • the metal packing 7 is a member formed by die-drawing a metal plate material, the manufacturing cost of the metal packing 7 can be reduced.
  • FIG. 9 to 14 show a power converter according to a third embodiment of the present invention.
  • symbol is attached
  • a metal packing 8 is disposed on the upper surface of the cooling body 3.
  • the metal packing 8 is a member formed by die-drawing a metal plate material. As shown in FIG. 12A, a rectangular opening 8a having substantially the same shape as the upper surface opening of the immersion part 5 of the cooling body 3 is used.
  • a rectangular frame-shaped sealing plate portion 8b formed so as to surround the end plate, and an endless annular liquid-sealing convex portion 8c that is continuously formed on the entire circumference of the sealing plate portion 8b and protrudes in a curved shape in one of the plate thickness directions.
  • a plurality of long-side inner engagement pieces 8 d extending in a direction orthogonal to the surface direction of the seal plate portion 8 b from the side edge of the long side opening 8 a of the seal plate portion 8 b, and the seal plate portion 8 b
  • a plurality of short side inner engagement pieces 8e extending from the side edge of the short side opening 8a in the direction orthogonal to the surface direction of the seal plate portion 8b in the same direction as the long side inner engagement piece 8d.
  • the metal packing 8 has a rectangular shape by engaging all the long side inner engagement pieces 8 d and the short side inner engagement pieces 8 e with the upper surface opening of the immersion part 5 of the cooling body 3.
  • the frame-shaped seal plate portion 8 b is positioned on the cooling body 3 in a state where the frame-shaped seal plate portion 8 b is in contact with the flat cooling body side sealing surface 6 on the periphery of the immersion portion 5.
  • a power module 11 is joined to the upper part of the cooling body 3.
  • the power module 11 includes, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion, and incorporates an IGBT in a rectangular parallelepiped insulating case body 12.
  • IGBT insulated gate bipolar transistor
  • a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13, and the heat radiating member 13 is cooled by the cooling body 3 by a direct cooling method. .
  • the liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling water flowing into the immersion part 5 from the water supply port 3a. In addition, a large number of cooling fins 17a are immersed.
  • a side seal surface 13a is formed.
  • the case body 12 and the heat radiating member 13 of the power module 11 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from the plane.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing unit 16.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heat generating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the drive circuit board 21 is fixed.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the power supply circuit board 23 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 16 a formed on the upper surface of the board fixing part 16. It is fixed by being screwed onto.
  • the power supply circuit board 23 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and the male screw portion 25a is inserted into the joint screw 24. It is fixed by being screwed into the female screw portion 24b.
  • the control circuit board 22 inserts a fixing screw 26 into an insertion hole 23 a formed at a position opposite to the female screw portion 25 b formed at the upper end of the joint screw 25, and the fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by being screwed onto.
  • control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 has a heat transfer support plate portion 32a on a flat plate and a fixing screw 32b on the right end side along the long side of the power module 11 of the heat transfer support plate portion 32a. And a fixed heat transfer support side plate 32c.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support side plate portion 32c is bent to the left from the upper end of the connection plate portion 32d on the right end side along the long side of the power module 11 and the upper end of the connection plate portion 32d, and is transferred by the fixing screw 32b.
  • the upper plate portion 32e is connected to the heat support plate portion 32a, and the lower plate portion 32f is bent to the right from the lower end of the connection plate portion 32d.
  • An insertion hole 32g through which the fixing screw 34 is inserted is formed in the lower plate portion 32f of the heat transfer support side plate portion 32c.
  • the heat transfer support metal plate 33 includes a heat transfer support plate portion 33a on a flat plate, and a heat transfer support side plate fixed to the left end along the long side of the power module 11 of the heat transfer support plate portion 33a by a fixing screw 33b. Part 33c.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • the heat transfer support side plate portion 33c is bent to the right from the upper end of the connection plate portion 33d and the connection plate portion 33d extending in the vertical direction on the left end side along the long side of the power module 11, and transferred by the fixing screw 33b.
  • the upper plate portion 33e is connected to the heat support plate portion 33a, and the lower plate portion 33f is bent leftward from the lower end of the connection plate portion 33d.
  • An insertion hole 33g through which the fixing screw 34 is inserted is formed in the lower plate portion 33f of the heat transfer support side plate portion 33c.
  • the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 37, and the heat transfer support plate portion 33 a are stacked by the fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component 39 mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess and deficiency, and the contact between the heat transfer member 37 and the control circuit board 22 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the control circuit board 22 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 35, and the heat transfer support plate portion 32a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35.
  • the contact between the power circuit board 23 and the heat transfer member 35 is performed without excess and deficiency, and the contact between the heat transfer member 35 and the power circuit board 23 and the heat transfer support plate portion 32a is satisfactorily performed.
  • the thermal resistance between the member 35 and the power supply circuit board 23 and the heat transfer support plate portion 32a can be reduced.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3. Further, a plurality of male screw portions 3d are formed on the outer peripheral side plane 3c on the upper surface of the cooling body 3, and through these insertion holes 32g formed in the lower plate portion 32f of the heat transfer supporting metal plate 32, the heat transfer supporting metal plate 3d is transmitted. The insertion hole 33g formed in the lower plate portion 33f of the heat-supporting metal plate 33 is made to correspond. Then, the fixing screw 34 inserted through the insertion holes 32g, 33g is screwed into the male screw portion 3d of the outer peripheral side plane 3c.
  • the heat radiation member 13 is fixed to the cooling body 3, and the liquid seal projection 8 c formed on the seal plate portion 8 b of the metal packing 8 disposed around the immersion portion 5 of the cooling body 3 is the cooling body side sealing surface. 6 and the heat radiating member side seal surface 13a are crushed and crushed, and a liquid-tight seal is provided to prevent the coolant accumulated in the immersion part 5 of the cooling body 3 from leaking to the outside, and the seal plate part 8b is cooled.
  • the power module 11 is fixed to the cooling body 3 in a state in which the body-side sealing surface 6 and the heat radiation member-side sealing surface 13a are in contact with each other by surface bonding. Further, the heat transfer support metal plates 32 and 33 are fixed to the cooling body 3 in a state where the lower plate portions 32f and 33f of the heat transfer support metal plates 32 and 33 are in contact with the outer peripheral side plane 3c by surface bonding. .
  • the bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 at 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 55 are fixed screws 51. It is connected with. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11. Further, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • control circuit and the power circuit mounted on the control circuit board 22 and the power circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat.
  • the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of the heat transfer support metal plates 32 and 33 are provided via heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transmitted to the heat transfer support metal plates 32 and 33 is radiated to the cooling body 3 from the lower plate portions 32f and 33f that are in direct surface contact with the outer peripheral side plane 3c on the upper surface of the cooling body 3, and is supported by the heat transfer. Efficient heat dissipation of the metal plates 32 and 33 is performed.
  • the heating element according to the present invention corresponds to the power module 11
  • the semiconductor power module according to the present invention corresponds to the power module 11
  • the coolant passage according to the present invention corresponds to the immersion part 5.
  • the sealing surface of the cooling body corresponds to the cooling body side sealing surface 6
  • the sealing surface of the heat radiating member according to the present invention corresponds to the heat radiating member side sealing surface 13 a
  • the liquid-tight sealing member according to the present invention corresponds to the metal packing 8.
  • the engagement piece according to the present invention corresponds to the long side inner engagement piece 8d and the short side inner engagement piece 8e
  • the seal portion according to the present invention corresponds to the seal plate part 8b.
  • the effect of the power converter device of this embodiment is demonstrated.
  • the liquid contact portion 17 provided in the center of the lower surface of the heat dissipation member 13 of the power module 11 is immersed in the cooling unit 3. Since it enters and is immersed in the cooling liquid and directly cooled, the power module 11 can be efficiently cooled.
  • the lower plate portions 32 f and 33 f of the heat transfer supporting metal plates 32 and 33 are directly surface-bonded to the outer peripheral side plane 3 c on the upper surface of the cooling body 3, the heat transfer is supported from the control circuit board 22 and the power supply circuit board 23. The heat transmitted to the heat-supporting metal plates 32 and 33 is radiated from the lower plate portions 32f and 33f to the cooling body 3, so that efficient heat radiation can be performed.
  • the sealing plate portion 8b of the metal packing 8 is sandwiched between the cooling body side sealing surface 6 of the cooling body 3 and the heat radiating member side sealing surface 13a of the heat radiating member 13, and is a liquid seal convex portion formed on the sealing plate portion 8b. 8c is crushed by the cooling body side sealing surface 6 and the heat radiating member side sealing surface 13a, so that a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3 can be secured, and highly reliable power conversion.
  • a device 1 can be provided.
  • the cooling body 3 of a large and heavy object that is difficult to assemble to a processing machine is not formed with a circumferential groove or the like for mounting an O-ring, but only a flat cooling body side sealing surface 6 is formed. Can be reduced.
  • the metal packing 8 is a member formed by die-drawing a metal plate material, the manufacturing cost of the metal packing 8 can be reduced.
  • FIG. 14 shows a modification of the above-described power conversion device of the third embodiment.
  • the heat transfer supporting metal plate 33 that supports the control circuit board 22 of this modification includes a lower plate portion 33h that is bent to the right from the lower end of the connecting plate portion 33d, as compared with the first embodiment.
  • the lower plate portion 33h is formed with an insertion hole 33i through which the fixing screw 14 is inserted.
  • the heat transfer support metal plate 32 that supports the control circuit board 22 of the present modification also includes a lower plate portion (not shown) bent leftward from the lower end of the connecting plate portion 32d.
  • an insertion hole for inserting the fixing screw 14 is formed in the lower plate portion.
  • FIGS. 15 to 17 show a main part of the power conversion device according to the fourth embodiment of the present invention.
  • the power module 11 according to the present embodiment is provided with a rectangular parallelepiped heat dissipation member 70 made of copper having a high thermal conductivity on the lower surface of the case body 12.
  • a closing member 71 is fixed to the lower surface.
  • the heat radiating member 70 is formed with a cooling chamber 70a that opens in a rectangular shape at the center of the lower surface of the heat radiating member 70, and the water supply of a water supply path 70b formed inside the heat radiating member 70 on one wall portion in the longitudinal direction of the cooling chamber 70a.
  • a mouth is opened, and a drainage port of a drainage channel 70c formed inside the heat radiating member 70 is opened on the other wall portion in the longitudinal direction of the cooling chamber 70a.
  • the water supply channel 70b and the drainage channel 70c are connected to a cooling water supply source (not shown) via a flexible hose, for example.
  • the closing member 71 is a member that closes the open upper portion of the lower housing 2A in which the smoothing film capacitor 4 is housed, like the cooling body 3 of the third embodiment.
  • aluminum having a high thermal conductivity It is formed by injection molding of an aluminum alloy.
  • a metal is provided between the heat radiating member side seal surface 70 f of the heat radiating member 70 and the upper surface of the closing member 71.
  • a seal plate portion 8b of the packing 8 is interposed.
  • the metal packing 8 is the same as the structure shown in FIG. 12 of the third embodiment.
  • the upper surface where the sealing plate portion 8b of the metal packing 8 of the closing member 71 is in surface contact is formed as a flat closing member side sealing surface 71a.
  • the heat dissipating member 70 is arranged so that the flat heat dissipating member-side seal surface 70f faces upward, and all the long side inner engagement pieces 8d and the short side inner engagements are formed on the opening periphery of the cooling chamber 70a of the heat dissipating member 70.
  • the metal packing 8 is arranged so that the joining piece 8e is engaged. As a result, the metal packing 8 is positioned with the square frame-shaped seal plate portion 8b evenly contacting the flat heat radiation member side seal surface 70f on the periphery of the opening of the cooling chamber 70a.
  • the fixing screw 14 is inserted into the insertion hole 15 formed in the case body 12 and the heat radiating member 70 from below, and the fixing screw 14 is screwed into the female screw portion 71 b formed in the closing member 71 to close the heat radiating member 70.
  • the member 71 is fixed.
  • the liquid seal convex portion 8c formed on the seal plate portion 8b of the metal packing 8 is sandwiched between the heat radiating member side seal surface 70f of the heat radiating member 70 and the closing member side seal surface 71a of the occluding member 71, and is crushed. Liquid-tight sealing is performed to prevent the cooling water accumulated in the chamber 70a from leaking outside.
  • the heating element according to the present invention corresponds to the power module 11
  • the semiconductor power module according to the present invention corresponds to the power module 11
  • the coolant passage according to the present invention corresponds to the cooling chamber 70a.
  • the sealing surface of the heat radiating member corresponds to the heat radiating member side sealing surface 70f
  • the sealing surface of the closing member according to the present invention corresponds to the closing member side sealing surface 71a
  • the liquid tight sealing member according to the present invention corresponds to the metal packing 8.
  • the engagement piece according to the present invention corresponds to the long side inner engagement piece 8d and the short side inner engagement piece 8e
  • the seal portion according to the present invention corresponds to the seal plate part 8b.
  • the effect of the power converter device of this embodiment is demonstrated.
  • the coolant flows into the cooling chamber 70a provided at the center of the lower surface of the heat dissipation member 70 of the power module 11, and directly cools the heat dissipation member 70. Therefore, the power module 11 can be efficiently cooled.
  • the heat transfer support metal plates 32 and 33 are directly surface-bonded to the upper surface of the closing member 71, the heat transfer support metal plates are supplied from the control circuit board 22 and the power supply circuit board 23.
  • the heat transmitted to 32 and 33 is radiated from the lower plate portions 32f and 33f to the closing member 71, so that efficient heat radiation can be performed.
  • the sealing plate portion 8b of the metal packing 8 is sandwiched between the heat radiating member side sealing surface 70f of the heat radiating member 70 and the closing member side sealing surface 71a of the closing member 71, and is formed on the sealing plate portion 8b.
  • the portion 8c is crushed by the heat radiating member side sealing surface 70f and the closing member side sealing surface 71a, so that a reliable liquid-tight sealing of the cooling water accumulated in the cooling chamber 70a can be secured, and the highly reliable power conversion device 1 Can be provided.
  • peripheral groove for mounting the O-ring is not formed on both the heat radiating member 70 and the closing member 71, and only the flat heat radiating member side sealing surface 70f and the closing member side sealing surface 71a are formed. Can be reduced. Further, all the long side inner engagement pieces 8 d and the short side inner engagement pieces 8 e of the metal packing 8 are engaged with the opening peripheral edge of the cooling chamber 70 a formed in the heat radiation member 70, so that the heat radiation member of the heat radiation member 70.
  • the positioning of the seal plate portion 8b with respect to the side seal surface 70f can be easily performed, and before the liquid seal convex portion 8c of the seal plate portion 8b is crushed by the heat radiating member side seal surface 70f and the closing member side seal surface 71a, It is possible to prevent the metal packing 8 from coming off from the heat radiating member 70 and to improve the assembly efficiency.
  • the metal packing 8 is a member formed by die-drawing a metal plate material, the manufacturing cost of the metal packing 8 can be reduced.
  • the heat transfer supporting metal plate 33 that supports the control circuit board 22 is bent rightward from the lower end of the connecting plate portion 33d.
  • the heat transfer supporting metal plate 32 which supports the control circuit board 22 as the lower plate portion is also a lower plate portion bent leftward from the lower end of the connecting plate portion 32d, and the heat dissipating member 13 and the cooling body are fixed by the fixing screws 14.
  • the heat transfer clamping member 33 and the heat transfer support metal plate 32 are fixed to the cooling body, and at the same time, the liquid seal convex portion 8c formed on the seal plate portion 8b of the metal packing 8 is crushed, and the cooling body 3 is provided with a liquid-tight seal of the cooling water accumulated in the immersion part 5, so that the assembly efficiency can be further improved.
  • FIGS. 18 to 21 show a main part of a power conversion device according to a fifth embodiment of the present invention.
  • the cooling body 3 and the power module 11 (the case body 12 and the heat radiating member 13) of the present embodiment have the same structure as that of the first embodiment described above, and the upper surface of the cooling body 3 and the power module.
  • the metal packing 9 is interposed between the lower surface of the heat radiating member 13 of the eleventh member.
  • the metal packing 9 of the present embodiment is a member formed by drawing a metal plate material, and as shown in FIG. 20, a rectangular opening that is substantially the same shape as the upper surface opening of the immersion part 5 of the cooling body 3.
  • a plurality of short side inner engagement pieces 9e extending from the side edge of the short side opening 9a in the direction perpendicular to the surface direction of the seal plate portion 8b in the same direction as the long side inner engagement piece 9d; Opposite to the direction in which the long side inner engagement piece 9d extends from the outer peripheral edge of the long side of the seal plate portion 9b
  • a plurality of long side outer engagement pieces 9f extending in a direction orthogonal to the surface direction of the seal
  • the metal packing 9 is arranged so that all the long side inner engagement pieces 9 d and the short side inner engagement pieces 8 e are engaged with the upper surface opening of the immersion part 5 of the cooling body 3.
  • the screw through hole 9h corresponds to the female screw 10 provided in the cooling body 3, and the square frame-shaped sealing plate portion 9b is in contact with the flat cooling body side sealing surface 6 at the periphery of the immersion portion 5.
  • the cooling body 3 is positioned and arranged.
  • the power module 11 is arranged so that all the long side outer engagement pieces 9f and the short side outer engagement pieces 9g of the metal packing 9 are engaged with the outer surface of the heat radiating member 13, whereby the power module 11 is inserted.
  • the hole 15 corresponds to the female screw 10 through the screw through hole 9h, and the cooling fin 17a of the heat radiating member 13 enters the center of the immersion part 5 of the cooling body 3, and the metal packing 9 of the present embodiment is cooled
  • the power module 11 is positioned with respect to the body 3.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13, and the fixing screw 14 is screwed into the female screw 10 formed in the cooling body 3, so that the heat radiating member 13 is cooled to the cooling body 3.
  • the liquid seal projection 9c formed on the seal plate portion 9b of the metal packing 9 disposed around the immersion portion 5 of the cooling body 3 is sandwiched between the cooling body side sealing surface 6 and the heat radiating member side sealing surface 13a. Then, the liquid is sealed (see FIG. 18), and liquid-tight sealing is performed to prevent the cooling water accumulated in the immersion part 5 of the cooling body 3 from leaking to the outside.
  • the heating element according to the present invention corresponds to the power module 11
  • the semiconductor power module according to the present invention corresponds to the power module 11
  • the coolant passage according to the present invention corresponds to the immersion part 5.
  • the sealing surface of the cooling body corresponds to the cooling body side sealing surface 6
  • the sealing surface of the heat radiating member according to the present invention corresponds to the heat radiating member side sealing surface 13 a
  • the liquid-tight sealing member according to the present invention corresponds to the metal packing 9.
  • the engagement piece according to the present invention corresponds to the long side inner engagement piece 9d and the short side inner engagement piece 9e
  • the seal portion according to the present invention corresponds to the seal plate part 9b.
  • the seal plate portion 9b of the metal packing 9 is sandwiched between the cooling body side seal surface 6 of the cooling body 3 and the heat dissipation member side seal surface 13a of the heat dissipation member 13, and the seal plate portion
  • the liquid seal convex part 9c formed in 9b is crushed by the cooling body side sealing surface 6 and the heat radiating member side sealing surface 13a, and it is possible to ensure a reliable liquid tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3.
  • the power converter device 1 can be provided with high reliability.
  • the cooling body 3 of a large and heavy object that is difficult to be assembled in a processing machine is not formed with a circumferential groove or the like for mounting an O-ring, and a flat cooling body side sealing surface 6 is formed. Therefore, the processing cost can be reduced.
  • the long side inner engagement piece 9d and the short side inner engagement piece 9e of the metal packing 9 are engaged with the upper surface opening of the immersion part 5, whereby the seal plate part 8b with respect to the cooling body side sealing surface 6 of the cooling body 3 is provided.
  • the metal packing 9 is detached from the cooling body 3 before the liquid seal projection 9c of the sealing plate portion 9b is crushed by the cooling body side sealing surface 6 and the heat radiating member side sealing surface 13a. Can be prevented, and the assembly efficiency can be improved.
  • the metal packing 9 is a member formed by drawing a metal plate material, the manufacturing cost of the metal packing 9 can be reduced.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists. Further, in each of the above-described embodiments, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
  • the heat-transfer support plate part 32a and the heat-transfer support side plate part 32c which comprise the heat-transfer support metal plate 32 are another member, and the heat-transfer support plate which comprises the heat-transfer support metal plate 33
  • the portion 33a and the heat transfer support side plate portion 33c are configured as separate members.
  • the cooling efficiency of the power supply circuit unit U3 is improved and the heat transfer support is configured.
  • the plate portion 33a and the heat transfer support side plate portion 33c are integrated members, the cooling efficiency of the control circuit unit U2 can be improved.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
  • the power converter device 1 which concerns on this invention can be applied to the electric vehicle or the rail vehicle which drive
  • the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the cooling structure according to the present invention is useful for reducing the processing cost and improving the assembly efficiency.
  • SYMBOLS 1 Power converter device, 2 ... Housing
  • Heat radiation member, 13a Heat radiation member side sealing surface, 15 ... Insertion hole, 16 ... Board fixing
  • Insulating sheet 52 ... Connection cord, 53 ... Crimp terminal, 55 ... Bus bar, 57 ... Current sensor, 58 ... Motor connection cable, 59 ... Crimp terminal, 70 ... Heat radiation member, 70a ... Cooling chamber, 70b ... Water supply channel, 7 c ... drainage, 70d ... bottom, 70e ... cooling fins, 70f ... heat radiating member side sealing surface, 71 ... closing member, 71a ... closing member side sealing surface, U2 ... control circuit unit, U3 ... power supply circuit unit

Abstract

La présente invention comporte : un module de puissance à semi-conducteurs (11) ayant, formé sur une surface de celui-ci, un élément de dissipation thermique (13) ; et un corps de refroidissement (3) qui est assemblé à l'élément de dissipation thermique. Le corps de refroidissement comporte un passage de fluide de refroidissement (5) qui est formé afin d'être ouvert au niveau d'un côté assemblé au corps de dissipation thermique, et à travers lequel un fluide de refroidissement circule. Dans l'élément de dissipation thermique, des parties de contact fluidique en saillie (17), qui sont disposées afin d'être insérées dans le passage de fluide de refroidissement au niveau d'un côté assemblé au corps de refroidissement, sont formées. Un élément d'étanchéité au fluide (7) est disposé entre le corps de refroidissement et l'élément de dissipation thermique. L'élément d'étanchéité au fluide comporte : une partie d'étanchéité (7b) qui est fermement fixée entre le corps de refroidissement et l'élément de dissipation thermique ; et une partie de positionnement (7d) qui s'engage avec une surface extérieure de l'élément de dissipation thermique afin de positionner la partie d'étanchéité. En outre, des surfaces scellées de manière étanche (6, 13a) du corps de refroidissement et de l'élément de dissipation thermique, lesdites surfaces scellées de manière étanche ayant la partie d'étanchéité fermement fixée à celles-ci, sont formées en tant que surfaces plates.
PCT/JP2013/007591 2013-02-14 2013-12-25 Structure de refroidissement et dispositif de conversion de puissance WO2014125548A1 (fr)

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JP2013026626 2013-02-14
JP2013-026626 2013-02-14
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JP2013-026625 2013-02-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018212862A1 (fr) * 2017-05-15 2018-11-22 Intel Corporation Plaque froide avec isolation de barrage
WO2020071058A1 (fr) * 2018-10-03 2020-04-09 富士電機株式会社 Dispositif à semi-conducteur
JP7462674B2 (ja) 2019-04-05 2024-04-05 ヴァレオ、シーメンス、イーオートモーティブ、フランス 電気絶縁材料製のフレームを備える容量性ブロックおよび電気機器

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6904070B2 (ja) * 2017-06-02 2021-07-14 株式会社デンソー 電力変換装置
JP6457678B1 (ja) * 2018-03-19 2019-01-23 株式会社ケーヒン 電力変換装置
JP6750809B1 (ja) * 2019-04-22 2020-09-02 三菱電機株式会社 冷却器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666373A (ja) * 1992-08-18 1994-03-08 Motoyama Seisakusho:Kk メタルガスケット
JPH112332A (ja) * 1997-06-13 1999-01-06 Toyota Motor Corp ガスケットかしめ方法
JP2003049948A (ja) * 2001-08-03 2003-02-21 Nippon Reinz Co Ltd メタルガスケット
JP2008311550A (ja) * 2007-06-18 2008-12-25 Nichicon Corp パワー半導体モジュール
WO2012056880A1 (fr) * 2010-10-27 2012-05-03 本田技研工業株式会社 Structure de refroidissement
JP2012210000A (ja) * 2011-03-29 2012-10-25 Mitsubishi Electric Corp 電力変換装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
JP4855168B2 (ja) * 2006-07-27 2012-01-18 オリンパス株式会社 固体撮像装置
JP4708459B2 (ja) * 2008-07-29 2011-06-22 日立オートモティブシステムズ株式会社 電力変換装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666373A (ja) * 1992-08-18 1994-03-08 Motoyama Seisakusho:Kk メタルガスケット
JPH112332A (ja) * 1997-06-13 1999-01-06 Toyota Motor Corp ガスケットかしめ方法
JP2003049948A (ja) * 2001-08-03 2003-02-21 Nippon Reinz Co Ltd メタルガスケット
JP2008311550A (ja) * 2007-06-18 2008-12-25 Nichicon Corp パワー半導体モジュール
WO2012056880A1 (fr) * 2010-10-27 2012-05-03 本田技研工業株式会社 Structure de refroidissement
JP2012210000A (ja) * 2011-03-29 2012-10-25 Mitsubishi Electric Corp 電力変換装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018212862A1 (fr) * 2017-05-15 2018-11-22 Intel Corporation Plaque froide avec isolation de barrage
US10431475B2 (en) 2017-05-15 2019-10-01 Intel Corporation Cold plate with dam isolation
WO2020071058A1 (fr) * 2018-10-03 2020-04-09 富士電機株式会社 Dispositif à semi-conducteur
JPWO2020071058A1 (ja) * 2018-10-03 2021-03-11 富士電機株式会社 半導体装置
JP7047929B2 (ja) 2018-10-03 2022-04-05 富士電機株式会社 半導体装置
JP7462674B2 (ja) 2019-04-05 2024-04-05 ヴァレオ、シーメンス、イーオートモーティブ、フランス 電気絶縁材料製のフレームを備える容量性ブロックおよび電気機器

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