WO2013084387A1 - 下受けピン配置判定装置および下受けピン配置判定方法 - Google Patents
下受けピン配置判定装置および下受けピン配置判定方法 Download PDFInfo
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- WO2013084387A1 WO2013084387A1 PCT/JP2012/005761 JP2012005761W WO2013084387A1 WO 2013084387 A1 WO2013084387 A1 WO 2013084387A1 JP 2012005761 W JP2012005761 W JP 2012005761W WO 2013084387 A1 WO2013084387 A1 WO 2013084387A1
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- pin
- shaft portion
- receiving pin
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- 238000000034 method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 230000007704 transition Effects 0.000 claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 238000001514 detection method Methods 0.000 claims description 11
- 238000003384 imaging method Methods 0.000 claims description 9
- 238000009424 underpinning Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 description 21
- 230000007723 transport mechanism Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011022 operating instruction Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49766—Method of mechanical manufacture with testing or indicating torquing threaded assemblage or determining torque herein
- Y10T29/49767—Determining relative number of threaded member rotations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49769—Using optical instrument [excludes mere human eyeballing]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53061—Responsive to work or work-related machine element
- Y10T29/53083—Responsive to work or work-related machine element including means to apply magnetic force directly to position or hold work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
Definitions
- the present invention relates to a receiving pin arrangement determining device and a receiving pin arrangement determining method for determining whether or not an arrangement of receiving pins for receiving a substrate in an electronic component mounting apparatus is correct.
- the substrate In the component mounting process for mounting the electronic component on the substrate, the substrate is positioned and held with the lower surface side supported by the receiving portion.
- a base pin method for supporting a plurality of base pins in contact with the lower surface of the substrate is widely used.
- this base pin method if there are already mounted parts mounted in the previous process on the lower surface side of the board, select the parts that can be received so as not to cause positional interference with these already mounted parts Therefore, it is necessary to arrange a receiving pin. After the pin placement work is completed, a check is performed to determine whether or not the receiving pin is actually placed at the selected correct position.
- a method for confirming the position of the lower receiving pin a method is known in which the position of the lower receiving pin is detected by recognizing a tip portion that contacts the substrate with a camera (see, for example, Patent Document 1).
- the recognition target surface for position detection is the tip portion that abuts against the substrate in the receiving pin.
- paste-like foreign matters such as flux are often attached to the underside surface of the substrate in the previous process, and in the state where it is used for underlay operations targeting a plurality of substrates, These foreign substances are attached to the tip.
- the recognition accuracy when the position of the tip of the receiving pin is imaged with a camera is lowered due to the presence of these foreign substances, and stable position recognition is difficult and may cause erroneous recognition.
- an object of the present invention is to provide a receiving pin arrangement determining device and a receiving pin arrangement determining method capable of stably recognizing the position of the receiving pin with good recognition accuracy.
- the underpinning pin arrangement determining device is an underpinning pin arrangement for determining whether or not the arrangement of underpins for receiving the substrate is correct in an electronic component mounting apparatus for mounting electronic components on the substrate held by the substrate holding unit.
- the lower receiving pin includes a base portion supported by a support plate disposed in the substrate holding portion, a shaft portion extending upward from the base portion, and an upper portion of the shaft portion.
- the lower receiving pin has a reduced diameter portion in which the outer diameter of the shaft portion is reduced, and an abutting surface that is formed on the top of the reduced diameter portion and abuts on the lower receiving surface of the substrate.
- Image pickup means for picking up the image from above and obtaining an image obtained by viewing the underpin in plan view; and by recognizing the image, the outer peripheral surface of the shaft portion is set at a height position at which the shaft portion transitions to the reduced diameter portion.
- a shaft shape detection unit for detecting the position and a plane position of the receiving pin obtained from the detected outer shape are compared with predetermined pin arrangement data to determine whether the arrangement of the receiving pin is correct or not And a pin position determination unit.
- the lower receiving pin includes a base portion supported by a support plate disposed in the substrate holding portion, a shaft portion extending upward from the base portion, and an upper portion of the shaft portion.
- the lower receiving pin has a reduced diameter portion in which the outer diameter of the shaft portion is reduced, and an abutting surface that is formed on the top of the reduced diameter portion and abuts on the lower receiving surface of the substrate.
- An imaging step for capturing the image from above and obtaining an image in which the receiving pin is viewed in plan, and recognition processing for the image, thereby setting the outer peripheral surface of the shaft portion to a height position at which the shaft portion transitions to the reduced diameter portion.
- a shaft shape detecting step for detecting the position and a plane position of the receiving pin obtained from the detected outer shape is compared with predetermined pin arrangement data to determine whether the receiving pin is arranged correctly or not.
- the receiving pin for receiving the substrate includes a shaft portion extending upward from the base portion, a reduced diameter portion in which the outer diameter of the shaft portion is reduced at the upper portion of the shaft portion, and the reduced diameter portion.
- the fragmentary sectional view of the electronic component mounting device of one embodiment of the present invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention (A), (b) is explanatory drawing of the receiving pin arrangement
- FIG. 2 (a), (b), the whole structure of the electronic component mounting apparatus 1 is demonstrated.
- the electronic component mounting apparatus 1 has a function of mounting an electronic component on a substrate held by a substrate holding unit.
- a substrate transport mechanism 2 is arranged in the X direction (substrate transport direction) at the center of the base 1a.
- the board transport mechanism 2 has a function of transporting the board 3 carried in from the upstream side and positioning it at a mounting work position by a component mounting mechanism described below, and includes two transport rails 2a arranged in parallel. have.
- a substrate holding portion 2c for receiving and holding the substrate 3 that has been carried in, and two opposite side edges of the substrate 3 lifted by the substrate holding portion 2c.
- a pressing member 2b that clamps by pressing from above is provided.
- component supply units 4 that supply electronic components to be mounted are arranged.
- a plurality of tape feeders 5 are arranged in parallel in the component supply unit 4, and the tape feeder 5 has a function of pitch-feeding the components held on the carrier tape to a take-out position by a component mounting mechanism described below.
- a Y-axis moving table 6 is disposed on one end in the X direction on the upper surface of the base 1a, and two X-axis moving tables 7 are slidably coupled to the Y-axis moving table 6 in the Y direction.
- a mounting head 8 is mounted on each X-axis moving table 7 so as to be slidable in the X direction.
- the mounting head 8 is a multiple-type head composed of a plurality of unit holding heads 9, and is separated from the tape feeder 5 by a suction nozzle 9 a (see FIG. 4) for part suction mounted on a nozzle holder at the lower end of the unit holding head 9.
- the electronic component to be mounted is held by vacuum suction.
- the Y-axis moving table 6 and the X-axis moving table 7 constitute a head moving mechanism that moves the mounting head 8.
- the head moving mechanism that moves the mounting head 8 and the mounting head 8 constitutes a component mounting mechanism 14 that takes out components from the component supply unit 4 and mounts them on the substrate 3.
- a substrate recognition camera 10 that moves integrally with the mounting head 8 is mounted on the lower surface of the X-axis moving table 7. By driving the head moving mechanism and moving the substrate recognition camera 10 above the substrate 3 held by the substrate transport mechanism 2, the substrate recognition camera 10 captures an image of the recognition mark formed on the substrate 3.
- a component recognition camera 11, a first nozzle storage unit 12, and a second nozzle storage unit 13 are disposed on the movement path of the mounting head 8 between the component supply unit 4 and the substrate transport mechanism 2.
- the component recognition camera 11 picks up an image of the component held by the mounting head 8 by performing a scanning operation in which the mounting head 8 taking out the component from the component supply unit 4 passes above the component recognition camera 11 in a predetermined direction. .
- a plurality of suction nozzles 9a attached to the nozzle holder of the unit holding head 9 are stored and held in the first nozzle storage unit 12 corresponding to the component type, and the second nozzle storage unit 13 similarly has a unit.
- a pin transfer nozzle (not shown), which is mounted on the nozzle holder of the holding head 9 and used to transfer a later-described receiving pin module 22, is stored and held.
- the substrate transport mechanism 2 is composed of two transport rails 2a arranged in parallel, and a conveyor mechanism 2d is provided along the transport direction inside the transport rail 2a. Is provided.
- a conveyor mechanism 2d is provided along the transport direction inside the transport rail 2a. Is provided.
- the substrate 3 is transported in the substrate transport direction.
- the clamp portion 2e that supports the side edge of the substrate from below is brought into contact with the support plate 21. It is arranged so that it can be raised and lowered.
- a substrate holding portion 2 c is disposed at the center of the substrate transport mechanism 2 corresponding to the work position by the component mounting mechanism 14.
- the substrate holding part 2c has a structure in which a horizontal plate-like support plate 21 is moved up and down (arrow a) by an elevating mechanism 20, and a lower receiving pin for supporting the substrate 3 from the lower surface side on the upper surface of the support plate 21.
- a module 22 (underpin) is provided upright.
- the support plate 21 is configured such that the upper surface of a plate member 21b made of a non-magnetic material such as aluminum is covered with a magnetic material 21a such as a steel plate, and a lower receiving pin module 22 is placed at an arbitrary position on the magnetic material 21a. Arranged according to the receiving position of the substrate 3 to be received.
- the lower receiving pin module 22 is fixed to the support plate 21 by the attractive force acting between the magnetic body 21a by the magnet member built in the base 23 of the lower receiving pin module 22.
- the fixing form of the receiving pin module 22 is not necessarily limited to the method using the magnetizing force by the magnet member.
- the elevating mechanism 20 is driven to raise the support plate 21 (arrow b), whereby the upper end of the lower receiving pin module 22 and the upper end of the clamp portion 2e are moved.
- the substrate 3 comes into contact with the lower surface of the substrate 3 and is held by the substrate holding portion 2c, and both ends of the substrate 3 are pressed against the lower surface of the pressing member 2b to be fixed in position.
- the lower receiving pin module 22 has a function of standing on an arbitrary position of the support plate 21 and receiving and supporting the substrate 3 from the lower surface side.
- the lower receiving pin module 22 has a hook-like shape provided at the upper end portion of the lower shaft portion 24A by extending the lower shaft portion 24A upward from the base portion 23 in contact with the support plate 21.
- the upper shaft portion 24B having a smaller diameter than the lower shaft portion 24A is extended further upward from the portion 25.
- the hook-like portion 25 is used when the lower receiving pin module 22 is sucked and held by a pin transfer nozzle that is detachably attached to the unit holding head 9.
- the lower shaft portion 24A and the upper shaft portion 24B are both provided with a circular cross section, and a reduced diameter portion 26 that reduces the outer diameter of the upper shaft portion 24B is provided above the upper shaft portion 24B.
- the upper surface of the reduced diameter portion 26 is an abutting surface 26a that abuts and supports the underside surface 3a of the substrate 3 (see FIG. 6A).
- the outer diameter D2 of the contact surface 26a is set smaller than the outer diameter D1 of 24B.
- the reduced diameter portion 26 includes a small diameter portion 26b having an outer diameter D2 smaller than the outer diameter D1 of the upper shaft portion 24B and having a contact surface 26a formed on the top portion, an outer periphery 26c of the small diameter portion 26b, and the upper shaft.
- the taper portion 26d connects the outer periphery 24a of the portion 24B with a conical taper surface 26e.
- the reduced diameter portion 26 is a position recognition target by the substrate recognition camera 10 in the determination of the receiving pin arrangement for determining whether the arrangement of the receiving pin module 22 on the support plate 21 is correct. That is, after the work of placing the receiving pins is completed, the mounting head 8 is moved to sequentially move the board recognition camera 10 above each receiving pin module 22 as shown in FIG.
- the board recognition camera 10 as the imaging means captures the lower pin module 22 from above and obtains an image of the lower pin module 22 in plan view. By recognizing this image, the position of the receiving pin module 22 to be imaged is detected as will be described later.
- the control unit 30 is an arithmetic device and controls each unit described below based on various programs and data stored in the storage unit 31.
- the storage unit 31 stores pin arrangement data 31b.
- the pin arrangement data 31 b is position coordinate data for arranging the receiving pin module 22 on the support plate 21, and is stored for each type of substrate 3.
- the mechanism driving unit 32 is controlled by the control unit 30 to drive the substrate transport mechanism 2, the substrate holding unit 2 c, and the component mounting mechanism 14. Thereby, the board
- the recognition processing unit 33 performs recognition processing on the imaging results obtained by the board recognition camera 10 and the component recognition camera 11. As a result, the position of the substrate 3 is recognized, and the position of the electronic component held by the mounting head 8 is detected. When an electronic component is mounted on the board 3 by the component mounting mechanism 14, the mounting position is corrected based on these recognition results.
- the shaft shape detection unit 34 sets the upper shaft portion 24B at the recognition reference position 24b set to a height position where the outer periphery 24a of the upper shaft portion 24B transitions to the reduced diameter portion 26. The process which detects the external shape of is performed.
- the pin position determination unit 35 compares the planar position of the receiving pin module 22 obtained from the outer shape of the upper shaft part 24B detected by the shaft shape detection unit 34 with predetermined pin arrangement data 31b. Then, the correctness of the arrangement of the receiving pin module 22 is determined.
- the display unit 36 is a display device such as a liquid crystal panel, and displays images acquired by the substrate recognition camera 10, recognition images processed by the recognition processing unit 33 and the shaft shape detection unit 34, and determination results by the pin position determination unit 35. indicate.
- the operation / input unit 37 is an input device such as a keyboard or a touch panel provided on the display screen of the display unit 36, and performs operations for operating instructions and data input.
- the substrate recognition camera 10, the recognition processing unit 33, the shaft shape detection unit 34, and the pin position determination unit 35 are arranged in the electronic component mounting apparatus 1 that mounts electronic components on the substrate 3 held by the substrate holding unit 2c.
- a receiving pin arrangement determining device that determines whether the arrangement of the receiving pin module 22 that receives the substrate 3 is correct is configured.
- FIG. 6A shows the state of the lower receiving surface 3 a and the reduced diameter portion 26 in the process of receiving the plurality of substrates 3 continuously by the lower receiving pin module 22.
- Paste foreign material 27 such as flux adheres to the lower surface 3a of the substrate 3 in the previous process, and in a state where it is used for the lowering operation for a plurality of substrates 3, the reduced diameter portion 26 Foreign matter 27 adheres to the contact surface 26a at the tip.
- FIG. 6B shows a state where the support plate 21 is lowered and the reduced diameter portion 26 is separated from the lower receiving surface 3a. In this state, the foreign matter 27 adheres to the small diameter portion 26b in a form that protrudes outward from the outer periphery 26c.
- the reduced diameter portion 26 in this state is an object to be imaged by the board recognition camera 10 in the receiving pin arrangement determining process executed after the arrangement of the receiving pin module 22 is changed. That is, the substrate recognition camera 10 is moved integrally with the mounting head 8, and as shown in FIG. 4, each of the underpinning pin modules 22 is imaged from above, and an image obtained by viewing the underpinning pin module 22 in plan view is obtained. (Imaging process).
- FIG. 7A shows a screen acquired as described above and displayed on the display unit 36 as the recognition image 36a.
- the range corresponding to the conical taper surface 26e appears as a dark image in the background image of the bright image, and the range where the foreign matter 27 does not adhere to the contact surface 26a appears as the bright image portion. That is, in this recognition image 36a, the contour of the recognition reference position 24b in the background image of the conical taper surface 26e is not affected by the attachment of the foreign matter 27, but the contour of the contact surface 26a is affected by the attached foreign matter 27. It does not appear clearly.
- the shaft shape detection unit 34 By processing the recognition image 36a acquired in this way by the shaft shape detection unit 34, the upper position at the recognition reference position 24b set at a height position where the outer periphery 24a of the upper shaft part 24B transitions to the reduced diameter part 26 is obtained. The outer shape of the shaft portion 24B is detected (shaft shape detection step).
- FIG. 7B shows the outer shape of the upper shaft portion 24B at the recognition reference position 24b detected in this way.
- the outline of the recognition reference position 24b is not affected by the adhesion of the foreign matter 27, so that more accurate recognition accuracy can be ensured as compared with the case where the contact surface 26a is the recognition target. Is possible.
- the pin position P indicating the planar position of the receiving pin module 22 is detected.
- the receiving pin module 22 as the receiving pin arranged on the board holding portion 2c and receiving the board 3 is A lower shaft portion 24A and an upper shaft portion 24B extending upward from the base portion 23, a reduced diameter portion 26 whose outer diameter decreases at the upper portion of the upper shaft portion 24B, and a top portion of the reduced diameter portion 26. It has a shape having a contact surface 26a that contacts the lower receiving surface 3a.
- the outer shape of the upper shaft portion 24B at the set recognition reference position 24b is detected.
- the position of the lower receiving pin module 22 can be stably recognized with good recognition accuracy even when the foreign matter 27 present on the lower receiving surface 3a of the substrate 3 is attached to the contact surface 26a. .
- the lower receiving pin module 22 having a configuration in which the lower shaft portion 24A and the upper shaft portion 24B having different diameters are connected is used as the lower receiving pin.
- the structure which extended the part from the base 23 may be sufficient.
- the reduced diameter portion 26 an example in which the small diameter portion 26b and the tapered portion 26d are combined is shown.
- the outer diameter D2 of the contact surface 26a may be smaller than the outer diameter D1 of the upper shaft portion 24B.
- other shapes may be adopted.
- the underpinning pin arrangement determining apparatus and underpinning pin arrangement determining method of the present invention have the effect that the position of the underpin can be stably recognized with good recognition accuracy, and are held by the substrate holding portion. This is useful in the field of electronic component mounting where electronic components are mounted on a substrate.
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Abstract
Description
2 基板搬送機構
2c 基板保持部
3 基板
8 実装ヘッド
9 単位保持ヘッド
9a 吸着ノズル
21 支持プレート
24B 上軸部
24b 認識基準位置
26 縮径部
26a 当接面
26b 小径部
26d テーパ部
Claims (4)
- 基板保持部に保持された基板に電子部品を実装する電子部品実装装置において前記基板を下受けする下受けピンの配置の正否を判定する下受けピン配置判定装置であって、
前記下受けピンは、前記基板保持部に配設された支持プレートに支持される基部と、前記基部から上方に延出して設けられた軸部と、前記軸部の上部において軸部の外径が縮小する縮径部と、前記縮径部の頂部に形成され前記基板の下受け面に当接して下受けする当接面とを有する形状であり、
前記下受けピンを上方から撮像してこの下受けピンを平面視した画像を取得する撮像手段と、
前記画像を認識処理することにより、前記軸部の外周面が前記縮径部に遷移する高さ位置に設定された認識基準位置における前記軸部の外形形状を検出する軸形状検出部と、
検出された前記外形形状より求められた前記下受けピンの平面位置を予め定められたピン配置データと比較することにより、当該下受けピンの配置の正否を判定するピン位置判定部とを備えたことを特徴とする下受けピン配置判定装置。 - 前記軸部は断面が円形であり、
前記縮径部は、前記軸部の外径よりも小さい外径を有し頂部に前記当接面が形成された小径部と、この小径部の外周と前記軸部の外周とを円錐テーパ面で繋ぐテーパ部よりなることを特徴とする請求項1記載の下受けピン配置判定装置。 - 基板保持部に保持された基板に電子部品を実装する電子部品実装装置において前記基板を下受けする下受けピンの配置の正否を判定する下受けピン配置判定方法であって、
前記下受けピンは、前記基板保持部に配設された支持プレートに支持される基部と、前記基部から上方に延出して設けられた軸部と、前記軸部の上部において軸部の外径が縮小する縮径部と、前記縮径部の頂部に形成され前記基板の下受け面に当接して下受けする当接面とを有する形状であり、
前記下受けピンを上方から撮像してこの下受けピンを平面視した画像を取得する撮像工程と、
前記画像を認識処理することにより、前記軸部の外周面が前記縮径部に遷移する高さ位置に設定された認識基準位置における前記軸部の外形形状を検出する軸形状検出工程と、
検出された前記外形形状より求められた前記下受けピンの平面位置を予め定められたピン配置データと比較することにより、当該下受けピンの配置の正否を判定するピン位置判定工程とを含むことを特徴とする下受けピン配置判定方法。 - 前記軸部は断面が円形であり、
前記縮径部は、前記軸部の外径よりも小さい外径を有し頂部に前記当接面が形成された小径部と、この小径部の外周と前記軸部の外周とを円錐テーパ面で繋ぐテーパ部よりなることを特徴とする請求項3記載の下受けピン配置判定方法。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN105493652A (zh) * | 2013-09-04 | 2016-04-13 | 富士机械制造株式会社 | 对基板作业装置 |
CN105580508A (zh) * | 2013-09-23 | 2016-05-11 | 富士机械制造株式会社 | 软支撑销的状态确认装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5494588B2 (ja) * | 2011-08-08 | 2014-05-14 | パナソニック株式会社 | 電子部品実装装置用の下受けピンモジュールおよび基板下受け装置ならびに基板下受け方法 |
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JP5903588B2 (ja) * | 2013-01-30 | 2016-04-13 | パナソニックIpマネジメント株式会社 | 下受けピンの配置決定支援装置および配置決定支援方法 |
DE102014205701A1 (de) * | 2014-03-27 | 2015-10-01 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Bestimmung der Position und/oder Orientierung zumindest eines Steckkontakts |
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US11412650B2 (en) * | 2017-09-28 | 2022-08-09 | Universal Instruments Corporation | Lead tip illumination device, system, and method |
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JP7498657B2 (ja) | 2020-12-18 | 2024-06-12 | 株式会社Fuji | バックアップ部材の配置方法および部品装着機 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11340696A (ja) * | 1998-05-21 | 1999-12-10 | Sanyo Electric Co Ltd | 基板のクランプ方法およびクランプ装置 |
JP2004140161A (ja) * | 2002-10-17 | 2004-05-13 | Hitachi High-Tech Instruments Co Ltd | 電子部品実装装置の基板バックアップピン立設位置の自動確認装置及びそれを用いた基板バックアップピン立設位置の自動確認方法 |
JP2010141053A (ja) * | 2008-12-10 | 2010-06-24 | Panasonic Corp | 正誤判定方法、正誤判定プログラム、正誤判定装置、部品実装機 |
JP2011014726A (ja) * | 2009-07-02 | 2011-01-20 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置、及び電子部品装着用バックアップピン |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2879588B2 (ja) * | 1990-05-02 | 1999-04-05 | グローリー工業株式会社 | 磁気センサの製造方法 |
KR0152879B1 (ko) * | 1995-10-10 | 1998-12-15 | 이희종 | 표면실장기의 부품인식방법 및 장치 |
US5940960A (en) * | 1997-01-21 | 1999-08-24 | Fori Automation, Inc. | Automatic valve stemming method and apparatus |
JP4014270B2 (ja) * | 1998-01-06 | 2007-11-28 | 富士機械製造株式会社 | 基板支持ピン配置方法,配置検査方法および装置 |
JP2002057498A (ja) * | 2000-08-09 | 2002-02-22 | Fuji Mach Mfg Co Ltd | 配線板作業システム |
JP2002298132A (ja) * | 2001-04-02 | 2002-10-11 | Fuji Mach Mfg Co Ltd | 撮像システム,撮像システム制御プログラムおよび電気部品装着システム |
US7551768B2 (en) * | 2003-01-09 | 2009-06-23 | Panasonic Corporation | Image recognition apparatus and method for surface discrimination using reflected light |
WO2005039268A1 (ja) * | 2003-10-15 | 2005-04-28 | Matsushita Electric Industrial Co., Ltd. | 部品装着装置 |
JP4147169B2 (ja) * | 2003-10-17 | 2008-09-10 | 日立ビアメカニクス株式会社 | バンプ形状計測装置及びその方法 |
JP4111160B2 (ja) * | 2004-03-26 | 2008-07-02 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
JP2008026927A (ja) * | 2004-10-29 | 2008-02-07 | Sharp Corp | 座標検出装置、表示装置および座標検出方法 |
JP4702959B2 (ja) * | 2005-03-28 | 2011-06-15 | パナソニック株式会社 | ユーザインタフェイスシステム |
US7549204B1 (en) * | 2005-11-30 | 2009-06-23 | Western Digital Technologies, Inc. | Methods for picking and placing workpieces into small form factor hard disk drives |
JP4964954B2 (ja) * | 2006-11-06 | 2012-07-04 | パナソニック株式会社 | 移動装置および電子部品実装装置 |
WO2008081796A1 (ja) * | 2006-12-28 | 2008-07-10 | Yamaha Motor Co., Ltd. | 部品認識装置、表面実装機、および部品試験装置 |
US8845114B2 (en) * | 2007-02-21 | 2014-09-30 | Panasonic Corporation | Lighting device for image capturing in electronic component mounting apparatus |
WO2009148089A1 (ja) * | 2008-06-05 | 2009-12-10 | 東芝機械株式会社 | ハンドリング装置、制御装置、制御方法およびプログラム |
JP5299379B2 (ja) * | 2010-08-17 | 2013-09-25 | パナソニック株式会社 | 部品実装装置および部品検出方法 |
JP5440486B2 (ja) * | 2010-12-17 | 2014-03-12 | パナソニック株式会社 | 部品実装装置および部品実装装置における機種切替え方法 |
JP5454481B2 (ja) * | 2011-01-20 | 2014-03-26 | パナソニック株式会社 | 部品実装装置および部品実装方法 |
JP5408153B2 (ja) * | 2011-02-21 | 2014-02-05 | パナソニック株式会社 | 電子部品実装装置および電子部品実装装置における画像読取り方法 |
JP5445534B2 (ja) * | 2011-08-08 | 2014-03-19 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法ならびに下受けピンモジュールの配置変更方法 |
JP5494588B2 (ja) * | 2011-08-08 | 2014-05-14 | パナソニック株式会社 | 電子部品実装装置用の下受けピンモジュールおよび基板下受け装置ならびに基板下受け方法 |
US9226436B2 (en) * | 2011-08-29 | 2015-12-29 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting position correcting method |
US8863371B2 (en) * | 2011-12-09 | 2014-10-21 | Baker Hughes Incorporated | Positioning system and method for automated alignment and connection of components |
JP5747167B2 (ja) * | 2012-02-02 | 2015-07-08 | パナソニックIpマネジメント株式会社 | 下受けピンの配置方法および下受けピンの返戻方法 |
-
2011
- 2011-12-06 JP JP2011266588A patent/JP5830644B2/ja active Active
-
2012
- 2012-09-11 WO PCT/JP2012/005761 patent/WO2013084387A1/ja active Application Filing
- 2012-09-11 KR KR1020137018698A patent/KR20140097968A/ko not_active Application Discontinuation
- 2012-09-11 DE DE112012005106.8T patent/DE112012005106T5/de not_active Withdrawn
- 2012-09-11 US US13/978,443 patent/US9332686B2/en active Active
- 2012-09-11 CN CN201280005477.8A patent/CN103329646B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11340696A (ja) * | 1998-05-21 | 1999-12-10 | Sanyo Electric Co Ltd | 基板のクランプ方法およびクランプ装置 |
JP2004140161A (ja) * | 2002-10-17 | 2004-05-13 | Hitachi High-Tech Instruments Co Ltd | 電子部品実装装置の基板バックアップピン立設位置の自動確認装置及びそれを用いた基板バックアップピン立設位置の自動確認方法 |
JP2010141053A (ja) * | 2008-12-10 | 2010-06-24 | Panasonic Corp | 正誤判定方法、正誤判定プログラム、正誤判定装置、部品実装機 |
JP2011014726A (ja) * | 2009-07-02 | 2011-01-20 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置、及び電子部品装着用バックアップピン |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104244692A (zh) * | 2013-06-14 | 2014-12-24 | 雅马哈发动机株式会社 | 基板处理装置和基板支撑装置 |
CN104244692B (zh) * | 2013-06-14 | 2017-06-27 | 雅马哈发动机株式会社 | 基板处理装置和基板支撑装置 |
CN105493652A (zh) * | 2013-09-04 | 2016-04-13 | 富士机械制造株式会社 | 对基板作业装置 |
CN105493652B (zh) * | 2013-09-04 | 2018-12-21 | 株式会社富士 | 对基板作业装置 |
CN105580508A (zh) * | 2013-09-23 | 2016-05-11 | 富士机械制造株式会社 | 软支撑销的状态确认装置 |
US20160225136A1 (en) * | 2013-09-23 | 2016-08-04 | Fuji Machine Mfg. Co., Ltd. | Soft back-up pin state checking device |
CN105580508B (zh) * | 2013-09-23 | 2018-11-09 | 株式会社富士 | 软支撑销的状态确认装置 |
US10223781B2 (en) * | 2013-09-23 | 2019-03-05 | Fuji Corporation | Soft back-up pin state checking device |
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CN103329646A (zh) | 2013-09-25 |
KR20140097968A (ko) | 2014-08-07 |
DE112012005106T5 (de) | 2014-09-18 |
US9332686B2 (en) | 2016-05-03 |
JP2013120765A (ja) | 2013-06-17 |
CN103329646B (zh) | 2016-08-31 |
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US20130276281A1 (en) | 2013-10-24 |
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