WO2013080356A1 - 電子機器用ラック及び情報処理装置 - Google Patents
電子機器用ラック及び情報処理装置 Download PDFInfo
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- WO2013080356A1 WO2013080356A1 PCT/JP2011/077791 JP2011077791W WO2013080356A1 WO 2013080356 A1 WO2013080356 A1 WO 2013080356A1 JP 2011077791 W JP2011077791 W JP 2011077791W WO 2013080356 A1 WO2013080356 A1 WO 2013080356A1
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- WIPO (PCT)
- Prior art keywords
- electronic device
- heat exchanger
- space
- rack
- temperature
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Definitions
- the present invention relates to an electronic equipment rack and an information processing apparatus.
- a large number of racks (server racks) are installed in a computer room, and a plurality of computers (servers) are stored in each rack. And according to the operating state of those computers, jobs are organically distributed to the computers, and a large number of jobs are processed efficiently.
- Packaged air conditioners can accurately control the temperature of the blown air, but it is difficult to manage the temperature distribution in the room using only packaged air conditioners. A place occurs. In addition, since there is a distance from the packaged air conditioner to the rack, the packaged air conditioner is required to have a large blowing capacity, which contributes to increased power consumption.
- a system called In-Row in which a cooling device having almost the same size as the rack is arranged between the racks may be adopted.
- This system high-temperature air exhausted from the rack is cooled in the vicinity of the rack, thereby suppressing excessive cooling and generation of heat pools, thereby saving power in the air conditioning equipment.
- An object of the present invention is to provide an electronic equipment rack and an information processing apparatus capable of efficiently cooling electronic equipment even when the amount of heat generated per rack is 30 kW or more.
- a plurality of panels surrounding a first space, an electronic device storage unit that is disposed in the first space and stores an electronic device, and the first space
- a heat exchanger disposed at a position separated from the electronic device storage portion, and provided between the electronic device storage portion and the heat exchanger and separated from other spaces in the first space.
- a rack for electronic equipment having a second space and a blower for circulating the air in the first space in the order of the electronic equipment storage section, the second space, and the heat exchanger.
- a plurality of panels that surround a first space, an electronic device storage unit that is disposed in the first space and stores an electronic device, and the first space
- a heat exchanger disposed in a position separated from the electronic device storage portion, and provided between the electronic device storage portion and the heat exchanger and from other spaces in the first space
- an information processing apparatus having a separated second space, and a blower that circulates air in the first space in the order of the electronic device storage unit, the second space, and the heat exchanger. Is done.
- the electronic equipment can be efficiently cooled and the power consumption can be reduced even if the heat generation amount per rack is 30 kW or more.
- FIG. 1 is a schematic diagram illustrating an electronic device rack according to the first embodiment and an information processing apparatus in which the electronic device is accommodated in the electronic device rack.
- FIG. 2 is a front view of the heat exchanger.
- FIG. 3 is a diagram illustrating a result of actually manufacturing the information processing apparatus according to the first embodiment and measuring the temperature of each unit.
- FIG. 4 is a diagram showing the results of examining the relationship between the load power and the heat exchange amount in Examples and Comparative Example 1.
- FIG. 5 is a plan view showing the arrangement of the first comparative example.
- FIG. 6 is a diagram illustrating the effect of the embodiment in comparison with the comparative example 2.
- FIG. 7 is a diagram showing the results of examining the relationship between the air volume and the heat passage rate in Examples and Comparative Example 3.
- FIG. 8 is a diagram illustrating a modification of the first embodiment.
- FIG. 9 is a diagram illustrating an electronic device rack according to the second embodiment and an information processing apparatus in which the electronic device is accommodated in the electronic device rack.
- FIG. 10 is a flowchart illustrating a method of controlling the blower fan and the cooling water supply amount by the control unit of the second embodiment.
- In-Row a system called In-Row
- the amount of heat generated per rack is currently about 10 kW, the amount of heat generated per rack is expected to be 30 kW or more in the near future. It becomes difficult to cool the used electronic equipment.
- FIG. 1 is a schematic diagram illustrating an electronic device rack according to the first embodiment and an information processing apparatus in which the electronic device is accommodated in the electronic device rack.
- the X direction in FIG. 1 is the front-rear direction
- the Y direction is the width direction
- the Z direction is the height direction.
- the electronic device rack 10 has a rectangular parallelepiped shape in which six surfaces are surrounded by panels 10 a, 10 b, 10 c,. However, at least one or both side panels of the rack 10 can be opened and closed, and the electronic device 15 can be easily attached, detached, and maintained. Note that the space surrounded by the panels 10a, 10b, 10c,... Corresponds to the first space.
- an electronic device storage unit 11 that stores the electronic device 15, a dry coil heat exchanger 12, and a blower fan 13 that circulates air in the rack 10 are provided.
- a partition plate 14 is disposed on the electronic device storage unit 11 and the heat exchanger 12.
- the electronic device storage unit 11 and the heat exchanger 12 are arranged in a line between the front panel 10 a and the back panel 10 b of the rack 10.
- a space between the electronic device storage unit 11 and the heat exchanger 12 is referred to as a hot aisle 21, and a space between the heat exchanger 12 and the back panel 10 b of the rack 10 is a first cold aisle 22.
- the space between the front panel 10a of the rack 10 and the electronic device housing 11 is referred to as a second cold aisle 24, and the space between the top panel 10c of the rack 10 and the partition plate 14 is referred to as a cold air flow path 23.
- the hot aisle 21 corresponds to the second space.
- the hot aisle 21 is separated from other spaces by the electronic device storage unit 11, the heat exchanger 12, the partition plate 14, and the side panel of the rack 10. Further, the cold air passage 23 and the second cold aisle 22 are in communication with each other in a state where air can freely flow.
- the electronic device 15 In the electronic device storage unit 11, a plurality of electronic devices 15 are stored side by side in the height direction.
- the electronic device 15 is a server (computer).
- an electronic device such as a storage or a switch may be stored in the electronic device storage unit 11.
- each electronic device 15 One surface (left surface in FIG. 1) of each electronic device 15 is an intake surface, and the other surface (right surface in FIG. 1) is an exhaust surface. Each electronic device 15 is arranged with the intake surface facing the second cold aisle 24 and the exhaust surface facing the hot aisle 21.
- the heat exchanger 12 has a pipe 12 a through which a cooling medium flows and a large number of fins 12 b connected to the pipe 12 a, and is stored in the electronic device storage unit 11.
- the electronic device 15 is disposed to face the exhaust surface. The air whose temperature has increased while passing through the electronic device 15 is cooled when passing between the fins 12b of the heat exchanger 12.
- the width and height of the heat exchanger 12 are substantially the same as the width and height of the electronic device housing 11.
- the heat exchanger 12 is connected to a cooling device (not shown) disposed outdoors via a pipe (not shown), and a cooling medium circulates between the cooling device and the heat exchanger 12.
- a cooling medium circulates between the cooling device and the heat exchanger 12.
- water is used as the cooling medium
- a free cooling device is used as the cooling device.
- a free cooling device is a device that cools water by using a phenomenon that takes away latent heat from the surroundings when water evaporates without using a refrigerator.
- the blower fan 13 is disposed between the first cold aisle 22 and the cold air flow path 23.
- the blower fan 13 is an example of a blower.
- each electronic device 15 is not provided with a blower fan, and the air in the rack 10 is circulated by the blower fan 13 so that the air is passed through the electronic device 15.
- each simulation server 15a is stored in the electronic device storage unit 11, and the heat generation amount of each simulation server 15a is 7.3 kW, 7.4 kW, 7.6 kW, 7.6 kW, It was set to 5.1 kW and 5.0 kW (total 40 kW).
- cooling water having a temperature of 15.0 ° C. was supplied to the heat exchanger 12. And the temperature and the wind speed in each position shown with the black dot in FIG. 3 were measured.
- the temperature of the air discharged from the simulation server 15a was 44 ° C. to 49 ° C.
- the temperature of the air after passing through the heat exchanger 12 was 21 ° C. to 23 ° C.
- emitted from the heat exchanger 12 was 21.4 degreeC.
- the arrow in FIG. 3 has shown the flow direction of air.
- the horizontal axis represents the total load power of the electronic devices (simulated servers) housed in the rack, and the vertical axis represents the amount of heat exchange by the heat exchanger. It is a figure which shows the result of having investigated the relationship between and heat exchange amount.
- the broken line in FIG. 4 shows the case where the load power is equal to the exchange heat amount, that is, the heat exchange rate is 100%.
- a model in which the electronic device 15 and the heat exchanger 12 are arranged in the rack 10 shown in FIG. 1 was adopted.
- the footprint of the example is 1.1 m 2 .
- Comparative Example 1 a model in which a rack 31 and a heat exchanger 32 are arranged in a room having a footprint of 5.2 m 2 as shown in the plan view of FIG.
- the air discharged from the rack 31 returns to the intake surface side of the heat exchanger 32 through the side of the rack 31 and above.
- the heat exchange rate is almost 100%, and other cooling devices such as a packaged air conditioner are unnecessary.
- the computer room also has a temperature change due to the entry and exit of a person, it is preferable to arrange a packaged air conditioner that adjusts the temperature of the entire room in which the rack 10 is arranged also in this embodiment.
- FIG. 6 is a diagram showing the effect of the embodiment in comparison with Comparative Example 2, with the load power on the horizontal axis and the amount of power required for cooling on the vertical axis.
- Comparative Example 2 a model in which an electronic device (simulated server) and a heat exchanger 12 are arranged in the rack 10 shown in FIG. 1 was adopted. Further, as Comparative Example 2, a model in which a rack storing electronic devices in a room and a packaged air conditioner was adopted. In Comparative Example 2, heat generated in the electronic device is discharged from the rack into the room, and the air discharged into the room is cooled by the package air conditioner and conveyed to the vicinity of the rack.
- the power consumption of the embodiment shows the sum of the power consumption of the blower fan 13 and the power consumption of the pump that supplies the cooling water to the heat exchanger 12, but the power consumption of the blower fan 13 is It is a measured value, and the power consumption of the pump is an estimated value. Moreover, the power consumption of the comparative example 2 is a measured value.
- the amount of electric power required for cooling the electronic device is much smaller than that in Comparative Example 2, and when the heat generation amount per rack is 40 kW, the power consumption can be reduced by about 64%.
- the horizontal axis represents the air volume passing through the heat exchanger, and the vertical axis represents the heat exchange rate of the heat exchanger. It is a figure which shows the result.
- the cooling water flow rate is 74.7 L (liter) / min, and the air volume is 3400 m 3 / h. did it.
- the cooling water amount was 95.6 L / min and the air amount was 7380 m 3 / h.
- FIG. 7 shows that the example requires less cooling water flow rate and air volume than Comparative Example 3, and consumes less power.
- the electronic equipment rack and the information processing apparatus can sufficiently cool the electronic equipment stored in the rack with a small amount of power even when the amount of heat generated per rack exceeds 30 kW. it can. Thereby, the power consumption of facilities, such as a data center, can be reduced.
- a guide plate 16 that can be freely inserted and removed is provided between the electronic device storage areas of the electronic device storage unit 11, and the amount of air supplied to each electronic device 15 is adjusted by the protruding amount of the guide plate 16. You may be able to do it.
- the amount of protrusion of the guide plate 16 may be adjusted individually by an operator, and a temperature sensor is provided in each electronic device 15, and the amount of protrusion of the guide plate 16 is automatically set according to the temperature detected by these temperature sensors. It may be changed.
- the guide plate 16 is an example of an air volume adjusting unit that adjusts the air volume of the electronic device storage area.
- FIG. 9 is a diagram illustrating an electronic device rack according to the second embodiment and an information processing apparatus in which the electronic device is accommodated in the electronic device rack.
- This embodiment is different from the first embodiment in that the number of rotations of the blower fan 13 and the amount of cooling water supplied to the heat exchanger 12 are controlled in accordance with the temperature difference before and after the heat exchanger 12.
- the same components as those in FIG. 9 are controlled in accordance with the temperature difference before and after the heat exchanger 12.
- a plurality of electronic devices 15 are stored in the electronic device storage section 11.
- the control unit 15 b is accommodated in the lowermost stage of the electronic device accommodation unit 11.
- the controller 15b controls the rotational speed of the blower fan 13 and the amount of cooling water supplied to the heat exchanger 12 as will be described later.
- the control unit 15b may be realized by using the electronic device 15 (server) stored in the electronic device storage unit 11, or may be realized by a dedicated circuit. When the control unit 15b is realized by a dedicated circuit, the control unit 15b may be arranged in a place other than the electronic device storage unit 11.
- a temperature sensor 41 that detects the temperature of air discharged from each electronic device 15 is disposed on the exhaust surface side of each electronic device 15 stored in the electronic device storage unit 11. ing.
- the first cold aisle 22 is provided with a temperature sensor 42 that detects the temperature of air after passing through the heat exchanger 12. Signals output from these temperature sensors 41 and 42 are transmitted to the control unit 15b.
- the guide plate 16 is provided between each electronic device storage area of the electronic device storage unit 11.
- a driving device (not shown) is driven based on an output of a temperature sensor (not shown) provided in each electronic device 15, and the protruding amount of the guide plate 16 changes.
- a temperature sensor 41 shown in FIG. 9 may be used as a temperature sensor used for controlling the guide plate 16.
- the protruding amount of the guide plate 16 may be controlled by the control unit 15b.
- the heat exchanger 12 is connected to the cooling device 45 via a cooling water supply pipe 47a and a cooling water return pipe 47b.
- a pump 46 is connected to the cooling water supply pipe 47 a, and the cooling water circulates between the cooling device 45 and the heat exchanger 12 by the pump 46.
- a temperature sensor 44a for detecting the temperature of the cooling water supplied to the heat exchanger 12 is arranged in the pipe 47a, and a temperature sensor 44b for detecting the temperature of the cooling water discharged from the heat exchanger 12 is arranged in the pipe 47b. Is arranged. Outputs of these temperature sensors 44a and 44b are also transmitted to the control unit 15b.
- the cooling device 45 a hybrid cooling device having a free cooling part 45a and a refrigerator 45b is used as the cooling device 45.
- the cooling device 45 normally reduces the cooling water temperature only by the free cooling part 45a.
- the refrigerator 45b is operated by a signal from the control unit 15b.
- an inverter type pump is used as the pump 46.
- the discharge amount of the pump 46 changes according to a signal from the control unit 15b.
- the control unit 15b determines the rotational speed of the blower fan 13 and the amount of cold water supplied to the heat exchanger 12 so that the difference between the average temperature of the hot aisle 21 and the average temperature of the first cold aisle 22 is 20 ° C. or more. To control.
- the heat exchange efficiency of the heat exchanger 12 is increased by maintaining the temperature difference before and after the heat exchanger 12 at 20 ° C. or more, and the power consumed in the facility such as the data center is further increased. To reduce.
- step S ⁇ b> 11 the control unit 15 b calculates the average value Tc of the detected temperatures of the plurality of temperature sensors 42 arranged in the first cold aisle 22 and sets it as the temperature of the first cold aisle 22.
- the temperature of the air supplied to the electronic device 15 can also be said to be the same as the temperature Tc of the first cold aisle 22.
- the controller 15b determines whether or not the temperature Tc exceeds a preset allowable value Tmax.
- the control unit 15b determines that the temperature Tc exceeds the allowable value Tmax (in the case of YES), the electronic device 15 is not sufficiently cooled, and the electronic device 15 may malfunction or break down. In this case, the process proceeds to step S12, and the control unit 15b controls the pump 46 to increase the amount of cooling water supplied to the heat exchanger 12, or controls the blower fan 13 to increase the rotational speed, or freezing The temperature Tc is decreased by either turning on the machine 45b and decreasing the temperature of the cooling water. Then, it returns to step S11 and continues processing.
- step S11 determines in step S11 that the temperature Tc does not exceed the allowable value Tmax (in the case of NO), it can be said that the electronic device 15 is sufficiently cooled. In this case, the process proceeds to step S ⁇ b> 13, and the control unit 15 b calculates the average value of the detected temperatures of the plurality of temperature sensors 41 arranged in the hot aisle 21 and sets it as the temperature Th of the hot aisle 21.
- the controller 15b calculates the difference between the temperature Th of the hot aisle 21 and the temperature Tc of the first cold aisle 22. If the difference between the temperature Th and the temperature Tc exceeds the allowable value of 20 ° C. and the control unit 15b is YES (in the case of YES), the heat exchange efficiency by the heat exchanger 12 is sufficiently high. Returning to step S11, the processing is continued.
- step S14 the control unit 15b turns off the refrigerator 45b and gradually decreases the rotational speed of the fan 13 to increase the temperature Th of the hot aisle 21.
- the pump 46 is further controlled to reduce the amount of cooling water supplied to the heat exchanger 12 in order to avoid excessive cooling. Then, it returns to step S11 and continues a process.
- the temperature before and behind the heat exchanger 12 is measured by the temperature sensors 41 and 42, and the rotational speed of the blower fan 13 is set so that the temperature difference between the front and rear of the heat exchanger 12 is 20 ° C. or more.
- the amount of cooling water supplied to the heat exchanger 12 and the on / off of the refrigerator 45b are controlled. Thereby, the heat exchange efficiency of the heat exchanger 12 increases, and the power consumed in the facility such as the data center can be further reduced.
- the temperature sensor 41 is arranged corresponding to each electronic device 15 housed in the electronic device housing portion 11, but the exhaust surface of one or more electronic devices 15 that are considered to be the hottest. Only the temperature sensor 41 may be arranged. In the present embodiment, three temperature sensors 42 are arranged in the first cold aisle 22, but the number of temperature sensors 42 arranged in the first cold aisle 22 may be one, two or four. It may be more than one.
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Abstract
Description
図1は、第1の実施形態に係る電子機器用ラック及びその電子機器用ラックに電子機器を収納してなる情報処理装置を示す模式図である。なお、ここでは説明の便宜上、図1のX方向を前後方向、Y方向を幅方向、Z方向を高さ方向とする。
図1に示す電子機器用ラック10では、第2のコールドアイル24を上から下に流れるエアーの流れが速いと、電子機器収納部11の上側に配置された電子機器15と下側に配置された電子機器15とでエアー供給量が大きく異なることがある。その結果、電子機器収納部11の上側に配置された電子機器15は冷却不足となり、故障や誤動作が発生する原因となる。
図9は、第2の実施形態に係る電子機器用ラック及びその電子機器用ラックに電子機器を収納してなる情報処理装置を示す図である。本実施形態が第1の実施形態と異なる点は熱交換器12の前後の温度差に応じて送風ファン13の回転数及び熱交換器12への冷却水の供給量を制御することにある。図9において図1と同一物には同一符号を付して、重複する部分の説明は省略する。
Claims (12)
- 第1の空間を囲む複数のパネルと、
前記第1の空間内に配置されて電子機器が収納される電子機器収納部と、
前記第1の空間内であって前記電子機器収納部から離隔した位置に配置された熱交換器と、
前記電子機器収納部と前記熱交換器との間に設けられて前記第1の空間内の他の空間から分離された第2の空間と、
前記第1の空間内のエアーを、前記電子機器収納部、前記第2の空間、及び前記熱交換器の順番で循環させる送風機と
を有することを特徴とする電子機器用ラック。 - 更に、前記熱交換器を通過する前のエアーの温度を検出する第1の温度センサと、
前記熱交換器を通過した後のエアーの温度を検出する第2の温度センサと、
前記第1の温度センサ及び前記第2の温度センサの検出温度に応じて前記送風機を制御する制御部と
を有することを特徴とする請求項1に記載の電子機器用ラック。 - 前記電子機器収納部は、前記電子機器を収納する複数の電子機器収納エリアと、電子機器収納エリアの通風量を調整可能な風量調整部とを有することを特徴とする請求項1又は2に記載の電子機器用ラック。
- 前記熱交換器がドライコイル式熱交換器であることを特徴とする請求項1乃至3のいずれか1項に記載の電子機器用ラック。
- 前記電子機器収納部に収納される前記電子機器が計算機であることを特徴とする請求項1乃至4のいずれか1項に記載の電子機器用ラック。
- 第1の空間を囲む複数のパネルと、
前記第1の空間内に配置されて電子機器が収納された電子機器収納部と、
前記第1の空間内であって前記電子機器収納部から離隔した位置に配置された熱交換器と、
前記電子機器収納部と前記熱交換器との間に設けられて前記第1の空間内の他の空間から分離された第2の空間と、
前記第1の空間内のエアーを、前記電子機器収納部、前記第2の空間、及び前記熱交換器の順番で循環させる送風機と
を有することを特徴とする情報処理装置。 - 更に、前記第1の空間の外に配置される冷却装置と、
前記冷却装置と前記熱交換器との間で冷却媒体を循環させるポンプと
を有することを特徴とする請求項6に記載の情報処理装置。 - 更に、前記熱交換器を通過する前のエアーの温度を検出する第1の温度センサと、
前記熱交換器を通過した後のエアーの温度を検出する第2の温度センサと、
前記第1の温度センサ及び前記第2の温度センサの検出温度に応じて前記送風機を制御する制御部と
を有することを特徴とする請求項7に記載の情報処理装置。 - 前記制御部は、前記第1の温度センサ及び前記第2の温度センサの検出温度の差が20℃以上となるように、前記送風機及び前記ポンプを制御することを特徴とする請求項8に記載の情報処理装置。
- 前記電子機器にはファンが設けられていないことを特徴とする請求項6乃至9のいずれか1項に記載の情報処理装置。
- 前記冷却装置が、冷凍機を有しないフリークーリング装置であることを特徴とする請求項7乃至10のいずれか1項に記載の情報処理装置。
- 前記制御部が、前記電子機器収納部に収納された計算機であることを特徴とする請求項7乃至11のいずれか1項に記載の情報処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11876495.0A EP2787801B1 (en) | 2011-12-01 | 2011-12-01 | Rack for electronic equipment, and information processing device |
JP2013546919A JP5804078B2 (ja) | 2011-12-01 | 2011-12-01 | 情報処理装置 |
PCT/JP2011/077791 WO2013080356A1 (ja) | 2011-12-01 | 2011-12-01 | 電子機器用ラック及び情報処理装置 |
CN201180075184.2A CN103959925A (zh) | 2011-12-01 | 2011-12-01 | 电子设备用机柜以及信息处理装置 |
US14/290,910 US9814161B2 (en) | 2011-12-01 | 2014-05-29 | Electronic device rack and information processing apparatus |
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TW201521560A (zh) * | 2013-11-22 | 2015-06-01 | Hon Hai Prec Ind Co Ltd | 數據中心及其散熱系統 |
CN203691803U (zh) * | 2013-12-27 | 2014-07-02 | 中兴通讯股份有限公司 | 一种插箱及终端 |
CN104363739B (zh) * | 2014-10-23 | 2017-04-26 | 国家电网公司 | 设备机柜冷风量自动平衡装置 |
TW201714042A (zh) * | 2015-10-13 | 2017-04-16 | 鴻海精密工業股份有限公司 | 貨櫃型資料中心 |
US11076509B2 (en) | 2017-01-24 | 2021-07-27 | The Research Foundation for the State University | Control systems and prediction methods for it cooling performance in containment |
US10327359B1 (en) * | 2018-04-30 | 2019-06-18 | Baidu Usa Llc | Coupling designs for a data center building using indirect evaporative cooling (IDEC) units |
US10925187B1 (en) * | 2019-08-30 | 2021-02-16 | Dell Products, L.P. | Remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment |
US11523546B1 (en) * | 2019-10-11 | 2022-12-06 | Meta Platforms, Inc. | Rack-level aisle emulator |
EP4252500A1 (en) | 2020-11-25 | 2023-10-04 | Digital Porpoise, LLC | Cooling system for a data center that includes an offset cooling technology |
WO2023139433A2 (en) * | 2022-01-18 | 2023-07-27 | Liquidstack Holding B.V. | Actively controlled immersion cooling system and method |
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CN103959925A (zh) | 2014-07-30 |
EP2787801A1 (en) | 2014-10-08 |
JPWO2013080356A1 (ja) | 2015-04-27 |
US9814161B2 (en) | 2017-11-07 |
JP5804078B2 (ja) | 2015-11-04 |
EP2787801A4 (en) | 2016-01-06 |
EP2787801B1 (en) | 2017-04-12 |
US20140268547A1 (en) | 2014-09-18 |
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