Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/66—Mercaptans
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic

Definitions

• This invention relates to a two part epoxy adhesive, and a method for preparing the same.
• a thiol group-containing polyether polymer obtained by allowing a halogen-terminated polyether polymer which is obtained by addition of epihalohydrin to a polyol having a polyether moiety in the main chain and having 3 or more hydroxy 1 groups at the ends to react with an alkali hydrosulfide and/or an alkali polysulfide in amides.
• an epoxy resin composition containing this polyether polymer has favorable curability, but when this epoxy resin composition is used as a curing agent for epoxy resins, the gel time is so short that curing is initiated while the epoxy resin and a thiol compound that is a curing agent are being mixed with each other, and hence, the working conditions are restricted.
• a liquid polysulfide polymer for epoxy resin curing which is a copolymer obtained by allowing a mixture of a tri- or tetrafunctional alkyl halide and a bifunctional alkyl halide to react with an alkali polysulfide, the amount of said polyfunctional monomers in the polymerization being 20 to 60% by mol based on all the monomers, and which contains 2 to 30% by mass of end thiol groups. It is indicated that by using this liquid sulfide polymer in combination with an amine, the curing rate becomes higher as compared with that of conventional polysulfide polymers. However, the gel time is short, and the resulting cured product has a problem of workability because it develops odor, though it is excellent in impact resistance, chemical resistance, etc.
• the present invention provides a novel epoxy based adhesive system, which allows a controllable gel time ranging from 5min to more than 24 hours.
• This invention is directed to a two part epoxy adhesive, which includes a first part comprising an epoxy resin containing two or more epoxy groups in one molecule, and a peroxide containing a -O-O- structure; and a second part comprising a thiol curing agent and an curing accelerator.
• the peroxide has a formula of R1-0-0-R2, wherein Rl and R2 are each independently selected from hydrogen atom, alkyl group of 1—10 carbon atoms and aromatic group including one or more phenyl group, and optionally there is a carbonyl group between Rl, R2 and -O-O-.
• the thiol curing agent containing one or more R3-SH groups in one molecule, wherein R3 is an alkyl group which includes 2—16 carbon atoms or aromatic group.
• first part comprising 100 parts by weight of an epoxy resin containing two or more epoxy groups in one molecule; 0.03-3 parts by weight of a peroxide containing a -O-O- structure; and a second part comprising 110-120 parts by weight of a thiol curing agent, 0.05-5 parts by weight of an curing accelerator.
• the gel time of the epoxy based compositions can be easily controlled
• peroxide is for the first time used to delay the reaction of thiol-amine curing system
• this adhesive system is suitable for satisfying different gel time requirements from customers.
• a first part comprising 100 parts by weight of an epoxy resin containing two or more epoxy groups in one molecule; 0.03-3 parts by weight of a peroxide containing a -O-O- structure;
• a second part comprising 110-120 parts by weight of a thiol curing agent, 0.05-5 parts by weight of an curing accelerator.
• a first part comprising 100 parts by weight of an epoxy resin containing two or more epoxy groups in one molecule; 0.2-2 parts by weight of a peroxide containing a -O-O- structure; 6-7 parts by weight of silane, and 4-5 parts by weight of thixotropic agent;
• a second part comprising 113-118 parts by weight of a thiol curing agent, 0.2-5 parts by weight of an accelerator, and 12-16 parts by weight of filler.
• the epoxy resin containing two or more epoxy group in molecule examples include polyhydric phenols, such as bisphenol A, halogenated bisphenol A, bisphenol F, halogenated bisphenol F, resorcinol, hydroquinone, pyrocatechol, 4,4'-dihydroxybiphenyl and 1,5-hydroxynaphthalene, polyhydric alcohols, such as ethylene glycol, propylene glycol and glycerol, and epoxy resins obtained by the addition of epichlorohydrin to aromatic dicarboxylic acids such as oxybenzoic acid and phthalic acid, but the epoxy resins are not limited to these resins.
• polyhydric phenols such as bisphenol A, halogenated bisphenol A, bisphenol F, halogenated bisphenol F, resorcinol, hydroquinone, pyrocatechol, 4,4'-dihydroxybiphenyl and 1,5-hydroxynaphthalene
• polyhydric alcohols such as ethylene glycol, propylene glyco
• Examples of commercially available epoxy resin products include Epon 828, 826, 862, 1001, 1002, 1071 (from Hexion Co. Ltd), DER 331, 332, 354, 671, 431, 731 (from Dow Chemical Co.Ltd), Epicoat 828, 1001, 801, 806, 807, 152, 604, 630, 871, YX8000, YX8034, YX4000 and Cardura E10P (from Japan Epoxy Resins Co., Ltd.), Epichlon 830, 835LV, HP4032D, 703, 720 and HP820 (from Dainippon Ink & Chemicals, Inc.), EP4100, EP4000, EP4080, EP4085, EP4088, EPU6, EPR4023, EPR1309 and EP49-20 (from ADEKA Corporation), Denachol EX411, EX314, EX201, EX212, EX252, EX111, EX146 and EX721 (from Nagase ChemteX Corporation), and
• the peroxide used in the invention has such structure as R1-0-0-R2, in which Rl and R2 are each independently selected from hydrogen atom, alkyl group of 1—10 carbon atoms and aromatic group including one or more phenyl group, and optionally there is a carbonyl group between Rl, R2 and -O-O- .
• Rl and R2 are each independently selected from hydrogen atom, alkyl group of 1—10 carbon atoms and aromatic group including one or more phenyl group, and optionally there is a carbonyl group between Rl, R2 and -O-O- .
• Examples of commercially available products include Benzoyl peroxide (CAS No. 94-36-0), TRIGONOX C-50D, TRIGONOX P-50S, PERKADOX L-50S, PERKADOX PD-50S (from Akzonobel Chemical Co. Ltd), tert-amylperoxy-3,5,5-trimethylhexanoate, tert-butyl
• Suitable peroxides are not limited to these compounds.
• R1-0-0-R2 there is a carbonyl group between Rl, R2 and -0-0-.
• the peroxide was used as solution when preparing the inventive adhesives, and the used solvent includes ethyl acetate, acetone, chloroform and the like.
• silane in this invention is to increase the crosslink degree for cured compound and used as a coupling agents between fillers and resin substrates.
• the silane can be used in this invention, and these silane can be ended by amine, alkyl, or epoxy groups.
• Commercially products include KH550, KH560 (from Chinese Chemical Company), Glymo, Wetlink 78 (from Evonik), A-1106, A-1702, A-1002 (from Momentive Co.Ltd).
• the silane products are not limited to these products. These resins can be used singly or can be used in combination of two or more kinds in arbitrary proportions.
• thixotropic agent can be used in invention to control the thixotropic and viscosity properties of the adhesive
• fumed silica the commercially products that can be used in invention include Cabosil TS-720, Cabosil M5 (from Cabot Company).
• the curing accelerator can be a nucleophilic substance such as an amine, a tertiary phosphine, quaternary ammonium salt with a nucleophilic anion, a quaternary phosphonium salt with a nucleophilic anion, an imidazole, tertiary arsenium saltwith a nucleophilic anion and a tertiary sulfonium salt with a nucleophilic anion.
• Possible amine catalysts include primary, secondary and tertiary amines. Various mixtures of catalysts can be used.
• Tertiary amine accelerator are preferred and are described, for examples: trimethylamine, triethylamine, tetraethylmethylenediamine, tetramethylpropane- 1 ,3-diamine, tetramethylhexane- 1 ,6-diamine, pentamethyldiethylenetriamine, pentamethyldipropylenetriamine, bis(2-dimethylaminoethyl)ether, ethylene glycol (3-dimethyl)aminopropyl ether, dimethylaminoethanol, dimethylaminoethoxyethanol, ⁇ , ⁇ , ⁇ '-trimethylaminoethylethanolamine, dimethylcyclohexylamine, ⁇ , ⁇ -dimethylaminomethylphenol, ⁇ , ⁇ -dimethylpropylamine, ⁇ , ⁇ , ⁇ ', ⁇ '-tetramethylhexamethylenediamine, N-methylpiperidine, ⁇ , ⁇ ' -dimethylpiperazine,
• N-methyl-N'-(2-hydroxyethyl)morpholine triethylenediamine and hexamethylenetetramine.
• tertiary amines are preferable, and ⁇ , ⁇ -dimethylbenzylamine and 2,4,6-tris (dimethylaminomethyl) phenol are particularly preferable. These can be used singly or can be used in combination of two or more kinds in arbitrary proportions.
• the thiol used in invention contains one or more R3-SH group in molecules, R3 is an alkyl group includes 2—16 carbon atoms or aromatic group. Examples for the commercially products include Polythiol QE 340M, GMP 800 (CAS No. 100-53-8), Didodecanethiol (CAS No. 112-55-0), 1,3-dimercaptopropane (CAS No. 109-80-8), Capcure 3-800 (Cognis Chemical company).
• fillers can be used in the invention, and it is not specifically restricted.
• Examples for commonly used fillers include CaC0 3 , Si0 2 , BaS0 4 , A1 2 0 3 , CaSi0 4 .
• the process for preparing the epoxy resin composition of the invention is not specifically restricted as long as the materials used can be mixed and dispersed, and for example, the following processes can be used.
• the components are mixed by a stirring rod, a spatula or the like in an appropriate container, such as a glass beaker, a can, a plastic cup or an aluminum cup.
• the components are mixed by an extruder type kneading extrusion machine. These preparation process can be used but the preparation process is not limited these process. These preparation processes can be used singly or can be used in combination of two or more process in preparing two components separately.
• the gel time measurements were based on the standard ASTM D3532-99.
• the gel time is considered as the time when the viscosity of the adhesive increased to twice time of the original compound.
• the lap shear strength measurements were based on the testing standard ASTM D 3161.
• the substrates used are cold rolled steel, and the bonding line is 10mm*25 mm.
• the surface of the substrates were washed by ethylacetate or actone.
• the data show in table 1 is the average value for at least 5 measurement data.
• Epon862 Bis phenol F Epoxy resin Hexion
• Example 1—14 (Useful embodiment for the invention including the key performance principles)
• the ingredients listed in Table 1 were combined to provide gel-time controllable epoxy based adhesives. Fixing other components in formulation, only varying the concentration of peroxide in the formulation, the gel time can be adjusted from 5min to more than 24h.
• the procedure for preparation of the first part as follows: peroxide was dissolved into acetone to form a solution with peroxide concentration 0.12g/ml. Epoxy resin was weighed out in a speedmixer cup at room temperature and then peroxide solution was weighed out in the mixing container, mixing the two components under 2000rpm THINKY Speedmixer for lmin at room temperature. The silane and thixotropic agent were weighed out in the mixing container.
• the combined four components were mixed with 2000 rpm rate for 1 minute under room temperature and 0.2 kPa vacuum in THINKY Speedmixer. After mixing and taking out from speedmixer, the liquid mixture was dropped in to a one part of 2K cartridge.
• the procedure for preparation of the second part as follows: firstly, thiol used as curing agent was weighed out in a mixing container and then amine catalyst was weighed out in mixing container, mixing the two components under 2000rpm THINKY Speedmixer for 30 seconds at room temperature, and then fillers were weighed and added into the mixture.
• the combined three components were mixed with 2000 rpm rate for 1 minute under room temperature and 0.2 kPa vacuum in THINKY Speedmixer.
• Samples for gel time measurements or mechanical properties measurements were prepared by using a mechanical or air pressure adhesive gun to extrude the two parts out and mixing, then apply it onto substrates.
• the gel time measurements were based on the standard ASTM D3532-99, and the results were listed in Table 1. From it we can find that the gel time will increase from 4.2 min to 24 hours by increasing the benzoyl peroxide from 0.03-2.99 weight% in formulations.
• the lap shear strength measurements were based on the testing standard ASTM D 3161, The used substrates are cold rolled steel. The measurement results were shown in Table 1. From it we can find that the addition of peroxide in the formulation will not have negative influence on the mechanical performance of the adhesives. TABLE 1
• the weight of components were listed in Table 2, and the procedure processes for examples 11-20 are similar as examples 1—10.
• the used peroxides including Perkadox L-50S, Trigonox P-50S were dissolved in acetone with a concentration of 0.12g/ml.
• Epoxy resin was weighed out in a speedmixer cup at room temperature and then peroxide solution was weighed out in the mixing container, mixing the two components under 2000rpm THINKY Speedmixer for 1 min at room temperature.
• the silane and thixotropic agent were weighed out in the mixing container.
• the combined four components were mixed with 2000 rpm rate for 1 minute under room temperature and 0.2 kPa vacuum in THINKY Speedmixer.
• the liquid mixture was dropped in to a one part of 2K cartridge.
• the procedure for preparation of the second part as follows: firstly, thiol used as curing agent was weighed out in a mixing container and then amine catalyst was weighed out in a mixing container, mixing the two components under 2000rpm THINKY Speedmixer for 30 seconds at room temperature. The fillers were weighed and added into the mixture, then the combined three components were mixed with 2000 rpm rate for 1 minute under room temperature and 0.2 kPa vacuum in THINKY Speedmixer. After mixing and taking out from speedmixer, the liquid mixture was dropped in to another one part of 2K cartridge.
• peroxide additive for delaying gel time in the epoxy-thiol curing systems is a total innovation and the effects are rather surprising. This finding together with the present invention will have a deep influence on design of the future epoxy-thiol based adhesives. For example, it can be used to design a series of specially products with different gel time for satisfying the requirements from customers.

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• Inorganic Chemistry (AREA)
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