JP6095016B2 - ゲル化時間を調整可能な２液型エポキシ接着剤 - Google Patents

ゲル化時間を調整可能な２液型エポキシ接着剤 Download PDF

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Publication number
JP6095016B2
JP6095016B2 JP2014534933A JP2014534933A JP6095016B2 JP 6095016 B2 JP6095016 B2 JP 6095016B2 JP 2014534933 A JP2014534933 A JP 2014534933A JP 2014534933 A JP2014534933 A JP 2014534933A JP 6095016 B2 JP6095016 B2 JP 6095016B2
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JP
Japan
Prior art keywords
liquid
epoxy
weight
parts
epoxy adhesive
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Expired - Fee Related
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JP2014534933A
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English (en)
Japanese (ja)
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JP2014531505A5 (enExample
JP2014531505A (ja
Inventor
ウー・ハイピン
ジャン・ジンフェン
ライナー・シェーンフェルト
ナイジェル・フェイ
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2014534933A 2011-10-11 2012-10-11 ゲル化時間を調整可能な２液型エポキシ接着剤 Expired - Fee Related JP6095016B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNPCT/CN2011/080626 2011-10-11
PCT/CN2011/080626 WO2013053100A1 (en) 2011-10-11 2011-10-11 Gel time controllable two part epoxy adhesive
PCT/CN2012/082794 WO2013053328A1 (en) 2011-10-11 2012-10-11 Gel time controllable two part epoxy adhesive

Publications (3)

Publication Number Publication Date
JP2014531505A JP2014531505A (ja) 2014-11-27
JP2014531505A5 JP2014531505A5 (enExample) 2015-11-26
JP6095016B2 true JP6095016B2 (ja) 2017-03-15

Family

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Family Applications (1)

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JP2014534933A Expired - Fee Related JP6095016B2 (ja) 2011-10-11 2012-10-11 ゲル化時間を調整可能な２液型エポキシ接着剤

Country Status (7)

Country Link
US (1) US9371475B2 (enExample)
EP (1) EP2766444B1 (enExample)
JP (1) JP6095016B2 (enExample)
KR (1) KR102049224B1 (enExample)
ES (1) ES2636686T3 (enExample)
IN (1) IN2014CN02625A (enExample)
WO (2) WO2013053100A1 (enExample)

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Publication number Priority date Publication date Assignee Title
KR101693605B1 (ko) 2015-02-10 2017-01-17 한국생산기술연구원 폴리티올 경화제를 포함하는 에폭시 접착제 조성물 및 이의 제조방법
MY178835A (en) 2017-10-31 2020-10-20 Namics Corp Resin composition
CN112703209B (zh) 2018-10-05 2022-08-05 纳美仕有限公司 树脂组合物
CN112789299B (zh) 2018-10-09 2023-02-21 纳美仕有限公司 用于使2-亚甲基-1，3-二羰基化合物固化的固化剂组合物
CN111171284A (zh) * 2020-01-07 2020-05-19 南宁珀源能源材料有限公司 一种环氧改性脂肪胺固化剂及其在硅锭切割固定胶的应用
CN112375209B (zh) * 2020-10-30 2022-07-22 山东益丰生化环保股份有限公司 一种凝胶时间可控的环氧树脂胶黏剂中的固化剂及其制备方法
KR102765200B1 (ko) * 2021-10-15 2025-02-07 주식회사 네패스 우수한 접착 및 속경화 특성을 가지는 에폭시 접착제 조성
WO2024224183A1 (en) * 2023-04-24 2024-10-31 Medtronic, Inc. Implantable medical device with curable liquid feedthrough potting adhesive

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DE3727847A1 (de) * 1987-08-20 1989-03-02 Fuller H B Co Schmelzklebstoff und verfahren zu seiner herstellung und verarbeitung
JP3038777B2 (ja) * 1990-04-05 2000-05-08 大日本インキ化学工業株式会社 不飽和ポリエステル樹脂系塗床材の施工方法
JPH0676428B2 (ja) 1990-05-16 1994-09-28 第一工業製薬株式会社 ショ糖脂肪酸エステルの脱色方法
JP2500526B2 (ja) 1990-12-25 1996-05-29 凸版印刷株式会社 フォトマスクブランクおよびフォトマスク
JP3584537B2 (ja) 1995-03-31 2004-11-04 東レ・ファインケミカル株式会社 チオール基含有ポリエーテルポリマー及びその製造 方法
US6653371B1 (en) 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
AU740553B2 (en) * 1998-01-16 2001-11-08 Loctite (R&D) Limited Curable epoxy-based compositions
CN1133678C (zh) 1998-04-17 2004-01-07 三洋化成工业株式会社 可固化组合物及其固化制品
JP3802253B2 (ja) * 1998-12-22 2006-07-26 化薬アクゾ株式会社 樹脂の硬化促進剤及び硬化方法
US6313257B1 (en) * 1999-03-23 2001-11-06 Lord Corporation Poly (mercaptopropylaryl) curatives
JP2003231736A (ja) * 2002-02-08 2003-08-19 Nagase Chemtex Corp ２液型リペアラブル組成物およびそれを用いたリペアラブル接着剤
DE10357355A1 (de) * 2003-12-09 2005-07-14 Henkel Kgaa 2 K Klebstoffe für den Fahrzeugbau
JP4707981B2 (ja) 2004-08-06 2011-06-22 昭和電工株式会社 成形物の製造方法
KR20080059428A (ko) * 2005-10-07 2008-06-27 디에스엠 아이피 어셋츠 비.브이. 화학적 고정방법
JP5076691B2 (ja) 2007-07-11 2012-11-21 Ｊｆｅスチール株式会社 高強度冷延鋼板の製造方法
EP2176348B1 (en) * 2007-08-02 2017-01-18 Dow Global Technologies LLC Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
EP2226347B1 (en) 2007-12-13 2012-06-27 Showa Denko K.K. Epoxy resin curing agent, method for producing the same, and epoxy resin composition
BRPI0905387B1 (pt) * 2008-01-08 2019-08-06 Dow Global Technologies Inc. Composição curável e resina termofixa enrijecida
JP5466368B2 (ja) * 2008-02-18 2014-04-09 積水化学工業株式会社 電子部品接合用接着剤
US20110077328A1 (en) * 2008-04-14 2011-03-31 Ludovic Valette Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions
CN101698787B (zh) * 2009-11-12 2013-01-09 镇江市电子化工材料工程研究中心有限公司 一种叶片修补用环氧树脂粘结剂及其制备方法
CN102639579B (zh) * 2009-11-30 2014-03-12 帝斯曼知识产权资产管理有限公司 适用于结构目的的包含降冰片烯官能团和硫醇的树脂

Also Published As

Publication number Publication date
KR102049224B1 (ko) 2019-11-28
KR20140074933A (ko) 2014-06-18
WO2013053100A1 (en) 2013-04-18
WO2013053328A1 (en) 2013-04-18
IN2014CN02625A (enExample) 2015-08-07
EP2766444A4 (en) 2015-06-17
EP2766444B1 (en) 2017-06-28
US9371475B2 (en) 2016-06-21
US20140221532A1 (en) 2014-08-07
ES2636686T3 (es) 2017-10-06
JP2014531505A (ja) 2014-11-27
EP2766444A1 (en) 2014-08-20

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