WO2013031656A1 - Film d'étanchéité adhésif, son procédé de fabrication, et liquide de revêtement pour film d'étanchéité adhésif - Google Patents

Film d'étanchéité adhésif, son procédé de fabrication, et liquide de revêtement pour film d'étanchéité adhésif Download PDF

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Publication number
WO2013031656A1
WO2013031656A1 PCT/JP2012/071362 JP2012071362W WO2013031656A1 WO 2013031656 A1 WO2013031656 A1 WO 2013031656A1 JP 2012071362 W JP2012071362 W JP 2012071362W WO 2013031656 A1 WO2013031656 A1 WO 2013031656A1
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Prior art keywords
sealing film
adhesive sealing
protons
amount
resin
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PCT/JP2012/071362
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English (en)
Japanese (ja)
Inventor
宏 中出
朋子 山川
安藤　正人
大森　健
上野　信彦
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三菱化学株式会社
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Priority to CN201280040574.0A priority Critical patent/CN103764752B/zh
Priority to JP2013531263A priority patent/JP5907170B2/ja
Priority to KR1020147004714A priority patent/KR101706438B1/ko
Publication of WO2013031656A1 publication Critical patent/WO2013031656A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08J2323/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08J2323/22—Copolymers of isobutene; butyl rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin

Definitions

  • the present invention relates to an adhesive sealing film, and more particularly to an adhesive sealing film using polyisobutylene.
  • the present invention also relates to a method for producing the adhesive sealing film and a coating liquid for the adhesive sealing film.
  • the organic electroluminescent device has a light emitting part that is unstable with respect to moisture and oxygen. Therefore, in order to extend the lifetime of the device, the organic electroluminescence device is intended to protect the device from moisture and oxygen entering from the outside.
  • the use of a stop film has been studied.
  • a rubber-based adhesive sealing film containing an elastomer and a tackifying resin has an advantage that it can be used by being attached to a desired place of the organic electroluminescence element without using an adhesive. Therefore, various rubber-based adhesive sealing films have been studied so far.
  • Patent Documents 1 and 2 report that an adhesive sealing film is produced by mixing a tackifying resin with a polyisoprene-based resin used as an elastomer.
  • Patent Document 3 reports an adhesive sealing film using polyisobutylene and a hydrogenated cyclic olefin polymer.
  • an adhesive sealing film using polyisobutylene and a hydrogenated cyclic olefin-based polymer has a high moisture barrier property but has insufficient adhesiveness. Therefore, when using such an adhesive sealing film as an adhesive sealing film of an organic electroluminescence element, there is a concern about moisture intrusion from an adhesive interface.
  • an object of the present invention is to provide an adhesive sealing film having both low moisture permeability, that is, high moisture barrier property and high adhesiveness.
  • the present inventors use polyisobutylene as an elastomer in order to realize a high moisture barrier property, and in order to realize a high adhesiveness, the carbon double bond content is 1.6 to
  • an adhesive sealing film using a 50% tackifying resin, an adhesive sealing film having both high moisture barrier properties and high adhesiveness can be produced, and the present invention is satisfied.
  • an adhesive sealing film having high durability can be produced, and the present invention has been achieved.
  • the gist of the present invention is as follows.
  • the carbon double bond content in the tackifier resin is the ratio of the amount of protons bonded to the double-bonded carbon to the total amount of protons when the tackifier resin is measured by 1 H-NMR. Is represented by the following equation.
  • Carbon double bond content in tackifier resin (amount of protons contained in tackifier resin bound to double-bonded carbon / amount of all protons contained in tackifier resin) x 100
  • the amount of all protons contained in the tackifier resin is the sum of the proton spectral areas observed at 0.1 to 8.0 ppm, and is bound to the double-bonded carbon.
  • the amount of protons is the sum of the spectral areas of protons observed at 4.6 to 8.0 ppm.
  • the tackifier resin is selected from the group consisting of a rosin resin, a terpene resin, an alicyclic petroleum resin, and an aromatic petroleum resin.
  • the adhesive sealing film which is 2 or more types.
  • Carbon double bond content in adhesive sealing film (Amount of protons contained in adhesive sealing film bound to double-bonded carbon / Amount of all protons contained in adhesive sealing film ) ⁇ 100
  • the total amount of protons contained in the adhesive sealing film is the sum of the proton spectral areas observed at 0.1 to 8.0 ppm
  • the amount of protons bound is the sum of the spectral areas of protons observed at 4.6 to 8.0 ppm.
  • [8] A method for producing the adhesive sealing film according to any one of [1] to [7], wherein the polyisobutylene having a number average molecular weight of 10,000 or more and a carbon double bond content are 1.
  • the manufacturing method of the adhesive sealing film which dries after apply
  • the carbon double bond content in the tackifier resin is the ratio of the amount of protons bonded to the double-bonded carbon to the total amount of protons when the tackifier resin is measured by 1 H-NMR. Is represented by the following equation.
  • Carbon double bond content in tackifier resin (amount of protons contained in tackifier resin bound to double-bonded carbon / amount of all protons contained in tackifier resin) x 100
  • the amount of all protons contained in the tackifier resin is the sum of the proton spectral areas observed at 0.1 to 8.0 ppm, and is bound to the double-bonded carbon.
  • the amount of protons is the sum of the spectral areas of protons observed at 4.6 to 8.0 ppm.
  • a coating solution for an adhesive sealing film comprising polyisobutylene having a number average molecular weight of 10,000 or more and a tackifying resin having a carbon double bond content of 1.6% or more and 50.0% or less.
  • the carbon double bond content in the tackifier resin is the ratio of the amount of protons bonded to the double-bonded carbon to the total amount of protons when the tackifier resin is measured by 1 H-NMR. Is represented by the following equation.
  • Carbon double bond content in tackifier resin (amount of protons contained in tackifier resin bound to double-bonded carbon / amount of all protons contained in tackifier resin) x 100
  • the amount of all protons contained in the tackifier resin is the sum of the proton spectral areas observed at 0.1 to 8.0 ppm, and is bound to the double-bonded carbon.
  • the amount of protons is the sum of the spectral areas of protons observed at 4.6 to 8.0 ppm.
  • the solid content of the coating solution for the adhesive sealing film is obtained by removing the solvent from the coating solution for the adhesive sealing film.
  • the carbon double in the solid content of the coating solution for the adhesive sealing film is the ratio of the amount of protons bound to double-bonded carbon to the total amount of protons when the solid content is measured by 1 H-NMR, and is represented by the following formula.
  • Carbon double bond content in solid content of coating solution for adhesive sealing film (Proton amount bonded to double-bonded carbon contained in coating solution for adhesive sealing film / adhesive sealing) 100% of all protons contained in the solid content of the coating solution for film)
  • the amount of all protons contained in the solid content is the sum of the proton spectral areas observed at 0.1 to 8.0 ppm, and the protons bonded to the double-bonded carbon The amount is the sum of the proton spectral areas observed at 4.6-8.0 ppm.
  • ADVANTAGE OF THE INVENTION According to this invention, high moisture barrier property and high adhesiveness are made compatible, and also the highly durable adhesive sealing film and its coating liquid are provided.
  • the adhesive sealing film of the present invention can be applied to adhesive sealing films for various electric devices such as organic or inorganic electroluminescence, solar cells, and displays.
  • Embodiments of the present invention will be described in detail below, but the description of the constituent elements described below is an example (representative example) of an embodiment of the present invention, and the present invention does not exceed the gist thereof. The content of is not specified.
  • the coating solution for an adhesive sealing film of the present invention is a coating solution for producing the adhesive sealing film of the present invention, and usually contains a solvent, a polyisobutylene, a tackifying resin, and other components. .
  • the number average molecular weight of the polyisobutylene used in the present invention is usually 10,000 or more, preferably 50,000 or more, more preferably 70,000 or more, particularly preferably 100,000 or more, and usually 1,000,000 or less, preferably 500,000 or less, more preferably Is 250,000 or less, particularly preferably 200,000 or less.
  • the number average molecular weight of the polyisobutylene is not less than the above lower limit, creep resistance is improved, which is preferable in terms of application to a device to be used for a long time.
  • the number average molecular weight of the polyisobutylene is not more than the above upper limit, the adhesiveness is improved, which is preferable.
  • the number average molecular weight of polyisobutylene can be determined by polystyrene conversion using a gel permeation chromatography (GPC) method.
  • the polyisobutylene is preferably a homopolymer of isobutylene, but may be a copolymer of isobutylene as a main component and isobutylene and another monomer such as isoprene.
  • the tackifying resin refers to a resin that improves the adhesive strength and adhesive strength of polyisobutylene in the sealing film of the present invention.
  • tackifier resin examples include rosin resins, terpene resins, aliphatic petroleum resins, aromatic petroleum resins, aliphatic / aromatic hybrid petroleum resins, and alicyclic petroleum resins.
  • rosin resins include gum rosin, wood rosin, tall oil rosin, rosin-modified maleic resin, polymerized rosin, rosin phenol, rosin ester, and hydrogenated rosin.
  • terpene resin include terpene resins, terpene phenol resins, aromatic modified terpene resins, and hydrogenated terpene resins.
  • the terpene resin is obtained by polymerizing any one of ⁇ -pinene, ⁇ -pinene and dipentene (limonene), or copolymerizing a mixture.
  • the terpene phenol resin is a copolymer of terpene and phenol, and examples thereof include ⁇ -pinene phenol resin, dipentene phenol resin, and terpene bisgenol resin.
  • the aromatic modified terpene resin is obtained by copolymerizing a terpene monomer and an aromatic monomer.
  • the hydrogenated terpene resin is obtained by hydrogenating a terpene resin, a terpene phenol resin, or an aromatic modified terpene resin.
  • Examples of the aliphatic petroleum resin include those obtained by polymerizing a C5 petroleum resin such as piperylene, isoprene, 2-methylbutene-2, dicyclopentadiene alone, or copolymerizing a mixture.
  • Examples of the aromatic petroleum resins include coumarone resins, inden resins, hydrogenated coumarone resins, hydrogenated inden resins, phenol resins, styrene resins, hydrogenated styrene resins, and xylene resins.
  • the coumarone resin is obtained by copolymerizing coumarone and any one of styrene, vinyltoluene, and ⁇ -methylstyrene, or by copolymerizing a mixture.
  • the indene resin is obtained by copolymerizing indene and any of styrene, vinyltoluene, and ⁇ -methylstyrene, or by copolymerizing a mixture.
  • Hydrogenated coumarone resin is a hydrogenated coumarone resin.
  • Hydrogenated indene resin is a hydrogenated indene resin.
  • the phenol resin is a copolymer of phenols and aldehydes. Examples of the styrene resin include acrylonitrile butadiene styrene copolymer, acrylonitrile styrene copolymer, and styrene thermoplastic elastomer.
  • the styrenic thermoplastic elastomer has a polystyrene block and a rubber intermediate block, and examples of the intermediate rubber block include polybutadiene, a polyethylene / butylene copolymer, an ethylene / propylene copolymer, and a vinyl / polyisoprene copolymer.
  • Hydrogenated styrene resin is a hydrogenated styrene resin.
  • the xylene-based resin is a copolymer of m-xylene and formaldehyde.
  • Examples of the aliphatic / aromatic hybrid petroleum resin include an aliphatic / aromatic hybrid petroleum resin and a hydrogenated aliphatic / aromatic hybrid petroleum resin.
  • the mixed aliphatic / aromatic petroleum resin is isoprene, piperylene, 2-methyl-1-butene, 2-methyl-2-butene, styrene, vinyltoluene, ⁇ -methylstyrene, indene, dicyclopentadiene or a mixture thereof.
  • Hydrogenated aliphatic / aromatic hybrid petroleum resin is a hydrogenated aliphatic / aromatic hybrid petroleum resin.
  • Examples of the alicyclic petroleum resin include dicyclopentadiene resin and hydrogenated dicyclopentadiene resin.
  • the dicyclopentadiene resin is obtained by copolymerizing dicyclopentadiene and any one of styrene, butadiene, pentadiene, vinyl acetate, maleic anhydride, and phenol, or a mixture thereof.
  • Hydrogenated dicyclopentadiene resin is obtained by hydrogenating dicyclopentadiene resin.
  • the tackifying resin may be hydrogenated. These tackifier resins may be used alone or in combination of two or more.
  • tackifying resins among the tackifying resins, rosin resins, terpene resins, alicyclic petroleum resins, and aromatic petroleum resins are preferable, among which terpene resins and alicyclic petroleum resins are preferable, Among these, alicyclic petroleum resins are particularly preferable, and dicyclopentadiene resins containing dicyclopentadiene as a monomer component are particularly preferable. From the viewpoint of transparency, terpene resins are preferred, and among these, aromatic modified terpene resins are particularly preferred.
  • the carbon double bond content of the tackifying resin is usually 1.6% or more, preferably 2.0% or more, more preferably 5.0% or more, still more preferably 8.0% or more, usually 50.0%.
  • it is preferably 40.0% or less, more preferably 30.0% or less, further preferably 25.0% or less, and particularly preferably 15.0% or less.
  • the carbon double bond content is not less than the above lower limit, the adhesiveness is improved, which is preferable. It is preferable that the carbon double bond content is not more than the above upper limit because weather resistance is improved.
  • the carbon double bond content in the tackifying resin is the ratio of the amount of protons bonded to the carbon having double bonds to the total amount of protons when the tackifying resin is measured by 1 H-NMR, It is expressed by the following formula.
  • Carbon double bond content in tackifier resin (amount of protons contained in tackifier resin bound to double-bonded carbon / amount of all protons contained in tackifier resin) x 100
  • the amount of all protons contained in the tackifying resin is the sum of the proton spectral areas observed at 0.1 to 8.0 ppm, and is bound to the double-bonded carbon.
  • the amount of protons is the sum of the spectral areas of protons observed at 4.6 to 8.0 ppm.
  • the softening point of the tackifying resin is usually 50 ° C. or higher, preferably 80 ° C. or higher, more preferably 100 ° C. or higher, further preferably 120 ° C. or higher, particularly preferably 140 ° C. or higher, 300 ° C. or lower, preferably 200 ° C. Below, more preferably 150 ° C. or less.
  • a softening point is more than the following lower limit, it is preferable from a viewpoint of the long-term durability of the device using this adhesive sealing film.
  • the softening point is not more than the above upper limit, the adhesiveness is improved, which is preferable.
  • the softening point of the tackifier resin can be measured by a known method, and examples thereof include a ring and ball method, a thermomechanical analysis (TMA) method, and the like.
  • the number average molecular weight of the tackifying resin is usually 400 or more, preferably 600 or more, more preferably 800 or more, and usually 2000 or less, preferably 1800 or less, more preferably 1600 or less.
  • the number average molecular weight is not less than the above lower limit, it is preferable from the viewpoint of long-term durability of a device using such an adhesive sealing film.
  • the number average molecular weight is not more than the above upper limit, it is preferable from the viewpoint of adhesiveness.
  • the number average molecular weight of the tackifier resin can be determined by polystyrene conversion using a gel permeation chromatography (GPC) method.
  • solvent of the coating solution for the adhesive sealing film any known one can be used as long as it dissolves the polyisobutylene and tackifying resin contained in the adhesive sealing film, and water, an organic solvent, or a mixture thereof can be used. It may be a solvent.
  • Organic solvents include alcohols such as methyl alcohol, ethyl alcohol, n-propyl alcohol, i-propyl alcohol, butyl alcohol, methyl cellosolve, butyl cellosolve, ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, propylene glycol Esters such as monoethyl ether acetate, ethers such as diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, amides such as dimethylformamide and N-methylpyrrolidone, acetone, methyl ethyl ketone, acetylacetone , Ketones such as cyclohexanone, aromatic hydrocarbons such as benzene, toluene, xylene, heptane, Hexane, pentane, it can be used decane, known organic
  • organic solvents are preferable, and toluene is more preferable from the viewpoint of improving solubility.
  • the coating liquid for adhesive sealing films can select the presence or absence of a solvent suitably according to a use. From the viewpoint of dissolving the high molecular weight polyisobutylene, it is preferable to use a solvent. Moreover, when there is no solvent, it is preferable to use a solvent from a viewpoint that the base material which apply
  • Softener plasticizer
  • corrosion inhibitor heat stabilizer
  • ultraviolet absorber ultraviolet absorber
  • infrared absorber colorant
  • antioxidant antifungal agent
  • pH adjuster difficult Flame retardants
  • crystal nucleating agents conductive particles, inorganic particles, organic particles, viscosity modifiers, lubricants, surface treatment agents, leveling agents, crosslinking agents, antifoaming agents, polymerizable monomers, photopolymerizable initiators, etc.
  • Various components may be included for the purpose of providing a function.
  • softeners may be used as the softener, and are not particularly limited.
  • aromatic hydrocarbon, paraffinic, naphthenic petroleum hydrocarbon, low molecular weight polybutene, low molecular weight polyisobutylene, low molecular weight polyisoprene examples include various depolymerized rubbers (liquid rubbers), mineral oils (process oils), liquid rubbers such as hydrogenated liquid polyisoprene and derivatives thereof, petrolactam, petroleum asphalts, and the like.
  • these softeners may be used alone or in combination of two or more.
  • the low molecular weight polyisobutylene refers to those having a number average molecular weight less than that of the polyisobutylene according to the present invention, that is, a number average molecular weight of less than 126000.
  • low molecular weight polybutene or low molecular weight polyisobutylene from the viewpoints of adhesion, workability improvement and high barrier properties.
  • the antioxidant is not particularly limited as long as it is usually used in the field of adhesives, resin materials or rubber materials. Specifically, phenolic antioxidants, phosphite antioxidants and amine-based antioxidants are used. An antioxidant is mentioned. From the viewpoint of the influence on the organic electroluminescence element, a phenol-based antioxidant and an amine-based antioxidant are preferable, and a phenol-based antioxidant is particularly preferable.
  • polymerizable monomers examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl (meth) acrylate, and 2-ethylhexyl (meth).
  • the coating liquid for sealing film is a polymerizable monomer. It is preferable not to contain a body.
  • thermosetting resins such as unsaturated polyester resin, polyimide, polyurethane, and silicon resin
  • thermoplastic resins such as polystyrene, polyacrylate, polyester, polyether, polyamide, and polyvinyl alcohol may be used. These components may be used alone or in combination of two or more.
  • the solid content concentration of the coating solution for adhesive sealing film is usually 1% by weight or more, preferably 10% by weight or more, more preferably 20% by weight, still more preferably 30% by weight or more, and usually 99.99% by weight or less. , Preferably 80% by weight or less, more preferably 50% by weight or less.
  • solid content concentration is more than the said minimum, since the adhesive sealing film of a desired film thickness is obtained, it is preferable from a viewpoint of sealing performance.
  • solid content concentration is below the said upper limit, it is preferable from a viewpoint which can use high molecular weight polyisobutylene as an elastomer and can manufacture an adhesive sealing film, without being restrict
  • the polyisobutylene content in the solid content of the coating solution for adhesive sealing film is usually 10% by weight or more, preferably 20% by weight or more, more preferably 30% by weight or more, further preferably 40% by weight or more, and usually 90% by weight. % Or less, preferably 80% by weight or less, more preferably 70% by weight or less, and still more preferably 60% by weight or less.
  • the polyisobutylene content in the solid content is not less than the above lower limit, it is preferable from the viewpoint of improving adhesiveness and moisture barrier properties.
  • the polyisobutylene content in solid content is below the said upper limit, it is preferable from a viewpoint of an adhesive improvement.
  • the solid content of the coating liquid for adhesive sealing film is a value obtained by removing the solvent from the coating liquid for adhesive sealing film.
  • the tackifying resin content in the solid content of the coating solution for adhesive sealing film is usually 10% by weight or more, preferably 20% by weight or more, more preferably 30% by weight or more, further preferably 40% by weight or more, 90% by weight. % Or less, preferably 80% by weight or less, more preferably 70% by weight or less, and still more preferably 60% by weight or less.
  • the content of tackifying resin in the solid content is not more than the above upper limit, it is preferable from the viewpoint of improving adhesiveness and moisture barrier properties.
  • tackifying resin content in solid content is more than the said minimum, it is preferable from a viewpoint of adhesive improvement.
  • the mixing weight ratio (polyisobutylene / tackifying resin) of polyisobutylene and tackifying resin contained in the coating solution for adhesive sealing film is usually 10/90 or more, preferably 20/80 or more, more preferably 30/70. More preferably, it is 40/60 or more, usually 90/10 or less, preferably 80/20 or less, more preferably 70/30 or less, and further preferably 60/40 or less.
  • the mixing weight ratio of polyisobutylene and tackifying resin is not less than the above lower limit, it is preferable from the viewpoint of improving the adhesiveness and moisture barrier properties.
  • the mixing weight ratio of polyisobutylene and tackifying resin is below the said upper limit, it is preferable from a viewpoint of an adhesive improvement.
  • the total content of polyisobutylene and tackifying resin in the solid content of the coating solution for adhesive sealing film is usually 70% by weight or more, preferably 80% by weight or more, more preferably 90% by weight or more, and further preferably 95% by weight. % Or more.
  • the total content of polyisobutylene and tackifying resin in the solid content is not less than the above lower limit, it is preferable from the viewpoint of improving adhesiveness and moisture barrier properties.
  • the content of the softening agent in the solid content of the coating liquid for adhesive sealing film is usually 0.01% by weight or more, preferably 1% by weight or more, More preferably, it is 5% by weight or more, usually 30% by weight or less, preferably 20% by weight or less, more preferably 10% by weight or less.
  • content of the softening agent in solid content is more than the said minimum, it is preferable from a viewpoint of the adhesive improvement by initial stage adhesion (tack).
  • tack initial stage adhesion
  • creep resistance is improved, which is preferable in terms of application to a device used for a long time.
  • the content of carbon double bonds in the solid content of the coating solution for adhesive sealing film is usually 1.8% or more, preferably 2.0% or more, more preferably 3.0% or more, and further preferably 4.0. % Or more, usually 50.0% or less, preferably 40.0% or less, more preferably 30.0% or less, still more preferably 20.0% or less, and particularly preferably 10.0% or less.
  • the content of the carbon double bond in the solid content of the coating liquid for adhesive sealing film is not less than the above lower limit, it is preferable because the adhesiveness is improved.
  • the content of the carbon double bond in the solid content of the coating solution for adhesive sealing film is not more than the above upper limit, it is preferable because durability is improved.
  • the content of the carbon double bond in the solid content of the coating solution for adhesive sealing film is the same as the carbon having double bonds with respect to the total amount of protons when the solid content is measured by 1 H-NMR. It is the ratio of the amount of protons bound, and is represented by the following formula.
  • Carbon double bond content in solid content of coating solution for adhesive sealing film (Proton amount bonded to double-bonded carbon contained in coating solution for adhesive sealing film / adhesive sealing) 100% of all protons contained in the solid content of the coating solution for film)
  • the amount of all protons contained in the solid content is the sum of the proton spectrum areas observed at 0.1 to 8.0 ppm, and protons bonded to double-bonded carbon The amount is the sum of the proton spectral areas observed at 4.6-8.0 ppm.
  • the adhesive sealing film in the present invention is characterized by containing a polyisobutylene having a number average molecular weight of 10,000 or more and a tackifying resin containing 1.6 to 50.0% of carbon double bonds. It is a sealing film having adhesiveness.
  • the adhesive sealing film in the present invention can be used by being attached to a desired location of the organic electroluminescence element without using an adhesive, and can be filled in the desired location. .
  • the carbon double bond content in the adhesive sealing film is usually 1.8% or more, preferably 2.0% or more, more preferably 3.0% or more, still more preferably 4.0% or more, and usually 50. It is 0% or less, preferably 40.0% or less, more preferably 30.0% or less, further preferably 20.0% or less, and particularly preferably 10.0% or less.
  • the carbon double bond content in the adhesive sealing film is not less than the above lower limit, it is preferable because the adhesiveness is improved.
  • the carbon double bond content in the adhesive sealing film is not more than the above upper limit, it is preferable because durability is improved.
  • the adhesive sealing film of the present invention can be produced using the aforementioned coating liquid for adhesive sealing film of the present invention, and the components other than the solvent in the coating liquid for adhesive sealing film of the present invention, That is, it is composed of a polyisobutylene having a number average molecular weight of 10,000 or more, a tackifier resin containing a carbon double bond, and, if necessary, the above-mentioned components contained in a coating solution for an adhesive sealing film, and a suitable number average Polyisobutylene having a molecular weight of 10,000 or more, a tackifier resin containing a carbon double bond, and other components are the same as those described as those contained in the adhesive sealing film coating solution.
  • composition of the polyisobutylene having a number average molecular weight of 10,000 or more contained in the adhesive sealing film, a tackifier resin containing a carbon double bond, and components used as necessary is the adhesive property of the present invention described above. It is the same as that of composition of solid content other than the solvent of the coating liquid for sealing films.
  • the film thickness of the adhesive sealing film is usually 1 ⁇ m or more, preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and usually 1 mm or less, preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less, and even more preferably 100 ⁇ m or less.
  • the film thickness is at least the above lower limit, the moisture barrier property is improved, which is preferable.
  • a film thickness is below the said upper limit, it is preferable from a viewpoint which the device applied is not restrict
  • the glass transition temperature of the adhesive sealing film is usually ⁇ 50 ° C. or higher, preferably ⁇ 30 ° C. or higher, more preferably ⁇ 20 ° C. or higher, further preferably ⁇ 10 ° C. or higher, particularly preferably 0 ° C. or higher, usually 200 ° C.
  • the temperature is preferably 150 ° C. or lower, more preferably 100 ° C. or lower, still more preferably 80 ° C. or lower, and particularly preferably 50 ° C. or lower.
  • the glass transition temperature is equal to or higher than the lower limit, the adhesiveness can be improved in both cases where the glass transition temperature is equal to or lower than the upper limit.
  • the glass transition temperature of the adhesive sealing film is measured by a differential scanning calorimeter (DSC), a dynamic viscoelasticity measuring device (DMA), or a thermomechanical analyzer (TMA).
  • DSC differential scanning calorimeter
  • DMA dynamic viscoelasticity measuring device
  • TMA thermomechanical analyzer
  • the minimum value of the storage elastic modulus at ⁇ 20 to 50 ° C. of the adhesive sealing film is usually 1 ⁇ 10 9 Pa or less, preferably 8 ⁇ 10 8 Pa or less, usually 1 ⁇ 10 3 Pa or more, preferably 1 ⁇ 10. 4 Pa or more.
  • the adhesive sealing film can be applied to a device for long-term use, which is preferable.
  • adhesiveness can be improved, it is preferable.
  • the minimum value of the storage elastic modulus at ⁇ 20 to 50 ° C. of the adhesive sealing film is not more than the above upper limit, the adhesiveness can be improved, which is preferable.
  • the storage elastic modulus of the adhesive sealing film is measured by a dynamic viscoelasticity measuring device (DMA) in a shear mode or a film shear mode at a frequency of 1 Hz in a nitrogen gas atmosphere.
  • DMA dynamic viscoelasticity measuring device
  • Tensile shear adhesive strength of the adhesive encapsulating film typically 50 N / 100 mm 2 or more, preferably 100 N / 100 mm 2 or more, more preferably 200 N / 100 mm 2 or more and usually 10000 N / 100 mm 2 or less.
  • the tensile shear adhesive strength is not less than the above lower limit, it is preferable because the adhesiveness is high.
  • the tensile shear adhesive strength is not more than the above upper limit, it is preferable from the viewpoint of recycling.
  • the tensile shear adhesive force of the adhesive sealing film is measured by the following method.
  • the test plate is an aluminum plate (10 cm ⁇ 3 cm ⁇ 1 mm), the test plate sandwiched with an adhesive sealing film (15 mm ⁇ 15 mm ⁇ 50 ⁇ m) is sandwiched between clips, and heated at 100 ° C. for 20 minutes to form an adhesive sealing film Is crimped onto the test plate.
  • the test plate after pressure-bonding the adhesive sealing film is measured for tensile shear adhesive strength at a tensile speed of 50 mm / min using a tensile tester under conditions of a test environment of 23 ° C., 50% RH, and a distance between chucks of 10 cm.
  • the moisture permeability measured by the following method is usually 30 g ⁇ m ⁇ 2 ⁇ 24 h ⁇ 1 or more, preferably 40 g ⁇ m ⁇ 2 ⁇ 24 h ⁇ 1 or more, usually 100 g ⁇ m ⁇ 2. • 24 h ⁇ 1 or less, preferably 80 g ⁇ m ⁇ 2 • 24 h ⁇ 1 or less, more preferably 60 g ⁇ m ⁇ 2 • 24 h ⁇ 1 or less.
  • the moisture permeability is not more than the above upper limit, the moisture barrier property can be improved, which is preferable.
  • the moisture permeability is at least the above lower limit, the carbon double bond content in the adhesive sealing film can be increased, which is preferable from the viewpoint of improving the adhesiveness.
  • the moisture permeability is measured by the following method.
  • Two peeled PET (polyethylene terephthalate) films obtained by cutting a circular adhesive sealing film (film thickness 25 ⁇ m) having a diameter of 1.2 cm into a circle having a diameter of 1.2 cm.
  • the laminated body A is produced by sandwiching.
  • This layered product A is set on the lid (hole cap) of a syringe vial (Syringe vial, Model CV-5, manufactured by Maruemu Co., Ltd.), and anhydrous calcium chloride particles (particle size: 3-5 mm, domestic chemical stock) 2 g of company) is put in and a sample for measuring moisture permeability is prepared.
  • a sample for measuring moisture permeability is placed in an atmosphere of 60 ° C. and 95% RH, and the weight after 24 hours and 72 hours is measured. After 24 to 72 hours, the increase in weight per 24 hours is adhesively sealed. Divide by the film area to obtain the moisture permeability of the laminate A.
  • the adhesive sealing film of the present invention can be produced by a melt extrusion method.
  • the adhesive sealing film coating liquid of the present invention is applied according to the method for producing an adhesive sealing film of the present invention. It is manufactured by coating and drying on a substrate.
  • Examples of the method for applying the coating liquid for adhesive sealing film of the present invention to the substrate include spray coating, dip coating, doctor blade coating, curtain roll coating, gravure roll coating, reverse roll coating, Examples include the air knife coating method, rod coating method, die coating method, offset printing method, comma coating method, and lip coating method.
  • the relative humidity during application of the coating solution for adhesive sealing film is usually 20% or more, preferably 25% or more, more preferably 30% or more, still more preferably 50% or more, and usually 85% or less, preferably 80. % Or less, more preferably 75% or less.
  • the relative humidity is within the above-mentioned range, the uniformity of the adhesive sealing film is improved, which may suppress a decrease in adhesion and moisture barrier properties due to a decrease in film uniformity.
  • coating of the coating liquid for adhesive sealing films There is no restriction
  • the coating solution for the adhesive sealing film may be applied in an air atmosphere, and may be applied in an inert gas atmosphere such as argon.
  • a filtration method a known method can be used.
  • a known method such as a filter paper, a nonwoven fabric, a metal mesh, a sintered metal, a porous plate, a porous ceramic, or a filter can be used.
  • the mesh of the filter medium is not particularly limited, but usually a mesh of about 5 to 20 ⁇ m is preferably used. Filtration is usually performed at room temperature under normal pressure, reduced pressure, or increased pressure.
  • the temperature of the coating liquid for adhesive sealing films Usually, 0 degreeC or more, Preferably it is 10 degreeC or more, More preferably, it is 20 degreeC or more, Usually, 200 degrees C or less, Preferably it is 150 degrees C or less, More preferably, it is 100. ° C or lower, more preferably 80 ° C or lower.
  • the temperature at the time of application is within the above range, the film thickness unevenness of the adhesive sealing film due to the volatilization of the solvent can be suppressed, and the deterioration of the adhesiveness and moisture barrier property due to the deterioration of the uniformity of the film can be suppressed. There is property and is preferable.
  • drying method a known method can be used, and examples thereof include a natural drying method, a heat drying method (hot air drying method, infrared drying method, far infrared drying method, etc.). You may implement and may implement in combination of 2 or more type.
  • the heating temperature is usually 40 ° C. or higher, preferably 60 ° C. or higher, more preferably 80 ° C. or higher, more preferably 100 ° C. or higher, usually 300 ° C. or lower, preferably 200 ° C. or lower, more preferably 150. It is below °C.
  • heating temperature is more than the said minimum, the residual solvent in an adhesive sealing film can be reduced and it is preferable.
  • heating temperature is below the said upper limit, deterioration by the heating of an adhesive sealing film can be suppressed, and it is preferable.
  • the base material which can be used is not restrict
  • the heating time during drying is usually 1 second or longer, preferably 10 seconds or longer, more preferably 30 seconds or longer, more preferably 1 minute or longer, particularly preferably 5 minutes or longer, most preferably 3 hours or longer, and usually 24 hours or shorter. , Preferably 12 hours or less, more preferably 6 hours or less, and even more preferably 4 hours or less.
  • heating time is more than the said minimum, the residual solvent in an adhesive sealing film can be reduced and it is preferable.
  • the drying time is not more than the above upper limit, it is possible to prevent thermal deterioration of the substrate and the substrate, and it is also preferable from the viewpoint of productivity.
  • the content of the residual solvent is usually 0 pm or more, preferably 1 ppm or more, more preferably 2 ppm or more, and usually 20000 ppm or less, more preferably 2000 ppm or less. More preferably, it is 1000 ppm or less, and particularly preferably 500 ppm or less.
  • residual toluene can be calculated
  • GC gas chromatography
  • a known heating device can be used for heating, and examples thereof include an oven, a hot plate, an IR heater, and an electromagnetic wave heating device.
  • the drying atmosphere includes an air atmosphere, a nitrogen gas atmosphere, an Ar gas atmosphere, a He gas atmosphere, a carbon dioxide atmosphere, and the like.
  • the coating after heating and drying may be cooled or cooled.
  • thermoplastic resin examples include polyolefin resins, polystyrene resins, vinyl chloride resins, acrylic resins, polyester resins, fluorine resins, polycarbonate resins, nylon resins, and cellulose acetate.
  • thermosetting resin examples include polyester resin, acrylic resin, epoxy resin, phenol resin, unsaturated alkyd resin, melamine resin, and urethane resin.
  • the resin film used in the present invention can be produced by a known method, and examples thereof include extrusion, calendering, injection, hollow, and compression molding.
  • the thickness is usually 10 ⁇ m or more, usually 1 cm or less, preferably 5 mm or less, more preferably 1 mm or less, and further preferably 100 ⁇ m or less.
  • thickness is below the said upper limit, after apply
  • thickness is more than the said minimum, when peeling an adhesive sealing film from a base material, the intensity
  • the thickness is usually 10 ⁇ m or more, and usually 1 cm or less, preferably 5 mm or less, more preferably 1 mm or less.
  • the thickness is less than or equal to the above upper limit, the weight does not become too heavy, which is preferable from the viewpoint of ease of handling.
  • the thickness is equal to or greater than the above lower limit, the strength of the base material is sufficient when the adhesive sealing film is peeled from the base material, which is preferable.
  • a release agent may be applied to the application surface of the substrate.
  • the release agent a known one such as a silicone resin can be used.
  • the adhesive sealing film formed by applying a coating solution for adhesive sealing film on a substrate and drying it as necessary is covered with another substrate and sandwiched between two substrates It is good.
  • the materials of the two substrates may be the same or different.
  • the thickness of two base materials may be the same and may differ. From the viewpoint of peeling the adhesive sealing film from the substrate, it is preferable that the two substrates have different thicknesses.
  • test plate was an aluminum plate (10 cm ⁇ 3 cm ⁇ 1 mm), the test plate sandwiched with the test piece (adhesive sealing film) was sandwiched between clips, and the test plate was heated in an oven at 100 ° C. for 20 minutes. Except for being crimped to JIS Z1541, the test environment is 23 ° C., 50% RH, test piece (adhesive sealing film) 15 mm ⁇ 15 mm ⁇ 50 ⁇ m, test plate size 10 cm ⁇ 3 cm, and distance between chucks 10 cm.
  • the tensile shear adhesive force at a tensile speed of 50 mm / min was measured using a tensile tester (Tensilon UTC-5T, manufactured by Orientec Co., Ltd.).
  • the test plate was ultrasonically cleaned with a solvent in which equal amounts of toluene and isopropyl alcohol were mixed before attaching the test piece.
  • a 1.2 cm diameter circular adhesive sealing film (film thickness 25 ⁇ m) is sandwiched between two peeled PET films (MRV 38, thickness 38 ⁇ m, manufactured by Mitsubishi Plastics Co., Ltd.) cut into a circular shape with a diameter of 1.2 cm and laminated.
  • Body A was prepared.
  • This layered product A is set on the lid (hole cap) of a syringe vial (Syringe vial, Model CV-5, manufactured by Maruemu Co., Ltd.), and anhydrous calcium chloride particles (particle size: 3-5 mm, domestic chemical stock) 2 g of company manufactured) was put into a sample for measuring moisture permeability.
  • a sample for measuring moisture permeability is placed in an atmosphere of 60 ° C. and 95% RH, the weight after 24 hours and 72 hours is measured, and the increase in weight per 24 hours is measured from 24 hours to 72 hours. Dividing by area, the moisture permeability of laminate A was determined.
  • the carbon double bond content in the tackifying resin, the carbon double bond content in the adhesive sealing film, and the carbon double bond content in the solid content of the coating solution for the adhesive sealing film are 1 H-NMR (proton Nuclear magnetic resonance) apparatus (AVANCE400, AV400, manufactured by Bruker Biospin) was used for measurement. At this time, it melt
  • Resonance frequency 400 MHz Probe: 5mm ⁇ probe Measurement temperature: 27 ° C Sample rotation speed: 20Hz Measurement method: Single pulse method Flip angle: 90 ° Repeat time: 1 s Measurement time: 2.73 s Integration count: 16 times Observation width: 6 kHz Broadening factor: 0.1 Hz
  • Such carbon double bond content is represented by the following formula.
  • Carbon double bond content in tackifier resin (amount of protons contained in tackifier resin bound to double-bonded carbon / amount of all protons contained in tackifier resin) x 100
  • Carbon double bond content in adhesive sealing film (Amount of protons contained in adhesive sealing film bound to double-bonded carbon / Amount of all protons contained in adhesive sealing film ) ⁇ 100
  • Content of carbon double bond in solid content of coating solution for adhesive sealing film (Proton amount bound to carbon having double bonds contained in solid content / Amount of all protons contained in solid content) ) ⁇ 100
  • the solid content of the coating liquid for adhesive sealing film is obtained by removing the solvent from the coating liquid for adhesive sealing film.
  • the total amount of protons contained in the entire tackifying resin, the total amount of protons contained in the entire adhesive sealing film, and the total amount of protons contained in the solid content of the coating solution for adhesive sealing film are 0.
  • the sum of the proton spectral areas (integrated values) at 1 to 8.0 ppm, and the amount of protons bound to the double-bonded carbon is the spectral area (integrated values) of protons at 4.6 to 8.0 ppm. Is the sum of
  • ⁇ Number average molecular weight> The number average molecular weight of polyisobutylene and tackifying resin is measured under the following conditions by gel permeation chromatography, and a calibration curve (created using the peak molecular weight of standard polystyrene) obtained from measurement of commercially available standard polystyrene is used. And calculated as a polystyrene equivalent value.
  • Example 1 ⁇ Preparation of adhesive sealing film> 2.5 g of polyisobutylene (number average molecular weight 1260, homopolymer of isobutylene, manufactured by BASF), alicyclic petroleum resin (cyclopentadiene-dicyclopentadiene copolymer, Quintone TD-401, Nippon Zeon Co., Ltd.) 6.3 g) was dissolved in 12.7 g of toluene (manufactured by Kanto Chemical Co., Ltd.) at room temperature (20-30 ° C.) with stirring using a mix rotor (VMR-3, manufactured by ASONE Co., Ltd.) A coating solution A for a stop film was prepared.
  • polyisobutylene number average molecular weight 1260, homopolymer of isobutylene, manufactured by BASF
  • alicyclic petroleum resin cyclopentadiene-dicyclopentadiene copolymer, Quintone TD-401, Nippon Zeon Co., Ltd.
  • the coating solution A for adhesive sealing film was applied onto a peeled PET film (MRV38, thickness 38 ⁇ m, manufactured by Mitsubishi Plastics Co., Ltd.) using an applicator, and dried by heating on a hot plate at 100 ° C. for 20 minutes. Then, it vacuum-dried at 100 degreeC for 3 hours, and produced the adhesive sealing film A.
  • Table 1 shows the composition of the adhesive sealing film A (same as the solid content composition of the coating liquid for adhesive sealing film) and the solid content concentration of the coating liquid A for adhesive sealing film.
  • Table 2 shows the tackifying resin. The carbon double bond content in the used alicyclic petroleum resin, adhesive sealing film A, and coating liquid A for adhesive sealing film is shown.
  • Example 2 2.5 g polyisobutylene (number average molecular weight 200,000, homopolymer of isobutylene, manufactured by BASF), 6.3 g aromatic modified terpene resin (YS Resin TR105, manufactured by Yasuhara Chemical Co., Ltd.), polybutene (HV-100, number average molecular weight) 980, JX Nippon Mining & Energy Co., Ltd.) 1.0 g was dissolved in toluene (Kanto Chemical Co., Ltd.) 31.5 g. Liquid B was prepared. The same operation as Example 1 was performed using the coating liquid B for adhesive sealing films, the adhesive sealing film B was produced, and the evaluation was performed.
  • Table 1 shows the composition of the adhesive sealing film B and the solid content concentration of the coating liquid B for adhesive sealing film
  • Table 2 shows the modified terpene resin, adhesive sealing film B, and adhesive seal used as tackifying resins. Carbon double bond content in the coating liquid B for stop films is shown.
  • the evaluation results of the adhesive sealing film B are shown in Table 3.
  • Example 3 The same operation as in Example 2 was performed except that an aromatic modified terpene resin (YS resin TO125, manufactured by Yasuhara Chemical Co., Ltd.) was used instead of the aromatic modified terpene resin (YS resin TR105, manufactured by Yasuhara Chemical Co., Ltd.)
  • the coating liquid C for adhesive sealing films was prepared.
  • the same operation as Example 1 was performed using the coating liquid C for adhesive sealing films, and the adhesive sealing film C was produced and evaluated.
  • Table 1 shows the composition of the adhesive sealing film C and the solid content concentration of the coating liquid C for adhesive sealing film
  • Table 2 shows the modified terpene resin, adhesive sealing film C, and adhesive seal used as tackifying resins.
  • the carbon double bond content in the coating liquid C for a stop film is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film C.
  • Example 4 Instead of polyisobutylene (number average molecular weight 200,000, manufactured by BASF), polyisobutylene (number average molecular weight 126,000, homopolymer of isobutylene, manufactured by BASF) is used, and alicyclic petroleum resin is used instead of modified terpene resin (Quintone TD-401, manufactured by Nippon Zeon Co., Ltd.) was used, and the same operation as in Example 3 was carried out except that the composition shown in Table 1 was used, to prepare a coating solution D for adhesive sealing film. The same operation as Example 1 was performed using the coating liquid D for adhesive sealing films, the adhesive sealing film D was produced, and the evaluation was performed.
  • polyisobutylene number average molecular weight 200,000, manufactured by BASF
  • polyisobutylene number average molecular weight 126,000, homopolymer of isobutylene, manufactured by BASF
  • alicyclic petroleum resin is used instead of modified terpene resin (Quintone TD-401, manufactured by Nippo
  • Table 1 shows the composition of the adhesive sealing film D and the solid content concentration of the coating liquid D for adhesive sealing film.
  • Table 2 shows the alicyclic petroleum resin, adhesive sealing film D used as a tackifying resin. Carbon double bond content in the coating liquid D for adhesive sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film D.
  • Example 5 An adhesive sealing film E was produced in the same manner as in Example 1 except that 4.4 g of polyisobutylene and alicyclic petroleum resin were dissolved.
  • Table 1 shows the composition of the adhesive sealing film E and the solid content concentration of the coating liquid E for adhesive sealing film.
  • Table 2 shows the alicyclic petroleum resin, adhesive sealing film E used as the tackifying resin. Carbon double bond content in the coating liquid E for adhesive sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film E.
  • Example 6 An adhesive sealing film F was produced in the same manner as in Example 1 except that 5.3 g of polyisobutylene and 3.5 g of alicyclic petroleum resin were dissolved.
  • Table 1 shows the composition of the adhesive sealing film F and the solid content concentration of the coating liquid F for adhesive sealing film.
  • Table 2 shows the alicyclic petroleum resin, adhesive sealing film F used as a tackifier resin, Carbon double bond content in the coating liquid E for adhesive sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film F.
  • Example 7 Example except that terpene resin (YS Resin PX1250, Yasuhara Chemical Co., Ltd.) was used instead of aromatic modified terpene resin (YS Resin TR105, Yasuhara Chemical Co., Ltd.) and 4.4 g of polyisobutylene and terpene resin were added respectively. Operation similar to 2 was performed and the coating liquid H for adhesive sealing films was prepared. The same operation as Example 1 was performed using the coating liquid H for adhesive sealing films, the adhesive sealing film H was produced, and the evaluation was performed. Table 1 shows the composition of the adhesive sealing film H and the solid content concentration of the coating liquid H for adhesive sealing film, and Table 2 shows the terpene resin, adhesive sealing film H, and adhesive sealing used as tackifying resins. Carbon double bond content in the coating liquid H for films is shown. Table 3 shows the evaluation results of the adhesive sealing film H.
  • terpene resin YS Resin PX1250, Yasuhara Chemical Co., Ltd.
  • aromatic modified terpene resin YS
  • Table 1 shows the composition of the adhesive sealing film I and the solid content concentration of the coating liquid I for adhesive sealing film
  • Table 2 shows the hydrogenated alicyclic petroleum resin and adhesive sealing film I used as tackifying resins.
  • the carbon double bond content in the coating liquid I for adhesive sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film I.
  • Example 2 A coating liquid J for an adhesive sealing film was prepared in the same manner as in Example 5 except that an aliphatic petroleum resin (Quinton A100) was used instead of the alicyclic petroleum resin. The same operation as Example 5 was performed using the coating liquid J for adhesive sealing films, the adhesive sealing film J was produced, and the evaluation was performed.
  • Table 1 shows the composition of the adhesive sealing film J and the solid content concentration of the coating liquid J for adhesive sealing film.
  • Table 2 shows the aliphatic petroleum resin, adhesive sealing film J, and adhesive used as tackifying resins. Carbon double bond content in coating liquid J for adhesive sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film J.
  • Example 3 A coating solution K for adhesive sealing film was prepared in the same manner as in Example 5 except that a hydrogenated indene resin (Alcon P100) was used instead of the alicyclic petroleum resin. The same operation as Example 5 was performed using the coating liquid K for adhesive sealing films, the adhesive sealing film K was produced, and the evaluation was performed.
  • Table 1 shows the composition of the adhesive sealing film K and the solid content concentration of the coating liquid K for adhesive sealing film
  • Table 2 shows the aliphatic petroleum resin, adhesive sealing film K, and adhesive used as tackifying resins. Carbon double bond content in the coating liquid K for conductive sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film K.
  • a coating liquid L for an adhesive sealing film was prepared in the same manner as in Example 5 except that an isobutylene-isoprene copolymer (number average molecular weight 1260, Butyl 268, manufactured by JSR Corporation) was used instead of polyisobutylene.
  • Example 5 The same operation as Example 5 was performed using the coating liquid L for adhesive sealing films, the adhesive sealing film L was produced, and the evaluation was performed.
  • Table 1 shows the composition of the adhesive sealing film L and the solid content concentration of the coating liquid L for adhesive sealing film
  • Table 2 shows the aliphatic petroleum resin, adhesive sealing film L, and adhesive used as tackifying resins. Carbon double bond content in the coating liquid K for conductive sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film L.
  • Adhesive sealing was carried out in the same manner as in Example 5 except that 0.4 g of epoxy resin (HP7200H, manufactured by DIC Corporation), 4.2 g of polyisobutylene, and 4.2 g of alicyclic petroleum resin were dissolved in the additive.
  • a coating solution M for a stop film was prepared.
  • the same operation as Example 5 was performed using the coating liquid M for adhesive sealing films, the adhesive sealing film M was produced, and the evaluation was performed.
  • Table 1 shows the composition of the adhesive sealing film M and the solid content concentration of the coating liquid M for adhesive sealing film
  • Table 2 shows the aliphatic petroleum resin, adhesive sealing film M, and adhesive used as tackifying resins. Carbon double bond content in the coating liquid M for porous sealing films is shown.
  • Table 3 shows the evaluation results of the adhesive sealing film M.
  • the adhesive sealing film using polyisobutylene had a low moisture permeability and showed a high moisture barrier property. Further, as in Examples 1 to 7, when the carbon double bond content of the tackifier resin is 1.6% or more and the carbon double bond content in the adhesive sealing film is 1.8% or more, The tensile shear adhesive strength was 143 N / 100 mm 2 or more, and high adhesiveness was exhibited.
  • the adhesive sealing film of the present invention can achieve both high adhesiveness and high moisture barrier properties, it can be applied to adhesive sealing films for various electric devices such as organic or inorganic electroluminescence, solar cells, and displays. Specifically, it is useful as an adhesive sealing film for organic electroluminescence.

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  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesive Tapes (AREA)

Abstract

Cette invention concerne un film d'étanchéité adhésif qui contient un polyisobutylène ayant un poids moléculaire moyen en nombre d'au moins 10 000, et une résine collante ayant une teneur en doubles liaisons carbone-carbone entre 1,6 et 50,0 %. Dans le film d'étanchéité adhésif durable selon la présente invention, le polyisobutylène est utilisé comme élastomère pour ses caractéristiques élevées de barrière à l'eau, et la résine collante ayant une teneur en doubles liaisons carbone-carbone dans la plage prédéfinie est utilisée pour son adhésivité élevée. Par conséquent, le film d'étanchéité adhésif selon la présente invention a en même temps des caractéristiques élevées de barrière à l'eau et une adhésivité élevée.
PCT/JP2012/071362 2011-08-26 2012-08-23 Film d'étanchéité adhésif, son procédé de fabrication, et liquide de revêtement pour film d'étanchéité adhésif WO2013031656A1 (fr)

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CN201280040574.0A CN103764752B (zh) 2011-08-26 2012-08-23 粘结性密封膜、粘结性密封膜的制造方法和粘结性密封膜用涂布液
JP2013531263A JP5907170B2 (ja) 2011-08-26 2012-08-23 接着性封止フィルム、接着性封止フィルムの製造方法および接着性封止フィルム用塗布液
KR1020147004714A KR101706438B1 (ko) 2011-08-26 2012-08-23 접착성 밀봉 필름, 접착성 밀봉 필름의 제조 방법 및 접착성 밀봉 필름용 도포액

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JP2015108045A (ja) * 2013-12-03 2015-06-11 古河電気工業株式会社 樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子および画像表示用装置
JP2015193724A (ja) * 2014-03-31 2015-11-05 リンテック株式会社 シート状封止材、封止シート及び電子デバイス
WO2016152756A1 (fr) * 2015-03-20 2016-09-29 味の素株式会社 Procédé de fabrication de boîtier
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CN110372967A (zh) * 2013-03-27 2019-10-25 古河电气工业株式会社 密封用树脂组合物、密封用树脂片、有机电致发光元件、及图像显示装置
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CN112852359B (zh) * 2020-12-29 2022-09-23 江苏雨中情防水材料有限责任公司 一种高耐水浸泡非沥青基预铺防水卷材及其制备方法
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JPWO2013137397A1 (ja) * 2012-03-15 2015-08-03 リンテック株式会社 粘着性組成物、及び粘着性シート
WO2013137397A1 (fr) * 2012-03-15 2013-09-19 リンテック株式会社 Composition adhésive et feuille adhésive
CN110372967A (zh) * 2013-03-27 2019-10-25 古河电气工业株式会社 密封用树脂组合物、密封用树脂片、有机电致发光元件、及图像显示装置
WO2014156555A1 (fr) * 2013-03-29 2014-10-02 古河電気工業株式会社 Composition de résine pour l'encapsulation d'éléments pour dispositifs électroniques organiques, feuille de résine pour l'encapsulation d'éléments pour dispositifs électroniques organiques, élément électroluminescent organique et dispositif d'affichage d'images
KR101796366B1 (ko) * 2013-03-29 2017-11-09 후루카와 덴키 고교 가부시키가이샤 유기 전자 디바이스용 소자 밀봉용 수지 조성물, 유기 전자 디바이스용 소자 밀봉용 수지 시트, 유기 일렉트로루미네센스 소자, 및 화상 표시 장치
CN105122939A (zh) * 2013-03-29 2015-12-02 古河电气工业株式会社 有机电子器件用元件密封用树脂组合物、有机电子器件用元件密封用树脂片、有机电致发光元件、及图像显示装置
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JP2015071673A (ja) * 2013-10-02 2015-04-16 三菱化学株式会社 樹脂組成物、接着性封止フィルム及びその製造方法
JP2015108045A (ja) * 2013-12-03 2015-06-11 古河電気工業株式会社 樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子および画像表示用装置
JP2019140118A (ja) * 2014-02-18 2019-08-22 エルジー・ケム・リミテッド 封止フィルム及びこれを含む有機電子装置
JP2015193724A (ja) * 2014-03-31 2015-11-05 リンテック株式会社 シート状封止材、封止シート及び電子デバイス
JPWO2016152756A1 (ja) * 2015-03-20 2017-12-28 味の素株式会社 封止体の製造方法
WO2016152756A1 (fr) * 2015-03-20 2016-09-29 味の素株式会社 Procédé de fabrication de boîtier
KR20170128578A (ko) * 2015-03-20 2017-11-22 아지노모토 가부시키가이샤 밀봉체의 제조 방법
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JP2018168378A (ja) * 2018-05-30 2018-11-01 リンテック株式会社 シート状封止材、封止シート及び電子デバイス
CN111378232A (zh) * 2020-03-19 2020-07-07 深圳市天宁达胶粘技术有限公司 一种锂电池用uv固化无溶剂密封材料及其制备方法

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KR101706438B1 (ko) 2017-02-13
TW201313866A (zh) 2013-04-01
TWI532811B (zh) 2016-05-11
CN103764752A (zh) 2014-04-30
JP5907170B2 (ja) 2016-04-20
CN103764752B (zh) 2016-03-02
KR20140050687A (ko) 2014-04-29

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