TWI532811B - 接著性密封薄膜、接著性密封薄膜之製造方法及接著性密封薄膜用塗佈液 - Google Patents
接著性密封薄膜、接著性密封薄膜之製造方法及接著性密封薄膜用塗佈液 Download PDFInfo
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- TWI532811B TWI532811B TW101130782A TW101130782A TWI532811B TW I532811 B TWI532811 B TW I532811B TW 101130782 A TW101130782 A TW 101130782A TW 101130782 A TW101130782 A TW 101130782A TW I532811 B TWI532811 B TW I532811B
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- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L93/04—Rosin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
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- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08J2323/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08J2323/22—Copolymers of isobutene; butyl rubber
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
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- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
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- Medicinal Chemistry (AREA)
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- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
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| JP6046113B2 (ja) * | 2012-03-15 | 2016-12-14 | リンテック株式会社 | 粘着性組成物、及び粘着性シート |
| KR20170116232A (ko) * | 2013-03-27 | 2017-10-18 | 후루카와 덴키 고교 가부시키가이샤 | 유기 전자 디바이스용 소자 밀봉용 수지 조성물, 유기 전자 디바이스용 소자 밀봉용 수지 시트, 유기 일렉트로루미네센스 소자 및 화상 표시 장치 |
| JP5435520B1 (ja) * | 2013-03-29 | 2014-03-05 | 古河電気工業株式会社 | 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置 |
| JP2015071673A (ja) * | 2013-10-02 | 2015-04-16 | 三菱化学株式会社 | 樹脂組成物、接着性封止フィルム及びその製造方法 |
| JP6247916B2 (ja) * | 2013-12-03 | 2017-12-13 | 古河電気工業株式会社 | 樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子および画像表示用装置 |
| KR20150097359A (ko) * | 2014-02-18 | 2015-08-26 | 주식회사 엘지화학 | 봉지 필름 및 이를 포함하는 유기전자장치 |
| JP6347975B2 (ja) * | 2014-03-31 | 2018-06-27 | リンテック株式会社 | シート状封止材、封止シート及び電子デバイス |
| KR102578975B1 (ko) * | 2015-03-20 | 2023-09-18 | 아지노모토 가부시키가이샤 | 밀봉체의 제조 방법 |
| KR102593490B1 (ko) * | 2017-02-28 | 2023-10-25 | 닛토덴코 가부시키가이샤 | 편광판 및 편광판의 제조 방법 |
| EP3617756A4 (fr) * | 2017-04-28 | 2020-11-18 | Komy Co., Ltd. | Miroir résistant aux intempéries |
| KR101962744B1 (ko) * | 2017-08-22 | 2019-03-27 | (주)이녹스첨단소재 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| KR102283118B1 (ko) * | 2017-11-01 | 2021-07-28 | 주식회사 엘지화학 | 유-무기 복합 태양전지 및 유-무기 복합 태양전지 제조방법 |
| WO2019117442A1 (fr) * | 2017-12-12 | 2019-06-20 | Lg Electronics Inc. | Terminal mobile |
| JP2018168378A (ja) * | 2018-05-30 | 2018-11-01 | リンテック株式会社 | シート状封止材、封止シート及び電子デバイス |
| JP7180628B2 (ja) * | 2019-03-14 | 2022-11-30 | 荒川化学工業株式会社 | 粘着付与樹脂エマルジョン、水系粘・接着剤組成物及び粘・接着シート |
| CN111378232A (zh) * | 2020-03-19 | 2020-07-07 | 深圳市天宁达胶粘技术有限公司 | 一种锂电池用uv固化无溶剂密封材料及其制备方法 |
| CN112852359B (zh) * | 2020-12-29 | 2022-09-23 | 江苏雨中情防水材料有限责任公司 | 一种高耐水浸泡非沥青基预铺防水卷材及其制备方法 |
| US12017248B2 (en) | 2022-09-28 | 2024-06-25 | Beyond Manufacture Inc. | Film manufacturing equipment and method of manufacturing film |
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| JP3260349B2 (ja) * | 2000-06-05 | 2002-02-25 | 松下電器産業株式会社 | 電気化学素子用封止剤およびそれを用いた電気化学素子 |
| US20080249236A1 (en) | 2003-10-02 | 2008-10-09 | Tohru Nakashima | Sealing Material For Double-Gazing Pane Comprising Resin Composition With Excellent Gas-Barrier Property and Hot-Melt Tackiness |
| JP4475084B2 (ja) | 2003-10-03 | 2010-06-09 | Ｊｓｒ株式会社 | 有機ｅｌ素子用透明封止材 |
| JP2007197517A (ja) | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機ｅｌ素子 |
| JP5365891B2 (ja) | 2006-10-13 | 2013-12-11 | 日本ゼオン株式会社 | 発光素子用樹脂組成物、発光素子用積層体、発光素子 |
| JP2008201994A (ja) * | 2007-02-22 | 2008-09-04 | Yokohama Rubber Co Ltd:The | 粘接着剤組成物およびそれを用いるゴム製品の製造方法 |
| JP2009062509A (ja) * | 2007-08-09 | 2009-03-26 | Jsr Corp | 水系ブチルゴム粘着性組成物、粘着前処理剤、及びブチルゴム粘着剤 |
| JP5768718B2 (ja) * | 2009-11-18 | 2015-08-26 | 味の素株式会社 | 樹脂組成物 |
-
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- 2012-08-23 CN CN201280040574.0A patent/CN103764752B/zh active Active
- 2012-08-23 KR KR1020147004714A patent/KR101706438B1/ko active IP Right Grant
- 2012-08-23 WO PCT/JP2012/071362 patent/WO2013031656A1/fr active Application Filing
- 2012-08-23 JP JP2013531263A patent/JP5907170B2/ja active Active
- 2012-08-24 TW TW101130782A patent/TWI532811B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103764752A (zh) | 2014-04-30 |
| KR101706438B1 (ko) | 2017-02-13 |
| JPWO2013031656A1 (ja) | 2015-03-23 |
| CN103764752B (zh) | 2016-03-02 |
| JP5907170B2 (ja) | 2016-04-20 |
| TW201313866A (zh) | 2013-04-01 |
| KR20140050687A (ko) | 2014-04-29 |
| WO2013031656A1 (fr) | 2013-03-07 |
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