WO2013015157A1 - Dispositif et procédé de production de substrat - Google Patents

Dispositif et procédé de production de substrat Download PDF

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Publication number
WO2013015157A1
WO2013015157A1 PCT/JP2012/068118 JP2012068118W WO2013015157A1 WO 2013015157 A1 WO2013015157 A1 WO 2013015157A1 JP 2012068118 W JP2012068118 W JP 2012068118W WO 2013015157 A1 WO2013015157 A1 WO 2013015157A1
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WO
WIPO (PCT)
Prior art keywords
substrate
station
thin film
base substrate
coating station
Prior art date
Application number
PCT/JP2012/068118
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English (en)
Japanese (ja)
Inventor
靖仁 中森
礒　圭二
裕司 岡本
Original Assignee
住友重機械工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友重機械工業株式会社 filed Critical 住友重機械工業株式会社
Priority to CN201280037448.XA priority Critical patent/CN103718661A/zh
Priority to JP2013525675A priority patent/JP5714110B2/ja
Priority to KR1020167009136A priority patent/KR20160044587A/ko
Priority to KR1020187008021A priority patent/KR102061315B1/ko
Priority to KR1020147000800A priority patent/KR20140024953A/ko
Publication of WO2013015157A1 publication Critical patent/WO2013015157A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions

Definitions

  • the present invention relates to a substrate manufacturing apparatus that forms a thin film on a base substrate by discharging droplets of a thin film material.
  • a technique for forming a thin film pattern on a base substrate by discharging droplets of a thin film pattern forming material (thin film material) from a nozzle hole onto the surface of the base substrate such as a printed wiring board is known.
  • the thin film pattern is, for example, a solder resist pattern.
  • a liquid resin ejecting apparatus that sprays liquid resin directly on a substrate and forms a pattern based on image information of computer graphics is disclosed (for example, see Patent Document 1).
  • a liquid resin injection device described in Patent Literature 1 a thin film pattern can be easily formed.
  • the process can be shortened and the production cost can be reduced as compared with the case where pattern formation is performed by photolithography.
  • a technique that can more easily form a thin film pattern on both sides of a base substrate is desired.
  • the objective of this invention is providing the board
  • a first coating station that applies a liquid thin film material to one surface of the base substrate, and irradiates the thin film material applied to the base substrate with light to cure a surface layer portion of the thin film material;
  • a base substrate coated with a thin film material is carried in at the first coating station, and the thin film material applied to the base substrate is irradiated with light to be cured to the inside of the thin film material, and the front and back sides of the base substrate are reversed.
  • Reversing station A transfer device for transferring a base substrate between the first coating station and the reversing station; A controller for controlling the first coating station, the reversing station, and the transfer device; The control device is provided with a substrate manufacturing apparatus that controls the transfer device to transfer the base substrate processed at the first coating station to the reversal station.
  • a base substrate is carried into a first coating station, and a liquid thin film material is applied to the first surface of the base substrate at the first coating station, and a surface layer of the thin film material applied to the base substrate Curing the part, Removing the base substrate from the first application station and carrying it into a main curing unit, where the main curing unit cures the thin film material applied to the first surface of the base substrate to the inside thereof; , Transporting the base substrate from the main curing unit to a reversing unit, and reversing the front and back of the base substrate in the reversing unit; The base substrate is taken out from the reversing unit, and the base substrate is transported to the first coating station in a state where the base substrate is turned upside down.
  • the first base substrate Applying a liquid thin film material to a second surface opposite to the surface, and curing a surface layer portion of the thin film material applied to the second surface of the base substrate; Transporting the base substrate from the first coating station to the main curing unit, and in the main curing unit, curing the thin film material applied to the second surface of the base substrate to the inside thereof; A substrate manufacturing method is provided.
  • the thin film pattern can be easily formed on the other side.
  • FIG. 1 is a schematic diagram illustrating a substrate manufacturing apparatus according to a first embodiment.
  • FIG. 2A is a schematic view of an alignment apparatus provided in the alignment station
  • FIGS. 2B and 2C are plan views showing a base substrate in the alignment station.
  • 3A and 3B are schematic views of a droplet discharge device provided in a coating station.
  • 4A is a schematic view showing a nozzle unit
  • FIG. 4B is a bottom view showing a droplet discharge surface of the nozzle unit
  • FIG. 4C is a schematic plan view showing an arrangement of nozzle units.
  • 5A to 5D are schematic views of the substrate reversing device and the ultraviolet irradiation device provided in the reversing station.
  • FIGS. 6A, 6C, and 6E are schematic plan views of the substrate holder, and FIGS. 6B, 6D, and 6F are schematic side views of the substrate holder.
  • FIG. 7 is a schematic view of a substrate manufacturing apparatus according to the second embodiment.
  • FIG. 8 is a schematic view of a substrate manufacturing apparatus according to the third embodiment.
  • FIG. 9 is a schematic view of a substrate manufacturing apparatus according to the fourth embodiment.
  • FIG. 10 is a schematic view of a substrate manufacturing apparatus according to the fifth embodiment.
  • FIG. 11 is a schematic diagram of a substrate manufacturing apparatus according to the sixth embodiment.
  • 12A to 12E are schematic views of a reversing station of the substrate manufacturing apparatus according to the seventh embodiment.
  • FIG. 13A to 13D are schematic views of a reversing station of the substrate manufacturing apparatus according to the eighth embodiment.
  • FIG. 14 is a schematic plan view of a coating station of the substrate manufacturing apparatus according to the ninth embodiment.
  • 15A to 15D are schematic plan views in the coating station for explaining a procedure for forming a thin film pattern in the coating station according to the ninth embodiment.
  • 15E to 15H are schematic plan views in the coating station for explaining a procedure for forming a thin film pattern in the coating station according to the ninth embodiment.
  • 16A to 16C are schematic views of a reversing station of the substrate manufacturing apparatus according to the tenth embodiment.
  • 16D to 16F are schematic views of a reversing station of the substrate manufacturing apparatus according to the tenth embodiment.
  • FIG. 17 is a schematic view of a substrate manufacturing apparatus according to the eleventh embodiment.
  • FIG. 18A to FIG. 18C are schematic diagrams for explaining a processing procedure when processing a substrate with the substrate manufacturing apparatus according to the eleventh embodiment.
  • 18D to 18E are schematic diagrams for explaining a processing procedure when a substrate is processed by the substrate manufacturing apparatus according to the eleventh embodiment.
  • 18F to 18G are schematic diagrams for explaining a processing procedure when a substrate is processed by the substrate manufacturing apparatus according to the eleventh embodiment.
  • FIG. 19A is a schematic view of a substrate manufacturing apparatus according to Embodiment 12, and
  • FIG. 19B is a schematic side view of a temporary storage apparatus.
  • 20A to 20C are schematic diagrams for explaining a processing procedure when a substrate is processed by the substrate manufacturing apparatus according to the twelfth embodiment.
  • 20D to 20E are schematic views for explaining a processing procedure when a substrate is processed by the substrate manufacturing apparatus according to the twelfth embodiment.
  • FIG. 21 is a schematic view of a substrate manufacturing apparatus according to the thirteenth embodiment.
  • FIG. 22A, FIG. 22B, and FIG. 22C are schematic views showing first, second, and third examples of the path of the substrate when the second-stage coating station fails, respectively.
  • FIG. 23A, FIG. 23B, and FIG. 23C are schematic views showing first, second, and third examples of substrate paths when the first-stage coating station fails, respectively.
  • FIG. 24A to 24B are schematic diagrams for explaining a processing procedure when processing a substrate by the substrate manufacturing apparatus according to the fourteenth embodiment.
  • FIG. 24C to FIG. 24D are schematic diagrams for explaining a processing procedure when processing a substrate with the substrate manufacturing apparatus according to the fourteenth embodiment.
  • FIG. 25 is a schematic view of a substrate manufacturing apparatus according to the fifteenth embodiment.
  • FIG. 26 is a schematic view of a substrate manufacturing apparatus according to a modification of the fifteenth embodiment.
  • FIG. 1 shows a schematic diagram of a substrate manufacturing apparatus according to the first embodiment.
  • the substrate manufacturing apparatus according to the first embodiment includes an alignment station 2, a coating station 3, a reversing station 4, an alignment station 5, a coating station 6, ultraviolet irradiation apparatuses 8, 9 and a lifter 11 ⁇ disposed inside a housing 18. 14 is included.
  • Substrate carry-in / out ports 1 and 7 are provided in a housing 18 of the substrate manufacturing apparatus.
  • the substrate manufacturing apparatus according to the first embodiment is used for forming a thin film pattern of a solder resist on both surfaces (first surface and second surface) of the base substrates 21 to 27 which are, for example, rectangular printed wiring boards. .
  • a base substrate on which a thin film pattern is not formed may be simply referred to as a “substrate”.
  • the substrate manufacturing apparatus includes conveyors 15 and 16 and a control device 20.
  • the conveyor 15 carries the substrates 21 to 27 from the outside of the housing 18 into the inside.
  • the lifters 11 to 14 transfer the substrates 21 to 27 between the stations in the housing 18.
  • the conveyor 16 carries the substrates 21 to 27 from the inside of the housing 18 to the outside.
  • the substrate is carried in from the substrate carry-in / out port 1 and the substrate is carried out from the substrate carry-in / out port 7.
  • the operation of each device in the housing 18 and the operations of the conveyors 15 and 16 are controlled by the control device 20.
  • the control device 20 includes a storage device 20a.
  • the substrates 21 to 27 are placed on the conveyor 15 and carried into the casing 18 through the carry-in / out entrance 1. At this time, the first surfaces of the substrates 21 to 27 face upward (the positive direction of the Z axis) in the figure.
  • X Define an XYZ Cartesian coordinate system with the vertical direction in the positive direction of the Z axis.
  • five stations from the alignment station 2 to the coating station 6 are sequentially arranged toward the positive direction of the X axis.
  • the substrates 21 to 27 carried into the housing 18 from the carry-in / out entrance 1 are transported in the positive direction of the X axis as a whole via the stations 2 to 6, and from the carry-in / out entrance 7 to the outside of the housing 18. It is carried out to.
  • the substrates 21 to 27 introduced into the housing 18 are transported to the alignment station 2 by the lifter 11.
  • the alignment station 2 alignment marks formed on the surfaces of the substrates 21 to 27 are detected, and alignment (positioning) of the substrates 21 to 27 is performed based on the detection result.
  • Aligned substrates 21 to 27 are transported to the coating station 3 by the lifter 11.
  • a thin film pattern of solder resist is formed on the first surfaces of the substrates 21 to 27.
  • the thin film pattern formed at the coating station 3 is in a state where only the surface layer portion is cured, and the inside of the thin film pattern remains in a liquid state.
  • the phenomenon that only the surface layer is cured is referred to as “temporary curing”, and the phenomenon that cures to the inside is referred to as “main curing”.
  • the substrates 21 to 27 having the thin film pattern formed on the first surface are transferred from the coating station 3 to the reversing station 4 by the lifter 12.
  • the front and back of the substrates 21 to 27 are reversed.
  • the second surfaces of the substrates 21 to 27 face the positive direction of the Z axis.
  • main curing of the thin film pattern formed on the first surfaces of the substrates 21 to 27 is performed.
  • the substrates 21 to 27 whose front and back sides are reversed and the thin film pattern of the first surface is finally cured are transported from the reversing station 4 to the second alignment station 5 by the lifter 13.
  • the second alignment station 5 alignment marks formed on the second surfaces of the substrates 21 to 27 are detected, and the substrates 21 to 27 are aligned based on the detection result.
  • the substrates 21 to 27 are transported from the alignment station 5 to the second coating station 6 by the lifter 13.
  • a solder resist thin film pattern is formed on the second surfaces of the substrates 21 to 27.
  • the substrates 21 to 27 on which the thin film pattern is formed on the second surface are conveyed from the coating station 6 to the conveyor 16 by the lifter 14.
  • the conveyor 16 carries the substrates 21 to 27 out of the housing 18 from the carry-in / out entrance 7.
  • the ultraviolet irradiation device 9 irradiates the entire second surfaces of the substrates 21 to 27 with ultraviolet rays.
  • the thin film pattern formed on the second surfaces of the substrates 21 to 27 is fully cured by the ultraviolet irradiation.
  • the ultraviolet irradiation device 9 moves in the housing 18 so as to pass above the substrates 21 to 27 placed on the conveyor 16.
  • the ultraviolet irradiation device 9 passes above the substrates 21 to 27, the second surfaces of the substrates 21 to 27 are irradiated with ultraviolet rays.
  • the ultraviolet irradiation device 9 applies ultraviolet rays to the substrates 21 to 27. May be configured to be irradiated. Irradiation of ultraviolet rays onto the substrates 21 to 27 is controlled by the control device 20.
  • processing is performed in parallel at each of the alignment station 2, the coating station 3, the reversing station 4, the alignment station 5, and the coating station 6.
  • the first surface of the other substrate 23 is applied in the coating station 3.
  • a thin film pattern is formed.
  • the main curing of the thin film pattern formed on the first surface of the other substrate 24 and the reversal of the front and back of the substrate 24 are performed. Detection of alignment marks formed on the surface and alignment of the substrate 25 are performed.
  • a thin film pattern is formed on the second surface of the other substrate 26.
  • the conveyor 15 carries the other substrate 21 in which the thin film pattern is not formed into the housing 18, and the conveyor 16 carries out the substrate 27 having the thin film pattern formed on both sides from the housing 18.
  • FIG. 2A shows a schematic view of an alignment apparatus provided in the alignment station 2.
  • the alignment apparatus includes a Y stage 32, a ⁇ stage 33, and a chuck plate 34 that are arranged in this order from the base 31 side on a base (base) 31.
  • the chuck plate 34 sucks and holds the substrate 22 transported to the alignment station 2 by the lifter 11 (FIG. 1).
  • the Y stage 32 moves the substrate 22 in the Y axis direction together with the ⁇ stage 33 and the chuck plate 34.
  • the ⁇ stage 33 rotates the substrate 22 together with the chuck plate 34 around an axis parallel to the Z axis.
  • the Y stage 32, the ⁇ stage 33, and the chuck plate 34 are collectively referred to as a “moving stage”. Adsorption of the substrate 22 by the chuck plate 34 and movement of the substrate 22 by the Y stage 32 and the ⁇ stage 33 are controlled by the control device 20.
  • Alignment device includes CCD cameras 35-38.
  • the CCD cameras 35 to 38 image the alignment marks formed on the surface of the substrate 22 held on the chuck plate 34. Imaging by the CCD cameras 35 to 38 is controlled by the control device 20. Further, the image data (detection result) obtained by the CCD cameras 35 to 38 is transmitted to the control device 20.
  • FIG. 2B is a plan view of the moving stage provided in the alignment station 2 and the substrate 22 sucked and held by the chuck plate 34.
  • Alignment marks 22 a to 22 d are formed on the first surface of the substrate 22.
  • the alignment marks 22a to 22d are arranged in the vicinity of the four corners.
  • the substrate 22 transported to the top of the chuck plate 34 by the lifter 11 is sucked and held by the chuck plate 34.
  • the substrate 22 held on the chuck plate 34 is moved in the negative direction of the Y axis in the alignment station 2 by the Y stage 32.
  • FIG. 2B the chuck plate 34 and the substrate 22 after being moved are shown in parentheses.
  • the CCD cameras 35 to 38 are arranged on the negative side of the Y axis with respect to the position of the chuck plate 34 when the substrate 22 is received from the lifter 11.
  • the CCD cameras 35 to 38 have a relative positional relationship so that the alignment marks 22a to 22d can be simultaneously imaged.
  • the substrate 22 is moved below the CCD cameras 35 to 38 by the Y stage 32, and the CCD cameras 35 to 38 image the alignment marks 22a to 22d formed on the first surface of the substrate 22, respectively.
  • the captured image data is transmitted to the control device 20.
  • the control device 20 analyzes the image data acquired by the CCD cameras 35 to 38, and calculates the position of the substrate 22 and the position (posture) in the rotation direction with the axis parallel to the Z axis as the rotation center. Thereafter, the position of the substrate 22 in the rotational direction is corrected.
  • the correction of the position in the rotation direction is called “ ⁇ correction”.
  • FIG. 2B shows, as an example, a case where the substrate 22 is displaced by an angle ⁇ counterclockwise from the target position with respect to the rotation direction of the XY plane.
  • the side connecting the vertex corresponding to the alignment mark 22a and the vertex corresponding to the alignment mark 22d is inclined by an angle ⁇ counterclockwise from the positive direction of the X axis with respect to the latter vertex.
  • the positional deviation is calculated by the control device 20 based on the image data acquired by the CCD cameras 35 to 38.
  • the control device 20 performs ⁇ correction by rotating the ⁇ stage 33 clockwise by an angle ⁇ .
  • FIG. 2C shows a plan view of the chuck plate 34 and the substrate 22 after ⁇ correction.
  • each side of the rectangular substrate 22 is parallel to the X axis or the Y axis.
  • the control device 20 drives the Y stage 32 to move the substrate 22 in the positive direction of the Y axis.
  • the moving distance of the Y stage 32 is equal to the distance of moving the Y stage 32 in the negative direction of the Y axis in the process shown in FIG. 2B.
  • the chuck plate 34 and the substrate 22 after moving in the positive direction of the Y axis are shown in parentheses in FIG. 2C.
  • the substrate 22 subjected to ⁇ correction is transferred from the alignment station 2 to the coating station 3 (FIG. 1) by the lifter 11 (FIG. 1).
  • the lifter 11 maintains the position (posture) in the rotation direction of the substrate 22 after the ⁇ correction by the rotation of the ⁇ stage 33 and conveys it to the coating station 3.
  • the coating station 3 Since the ⁇ correction is completed in the alignment station 2 shown in FIG. 1, the coating station 3 starts forming a thin film pattern on the first surface of the substrate 22 without performing ⁇ correction of the substrate 22. be able to. Compared with the case where ⁇ correction is performed at the coating station 3 and then a thin film pattern is formed, the processing time at the coating station 3 can be shortened. As a result, the tact time can be shortened and the production efficiency can be improved.
  • the substrate 22 may have an elongation strain.
  • the elongation strain is generated, the dimension of the substrate at the time of forming the thin film pattern is different from the design value.
  • the control device 20 calculates the dimensions of the substrate 22 based on the image data acquired by the alignment station 2. Based on the calculated substrate dimensions, ejection control image data used when forming a thin film pattern at the coating station 3 is generated. The generated ejection control image data is stored in the storage device 20a of the control device 20.
  • FIG. 3A and 3B are schematic views of the droplet discharge device 70 provided in the coating station 3 (FIG. 1).
  • the droplet discharge device 70 includes a base (base) 41 installed in a posture parallel to the XY plane, and an X stage 43 sequentially disposed on the base 41 from the base 41 side.
  • a Y stage 44 and a chuck plate 45 are included. The chuck plate 45 sucks and holds the substrate 23 transported to the coating station 3 by the lifter 11 (FIG. 1).
  • the X stage 43 moves the substrate 23 along with the Y stage 44 and the chuck plate 45 in the X-axis direction.
  • the Y stage 44 moves the substrate 23 in the Y axis direction together with the chuck plate 44.
  • the X stage 43, the Y stage 44, and the chuck plate 45 are collectively referred to as a “moving stage”. Adsorption of the substrate 23 by the chuck plate 45 and movement of the substrate 23 by the X stage 43 and the Y stage 44 are controlled by the control device 20.
  • a high-function stage having the functions of the X stage 43, the Y stage 44, and the chuck plate 45 may be used as the moving stage.
  • the frame 42 is fixed to the base 41.
  • the frame 42 includes two struts 42a and 42b and a beam 42c.
  • the support columns 42a and 42b are attached to the center of the base 41 in the Y-axis direction.
  • the beam 42c is supported by the columns 42a and 42b so as to be along the X-axis direction.
  • Nozzle units 47 a to 47 f are supported above the chuck plate 44 by the frame 42.
  • the nozzle units 47a to 47f are supported by the beam 42c of the frame 42 via the connecting member 46.
  • Each of the nozzle units 47a to 47f includes a plurality of nozzle heads and an ultraviolet light source.
  • the nozzle head discharges, for example, droplets of an ultraviolet curable thin film material toward the first surface of the substrate 23 held by the chuck plate 44.
  • the thin film material is discharged while moving the substrate 23 in the Y-axis direction.
  • a thin film pattern having a predetermined planar shape is formed on the first surface of the substrate 23 by the discharged thin film material.
  • the thin film pattern is temporarily cured by the ultraviolet rays emitted from the ultraviolet light source.
  • Image data that defines the planar shape of the thin film pattern to be formed on the first surface of the substrate 23 is stored in the storage device 20a of the control device 20.
  • the pattern definition data is given in, for example, a Gerber format.
  • data indicating the relationship (ejection timing) between the amount of movement of the substrate 23 by the moving stage and the timing of ink ejection from the nozzle head is stored in the storage device 20a.
  • These data are design data given on the assumption that the substrate 23 is not distorted. If the substrate 23 is distorted, this design data cannot be used as it is.
  • the control device 20 generates discharge control image data from these design data based on the image data of the substrate 23 imaged by the alignment station 2 (FIG. 1).
  • the ejection control image data is given, for example, in a raster format.
  • the control device 20 calculates the amount of expansion / contraction of the substrate 23 in the X direction and Y direction from the image data acquired by the alignment station 2.
  • the pattern definition data is corrected according to the amount of expansion and contraction of the substrate 23 in the X direction and the Y direction. Based on the corrected pattern definition data, raster format ejection control image data is generated.
  • the control device 20 Based on the ejection control image data stored in the storage device 20a, the control device 20 applies the thin film material from the nozzle units 47a to 47f so that the thin film material is applied to a predetermined region of the first surface of the substrate 23. And the movement of the substrate 23 by the moving stage is controlled. The thin film material is applied to the first surface of the substrate 23 when the substrate 23 moves along the Y-axis direction and passes vertically below the nozzle units 47a to 47f (the negative direction of the Z-axis).
  • FIG. 3B shows a schematic view of the vicinity of the nozzle units 47a to 47f of the droplet discharge device 70.
  • the nozzle units 47a to 47f have the same configuration, and are fixed to the connecting member 46 at equal intervals along the X-axis direction.
  • the connecting member 46 is attached to the beam 42c of the frame so as to be movable in the Z-axis direction. By moving the connecting member 46 in the Z-axis direction, the distance between the nozzle units 47a to 47f and the substrate 23 can be changed.
  • the movement of the nozzle units 47a to 47f in the Z-axis direction by the connecting member 46 is controlled by the control device 20.
  • the nozzle units 47a to 47f may be directly fixed to the beam 42c of the frame without using the connecting member 46.
  • FIG. 4A shows a perspective view of the nozzle unit 47a.
  • the nozzle unit 47a includes nozzle heads 47a1 to 47a4 and ultraviolet light sources 47a5 to 47a9 that are alternately assembled along the Y-axis direction in the nozzle holder 47ac.
  • Each nozzle head 47a1 to 47a4 includes two nozzle rows arranged along the Y-axis direction.
  • Each nozzle row is constituted by a plurality of, for example, 192 nozzle holes arranged along the X-axis direction.
  • the length along the X-axis direction of each nozzle row is, for example, about 30 mm. For this reason, the length along the X-axis direction of the nozzle unit 47a is also about 30 mm.
  • An ultraviolet curable thin film material is discharged from each nozzle hole.
  • the ultraviolet light sources 47a5 to 47a9 are configured to include, for example, a light emitting diode (LED), and emit light having a wavelength in the ultraviolet region.
  • the ultraviolet curable thin film material discharged from the nozzle holes of the nozzle heads 47a1 to 47a4 to the substrate 23 is temporarily cured by light emitted from the ultraviolet light sources 47a5 to 47a9.
  • the emission of ultraviolet light from the ultraviolet light sources 47a5 to 47a9 is controlled by the control measure 20.
  • FIG. 4B shows a bottom view of the nozzle unit 47a (nozzle heads 47a1 to 47a4).
  • the description of the ultraviolet light sources 47a5 to 47a9 is omitted.
  • each of the nozzle heads 47a1 to 47a4 includes 384 nozzle holes arranged in a zigzag pattern at intervals of 80 ⁇ m in the X-axis direction, and has a resolution corresponding to about 300 dpi.
  • a piezoelectric element is disposed in each nozzle hole, and a thin film material is discharged from the nozzle hole by applying a voltage to the piezoelectric element.
  • Application of voltage to the piezoelectric element is controlled by the control device 20. That is, the discharge of the thin film material is controlled by the control device 20.
  • two nozzle rows are arranged in each of the nozzle heads 47a1 to 47a4. However, the number of nozzle rows may be one or three or more.
  • the nozzle heads 47a1 to 47a4 are arranged along the Y-axis direction as a whole while their relative positions are sequentially shifted in the positive direction of the X-axis. That is, the nozzle head 47a2 is arranged so as to be shifted in the positive direction of the X axis by 20 ⁇ m with respect to the nozzle head 47a1. Similarly, the nozzle heads 47a3 and a4 are arranged so as to be shifted in the positive direction of the X axis by 20 ⁇ m with respect to the nozzle heads 47a2 and a3, respectively.
  • the nozzle unit 47a includes a plurality of nozzle holes arranged at intervals of 20 ⁇ m (resolution corresponding to about 1200 dpi) in the X-axis direction.
  • FIG. 4C shows a schematic plan view of the nozzle units 47a to 47f.
  • each of the nozzle units 47a to 47f has a droplet discharge capability in a range of about 30 mm along the X-axis direction.
  • the plurality of nozzle units 47a to 47f are arranged at equal intervals along the X-axis direction.
  • the distance between adjacent nozzle units 47a to 47f is, for example, about 60 mm.
  • the process in the coating station 3 (FIG. 1) will be described.
  • the lifter 11 transports the substrate 23 and places it on the chuck plate 45 (FIG. 3A). While moving the substrate 23 held by the chuck plate 45 in the negative direction of the Y axis, the odd-numbered row regions (regions marked with circles in FIG. 4C) along the Y axis direction below the nozzle units 47a to 47f.
  • the thin film material is discharged from the nozzle units 47a to 47f toward the landing target position (position where the thin film material is to be applied).
  • the substrate 23 is moved in the positive direction of the X axis by, for example, 10 ⁇ m by the X stage 43 (FIG. 3A).
  • a thin film pattern can be formed with high resolution corresponding to about 2400 dpi.
  • the X stage 43 is driven, and the substrate 23 is moved about 30 mm in the positive direction of the X axis.
  • the substrate 23 is reciprocated in the Y-axis direction by the Y stage 44, and the odd-numbered row region and the even-numbered row region are drawn in the forward path and the backward path, respectively.
  • the same processing is performed once more, and the substrate 23 is reciprocated a total of three times along the Y-axis direction, thereby completing the formation of the thin film pattern on the first surface of the substrate 23.
  • the droplet discharge device 70 shown in FIGS. 3A to 4C includes six nozzle units 47a to 47f.
  • the number of nozzle units is not limited to six.
  • the number of nozzle units may be one.
  • the substrate reversing device 50 includes a substrate holder 51 that holds the substrates 21 to 27 transported to the reversing station 4, and a rod-like support member 52 that supports the substrate holder 51.
  • the substrate holder 51 is composed of a bar-shaped member along the remaining three sides from which one short side is removed from the four sides of the rectangle. A portion along two long sides parallel to each other is referred to as an “arm”, and a portion along one short side is referred to as a “connecting portion”.
  • the support member 52 is connected to the midpoint of the connecting portion and extends in the opposite direction to the two arms.
  • the substrate holder 51 is rotatable about the support member 52 as a rotation axis. The rotation of the substrate holder 51 by the support member 52 is controlled by the control device 20.
  • the ultraviolet irradiation device 60 includes a support member 61 and an ultraviolet light source 62.
  • the support member 61 extends in a direction parallel to the extending direction of the support member 52 of the substrate reversing device 50.
  • the ultraviolet light source 62 includes a lamp or an LED and emits light having a wavelength in the ultraviolet region.
  • the ultraviolet light source 62 has a higher output than the ultraviolet light sources 47a5 to 47a9 (FIG. 4A) included in the nozzle unit.
  • the wavelength of the ultraviolet light emitted from the ultraviolet light source 2 may be the same as or different from the wavelength of the ultraviolet light emitted from the ultraviolet light source of the nozzle unit.
  • the ultraviolet light source 62 is supported by the support member 61 so as to be movable in the extending direction.
  • the control device 20 controls the emission of the ultraviolet light from the ultraviolet light source 62 and the movement of the ultraviolet light source 62 along the support member 61.
  • the substrates 21 to 27 on which the thin film pattern is formed on the first surface at the coating station 3 (FIG. 1), for example, the substrate 24, are transferred to the reversing station 4 by the lifter 12 (FIG. 1).
  • the substrate 24 is placed on the substrate holder 51 by the lifter 12 so that the first surface (the surface on which the thin film pattern is formed) of the substrate 24 faces upward (to face the positive direction of the Z axis).
  • the substrate holder 51 holds the substrate 24 in a fixed manner by suction, pressing, clamping, or the like. That is, the substrate 24 is held so as not to move relative to the substrate holder 51.
  • the control device 20 controls the fixed holding and release of the substrate 24 by the substrate holder 51.
  • the ultraviolet light source 62 is moved along the support member 61 while emitting ultraviolet light from the ultraviolet light source 62.
  • the ultraviolet light source 62 passes over the substrate 24 held by the substrate holder 51, and the ultraviolet light emitted from the ultraviolet light source 62 is at least on the substrate 24.
  • the region where the thin film pattern is spastic, for example, the entire first surface of the substrate 24 is irradiated.
  • the ultraviolet light emitted from the ultraviolet light source 62 is irradiated on the entire first surface of the substrate 24 at an energy density of, for example, 1000 mJ / cm 2 .
  • the main curing of the thin film pattern formed on the first surface of the substrate 24 is performed by irradiation with ultraviolet light.
  • the substrate 24 is irradiated with ultraviolet light at a higher energy density than when the temporary curing is performed.
  • the substrate holder 51 is rotated by 180 ° with the support member 52 as the rotation axis. As a result, the front and back of the substrate 24 held by the substrate holder 51 are reversed.
  • the substrate 24 whose front and back are reversed is conveyed to the alignment station 5 by the lifter 13 (FIG. 1).
  • the substrate 24 is transferred to the coating station 6. Before the transfer by the lifter 13 is performed, the holding of the substrate 24 by the substrate holder 51 is released.
  • FIGS. 6A to 6F show schematic plan views of the substrate holder 51
  • FIGS. 6B, 6D, and 6F show schematic side views of the substrate holder 51.
  • FIG. 6A, 6C, and 6E show schematic plan views of the substrate holder 51
  • FIGS. 6B, 6D, and 6F show schematic side views of the substrate holder 51.
  • FIG. 6A, 6C, and 6E show schematic plan views of the substrate holder 51
  • FIGS. 6B, 6D, and 6F show schematic side views of the substrate holder 51.
  • the substrate holder 51 includes a vacuum suction pad 53 on the surface of the arm.
  • 6A and 6B show an example in which a plurality of vacuum suction pads 53 are formed on the upper surfaces of two arms.
  • the substrate 24 is placed on the vacuum suction pad 53 by the lifter 12 (FIG. 1), and is sucked and held by the substrate holder 51 by the suction force from the vacuum suction pad 53.
  • the substrate holder 51 is provided with a pressing roller 54 extending in parallel with the arms on the two arms.
  • the presser roller 54 moves on the edge of the substrate 24 placed on the upper surface of the substrate holder 51 by the lifter 12 (FIG. 1).
  • the substrate 24 is fixedly held by the substrate holder 51 by being pressed by the pressing roller 54.
  • the substrate holder 51 includes a clamp mechanism 55.
  • the clamp mechanism 55 has a rising portion extending in a direction parallel to the two arms, and bends, for example, 90 ° so that a part (clamp destination) of the clamp mechanism 55 falls inward.
  • the edge of the substrate 24 placed on the substrate holder 51 is sandwiched between the clamp mechanisms 55, the substrate 24 is held by the substrate holder 51.
  • the substrate holder 51 contacts the substrate 24 at a portion where the thin film pattern is not formed.
  • the substrate holder 51 was rotated to reverse the front and back of the substrate 24.
  • the main curing may be performed by irradiating the first surface of the substrate 24 with ultraviolet light from the negative side of the Z-axis. Further, the main curing by the irradiation of ultraviolet light and the inversion of the substrate 24 by the rotation of the substrate holder 51 may be performed in parallel.
  • the ultraviolet light source 62 is rotated in synchronization with the rotation of the substrate 24 so that the first surface of the rotating substrate 24 is irradiated with ultraviolet light having a predetermined intensity.
  • the substrate 24 on which the thin film pattern on the first surface is fully cured and the front and back are reversed is transferred to the alignment station 5 (FIG. 1) by the lifter 13 (FIG. 1).
  • Alignment station 5 has the same configuration and functions as alignment station 2. An alignment mark formed on the second surface opposite to the first surface of the substrate 24 is detected by the CCD camera, and ⁇ correction is performed. Further, from the captured image data, the dimensions of the substrate 24 on which the thin film pattern formation on the first surface is completed are calculated, and the discharge control image data used when forming the thin film pattern on the second surface of the substrate 24 is obtained. Generate a new one. Further, ⁇ correction of the substrate 24 is performed in the alignment station 5.
  • the lifter 13 transports the substrate 24 after the ⁇ correction to the stage of the coating station 6 (FIG. 1) while maintaining the direction of the rotation direction.
  • the coating station 6 has the same configuration and function as the coating station 3. In the coating station 6, a thin film pattern is formed on the second surface of the substrate 24 based on the ejection control image data on the second surface.
  • the image data for ejection control of the second surface can also be created based on the image data acquired by the first alignment station 2.
  • the image data obtained by the alignment station 5 is used only for ⁇ correction, for example.
  • the substrate 24 on which the formation of the thin film pattern on the second surface has been completed is conveyed to the conveyor 16 by the lifter 14 (FIG. 1).
  • the lifter 14 By irradiating the second surface of the substrate 24 placed on the conveyor 16 with the ultraviolet rays emitted from the ultraviolet irradiation device 9, the thin film pattern is fully cured. Thereafter, the substrate 24 is carried out of the housing 18 from the carry-in / out entrance 7 by the conveyor 16.
  • the substrate manufacturing apparatus from the end of the formation of the thin film pattern on the first surface of the substrate 24 at the coating station 3 (FIG. 1) until the substrate 24 is placed on the stage of the coating station 6 (FIG. 1).
  • the thin film pattern formed on the first surface of the substrate 24 is fully cured.
  • the thin film pattern formed on the first surface of the substrate 24 at the coating station 3 is finally cured at the reversing station 4 without coming into contact with anything.
  • tackiness occurs in the thin film pattern.
  • the thin film pattern on the second surface of the substrate 24 is formed without performing the main curing of the thin film pattern on the first surface of the substrate 24, for example, when the substrate 24 is handled by the lifter 13 (FIG. 1)
  • a trace such as a scratch may be formed on the thin film pattern on the first surface.
  • problems may occur in various processes due to tack.
  • the thin film pattern on the second surface of the substrate 24 is fully cured by the ultraviolet light emitted from the ultraviolet irradiation device 9, the thin film on the second surface of the substrate 24 is transported to the outside of the housing 18. It is possible to prevent the pattern from being scratched or imprinted.
  • the non-normal operation time means, for example, a state in which one of the droplet discharge devices disposed in the coating stations 3 and 6 is in failure or maintenance, and only the other coating station can be used.
  • the operation of the substrate manufacturing apparatus during a period in which a problem occurs in the droplet discharge device of the second-stage coating station 6 and a period during which the droplet discharge device is maintained will be described. This operation is realized by control from the control device 20.
  • the processing in the alignment station 2, the coating station 3, and the reversing station 4 for the substrate introduced into the housing 18 is the same as in normal operation. That is, the alignment station 2 detects an alignment mark formed on the first surface of the substrate, and performs ⁇ correction of the substrate based on the detection result. Further, the size of the substrate is calculated based on the image data acquired in the alignment station 2, and the image data for ejection control is generated according to the grasped size.
  • the lifter 11 conveys the substrate to the stage of the coating station 3 while maintaining the position (posture) in the rotation direction of the substrate. In the coating station 3, a thin film pattern is formed on the first surface of the substrate based on the ejection control image data.
  • the lifter 12 transports the substrate from the coating station 3 to the reversing station 4. In the inversion station 4, main curing of the thin film pattern formed on the first surface of the substrate and inversion of the front and back are performed.
  • the substrate on which the thin film pattern on the first surface is fully cured and the front and back are reversed is transferred to the first alignment station 2 by the lifter 12 or 11.
  • the alignment marks formed on the second surface of the substrate are detected by the CCD cameras 35 to 38 (FIG. 2A). Based on the detection result, ⁇ correction of the substrate is performed. Further, the size of the substrate is calculated based on the image data acquired by the CCD cameras 35 to 38, and the image data for controlling discharge of the thin film pattern formed on the second surface of the substrate is generated according to the calculated size. To do.
  • the discharge control image data of the thin film pattern formed on the second surface can be generated based on the image data obtained by imaging the alignment mark on the first surface.
  • the image data obtained by the alignment station 2 after the substrate inversion is used only for ⁇ correction.
  • the substrate subjected to ⁇ correction is transferred to the coating station 3 by the lifter 11.
  • a thin film pattern is formed on the second surface of the substrate by the droplet discharge device based on the discharge control image data of the thin film pattern formed on the second surface.
  • the substrate on which the thin film pattern is formed on the second surface is conveyed to the conveyor 15 by the lifter 11.
  • the conveyor 15 carries the substrate out of the housing 18 from the carry-in / out entrance 1.
  • the substrate carry-in / out port 1 is used for carrying in and carrying out the substrate.
  • the ultraviolet irradiation device 8 irradiates the entire area of the second surface of the substrate with ultraviolet rays, and the thin film pattern formed on the second surface is fully cured.
  • the ultraviolet irradiation device 8 is movable in the housing 18 so as to pass over the substrate placed on the conveyor 15, and irradiates the second surface of the substrate with ultraviolet light while passing over the substrate. .
  • the ultraviolet irradiating device 8 may be fixedly disposed in the housing 18 and the substrate may pass under the ultraviolet irradiating device 8 during the period in which the substrate is conveyed by the conveyor 15. Irradiation of ultraviolet rays onto the substrate is controlled by the control device 20.
  • the first surface and the second surface of the substrate are used by using the droplet discharge device of the first-stage coating station 3 at the time of failure or maintenance of the droplet discharge device of the coating station 6.
  • a thin film pattern is formed on both of the surfaces.
  • the substrates are processed simultaneously in parallel at each of the stations 2 to 4, but the substrate is not parallel at the time of failure or maintenance of the droplet discharge device of the second-stage coating station 6. Processed one by one. For example, after the processing for one substrate is completed and the substrate is unloaded from the housing 18, another substrate is loaded into the housing 18. For this reason, production efficiency is lower during non-normal operation than during normal operation.
  • the substrate can be transported to the conveyor 15 using the lifter 11 after the formation of the thin film pattern at the coating station 3 is completed without forming the thin film pattern on the second surface.
  • the substrate After the formation of the thin film pattern on the first surface, it is possible to perform the main curing of the thin film pattern on the first surface at the reversing station 4 and then transport the substrate to the conveyor 15 using the lifter 12 or 11. .
  • the reversing station 4 may perform not only the main curing of the thin film pattern but also the reversal of the front and back of the substrate.
  • the thin film material is applied using the droplet discharge device of the first-stage coating station 3 when the droplet discharge device of the second-stage coating station 6 fails or when maintenance is performed. At the time of failure or maintenance of the droplet discharge device at the first-stage coating station 3, the thin-film material is applied using the droplet discharge device at the second-stage coating station 6.
  • the conveyor 16 carries the substrate into the housing 18 from the carry-in / out entrance 7.
  • the substrate carry-in / out port 7 is used not only for carrying out the substrate but also for carrying in the substrate.
  • the first surface of the substrate faces the positive direction of the Z axis.
  • the substrate introduced into the housing 18 is transported to the alignment station 5 by the lifter 14 or 13.
  • alignment station 5 an alignment mark formed on the first surface of the substrate is detected.
  • ⁇ correction of the substrate is performed.
  • the size of the substrate is calculated based on the image data acquired in the alignment station 5, and image data for ejection control is generated according to the calculated size.
  • the substrate subjected to ⁇ correction is transported to the stage of the coating station 6 by the lifter 13.
  • a thin film pattern is formed on the first surface of the substrate based on the generated ejection control image data.
  • the substrate is transferred to the reversing station 4 by the lifter 13, and the main curing of the thin film pattern formed on the first surface and the reversing of the front and back are performed.
  • the substrate with the second surface facing the positive direction of the Z-axis is transferred again to the alignment station 5 by the lifter 13.
  • alignment station 5 an alignment mark formed on the second surface of the substrate is detected, and ⁇ correction of the substrate is performed based on the detection result. Further, the size of the substrate is calculated based on the image data acquired by the alignment station 5, and image data for ejection control of the thin film pattern formed on the second surface is generated according to the calculated size.
  • the image data for ejection control of the thin film pattern formed on the second surface can also be created based on the detection result of the alignment mark on the first surface.
  • the substrate subjected to ⁇ correction is transferred to the stage of the coating station 6 by the lifter 13.
  • the thin film pattern is formed on the second surface by the droplet discharge device based on the discharge control image data of the thin film pattern formed on the second surface.
  • the substrate on which the thin film pattern is formed on the second surface is conveyed to the conveyor 16 by the lifter 14.
  • the conveyor 16 carries the substrate out of the housing 18 from the carry-in / out entrance 7.
  • the ultraviolet irradiation device 9 irradiates the entire area of the second surface of the substrate with ultraviolet rays, so that the thin film pattern is fully cured.
  • the substrate to be processed next is loaded into the housing 18.
  • the substrate can be transported to the conveyor 16 using the lifter 14 after the formation of the thin film pattern on the first surface at the coating station 6 without forming the thin film pattern on the second surface.
  • the substrate After the formation of the thin film pattern on the first surface, it is possible to perform the main curing of the thin film pattern on the first surface at the reversing station 4 and then transport the substrate to the conveyor 16 with the lifter 13 or 14. Further, the reversing station 4 may perform not only the main curing of the thin film pattern but also the reversal of the front and back of the substrate.
  • the thin film material is applied using the droplet discharge device of the first-stage coating station 3 when the droplet discharge device of the second-stage coating station 6 fails or when maintenance is performed.
  • the thin film material is coated using the droplet ejection device at the second stage coating station 6. For this reason, the board
  • FIG. 7 shows a schematic diagram of a substrate manufacturing apparatus according to the second embodiment.
  • the alignment stations 2 and 5 do not include an alignment device for performing ⁇ correction.
  • the droplet discharge device of the coating stations 3 and 6 includes a ⁇ stage 49 and CCD cameras 63 to 66.
  • a temporary stage 48 which is an alignment device that performs simple alignment without ⁇ correction is arranged.
  • the substrates 21 to 27 are placed on the temporary stage 48 of the alignment stations 2 and 5 by the lifters 11 and 13.
  • the substrates 21 to 27 are transported to the coating stations 3 and 6 after simple alignment such as pressing against fixing pins.
  • the droplet discharge device of the coating stations 3 and 6 includes a ⁇ stage 49 between the Y stage 44 and the chuck plate 45.
  • the ⁇ stage 49 can rotate the substrates 21 to 27 held by the chuck plate 45 around a straight line parallel to the Z axis.
  • the droplet discharge device includes CCD cameras 63 to 66 that detect alignment marks formed on the surfaces facing upward of the substrates 21 to 27.
  • the substrates 21 to 27 transported to the coating stations 3 and 6 are sucked and held by the chuck plate 45, and the alignment marks on the surface facing upward are detected by the CCD cameras 63 to 66.
  • the detection result, that is, the captured image data is transmitted to the control device 20.
  • the control device 20 analyzes the detection result and calculates the positions of the substrates 21 to 27 in the X and Y directions and the position (posture) in the rotation direction. Based on the calculated result, the ⁇ stage 49 is driven to perform ⁇ correction on the substrates 21 to 27. Further, the control device 20 calculates the sizes of the substrates 21 to 27 based on the detection results of the CCD cameras 63 to 66, and generates ejection control image data according to the calculated sizes.
  • ⁇ correction of the substrates 21 to 27 is not performed at the alignment stations 2 and 5, and ⁇ correction of the substrates 21 to 27 is performed at the coating stations 3 and 6. Further, a thin film pattern is formed on the substrates 21 to 27 based on the generated ejection control image data.
  • the operation of the substrate manufacturing apparatus according to the second embodiment is controlled by the control device 20 as follows.
  • the substrate introduced into the housing 18 from the carry-in / out entrance 1 is placed on the temporary placement stage 48 of the alignment station 2 and subjected to simple alignment. Thereafter, the wafer is conveyed from the alignment station 2 to the chuck plate 45 of the coating station 3.
  • the substrate is held by suction on the chuck plate 45, and the alignment marks on the first surface are detected by the CCD cameras 63-66.
  • the detection result is transmitted to the control device 20.
  • the control device 20 analyzes the detection result and detects the position of the substrate and the posture in the rotation direction. Based on the detection result, ⁇ correction of the substrate is performed. Further, the control device 20 calculates the size of the substrate based on the detection results of the CCD cameras 63 to 66, and generates ejection control image data according to the calculated size. Thereafter, a thin film pattern is formed on the first surface of the substrate based on the generated ejection control image data.
  • the substrate is conveyed to the reversing station 4 by the lifter 12, and the main curing of the thin film pattern formed on the first surface of the substrate and the reversing of the front and back are performed. Then, simple alignment is performed by mounting on the temporary stage 48 of the alignment station 2. After simple alignment, the liquid is again returned onto the chuck plate 45 of the droplet discharge device of the coating station 3.
  • the alignment marks formed on the second surface of the substrate are detected by the CCD cameras 63 to 66, and ⁇ correction of the substrate is performed based on the detection result. Further, the size of the substrate is calculated based on the image data acquired by the CCD cameras 63 to 66, and the image data for controlling the discharge of the thin film pattern formed on the second surface of the substrate is generated according to the calculated size. Is done. A thin film pattern is formed on the second surface of the substrate based on the discharge control image data of the thin film pattern formed on the second surface.
  • the substrate on which the thin film pattern is formed on the second surface is conveyed to the conveyor 15, and the thin film pattern on the second surface is fully cured by the ultraviolet irradiation device 8. Thereafter, the conveyor 5 carries the substrate out of the housing 18 from the carry-in / out entrance 1.
  • the substrate manufacturing apparatus is controlled by the control device 20 as follows.
  • the substrate is introduced into the housing 18 from the carry-in / out entrance 7.
  • the substrate introduced into the housing 18 is transported to the temporary placement stage 48 of the alignment station 5 by the lifters 14 and 13, and simple alignment is performed. Thereafter, the ink is conveyed from the alignment station 5 to the chuck plate 45 of the droplet discharge device of the coating station 6.
  • the alignment mark on the first surface of the substrate held by suction on the chuck plate 45 is detected by the CCD cameras 63 to 66, and the detection result is transmitted to the control device 20.
  • the control device 20 analyzes the detection result, detects the position of the substrate and the orientation in the rotation direction, and performs ⁇ correction.
  • the control device 20 calculates the size of the substrate based on the detection results of the CCD cameras 63 to 66, and generates ejection control image data according to the calculated size. Thereafter, a thin film pattern is formed on the first surface of the substrate based on the generated ejection control image data.
  • the substrate on which the thin film pattern is formed on the first surface is transported to the reversing station 4 by the lifter 13, and the main curing of the thin film pattern formed on the first surface and the reverse of the front and back are performed. Thereafter, simple alignment is performed on the temporary stage 48 of the alignment station 5, and it is returned again onto the chuck plate 45 of the droplet discharge device of the coating station 6.
  • the alignment marks formed on the second surface of the substrate are detected by the CCD cameras 63 to 66, and ⁇ correction of the substrate is performed based on the detection result. Further, the size of the substrate is calculated based on the image data acquired by the CCD cameras 63 to 66, and the image data for controlling the discharge of the thin film pattern formed on the second surface of the substrate is generated according to the calculated size. Is done. A thin film pattern is formed on the second surface based on the discharge control image data of the thin film pattern formed on the second surface.
  • the substrate on which the thin film pattern is formed on the second surface is conveyed to the conveyor 16, and the thin film pattern on the second surface is fully cured by the ultraviolet irradiation device 9.
  • the substrate after the main curing is carried out from the carry-in / out entrance 7 to the outside of the housing 18.
  • the substrate manufacturing apparatus according to the second embodiment can also form a thin film pattern by using the other coating station when one of the droplet ejection apparatuses at the coating stations 3 and 6 cannot be used. Thereby, continuity of work can be secured.
  • FIG. 8 shows a schematic diagram of a substrate manufacturing apparatus according to the third embodiment.
  • the third embodiment is different from the first embodiment in that the ultraviolet irradiation device 8 (FIG. 1) is not included and the inversion station 4 includes a substrate carry-out port 17.
  • the operation during normal operation of the substrate manufacturing apparatus according to the third embodiment is equal to that of the first embodiment.
  • the substrate manufacturing apparatus according to the third embodiment forms a thin film pattern on one surface of the substrate, for example, the first surface.
  • the substrate manufacturing apparatus according to the third embodiment is controlled by the control device 20 as follows when the droplet discharge device of the second-stage coating station 6 fails or during maintenance.
  • the processing in the alignment station 2, the coating station 3, and the reversing station 4 for the substrates 21 to 24 introduced into the housing 18 is the same as that in normal operation.
  • the substrates 21 to 24 on which the main curing of the thin film pattern formed on the first surface and the front and back have been reversed are carried out of the housing 18 from the substrate carry-out port 17. Carrying out may be performed using a conveyor or may be performed manually.
  • the substrates 21 to 24 conveyed to the reversing station 4 may be carried out from the substrate carry-out port 17 without performing one or both of the main curing of the thin film pattern formed on the surface and the reversing of the substrate. it can.
  • the processing of the substrate can be performed in parallel at each of the stations 2 to 4. For this reason, even when the droplet discharge device of the coating station 6 cannot be used, high production efficiency can be maintained.
  • a thin film pattern is similarly formed on one side of the substrate, for example, the first surface of the substrate, under the control of the control device 20 using the droplet discharge device at the coating station 6. To do.
  • the substrate is conveyed by the conveyor 16 and introduced into the housing 18 from the carry-in / out entrance 7.
  • the substrate introduced into the housing 18 is transported to the alignment station 5 by the lifters 14 and 13.
  • ⁇ correction of the substrate is performed.
  • the size of the substrate is calculated based on the image data acquired in the alignment station 5, and image data for ejection control of the thin film pattern formed on the first surface is generated according to the calculated size.
  • the lifter 13 conveys the substrate after ⁇ correction from the alignment station 5 to the stage of the coating station 6.
  • a thin film pattern is formed on the first surface based on the generated ejection control image data.
  • the substrate is transferred to the reversing station 4 by the lifter 13, and the main curing of the thin film pattern formed on the first surface and the reversal of the front and back are performed. After that, the substrate is carried out of the housing 18 from the carry-out port 17 by, for example, a conveyor or a manpower.
  • the carrying out from the carry-out port 17 may be performed without performing one or both of the main curing of the thin film pattern and the reversing of the substrate.
  • Example 3 even when the droplet discharge device at the coating station 3 cannot be used, the alignment or coating at the alignment station 5 is performed during the period in which the main curing of the solder resist and the substrate are reversed at the reversing station 4.
  • the thin film material can be applied at the station 6. For this reason, in Example 1, it is possible to raise production efficiency compared with the case where the droplet discharge apparatus of the application
  • the substrate manufacturing apparatus when one of the droplet discharge devices of the coating stations 3 and 6 cannot be used, a thin film pattern is formed on one surface of the substrate using the other coating station, and the processing on one surface is performed.
  • the completed substrate is carried out from the carry-out port 17 to the outside of the housing 18.
  • the carry-out port 17 can take out the substrate to the outside of the substrate manufacturing apparatus (outside of the casing 18) from the substrate transport path connecting the coating station 3 and the coating station 6.
  • FIG. 9 shows a schematic diagram of a substrate manufacturing apparatus according to the fourth embodiment.
  • the fourth embodiment is different from the second embodiment in that the ultraviolet irradiation device 8 (FIG. 7) is not included and the inversion station 4 includes the substrate carry-out port 17.
  • the operation during normal operation of the substrate manufacturing apparatus according to the fourth embodiment is equal to that of the second embodiment.
  • the substrate manufacturing apparatus according to the fourth embodiment forms a thin film pattern on only one surface of the substrate, for example, the first surface, as in the third embodiment.
  • the substrate manufacturing apparatus At the time of failure or maintenance of the droplet discharge device of the coating station 6, the substrate manufacturing apparatus according to the fourth embodiment is controlled by the control device 20 as follows.
  • the processing in the alignment station 2, the coating station 3, and the reversing station 4 for the substrates 21 to 24 introduced into the housing 18 is the same as in normal operation.
  • the substrates 21 to 24 on which the main curing of the thin film pattern formed on the first surface and the front and back have been reversed are carried out of the housing 18 from the carry-out port 17. Carrying out may be performed using a conveyor or may be performed manually.
  • the main curing of the thin film pattern formed on the first surface of the substrates 21 to 24 transferred to the reversing station 4 and the reversal of the substrate may be carried out from the carry-out port 17 without performing one or both of them. it can.
  • Example 2 when the droplet discharge device of the coating station 6 cannot be used, the processing for one substrate is completed, and after the substrate is unloaded from the housing 18, another substrate is loaded into the housing 18. did.
  • substrate processing can be performed in parallel at each of the stations 2 to 4. For this reason, even when the droplet discharge device of the coating station 6 cannot be used, high production efficiency can be maintained.
  • the droplet discharge device of the coating station 6 is used, and under the control of the control device 20, a thin film is similarly formed on one side of the substrate, for example, the first surface. Form a pattern.
  • the substrate is conveyed by the conveyor 16 and introduced into the housing 18 from the carry-in / out entrance 7.
  • the substrate introduced into the housing 18 is transported to the alignment station 5 by the lifters 14 and 13, and simple alignment is performed. Thereafter, the substrate is transported to the chuck plate 45 of the droplet discharge device of the coating station 6.
  • the CCD camera 63 to 66 detects the alignment mark on the first surface of the substrate.
  • the control device 20 detects the positions of the substrates 21 to 24 and the posture in the rotation direction based on the detection result, and performs ⁇ correction of the substrate.
  • the control device 20 calculates the size of the substrate, and generates ejection control image data according to the calculated size.
  • a thin film pattern is formed on the first surface of the substrate based on the generated ejection control image data.
  • the substrate on which the thin film pattern is spastic is conveyed to the reversal station 4 by the lifter 13, and the main curing of the thin film pattern formed on the first surface and the reverse of the front and back are performed. After that, the substrate is carried out of the housing 18 from the carry-out port 17 by, for example, a conveyor or a manpower.
  • the reversing station 4 carries out the substrate from the carry-out port 17 without performing one or both of the main curing of the thin film pattern and the inversion of the substrate. May be.
  • the alignment at the alignment station 5 is performed during the period when the thin film pattern is fully cured and the substrate is reversed at the reversing station 4.
  • the thin film material can be applied at the application station 6. For this reason, in Example 2, it is possible to raise production efficiency compared with the case where the droplet discharge apparatus of the coating station 3 cannot be used.
  • the substrate manufacturing apparatus according to the fourth embodiment forms a thin film pattern on one surface of the substrate using the other coating station when one of the droplet discharge devices at the coating stations 3 and 6 cannot be used.
  • a substrate having a spastic thin film pattern on one side is carried out from the carry-out port 17 to the outside of the substrate manufacturing apparatus (outside the housing 18).
  • the substrate manufacturing apparatus according to the fourth embodiment can also continue work when the coating station fails.
  • FIG. 10 shows a schematic diagram of a substrate manufacturing apparatus according to the fifth embodiment.
  • the fifth embodiment is different from the first embodiment in that the alignment station 5, the coating station 6, the ultraviolet irradiation device 9, the lifters 13 and 14, and the conveyor 16 shown in FIG. 1 are not included.
  • the housing 18 does not include the substrate carry-in / out port 7 (FIG. 1). Furthermore, the contents of control by the control device 20 are different from those in the first embodiment.
  • the substrate manufacturing apparatus when the droplet discharge device of the coating station 6 of the substrate manufacturing apparatus according to the first embodiment is not usable, the substrate is processed in the same procedure as that for forming a thin film pattern on both surfaces of the substrate. A thin film pattern is formed on both sides.
  • the substrate 21 is conveyed by the conveyor 15 and introduced into the housing 18 from the carry-in / out entrance 1.
  • the first surface of the substrate 21 faces upward (the positive direction of the Z axis).
  • the substrate 21 is transferred from the conveyor 15 to the alignment station 2 by the lifter 11.
  • the alignment mark formed on the first surface of the substrate 21 is detected. Based on the detection result, ⁇ correction of the substrate 21 is performed. Further, the size of the substrate 21 is calculated based on the image data acquired in the alignment station 2, and ejection control image data is generated according to the calculated size.
  • the substrate 21 subjected to the ⁇ correction is transferred to the coating station 3 by the lifter 11.
  • ⁇ correction is not performed, and a thin film pattern is formed on the first surface of the substrate 21 based on the ejection control image data.
  • the substrate 21 on which the thin film pattern is formed is transferred to the reversing station 4 by the lifter 12.
  • the inversion station 4 the main curing of the thin film pattern formed on the first surface of the substrate 21 and the inversion of the substrate 21 are performed.
  • the inverted substrate 21 is transferred to the alignment station 2 by the lifters 12 and 11.
  • alignment station 2 an alignment mark formed on the second surface of substrate 21 is detected, and ⁇ correction of substrate 21 is performed based on the detection result.
  • the size of the substrate 21 is calculated based on the image data acquired by the CCD cameras 35 to 38, and the ejection control image data of the thin film pattern to be formed on the second surface of the substrate is calculated according to the calculated size. Generated.
  • the detection result of the alignment mark on the first surface of the substrate 21 may be used to generate the image data for ejection control of the thin film pattern formed on the second surface.
  • the imaging result of the alignment mark on the second surface of the substrate 21 is used only for ⁇ correction.
  • the substrate 21 subjected to ⁇ correction is transported to the coating station 3 by the lifter 11.
  • the thin film pattern is applied to the second surface of the substrate 21 based on the discharge control image data of the thin film pattern formed on the second surface of the substrate 21 by the droplet discharge device without performing ⁇ correction.
  • the substrate 21 on which the thin film pattern is formed on the second surface is transported to the conveyor 15 by the lifter 11, and the thin film pattern on the second surface is fully cured by irradiation with ultraviolet rays from the ultraviolet irradiation device 8.
  • the conveyor 15 carries the substrate 21 out of the housing 18 from the carry-in / out entrance 1.
  • the configuration of the substrate manufacturing apparatus according to the fifth embodiment is simpler than that of the substrate manufacturing apparatus according to the first embodiment, and the cost of the apparatus can be reduced.
  • FIG. 11 shows a schematic diagram of a substrate manufacturing apparatus according to the sixth embodiment.
  • the sixth embodiment is different from the second embodiment in that the alignment station 5, the coating station 6, the ultraviolet irradiation device 9, the lifters 13 and 14, and the conveyor 16 shown in FIG. 7 are not included.
  • the housing 18 does not include the substrate carry-in / out port 7. Furthermore, the contents of control by the control device 20 are different from those in the second embodiment.
  • the droplet discharge device of the coating station 6 of the substrate manufacturing apparatus according to the second embodiment when the droplet discharge device of the coating station 6 of the substrate manufacturing apparatus according to the second embodiment is not usable, the same procedure as that for forming a thin film pattern on both surfaces of the substrate is used. Thin film patterns are formed on both sides of the substrate.
  • the substrate 21 is conveyed by the conveyor 15 and introduced into the housing 18 from the carry-in / out entrance 1.
  • the first surface of the substrate 21 faces upward (the positive direction of the Z axis).
  • the substrate 21 introduced into the housing 18 is transported to the alignment station 2 by the lifter 11.
  • Alignment station 2 performs simple alignment of substrate 21. After the alignment, the substrate 21 is transferred to the coating station 3.
  • a thin film pattern is formed on the first surface of the substrate 21.
  • the substrate 21 on which the thin film pattern is formed on the first surface is transported to the inversion station 4 by the lifter 12.
  • the inversion station 4 the main curing of the thin film pattern formed on the first surface of the substrate and the inversion of the substrate are performed.
  • the substrate 21 is transferred to the alignment station 2. After simple alignment is performed at the alignment station 2, the substrate 21 is transported to the coating station 3 again.
  • a thin film pattern is formed on the second surface of the substrate 21.
  • substrate 21 with which the thin film pattern was formed in the 2nd surface is conveyed by the conveyor 15 by the lifter 11, and the main curing of the thin film pattern of the 2nd surface is performed. Thereafter, the substrate 21 is unloaded from the loading / unloading port 1 to the outside of the housing 18.
  • the configuration of the substrate manufacturing apparatus according to the sixth embodiment is simpler than the configuration of the substrate manufacturing apparatus according to the second embodiment, and the cost of the apparatus can be reduced.
  • Example 7 12A to 12E are schematic views of a reversing station of the substrate manufacturing apparatus according to the seventh embodiment.
  • This inversion station can be applied to the inversion station 4 (FIG. 1, FIG. 7 to FIG. 11) of the substrate manufacturing apparatus according to the first to sixth embodiments.
  • a pair of semicircular guides 56 are installed on both sides of the ultraviolet light source 62 that is long in the Y-axis direction.
  • the ultraviolet light source 62 is movable by being guided by guides 56 on both sides.
  • the movement of the ultraviolet light source 62 is controlled by the control device 20.
  • the surface on which the thin film pattern is formed faces the positive direction of the Z axis.
  • the ultraviolet light emitted from the ultraviolet light source 62 is applied to the surface of the substrate 24 on which the thin film pattern is formed.
  • the ultraviolet light source 62 emits diverging ultraviolet light.
  • the control device 20 rotates the substrate 24 at a constant angular velocity with the support member 52 as a rotation axis.
  • the ultraviolet light source 62 is moved along the guide 56 at a constant speed so that the thin film pattern forming surface of the rotating substrate 24 is irradiated with ultraviolet light having a predetermined intensity or more. Irradiation with ultraviolet light ends when the thin film pattern forming surface of the substrate 24 faces the negative direction of the Z-axis, as shown in FIG. 7E.
  • Example 7 the inversion of the substrate and the ultraviolet irradiation can be performed in parallel. For this reason, the processing time in the inversion station 4 can be shortened.
  • Example 8 13A to 13D are schematic views of a reversing station of the substrate manufacturing apparatus according to the eighth embodiment.
  • This inversion station can be applied to the inversion station 4 (FIG. 1, FIG. 7 to FIG. 11) of the substrate manufacturing apparatus according to the first to sixth embodiments.
  • FIG. 1, FIG. 7 to FIG. 11 the inversion station 4 of the substrate manufacturing apparatus according to the first to sixth embodiments.
  • Example 8 shown in FIGS. 13A to 13D the ultraviolet light source 62 emits focused ultraviolet light.
  • a pair of guides 56 are installed at both ends of a support member 61 that is long in the Y-axis direction.
  • An ultraviolet light source 62 that is long in the X-axis direction is supported on one end of the support member 61.
  • the support member 61 is movable by being guided by guides 56 at both ends. The movement of the support member 61 is controlled by the control device 20.
  • the control device 20 rotates the substrate 24 at a constant angular velocity with the support member 52 as a rotation axis.
  • the support member 61 is moved along the guide 56 at a constant speed.
  • the ultraviolet light source 62 is moved along the support member 61 at a constant speed in the Y-axis direction.
  • FIG. 13A shows a state in which the thin film pattern forming surface of the substrate 24 faces in the positive direction of the Z axis.
  • FIG. 13D shows a state where the substrate 24 is gradually rotated and the thin film pattern forming surface of the substrate 24 faces the negative direction of the Z axis. In the state shown in FIG.
  • the ultraviolet light source 62 irradiates ultraviolet light to the positive end of the Y axis of the substrate 24.
  • the ultraviolet light source 62 moves to a position where the ultraviolet light is applied to the negative end of the Y axis of the substrate 24. Irradiation with ultraviolet light starts when the thin film pattern forming surface of the substrate 24 faces the positive direction of the Z axis, and ends when the thin film pattern forming surface of the substrate 24 faces the negative direction of the Z axis. .
  • the processing time in the reversing station 4 can be shortened.
  • the substrate is moved relative to the nozzle unit (moving in the XY plane) only by the stage.
  • the frame 42 (FIG. 3A) is movable in the Y-axis direction
  • the nozzle unit 47a to 47f may be movable on the frame 42 in the X-axis direction and the Z-axis direction. What is necessary is just to move a nozzle unit and a board
  • the configuration in which only the substrate is moved in the XY plane can improve the positional accuracy of the thin film pattern compared to the configuration in which the nozzle unit is also moved in the XY plane direction.
  • the substrate manufacturing apparatus formed the solder resist thin film pattern on the printed wiring board.
  • the substrate manufacturing apparatus in Examples 1 to 8 has other thin film patterns. It can also be applied to formation.
  • the substrate manufacturing apparatus according to the first to eighth embodiments can be used for manufacturing a touch panel that forms an insulating film on a glass substrate.
  • the temporary stage 48 (FIG. 7 and the like) it is not essential to pass the temporary stage before the substrate is transferred to the droplet discharge device.
  • the droplet discharge device of the coating station 6 (FIG. 8) of the second embodiment is out of order or under maintenance, the substrate is transferred from the reversing station 4 to the coating station 3 without going through the alignment station 2. Also good. By omitting the processing by the alignment station 2, an increase in tact time can be suppressed. This also applies to the normal operation of the substrate manufacturing apparatus according to the sixth embodiment.
  • the alignment function may be applied to a lifter or a substrate reversing device.
  • an alignment station may be provided between the coating station 3 (FIGS. 10 and 11) and the reversing station 4 (FIGS. 10 and 11).
  • the substrate is transported to the coating station 3 via an alignment station provided between the coating station 3 and the reversing station 4. By doing so, the tact time can be shortened.
  • each station is arranged linearly, but each station may be installed at a position corresponding to the vertex of a polygon.
  • FIG. 14 is a schematic plan view of the coating station 3 of the substrate manufacturing apparatus according to the ninth embodiment.
  • the coating station 3 includes a first-stage coating station 3 (FIGS. 1, 7 to 11) and a second-stage coating station 6 (FIGS. 1, 7 to 11) of the substrate manufacturing apparatus according to the first to eighth embodiments. It can be applied to FIG. Since the coating station 3 according to the ninth embodiment has a substrate alignment function, when the coating station 3 according to the ninth embodiment is applied to the first to eighth embodiments, the alignment stations 2, 5 ( 1 and 7 to 11) are omitted.
  • the coating station 3 includes a first coating stage 85A and a second coating stage 85B.
  • the first application stage 85A is movable between the first transfer area 80A, the first alignment area 81A, and the application area 82 in the application station 3.
  • the second application stage 85B is movable between the second transfer area 80B, the second alignment area 81B, and the application area 82 in the application station 3.
  • the application region 82 is shared by the first application stage 85A and the second application stage 85B.
  • the lifter 11 can pass above the first and second delivery areas 80A and 80B.
  • the substrate can be delivered from the lifter 11 to the first application stage 85A or vice versa in a state where the first application stage 85A is disposed in the first delivery region 80A.
  • the substrate can be delivered from the lifter 11 to the second coating stage 85B or vice versa with the second coating stage 85B being disposed in the second delivery region 80B.
  • a plurality of imaging devices 83 are arranged in each of the first alignment region 81A and the second alignment region 81B.
  • the alignment mark of the substrate held on the first application stage 85A is imaged by the imaging device 83.
  • ⁇ correction of the substrate held on the second coating stage 85B is performed, and the expansion and contraction amounts in the X direction and the Y direction are set. Can be calculated.
  • nozzle units 47a to 47f are provided in the application region 82.
  • the first coating stage 85A is arranged in the coating region 82, and the substrate is scanned with respect to the nozzle units 47a to 47f, thereby forming a thin film pattern on the upper surface of the substrate held by the first coating stage 85A. be able to.
  • the second coating stage 85B in the coating region 82, a thin film pattern can be formed on the upper surface of the substrate held by the second coating stage 85B.
  • the first application stage 85A and the second application stage 85B are disposed in the first transfer area 80A and the second transfer area 80B, respectively.
  • the lifter 11 (FIG. 14) places the unprocessed substrate 21 on the first coating stage 85A.
  • the first coating stage 85A is moved to the first alignment region 81A.
  • the alignment mark formed on the upper surface of the substrate 21 is imaged by the imaging device 83 (FIG. 14). Based on the imaging result, ⁇ correction of the substrate 21 is performed, and ejection control image data for forming a thin film pattern is generated.
  • the first coating stage 85A is moved to the coating region 82, and the thin film material is coated on the substrate 21.
  • the lifter 11 places the substrate 22 to be processed next on the second coating stage 85B.
  • the second coating stage 85B is moved to the second alignment region 81B.
  • the imaging device 83 (FIG. 14) images the alignment mark formed on the upper surface of the substrate 22 held on the second coating stage 85B. Based on the imaging result, ⁇ correction of the substrate 22 is performed, and ejection control image data is generated.
  • the thin film material coating process is continuously performed on the substrate 21 held on the first coating stage 85A.
  • the first application stage 85A is moved from the application area 82 to the first delivery area 80A.
  • the second coating stage 85B is moved from the second alignment region 81B to the coating region 82.
  • a thin film material is applied to the upper surface of the substrate 22 held by the second application stage 85B.
  • the lifter 12 (FIG. 1) unloads the substrate 21 held by the first coating stage 85A from the coating station 3.
  • the lifter 11 places the substrate 23 to be processed next on the first coating stage 85A.
  • the coating process of the thin film material on the upper surface of the substrate 22 held by the second coating stage 85B is continued.
  • the first coating stage 85A is moved to the first alignment region 81A.
  • the alignment mark formed on the upper surface of the substrate 23 is imaged.
  • ⁇ correction of the substrate 23 is performed and ejection control image data is generated.
  • the coating process of the thin film material on the upper surface of the substrate 22 held by the second coating stage 85B is continued.
  • the second application stage 85B is moved to the second delivery area 80B, and the substrate 22 is unloaded from the application station 3.
  • the first application stage 85A is moved to the application region 82, and the substrate to be processed next is placed on the second application stage 85B. Thereafter, the processing is repeatedly executed from FIG. 15D to FIG.
  • ⁇ correction and ejection control image data for the substrate to be processed next. are generated in parallel. For this reason, processing time can be shortened.
  • FIGS. 1 and 7 to 11 are schematic views of the reversing station 4 of the substrate manufacturing apparatus according to the tenth embodiment.
  • the reversing station 4 of the tenth embodiment is applied to the reversing station 4 (FIGS. 1 and 7 to 11) of the substrate manufacturing apparatus of the first to ninth embodiments.
  • a roller conveyor 90 is provided in the reversing station 4. From the upstream end to the downstream end of the roller conveyor 90, a carry-in part 4A, a main curing part 4B, a reversing part 4C, and a carry-out part 4D are defined.
  • the substrate 21 coated with the thin film material at the coating station 2 (FIGS. 1, 7 to 11) is placed on the carry-in portion 4A of the roller conveyor 90 by the lifter 12 (FIGS. 1, 7 to 11). .
  • the first surface 21A coated with the thin film material faces upward, and the opposite second surface 21B contacts the roller conveyor 90.
  • a main curing light source 91 is disposed above the roller conveyor 90 of the main curing unit 4B.
  • the main curing light source 91 irradiates the upper surface of the substrate 21 passing through the roller conveyor 90 with ultraviolet rays.
  • the roller conveyor 90 includes a first roller 90A that supports the substrate 21 from below and a second roller 90B that contacts the upper surface of the substrate 21.
  • first roller 90A that supports the substrate 21 from below
  • second roller 90B that contacts the upper surface of the substrate 21.
  • the substrate 21 transported to the unloading section 4D of the roller conveyor 90 is unloaded from the reversing station 4 by the lifter 13 (FIGS. 1, 7 to 9), and the second-stage coating station 6 (FIGS. 1, 7 to 9). 9) and the like.
  • the substrate 21 placed on the roller conveyor 90 of the carry-in unit 4A passes through the main curing unit 4B and is conveyed toward the reversing unit 4B.
  • the control device 20 includes a storage device 20 b that stores the feed rate of the substrate 21.
  • the feed rate stored in the storage device 20b is set so that the light energy density applied to the first surface 21A of the substrate 21 is large enough to fully cure the thin film material.
  • the light irradiation time may be stored in the storage device 20b. In this case, the control device 20 calculates the feeding speed of the substrate 21 from the irradiation time stored in the storage device 20b.
  • the substrate 21 is conveyed to the roller conveyor 90 of the reversing unit 4C.
  • the first roller 90A, the second roller 90B, and the substrate 21 are rotated about a straight line parallel to the transport direction. Rotate 180 °.
  • FIG. 16D shows a side view of the first roller 90A, the second roller 90B, and the substrate 21 rotated by 90 °.
  • the first surface 21A of the substrate 21 is facing forward.
  • FIG. 16E shows a side view of the first roller 90A, the second roller 90B, and the substrate 21 rotated by 90 °.
  • the vertical relationship between the first roller 90A and the second roller 90B is reversed, and the second surface 21B of the substrate 21 faces upward.
  • the substrate 21 with the front and back sides reversed is transported to the unloading unit 4 ⁇ / b> D of the roller conveyor 90.
  • Example 10 it is also possible to perform main curing and substrate inversion using a roller conveyor 90.
  • FIG. 17 is a schematic view of a substrate manufacturing apparatus according to the eleventh embodiment.
  • a plurality of substrates are accumulated in the substrate stocker 93.
  • the coating station 3 a thin film pattern having a predetermined planar shape is formed on the substrate.
  • the thin film pattern formed at the coating station 3 is in a temporarily cured state, and is not actually cured.
  • the inversion station 4 includes a main curing unit 4B and an inversion unit 4C.
  • the main curing part 4B the thin film material applied to the substrate is finally cured.
  • the front and back sides of the substrate are inverted.
  • a main curing station 94 is arranged in addition to the main curing unit 4B.
  • the main curing station 94 also performs the main curing of the thin film material applied to the substrate.
  • the transport apparatus 100 transports the substrate between the main curing unit 4B and the reversing unit 4C of the substrate stocker 93, the main curing station 94, the coating station 3, and the reversing station 4.
  • a roller conveyor, a lifter that sucks and holds the upper surface of the substrate, a robot arm that supports the substrate from below, and the like are used.
  • the transport device 100 and the devices in each station are controlled by the control device 20.
  • the movement path of the substrate when the substrate is processed is indicated by a curve with an arrow.
  • the unprocessed substrate accumulated in the substrate stocker 93 is transported to the coating station 3 by the transport device 100.
  • a thin film pattern is formed on the first surface, which is one surface of the substrate, at the coating station 3.
  • the substrate on which the thin film pattern is formed is transported to the main curing unit 4B of the reversing station 4 by the transport device 100. In the main curing part 4B, the thin film pattern is finally cured. Thereafter, the substrate is inverted at the inversion station 4C.
  • the inverted substrate is transported to the coating station 3 by the transport device 100.
  • a thin film pattern is formed on the second surface opposite to the first surface of the substrate.
  • the substrate on which the thin film pattern is formed on the second surface is transported to the main curing station 94 by the transport device 100.
  • the main curing station 94 performs main curing on the thin film pattern formed on the second surface of the substrate. After the thin film pattern on the second surface is fully cured, the substrate is transported to the substrate stocker 93 by the transport device 100. Next, a method for forming a thin film pattern on a substrate will be described in more detail with reference to FIGS. 18A to 18G.
  • the configuration of the carry-in unit 4A, the main curing unit 4B, and the reversing unit 4C of the reversing station 4 illustrated in FIG. 18A has the same configuration as that of the substrate manufacturing apparatus according to the tenth embodiment illustrated in FIG.
  • the substrate 21 is transported to the coating station 3 from the substrate stocker 93 (FIG. 17).
  • a thin film pattern is formed on the first surface 21 ⁇ / b> A of the substrate 21 at the coating station 3.
  • substrate 21 in which the thin film pattern was formed is carried in to the carrying-in part 4A of the inversion station 4 by the conveying apparatus 100 (FIG. 17).
  • the first surface 21A on which the thin film pattern is formed faces upward.
  • the substrate 21 is conveyed to the reversing unit 4C via the main curing unit 4B.
  • the roller conveyor 90 functions as a transport device 100 (FIG. 17) that transports the substrate 21 from the coating station 3 to the main curing unit 4B and from the main curing unit 4B to the reversing unit 4C.
  • the thin film pattern formed on the first surface 21A of the substrate 21 is cured by irradiation with ultraviolet light when passing under the main curing light source 91 in the main curing unit 4B.
  • the substrate 21 is sandwiched between the first roller 90A and the second roller 90B of the reversing station 4C.
  • the first roller 90A and the second roller 90B are turned upside down.
  • the second surface 21B of the substrate 21 faces upward.
  • the roller conveyor 90 is driven to transport the substrate 21 to the carry-in section 4A. At this time, no processing is performed in the main curing unit 4B, and the substrate 21 simply passes through the main curing unit 4B.
  • the transport apparatus 100 transports the substrate 21 from the reversing station 4 to the coating station 3.
  • a thin film pattern is formed on the second surface 21 ⁇ / b> B of the substrate 21 at the coating station 3.
  • the transport apparatus 100 transports the substrate 21 from the coating station 3 to the main curing station 94.
  • the thin film pattern formed on the second surface 21B of the substrate 21 is irradiated with ultraviolet rays from the main curing light source 92. Thereby, the thin film pattern formed on the second surface 21B is fully cured.
  • substrate 21 by which the thin film pattern of the 2nd surface was fully hardened is conveyed to the board
  • Example 11 after the thin film pattern is formed on the second surface 21B of the substrate 21 in the step shown in FIG. 18F, the main curing of the thin film pattern is performed at the main curing station 94 without returning the substrate 21 to the inversion station 4. It can be performed.
  • the coating station 3 is used when the substrate is transported leftward in FIG. 17, that is, when a thin film pattern is formed on the first surface, and when the substrate is transported rightward, It is used both when a thin film pattern is formed on the second surface.
  • a path in which the substrate is conveyed leftward is referred to as “outward path”, and a path in which the substrate is conveyed rightward is referred to as “return path”.
  • the coating station 3 is preferably the coating station 3 according to Example 9 shown in FIG.
  • the coating station 3 according to the ninth embodiment includes a first coating stage 85A (FIG. 14) and a second coating stage 85B (FIG. 14).
  • the first application stage 85A can be used on the forward path
  • the second application stage 85B can be applied on the return path.
  • the substrate transported in the forward path and the substrate transported in the backward path can pass each other in the coating station 3. Thereby, before the substrate carried out from the substrate stocker 93 returns to the substrate stocker 93 via the forward path and the backward path, the substrate to be processed next can be sent to the forward path.
  • FIG. 19A shows a schematic view of a substrate manufacturing apparatus according to the twelfth embodiment.
  • the substrate manufacturing apparatus according to the twelfth embodiment includes a substrate stocker 93, a coating station 3, an inversion station 4, and a temporary storage device 95.
  • the reversing station 4 has the same configuration as the reversing station 4 (FIG. 18A) of the eleventh embodiment, and includes a main curing unit 4B and a reversing unit 4C.
  • the transport device 100 transports the substrate among the substrate stocker 93, the coating station 3, the main curing unit 4B of the reversing station 4, the reversing unit 4C of the reversing station 4, and the temporary storage device 95.
  • the transport device 100 and the devices in each station are controlled by the control device 20.
  • FIG. 19B shows a schematic side view of the temporary storage device 95.
  • the temporary storage device 95 has a table on which a substrate is placed. A plurality of substrates 21 are stacked on this table. The substrate carried into the temporary storage device 95 by the transport device 100 is placed on the top of the substrate already stored. Further, the transport device 100 holds the uppermost substrate among the substrates 21 stacked on the temporary storage device 95 and carries it out of the temporary storage device 95.
  • FIGS. 20A to 20E a substrate processing method by the substrate manufacturing apparatus according to the twelfth embodiment will be described.
  • the substrates 21 to be processed are accumulated in the substrate stocker 93, and no substrates are accumulated in the temporary accumulation device 95.
  • the substrates 21 accumulated in the substrate stocker 93 are stacked with the first surface facing upward.
  • the transport apparatus 100 takes out the substrates accumulated in the substrate stocker 93 one by one, and sets the coating station 3, the main curing unit 4B of the reversing station 4, and the reversing unit 4C of the reversing station 4. And then transported to the temporary storage device 95.
  • a path for transporting from the substrate stocker 93 to the temporary storage device 95 is referred to as an “outward path”.
  • a thin film pattern is formed on the first surface of the substrate 21 at the coating station 3.
  • the main curing part 4B the thin film pattern formed on the first surface of the substrate 21 is fully cured.
  • the front and back of the substrate are reversed so that the second surface of the substrate 21 faces upward.
  • the substrates 21 are stacked such that the second surface faces upward.
  • FIG. 20C shows a state in which all the substrates 21 stored in the substrate stocker 93 are carried out and temporarily stored in the temporary storage device 95.
  • the transport apparatus 100 unloads the substrates 21 stored in the temporary storage device 95 one by one, and passes through the main curing unit 4B of the coating station 3 and the reversing station 4 so as to transfer the substrate stocker 93.
  • a path for transporting from the temporary storage device 95 to the substrate stocker 93 is referred to as a “return path”.
  • a thin film pattern is formed on the second surface of the substrate 21 at the coating station 3. In the main curing part 4B, the thin film pattern formed on the second surface is fully cured.
  • all the substrates 21 temporarily stored in the temporary storage device 95 are transferred to the substrate stocker 93.
  • a thin film pattern is formed on both sides of the substrate 21 accumulated in the substrate stocker 93.
  • Example 12 there is no difference between the substrate transported in the forward path shown in FIG. 20B and the substrate transported in the return path shown in FIG. 20D. For this reason, the substrate to be processed next can be sent out from the substrate stocker 93 to the outward path during a period in which one substrate is transported in the outward path.
  • FIG. 21 shows a schematic view of a substrate manufacturing apparatus according to the thirteenth embodiment. Unprocessed substrates are accumulated in the substrate stocker 93 on the carry-in side.
  • the transport apparatus 100 includes a first-stage coating station 3, a main curing unit 4B of the reversing station 4, a reversing unit 4C of the reversing station 4, an intermediate stocker 98, a second-stage coating station 6, a main curing station 96, and a delivery side.
  • the substrate is transported between the substrate stockers 97.
  • the coating stations 3 and 6 for example, the coating station according to the ninth embodiment shown in FIG. 14 is employed.
  • the reversing station 4 employs a reversing station according to the tenth embodiment shown in FIG. 16A.
  • the main curing station 96 includes, for example, the roller conveyor 16 and the ultraviolet irradiation device 8 of the substrate manufacturing apparatus according to the first embodiment.
  • the transport device 100 and the devices in each station are controlled by the control device 20.
  • the transport device 100 and the devices in each station are controlled by the control device 20.
  • the control device 20 includes a storage device 20c.
  • the storage device 20c stores the presence / absence of a failure in the first-stage coating station 3 and the second-stage coating station 6. If the coating stations 3 and 6 have not failed, the substrate accumulated in the substrate stocker 93 is transferred to the main curing unit 4B of the first-stage coating station 3, the reversing station 4 and the reversing station 4 by the transport device 100. It is conveyed to the substrate stocker 97 on the carry-out side via the reversing unit 4C, the second stage coating station 6, and the main curing station 96. Thereby, a thin film pattern is formed on both surfaces of the substrate. The intermediate stocker 98 is not used.
  • the intermediate stocker 98 is disposed between the reversing station 4 and the second-stage coating station 6.
  • the intermediate stocker 98 can store a plurality of substrates. Further, the substrate stored in the intermediate stocker 98 can be carried out of the substrate manufacturing apparatus. Conversely, it is also possible to carry a substrate into the intermediate stocker 98 from the outside of the substrate manufacturing apparatus.
  • FIG. 22A, 22B, and 22C show first, second, and third examples of substrate paths when the second-stage coating station 6 is broken, respectively.
  • the substrate is carried into the second-stage coating station 6 and the main curing station 96, but is carried out without any processing.
  • the substrate unloaded from the reversing station 4 is directly transferred to the unloading substrate stocker 97 without passing through the second coating station 6 and the main curing station 96.
  • the substrate that has been subjected to the reversal process in the reversing station 4 is transported to the intermediate stocker 98 by the transport device 100. The processed substrate is taken out from the intermediate stocker 98.
  • FIG. 23A, FIG. 23B, and FIG. 23C show first, second, and third examples of substrate paths when the first-stage coating station 3 is broken, respectively.
  • the substrate is carried into the first-stage coating station 3 and reversing station 4, but is carried out without any processing.
  • the substrate unloaded from the loading-side substrate stocker 93 directly passes through the second-stage coating station 6 without passing through the first-stage coating station 3 and the reversing station 4. It is conveyed to.
  • the substrate stocker 93 on the carry-in side is not used, and an unprocessed substrate is prepared in the intermediate stocker 98. The unprocessed substrate is transported from the intermediate stocker 98 to the second stage coating station 6.
  • a thin film pattern can be formed on one side of the substrate even when one of the coating stations 3 and 6 is out of order.
  • Example 14 A substrate manufacturing apparatus according to Embodiment 14 will be described with reference to FIGS. 24A to 24D. Hereinafter, differences from the thirteenth embodiment will be described, and description of the same configuration will be omitted.
  • moving stockers 99A and 99B are arranged in place of the carry-in substrate stocker 93 and the intermediate stocker 98 (FIG. 21) of the thirteenth embodiment.
  • the movement stockers 99A and 99B can be removed from the conveyance path of the conveyance apparatus 100 and moved.
  • FIG. 24A to FIG. 24D show the flow of substrate processing when the second stage coating station 6 is out of order.
  • a plurality of unprocessed substrates are accumulated in the loading stocker 99A.
  • the substrate is not accumulated in the other moving stocker 99B.
  • the moving stockers 99A and 99B are arranged at the positions of the carry-in substrate stocker 93 and the intermediate stocker 98 in FIG.
  • the transport apparatus 100 transports the substrate from the moving stocker 99A to the other moving stocker 99B via the first-stage coating station 3 and reversing station 4. Thereby, a thin film pattern is formed on the first surface of the substrate.
  • the moving stockers 99A and 99B are removed from the transfer path of the transfer apparatus 100 as shown in FIG.
  • the empty stocker 99A is disposed at the position of the intermediate stocker 98 (FIG. 21), and the mobile stocker 99B storing the substrate with the thin film pattern formed on one side is loaded.
  • the substrate stocker 93 (FIG. 21) is disposed. Movement of the movement stockers 99A and 99B may be performed manually, or the movement stockers 99A and 99B may have an automatic operation function.
  • the substrate is transported from the moving stocker 99B to the other moving stocker 99A via the coating station 3 and the main curing unit 4B of the reversing station 4. Thereby, a thin film pattern is formed on the second surface of the substrate.
  • the reversing station 4 according to the tenth embodiment shown in FIG. 16A is adopted as the reversing station 4, the substrate passes through the reversing unit 4C, but the reversing operation is not performed.
  • Example 14 a thin film pattern can be formed on both sides only by transporting the substrate in one direction by the transport device 100.
  • the intermediate stocker 98 and the unloading substrate stocker 97 shown in FIG. 21 may be replaced with moving stockers 99A and 99B, respectively.
  • FIG. 25 shows a schematic diagram of a substrate manufacturing apparatus according to the fifteenth embodiment.
  • the intermediate stocker 98 and the main curing station 96 shown in FIG. 21 are not arranged. That is, one main curing unit 4B is arranged for the two coating stations 3 and 6.
  • the substrate flow from the carry-in substrate stocker 93 to the second-stage coating station 6 is the same as that in Example 13 shown in FIG.
  • the substrate on which the thin film pattern is formed on the second surface at the second-stage coating station 6 is returned to the main curing unit 4B of the reversing station 4 by the transport device 100.
  • the main curing unit 4B the thin film pattern on the second surface of the substrate is finally cured. Thereafter, the substrate is transported from the main curing unit 4B to the substrate stocker 97 for unloading.
  • one main curing unit 4B uses the first surface and You may make it perform main hardening of the thin film pattern of a 2nd surface.
  • FIG. 26 shows an example of a planar layout of each station of the substrate manufacturing apparatus according to a modification of the fifteenth embodiment.
  • a substrate stocker 93 for carrying in, a first-stage coating station 3, a main curing unit 4B, a reversing unit 4C, a second-stage coating station 6, and a carrying-out substrate stocker 97 are arranged in a circle.
  • a transport device 100 is disposed at the center of this circumference.
  • a rotary extendable arm can be used for the transport device 100.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Selon l'invention, dans une première station de revêtement, une surface d'un substrat est revêtue d'une matière de couche mince liquide, la matière de couche mince appliquée en revêtement sur le substrat est irradiée par de la lumière, et la section de couche de surface de la matière de couche mince durcit. Le substrat revêtu de la matière de couche mince dans la première station de revêtement est transporté dans une station d'inversion. Dans la station d'inversion, la matière de couche mince appliquée en revêtement sur le substrat est irradiée par de la lumière et durcit à travers l'intérieur de la matière de couche mince, et l'orientation avant/arrière du substrat est inversée. Un dispositif de transport transporte le substrat entre la première station de revêtement et la station d'inversion. Un dispositif de commande commande la première station de revêtement, la station d'inversion et le dispositif de transport. Le dispositif de commande commande le dispositif de transport, et transporte le substrat traité dans la première station de revêtement vers la station d'inversion.
PCT/JP2012/068118 2011-07-27 2012-07-17 Dispositif et procédé de production de substrat WO2013015157A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201280037448.XA CN103718661A (zh) 2011-07-27 2012-07-17 基板制造装置及基板制造方法
JP2013525675A JP5714110B2 (ja) 2011-07-27 2012-07-17 基板製造装置及び基板製造方法
KR1020167009136A KR20160044587A (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법
KR1020187008021A KR102061315B1 (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법
KR1020147000800A KR20140024953A (ko) 2011-07-27 2012-07-17 기판제조장치 및 기판제조방법

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JP2011164874 2011-07-27
JP2011-164874 2011-07-27
JP2011-175170 2011-08-10
JP2011175170 2011-08-10

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KR (3) KR20140024953A (fr)
CN (2) CN103718661A (fr)
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JP2015150469A (ja) * 2014-02-12 2015-08-24 矢崎総業株式会社 プライマ塗布方法及びプライマ塗布装置
JP2017037989A (ja) * 2015-08-11 2017-02-16 東京応化工業株式会社 レジストパターン形成装置およびレジストパターン形成方法
CN108027689A (zh) * 2015-09-30 2018-05-11 住友金属矿山株式会社 有机皮膜的制造方法、导电性基板的制造方法、有机皮膜制造装置
EP4088939A1 (fr) * 2021-05-11 2022-11-16 Applied Materials, Inc. Plateforme à jet d'encre pour la fabrication de films et structures optiques

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CN105188277B (zh) * 2015-09-21 2017-12-08 迅得机械（东莞）有限公司 一种板件自动翻转插框装置
JP6652426B2 (ja) * 2016-03-29 2020-02-26 東レエンジニアリング株式会社 連続塗布装置及び連続塗布方法
JP6723648B2 (ja) * 2016-07-27 2020-07-15 住友重機械工業株式会社 位置検出装置及び位置検出方法
CN106067436A (zh) * 2016-08-01 2016-11-02 江苏宇天港玻新材料有限公司 一种基于同步带传送的基片材料输送装置
KR101954917B1 (ko) * 2018-09-12 2019-03-06 (주)에이피텍 카메라 모듈 제작용 양면 트레이를 이용한 카메라 모듈 양면 디스펜싱 시스템
KR102205125B1 (ko) * 2019-09-17 2021-01-19 연세대학교 산학협력단 베젤리스 표시 장치의 배선 인쇄 장치 및 표시 장치

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JP2014160745A (ja) * 2013-02-20 2014-09-04 Sumitomo Heavy Ind Ltd 基板製造装置
JP2015150469A (ja) * 2014-02-12 2015-08-24 矢崎総業株式会社 プライマ塗布方法及びプライマ塗布装置
JP2017037989A (ja) * 2015-08-11 2017-02-16 東京応化工業株式会社 レジストパターン形成装置およびレジストパターン形成方法
CN108027689A (zh) * 2015-09-30 2018-05-11 住友金属矿山株式会社 有机皮膜的制造方法、导电性基板的制造方法、有机皮膜制造装置
CN108027689B (zh) * 2015-09-30 2021-03-23 住友金属矿山株式会社 有机皮膜的制造方法、导电性基板的制造方法、有机皮膜制造装置
EP4088939A1 (fr) * 2021-05-11 2022-11-16 Applied Materials, Inc. Plateforme à jet d'encre pour la fabrication de films et structures optiques
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CN110099513B (zh) 2022-02-18
TWI458408B (zh) 2014-10-21
CN103718661A (zh) 2014-04-09
TW201322853A (zh) 2013-06-01
JPWO2013015157A1 (ja) 2015-02-23
JP5714110B2 (ja) 2015-05-07
KR20140024953A (ko) 2014-03-03
CN110099513A (zh) 2019-08-06
KR102061315B1 (ko) 2019-12-31
KR20180033598A (ko) 2018-04-03
KR20160044587A (ko) 2016-04-25

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