WO2012165291A1 - 炭化ケイ素－炭素複合材の製造方法 - Google Patents

炭化ケイ素－炭素複合材の製造方法 Download PDF

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WO2012165291A1
WO2012165291A1 PCT/JP2012/063316 JP2012063316W WO2012165291A1 WO 2012165291 A1 WO2012165291 A1 WO 2012165291A1 JP 2012063316 W JP2012063316 W JP 2012063316W WO 2012165291 A1 WO2012165291 A1 WO 2012165291A1
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Prior art keywords
silicon carbide
composite material
carbon composite
producing
silicon nitride
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PCT/JP2012/063316
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English (en)
French (fr)
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衛武 陳
宮本　欽生
東城　哲朗
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東洋炭素株式会社
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Priority to CN201280025810.1A priority Critical patent/CN103582621B/zh
Priority to US14/119,194 priority patent/US9045375B2/en
Priority to KR1020137031027A priority patent/KR20140038426A/ko
Priority to EP12794133.4A priority patent/EP2716617A4/en
Publication of WO2012165291A1 publication Critical patent/WO2012165291A1/ja

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    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient

Definitions

  • the present invention relates to a method for producing a silicon carbide-carbon composite material.
  • Patent Document 1 discloses a method of producing a carbon substrate coated with silicon carbide by reacting a carbon substrate with SiO 2 gas.
  • Patent Document 2 discloses a method for producing a composite material of silicon carbide and carbon by mixing carbon and silicon carbide, followed by firing.
  • the present invention has been made in view of such a point, and an object thereof is to provide a novel method for producing a silicon carbide-carbon composite material.
  • the method for producing a silicon carbide-carbon composite of the present invention includes a step of firing a molded body containing silicon nitride and a carbonaceous material. Silicon nitride is preferably attached to the surface of the carbonaceous material.
  • silicon nitride, a carbonaceous material, and a binder are mixed to obtain a mixture containing a carbonaceous material having silicon nitride attached to the surface, and the mixture is molded and molded. It is preferable to obtain a body.
  • a molded body can be obtained by a gel casting method.
  • particulate silicon nitride may be used.
  • the particle diameter of silicon nitride is preferably in the range of 1/100 to 1/5 of the particle diameter of the carbonaceous material.
  • a molded body having a volume ratio of silicon nitride to carbonaceous material of 5:95 to 50:50.
  • the compact is fired at 1700 ° C. or higher.
  • the method for producing a silicon carbide-carbon composite of the present invention is for producing a silicon carbide-carbon composite having silicon carbide covering a plurality of carbonaceous materials and connecting the plurality of carbonaceous materials. Is the method.
  • a novel method for producing a silicon carbide-carbon composite material can be provided.
  • FIG. 1 is a schematic cross-sectional view of a silicon carbide-carbon composite material obtained by a manufacturing method according to an embodiment of the present invention.
  • 2 is a scanning electron micrograph ((a) surface (b) fracture surface) of the silicon carbide-graphite composite material obtained in Example 1.
  • FIG. 3 is a scanning electron micrograph ((a) surface (b) fracture surface) of the silicon carbide-graphite composite material obtained in Example 2.
  • FIG. 4 is a scanning electron micrograph ((a) surface (b) fracture surface) of the silicon carbide-graphite composite material obtained in Example 3.
  • FIG. 5 is a scanning electron micrograph ((a) surface (b) fracture surface) of the silicon carbide-graphite composite material obtained in Example 4.
  • FIG. 1 is a schematic cross-sectional view of a silicon carbide-carbon composite material obtained by a manufacturing method according to an embodiment of the present invention.
  • 2 is a scanning electron micrograph ((a) surface (b) fracture surface) of the silicon carbide-graph
  • FIG. 6 is a scanning electron micrograph ((a) surface (b) fracture surface) of the silicon carbide-graphite composite material obtained in Example 5.
  • FIG. 7 is a scanning electron micrograph of the surface of the silicon carbide-graphite composite material obtained in Comparative Example 1.
  • FIG. 8 is a scanning electron micrograph of the surface of the silicon carbide-graphite composite material obtained in Comparative Example 2.
  • FIG. 1 is a schematic cross-sectional view showing a silicon carbide-carbon composite material obtained by the manufacturing method according to the present embodiment. First, the structure of the silicon carbide-carbon composite material obtained by the manufacturing method according to this embodiment will be described with reference to FIG.
  • the silicon carbide-carbon composite material 1 is a composite material composed of a plurality of carbonaceous materials 2 and silicon carbide 3.
  • the carbonaceous material for example, natural graphite made of phosphorous graphite, flake graphite, earthy graphite or the like, artificial graphite made of coke or mesophase microspheres, etc. are preferably used.
  • the carbonaceous material may be particulate. That is, the carbonaceous material 2 may be carbon particles.
  • the particle size of the carbonaceous material 2 is preferably about 50 nm to 500 ⁇ m, more preferably about 1 ⁇ m to 250 ⁇ m, and still more preferably about 5 ⁇ m to 100 ⁇ m. If the particle size of the carbonaceous material 2 is too small, it may aggregate. If the carbonaceous material 2 is agglomerated too much, the silicon carbide-carbon composite material 1 may not obtain carbon characteristics.
  • the plurality of carbonaceous materials 2 may include only one type of carbonaceous material 2 or may include a plurality of types of carbonaceous material 2.
  • Silicon carbide 3 is formed between a plurality of carbonaceous materials 2.
  • the silicon carbide 3 covers the plurality of carbonaceous materials 2 and connects the plurality of carbonaceous materials 2.
  • Silicon carbide 3 preferably has a continuous structure. More preferably, silicon carbide 3 has a three-dimensional network structure. That is, the plurality of carbonaceous materials 2 are preferably integrated by silicon carbide 3 having a three-dimensional network structure.
  • the carbon particles 2 are preferably dispersed in the silicon carbide 3.
  • the carbon particles 2 may be dispersed in the silicon carbide 3 as a lump.
  • the silicon carbide 3 may be comprised by one continuous lump, and may be comprised by the isolated several lump.
  • the volume ratio of the carbonaceous material 2 and silicon carbide 3 in the silicon carbide-carbon composite material 1 is preferably 95: 5 to 50:50, and 90 : 10 to 70:30 is more preferable.
  • the thickness of silicon carbide 3 is preferably about 100 nm to 10 ⁇ m.
  • the silicon carbide-carbon composite material 1 may contain a compound derived from a sintering aid.
  • a sintering aid include yttrium oxide such as Y 2 O 3 , aluminum oxide such as Al 2 O 3, calcium oxide such as CaO, silicon oxide such as SiO 2 , and other rare earth oxides.
  • a molded body including the carbonaceous material 2 having silicon nitride attached to the surface is produced.
  • the shape of silicon nitride attached to the surface of the carbonaceous material 2 is not particularly limited.
  • a particle form, a film form, etc. are mentioned.
  • the particle size of silicon nitride is preferably about 50 nm to 10 ⁇ m, and more preferably about 100 nm to 1 ⁇ m.
  • the particle diameter of silicon nitride is preferably in the range of 1/100 to 1/5 of the particle diameter of the carbonaceous material 2. In this case, substantially the entire surface of the carbonaceous material 2 can be covered with silicon nitride.
  • the particle size of silicon nitride is more preferably in the range of 1/50 to 1/10, and even more preferably in the range of 1/40 to 1/20 of the particle size of the carbonaceous material 2.
  • the mixing ratio of silicon nitride and carbonaceous material 2 (volume of silicon nitride: volume (volume ratio) of carbonaceous material 2) is preferably 5:95 to 50:50, and 10:90 to 30:70. It is more preferable that
  • the method for attaching silicon nitride to the surface of the carbonaceous material 2 is not particularly limited.
  • the carbonaceous material 2 and silicon nitride may be mixed.
  • Specific examples include a mechanical mixing method in which silicon nitride and the carbonaceous material 2 are mixed using a gas phase method, a liquid phase method, a mixer, or the like, a slurry method, or a method in which these are combined.
  • Specific examples of the vapor phase method include a chemical vapor deposition method (CVD method) and a conversion method (CVR method).
  • Specific examples of the liquid phase method include a chemical precipitation method.
  • Specific examples of the slurry method include, for example, a gel cast method and a slip method. Examples include casting and tape casting.
  • the method for molding the carbonaceous material 2 having silicon nitride adhered to the surface is not particularly limited.
  • the gel cast method it is possible to simultaneously attach and form silicon nitride to the surface of the carbonaceous material 2.
  • a liquid solvent and a binder are mixed to form a slurry, and a carbonaceous material is added to the slurry, mixed, and then dried to obtain a solid mixture.
  • a slurry is prepared by adding a carbon powder and a silicon nitride powder to an isopropanol organic solvent to which acryamide and N, N′-methylenebisacrylamide are added as a binder, and stirring with a rotating / revolving mixer, and the slurry is made into a mold. It is put and dried to obtain a molded body.
  • the molded body is fired.
  • the firing method include a discharge plasma sintering method.
  • the firing temperature and firing time of the molded body, the type of firing atmosphere, the pressure of the firing atmosphere, and the like can be appropriately set according to the type, shape, size, and the like of the material used.
  • the firing temperature may be 1700 ° C. or higher, for example.
  • the firing temperature is preferably about 1700 ° C. to 2100 ° C., more preferably about 1800 ° C. to 2000 ° C.
  • the firing time can be, for example, about 5 minutes to 2 hours.
  • the kind of baking atmosphere can be made into inert gas atmosphere, such as a vacuum, nitrogen, argon, for example.
  • the pressure of the firing atmosphere can be, for example, about 0.01 MPa to 10 MPa.
  • silicon carbide 3 is formed on the surface of the carbonaceous material 2. At this time, the silicon carbide 3 is formed between the plurality of carbonaceous materials 2. That is, in the firing step, the plurality of carbonaceous materials 2 are covered with silicon carbide 3 and connected by silicon carbide 3. Note that silicon nitride may remain in the silicon carbide-carbon composite material 1.
  • the silicon carbide-carbon composite material 1 obtained by the manufacturing method of the present embodiment is superior in terms of strength, thermal conductivity and the like as compared with the silicon carbide-carbon composite material obtained using silicon carbide as a raw material. This is because it is easier to form silicon carbide 3 on the surface of the carbonaceous material 2 at a lower temperature in the firing process and to facilitate the sintering of silicon carbide than to use silicon carbide as a raw material. It may be caused by In other words, when silicon carbide is used as a raw material, the driving force of sintering depends only on the reduction of the particle surface energy, but when silicon nitride is used as a raw material, the chemical reaction that converts silicon nitride to silicon carbide sinters.
  • silicon carbide-carbon composite 1 increases as the sintering progresses, and the strength and thermal conductivity improve as the continuity of silicon carbide 3 increases. That is, in the manufacturing method of this embodiment, since silicon nitride is used as a raw material, it is considered that the silicon carbide-carbon composite material 1 excellent in terms of strength, thermal conductivity and the like can be obtained.
  • the silicon carbide-carbon composite material 1 can be easily manufactured at a lower temperature without using silicon carbide as a raw material.
  • Example 1 A silicon carbide-carbon composite material having a configuration substantially similar to that of the silicon carbide-carbon composite material 1 was produced as follows.
  • carbonaceous material 2 graphite (mesophase globules, manufactured by Toyo Tanso Co., Ltd.) was used.
  • silicon nitride Si 3 N 4 manufactured by Ube Industries, Ltd. was used.
  • the volume ratio of graphite to ceramics in the mixture was 80:20.
  • the obtained mixture was dried at 80 ° C. for 12 hours under normal pressure to obtain a dried product. Next, the dried product was heated in vacuum at 700 ° C. for 1 hour to remove acrylamide as a binder.
  • pulsed current sintering was performed under a vacuum condition at 1700 ° C. for 5 minutes while applying a pressure of 30 MPa by a discharge plasma sintering method.
  • a silicon carbide-graphite composite material was obtained as the silicon carbide-carbon composite material.
  • the bulk density, relative density, bending strength and thermal conductivity of the obtained silicon carbide-graphite composite material were measured as follows. The results are shown in Table 1 below.
  • the bending strength was measured by a three-point bending strength test. Specifically, it was measured based on JIS A1509-4.
  • Thermal conductivity was measured by a laser flash method. Specifically, it was measured based on JIS R1650-3.
  • FIG. 2 shows a scanning electron micrograph ((a) surface (b) fractured surface) of the silicon carbide-graphite composite material obtained in Example 1 (magnification 1000 times).
  • Example 2 A silicon carbide-graphite composite was obtained in the same manner as in Example 1 except that the pulse current sintering was performed at 1750 ° C. The bulk density, relative density, bending strength and thermal conductivity of the obtained silicon carbide-graphite composite material were measured in the same manner as in Example 1. The results are shown in Table 1 below. A scanning electron micrograph ((a) surface (b) fracture surface) of the silicon carbide-graphite composite material obtained in Example 2 is shown in FIG. 3 (magnification 1000 times).
  • Example 3 A silicon carbide-graphite composite material was obtained in the same manner as in Example 1 except that the pulse current sintering was performed at 1800 ° C. The bulk density, relative density, bending strength and thermal conductivity of the obtained silicon carbide-graphite composite material were measured in the same manner as in Example 1. The results are shown in Table 1 below. A scanning electron micrograph ((a) surface (b) fractured surface) of the silicon carbide-graphite composite material obtained in Example 3 is shown in FIG. 4 (magnification 1000 times).
  • Example 4 A silicon carbide-graphite composite was obtained in the same manner as in Example 1 except that the pulse current sintering was performed at 1900 ° C. The bulk density, relative density, bending strength and thermal conductivity of the obtained silicon carbide-graphite composite material were measured in the same manner as in Example 1. The results are shown in Table 1 below. A scanning electron micrograph ((a) surface (b) fractured surface) of the silicon carbide-graphite composite material obtained in Example 4 is shown in FIG. 5 (magnification 1000 times).
  • Example 5 Powder mixed with graphite (10 g), silicon nitride (5.96 g), Al 2 O 3 (0.39 g) and Y 2 O 3 (0.20 g) as sintering aids, and acrylamide as the organic monomer
  • graphite 10 g
  • silicon nitride 5.96 g
  • Al 2 O 3 0.39 g
  • Y 2 O 3 0.20 g
  • acrylamide as the organic monomer
  • a silicon carbide-graphite composite material was obtained in the same manner as in Example 4 except that 1-propanol (3.83 g) containing was mixed by the gel casting method.
  • the volume ratio of graphite to ceramics in the mixture was 80:20.
  • a scanning electron micrograph ((a) surface (b) fractured surface) of the silicon carbide-graphite composite material obtained in Example 5 is shown in FIG. 6 ((a) is 500 times magnification and (b) is 1000 magnification. Times).
  • the bulk density, relative density, bending strength and thermal conductivity of the obtained silicon carbide-graphite composite were measured in the same manner as in Example 1. The results are shown in Table 1 below.
  • a scanning electron micrograph of the surface of the silicon carbide-graphite composite obtained in Comparative Example 1 is shown in FIG. 7 (magnification 1000 times).
  • the bulk density, relative density, bending strength and thermal conductivity of the obtained silicon carbide-graphite composite were measured in the same manner as in Example 1. The results are shown in Table 1 below.
  • a scanning electron micrograph of the surface of the silicon carbide-graphite composite material obtained in Comparative Example 2 is shown in FIG. 8 (magnification 1000 times).

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Abstract

　新規な炭化ケイ素－炭素複合材の製造方法を提供する。　窒化ケイ素が表面に付着した炭素質材料２を含む成形体を焼成することにより炭化ケイ素－炭素複合材１を製造する。

Description

炭化ケイ素－炭素複合材の製造方法
　本発明は、炭化ケイ素－炭素複合材の製造方法に関する。
　従来、黒鉛などの炭素と炭化ケイ素とを複合化した炭化ケイ素－炭素複合材が知られている。例えば特許文献１には、炭素基材とＳｉＯ２ガスとを反応させて、炭化ケイ素で被覆された炭素基材を製造する方法が開示されている。また、特許文献２には、炭素と炭化ケイ素とを混合後、焼成して、炭化ケイ素と炭素との複合材を製造する方法が開示されている。
特開２０１１－５１８６６号公報 特開２０１１－５１８６７号公報
　炭化ケイ素－炭素複合材のさらなる有力な製造方法が求められている。
　本発明は、斯かる点に鑑みてなされたものであり、その目的は、新規な炭化ケイ素－炭素複合材の製造方法を提供することにある。
　本発明の炭化ケイ素－炭素複合材の製造方法は、窒化ケイ素と炭素質材料を含む成形体を焼成する工程を備える。炭素質材料の表面には窒化ケイ素が付着していることが好ましい。
　本発明の炭化ケイ素－炭素複合材の製造方法においては、窒化ケイ素と炭素質材料とバインダーとを混合し、窒化ケイ素が表面に付着した炭素質材料を含む混合物を得、混合物を成形して成形体を得ることが好ましい。
　本発明の炭化ケイ素－炭素複合材の製造方法においては、ゲルキャスティング法により成形体を得ることができる。
　本発明の炭化ケイ素－炭素複合材の製造方法においては、粒子状の窒化ケイ素を用いてもよい。
　窒化ケイ素の粒子径は、炭素質材料の粒子径の１／１００～１／５の範囲内であることが好ましい。
　本発明の炭化ケイ素－炭素複合材の製造方法においては、窒化ケイ素と炭素質材料との体積比が５：９５～５０：５０である成形体を用いることが好ましい。
　本発明の炭化ケイ素－炭素複合材の製造方法においては、成形体の焼成を１７００℃以上で行うことが好ましい。
　本発明の炭化ケイ素－炭素複合材の製造方法は、複数の炭素質材料を覆っており、かつ複数の炭素質材料を接続している炭化ケイ素を有する炭化ケイ素－炭素複合材を製造するための方法である。
　本発明によれば、新規な炭化ケイ素－炭素複合材の製造方法を提供することができる。
図１は、本発明の一実施形態に係る製造方法によって得られる炭化ケイ素－炭素複合材の略図的断面図である。 図２は、実施例１で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）である。 図３は、実施例２で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）である。 図４は、実施例３で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）である。 図５は、実施例４で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）である。 図６は、実施例５で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）である。 図７は、比較例１で得られた炭化ケイ素－黒鉛複合材表面の走査型電子顕微鏡写真である。 図８は、比較例２で得られた炭化ケイ素－黒鉛複合材表面の走査型電子顕微鏡写真である。
　以下、本発明を実施した好ましい形態の一例について説明する。但し、下記の実施形態は、単なる例示である。本発明は、下記の実施形態に何ら限定されない。
　実施形態等において参照する図面は、模式的に記載されたものであり、図面に描画された物体の寸法の比率などは、現実の物体の寸法の比率などとは異なる場合がある。具体的な物体の寸法比率等は、以下の説明を参酌して判断されるべきである。
　（炭化ケイ素－炭素複合材１）
　図１は、本実施形態に係る製造方法によって得られる炭化ケイ素－炭素複合材を示す略図的断面図である。まず、図１を参照しながら、本実施形態に係る製造方法によって得られる炭化ケイ素－炭素複合材の構成について説明する。
　炭化ケイ素－炭素複合材１は、複数の炭素質材料２と、炭化ケイ素３とからなる複合材である。
　炭素質材料２は、例えばりん状黒鉛、りん片状黒鉛、土状黒鉛等からなる天然黒鉛、コークスやメソフェーズ小球体を原料とした人造黒鉛などが好ましく用いられる。炭素質材料は、粒子状であってもよい。すなわち、炭素質材料２は、炭素粒子であってもよい。炭素質材料２の粒子径は、５０ｎｍ～５００μｍ程度であることが好ましく、１μｍ～２５０μｍ程度であることがより好ましく、５μｍ～１００μｍ程度であることがさらに好ましい。炭素質材料２の粒子径が小さすぎると、凝集してしまう可能性ある。炭素質材料２が凝集しすぎると、炭化ケイ素－炭素複合材１が炭素の特性を得られない場合がある。一方、炭素質材料２の粒子径が大きすぎると、焼成したセラミックス―炭素複合材の強度が低下する場合がある。複数の炭素質材料２は、１種類の炭素質材料２のみを含んでいてもよいし、複数種類の炭素質材料２を含んでいてもよい。 
　炭化ケイ素３は、複数の炭素質材料２の間に形成されている。炭化ケイ素３は、複数の炭素質材料２を覆っており、かつ複数の炭素質材料２を接続している。炭化ケイ素３は、連続した構造を有していることが好ましい。炭化ケイ素３は、３次元網目構造を有していることがより好ましい。すなわち、複数の炭素質材料２は、３次元網目構造を有する炭化ケイ素３によって一体化されていることが好ましい。炭化ケイ素－炭素複合材１において、炭化ケイ素３中に炭素粒子２が分散していることが好ましい。炭化ケイ素３中に炭素粒子２が塊状となって分散していてもよい。
　なお、炭化ケイ素３は、連続したひとつの塊により構成されていてもよいし、孤立した複数の塊により構成されていてもよい。
　炭化ケイ素－炭素複合材１における炭素質材料２と炭化ケイ素３との体積比（炭素質材料２の体積：炭化ケイ素３の体積）は、９５：５～５０：５０であることが好ましく、９０：１０～７０：３０であることがより好ましい。
　炭化ケイ素３の厚みは、１００ｎｍ～１０μｍ程度であることが好ましい。
　炭化ケイ素－炭素複合材１は、焼結助剤由来の化合物を含んでいてもよい。焼結助剤としては、Ｙ２Ｏ３などの酸化イットリウム、Ａｌ２Ｏ３等の酸化アルミニウム、ＣａＯなどの酸化カルシウム、ＳｉＯ２などの酸化ケイ素、その他の希土類酸化物などが挙げられる。
　次に、炭化ケイ素－炭素複合材１の製造方法の一例を説明する。
　（成形体作製工程）
　窒化ケイ素が表面に付着した炭素質材料２を含む成形体を作製する。
　炭素質材料２の表面に付着させる窒化ケイ素の形状は、特に限定されない。例えば粒子状、被膜状などが挙げられる。
　窒化ケイ素が粒子状である場合、窒化ケイ素の粒子径は、５０ｎｍ～１０μｍ程度であることが好ましく、１００ｎｍ～１μｍ程度であることがより好ましい。
　窒化ケイ素の粒子径は、炭素質材料２の粒子径の１／１００～１／５の範囲内であることが好ましい。この場合、炭素質材料２の表面の実質的に全体を窒化ケイ素で覆うことが可能となる。窒化ケイ素の粒子径は、炭素質材料２の粒子径の１／５０～１／１０の範囲内であることがより好ましく、１／４０～１／２０の範囲内であることがさらに好ましい。
　窒化ケイ素と炭素質材料２との混合割合（窒化ケイ素の体積：炭素質材料２の体積（体積比））は、５：９５～５０：５０であることが好ましく、１０：９０～３０：７０であることがより好ましい。
　炭素質材料２の表面に窒化ケイ素を付着させる方法は、特に限定されない。例えば、炭素質材料２と窒化ケイ素とを混合すればよい。具体例としては、気相法、液相法、ミキサー等を用いて窒化ケイ素と炭素質材料２とを混合する機械的混合方法、スラリー法またはこれらを組み合わせた方法が挙げられる。気相法の具体例としては、化学気相蒸着法（ＣＶＤ法）、転化法（ＣＶＲ法）などが挙げられる。液相法の具体例としては、例えば、化学沈殿法等が挙げられる。スラリー法の具体例としては、例えばゲルキャスト法、スリッ 
プキャスティング、テープキャスティングなどが挙げられる。
　窒化ケイ素が表面に付着した炭素質材料２を成形する方法は、特に限定されない。例えばゲルキャスト法によれば、炭素質材料２の表面への窒化ケイ素の付着と成形とを同時に行うことができる。ゲルキャスト法では、液体である溶媒及びバインダーを混合してスラリーとし、このスラリー中に炭素質材料を添加し、混合した後、乾燥させて固形混合物が得られる。例えば、バインダーとしてアクリアミドとＮ，Ｎ’－メチレンビスアクリルアミドを加えたイソプロパノール有機溶媒に炭素粉末と窒化ケイ素粉末を加え、自転・公転ミキサーで撹拌することで、スラリーを調製し、そのスラリーを型に入れ乾燥させ、成形体を得る。
　（焼成工程）
　次に、成形体を焼成する。焼成方法としては、例えば、放電プラズマ焼結法などが挙げられる。
　成形体の焼成温度や焼成時間、焼成雰囲気の種類、焼成雰囲気の圧力等は、使用する材料の種類、形状、大きさ等に応じて適宜設定することができる。焼成温度は、例えば１７００℃以上とすればよい。焼成温度は、１７００℃～２１００℃程度であることが好ましく、１８００℃～２０００℃程度であることがより好ましい。焼成時間は、例えば、５分間～２時間程度とすることができる。焼成雰囲気の種類は、例えば、真空、窒素、アルゴンなどの不活性ガス雰囲気とすることができる。焼成雰囲気の圧力は、例えば、０．０１ＭＰａ～１０ＭＰａ程度とすることができる。
　焼成工程において、炭素質材料２の表面に炭化ケイ素３が形成される。このとき、炭化ケイ素３は、複数の炭素質材料２の間に形成される。すなわち、焼成工程において、複数の炭素質材料２は、炭化ケイ素３により覆われ、かつ炭化ケイ素３により接続される。なお、炭化ケイ素－炭素複合材１には、窒化ケイ素が残っていてもよい。
　本実施形態の製造方法によって得られる炭化ケイ素－炭素複合材１は、炭化ケイ素を原料として得られる炭化ケイ素－炭素複合材に比して、強度、熱伝導度などの点で優れている。これは、原料として炭化ケイ素を用いるよりも、窒化ケイ素を用いる方が、焼成工程において、炭素質材料２の表面にて炭化ケイ素３をより低温で形成しやすく、炭化ケイ素の焼結が進みやすくなることに起因するのではないかと考えられる。すなわち、炭化ケイ素を原料にした場合、焼結の駆動力は粒子表面エネルギーの減少に依存するしかないが、窒化ケイ素を原料にした場合は、窒化ケイ素から炭化ケイ素に転換する化学反応が焼結をさらに促進するものと考えられる。焼結が進むほど、炭化ケイ素－炭素複合材１における炭化ケイ素３の連続性は高まり、炭化ケイ素３の連続性が高くなるほど、強度や熱伝導度は向上すると考えられる。すなわち、本実施形態の製造方法では、窒化ケイ素を原料として用いているため、強度、熱伝導度などの点で優れた炭化ケイ素－炭素複合材１が得られるものと考えられる。
　本実施形態に係る製造方法によれば、原料として炭化ケイ素を使用しなくても、より低温で炭化ケイ素－炭素複合材１を簡易に製造することができる。
　以下、本発明について、具体的な実施例に基づいて、さらに詳細に説明する。本発明は、以下の実施例に何ら限定されるものではない。本発明の要旨を変更しない範囲において適宜変更して実施することが可能である。
　（実施例１）
　以下のようにして炭化ケイ素－炭素複合材１と実質的に同様の構成を有する炭化ケイ素－炭素複合材を作製した。
　炭素質材料２として黒鉛（メソフェーズ小球体、東洋炭素株式会社製）を使用した。窒化ケイ素として、宇部興産株式会社製のＳｉ３Ｎ４を使用した。
　黒鉛（１０ｇ）と、窒化ケイ素（４．６３ｇ）と焼結助剤としてのＡｌ２Ｏ３（０．３１ｇ）及びＹ２Ｏ３（０．１５ｇ）とを混合した粉末と、アクリルアミド（８ｇ）及びＮ，Ｎ’－メチレンビスアクリルアミド（１ｇ）をイソプロパノール（４５ｇ）に溶解したバインダー溶液（３．５７ｇ）とをゲルキャスティング法により混合し、混合物をプラスティックモールドにキャスティングした。混合物中の黒鉛とセラミックスとの体積比は８０：２０であった。得られた混合物を常圧下、８０℃で１２時間乾燥して乾燥物を得た。次に、乾燥物を真空中、７００℃で１時間加熱してバインダーであるアクリルアミドを除去した。さらに、放電プラズマ焼結法にて、３０ＭＰａの圧力を印加しつつ、１７００℃で５分間、真空条件でパルス通電焼結した。その結果、炭化ケイ素－炭素複合材として、炭化ケイ素－黒鉛複合材が得られた。
　得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を下記の要領で測定した。結果を下記の表１に示す。
　〔かさ密度〕
　アルキメデス法により、かさ密度を測定した。具体的には、ＪＩＳ　Ａ１５０９－３に基づき測定した。
　〔相対密度〕
　上記の方法で測定したかさ密度と、同じサンプルの理論密度(気孔のない状態おける密度)との比により相対密度を計算した（ＪＩＳ　Ｚ２５００－３４０７を参照）。
　〔曲げ強度〕
　３点曲げ強度試験により、曲げ強度を測定した。具体的には、ＪＩＳ　Ａ１５０９－４に基づき測定した。
　〔熱伝導率〕
　レーザーフラッシュ法により、熱伝導率を測定した。具体的には、ＪＩＳ　Ｒ１６５０－３に基づき測定した。
　実施例１で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）を図２に示す（倍率１０００倍）。
　（実施例２）
　１７５０℃でパルス通電焼結したこと以外は、実施例１と同様にして、炭化ケイ素－黒鉛複合材を得た。得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を実施例１と同様にして測定した。結果を下記の表１に示す。実施例２で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）を図３に示す（倍率１０００倍）。
　（実施例３）
　１８００℃でパルス通電焼結したこと以外は、実施例１と同様にして、炭化ケイ素－黒鉛複合材を得た。得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を実施例１と同様にして測定した。結果を下記の表１に示す。実施例３で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）を図４に示す（倍率１０００倍）。
　（実施例４）
　１９００℃でパルス通電焼結したこと以外は、実施例１と同様にして、炭化ケイ素－黒鉛複合材を得た。得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を実施例１と同様にして測定した。結果を下記の表１に示す。実施例４で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）を図５に示す（倍率１０００倍）。
　（実施例５）
　黒鉛（１０ｇ）と、窒化ケイ素（５．９６ｇ）と焼結助剤としてのＡｌ２Ｏ３（０．３９ｇ）及びＹ２Ｏ３（０．２０ｇ）とを混合した粉末と、有機モノマーとしてアクリルアミドを含んだ１－プロパノール（３．８３ｇ）とをゲルキャスティング法により混合したこと以外は、実施例４と同様にして、炭化ケイ素－黒鉛複合材を得た。混合物中の黒鉛とセラミックスとの体積比は８０：２０であった。
　得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を実施例１と同様にして測定した。結果を下記の表１に示す。
　実施例５で得られた炭化ケイ素－黒鉛複合材の走査型電子顕微鏡写真（（ａ）表面（ｂ）破断面）を図６に示す（（ａ）が倍率５００倍、（ｂ）が倍率１０００倍）。
　（比較例１）
　黒鉛（１０ｇ）と、炭化ケイ素（ＳｉＣ　４．５０ｇ）と焼結助剤としてのＡｌ２Ｏ３（０．３０ｇ）及びＹ２Ｏ３（０．１５ｇ）とを混合した粉末と、アクリルアミド（８ｇ）及びＮ，Ｎ’－メチレンビスアクリルアミド（１ｇ）をイソプロパノール（４５ｇ）に溶解したバインダー溶液（３．０３ｇ）とをゲルキャスティング法により混合したこと以外は、実施例４と同様にして、炭化ケイ素－黒鉛複合材を得た。混合物中の黒鉛とセラミックスとの体積比は７５：２５であった。
　得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を実施例１と同様にして測定した。結果を下記の表１に示す。比較例１で得られた炭化ケイ素－黒鉛複合材表面の走査型電子顕微鏡写真を図７に示す（倍率１０００倍）。
　（比較例２）
　黒鉛（１０ｇ）と、炭化ケイ素（ＳｉＣ　５．９６ｇ）と焼結助剤としてのＡｌ２Ｏ３（０．３９ｇ）及びＹ２Ｏ３（０．２０ｇ）とを混合した粉末と、有機モノマーとしてアクリルアミドを含んだ１－プロパノール（３．２４ｇ）とをゲルキャスティング法により混合したこと以外は、実施例４と同様にして、炭化ケイ素－黒鉛複合材を得た。混合物中の黒鉛とセラミックスとの体積比は７０：３０であった。
　得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を実施例１と同様にして測定した。結果を下記の表１に示す。比較例２で得られた炭化ケイ素－黒鉛複合材表面の走査型電子顕微鏡写真を図８に示す（倍率１０００倍）。
　（比較例３）
　黒鉛（１０ｇ）と、窒化アルミニウム（ＡｌＮ　３．５４ｇ）と焼結助剤としてのＹ２Ｏ３（０．１９ｇ）とを混合した粉末と、アクリルアミド（８ｇ）及びＮ，Ｎ’－メチレンビスアクリルアミド（１ｇ）をイソプロパノール（４５ｇ）に溶解したバインダー溶液（２．４９ｇ）とをゲルキャスティング法により混合したこと以外は、実施例４と同様に 
して、炭化ケイ素－黒鉛複合材を得た。混合物中の黒鉛とセラミックスとの体積比は７０：３０であった。
　得られた炭化ケイ素－黒鉛複合材のかさ密度、相対密度、曲げ強度及び熱伝導率を実施例１と同様にして測定した。結果を下記の表１に示す。
Figure JPOXMLDOC01-appb-T000001
１…炭化ケイ素－炭素複合材
２…炭素質材料
３…炭化ケイ素
 

Claims (8)

  1. 　炭化ケイ素－炭素複合材の製造方法であって、
    　窒化ケイ素と炭素質材料とを含む成形体を焼成することにより、炭化ケイ素－炭素複合材を得る、炭化ケイ素－炭素複合材の製造方法。
  2. 　前記成形体における前記炭素質材料の表面には前記窒化ケイ素が付着している請求項１に記載の炭化ケイ素－炭素複合材の製造方法。
  3. 　前記窒化ケイ素と前記炭素質材料とバインダーとを混合し、前記窒化ケイ素が表面に付着した前記炭素質材料を含む混合物を得、前記混合物を成形することにより前記成形体を得る請求項１または２に記載の炭化ケイ素－炭素複合材の製造方法。
  4. 　粒子状の前記窒化ケイ素を用いる請求項１～３のいずれか一項に記載の炭化ケイ素－炭素複合材の製造方法。
  5. 　前記窒化ケイ素の粒子径は、前記炭素質材料の粒子径の１／１００～１／５の範囲内である請求項４に記載の炭化ケイ素－炭素複合材の製造方法。
  6. 　前記窒化ケイ素と炭素質材料との体積比が５：９５～５０：５０である成形体を用いる請求項１～５のいずれか一項に記載の炭化ケイ素－炭素複合材の製造方法。
  7. 　前記成形体の焼成を１７００℃以上で行う請求項１～６のいずれか一項に記載の炭化ケイ素－炭素複合材の製造方法。
  8. 　前記複数の炭素質材料を覆っており、かつ前記複数の炭素質材料を接続している炭化ケイ素を有する炭化ケイ素－炭素複合材を製造するための請求項１～７のいずれか一項に記載の炭化ケイ素－炭素複合材の製造方法。
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