WO2012157194A1 - ファイバ転送レーザ光学系 - Google Patents
ファイバ転送レーザ光学系 Download PDFInfo
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- WO2012157194A1 WO2012157194A1 PCT/JP2012/002896 JP2012002896W WO2012157194A1 WO 2012157194 A1 WO2012157194 A1 WO 2012157194A1 JP 2012002896 W JP2012002896 W JP 2012002896W WO 2012157194 A1 WO2012157194 A1 WO 2012157194A1
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- optical fiber
- laser
- laser light
- lens
- optical
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/30—Collimators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
- G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
- G02B6/0006—Coupling light into the fibre
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/3808—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H10P14/381—Beam shaping, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
- H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
- H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
Definitions
- the present invention relates to a fiber transfer laser optical system that transfers laser light output from an oscillator through a fiber and forms it into a line beam, and is suitable for use in annealing of thin film silicon.
- the laser light emitted from the first optical fiber is condensed into a multipoint spot by the array lens, the light is incident on the second optical fiber, and the emission ends thereof are arranged in a line.
- the core diameter of the first optical fiber can be increased to reduce the damage, and a line beam having a large dimensional ratio with respect to the longitudinal direction can be obtained.
- the dimension of the line beam in the short direction can be freely set.
- the laser light emitted from the plurality of second optical fibers can be formed into a line beam having a uniform intensity distribution in the longitudinal direction and the lateral direction on the irradiation surface.
- the fiber transfer laser optical system can be applied to a laser annealing apparatus. According to this, it is possible to realize a high-throughput annealing process with a linear laser beam having a small dimension in the short direction (high energy density) and a large dimension in the longitudinal direction.
- a spherical array lens 5 is disposed on the exit side of the collimating lens 4.
- the spherical array lens 5 is a matrix in which cells 5a made of spherical lenses exhibiting a square in plan view are continuously arranged along the X-axis and Y-axis directions orthogonal to each other on the plane to form a plurality of columns in both the X-axis direction and the Y-axis direction. It is arranged in a shape.
- the spherical array lens 5 is composed of nine cells 5a arranged in three rows each in the X-axis direction and the Y-axis direction. The parallel light incident on the spherical array lens 5 is collected by each cell 5a to form a plurality of (here, nine) spots.
- the number of second optical fibers 6 having a smaller core diameter than the first optical fiber 3 is a number corresponding to the number of spots formed by the spherical array lens 5 (in this embodiment, , Square 3 rows 3 columns, a total of 9).
- the incident end 6a of the second optical fiber 6 is located at the formation position of each spot, that is, at the focal point of the array lens. That is, the incident end 6a of the second optical fiber 6 is arranged at the center of each cell 5a in plan view.
- the incident end 6a of the second optical fiber 6 is arranged so that its axis is parallel to the optical axis.
- parallel to the optical axis means not parallel to the center of the actual light beam passing through each cell 5a but parallel to the rotational symmetry axis of each cell 5a (referred to herein as the optical axis).
- the laser light collected by each cell 5 a enters the second optical fiber 6 from the incident end 6 a arranged at the spot position, and propagates through the second optical fiber 6.
- Each of the second optical fibers 6 is arranged so as to be gently curved, and its emission end 6b obtains a linear laser beam on the irradiation surface 12, so that the Y-axis as shown in FIG. Are arranged in a straight line parallel to the. Further, the emission ends 6b of the second optical fibers 6 are arranged so that their axes are parallel to each other, and are arranged at equal intervals in this embodiment.
- the laser light emitted from the second optical fiber 6 has an elliptical cross section by a cylindrical lens 7 for collimating in the longitudinal direction (Y-axis direction) and a cylindrical lens 8 for collimating in the short direction (X-axis direction). Collimated to parallel light of shape.
- the irradiation surface from the cylindrical lens 11 is irradiated. If the distance up to 12 is set to an appropriate value, the dimension C in the short direction of the laser light irradiated on the irradiation surface 12 can be selected by changing N within a range satisfying N ⁇ 1. In addition, the dimension C can be made smaller than A without causing energy loss.
- the light intensity distribution as shown in FIG. 4A shows the light intensity distribution in the short direction (X-axis direction) of the laser light
- FIG. 4B shows the light intensity distribution in the longitudinal direction (Y-axis direction) of the laser light.
- a substantially uniform light intensity distribution over the dimension C in the short direction and a substantially uniform light intensity distribution over the dimension M in the longitudinal direction. Can be obtained on the irradiation surface 12.
- the fiber transfer laser optical system 1 capable of irradiating the irradiation surface 12 with such a laser beam is suitable as an apparatus for annealing a thin film silicon.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Laser Beam Processing (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
D4/D5=(A×B)/(L×K)
を満たす構成とすることができる。
D4/D5=(A×B)/(L×K) ・・・(1)
第2の光ファイバ6のコア径およびNAがこのような設定とされることにより、第1の光ファイバ3から出射されたレーザ光がエネルギロスを生じさせることなく第2の光ファイバ6に入射することとなる。
2 レーザ発振器
3 第1の光ファイバ
4 コリメートレンズ
5 球面アレイレンズ
5a セル
6 第2の光ファイバ
6a 入射端
6b 出射端
7 シリンドリカルレンズ(第1のシリンドリカルレンズ)
8 シリンドリカルレンズ(第2のシリンドリカルレンズ)
9 シリンドリカルアレイレンズ
10 シリンドリカルレンズ(第3のシリンドリカルレンズ)
11 シリンドリカルレンズ(第4のシリンドリカルレンズ)
12 照射面
A 第1の光ファイバ3のコア径
B 第1の光ファイバ3のNA
L 第2の光ファイバ6のコア径
K 第2の光ファイバ6のNA
N 照射面12にレーザ光を集光するレンズの短手方向のNA
C 照射面12におけるレーザ光の短手方向の寸法
M 照射面12におけるレーザ光の長手方向の寸法
D4 コリメートレンズ4のビーム径
D5 球面アレイレンズ5のセル5aに外接する円の径
Claims (4)
- レーザ発振器より出力されたレーザ光を伝送する第1の光ファイバと、当該第1の光ファイバより出射されたレーザ光をコリメートするコリメートレンズと、当該コリメートレンズより出射されたレーザ光を複数のセルによって多点スポットに集光するアレイレンズと、前記第1の光ファイバよりも小さなコア径を有し、前記アレイレンズにより多点スポットに集光された各レーザ光を入射させ、且つ出射端がその軸線を互いに平行にして直線状の一列に配列された複数の第2の光ファイバと、当該複数の第2の光ファイバより出射されたレーザ光を照射面で直線状をなすレーザ光に成形する線形化光学系とを備えることを特徴とするファイバ転送レーザ光学系。
- 前記第1の光ファイバのコア径をAとし、前記照射面にレーザ光を集光する集光レンズの短手方向のNAをNとし、前記照射面におけるレーザ光の短手方向の寸法をCとしたとき、N<1を満足する限りにおいてC<Aを満たすことを特徴とする請求項1に記載のファイバ転送レーザ光学系。
- 前記第1の光ファイバのコア径をAとし、前記第1の光ファイバのNAをBとし、前記第2の光ファイバのコア径をLとし、前記第2の光ファイバのNAをKとし、前記コリメートレンズのビーム径をD4とし、前記アレイレンズの前記セルに外接する円の径をD5としたとき、
D4/D5=(A×B)/(L×K)
を満たすことを特徴とする、請求項1または請求項2に記載のファイバ転送レーザ光学系。 - 前記線形化光学系は、
前記第2の光ファイバより出射されたレーザ光を前記第2の光ファイバの配列方向について屈折させる第1のシリンドリカルレンズと、
前記第2の光ファイバより出射されたレーザ光を前記第2の光ファイバの配列方向と直交する方向について屈折させる第2のシリンドリカルレンズと、
前記第1のシリンドリカルレンズおよび前記第2のシリンドリカルレンズから出射されたレーザ光を前記第2の光ファイバの配列方向について屈折させるシリンドリカルアレイレンズと、
前記シリンドリカルアレイレンズから出射されたレーザ光を、前記シリンドリカルアレイレンズに対してケーラー照明の原理を利用して前記第2の光ファイバの配列方向について屈折させる第3のシリンドリカルレンズと、
前記シリンドリカルアレイレンズから出射されたレーザ光を、前記第2のシリンドリカルレンズに対して結像関係を利用して前記第2の光ファイバの配列方向と直交する方向について屈折させる第4のシリンドリカルレンズと
を含むことを特徴とする、請求項1から請求項3のいずれか一項に記載のファイバ転送レーザ光学系。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201280001616.XA CN102959685B (zh) | 2011-05-18 | 2012-04-27 | 纤维传送激光光学系统 |
| DE112012000019.6T DE112012000019B4 (de) | 2011-05-18 | 2012-04-27 | Glasfaserübertragung verwendendes Laseroptiksystem |
| KR1020127031835A KR101322346B1 (ko) | 2011-05-18 | 2012-04-27 | 파이버 전송 레이저 광학계 |
| SG2012095923A SG186846A1 (en) | 2011-05-18 | 2012-04-27 | Fiber forwarding laser optical system |
| US13/702,342 US8662761B2 (en) | 2011-05-18 | 2012-04-27 | Laser optical system using optical fiber transmission |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-111396 | 2011-05-18 | ||
| JP2011111396A JP5148730B2 (ja) | 2011-05-18 | 2011-05-18 | ファイバ転送レーザ光学系 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012157194A1 true WO2012157194A1 (ja) | 2012-11-22 |
Family
ID=47176548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2012/002896 Ceased WO2012157194A1 (ja) | 2011-05-18 | 2012-04-27 | ファイバ転送レーザ光学系 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8662761B2 (ja) |
| JP (1) | JP5148730B2 (ja) |
| KR (1) | KR101322346B1 (ja) |
| CN (1) | CN102959685B (ja) |
| DE (1) | DE112012000019B4 (ja) |
| SG (1) | SG186846A1 (ja) |
| TW (1) | TWI414386B (ja) |
| WO (1) | WO2012157194A1 (ja) |
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| CN106094219A (zh) * | 2016-07-18 | 2016-11-09 | 柳州好顺科技有限公司 | 一种电子设备的光学显示电路 |
| CN109581676A (zh) * | 2017-09-29 | 2019-04-05 | 武汉资联虹康科技股份有限公司 | 一种激光均匀分散的发射光纤 |
| US11579384B2 (en) | 2019-02-25 | 2023-02-14 | Nichia Corporation | Light source device, direct diode laser system, and optical coupling device |
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| US10537965B2 (en) * | 2013-12-13 | 2020-01-21 | Applied Materials, Inc. | Fiber array line generator |
| US9343307B2 (en) | 2013-12-24 | 2016-05-17 | Ultratech, Inc. | Laser spike annealing using fiber lasers |
| DE102014200633B3 (de) * | 2014-01-15 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche |
| JP6743021B2 (ja) | 2014-12-31 | 2020-08-19 | ドルビー ラボラトリーズ ライセンシング コーポレイション | 画像プロジェクタ用の個別レーザファイバ入力 |
| CN105108331A (zh) * | 2015-07-28 | 2015-12-02 | 上海信耀电子有限公司 | 一种整形导光管及激光焊接工艺 |
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| JP5084137B2 (ja) * | 2004-12-06 | 2012-11-28 | 株式会社半導体エネルギー研究所 | レーザ照射装置及びレーザ照射方法、並びに半導体装置の作製方法 |
| JP5132119B2 (ja) * | 2005-10-26 | 2013-01-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4667270B2 (ja) | 2006-02-27 | 2011-04-06 | キヤノン株式会社 | 円筒状電子写真感光体用支持体の切削方法 |
| WO2008123609A1 (ja) * | 2007-04-04 | 2008-10-16 | Mitsubishi Electric Corporation | レーザ加工装置及びレーザ加工方法 |
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- 2011-05-18 JP JP2011111396A patent/JP5148730B2/ja active Active
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2012
- 2012-04-27 KR KR1020127031835A patent/KR101322346B1/ko not_active Expired - Fee Related
- 2012-04-27 SG SG2012095923A patent/SG186846A1/en unknown
- 2012-04-27 WO PCT/JP2012/002896 patent/WO2012157194A1/ja not_active Ceased
- 2012-04-27 DE DE112012000019.6T patent/DE112012000019B4/de not_active Expired - Fee Related
- 2012-04-27 CN CN201280001616.XA patent/CN102959685B/zh active Active
- 2012-04-27 US US13/702,342 patent/US8662761B2/en not_active Expired - Fee Related
- 2012-05-04 TW TW101116011A patent/TWI414386B/zh not_active IP Right Cessation
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| JP2006278491A (ja) * | 2005-03-28 | 2006-10-12 | Sony Corp | 照射装置 |
| JP2007266146A (ja) * | 2006-03-27 | 2007-10-11 | Omron Laserfront Inc | レーザアニーリング装置 |
| JP2008147428A (ja) * | 2006-12-11 | 2008-06-26 | Sumitomo Heavy Ind Ltd | レーザ照射装置、及び、レーザ照射方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106094219A (zh) * | 2016-07-18 | 2016-11-09 | 柳州好顺科技有限公司 | 一种电子设备的光学显示电路 |
| CN109581676A (zh) * | 2017-09-29 | 2019-04-05 | 武汉资联虹康科技股份有限公司 | 一种激光均匀分散的发射光纤 |
| US11579384B2 (en) | 2019-02-25 | 2023-02-14 | Nichia Corporation | Light source device, direct diode laser system, and optical coupling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5148730B2 (ja) | 2013-02-20 |
| CN102959685B (zh) | 2015-06-17 |
| US20130084046A1 (en) | 2013-04-04 |
| TW201249578A (en) | 2012-12-16 |
| DE112012000019T5 (de) | 2013-02-28 |
| JP2012243900A (ja) | 2012-12-10 |
| SG186846A1 (en) | 2013-02-28 |
| KR20130014063A (ko) | 2013-02-06 |
| KR101322346B1 (ko) | 2013-10-28 |
| US8662761B2 (en) | 2014-03-04 |
| CN102959685A (zh) | 2013-03-06 |
| DE112012000019B4 (de) | 2017-05-18 |
| TWI414386B (zh) | 2013-11-11 |
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