WO2012153901A1 - 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판 - Google Patents
전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판 Download PDFInfo
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- WO2012153901A1 WO2012153901A1 PCT/KR2011/009104 KR2011009104W WO2012153901A1 WO 2012153901 A1 WO2012153901 A1 WO 2012153901A1 KR 2011009104 W KR2011009104 W KR 2011009104W WO 2012153901 A1 WO2012153901 A1 WO 2012153901A1
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- WO
- WIPO (PCT)
- Prior art keywords
- polymer film
- repeating unit
- derived
- copolymer resin
- polyester amide
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/12—Polyester-amides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Definitions
- a flexible printed circuit board comprising a wholly aromatic polyester amide copolymer resin, a polymer film comprising the wholly aromatic polyester amide copolymer resin, a flexible metal foil laminate comprising the polymer film, and the flexible metal foil laminate. More specifically, the flexible metal foil having an excellent bend life and dimensional stability, including the wholly aromatic polyester amide copolymer resin, polymer film containing the wholly aromatic polyester amide copolymer resin, the polymer film with improved bending life
- a flexible printed circuit board comprising a laminate and a flexible metal foil laminate is disclosed.
- the flexible metal foil laminate consists of two layers, a metal layer such as copper foil or aluminum foil, and a polymer film layer.
- the polymer film applied to the metal foil laminate for the flexible printed circuit board should satisfy the following main characteristics to be suitable for the performance of the semiconductor and the manufacturing conditions of the semiconductor packaging process.
- the flexible metal foil laminate is produced by applying a polyamic acid solution to the metal thin film and then curing by heat treatment under appropriate conditions.
- the flexible metal foil laminate thus manufactured has a structure in which a polyimide resin layer is formed on a metal thin film. Therefore, the flexible metal foil laminate has excellent bending life and heat resistance, which are the inherent characteristics of the polyimide resin, but due to the warpage phenomenon and the high hygroscopicity of the polyimide resin itself due to the difference in thermal expansion coefficient between the polyimide resin layer and the metal thin film. There is a problem of low dimensional stability.
- One embodiment of the present invention provides a repeating unit (A) derived from an aromatic hydroxy carboxylic acid, a repeating unit (B) derived from an aromatic amine having a phenolic hydroxy group, and a repeating unit (B ′) derived from an aromatic diamine.
- Another embodiment of the present invention provides a polymer film comprising the wholly aromatic polyester amide copolymer resin.
- Another embodiment of the present invention provides a flexible metal foil laminate including the polymer film and a flexible printed circuit board including the flexible metal foil laminate.
- repeating units (A) derived from aromatic hydroxy carboxylic acid
- the repeating unit (A) is para hydroxy benzoic acid, meta hydroxy benzoic acid, 6-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, 1-hydroxy-2-naphthoic acid and 2-hydroxy It is derived from at least one compound selected from the group consisting of oxy-1-naphthoic acid, and the repeating unit (B) is 3-aminophenol, 4-aminophenol, 5-amino-1-naphthol, 8-amino- It is derived from at least one compound selected from the group consisting of 2-naphthol and 3-amino-2-naphthol, and the repeating unit (B ′) is 1,4-phenylene diamine, 1,3-phenylene diamine, It is derived from at least one compound selected from the group consisting of 1,5-diaminonaphthalene, 2,3-diaminonaphthalene and 1,8-diaminonaphthalene,
- the wholly aromatic polyester amide copolymer resin may have a weight average molecular weight of 1,000 ⁇ 100,000, the glass transition temperature may be 200 ⁇ 300 °C.
- the polymer film may have a thermal expansion coefficient of 16 ppm or less in one direction.
- the polymer film may have a dielectric constant (1 GHz) of 3.5 or less and a dielectric loss (1 GHz) of 0.01 or less.
- the polymer film may have a moisture absorption of 0.5% by weight or less.
- the polymer film may have a glass transition temperature of 250 to 350 ° C.
- It provides a flexible metal foil laminate comprising at least one metal thin film disposed on at least one surface of the polymer film.
- the metal thin film may include at least one of copper foil and aluminum foil.
- a flexible printed circuit board obtained by etching a metal thin film of the flexible metal foil laminate.
- It provides a flexible printed circuit board formed by printing a metal circuit pattern on at least one surface of the polymer film.
- a wholly aromatic polyester amide copolymer resin having similar bending life and thermal expansion rate as compared to existing materials (eg, polyimide), but having low moisture absorption rate, dielectric constant and dielectric loss may be provided. have.
- a polymer film having a high bending life, high dimensional stability, low moisture absorption, low dielectric constant and low dielectric loss can be provided.
- a flexible metal foil laminate and a flexible printed circuit board having good bending properties and high peeling strength in addition to the properties of the polymer film may be provided.
- a wholly aromatic polyester amide copolymer resin according to an embodiment of the present invention, a polymer film comprising the wholly aromatic polyester amide copolymer resin, and a flexible metal foil laminate comprising the polymer film and the flexible metal foil laminate
- a flexible printed circuit board (FPCB) will be described in detail.
- the wholly aromatic polyester amide copolymer resin according to one embodiment of the present invention is a repeating unit derived from an aromatic amine having 5 to 25 mole parts of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid and a phenolic hydroxyl group (B ) And 20 to 40 mole parts of at least one repeating unit selected from the group consisting of repeating units (B ′) derived from aromatic diamines, 20 to 40 mole parts of repeating units (C) derived from aromatic dicarboxylic acids, derived from aromatic diols 5 to 20 mole parts of the repeating unit (D) and 5 to 20 mole parts of the repeating unit (E) derived from an aromatic amino carboxylic acid.
- the wholly aromatic polyester amide copolymer resin has an appropriate level of thermal characteristics.
- the wholly aromatic polyester amide copolymer resin has an appropriate level of solubility in the solvent and an appropriate level of hygroscopicity.
- the wholly aromatic polyester amide copolymer resin will have an appropriate level of solubility in a solvent.
- the wholly aromatic polyester amide copolymer resin has a high bending life.
- the wholly aromatic polyester amide copolymer resin has high solubility in solvents and provides excellent bending properties and high peel strength when applied to a flexible metal foil laminate as a polymer film. do.
- the repeating unit (A) is para hydroxy benzoic acid, meta hydroxy benzoic acid, 6-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, 1-hydroxy-2-naphthoic acid and 2-hydroxy It is derived from at least one compound selected from the group consisting of oxy-1-naphthoic acid, and the repeating unit (B) is 3-aminophenol, 4-aminophenol, 5-amino-1-naphthol, 8-amino- It is derived from at least one compound selected from the group consisting of 2-naphthol and 3-amino-2-naphthol, and the repeating unit (B ′) is 1,4-phenylene diamine, 1,3-phenylene diamine, It is derived from at least one compound selected from the group consisting of 1,5-diaminonaphthalene, 2,3-diaminonaphthalene and 1,8-diaminonaphthalene,
- Such wholly aromatic polyester amide copolymer resins include: (1) aromatic hydroxy carboxylic acids or derivatives for ester formation thereof; (2) at least one member selected from the group consisting of an aromatic amine having a phenolic hydroxy group or a derivative for forming an amide, and an aromatic diamine or a derivative for forming an amide; (3) aromatic dicarboxylic acids or derivatives for ester formation thereof; (4) aromatic diols or derivatives for ester formation thereof; And (5) polymerizing an aromatic amino carboxylic acid, a derivative for forming an amide thereof, or a derivative for forming an ester thereof.
- the derivative for forming an amide of the aromatic amine, aromatic diamine and / or aromatic amino carboxylic acid may be one in which their amine group forms an amide bond with carboxylic acids.
- the derivative for forming an ester of the aromatic diol may be one whose hydroxyl group forms an ester bond with carboxylic acids.
- the wholly aromatic polyester amide copolymer resin prepared as described above may be dissolved in a solvent.
- the wholly aromatic polyester amide copolymer resin may have a weight average molecular weight of 1,000 ⁇ 100,000, the glass transition temperature may be 200 ⁇ 300 °C.
- the wholly aromatic polyester amide copolymer resin as described above can be prepared by the following method. That is, the wholly aromatic polyester amide copolymer resin is an aromatic hydroxy carboxylic acid corresponding to the repeating unit (A), an aromatic amine having a phenolic hydroxy group corresponding to the repeating unit (B), the repeating unit ( Aromatic diamines corresponding to B ′), aromatic diols corresponding to the repeating unit (D) and / or hydroxy groups and / or amine groups of the aromatic amino carboxylic acids corresponding to the repeating unit (E) are acid anhydrides.
- the wholly aromatic polyester amide copolymer resin is an aromatic hydroxy carboxylic acid corresponding to the repeating unit (A), an aromatic amine having a phenolic hydroxy group corresponding to the repeating unit (B), the repeating unit ( Aromatic diamines corresponding to B ′), aromatic diols corresponding to the repeating unit (D) and / or hydroxy groups and / or amine groups of the
- the amount of the acid anhydride added may be 1.0-1.2 times the equivalent of the hydroxyl group and the amine group, for example, 1.0-1.1 times the equivalent.
- the amount of the acid anhydride added is within the above range, the coloring of the resulting wholly aromatic polyester amide copolymer resin is reduced, and sublimation of the raw material monomer and the like does not occur in the resultant wholly aromatic polyester amide copolymer resin, and the amount of phenol gas generated Will also be less.
- the acylation reaction may be performed for 30 minutes to 8 hours at 130 to 170 ° C, for example, for 1 to 3 hours at 140 to 160 ° C.
- the acid anhydride used in the acylation reaction may include acetic anhydride, propionic anhydride, isobutyric anhydride, gil acetic anhydride, pivalic anhydride, butyric anhydride, or a combination thereof.
- the transesterification and amide exchange reaction may be carried out at a temperature increase rate of 0.1 to 2 °C / min at 130 ⁇ 400 °C, for example, at a temperature increase rate of 0.3 ⁇ 1 °C / min at 140 ⁇ 350 °C.
- by-product acid and unreacted anhydride may be discharged out of the reaction system by evaporation or distillation, in order to shift the chemical equilibrium and increase the reaction rate during the transesterification reaction and / or amide exchange reaction.
- the acylation reaction, transesterification reaction and amide exchange reaction can proceed in the presence of a catalyst.
- the catalyst may include magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, antimony trioxide, N, N-dimethylaminopyridine, N-methylimidazole, or a combination thereof.
- the catalyst may be added simultaneously with the monomer when the monomer is added, and acylation reaction and transesterification reaction may occur in the presence of the catalyst.
- the condensation polymerization by the transesterification and the amide exchange reaction may be carried out by melt polymerization, or may be carried out using a combination of melt polymerization and solid phase polymerization.
- the polymerizer used for the melt polymerization is not particularly limited, and may be a reactor equipped with a stirring apparatus generally used for high viscosity reactions. At this time, the same reactor may be used as the reactor of the acylation process and the polymerizer of the melt polymerization process or different reactors may be used for each process.
- the solid phase polymerization may be performed by pulverizing the prepolymer discharged from the melt polymerization process into a flake or powder phase and then proceeding with the polymerization.
- Such solid phase polymerization may be performed by, for example, heat treatment in a solid state at 250 to 450 ° C. for 1 to 30 hours in an inert atmosphere such as nitrogen.
- the solid phase polymerization may be carried out under stirring or may be carried out in an unstirred state.
- the reactor equipped with suitable stirring facilities can also be used together with a melt polymerization tank and a solid state polymerization tank.
- the wholly aromatic polyester amide copolymer resin obtained may be pelletized by a known method and then molded or fiberized by a known method.
- Such wholly aromatic polyester amide copolymer resin may be dissolved in a solvent.
- the wholly aromatic polyester amide copolymer resin may be coated on a metal thin film in the form of varnish dissolved in a solvent and then dried and heat-treated to form a polymer film in order to manufacture a flexible metal foil laminate. That is, the polymer film is formed in a form attached to the metal thin film by the drying and heat treatment.
- the wholly aromatic polyester amide copolymer resin can be used in various applications in addition to the flexible metal foil laminate.
- the solvent for dissolving the wholly aromatic polyester amide copolymer resin may be used in an amount of 100 to 100,000 parts by weight based on 100 parts by weight of the wholly aromatic polyester amide copolymer resin, and if the content ratio of the solvent is within the above range Although the said wholly aromatic polyester amide copolymer resin melt
- a non-halogen solvent such as N, N-dimethylacetamide (DMAc) or N-methyl-2-pyrrolidone (NMP) may be used.
- the wholly aromatic polyester amide copolymer resin can be used in the manufacture of flexible metal foil laminates or flexible printed circuit boards without dissolving well in non-halogen solvents and using a solvent containing a halogen element. If a solvent containing a halogen element is used, it may cause problems in the manufacturing process, and in particular, an environmental hormone harmful to a human body may be generated when the halogen element is incinerated or decomposed.
- the flexible metal foil laminate according to one embodiment of the present invention includes a film of a wholly aromatic polyester amide copolymer resin having low dielectric properties and low moisture absorption, and a metal thin film having excellent mechanical strength. Therefore, the flexible metal foil laminate may be applied to various fields as a dimensional stability excellent and flexible substrate material.
- the thermal expansion coefficient of the polymer film may be 16 ppm / K or less.
- the thermal expansion coefficient of the polymer film is within the above range, warpage or shrinkage may not occur in the flexible metal foil laminate including the polymer film.
- the dielectric constant of the polymer film (1 GHz) is 3.5 or less
- the dielectric loss (1 GHz) may be 0.01 or less.
- 'dielectric loss' means an energy loss lost by heat in the dielectric when an alternating electric field is applied to the dielectric (ie, the polymer film).
- the polymer film may be used as an insulating substrate in the high frequency region.
- the moisture absorption rate of the polymer film may be 0.5% or less.
- the moisture absorption rate of the polymer film is within the above range, the resistance to moisture is high and the reliability of the flexible metal foil laminate becomes high.
- the glass transition temperature of the polymer film may be 250 ⁇ 350 °C.
- the polymer film may have heat resistance to a reflow process in manufacturing the flexible printed circuit board using the polymer film.
- the thermal expansion rate, dielectric constant, dielectric loss, moisture absorption rate, and glass transition temperature of the above-described polymer film may be measured after the following process. That is, a composition solution (a varnish, i.e., a solution in which the wholly aromatic polyester amide copolymer resin is dissolved in a solvent) is applied to a metal thin film, and then dried and heat-treated to prepare a flexible metal foil laminate, and then a metal from the flexible metal foil laminate. After removing all the thin films, the remaining polymer film may be analyzed to measure the properties.
- a composition solution a varnish, i.e., a solution in which the wholly aromatic polyester amide copolymer resin is dissolved in a solvent
- the metal thin film may include at least one selected from the group consisting of copper foil and aluminum foil.
- the polymer film may have a thickness of 1 ⁇ m to 100 ⁇ m.
- the thickness of the polymer film is within the above range, cracks are less likely to occur during the processing of the winding method, and is advantageous for multilayer lamination of a limited thickness.
- the metal thin film may have a thickness of about 1 ⁇ m to about 70 ⁇ m. If the thickness of the said metal thin film is within the said range, it is suitable for light and small size reduction, and pattern formation is easy.
- the flexible printed circuit board may be manufactured by etching the metal thin film of the flexible metal foil laminate and forming a circuit.
- a flexible printed circuit board may be manufactured by printing a metal circuit pattern on at least one surface of the polymer film.
- a through hole or the like may be formed in the flexible printed circuit board as necessary.
- the flexible printed circuit board may have a thickness of 2 ⁇ m to 170 ⁇ m. When the thickness of the flexible printed circuit board is within the above range, it is suitable for light and short and short, and the printed circuit board may have flexibility.
- Step 1 Preparation of wholly aromatic polyester amide copolymer resin
- HNA 6-hydroxy-2-naphthoic acid
- AP 4-aminophenol
- IPA isophthalic acid
- BPA bisphenol A
- ABA 4-aminobenzoic acid
- Table 1 The content (molar parts) of the monomers introduced into the reactor is shown in Table 1 below. Then, the hydroxyl group of the monomers was acetylated while the reactor temperature was raised to 140 ° C. over 1 hour and refluxed at this temperature for 2 hours . Subsequently, the reactor temperature was raised to 300 ° C.
- acetic acid is further produced as a by-product in the preparation of the prepolymer, which was also removed continuously during the prepolymer preparation together with the acetic acid produced in the acetylation reaction.
- the prepolymer was recovered from the reactor and cooled and solidified.
- the wholly aromatic polyester amide copolymer prepolymer was pulverized to an average particle diameter of 1 mm, 20 kg of the crushed wholly aromatic liquid crystalline polyester prepolymer was introduced into a rotary kiln reactor having a capacity of 100 liters, and a nitrogen flow rate was 1 Nm 3 / hour. After continuing to flow the temperature to the weight loss start temperature to 200 °C over 1 hour, and then heated up to 320 °C over 10 hours to maintain for 3 hours to prepare a wholly aromatic liquid-crystalline polyester resin. Subsequently, the reactor was cooled to room temperature over 1 hour, and then the wholly aromatic liquid crystal polyester resin was recovered from the reactor.
- step 2 preparing a composition solution of the wholly aromatic polyester amide copolymer resin
- NMP N-methyl-2-pyrrolidone
- step 3 production of copper foil laminate
- the composition solution of the wholly aromatic polyester amide copolymer resin prepared in step 2 was coated on the copper foil surface having a thickness of 18 ⁇ m. Thereafter, the composition solution of the coated wholly aromatic polyester amide copolymer resin was dried at 160 ° C. Next, in order to further improve physical properties, the temperature was raised to 300 ° C to prepare a copper foil laminate.
- the copper foil laminate thus produced includes a polymer film of the type attached to the copper foil.
- the weight average molecular weight was found to have no significant difference in each Example and Comparative Example, but due to the structural difference of the final polymer chain, the glass transition temperature was found to have a large difference.
- the wholly aromatic polyester amide copolymer resin of Comparative Example 1 was found to have a very low melting temperature. Therefore, the copolymer resin prepared in Comparative Example 1 has a low thermal property of itself, and thus it is difficult to pass the reflow process even after the additional heat treatment process.
- a bending test specimen was prepared by bonding a coverlay (12 ⁇ m of polyimide film, 25 ⁇ m of adhesive) to one surface (that is, a surface on which a circuit is formed) of each of the flexible copper foil laminates. Subsequently, the test specimen was mounted on an MIT bending test apparatus (TOYOSEIKI, MIT-SA), and then the jig with a radius of curvature of 0.38 R was repeatedly rotated at a speed of 175 rpm to rotate the fixture until the test specimen was disconnected. The number of times was measured.
- TOYOSEIKI TOYOSEIKI, MIT-SA
- Each of the flexible copper foil laminates were cut to a size of 10 cm ⁇ 10 cm to prepare test specimens. Subsequently, after placing each test specimen on a plate, the height (mm) from each edge of the flexible copper foil laminate to the plate was measured to obtain an average value of the measured values.
- the peel strength of the copper foil was measured according to the IPC-TM-650 2.4.9 standard.
- the polymer film prepared in Example 1-2 has a lower coefficient of thermal expansion, dielectric constant, dielectric loss and moisture absorption, and a higher glass transition temperature than the polymer film prepared in Comparative Example 1-10. appear.
- the polymer film prepared in Example 1-2 showed lower thermal expansion coefficient, dielectric constant, dielectric loss, moisture absorption rate and glass transition temperature than the polymer film prepared in Comparative Example 11.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Polyamides (AREA)
- Laminated Bodies (AREA)
- Wire Bonding (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
HNA(몰부) | AP(몰부) | IPA(몰부) | BPA(몰부) | ABA(몰부) | Ac2O(몰부) | |
실시예 1 | 20 | 30 | 30 | 10 | 10 | 110 |
실시예 2 | 25 | 25 | 25 | 10 | 15 | 110 |
비교예 1 | 2 | 35 | 35 | 20 | 8 | 110 |
비교예 2 | 45 | 20 | 20 | 5 | 10 | 110 |
비교예 3 | 25 | 5 | 40 | 15 | 15 | 110 |
비교예 4 | 10 | 50 | 20 | 10 | 10 | 110 |
비교예 5 | 25 | 40 | 5 | 15 | 15 | 110 |
비교예 6 | 10 | 20 | 50 | 10 | 10 | 110 |
비교예 7 | 25 | 30 | 30 | 2 | 13 | 110 |
비교예 8 | 10 | 20 | 20 | 40 | 10 | 110 |
비교예 9 | 25 | 30 | 30 | 13 | 2 | 110 |
비교예 10 | 10 | 20 | 20 | 10 | 40 | 110 |
중량평균분자량 | 유리전이온도(℃) | |
실시예 1 | 11,000 | 230 |
실시예 2 | 12,000 | 240 |
비교예 1 | 9,500 | 175 |
비교예 2 | 12,000 | 255 |
비교예 3 | 13,000 | 210 |
비교예 4 | 8,500 | 245 |
비교예 5 | 9,000 | 250 |
비교예 6 | 9,500 | 210 |
비교예 7 | 10,000 | 235 |
비교예 8 | 10,500 | 210 |
비교예 9 | 10,000 | 220 |
비교예 10 | 10,500 | 230 |
비교예 11 | - | - |
굴곡수명(회) | 휨 특성(mm) | 동박의 박리 강도(N/mm) | |
실시예 1 | 7,200 | 5 | 14 |
실시예 2 | 7,800 | 2 | 14 |
비교예 1 | 5,500 | 15 | 8 |
비교예 2 | 7,500 | 11 | 10 |
비교예 3 | 4,200 | 15 | 8 |
비교예 4 | 4,600 | 10 | 9 |
비교예 5 | 6,300 | 9 | 10 |
비교예 6 | 3,800 | 18 | 7 |
비교예 7 | 6,200 | 10 | 11 |
비교예 8 | 7,500 | 12 | 8 |
비교예 9 | 6,100 | 10 | 11 |
비교예 10 | 5,800 | 10 | 10 |
비교예 11 | 6,500 | 5 | 10 |
열팽창률(ppm/K) | 유전상수(@1GHz) | 유전손실(@1GHz) | 흡습율(중량%) | 유리전이온도(℃) | |
실시예 1 | 15 | 3.0 | 0.004 | 0.2 | 270 |
실시예 2 | 15 | 3.0 | 0.004 | 0.2 | 280 |
비교예 1 | 20 | 3.8 | 0.005 | 0.4 | 230 |
비교예 2 | 20 | 3.6 | 0.005 | 0.7 | 240 |
비교예 3 | 25 | 3.6 | 0.005 | 0.7 | 220 |
비교예 4 | 20 | 3.5 | 0.005 | 0.3 | 240 |
비교예 5 | 18 | 3.2 | 0.005 | 0.4 | 250 |
비교예 6 | 30 | 3.8 | 0.005 | 0.8 | 200 |
비교예 7 | 20 | 3.2 | 0.005 | 0.5 | 240 |
비교예 8 | 22 | 3.3 | 0.005 | 0.5 | 230 |
비교예 9 | 17 | 3.2 | 0.005 | 0.7 | 250 |
비교예 10 | 25 | 3.5 | 0.005 | 0.5 | 260 |
비교예 11 | 24 | 3.8 | 0.005 | 1.2 | > 300 |
Claims (12)
- 방향족 히드록시 카르복실산에서 유도된 반복단위(A) 5~25몰부;페놀성 히드록시기를 갖는 방향족 아민에서 유도된 반복단위(B) 및 방향족 디아민에서 유도된 반복단위(B')로 이루어진 군으로부터 선택된 적어도 하나의 반복단위 20~40몰부;방향족 디카르복실산에서 유도된 반복단위(C) 20~40몰부;방향족 디올에서 유도된 반복단위(D) 5~20몰부; 및방향족 아미노 카르복실산에서 유도된 반복단위(E) 5~20몰부를 포함하는 전방향족 폴리에스테르 아미드 공중합체 수지.
- 제1항에 있어서,상기 반복단위(A)는 파라 히드록시 벤조산, 메타 히드록시 벤조산, 6-히드록시-2-나프토산, 3-히드록시-2-나프토산, 1-히드록시-2-나프토산 및 2-히드록시-1-나프토산으로 이루어진 군에서 선택된 적어도 1종의 화합물에서 유도된 것이고, 상기 반복단위(B)는 3-아미노페놀, 4-아미노페놀, 5-아미노-1-나프톨, 8-아미노-2-나프톨 및 3-아미노-2-나프톨로 이루어진 군에서 선택된 적어도 1종의 화합물에서 유도된 것이고, 상기 반복단위(B')는 1,4-페닐렌 디아민, 1,3-페닐렌 디아민, 1,5-디아미노나프탈렌, 2,3-디아미노나프탈렌 및 1,8-디아미노나프탈렌으로 이루어진 군에서 선택된 적어도 1종의 화합물에서 유도된 것이고, 상기 반복단위(C)는 이소프탈산, 나프탈렌 디카르복실산 및 테레프탈산으로 이루어진 군으로부터 선택된 적어도 1종의 화합물에서 유도된 것이고, 상기 반복단위(D)는 비스페놀 A, 레조르시놀, 4,4´-바이페놀 및 하이드로퀴논으로 이루어진 군으로부터 선택된 적어도 1종의 화합물에서 유도된 것이고, 상기 반복단위(E)는 4-아미노벤조산, 2-아미노-나프탈렌-6-카르복실산 및 4'-아미노-바이페닐-4-카르복실산으로 이루어진 군에서 선택된 적어도 1종의 화합물에서 유도된 것인 전방향족 폴리에스테르 아미드 공중합체 수지.
- 제1항에 있어서,중량평균분자량이 1,000~100,000이고, 유리전이온도가 200~300℃인 전방향족 폴리에스테르 아미드 공중합체 수지.
- 제1항 내지 제3항 중 어느 한 항에 따른 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름.
- 제4항에 있어서,일방향의 열팽창률이 16ppm/K 이하인 고분자 필름.
- 제4항에 있어서,유전상수(1GHz)가 3.5 이하이며, 유전손실(1GHz)이 0.01 이하인 고분자 필름.
- 제4항에 있어서,흡습율이 0.5중량% 이하인 고분자 필름.
- 제4항에 있어서,유리전이온도가 250~350℃인 고분자 필름.
- 제1항 내지 제3항 중 어느 한 항에 따른 고분자 필름; 및상기 고분자 필름의 적어도 일면에 배치된 적어도 한장의 금속 박막을 포함하는 연성 금속박 적층판.
- 제9항에 있어서,상기 금속 박막은 동박 및 알루미늄박 중 적어도 하나를 포함하는 연성 금속박 적층판.
- 제9항에 따른 연성 금속막 적층판의 금속 박막을 에칭하여 얻어지는 연성 인쇄 회로기판.
- 제4항에 따른 고분자 필름의 적어도 일면에 금속 회로 패턴을 인쇄하여 형성된 연성 인쇄 회로기판.
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US14/113,336 US9161443B2 (en) | 2011-05-06 | 2011-11-28 | Wholly aromatic polyester amide copolymer resin, polymer film including the wholly aromatic polyester amide copolymer resin, flexible metal-clad laminate including the polymer film, and flexible printed circuit board including the flexible metal-clad laminate |
JP2014510231A JP5945320B2 (ja) | 2011-05-06 | 2011-11-28 | 全芳香族ポリエステルアミド共重合体樹脂、該全芳香族ポリエステルアミド共重合体樹脂を含む高分子フィルム、該高分子フィルムを含む軟性金属箔積層板、及び該軟性金属箔積層板を具備する軟性印刷回路基板 |
CN201180070563.2A CN103502308A (zh) | 2011-05-06 | 2011-11-28 | 全芳香族聚酯酰胺共聚物树脂、包括该全芳香族聚酯酰胺共聚物树脂的聚合物膜、包括该聚合物膜的柔性覆金属箔层压板、和具有该柔性覆金属箔层压板的柔性印刷电路板 |
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KR10-2011-0043072 | 2011-05-06 | ||
KR1020110043072A KR101798237B1 (ko) | 2011-05-06 | 2011-05-06 | 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판 |
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KR102369349B1 (ko) * | 2019-10-02 | 2022-03-02 | 에스케이씨 주식회사 | 전자기판용 필름 및 적층체, 및 이를 포함하는 전자기판 |
CN111393635B (zh) * | 2020-04-07 | 2024-02-09 | 宁波长阳科技股份有限公司 | 一种液晶高分子覆铜板及其制备方法 |
TWI749575B (zh) * | 2020-06-02 | 2021-12-11 | 長興材料工業股份有限公司 | 芳香族液晶聚酯、液晶聚酯組合物及製備液晶聚酯膜之方法 |
KR102439134B1 (ko) * | 2020-10-23 | 2022-09-02 | 에스케이씨 주식회사 | 전자기판용 필름 및 적층체, 및 이를 포함하는 전자기판 |
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