JP2014518915A - 全芳香族ポリエステルアミド共重合体樹脂、該全芳香族ポリエステルアミド共重合体樹脂を含む高分子フィルム、該高分子フィルムを含む軟性金属箔積層板、及び該軟性金属箔積層板を具備する軟性印刷回路基板 - Google Patents
全芳香族ポリエステルアミド共重合体樹脂、該全芳香族ポリエステルアミド共重合体樹脂を含む高分子フィルム、該高分子フィルムを含む軟性金属箔積層板、及び該軟性金属箔積層板を具備する軟性印刷回路基板 Download PDFInfo
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- JP2014518915A JP2014518915A JP2014510231A JP2014510231A JP2014518915A JP 2014518915 A JP2014518915 A JP 2014518915A JP 2014510231 A JP2014510231 A JP 2014510231A JP 2014510231 A JP2014510231 A JP 2014510231A JP 2014518915 A JP2014518915 A JP 2014518915A
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- repeating unit
- derived
- polymer film
- copolymer resin
- acid
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- 125000003118 aryl group Chemical group 0.000 title claims abstract description 86
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 63
- 239000002184 metal Substances 0.000 title claims abstract description 63
- 229920006254 polymer film Polymers 0.000 title claims abstract description 59
- 229920006149 polyester-amide block copolymer Polymers 0.000 title claims abstract description 58
- 229920006026 co-polymeric resin Polymers 0.000 title claims abstract description 56
- 239000011888 foil Substances 0.000 title claims abstract description 41
- 238000007639 printing Methods 0.000 title claims description 4
- -1 aromatic diol Chemical class 0.000 claims abstract description 9
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims abstract description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 150000004984 aromatic diamines Chemical class 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000011889 copper foil Substances 0.000 claims description 26
- 239000010409 thin film Substances 0.000 claims description 20
- 150000001875 compounds Chemical class 0.000 claims description 18
- 230000009477 glass transition Effects 0.000 claims description 16
- 238000010521 absorption reaction Methods 0.000 claims description 12
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 claims description 10
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 10
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 8
- 150000004982 aromatic amines Chemical class 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 claims description 6
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 6
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 3
- SJJCQDRGABAVBB-UHFFFAOYSA-N 1-hydroxy-2-naphthoic acid Chemical compound C1=CC=CC2=C(O)C(C(=O)O)=CC=C21 SJJCQDRGABAVBB-UHFFFAOYSA-N 0.000 claims description 3
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 claims description 3
- ALKYHXVLJMQRLQ-UHFFFAOYSA-N 3-Hydroxy-2-naphthoate Chemical compound C1=CC=C2C=C(O)C(C(=O)O)=CC2=C1 ALKYHXVLJMQRLQ-UHFFFAOYSA-N 0.000 claims description 3
- ZHVPTERSBUMMHK-UHFFFAOYSA-N 3-aminonaphthalen-2-ol Chemical compound C1=CC=C2C=C(O)C(N)=CC2=C1 ZHVPTERSBUMMHK-UHFFFAOYSA-N 0.000 claims description 3
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 claims description 3
- 229940018563 3-aminophenol Drugs 0.000 claims description 3
- ZSFKODANZQVHCK-UHFFFAOYSA-N 4-(4-aminophenyl)benzoic acid Chemical compound C1=CC(N)=CC=C1C1=CC=C(C(O)=O)C=C1 ZSFKODANZQVHCK-UHFFFAOYSA-N 0.000 claims description 3
- ALYNCZNDIQEVRV-PZFLKRBQSA-N 4-amino-3,5-ditritiobenzoic acid Chemical compound [3H]c1cc(cc([3H])c1N)C(O)=O ALYNCZNDIQEVRV-PZFLKRBQSA-N 0.000 claims description 3
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 3
- ZBIBQNVRTVLOHQ-UHFFFAOYSA-N 5-aminonaphthalen-1-ol Chemical compound C1=CC=C2C(N)=CC=CC2=C1O ZBIBQNVRTVLOHQ-UHFFFAOYSA-N 0.000 claims description 3
- NZTPZUIIYNYZKT-UHFFFAOYSA-N 6-aminonaphthalene-2-carboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(N)=CC=C21 NZTPZUIIYNYZKT-UHFFFAOYSA-N 0.000 claims description 3
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 3
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 claims description 3
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 claims description 3
- XTBLDMQMUSHDEN-UHFFFAOYSA-N naphthalene-2,3-diamine Chemical compound C1=CC=C2C=C(N)C(N)=CC2=C1 XTBLDMQMUSHDEN-UHFFFAOYSA-N 0.000 claims description 3
- YFOOEYJGMMJJLS-UHFFFAOYSA-N 1,8-diaminonaphthalene Chemical compound C1=CC(N)=C2C(N)=CC=CC2=C1 YFOOEYJGMMJJLS-UHFFFAOYSA-N 0.000 claims 1
- KVHHMYZBFBSVDI-UHFFFAOYSA-N 8-aminonaphthalen-2-ol Chemical compound C1=C(O)C=C2C(N)=CC=CC2=C1 KVHHMYZBFBSVDI-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000001413 amino acids Chemical class 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 16
- 238000006116 polymerization reaction Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 238000005452 bending Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 229910052736 halogen Inorganic materials 0.000 description 8
- 150000002367 halogens Chemical class 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 7
- 239000009719 polyimide resin Substances 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000005917 acylation reaction Methods 0.000 description 6
- 150000001408 amides Chemical group 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000005809 transesterification reaction Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000007790 solid phase Substances 0.000 description 5
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- FHMMQQXRSYSWCM-UHFFFAOYSA-N 1-aminonaphthalen-2-ol Chemical compound C1=CC=C2C(N)=C(O)C=CC2=C1 FHMMQQXRSYSWCM-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 238000006640 acetylation reaction Methods 0.000 description 2
- 229960004050 aminobenzoic acid Drugs 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000012643 polycondensation polymerization Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- PGZVFRAEAAXREB-UHFFFAOYSA-N 2,2-dimethylpropanoyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC(=O)C(C)(C)C PGZVFRAEAAXREB-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000010933 acylation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000008430 aromatic amides Chemical class 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000005556 hormone Substances 0.000 description 1
- 229940088597 hormone Drugs 0.000 description 1
- LSACYLWPPQLVSM-UHFFFAOYSA-N isobutyric acid anhydride Chemical compound CC(C)C(=O)OC(=O)C(C)C LSACYLWPPQLVSM-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- PSHKMPUSSFXUIA-UHFFFAOYSA-N n,n-dimethylpyridin-2-amine Chemical compound CN(C)C1=CC=CC=N1 PSHKMPUSSFXUIA-UHFFFAOYSA-N 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- DUCKXCGALKOSJF-UHFFFAOYSA-N pentanoyl pentanoate Chemical compound CCCCC(=O)OC(=O)CCCC DUCKXCGALKOSJF-UHFFFAOYSA-N 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
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Abstract
Description
(1)金属熱膨脹率に対応可能な低熱膨脹率
(2)1GHz以上の高周波領域での低誘電定数及び誘電安定性
(3)260℃程度のリフロー工程に対する耐熱性
(4)信頼性向上のための低吸湿性
(1)工程1:全芳香族ポリエステルアミド共重合体樹脂の製造
撹拌装置、窒素ガス導入管、温度計及び還流冷却器を具備した反応器に、6−ヒドロキシ−2−ナフトエ酸(HNA)、4−アミノフェノール(AP)、イソフタル酸(IPA)、ビスフェノールA(BPA)及び4−アミノ安息香酸(ABA)を投入し、窒素ガスを注入し、前記反応器の内部空間を不活性状態にした後、前記反応器に、酢酸無水物(Ac2O)をさらに添加した。反応器に投入された単量体の含量(モル部)を下記表1に示した。その後、反応器温度を1時間にわたって140℃まで昇温させ、前記温度で2時間還流させながら、前記単量体のヒドロキシル基をアセチル化させた。次に、前記アセチル化反応で生成された酢酸を除去しながら、反応器温度を4時間にわたって300℃まで昇温させ、単量体の縮重合反応によって、全芳香族ポリエステルアミド共重合体プレポリマーを製造した。また、前記プレポリマーの製造時、副生成物として酢酸がさらに生成されるが、この酢酸も、前記アセチル化反応で生成された酢酸と共に、前記プレポリマー製造の間に連続的に除去した。次に、前記プレポリマーを反応器から回収して冷却固化させた。
N−メチル−2−ピロリドン(NMP)700gに、前記工程1で製造した全芳香族ポリエステルアミド共重合体樹脂粉末300gを添加し、高温(180℃)で4時間撹拌し、全芳香族ポリエステルアミド共重合体樹脂の組成物溶液を得た。
厚み18μmの銅箔表面に、前記工程2で製造された全芳香族ポリエステルアミド共重合体樹脂の組成物溶液をコーティングさせた。その後、前記コーティングされた全芳香族ポリエステルアミド共重合体樹脂の組成物溶液を160℃で乾燥させた。次に、物性をさらに高めるために、300℃まで昇温させて銅箔積層板を製造した。かように製造された銅箔積層板は、銅箔に付着された形態の高分子フィルムを含む。
SD Flex社で製造された、ポリイミド樹脂のフィルムを含む銅箔積層板(Pyralux AC)を入手した。
<評価例1:樹脂の物性評価>
前記実施例1,2及び比較例1〜10で製造されたそれぞれの全芳香族ポリエステルアミド共重合体樹脂の重量平均分子量及びガラス転移温度を測定し、下記表2に示した。ただし、比較例11の銅箔積層板に含まれた樹脂の物性データは手に入れることができなかった。
前記実施例1,2及び比較例1〜11の各銅箔積層板の屈曲寿命(bending endurance)、反り特性及び銅箔の剥離強度をそれぞれ測定し、その結果を下記表3に示した。反り特性の場合、数値が小さいほど反り特性に優れるということを意味する。
前記各軟性銅箔積層板の一表面(すなわち、回路が形成される表面)にカバーレイ(Coverlay)(ポリイミドフィルム12μm、接着剤25μm)を接合して屈曲試験用の試験片を製造した。次に、前記試験片を、MIT屈曲試験装置(TOYOSEIKI、MIT−SA)に装着した後、0.38Rの曲率半径を有したジグを175rpmの速度で反復回転させ、前記試験片が断線されるまでの前記ジグの回転数を測定した。
前記各軟性銅箔積層板を10cmx10cmサイズに切断し、試験片を製造した。次に、前記各試験片を平板上に置いた後、軟性銅箔積層板のロールして浮き上がった各エッジから平板までの高さ(mm)を測定し、前記測定値の平均値を求めた。
IPC−TM−650 2.4.9規格によって、銅箔の剥離強度を測定した。
前記実施例1,2及び比較例1〜11の各銅箔積層板からエッチングによって銅箔を完全に除去した後、残った高分子フィルムを分析し、前記高分子フィルムの熱膨脹率、誘電特性、吸湿率及びガラス転移温度をそれぞれ測定して下記表4に示した。
Claims (12)
- 芳香族ヒドロキシカルボン酸から誘導される繰り返し単位(A)5〜25モル部と、
フェノール性ヒドロキシ基を有する芳香族アミンから誘導される繰り返し単位(B)、及び芳香族ジアミンから誘導される繰り返し単位(B’)からなる群から選択される少なくとも1つの繰り返し単位20〜40モル部と、
芳香族ジカルボン酸から誘導される繰り返し単位(C)20〜40モル部と、
芳香族ジオールから誘導される繰り返し単位(D)5〜20モル部と、
芳香族アミノカルボン酸から誘導される繰り返し単位(E)5〜20モル部と、を含む全芳香族ポリエステルアミド共重合体樹脂。 - 前記繰り返し単位(A)は、パラヒドロキシ安息香酸、メタヒドロキシ安息香酸、6−ヒドロキシ−2−ナフトエ酸、3−ヒドロキシ−2−ナフトエ酸、1−ヒドロキシ−2−ナフトエ酸及び2−ヒドロキシ−1−ナフトエ酸からなる群から選択される少なくとも1種の化合物から誘導されるものであり、
前記繰り返し単位(B)は、3−アミノフェノール、4−アミノフェノール、5−アミノ−1−ナフトール、8−アミノ−2−ナフトール及び3−アミノ−2−ナフトールからなる群から選択される少なくとも1種の化合物から誘導されるものであり、
前記繰り返し単位(B’)は、1,4−フェニレンジアミン、1,3−フェニレンジアミン、1,5−ジアミノ−ナフタレン、2,3−ジアミノ−ナフタレン及び1,8−ジアミノ−ナフタレンからなる群から選択される少なくとも1種の化合物から誘導されるものであり、
前記繰り返し単位(C)は、イソフタル酸、ナフタレンジカルボン酸及びテレフタル酸からなる群から選択される少なくとも1種の化合物から誘導されるものであり、
前記繰り返し単位(D)は、ビスフェノールA、レゾルシノール、4,4’−ビフェノール及びヒドロキノンからなる群から選択される少なくとも1種の化合物から誘導されるものであり、
前記繰り返し単位(E)は、4−アミノ−安息香酸、2−アミノ−ナフタレン−6−カルボン酸及び4’−アミノ−ビフェニル−4−カルボン酸からなる群から選択される少なくとも1種の化合物から誘導されるものであることを特徴とする請求項1に記載の全芳香族ポリエステルアミド共重合体樹脂。 - 重量平均分子量が1,000〜100,000であり、ガラス転移温度が200〜300℃であることを特徴とする請求項1に記載の全芳香族ポリエステルアミド共重合体樹脂。
- 請求項1〜3のいずれか1項に記載の全芳香族ポリエステルアミド共重合体樹脂を含む高分子フィルム。
- 1方向の熱膨脹率が16ppm/K以下であることを特徴とする請求項4に記載の高分子フィルム。
- 1GHzにおける誘電定数が3.5以下であり、1GHzにおける誘電損失が0.01以下であることを特徴とする請求項4に記載の高分子フィルム。
- 吸湿率が0.5重量%以下であることを特徴とする請求項4に記載の高分子フィルム。
- ガラス転移温度が250〜350℃であることを特徴とする請求項4に記載の高分子フィルム。
- 請求項1〜3のいずれか1項に記載の高分子フィルムと、
前記高分子フィルムの少なくとも一面に配置された少なくとも1枚の金属薄膜と、を含む軟性金属箔積層板。 - 前記金属薄膜は、銅箔及びアルミニウム箔のうち少なくとも一つを含むことを特徴とする請求項9に記載の軟性金属箔積層板。
- 請求項9に記載の軟性金属膜積層板の金属薄膜をエッチングして得られる軟性印刷回路基板。
- 請求項4に記載の高分子フィルムの少なくとも一面に、金属回路パターンを印刷して形成された軟性印刷回路基板。
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JP2022550369A (ja) * | 2019-10-02 | 2022-12-01 | エスケイシー・カンパニー・リミテッド | 電子基板用フィルムおよび積層体、並びにこれらを含む電子基板 |
JP2022550370A (ja) * | 2019-10-02 | 2022-12-01 | エスケイシー・カンパニー・リミテッド | 電子基板用フィルムおよび積層体、並びにこれらを含む電子基板 |
JP7369284B2 (ja) | 2019-10-02 | 2023-10-25 | エスケーマイクロワークス 株式会社 | 電子基板用フィルムおよび積層体、並びにこれらを含む電子基板 |
JP7369285B2 (ja) | 2019-10-02 | 2023-10-25 | エスケーマイクロワークス 株式会社 | 電子基板用フィルムおよび積層体、並びにこれらを含む電子基板 |
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WO2012153901A1 (ko) | 2012-11-15 |
KR20120125034A (ko) | 2012-11-14 |
KR101798237B1 (ko) | 2017-11-15 |
JP5945320B2 (ja) | 2016-07-05 |
US9161443B2 (en) | 2015-10-13 |
CN103502308A (zh) | 2014-01-08 |
US20140284085A1 (en) | 2014-09-25 |
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