WO2012121070A1 - Module de caméra et procédé de contrôle du module de caméra - Google Patents

Module de caméra et procédé de contrôle du module de caméra Download PDF

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Publication number
WO2012121070A1
WO2012121070A1 PCT/JP2012/055024 JP2012055024W WO2012121070A1 WO 2012121070 A1 WO2012121070 A1 WO 2012121070A1 JP 2012055024 W JP2012055024 W JP 2012055024W WO 2012121070 A1 WO2012121070 A1 WO 2012121070A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera module
connection terminals
outer edge
circuit board
printed circuit
Prior art date
Application number
PCT/JP2012/055024
Other languages
English (en)
Japanese (ja)
Inventor
清末成憲
片桐禎人
Original Assignee
コニカミノルタアドバンストレイヤー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタアドバンストレイヤー株式会社 filed Critical コニカミノルタアドバンストレイヤー株式会社
Priority to CN201280012005.5A priority Critical patent/CN103503584A/zh
Priority to JP2013503465A priority patent/JPWO2012121070A1/ja
Publication of WO2012121070A1 publication Critical patent/WO2012121070A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to a camera module in which two substrates are connected by interposing an anisotropic conductive film between a rigid substrate or a flexible substrate and a flexible substrate, and a method for inspecting the camera module.
  • ultra-small camera modules have been installed in small and thin mobile terminals such as mobile phones and PDAs (Personal Digital Assistants), which enables not only voice communication but also image capture and communication. It has become.
  • Such a camera module incorporates at least an imaging lens and an imaging device such as a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor.
  • an imaging device such as a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor.
  • CCD Charge Coupled Device
  • CMOS Complementary Metal-Oxide Semiconductor
  • the image sensor is mounted on a rigid board, and an elongated flexible board is electrically connected to the rigid board in order to output an image signal transmitted to the rigid board to an external device.
  • a flexible substrate having a short or irregular shape is electrically connected.
  • an ACF is used in recent years.
  • ACF is a film for electrical joining having a thickness of 20 to 30 ⁇ m formed of a heat resistant resin.
  • a plurality of conductive particles are dispersed in the surface direction inside the heat-resistant resin, and the conductive particles are formed in 3 to 10 ⁇ m spheres in which the resin is coated with nickel or the like.
  • the anisotropic conductive film disposed between the two printed boards is thermocompression bonded, the connection terminals of the two printed boards come into contact with the conductive particles, and therefore have conductivity in the thickness direction. Become.
  • the conductive particles are dispersed in the heat-resistant resin at a ratio of approximately 10% or less, and since no pressure is applied in the surface direction, the conductive particles do not contact each other and the insulation is maintained. Accordingly, when connecting a plurality of connection terminals provided on two printed boards, the opposing connection terminals are conducted, and adjacent connection terminals are not conducted.
  • Patent Document 1 relates to a printed circuit board connection structure. That is, when the connection terminal provided at the end of the flexible substrate is connected to the connection terminal provided at the end of the rigid substrate via the ACF, if the flexible substrate is warped, the connection terminal of the flexible substrate may be warped and broken. is there. Therefore, the insulating coating is joined together with the connection terminals by ACF.
  • FIG. 1 is a perspective view showing a process of sequentially placing an ACF and a flexible board on a rigid board of a camera module
  • FIG. 2 is a perspective view showing a process of crimping the flexible board with a crimping head
  • FIG. It is a figure of the camera module by which the flexible substrate was joined to the rigid board
  • reference numeral 31 denotes a camera module to which a rigid board 32 is connected.
  • An imaging element (not shown) is mounted on the back surface of the rigid substrate 32, that is, the lower surface in the figure, and an imaging lens (not shown) is disposed below the imaging element. Therefore, in the camera module shown in FIG. 1, the direction in which the subject is imaged is downward.
  • connection terminals 32 a are arranged on the upper surface of the rigid substrate 32.
  • the number of connection terminals 32a is 10 in total, 5 each on the left and right sides. However, in order to clarify the form, the number of connection terminals 32a is actually 10 and is about 20.
  • the ACF 33 is placed on the rigid substrate 32.
  • the flexible substrate 34 is placed on the ACF 33.
  • connection terminals 34 a are arranged on the back surface of the flexible substrate 34, that is, the lower surface in the drawing. Each connection terminal 34a is arranged to face the connection terminal 32a, and the number thereof is the same.
  • the flexible substrate 34 is crimped by the crimping head 51 heated to a high temperature as shown in FIG.
  • the temperature of the crimping head 51 is 130 to 160 ° C.
  • the crimping force is 1 to 4 MPa.
  • the ACF 33 is crushed thinly as shown in FIG. 3, and the flexible substrate 34 is joined to the rigid substrate 32 via the ACF 33. Is electrically connected.
  • the camera module 31 is placed on a predetermined jig and the above operation is performed, but the surface of the rigid substrate 32 and the lower surface of the crimping head 51 need to be parallel. In other words, if not parallel, the plurality of connection terminals 32a and the connection terminals 34a are not uniformly connected, and conduction failure may occur in some of the connection terminals.
  • the rigid board 32 is attached to the camera module main body by bonding or the like, but the rigid board 32 may be attached to be inclined. In some cases, the camera module 31 is tilted and placed on a jig used for crimping by the crimping head 51, and the rigid substrate 32 is tilted.
  • FIG. 4 shows a state in which the plurality of connection terminals 32a and the connection terminals 34a are thus connected unevenly.
  • 4A is a top view and
  • FIG. 4B is a cross-sectional view.
  • a method that is normally considered as an inspection for confirming the continuity state is a method of actually electrically confirming the continuity between the connection terminal 32a and the connection terminal 34a.
  • FIG. 5 (A), FIG. 5 (B), and FIG. 5 (C) the upper figure is a top view and the lower figure is a front view.
  • FIG. 5A is a diagram corresponding to FIG. 1 and shows a state where the ACF 33 and the flexible substrate 34 are placed on top of the rigid substrate 32.
  • FIG. 5B is a diagram showing a state where the ACF 33 and the flexible substrate 34 are placed on top of the rigid substrate 32 and then pressed slightly by the crimping head 51. Since the connection terminal 32a of the rigid board 32 and the connection terminal 34a of the flexible board 34 protrude from the surface of the board, the pressed ACF 33 flows in the direction of the arrow, and the depression between the adjacent connection terminals 32a and the adjacent connection terminals. Enters the recess between 34a.
  • FIG. 5C is a view showing a state where the pressure is sufficiently pressed by the pressure-bonding head 51.
  • the ACF 33 sufficiently enters the recess between the adjacent connection terminals 32 a and the recess between the adjacent connection terminals 34 a, and the flexible substrate 34 is reliably bonded to the rigid substrate 32.
  • the ACF 33 not only flows into the recess, but also flows outward along the surface of each substrate.
  • the ACF 33 first flows in the direction in which the plurality of connection terminals 32a and 34a are adjacent to each other ( ⁇ direction), and then the volume that cannot be accommodated next is in the direction orthogonal to the ⁇ direction ( ⁇ direction), that is, below the top view. Also flows.
  • the ACF 33 protrudes from the outer edge portion of the rigid substrate 32 or the flexible substrate 34, but the ACF 33 protruding from the outer edge portion is not a uniform amount, and the adjacent connection terminal 32a from the outer edge portion in the vicinity of the connection terminals 32a and 34a. , 34a, the ACF 33 protrudes more at the outer edge near the recess. Therefore, the shape of the outer edge portion of the ACF 33 protruding from the outer edge portion of the rigid substrate 32 or the flexible substrate 34 has a waveform.
  • the waveform of the outer edge portion of the ACF 33 becomes substantially the same shape.
  • the protruding portion has a large protruding amount and the protruding portion has a small protruding amount as shown in FIG.
  • the pressed state of the ACF 33 can be determined, and whether the connection between the connection terminal 32a and the connection terminal 34a is electrically inspected or not can be determined by visual inspection. It is thought that it is possible to do.
  • the outer edge portion of the ACF 33 is in the same position as the outer edge portion of the rigid substrate 32 or the flexible substrate 34 or protrudes before pressing.
  • the outer edge of the ACF 33 may protrude larger than the outer edge of the rigid substrate 32 or the flexible substrate 34 before pressing due to variations in installation in the jig. In such a case, the outer edge of the ACF 33 is noticeable. In the same way, it is difficult to perform visual inspection.
  • the present invention has been made in view of such problems, and a camera module configured to be easily inspected visually when inspecting the continuity of connection terminals of two printed circuit boards, and a method for inspecting the camera module. It is an object of the invention to propose.
  • Patent Document 1 does not describe a configuration or method for inspecting the conduction state of the connection terminal.
  • Anisotropic conduction between a plurality of first connection terminals arranged in parallel on a first printed circuit board made of a rigid board or a flexible board and a plurality of second connection terminals arranged in parallel on a second printed circuit board made of a flexible board A camera module in which a plurality of the first connection terminals and the second connection terminals are electrically connected to each other by interposing a film and pressing with a crimping head, wherein the anisotropic conductive film is mixed with a pressure coloring capsule And the outer edge of the anisotropic conductive film in the second direction orthogonal to the first direction in which the plurality of first connection terminals and the second connection terminals are adjacent to each other before being pressed by the crimping head. At least one of the first printed circuit board and the second printed circuit board is located at the same position as the outer edge part in the second direction, or protrudes from the outer edge part.
  • the outer edge portion of the anisotropic conductive film in two directions is at a position equivalent to the outer edge portion in the second direction of at least one of the first printed circuit board and the second printed circuit board, or protrudes from the outer edge section.
  • the first connection terminal and the second connection are formed according to the color development state of the anisotropic conductive film protruding from the outer edge portion of at least one of the first printed board and the second printed board.
  • the camera module and the camera module inspection method of the present invention when the ACF protruding from between the two printed circuit boards is visually inspected to inspect the conduction state of the connection terminal, the pressure coloring capsule is mixed into the ACF. As a result, the ACF color develops and the connection terminal conduction state can be easily inspected.
  • FIG. 1 It is a perspective view which shows the process of mounting ACF and a flexible substrate in order on the rigid board
  • FIG. 1 1, and the figure which shows the state which piled and mounted ACF33 and the flexible substrate 34 on the upper part of the rigid board
  • (B) is a diagram showing a state in which the ACF 33 and the flexible substrate 34 are placed on top of the rigid substrate 32 and then pressed slightly by the crimping head 51, and (C) is sufficiently pressed by the crimping head 51. It is a figure which shows the state which carried out. It is sectional drawing of the camera module by this embodiment. It is a figure which shows the shape of the edge part of ACF produced by pressing ACF (anisotropic conductive film) in this embodiment, (A) is mounting the ACF3 and the flexible substrate 4 on the upper part of the rigid board
  • FIG. The figure which shows the state which carried out, (B) is a figure which shows the state pressed fully with the crimping
  • FIG. 6 is a sectional view in which a flexible substrate is connected to the camera module.
  • the camera module 1 includes at least an imaging lens 11 and an imaging element 12 including a CCD image sensor, a CMOS image sensor, or the like.
  • an imaging lens 11 When a light image of a subject is formed on the image sensor 12 by the imaging lens 11, it is photoelectrically converted and output as an image signal to an external device such as a portable terminal.
  • the image pickup device 12 is mounted on the rigid substrate 2, and an elongated flexible substrate 4 is connected to the rigid substrate 2 via the ACF 3 in order to output an image signal transmitted to the rigid substrate 2 to an external device.
  • the imaging lens 11 has a lens portion 11a, a flange portion 11b, a fitting surface 11c, and a leg portion 11d.
  • the imaging lens 11 is included in the lens frame 13, and the fitting surface 11 c that is the outer circumferential surface of the imaging lens 11 is fitted to the inner circumferential surface 13 b of the protruding portion 13 a that protrudes from the inner circumferential surface of the lens frame 13 in the central axis direction.
  • the imaging lens 11 is positioned in a direction orthogonal to the optical axis O.
  • the rigid substrate 2 is bonded to one end portion of the lens frame 13 with an adhesive, and the leg portion 11 d of the imaging lens 11 is in contact with the imaging element 12 mounted on the rigid substrate 2.
  • a filter holding plate 15 to which an infrared cut filter 14 is joined is joined to the other end of the lens frame 13.
  • a compression spring 16 is disposed between the flange portion 11 b of the imaging lens 11 protruding in a direction orthogonal to the optical axis O and the filter holding plate 15, and the compression spring 16 moves the imaging lens 11 in the direction of the imaging element 12. Energized. Accordingly, the leg portion 11 d of the imaging lens 11 always abuts on the imaging element 12.
  • the distance between the lens portion 11a of the image pickup lens 11 and the image pickup element 12 is kept constant, and there is no need to adjust the focus individually.
  • a fixed diaphragm plate 17 is joined to the surface of the imaging lens 11 on the infrared cut filter 14 side.
  • the camera module is not limited to the configuration shown in FIG. 6 and may have any configuration.
  • the number of imaging lenses may be two or more, and the positions of the infrared cut filter and the fixed aperture plate may be anywhere.
  • a resistor, a capacitor, or the like may be mounted in addition to the image sensor 12.
  • thermocompression bonding method is the same as the method shown in FIGS.
  • FIG. 7 is a view similar to FIG. 5.
  • the upper view is a top view
  • the lower view is a front view
  • the right view of the lower view is a side view of the upper view from the right side.
  • FIG. 7A is a diagram showing a state in which the ACF 3 and the flexible substrate 4 (second printed circuit board) are placed on top of the rigid substrate 2 (first printed circuit board).
  • FIG. 7B is a diagram showing a state where the pressure is sufficiently pressed by the pressure-bonding head 51 shown in FIG. Thereby, the ACF 3 sufficiently enters the recess between the adjacent connection terminals 2a (first connection terminals) in the rigid substrate 2 and the recess between the adjacent connection terminals 4a (second connection terminals) in the flexible substrate 4, The flexible substrate 4 is securely bonded to the rigid substrate 2. At this time, the ACF 3 not only enters the recess, but also flows outward along the surface of each substrate.
  • the ACF 3 first flows in the direction in which the plurality of connection terminals 2a and 4a are adjacent to each other ( ⁇ direction), and then the volume that cannot be accommodated is the direction orthogonal to the ⁇ direction ( ⁇ direction), that is, below each top view. Also flows. Further, the ACF 3 protrudes from the outer edge portion of the rigid substrate 2 or the flexible substrate 4. However, the ACF 3 protruding from the outer edge portion is not a uniform amount, and the adjacent connection portions from the outer edge portions in the vicinity of the connection terminal 2a and the connection terminal 4a. ACF 3 protrudes more at the outer edge near the recess between the terminals 2a and 4a. Therefore, the shape of the outer edge portion of the ACF 3 protruding from the outer edge portion of the rigid substrate 2 or the flexible substrate 4 has a waveform.
  • the ACF 3 is mixed with a pressure coloring capsule.
  • the pressure coloring capsule is a kind of so-called microcapsule, in which a dye is encapsulated and mixed with a color former, and has a property of coloring when pressed.
  • a 3 to 10 ⁇ m sphere is assumed here.
  • the color can be selected from red, orange, black, blue, green, emerald green, and the color development is irreversible.
  • the pressed portion is colored.
  • the ACF 3 protruding from the outer edge of the rigid substrate 2 and the flexible substrate 4 near the recess between the connection terminals 2a and 4a is partially colored, as shown by the dark shading in the top view of FIG. 7B.
  • the respective colored shapes are substantially the same.
  • the rigid substrate 2 is inclined with respect to the crimping head 51 as shown in FIG. 4, the contact between the connection terminals 2a and the connection terminals 4a is uncertain, and the respective colored shapes are not sure. Will be different. That is, the color development area becomes narrower or the color development itself becomes lighter as it goes from right to left in FIG.
  • connection terminal 2a and connection terminal 4a can be visually inspected.
  • the ACF 3 portion that is colored by pressing must reliably protrude from the outer edge portion 2 b of the rigid substrate 2 and the outer edge portion 4 b of the flexible substrate 4.
  • the outer edge 3a of the ACF 3 in the ⁇ direction (second direction) orthogonal to the ⁇ direction (first direction) adjacent to the plurality of connection terminals 2a and the connection terminals 4a before pressing is the rigid substrate 2 or flexible substrate. 4 is required to be in the same position or projecting from the outer edge portions 2b, 4b in at least one of the second directions.
  • the outer edge portion of the ACF 3 may protrude larger than the outer edge portions 2b and 4b of the rigid substrate 2 or the flexible substrate 4 before pressing due to variations in installation in the jig.
  • the outer edge portion 3a of the ACF 3 However, the colored portion is at a position inside the outer edge 3a of the ACF 3 and can be sufficiently visually inspected.
  • the posture shown in FIG. 7, that is, the camera module 1 shown in FIG. become.
  • the inspection is performed with the posture of FIG. . In this case, it is necessary to configure the camera module 1 so that visual observation is not hindered by the lens frame 13 or the like.
  • the flexible board is connected to the rigid board via the ACF, but the flexible board (second printed board) may be connected to the flexible board (first printed board).
  • the inspection can be done in exactly the same way.

Abstract

L'invention concerne un module de caméra constitué de telle façon que l'état de conductivité de bornes de connexion sur deux cartes à circuits imprimés puisse être facilement contrôlé par observation visuelle lors du contrôle, ainsi qu'un procédé de contrôle du module de caméra. Le présent module de caméra comprend un film conducteur anisotrope intercalé entre une pluralité de premières bornes de connexion placées selon une disposition en rangée sur une première carte à circuit imprimé constituée d'une carte à circuit rigide ou d'une carte à circuit souple, et une pluralité de deuxièmes bornes de connexion placées selon une disposition en rangée sur une deuxième carte à circuit imprimé constituée d'une carte à circuit souple, et crée une conductivité respectivement entre la pluralité de premières bornes de connexion et les deuxièmes bornes de connexion en appuyant avec une tête de liaison par diffusion. Le film conducteur anisotrope est mélangé à des capsules de coloration sensibles à la pression et, avant que la pression ne soit appliquée par la tête de liaison par diffusion, le bord extérieur du film conducteur anisotrope dans une deuxième direction orthogonale à une première direction, dans laquelle la pluralité de premières bornes de connexion et les deuxièmes bornes de connexion sont adjacentes les unes aux autres, dépasse d'un emplacement équivalent à la partie de bord extérieur en question ou de la partie de bord extérieur en question dans la deuxième direction pour la première carte à circuit imprimé et / ou la deuxième carte à circuit imprimé.
PCT/JP2012/055024 2011-03-10 2012-02-29 Module de caméra et procédé de contrôle du module de caméra WO2012121070A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280012005.5A CN103503584A (zh) 2011-03-10 2012-02-29 相机模块以及相机模块的检查方法
JP2013503465A JPWO2012121070A1 (ja) 2011-03-10 2012-02-29 カメラモジュール及びカメラモジュールの検査方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-052454 2011-03-10
JP2011052454 2011-03-10

Publications (1)

Publication Number Publication Date
WO2012121070A1 true WO2012121070A1 (fr) 2012-09-13

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Application Number Title Priority Date Filing Date
PCT/JP2012/055024 WO2012121070A1 (fr) 2011-03-10 2012-02-29 Module de caméra et procédé de contrôle du module de caméra

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Country Link
JP (1) JPWO2012121070A1 (fr)
CN (1) CN103503584A (fr)
WO (1) WO2012121070A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120790A (ja) * 1989-10-03 1991-05-22 Toshiba Corp 配線基板の接続装置
JPH04292803A (ja) * 1991-03-20 1992-10-16 Hitachi Ltd 異方導電性フィルム
JPH07120849B2 (ja) * 1987-06-05 1995-12-20 株式会社リコー 回路基板の接続方法及び装置
JPH08255958A (ja) * 1995-03-15 1996-10-01 Seiko Epson Corp フレキシブル基板及びその接続構造及びその接続方法
JP2009176792A (ja) * 2008-01-22 2009-08-06 Nec Saitama Ltd 熱圧着接続方法、装置及び配線基板
JP2010192652A (ja) * 2009-02-18 2010-09-02 Konica Minolta Opto Inc プリント配線板の接続構造及びカメラモジュール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4966156B2 (ja) * 2007-10-23 2012-07-04 ソニーケミカル＆インフォメーションデバイス株式会社 配線基板の受台及びこれを用いた配線基板の接続装置、接続方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120849B2 (ja) * 1987-06-05 1995-12-20 株式会社リコー 回路基板の接続方法及び装置
JPH03120790A (ja) * 1989-10-03 1991-05-22 Toshiba Corp 配線基板の接続装置
JPH04292803A (ja) * 1991-03-20 1992-10-16 Hitachi Ltd 異方導電性フィルム
JPH08255958A (ja) * 1995-03-15 1996-10-01 Seiko Epson Corp フレキシブル基板及びその接続構造及びその接続方法
JP2009176792A (ja) * 2008-01-22 2009-08-06 Nec Saitama Ltd 熱圧着接続方法、装置及び配線基板
JP2010192652A (ja) * 2009-02-18 2010-09-02 Konica Minolta Opto Inc プリント配線板の接続構造及びカメラモジュール

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JPWO2012121070A1 (ja) 2014-07-17

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