WO2012121070A1

WO2012121070A1 - Camera module and method for inspecting camera module

Info

Publication number: WO2012121070A1
Application number: PCT/JP2012/055024
Authority: WO
Inventors: 清末成憲; 片桐禎人
Original assignee: コニカミノルタアドバンストレイヤー株式会社
Priority date: 2011-03-10
Filing date: 2012-02-29
Publication date: 2012-09-13
Also published as: JPWO2012121070A1; CN103503584A

Abstract

Provided are a camera module constituted such that the conductive state of connecting terminals on two printed circuit boards is easily inspectable by visual observation when inspecting and a method for inspecting the camera module. This camera module has an anisotropic conductive film intervening between a plurality of first connecting terminals provided in a row arrangement on a first printed circuit board formed from a rigid circuit board or a flexible circuit board and a plurality of second connecting terminals provided in a row arrangement on a second printed circuit board formed from a flexible circuit board and creates conductivity respectively between the plurality of first connecting terminals and second connecting terminals by pressing with a pressure bonding head. The anisotropic conductive film is mixed with pressure coloration capsules, and before pressure is applied by the pressure bonding head, the outer edge of the anisotropic conductive film in a second direction orthogonal to a first direction, in which the plurality of first connecting terminals and second connecting terminals are adjacent to each other, protrudes from a location equivalent to that outer edge part or from that outer edge part in the second direction for either or both of the first printed circuit board or second printed circuit board.

Description

Camera module and camera module inspection method

The present invention relates to a camera module in which two substrates are connected by interposing an anisotropic conductive film between a rigid substrate or a flexible substrate and a flexible substrate, and a method for inspecting the camera module.

Conventionally, ultra-small camera modules have been installed in small and thin mobile terminals such as mobile phones and PDAs (Personal Digital Assistants), which enables not only voice communication but also image capture and communication. It has become.

Such a camera module incorporates at least an imaging lens and an imaging device such as a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor. When a light image of a subject is formed on an image sensor by an imaging lens, it is photoelectrically converted and output as an image signal to an external device such as a portable terminal.

The image sensor is mounted on a rigid board, and an elongated flexible board is electrically connected to the rigid board in order to output an image signal transmitted to the rigid board to an external device. In some cases, a flexible substrate having a short or irregular shape is electrically connected.

Here, when connecting a flexible substrate to a rigid substrate, an ACF (Anisotropic Conductive Film, anisotropic conductive film) is used in recent years.

ACF is a film for electrical joining having a thickness of 20 to 30 μm formed of a heat resistant resin. A plurality of conductive particles are dispersed in the surface direction inside the heat-resistant resin, and the conductive particles are formed in 3 to 10 μm spheres in which the resin is coated with nickel or the like. When the anisotropic conductive film disposed between the two printed boards is thermocompression bonded, the connection terminals of the two printed boards come into contact with the conductive particles, and therefore have conductivity in the thickness direction. Become. On the other hand, the conductive particles are dispersed in the heat-resistant resin at a ratio of approximately 10% or less, and since no pressure is applied in the surface direction, the conductive particles do not contact each other and the insulation is maintained. Accordingly, when connecting a plurality of connection terminals provided on two printed boards, the opposing connection terminals are conducted, and adjacent connection terminals are not conducted.

A camera module using such an ACF is disclosed in a patent publication (see, for example, Patent Document 1).

The invention described in Patent Document 1 relates to a printed circuit board connection structure. That is, when the connection terminal provided at the end of the flexible substrate is connected to the connection terminal provided at the end of the rigid substrate via the ACF, if the flexible substrate is warped, the connection terminal of the flexible substrate may be warped and broken. is there. Therefore, the insulating coating is joined together with the connection terminals by ACF.

JP 2010-192652 A

A method of bonding a flexible substrate to a rigid substrate using ACF will be described with reference to FIGS. FIG. 1 is a perspective view showing a process of sequentially placing an ACF and a flexible board on a rigid board of a camera module, FIG. 2 is a perspective view showing a process of crimping the flexible board with a crimping head, and FIG. It is a figure of the camera module by which the flexible substrate was joined to the rigid board | substrate by ACF.

In FIG. 1, reference numeral 31 denotes a camera module to which a rigid board 32 is connected. An imaging element (not shown) is mounted on the back surface of the rigid substrate 32, that is, the lower surface in the figure, and an imaging lens (not shown) is disposed below the imaging element. Therefore, in the camera module shown in FIG. 1, the direction in which the subject is imaged is downward.

A plurality of connection terminals 32 a are arranged on the upper surface of the rigid substrate 32. In this figure, the number of connection terminals 32a is 10 in total, 5 each on the left and right sides. However, in order to clarify the form, the number of connection terminals 32a is actually 10 and is about 20.

The ACF 33 is placed on the rigid substrate 32.

Subsequently, the flexible substrate 34 is placed on the ACF 33.

A plurality of connection terminals 34 a are arranged on the back surface of the flexible substrate 34, that is, the lower surface in the drawing. Each connection terminal 34a is arranged to face the connection terminal 32a, and the number thereof is the same.

As described above, with the ACF 33 and the flexible substrate 34 placed in order on the rigid substrate 32 of the camera module 31, the flexible substrate 34 is crimped by the crimping head 51 heated to a high temperature as shown in FIG. For example, the temperature of the crimping head 51 is 130 to 160 ° C., and the crimping force is 1 to 4 MPa.

As a result, the ACF 33 is crushed thinly as shown in FIG. 3, and the flexible substrate 34 is joined to the rigid substrate 32 via the ACF 33. Is electrically connected.

Here, the camera module 31 is placed on a predetermined jig and the above operation is performed, but the surface of the rigid substrate 32 and the lower surface of the crimping head 51 need to be parallel. In other words, if not parallel, the plurality of connection terminals 32a and the connection terminals 34a are not uniformly connected, and conduction failure may occur in some of the connection terminals. However, in the camera module 31, the rigid board 32 is attached to the camera module main body by bonding or the like, but the rigid board 32 may be attached to be inclined. In some cases, the camera module 31 is tilted and placed on a jig used for crimping by the crimping head 51, and the rigid substrate 32 is tilted.

FIG. 4 shows a state in which the plurality of connection terminals 32a and the connection terminals 34a are thus connected unevenly. 4A is a top view and FIG. 4B is a cross-sectional view.

In FIG. 4, since the rigid board 32 is inclined downward to the left, the ACF 33 is sufficiently pressed on the right side, and the connection terminal 32a and the connection terminal 34a are electrically connected, but the ACF 33 is not sufficiently pressed on the left side. Therefore, there is a possibility that the connection terminal 32a and the connection terminal 34a are poorly connected. Of course, the rigid board 32 may tilt to the right. In this case, the connection terminal 32a and the connection terminal 34a located on the right side may be poorly connected.

As described above, since there is a possibility that a conduction failure may occur when the rigid substrate 32 and the flexible substrate 34 are connected, it is necessary to inspect them.

A method that is normally considered as an inspection for confirming the continuity state is a method of actually electrically confirming the continuity between the connection terminal 32a and the connection terminal 34a. However, in this case, it is necessary to bring the probes into contact with the large number of connection terminals 32a and connection terminals 34a one by one, which increases the work man-hours. It is also possible to manufacture an inspection jig provided with a large number of probes and inspect the continuity of a large number of connection terminals 32a and connection terminals 34a at a time. It is necessary to prepare a large number of inspection jigs, which increases the cost.

Instead of such inspection, visual inspection is also conceivable. That is, since the ACF is compressed in the thickness direction, it is conceivable to visually inspect the shape of the edge of the extended ACF extending in a direction orthogonal to the direction.

The shape of the edge portion of the ACF generated by pressing the ACF in this way will be described with reference to FIG. In each figure of FIG. 5 (A), FIG. 5 (B), and FIG. 5 (C), the upper figure is a top view and the lower figure is a front view.

FIG. 5A is a diagram corresponding to FIG. 1 and shows a state where the ACF 33 and the flexible substrate 34 are placed on top of the rigid substrate 32.

FIG. 5B is a diagram showing a state where the ACF 33 and the flexible substrate 34 are placed on top of the rigid substrate 32 and then pressed slightly by the crimping head 51. Since the connection terminal 32a of the rigid board 32 and the connection terminal 34a of the flexible board 34 protrude from the surface of the board, the pressed ACF 33 flows in the direction of the arrow, and the depression between the adjacent connection terminals 32a and the adjacent connection terminals. Enters the recess between 34a.

FIG. 5C is a view showing a state where the pressure is sufficiently pressed by the pressure-bonding head 51. As a result, the ACF 33 sufficiently enters the recess between the adjacent connection terminals 32 a and the recess between the adjacent connection terminals 34 a, and the flexible substrate 34 is reliably bonded to the rigid substrate 32. At this time, the ACF 33 not only flows into the recess, but also flows outward along the surface of each substrate. As a result, the ACF 33 first flows in the direction in which the plurality of

connection terminals

32a and 34a are adjacent to each other (α direction), and then the volume that cannot be accommodated next is in the direction orthogonal to the α direction (β direction), that is, below the top view. Also flows. Further, the ACF 33 protrudes from the outer edge portion of the rigid substrate 32 or the flexible substrate 34, but the ACF 33 protruding from the outer edge portion is not a uniform amount, and the adjacent connection terminal 32a from the outer edge portion in the vicinity of the

connection terminals

32a and 34a. , 34a, the ACF 33 protrudes more at the outer edge near the recess. Therefore, the shape of the outer edge portion of the ACF 33 protruding from the outer edge portion of the rigid substrate 32 or the flexible substrate 34 has a waveform.

When the ACF 33 is pressed uniformly, the waveform of the outer edge portion of the ACF 33 becomes substantially the same shape. However, when the ACF 33 is pressed unevenly, as shown in FIG. 4 (A), the protruding portion has a large protruding amount and the protruding portion has a small protruding amount as shown in FIG.

Therefore, by looking at the waveform of the protruding ACF 33, the pressed state of the ACF 33 can be determined, and whether the connection between the connection terminal 32a and the connection terminal 34a is electrically inspected or not can be determined by visual inspection. It is thought that it is possible to do.

However, since the normal ACF 33 is translucent, it is very difficult to visually recognize, and it is difficult for an operator to actually inspect visually.

Further, in order to visually recognize the shape of the ACF 33 protruding after pressing, it is necessary that the outer edge portion of the ACF 33 is in the same position as the outer edge portion of the rigid substrate 32 or the flexible substrate 34 or protrudes before pressing. However, the outer edge of the ACF 33 may protrude larger than the outer edge of the rigid substrate 32 or the flexible substrate 34 before pressing due to variations in installation in the jig. In such a case, the outer edge of the ACF 33 is noticeable. In the same way, it is difficult to perform visual inspection.

The present invention has been made in view of such problems, and a camera module configured to be easily inspected visually when inspecting the continuity of connection terminals of two printed circuit boards, and a method for inspecting the camera module. It is an object of the invention to propose.

Note that Patent Document 1 does not describe a configuration or method for inspecting the conduction state of the connection terminal.

The above object is achieved by the invention described below.

1. Anisotropic conduction between a plurality of first connection terminals arranged in parallel on a first printed circuit board made of a rigid board or a flexible board and a plurality of second connection terminals arranged in parallel on a second printed circuit board made of a flexible board A camera module in which a plurality of the first connection terminals and the second connection terminals are electrically connected to each other by interposing a film and pressing with a crimping head, wherein the anisotropic conductive film is mixed with a pressure coloring capsule And the outer edge of the anisotropic conductive film in the second direction orthogonal to the first direction in which the plurality of first connection terminals and the second connection terminals are adjacent to each other before being pressed by the crimping head. At least one of the first printed circuit board and the second printed circuit board is located at the same position as the outer edge part in the second direction, or protrudes from the outer edge part. The camera module according to claim.

2. 2. The camera module according to 1, wherein the first connection terminal is electrically connected to an image sensor.

3. Anisotropic conduction between a plurality of first connection terminals arranged in parallel on a first printed circuit board made of a rigid board or a flexible board and a plurality of second connection terminals arranged in parallel on a second printed circuit board made of a flexible board A method of inspecting a camera module in which a plurality of the first connection terminals and the second connection terminals are made conductive by interposing a film and pressing with a crimping head,
The anisotropic conductive film is mixed with a pressure coloring capsule, and before being pressed by the crimping head, a plurality of the first connection terminals and the second connection terminals are orthogonal to the adjacent first direction. The outer edge portion of the anisotropic conductive film in two directions is at a position equivalent to the outer edge portion in the second direction of at least one of the first printed circuit board and the second printed circuit board, or protrudes from the outer edge section. And
After being pressed by the pressure-bonding head, the first connection terminal and the second connection are formed according to the color development state of the anisotropic conductive film protruding from the outer edge portion of at least one of the first printed board and the second printed board. A method for inspecting a camera module, comprising inspecting a conduction state with a connection terminal.

4. When the anisotropic conductive film protruding from the outer edge portion is uniformly colored in the first direction, it is determined that conduction between the first connection terminal and the second connection terminal is good. 4. The inspection method for the camera module as described in 3 above.

According to the camera module and the camera module inspection method of the present invention, when the ACF protruding from between the two printed circuit boards is visually inspected to inspect the conduction state of the connection terminal, the pressure coloring capsule is mixed into the ACF. As a result, the ACF color develops and the connection terminal conduction state can be easily inspected.

It is a perspective view which shows the process of mounting ACF and a flexible substrate in order on the rigid board | substrate of a camera module. It is a perspective view which shows the process of crimping | bonding a flexible substrate with a crimping | compression-bonding head. It is the figure of the camera module which the crimping | compression-bonding head crimped and the flexible substrate was joined to the rigid board | substrate by ACF. It is a figure which shows the state in which the some connection terminal was connected unevenly, (A) is a top view, (B) is sectional drawing. It is a figure which shows the shape of the edge part of ACF which arises by pressing, (A) is a figure equivalent to FIG. 1, and the figure which shows the state which piled and mounted ACF33 and the flexible substrate 34 on the upper part of the rigid board | substrate 32, (B) is a diagram showing a state in which the ACF 33 and the flexible substrate 34 are placed on top of the rigid substrate 32 and then pressed slightly by the crimping head 51, and (C) is sufficiently pressed by the crimping head 51. It is a figure which shows the state which carried out. It is sectional drawing of the camera module by this embodiment. It is a figure which shows the shape of the edge part of ACF produced by pressing ACF (anisotropic conductive film) in this embodiment, (A) is mounting the ACF3 and the flexible substrate 4 on the upper part of the rigid board | substrate 2. FIG. The figure which shows the state which carried out, (B) is a figure which shows the state pressed fully with the crimping | compression-bonding head 51 shown in FIG.

An example of the camera module according to the present embodiment will be described with reference to FIG. FIG. 6 is a sectional view in which a flexible substrate is connected to the camera module.

The camera module 1 includes at least an imaging lens 11 and an imaging element 12 including a CCD image sensor, a CMOS image sensor, or the like. When a light image of a subject is formed on the image sensor 12 by the imaging lens 11, it is photoelectrically converted and output as an image signal to an external device such as a portable terminal.

The image pickup device 12 is mounted on the rigid substrate 2, and an elongated flexible substrate 4 is connected to the rigid substrate 2 via the ACF 3 in order to output an image signal transmitted to the rigid substrate 2 to an external device.

The imaging lens 11 has a lens portion 11a, a flange portion 11b, a fitting surface 11c, and a leg portion 11d.

The imaging lens 11 is included in the lens frame 13, and the fitting surface 11 c that is the outer circumferential surface of the imaging lens 11 is fitted to the inner circumferential surface 13 b of the protruding portion 13 a that protrudes from the inner circumferential surface of the lens frame 13 in the central axis direction. The imaging lens 11 is positioned in a direction orthogonal to the optical axis O.

On the other hand, the rigid substrate 2 is bonded to one end portion of the lens frame 13 with an adhesive, and the leg portion 11 d of the imaging lens 11 is in contact with the imaging element 12 mounted on the rigid substrate 2.

A filter holding plate 15 to which an infrared cut filter 14 is joined is joined to the other end of the lens frame 13. A compression spring 16 is disposed between the flange portion 11 b of the imaging lens 11 protruding in a direction orthogonal to the optical axis O and the filter holding plate 15, and the compression spring 16 moves the imaging lens 11 in the direction of the imaging element 12. Energized. Accordingly, the leg portion 11 d of the imaging lens 11 always abuts on the imaging element 12.

Thereby, the distance between the lens portion 11a of the image pickup lens 11 and the image pickup element 12 is kept constant, and there is no need to adjust the focus individually.

Further, a fixed diaphragm plate 17 is joined to the surface of the imaging lens 11 on the infrared cut filter 14 side.

Note that the camera module is not limited to the configuration shown in FIG. 6 and may have any configuration. For example, the number of imaging lenses may be two or more, and the positions of the infrared cut filter and the fixed aperture plate may be anywhere. Furthermore, as an electronic component mounted on the rigid board 2, a resistor, a capacitor, or the like may be mounted in addition to the image sensor 12.

Thereafter, the flexible substrate 4 for electrical connection with the portable terminal is thermocompression bonded to the rigid substrate 2 via the ACF 3. The thermocompression bonding method is the same as the method shown in FIGS.

When the flexible substrate 4 is thermocompression bonded to the rigid substrate 2 of the camera module 1 via the ACF 3 and then the continuity between the substrates is inspected, it is visually observed as described in “Problems to be solved by the invention”. A camera module that can solve the problem that it is difficult to perform the inspection will be described below.

7 is a view similar to FIG. 5. In FIGS. 7A and 7B, the upper view is a top view, the lower view is a front view, and the right view of the lower view is a side view of the upper view from the right side. FIG.

FIG. 7A is a diagram showing a state in which the ACF 3 and the flexible substrate 4 (second printed circuit board) are placed on top of the rigid substrate 2 (first printed circuit board).

FIG. 7B is a diagram showing a state where the pressure is sufficiently pressed by the pressure-bonding head 51 shown in FIG. Thereby, the ACF 3 sufficiently enters the recess between the adjacent connection terminals 2a (first connection terminals) in the rigid substrate 2 and the recess between the adjacent connection terminals 4a (second connection terminals) in the flexible substrate 4, The flexible substrate 4 is securely bonded to the rigid substrate 2. At this time, the ACF 3 not only enters the recess, but also flows outward along the surface of each substrate. As a result, the ACF 3 first flows in the direction in which the plurality of

connection terminals

2a and 4a are adjacent to each other (α direction), and then the volume that cannot be accommodated is the direction orthogonal to the α direction (β direction), that is, below each top view. Also flows. Further, the ACF 3 protrudes from the outer edge portion of the rigid substrate 2 or the flexible substrate 4. However, the ACF 3 protruding from the outer edge portion is not a uniform amount, and the adjacent connection portions from the outer edge portions in the vicinity of the connection terminal 2a and the connection terminal 4a. ACF 3 protrudes more at the outer edge near the recess between the

terminals

2a and 4a. Therefore, the shape of the outer edge portion of the ACF 3 protruding from the outer edge portion of the rigid substrate 2 or the flexible substrate 4 has a waveform.

Here, unlike the ACF 33 described above, the ACF 3 is mixed with a pressure coloring capsule. The pressure coloring capsule is a kind of so-called microcapsule, in which a dye is encapsulated and mixed with a color former, and has a property of coloring when pressed. There are various sizes of capsules, but a 3 to 10 μm sphere is assumed here. The color can be selected from red, orange, black, blue, green, emerald green, and the color development is irreversible.

By using ACF3 mixed with such a pressure coloring capsule, when the ACF3 is pressed as shown in FIG. 7B, the pressed portion is colored. For example, the ACF 3 protruding from the outer edge of the rigid substrate 2 and the flexible substrate 4 near the recess between the

connection terminals

2a and 4a is partially colored, as shown by the dark shading in the top view of FIG. 7B. . When the ACF 3 is uniformly pressed and each connection terminal 2a and the connection terminal 4a are reliably connected, the respective colored shapes are substantially the same. On the other hand, when the rigid substrate 2 is inclined with respect to the crimping head 51 as shown in FIG. 4, the contact between the connection terminals 2a and the connection terminals 4a is uncertain, and the respective colored shapes are not sure. Will be different. That is, the color development area becomes narrower or the color development itself becomes lighter as it goes from right to left in FIG.

As described above, by using the ACF 3 in which the pressure coloring capsule is mixed, the color forming shape can be surely recognized, and the conduction state of each connection terminal 2a and connection terminal 4a can be visually inspected. .

Depending on the characteristics and mixing amount of the pressure coloring capsule, color may appear on all of the protruding ACF 3 instead of the partial as shown in FIG. 7 (B). However, as explained in FIGS. Since the protruding portion has a waveform, the visual inspection can be similarly performed using the waveform.

In addition, the ACF 3 portion that is colored by pressing must reliably protrude from the outer edge portion 2 b of the rigid substrate 2 and the outer edge portion 4 b of the flexible substrate 4. For this purpose, the outer edge 3a of the ACF 3 in the β direction (second direction) orthogonal to the α direction (first direction) adjacent to the plurality of connection terminals 2a and the connection terminals 4a before pressing is the rigid substrate 2 or flexible substrate. 4 is required to be in the same position or projecting from the

outer edge portions

2b, 4b in at least one of the second directions.

In this case, the outer edge portion of the ACF 3 may protrude larger than the

outer edge portions

2b and 4b of the rigid substrate 2 or the flexible substrate 4 before pressing due to variations in installation in the jig. In this case, the outer edge portion 3a of the ACF 3 However, the colored portion is at a position inside the outer edge 3a of the ACF 3 and can be sufficiently visually inspected.

If the outer edge 3a of the ACF 3 protrudes at least from the outer edge 4b of the flexible substrate 4 before pressing, the posture shown in FIG. 7, that is, the camera module 1 shown in FIG. become. However, when the outer edge portion 3a of the ACF 3 does not protrude from the outer edge portion 4b of the flexible substrate 4 but protrudes from the outer edge portion 2b of the rigid substrate 2, the inspection is performed with the posture of FIG. . In this case, it is necessary to configure the camera module 1 so that visual observation is not hindered by the lens frame 13 or the like.

In the above embodiment, the flexible board is connected to the rigid board via the ACF, but the flexible board (second printed board) may be connected to the flexible board (first printed board). The inspection can be done in exactly the same way.

The present invention has been described above with reference to the embodiments. However, the present invention is not limited to the embodiments described in the present specification, and it is described in the present specification that other embodiments are included. It will be apparent to those skilled in the art from the embodiments and technical ideas.

DESCRIPTION OF

SYMBOLS

1,31 Camera module 11 Imaging lens 12

Imaging element

2,32

Rigid board

2a, 4a, 32a,

34a Connection terminal

2b, 3a, 4b

Outer edge part

3,33 ACF
4,34 Flexible substrate 51 Crimp head

Claims

Anisotropic conduction between a plurality of first connection terminals arranged in parallel on a first printed circuit board made of a rigid board or a flexible board and a plurality of second connection terminals arranged in parallel on a second printed circuit board made of a flexible board A camera module in which a plurality of the first connection terminals and the second connection terminals are made conductive by interposing a film and pressing with a crimping head,
The anisotropic conductive film is mixed with a pressure coloring capsule, and before being pressed by the crimping head, a plurality of the first connection terminals and the second connection terminals are orthogonal to the adjacent first direction. The outer edge portion of the anisotropic conductive film in two directions is at a position equivalent to the outer edge portion in the second direction of at least one of the first printed circuit board and the second printed circuit board, or protrudes from the outer edge section. A camera module characterized by comprising:
The camera module according to claim 1, wherein the first connection terminal is electrically connected to the image sensor.
Anisotropic conduction between a plurality of first connection terminals arranged in parallel on a first printed circuit board made of a rigid board or a flexible board and a plurality of second connection terminals arranged in parallel on a second printed circuit board made of a flexible board A method of inspecting a camera module in which a plurality of the first connection terminals and the second connection terminals are made conductive by interposing a film and pressing with a crimping head,
The anisotropic conductive film is mixed with a pressure coloring capsule, and before being pressed by the crimping head, a plurality of the first connection terminals and the second connection terminals are orthogonal to the adjacent first direction. The outer edge portion of the anisotropic conductive film in two directions is at a position equivalent to the outer edge portion in the second direction of at least one of the first printed circuit board and the second printed circuit board, or protrudes from the outer edge section. And
After being pressed by the pressure-bonding head, the first connection terminal and the second connection are formed according to the color development state of the anisotropic conductive film protruding from the outer edge portion of at least one of the first printed board and the second printed board. A method for inspecting a camera module, comprising inspecting a conduction state with a connection terminal.
When the anisotropic conductive film protruding from the outer edge portion is uniformly colored in the first direction, it is determined that conduction between the first connection terminal and the second connection terminal is good. The method for inspecting a camera module according to claim 3.