CN103503584A - Camera module and method for inspecting camera module - Google Patents
Camera module and method for inspecting camera module Download PDFInfo
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- CN103503584A CN103503584A CN201280012005.5A CN201280012005A CN103503584A CN 103503584 A CN103503584 A CN 103503584A CN 201280012005 A CN201280012005 A CN 201280012005A CN 103503584 A CN103503584 A CN 103503584A
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- Prior art keywords
- circuit board
- splicing ear
- pcb
- outer edge
- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Provided are a camera module constituted such that the conductive state of connecting terminals on two printed circuit boards is easily inspectable by visual observation when inspecting and a method for inspecting the camera module. This camera module has an anisotropic conductive film intervening between a plurality of first connecting terminals provided in a row arrangement on a first printed circuit board formed from a rigid circuit board or a flexible circuit board and a plurality of second connecting terminals provided in a row arrangement on a second printed circuit board formed from a flexible circuit board and creates conductivity respectively between the plurality of first connecting terminals and second connecting terminals by pressing with a pressure bonding head. The anisotropic conductive film is mixed with pressure coloration capsules, and before pressure is applied by the pressure bonding head, the outer edge of the anisotropic conductive film in a second direction orthogonal to a first direction, in which the plurality of first connecting terminals and second connecting terminals are adjacent to each other, protrudes from a location equivalent to that outer edge part or from that outer edge part in the second direction for either or both of the first printed circuit board or second printed circuit board.
Description
Technical field
The present invention relates to make anisotropic conductive film between between rigid circuit board or flexible PCB and flexible PCB and be connected the inspection method of camera model and this camera model of two circuit boards.
Background technology
In the past, subminiature camera model was equipped on mobile phone or PDA(Personal Digital Assistant, personal digital assistant) etc. small-sized and slim portable terminal, the not only communication of sound thus, the shooting of image or the communication possibility that also becomes.
At least built-in pick-up lens of such camera model, by CCD(Charge Coupled Device, charge coupled device) imaging apparatus that type imageing sensor or CMOS(Complementary Metal-Oxide Semiconductor, complementary metal oxide semiconductors (CMOS)) type imageing sensor etc. forms.If the optical image of subject images in imaging apparatus by light-to-current inversion by pick-up lens, export the external equipment of portable terminal etc. to as picture signal.
Imaging apparatus is installed on rigid circuit board, and for the image signal output that will be transferred into rigid circuit board, to external equipment, elongated flexible PCB is electrically connected to rigid circuit board.In addition, the situation that also exists the flexible PCB of short or special-shaped shape to be electrically connected.
At this, when flexible PCB is connected to rigid circuit board, in recent years use ACF(Anisotropic Conductive Film, anisotropic conductive film).
ACF is that the electricity of thickness 20～30 μ m that formed by heat-resistant resin engages and uses film.In the inside of heat-resistant resin, a plurality of conducting particless are dispersed to the face direction, and this conducting particles forms the spheroid with 3～10 μ m of the covering resins such as nickel.If the anisotropic conductive film configured between two printed circuit board (PCB)s is by hot pressing, the splicing ear of two printed circuit board (PCB)s and each conducting particles butt, therefore have conductivity at thickness direction.On the other hand, due to conducting particles in the inside of heat-resistant resin with the ratios diverge below 10% roughly, and do not exert pressure on the face direction, so contactless and keep insulating properties between conducting particles.Thereby, during a plurality of splicing ear of arranging separately in being bonded on two printed circuit board (PCB)s, opposed splicing ear conducting, adjacent not conducting of splicing ear.
Used the camera model of such ACF to be disclosed in patent gazette (for example,, with reference to patent documentation 1).
The described invention of patent documentation 1 relates to connection structure of printed circuit board.That is, the splicing ear that will arrange in the end of flexible PCB with in the situation that the splicing ear of the end setting of rigid circuit board via ACF, be connected, if by the flexible PCB turn-over also turn-over and the danger of fracture is arranged of splicing ear of flexible PCB.Therefore, together with splicing ear, insulating coating also engages by ACF.
The prior art document
Patent documentation
Patent documentation 1: JP 2010-192652 communique
Summary of the invention
The problem that invention will solve
Illustrate and use ACF flexible PCB to be engaged to the method for rigid circuit board with reference to Fig. 1～Fig. 3.Fig. 1 means the stereogram of step that ACF and flexible PCB is placed in order to the rigid circuit board of camera model, Fig. 2 means the stereogram by the step of crimp head crimping by flexible PCB, Fig. 3 is by the crimp head crimping, is engaged to the figure of the camera model of rigid circuit board by the ACF flexible PCB.
In Fig. 1, the 31st, camera model, be connected rigid circuit board 32.At the back side of rigid circuit board 32, i.e. the not shown imaging apparatus of installation below figure, the not shown pick-up lens of configuration below this imaging apparatus.Thereby, in the camera model shown in Fig. 1, the direction of taking subject is below.
Upper surface at rigid circuit board 32 configures a plurality of splicing ear 32a.In this figure, each 5 of the number of splicing ear 32a left and right are described 10 altogether, but form is clear only is made as 10 in order to make, and actual is 20 left and right.
ACF33 is placed on top at this rigid circuit board 32.
Next, place flexible PCB 34 on the top of ACF33.
At the back side of flexible PCB 34, i.e. a plurality of splicing ear 34a of configuration below figure.Each splicing ear 34a and splicing ear 32a are opposed and be configured, and its number is identical.
Like this, on the top of the rigid circuit board 32 of camera model 31, place in order under the state of ACF33 and flexible PCB 34, as shown in Figure 2, by the crimp head 51 crimping flexible PCBs 34 that are heated to high temperature.For example, the temperature of crimp head 51 is 130～160 ℃, and crimp force is 1～4MPa.
Thus, ACF33 is squeezed into thinlyyer as shown in Figure 3, via ACF33 flexible PCB 34, is engaged to rigid circuit board 32, and simultaneously by the conducting particles of ACF33, the splicing ear 34a of flexible PCB 34 is electrically connected to the splicing ear 32a of rigid circuit board 32.
At this, configuration camera model 31 and carry out above-mentioned operation in the utensil of regulation, but need the following parallel of the face of rigid circuit board 32 and crimp head 51.That is, if not parallel, can not connect equably a plurality of splicing ear 32a and splicing ear 34a, have the situation that produces poor flow in a part of splicing ear.But, although exist rigid circuit board 32 in camera model 31 to wait and be mounted by bonding in the camera model main body, rigid circuit board 32 is tilted the situation of installation.In addition, also exist camera model 31 in the utensil by crimp head 51 crimping the time to be tilted configuration, the situation that rigid circuit board 32 tilts.
The state that a plurality of like this splicing ear 32a are connected unevenly with splicing ear 34a as shown in Figure 4.Fig. 4 (A) is vertical view, and Fig. 4 (B) is sectional view.
In Fig. 4 because rigid circuit board 32 tilts to left down, so pressed and splicing ear 32a and splicing ear 34a conducting fully at right-hand ACF33, but become insufficient pressing of left ACF33, exist splicing ear 32a and splicing ear 34a to become the danger of poor flow.Certainly, the situation that also exists rigid circuit board 32 to have a down dip to the right, exist in this situation and be positioned at the danger that right-hand splicing ear 32a and splicing ear 34a become poor flow.
As more than, owing to there being the danger that poor flow occurs when connecting rigid circuit board 32 and flexible PCB 34, therefore must be checked.
As the inspection of confirming conducting state, what usually consider is that the conducting of the reality of splicing ear 32a and splicing ear 34a is carried out to the method that electricity is confirmed.But, in this situation, need to make detector to contact one by one a plurality of splicing ear 32a and splicing ear 34a, it is large that work procedures becomes.In addition, also can make the inspection utensil that is provided with a plurality of detectors, once check the conducting state of a plurality of splicing ear 32a and splicing ear 34a, but also need to prepare a plurality of inspection utensils in the situation that manufacture the camera model of many kinds, its expense uprises.
Replace such inspection, also consider visual inspection.That is, consider therefore to extend to the direction with this direction quadrature due to thickness direction compression ACF, the shape of the edge part of the ACF after extending is carried out to visual examination.
The shape of the edge part of the ACF that presses ACF like this and produce is described with reference to Fig. 5.In each figure of Fig. 5 (A), Fig. 5 (B), Fig. 5 (C), upper figure is vertical view, and figure below is front elevation.
Fig. 5 (A) is the figure that is equivalent to Fig. 1, means the figure of the state of overlapping placement ACF33 and flexible PCB 34 on the top of rigid circuit board 32.
Fig. 5 (B) means after the top of rigid circuit board 32 overlapping placement ACF33 and flexible PCB 34, the figure of the state of being pressed a little by crimp head 51.Because the splicing ear 34a of the splicing ear 32a of rigid circuit board 32 and flexible PCB 34 is more outstanding than the face of circuit board, so the ACF33 be pressed flows to the direction of arrow, enter the recess between recess between adjacent splicing ear 32a and adjacent splicing ear 34a.
Fig. 5 (C) means the figure of the state of being pressed fully by crimp head 51.Thus, ACF33 enters the recess between recess between adjacent splicing ear 32a and adjacent splicing ear 34a fully, and flexible PCB 34 is engaged to rigid circuit board 32 reliably.Now, ACF33 not only flows to this recess, and flows along the face outward direction of each circuit board.Its result, at first ACF33 flows to a plurality of splicing ear 32a, direction (α direction) that 34a is adjacent, the volume then do not held fully also to the direction with α direction quadrature (β direction), be that the below of vertical view is mobile.And then, the outer edge of ACF33 specific rigidity circuit board 32 or flexible PCB 34 is outstanding, but outstanding ACF33 is not uniform amount than this outer edge, compared with near the outer edge of splicing ear 32a, 34a, near the outer edge ACF33 of the recess between adjacent splicing ear 32a, 34a is outstanding more.Thereby the shape of the outer edge of the ACF33 that the outer edge of specific rigidity circuit board 32 or flexible PCB 34 is outstanding becomes waveform.
When ACF33 is pressed equably, the waveform of the outer edge of ACF33 becomes roughly the same shape.But, when ACF33 is pressed unevenly, as shown in Fig. 4 (A), the part overhang of pressing pressure is large, the part overhang a little less than pressing is little.
Thereby the corrugated shape of seeing outstanding like this ACF33 if think, can judge the pressed state of ACF33, even the conducting state of splicing ear 32a and splicing ear 34a is looked in not electric-examination, also can carry out fine or not differentiation by visual inspection.
But, because common ACF33 is translucent, carry out visuognosis so very difficult, in fact the operator is difficult by visual the inspection.
In addition, for the shape that rear outstanding ACF33 is pressed in visuognosis, before pressing, the outer edge of ACF33 need to be present in the position equal with the outer edge of rigid circuit board 32 or flexible PCB 34, or outstanding.But, also there is the deviation owing to arranging in utensil, the outer edge of the outer edge specific rigidity circuit board 32 of ACF33 or flexible PCB 34 outstanding situation significantly before pressing, outer edge at ACF33 in such situation does not produce significant waveform, by visual the inspection, is similarly difficult.
The present invention completes in view of this problem, and the purpose of invention is, proposes to be configured to when the conducting state of the splicing ear that checks two printed circuit board (PCB)s, by the inspection method of the visual camera model that can easily check and camera model.
In addition, do not put down in writing structure or the method for the conducting state for checking splicing ear in patent documentation 1.
For solving the means of problem
Above-mentioned purpose is reached by the invention of following record.
1. a camera model, between a plurality of the 2nd splicing ears that anisotropic conductive film is set up in parallel in a plurality of the 1st splicing ears that are set up in parallel in the 1st printed circuit board (PCB) consisted of rigid circuit board or flexible PCB and the 2nd printed circuit board (PCB) that consisting of flexible PCB, make a plurality of described the 1st splicing ears and described the 2nd splicing ear conducting separately by being pressed by crimp head, it is characterized in that, sneak into pressurization color development capsule in described anisotropic conductive film, and before being pressed by crimp head, with the outer edge of the described anisotropic conductive film of the 2nd direction of a plurality of described the 1st splicing ears and adjacent the 1st direction quadrature of described the 2nd splicing ear be the position equal with the outer edge of at least either party's of described the 1st printed circuit board (PCB) or described the 2nd printed circuit board (PCB) described the 2nd direction, perhaps outstanding than this outer edge.
As described in 1 described camera model, it is characterized in that described the 1st splicing ear and imaging apparatus conducting.
3. the inspection method of a camera model, between a plurality of the 2nd splicing ears that this camera model is set up in parallel anisotropic conductive film in a plurality of the 1st splicing ears that are set up in parallel in the 1st printed circuit board (PCB) consisted of rigid circuit board or flexible PCB and the 2nd printed circuit board (PCB) that consisting of flexible PCB, make a plurality of described the 1st splicing ears and described the 2nd splicing ear conducting separately by being pressed by crimp head, it is characterized in that
Sneak into pressurization color development capsule in described anisotropic conductive film, and before being pressed by crimp head, with the outer edge of the described anisotropic conductive film of the 2nd direction of a plurality of described the 1st splicing ears and adjacent the 1st direction quadrature of described the 2nd splicing ear be the position equal with the outer edge of at least either party's of described the 1st printed circuit board (PCB) or described the 2nd printed circuit board (PCB) described the 2nd direction, perhaps outstanding than this outer edge
After being pressed by crimp head, the color development situation of the described anisotropic conductive film that the outer edge by least either party than described the 1st printed circuit board (PCB) or described the 2nd printed circuit board (PCB) is outstanding, check the conducting state of described the 1st splicing ear and described the 2nd splicing ear.
As described in the inspection method of 3 described camera models, it is characterized in that, than described outer edge, outstanding described anisotropic conductive film on described the 1st direction equably during color development, is judged to be described the 1st splicing ear and described the 2nd splicing ear conducting is good.
The invention effect
Inspection method according to camera model of the present invention and camera model, due to when carrying out visuognosis from outstanding ACF between two printed circuit board (PCB)s and check the conducting state of splicing ear, sneak into pressurization color development capsule (pressure coloration capsules) in ACF, therefore ACF color development, can easily check the conducting state of splicing ear.
The accompanying drawing explanation
Fig. 1 means the stereogram of placing in order the step of ACF and flexible PCB in the rigid circuit board of camera model.
Fig. 2 means the stereogram by the step of crimp head crimping by flexible PCB.
Fig. 3 is by the crimp head crimping, the figure by ACF to the camera model of rigid circuit board connecting flexible circuit board.
Fig. 4 means the figure of the state that a plurality of splicing ears connect unevenly, is (A) vertical view, is (B) sectional view.
Fig. 5 means the figure of shape of the edge part of the ACF that presses and produce, (A) mean the figure that is equivalent to Fig. 1, the figure of the state of overlapping placement ACF33 and flexible PCB 34 on the top of rigid circuit board 32, (B) mean after the top of rigid circuit board 32 overlapping placement ACF33 and flexible PCB 34, the figure of the state of being pressed a little by crimp head 51, (C) mean the figure of the state of being pressed fully by crimp head 51.
Fig. 6 is the sectional view of the camera model of present embodiment.
Fig. 7 means in present embodiment and presses the ACF(anisotropic conductive film) and the figure of the shape of the edge part of the ACF that produces, (A) mean the figure of the state of overlapping placement ACF3 and flexible PCB 4 on the top of rigid circuit board 2, (B) mean the figure of the state of being pressed fully by crimp head 51 as shown in Figure 2.
Embodiment
One example of the camera model of present embodiment is described with reference to Fig. 6.Fig. 6 is the sectional view that has connected flexible PCB in camera model.
At least built-in pick-up lens 11 of camera model 1, the imaging apparatus 12 formed by CCD type imageing sensor or CMOS type imageing sensor etc.If the optical image of subject images in 12 of imaging apparatuss by light-to-current inversion by pick-up lens 11, the external equipment as image signal output to portable terminal etc.
Pick-up lens 11 has camera lens part 11a, flange part 11b, chimeric surface 11c and the 11d of foot.
Be wrapped in picture frame 13 in pick-up lens 11, as the chimeric surface 11c of the outer peripheral face of pick-up lens 11 from the inner peripheral surface of picture frame 13 with chimeric to the inner peripheral surface 13b of outstanding protuberance 13a to central shaft, pick-up lens 11 is positioned on the direction with optical axis O quadrature.
On the other hand, in an end of picture frame 13, with binding agent, engage rigid circuit board 2, the 11d of the foot butt of pick-up lens 11 is to the imaging apparatus 12 that is installed on rigid circuit board 2.
Be engaged the filter holding plate 15 of IR-cut filter 14 in another engaged at end of picture frame 13.To and the flange part 11b of the outstanding pick-up lens 11 of the direction of optical axis O quadrature and filter holding plate 15 between configuration Compress Spring 16, Compress Spring 16 is the direction application of force to imaging apparatus 12 by pick-up lens 11.Thereby, the 11d of foot of pick-up lens 11 all the time butt to imaging apparatus 12.
Thus, the camera lens part 11a of pick-up lens 11 and the interval of imaging apparatus 12 remain necessarily, do not need to carry out separately the focus adjustment.
In addition, the face in IR-cut filter 14 sides of pick-up lens 11 engages fixed aperture 17.
In addition, camera model is not limited to the structure shown in Fig. 6, can be also any structure.For example, pick-up lens can be also that more than two, the position of IR-cut filter or fixed aperture also can be at an arbitrary position.And then, as the electronic unit that is installed on rigid circuit board 2, also resistance or capacitor etc. can be installed beyond imaging apparatus 12.
Then, in rigid circuit board 2, will carry out hot pressing via ACF3 for the flexible PCB 4 be electrically connected to portable terminal.The method of this hot pressing is identical with the method shown in Fig. 1～Fig. 3.
Below explanation can solve the camera model of following problem, in the rigid circuit board 2 of such camera model 1, flexible PCB 4 is carried out to hot pressing via ACF3, be then difficult problem by visual the inspection when the conducting between the check circuit plate as described in " problem that invention will solve ".
Fig. 7 is the figure identical with Fig. 5, and in Fig. 7 (A), (B), upper figure is vertical view, and figure below is front elevation, and right-hand figure of figure below takes a fancy to the side view of figure from right.
Fig. 7 (A) means the 1st printed circuit board (PCB) at rigid circuit board 2() the overlapping placement in top ACF3 and flexible PCB 4(the 2nd printed circuit board (PCB)) the figure of state.
Fig. 7 (B) means the figure of the state of being pressed fully by crimp head 51 shown in Fig. 2.Thus, ACF3 fully enters adjacent splicing ear 2a(the 1st splicing ear in rigid circuit board 2) between recess and adjacent splicing ear 4a(the 2nd splicing ear in flexible PCB 4) between recess, flexible PCB 4 is engaged to rigid circuit board 2 reliably.Now, ACF3 not only enters to this recess, and also the face along each circuit board flows to outer direction.Its result, at first ACF3 flows to a plurality of splicing ear 2a, direction (α direction) that 4a is adjacent, the volume then do not held fully also to the direction with α direction quadrature (β direction), be that the below of each vertical view is mobile.And then, the outer edge of ACF3 specific rigidity circuit board 2 or flexible PCB 4 is outstanding, but this ACF3 more outstanding than outer edge is not uniform amount, compared with near the outer edge of splicing ear 2a and 4a, near the ACF3 of the outer edge of the recess between adjacent splicing ear 2a, 4a is outstanding more.Thereby the shape of the outer edge of the ACF3 that the outer edge of specific rigidity circuit board 2 or flexible PCB 4 is outstanding becomes waveform.
At this, ACF3, from described ACF33 is different before, sneaks into pressurization color development capsule.Pressurization color development capsule is a kind of of so-called microcapsules, is capsule dyestuff is encapsulated and that mix with colour former, the character of color development while having pressurization.The size of capsule has various, but is envisioned for the spheroid of 3～10 μ m at this.It is red, orange, black, blue, green, emerald green etc. that color can be selected, and its color development is irreversible.
By using such ACF3 that sneaks into pressurization color development capsule, if ACF3 as Fig. 7 (B) is pressed, the part color development be pressed.For example, in the vertical view of Fig. 7 (B) as shown in close net, the outstanding ACF3 color development partly than the outer edge of near the rigid circuit board 2 of the recess between splicing ear 2a, 4a or flexible PCB 4.At ACF3, pressed equably, splicing ear 2a separately and splicing ear 4a are reliably in the situation of conducting, and color development shape separately becomes roughly the same.On the other hand, in the situation that rigid circuit board 2 tilts with respect to crimp head 51 as shown in Figure 4, pressed unevenly, splicing ear 2a separately and the conducting of splicing ear 4a are also unreliable, color development shape difference separately.That is, along with the right left from Fig. 4 carries out, the color development area narrows down, and color development itself is thin out.
Like this, sneak into the ACF3 of pressurization color development capsule by use, visuognosis color development shape reliably, can be by visual examination splicing ear 2a separately and the conducting state of splicing ear 4a.
In addition, by characteristic or the mixed volume of pressurization color development capsule, as shown in Fig. 7 (B), exist the whole of outstanding ACF3 rather than part by the situation of color development, but because the such outstanding part of explanation in Fig. 4～5 becomes waveform, therefore can pass through waveform, similarly carry out visual examination.
In addition, by pressing, the outer edge 4b of the outer edge 2b of the necessary specific rigidity circuit board 2 of the part of the ACF3 of color development or flexible PCB 4 is more outstanding.Therefore, before pressing, with the outer edge 3a of the ACF3 of the β direction (the 2nd direction) of a plurality of splicing ear 2a and adjacent α direction (the 1st direction) quadrature of splicing ear 4a need to be outer edge 2b, the 4b same position or outstanding with at least either party's of rigid circuit board 2 or flexible PCB 4 the 2nd direction.
Now, deviation owing to arranging in utensil, the outer edge specific rigidity circuit board 2 of existence ACF3 before pressing or the outstanding more greatly situation of outer edge 2b, 4b of flexible PCB 4, now in the 3a of the outer edge of ACF3, do not produce significant waveform, but the part of color development becomes the waveform of visual examination fully in the position of the 3a inboard, outer edge than ACF3.
In addition, if before pressing, the outer edge 3a of ACF3 is at least outstanding than the outer edge 4b of flexible PCB 4, becomes posture as shown in Figure 7,, under the state that camera model 1 is as shown in Figure 6 stood upside down, checks.But, outstanding unlike the outer edge 4b of flexible PCB 4 at the outer edge of ACF3 3a, and, in the outstanding situation of the outer edge 2b of specific rigidity circuit board 2, become so that the posture that the posture of Fig. 7 is stood upside down is checked.Now, camera model 1 need to be configured in picture frame 13 grades, do not hinder visual.
In the above embodiment, be configured to via ACF flexible PCB is connected to rigid circuit board, even but be configured to, flexible PCB (the 2nd printed circuit board (PCB)) is connected to flexible PCB (the 1st printed circuit board (PCB)), also can be fully similarly checked.
Above, with reference to execution mode, the present invention has been described, but to those skilled in the art, execution mode given this description and the thought of technology, understand that the present invention is not limited to the described execution mode of this specification, and comprise other execution modes.
Label declaration
1,31 camera models
11 pick-up lenss
12 imaging apparatuss
2,32 rigid circuit boards
2a, 4a, 32a, 34a splicing ear
2b, 3a, 4b outer edge
3、33?ACF
4,34 flexible PCBs
51 crimp head
Claims (4)
1. a camera model, between a plurality of the 2nd splicing ears that anisotropic conductive film is set up in parallel in a plurality of the 1st splicing ears that are set up in parallel in the 1st printed circuit board (PCB) consisted of rigid circuit board or flexible PCB and the 2nd printed circuit board (PCB) that consisting of flexible PCB, make a plurality of described the 1st splicing ears and described the 2nd splicing ear conducting separately by being pressed by crimp head, it is characterized in that
Sneak into pressurization color development capsule in described anisotropic conductive film, and before being pressed by crimp head, with the outer edge of the described anisotropic conductive film of the 2nd direction of a plurality of described the 1st splicing ears and adjacent the 1st direction quadrature of described the 2nd splicing ear be the position equal with the outer edge of at least either party's of described the 1st printed circuit board (PCB) or described the 2nd printed circuit board (PCB) described the 2nd direction, or than this outer edge outstanding position.
2. camera model as claimed in claim 1, is characterized in that,
Described the 1st splicing ear and imaging apparatus conducting.
3. the inspection method of a camera model, between a plurality of the 2nd splicing ears that this camera model is set up in parallel anisotropic conductive film in a plurality of the 1st splicing ears that are set up in parallel in the 1st printed circuit board (PCB) consisted of rigid circuit board or flexible PCB and the 2nd printed circuit board (PCB) that consisting of flexible PCB, make a plurality of described the 1st splicing ears and described the 2nd splicing ear conducting separately by being pressed by crimp head, it is characterized in that
Sneak into pressurization color development capsule in described anisotropic conductive film, and before being pressed by crimp head, with the outer edge of the described anisotropic conductive film of the 2nd direction of a plurality of described the 1st splicing ears and adjacent the 1st direction quadrature of described the 2nd splicing ear be the position equal with the outer edge of at least either party's of described the 1st printed circuit board (PCB) or described the 2nd printed circuit board (PCB) described the 2nd direction, or than this outer edge outstanding position
After being pressed by crimp head, the color development situation of the described anisotropic conductive film that the outer edge by least either party than described the 1st printed circuit board (PCB) or described the 2nd printed circuit board (PCB) is outstanding, check the conducting state of described the 1st splicing ear and described the 2nd splicing ear.
4. the inspection method of camera model as claimed in claim 3, is characterized in that,
Than described outer edge, outstanding described anisotropic conductive film is on described the 1st direction equably during color development, is judged to be described the 1st splicing ear and described the 2nd splicing ear conducting is good.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-052454 | 2011-03-10 | ||
| JP2011052454 | 2011-03-10 | ||
| PCT/JP2012/055024 WO2012121070A1 (en) | 2011-03-10 | 2012-02-29 | Camera module and method for inspecting camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103503584A true CN103503584A (en) | 2014-01-08 |
Family
ID=46798038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280012005.5A Pending CN103503584A (en) | 2011-03-10 | 2012-02-29 | Camera module and method for inspecting camera module |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2012121070A1 (en) |
| CN (1) | CN103503584A (en) |
| WO (1) | WO2012121070A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255958A (en) * | 1995-03-15 | 1996-10-01 | Seiko Epson Corp | Flexible board, and structure and method for its connection |
| JP2009176792A (en) * | 2008-01-22 | 2009-08-06 | Nec Saitama Ltd | Thermocompression bonding method, apparatus, and wiring board |
| JP2010192652A (en) * | 2009-02-18 | 2010-09-02 | Konica Minolta Opto Inc | Printed wiring board connection structure and camera module |
| CN101836517A (en) * | 2007-10-23 | 2010-09-15 | 索尼化学&信息部件株式会社 | Wiring board receiving plate, and device and method for connection of wiring board using same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07120849B2 (en) * | 1987-06-05 | 1995-12-20 | 株式会社リコー | Method and device for connecting circuit boards |
| JPH03120790A (en) * | 1989-10-03 | 1991-05-22 | Toshiba Corp | Connecting device for wiring board |
| JPH04292803A (en) * | 1991-03-20 | 1992-10-16 | Hitachi Ltd | Anisotropic conductive film |
-
2012
- 2012-02-29 JP JP2013503465A patent/JPWO2012121070A1/en active Pending
- 2012-02-29 WO PCT/JP2012/055024 patent/WO2012121070A1/en active Application Filing
- 2012-02-29 CN CN201280012005.5A patent/CN103503584A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255958A (en) * | 1995-03-15 | 1996-10-01 | Seiko Epson Corp | Flexible board, and structure and method for its connection |
| CN101836517A (en) * | 2007-10-23 | 2010-09-15 | 索尼化学&信息部件株式会社 | Wiring board receiving plate, and device and method for connection of wiring board using same |
| JP2009176792A (en) * | 2008-01-22 | 2009-08-06 | Nec Saitama Ltd | Thermocompression bonding method, apparatus, and wiring board |
| JP2010192652A (en) * | 2009-02-18 | 2010-09-02 | Konica Minolta Opto Inc | Printed wiring board connection structure and camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012121070A1 (en) | 2014-07-17 |
| WO2012121070A1 (en) | 2012-09-13 |
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