JPH08255958A - Flexible board, and structure and method for its connection - Google Patents

Flexible board, and structure and method for its connection

Info

Publication number
JPH08255958A
JPH08255958A JP7056327A JP5632795A JPH08255958A JP H08255958 A JPH08255958 A JP H08255958A JP 7056327 A JP7056327 A JP 7056327A JP 5632795 A JP5632795 A JP 5632795A JP H08255958 A JPH08255958 A JP H08255958A
Authority
JP
Japan
Prior art keywords
flexible substrate
conductive
conductive pattern
adhesive
coloring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7056327A
Other languages
Japanese (ja)
Inventor
Hisanori Maruyama
久則 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP7056327A priority Critical patent/JPH08255958A/en
Publication of JPH08255958A publication Critical patent/JPH08255958A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PURPOSE: To obtain a flexible board in which the state of a pressurization can be grasped visually and in which a connection state is controlled easily by a method wherein at least two kinds of coloring members are used in an adhesive conductive member. CONSTITUTION: When a flexible board and an LCD panel are connected, conductive elements 7 as will as first pigment balls 1' and second pigment balls 1" are scattered in an adhesive conductive member 10 for a heat seal. The strength of the conductive elements is sufficient as compared with that of the pigment balls, and the continuity elements are not destroyed by a pressurization operation when the heat seal is connected. The diameter of the pigment balls 1' is a little larger than, or equal to, the size of a desired gap 6, and every first pigment is sealed inside a ball shell. On the other hand, the second pigment balls 1" are pigment balls whose diameter is smaller than the size of the desired gap 6, and every second pigment is sealed inside a ball shell. When a pressurization in their connection is proper and the gap 6 is a desired size, only the pigment balls 1' which are larger are destroyed, and the adhesive conductive member looks like the color of the first pigment.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、フレキシブル基板及び
その接続構造及びその接続方法に関し、特に液晶表示素
子に接続するフレキシブル基板に好適のものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible substrate, a connecting structure therefor, and a connecting method therefor, and is particularly suitable for a flexible substrate connected to a liquid crystal display device.

【0002】[0002]

【従来の技術】フレキシブル基板の構造について、フレ
キシブル基板と液晶表示素子(以下LCDパネルと称
す)との接続構造を例にあげ、以下に説明する。
2. Description of the Related Art The structure of a flexible substrate will be described below by taking a connection structure between a flexible substrate and a liquid crystal display element (hereinafter referred to as an LCD panel) as an example.

【0003】図3は従来のフレキシブル基板の接続構造
であり、4はフレキシブルテープでありポリエステル等
の樹脂でできた可撓性基材(厚さ約30ミクロン)から
なり、8はフレキシブルテープの導電パターンであり銀
や黒鉛の微小粒子を印刷して形成される。5はガラス等
でできているLCDパネル、9はLCDパネルの透明電
極であり、LCDパネルの表面にITO膜など(厚さ数
ミクロン)により形成されている。10は接着導電部材
であり、その接着導電部材には導通素子7(以下樹脂ボ
ールと称す)が散在している。樹脂ボール7は直径10
ミクロン程度、中実が樹脂からなり表面に金などの金属
をメッキしてある。接着導電部材によりフレキシブルテ
ープの導電パターン8とLCDパネルの透明電極9とを
接着させるとともに散在する樹脂ボールにより導通をと
る構造となっていた。一般的にフレキシブル基板の構造
としては、フレキシブル基板の導電パターンに接着導電
部材10が塗布された状態で存在する。特に、その接着
導電部材が塗布された状態のフレキシブル基板のことを
ヒートシールコネクタと称している。
FIG. 3 shows a conventional flexible substrate connection structure, 4 is a flexible tape, which is made of a flexible base material (thickness of about 30 μm) made of a resin such as polyester, and 8 is conductive of the flexible tape. It is a pattern and is formed by printing fine particles of silver or graphite. Reference numeral 5 is an LCD panel made of glass or the like, and 9 is a transparent electrode of the LCD panel, which is formed on the surface of the LCD panel by an ITO film or the like (several microns in thickness). Reference numeral 10 denotes an adhesive conductive member, and conductive elements 7 (hereinafter referred to as resin balls) are scattered on the adhesive conductive member. Resin ball 7 has a diameter of 10
About micron, solid is made of resin and metal such as gold is plated on the surface. The conductive pattern 8 of the flexible tape and the transparent electrode 9 of the LCD panel are adhered by the adhesive conductive member, and the resin balls are scattered to establish the conduction. Generally, the structure of the flexible substrate exists in a state where the adhesive conductive member 10 is applied to the conductive pattern of the flexible substrate. In particular, the flexible substrate with the adhesive conductive member applied is called a heat seal connector.

【0004】次にヒートシールコネクタ(以下ヒートシ
ールと称す)の接続方法すなわちヒートシールとLCD
パネルとの電極の接続方法について示す。ヒートシール
接続は、例えば200端子程度の多数の電極を一括して
接続する方法の一つであり、おもにLCDパネルとこれ
を駆動するドライバICとの間の導通を得る場合等に用
いられる。ヒートシール接続は、LCDパネル5上の透
明電極9にヒートシール4の接着剤面を当接し,上部よ
り例えば200℃に加熱した圧着治具(硬質ゴム等、図
示せず)を用いて加熱・加圧し、接着導伝部材10が熱
で溶け、圧力で図の奥行き方向に排除されて樹脂ボール
7がLCDパネル5の透明電極9に接触する。ここで圧
着治具をはずし、加熱及び加圧を中止すると、接着導伝
部材10が冷却硬化して樹脂ボール7がLCDパネル5
の透明電極9とヒートシール4の導電パターン8の間で
押しつけられた状態を保持することによって、電気的導
通を確保する接続方法である。このときすき間6は、接
着導伝部材10で満たされており、その寸法は樹脂ボー
ル7の直径よりやや小さいことが理想的である。
Next, a method of connecting a heat seal connector (hereinafter referred to as heat seal), that is, heat seal and LCD
The method of connecting the electrodes to the panel will be described. The heat-sealing connection is one of the methods of collectively connecting a large number of electrodes having, for example, about 200 terminals, and is mainly used for obtaining conduction between an LCD panel and a driver IC that drives the LCD panel. For heat seal connection, the transparent electrode 9 on the LCD panel 5 is brought into contact with the adhesive surface of the heat seal 4 and heated from above using a pressure bonding jig (hard rubber or the like, not shown) heated to, for example, 200 ° C. When pressure is applied, the adhesive conductive member 10 is melted by heat, and is removed in the depth direction of the drawing by the pressure so that the resin ball 7 comes into contact with the transparent electrode 9 of the LCD panel 5. Here, when the crimping jig is removed and heating and pressurization are stopped, the adhesive conductive member 10 is cooled and hardened so that the resin ball 7 becomes the LCD panel 5.
This is a connection method for ensuring electrical continuity by holding the pressed state between the transparent electrode 9 and the conductive pattern 8 of the heat seal 4. At this time, the gap 6 is filled with the adhesive conductive member 10, and the size thereof is ideally smaller than the diameter of the resin ball 7.

【0005】なお、ヒートシール接続はこの図のような
端子が横方向に多数個(例えば200個)連続して並ん
でおり、同時に適正で均等な加圧力により接続すること
が重要である。
In the heat-sealing connection, a large number (for example, 200) of terminals as shown in the figure are arranged in a row in the lateral direction, and it is important that the terminals are simultaneously connected by appropriate and uniform pressure.

【0006】[0006]

【発明が解決しようとする課題】しかるに加圧力が弱い
と樹脂ボール7と各導電パターン8および透明電極9と
の接触圧が不足するため、導通が得られなかったり、接
続信頼性の不十分な接続となる場合があった。特に従来
のフレキシブル基板の接続方法では、圧着治具の面と接
続面との平行度にズレが生じたり、圧着治具の摩耗によ
る片べりなどによって加圧力が不均一となる場合があっ
て、部分的に不十分な接続が得られることがあった。し
かしながら、従来のフレキシブル基板の構造及びそれを
用いた接続構造では接続良否状態の判別をすることが容
易にできない構造であった。
However, if the applied pressure is weak, the contact pressure between the resin ball 7 and each conductive pattern 8 and the transparent electrode 9 becomes insufficient, so that electrical continuity cannot be obtained or the connection reliability is insufficient. There were cases where it became a connection. Especially in the conventional flexible board connecting method, there may be a deviation in the parallelism between the surface of the crimping jig and the connecting surface, or the pressing force may become uneven due to one-sided slippage due to wear of the crimping jig, Partially poor connection was sometimes obtained. However, in the conventional flexible substrate structure and the connection structure using the same, it is not possible to easily determine the connection quality.

【0007】更に従来のフレキシブル基板の接続の加圧
力の測定には、感圧紙とよばれる圧力測定用のシートを
用いていた。この感圧紙は、一方のシートに発色性の試
薬を、他方のシートには反応剤をそれぞれ塗布した2枚
組の圧力測定シートであり、被測定面にこのシートをは
さみ、加圧することで圧力の大きい部分は2枚のシート
が強く圧縮されるため発色反応がおこり色が付いてみ
え、圧力の小さい部分は発色しないため圧力の分布が色
で確認、測定できるようにしたものである。感圧紙の使
用は加圧面にシート(すなわち異物)を介在させるた
め、加圧力測定のために工程を止める必要があった。つ
まり、フレキシブル基板の接続においては、加圧力の絶
対値および分布が非常に重要な要因であるにも関わら
ず、それを測定、管理するには接合面に異物を介在させ
なければならないため加工工程中で容易に圧力測定がで
きなかった。
Further, a pressure measuring sheet called pressure sensitive paper has been used for measuring the pressure applied to the connection of the conventional flexible substrate. This pressure-sensitive paper is a set of two pressure measuring sheets in which one sheet is coated with a coloring reagent and the other sheet is coated with a reactive agent. In the large area, the two sheets are strongly compressed so that a color reaction occurs and a color appears, and in the small area the color does not develop so that the pressure distribution can be confirmed and measured by color. Since the use of pressure-sensitive paper causes a sheet (that is, a foreign substance) to intervene on the pressing surface, it was necessary to stop the process for measuring the pressing force. In other words, although the absolute value and distribution of the pressing force are very important factors in the connection of flexible boards, foreign matter must be present on the joint surface in order to measure and manage them, so the processing step The pressure could not be measured easily.

【0008】そこで本発明はこのような問題点を解決す
るもので、その目的とするところは、フレキシブル基板
の接続が確実に行われたことが容易に判別可能なフレキ
シブル基板の接続構造及びその接続方法を提供すること
にある。
Therefore, the present invention solves such a problem, and an object of the present invention is to provide a flexible substrate connection structure and its connection that can easily determine that the flexible substrates have been securely connected. To provide a method.

【0009】また、その接続検査が簡易に行えるフレキ
シブル基板の接続構造及びその接続方法を提供すること
にある。
It is another object of the present invention to provide a flexible board connection structure and a connection method thereof, in which the connection inspection can be performed easily.

【0010】[0010]

【課題を解決するための手段】[Means for Solving the Problems]

(手段1)可撓性を有する基材と、前記基材に配設され
た導電パターンと、前記導電パターンに被覆された接着
導電部材とを有するフレキシブル基板であって、前記接
着導電部材には、電気的導通可能な導通素子と、加圧に
より発色する発色部材とを有することを特徴とする。
(Means 1) A flexible substrate having a flexible base material, a conductive pattern provided on the base material, and an adhesive conductive member covered with the conductive pattern, wherein the adhesive conductive member is , A conductive element capable of electrical conduction, and a coloring member that develops a color when pressed.

【0011】(手段2)上記手段1の特徴点に加え、フ
レキシブル基板は、前記接着導電部材に散在する前記発
色部材が少なくとも二種類の発色部材を有することを特
徴とする。
(Means 2) In addition to the characteristics of the means 1, the flexible substrate is characterized in that the coloring members scattered on the adhesive conductive member have at least two kinds of coloring members.

【0012】(手段3)上記手段2の特徴点に加え、フ
レキシブル基板は、更に前記接着導電部材に散在する前
記発色部材が、前記導通素子の径より大きい径からなる
第一の発色部材と、前記導通素子の径より小さい径から
なる第二の発色部材とを有することを特徴とする。
(Means 3) In addition to the characteristics of the means 2, the flexible substrate further includes a first coloring member in which the coloring members scattered on the adhesive conductive member have a diameter larger than that of the conductive element. And a second coloring member having a diameter smaller than that of the conducting element.

【0013】(手段4)またフレキシブル基板の接続構
造は、導電パターンを有するフレキシブル基板と、透明
電極を有する液晶表示素子と、外圧により発色する発色
部材を有し、前記導電パターンと前記透明電極との間に
介在し前記透明電極と前記フレキシブル基板の導電パタ
ーンとを電気的に導通可能な導通素子により接続する接
着導電部材とからなり、前記透明電極と前記フレキシブ
ル基板の導電パターンとが、発色部材の発色した状態か
らなる前記接着導電部材により接続されていることを特
徴とする。
(Means 4) Further, the connection structure of the flexible substrate has a flexible substrate having a conductive pattern, a liquid crystal display element having a transparent electrode, and a coloring member that develops color by an external pressure, and the conductive pattern and the transparent electrode. And an adhesive conductive member that is interposed between the transparent electrode and the conductive pattern of the flexible substrate to connect the conductive pattern with an electrically conductive element, and the transparent electrode and the conductive pattern of the flexible substrate are colored members. Are connected by the adhesive conductive member in the colored state.

【0014】(手段5)上記手段4の特徴点に加え、フ
レキシブル基板の接続構造は、前記接着導電部材中には
未発色の発色部材が存在することを特徴とする。
(Means 5) In addition to the characteristics of the means 4, the flexible substrate connection structure is characterized in that an uncolored coloring member is present in the adhesive conductive member.

【0015】(手段6)またフレキシブル基板の接続構
造は、導電パターンを有するフレキシブル基板と、透明
電極を有する液晶表示素子と、外圧により発色する発色
部材を有し、前記導電パターンと前記透明電極との間に
介在し前記透明電極と前記フレキシブル基板の導電パタ
ーンとを電気的に導通可能な導通素子により接続する接
着導電部材とからなり、発色部材が未発色の状態にある
前記接着導電部材で前記透明電極と前記フレキシブル基
板の導電パターンとが接続されていることを特徴とす
る。
(Means 6) Further, the flexible substrate connection structure has a flexible substrate having a conductive pattern, a liquid crystal display element having a transparent electrode, and a coloring member that develops color by an external pressure, and the conductive pattern and the transparent electrode. An adhesive conductive member that is interposed between the transparent electrode and the conductive pattern of the flexible substrate and is connected by a conductive element capable of electrical conduction, and the coloring member is the adhesive conductive member in a non-colored state. The transparent electrode and the conductive pattern of the flexible substrate are connected to each other.

【0016】(手段7)またフレキシブル基板の接続方
法は、フレキシブル基板の導電パターンと液晶表示素子
の透明電極とを電気的に導通可能な導通素子が含有され
た接着導電部材により接続するフレキシブル基板の接続
方法であって、前記接着導電部材には加圧により発色す
る発色部材が含有され、前記発色部材の状態により前記
導電パターンと前記透明電極との接続状態が示されるこ
とを特徴とする。
(Means 7) Further, the method of connecting the flexible substrate is such that the conductive pattern of the flexible substrate and the transparent electrode of the liquid crystal display element are connected by an adhesive conductive member containing a conductive element capable of electrically conducting. In the connection method, the adhesive conductive member includes a coloring member that develops a color when pressed, and a state of the coloring member indicates a connection state between the conductive pattern and the transparent electrode.

【0017】[0017]

【作用】従って、手段1に記載のフレキシブル基板によ
れば、加圧により発色する発色部材を有するので、適正
な加圧が与えられていれば、発色部材の状態により確実
に接続されているか簡易に判断できる。
Therefore, according to the flexible substrate described in the means 1, since the flexible substrate has the coloring member that develops color by pressurization, if the proper pressurization is applied, it can be easily connected depending on the state of the coloring member. Can judge.

【0018】これに加え、手段2に記載のフレキシブル
基板によれば、少なくとも2種類の発色部材を用いるこ
とにより加圧力の状態の把握が容易になる。また接続状
態の制御が容易になる。
In addition to this, according to the flexible substrate described in the means 2, it becomes easy to grasp the state of the pressing force by using at least two kinds of coloring members. Also, the control of the connection state becomes easy.

【0019】更に手段3に記載のフレキシブル基板によ
れば、確実に導通がとれていれば少なくとも導通素子の
径より大きい径の発色部材は発色している。従って発色
部材の状態により最適な加圧の状態であるのか、または
最適な接続状態にあるのか判断が容易になる。
Further, according to the flexible substrate described in the means 3, the color-developing member having a diameter at least larger than the diameter of the conductive element is colored when the conductive is surely established. Therefore, depending on the state of the color-developing member, it is easy to determine whether the state is the optimum pressurization state or the optimum connection state.

【0020】また手段4乃至6のいずれかに記載のフレ
キシブル基板の接続構造によれば、接着導伝部材の状態
により、接続の良否の判断が可能であり、しかも特別な
装置を用いなくとも目視での判断も可能である。
According to the flexible substrate connection structure according to any one of the means 4 to 6, it is possible to judge whether the connection is good or bad depending on the state of the adhesive conductive member, and moreover, it is possible to visually check without using a special device. It is also possible to judge by.

【0021】そして手段7に記載のフレキシブル基板の
接続方法によれば、接着導伝部材の発色状態により、接
続の良否の判断が可能である。
According to the flexible board connecting method described in the means 7, it is possible to judge the quality of the connection based on the coloring state of the adhesive conductive member.

【0022】[0022]

【実施例】図1に本発明に用いる接着導電部材に散在さ
せる発色部材の一実施例を示す。本実施例では外形状が
球体の場合を例とし説明する。図1(a)は球体からな
る発色部材1であって、球殻2は樹脂等の硬くて割れや
すい材質で形成されており、内部には発散しやすい状態
で色素3が封入されている。硬くて割れやすい材質と
は、例えばポリカーボネイトなどの硬質プラスチックで
あり、フレキシブル基板(以下ヒートシールと称す)接
続時の加圧力により変形されずに破壊するような材質を
いう。また、発散しやすい状態とは、気体、液体または
粉体等、容器がなければ発散してしまう状態のことをい
う。この発色部材1(以下色素球と称す)は、例えば液
状の硬化剤中に液状の球殻2の材料を球状に放出し、内
部に内容物たる色素3を注入した後、球殻を硬化させる
ことで形成できる。この時の各材料の量を規定すること
により、色素球の直径および球殻2の厚さを所望の寸法
に管理できる。なお、本例では球体を例とし説明した
が、あくまで色素3が封入してあればいずれの形であっ
ても良い。
EXAMPLE FIG. 1 shows an example of a coloring member dispersed in the adhesive conductive member used in the present invention. In this embodiment, a case where the outer shape is a sphere will be described as an example. FIG. 1A shows a coloring member 1 made of a sphere, and a spherical shell 2 is made of a material that is hard and easily broken, such as a resin, and a pigment 3 is encapsulated therein in a state where it easily diffuses. The hard and fragile material is, for example, a hard plastic such as polycarbonate, which is a material that is destroyed without being deformed by a pressure applied when a flexible substrate (hereinafter referred to as heat seal) is connected. In addition, the state of being easily divergent means a state of diverging without a container such as gas, liquid or powder. The coloring member 1 (hereinafter referred to as a dye sphere) releases the material of the liquid spherical shell 2 into a spherical shape in a liquid curing agent, injects the dye 3 as the content into the inside, and then hardens the spherical shell. It can be formed. By defining the amount of each material at this time, the diameter of the pigment sphere and the thickness of the spherical shell 2 can be controlled to desired dimensions. In this example, a spherical body is described as an example, but any shape may be used as long as the dye 3 is encapsulated.

【0023】図1(b)はヒートシールとLCDパネル
とが接続される前の状態であって、本発明のヒートシー
ル構造の一実施例を示す。5はガラス等でできているL
CDパネル、9はLCDパネルの透明電極であり、LC
Dパネルの表面にITO膜など(厚さ数ミクロン)によ
り形成されている。4はフレキシブルテープでありポリ
エステル等の樹脂でできた可撓性を有する基材(厚さ約
30ミクロン)からなる。8はフレキシブルテープの導
電パターンであり銀や黒鉛等の微小粒子を印刷して形成
される。10は接着導電部材であり、その接着導電部材
には導通素子7(以下樹脂ボールと称す)と発色部材で
ある第1及び第2の色素球1’、1”とが散在してい
る。樹脂ボールは直径10ミクロン程度、中実が樹脂球
からなり表面に金などの金属をメッキしてある。樹脂ボ
ールは後述の色素球に比べ十分に強度を持っており、ヒ
ートシール接続時に加圧等の外圧により破壊されない程
度の強度を有する。本実施例の色素球1には2種類の直
径のそれぞれ色素の違うものが用いられている。1’は
所望のすき間6寸法よりやや大きいかまたは等しい直径
を持った色素球で、一般的には導通素子の径よりはやや
大きいかまたは等しい程度の径をもったものであり、球
殻2内に第1の色素(例えば黄色)が封入されている。
一方、1”は所望のすき間6寸法より小さい直径の色素
球で、一般的には導通素子の径よりは小さい径をもった
ものであり、球殻2内に第2の色素(例えば赤色)が封
入されている。また前述の所望のすき間6寸法とは、樹
脂ボール7の直径よりやや小さな寸法であり、各導電パ
ターン8および透明電極9の間の間隔がこの程度になる
と良好なヒートシール接続が得られるといった範囲を示
すものである。ヒートシールの構造としてはフレキシブ
ルテープ4の導電パターン8に樹脂ボール、色素球を含
んだ接着導電部材10が塗布された状態で存在する。な
お本実施例ではフレキシブルテープ4の導電パターン1
つに対して接着導電部材10を塗布した例を示している
が、連設された導電パターン全てに塗布されているほう
が塗布の簡易化の点から好ましい。
FIG. 1B shows a state before the heat seal and the LCD panel are connected to each other, showing an embodiment of the heat seal structure of the present invention. 5 is L made of glass or the like
CD panel, 9 is a transparent electrode of LCD panel, LC
An ITO film or the like (thickness of several microns) is formed on the surface of the D panel. 4 is a flexible tape, which is made of a flexible base material (thickness: about 30 microns) made of a resin such as polyester. 8 is a conductive pattern of a flexible tape, which is formed by printing fine particles such as silver or graphite. Reference numeral 10 denotes an adhesive conductive member, on which conductive elements 7 (hereinafter referred to as resin balls) and first and second dye spheres 1 ′ and 1 ″ which are coloring members are scattered. The ball has a diameter of about 10 microns, the solid is a resin sphere, and the surface is plated with metal such as gold.The resin ball has sufficient strength compared to the dye sphere described later, and pressure etc. at the time of heat seal connection It has such a strength that it will not be destroyed by the external pressure of 1. The dye spheres 1 of this embodiment have different diameters of two kinds of dyes. 1'is slightly larger than or equal to the desired 6 dimensions. A pigment sphere having a diameter, which is generally slightly larger than or equal to the diameter of the conducting element, and the first pigment (for example, yellow) is enclosed in the spherical shell 2. There is.
On the other hand, 1 ″ is a pigment sphere having a diameter smaller than the desired size of 6 dimensions, and generally has a diameter smaller than that of the conducting element, and the second pigment (for example, red) is contained in the spherical shell 2. Further, the above-mentioned desired clearance 6 dimension is a dimension slightly smaller than the diameter of the resin ball 7, and when the distance between each conductive pattern 8 and the transparent electrode 9 is in this range, good heat sealing is achieved. The heat-sealing structure exists in a state where the conductive pattern 8 of the flexible tape 4 is coated with the adhesive conductive member 10 containing resin balls and pigment balls. In the example, the conductive pattern 1 of the flexible tape 4
An example in which the adhesive conductive member 10 is applied to one of the two is shown, but it is preferable to apply the adhesive conductive member 10 to all of the conductive patterns that are continuously arranged from the viewpoint of simplification of application.

【0024】次に本構造のヒートシールを用いたLCD
パネルとの接続方法すなわちヒートシールの導電パター
ンとLCDパネルとの透明電極との接続方法について示
す。ヒートシール接続は、例えば200端子程度の多数
の電極を一括して接続する方法の一つであり、おもにL
CDパネルとこれを駆動するドライバICとの間の導通
を得る場合等に用いられる。ヒートシール接続は、LC
Dパネル5上の透明電極9にヒートシール4の接着剤面
を当接し,上部より例えば200℃に加熱した圧着治具
(硬質ゴム等、図示せず)を用いて加圧・加熱し、接着
剤層10が熱により溶融し、圧力で図の奥行き方向に排
除されて樹脂ボール7がLCDパネル5の透明電極9に
接触する。ここで圧着治具をはずし、加熱及び加圧を中
止すると、接着剤層10が冷却硬化して樹脂ボール7が
LCDパネル5の透明電極9とヒートシール4の導電パ
ターン8の間で押しつけられた状態を保持することによ
って、電気的導通を確保する接続方法である。このとき
すき間6は、接着剤10で満たされており、その寸法は
樹脂ボール7の直径よりやや小さいことが理想的であ
る。
Next, an LCD using the heat seal of this structure
A method for connecting to a panel, that is, a method for connecting a heat-seal conductive pattern and a transparent electrode to an LCD panel will be described. The heat seal connection is one of the methods of collectively connecting a large number of electrodes, for example, about 200 terminals.
It is used to obtain conduction between the CD panel and the driver IC that drives the CD panel. Heat seal connection is LC
The adhesive surface of the heat seal 4 is brought into contact with the transparent electrode 9 on the D panel 5, and pressure and heat are applied from above with a pressure bonding jig (hard rubber or the like, not shown) heated to, for example, 200 ° C. The agent layer 10 is melted by heat and is removed by pressure in the depth direction of the drawing, so that the resin ball 7 comes into contact with the transparent electrode 9 of the LCD panel 5. When the pressure-bonding jig was removed and heating and pressurization were stopped, the adhesive layer 10 was cooled and hardened, and the resin ball 7 was pressed between the transparent electrode 9 of the LCD panel 5 and the conductive pattern 8 of the heat seal 4. This is a connection method for maintaining electrical continuity by maintaining the state. At this time, the gap 6 is filled with the adhesive 10, and its size is ideally slightly smaller than the diameter of the resin ball 7.

【0025】なお、ヒートシール接続はこの図のような
端子が横方向に多数個(例えば200個)連続して並ん
でおり、同時に適正で均等な加圧力により接続すること
が重要である。
In the heat-sealing connection, a large number (for example, 200) of terminals as shown in the figure are continuously arranged in the lateral direction, and it is important that the terminals are simultaneously connected by appropriate and uniform pressure.

【0026】ここで前述の接続構造及び方法を用いた場
合に、接着導電部材10中に導通素子7を散在させてあ
るために、接合のための加圧力によって圧着治具(図示
せず)およびヒートシール4がたわみ、加圧力の大きさ
によって各導電パターン8および透明電極9の間のすき
間6が適当な場合および不適当な場合が生じ、以下のよ
うな状態となる。図2にその説明図を示す。
When the above-described connection structure and method are used here, since the conductive elements 7 are scattered in the adhesive conductive member 10, a pressure bonding jig (not shown) and The heat seal 4 is bent, and the gap 6 between each conductive pattern 8 and the transparent electrode 9 may be appropriate or inappropriate depending on the magnitude of the pressing force, resulting in the following state. FIG. 2 shows an explanatory diagram thereof.

【0027】(1)すき間が適当な場合 すき間が適当な場合の、本発明の実施例を図2(a)に
示す。加圧力が適当で、LCDパネル5とヒートシール
4のすき間6(すなわち接着剤層10の厚さ)が所望の
寸法である場合は、大きい方の色素球1’のみが破壊さ
れ黄色の色素をまき散らすため、接着導電部材10は黄
色く見える。
(1) When the gap is appropriate FIG. 2A shows an embodiment of the present invention when the gap is appropriate. When the pressing force is appropriate and the gap 6 between the LCD panel 5 and the heat seal 4 (that is, the thickness of the adhesive layer 10) has a desired size, only the larger dye sphere 1'is destroyed and the yellow dye is removed. Since the particles are scattered, the adhesive conductive member 10 looks yellow.

【0028】(2)すき間が不適当な場合 すき間が不適当な場合は、加圧力が不足している場合ま
たは過大の場合におこる。加圧力が不足している場合の
説明図を図2(b)に示す。この場合には、すき間6’
が色素球1’の直径よりも大きいかまたは等しいため色
素球1’は破壊されず、したがって接着導電部材10の
色に変化はない。
(2) Inappropriate gap The inadequate gap occurs when the pressure is insufficient or excessive. FIG. 2B shows an explanatory view when the applied pressure is insufficient. In this case, the gap 6 '
Is greater than or equal to the diameter of the dye sphere 1 ′, the dye sphere 1 ′ is not destroyed, and therefore the color of the adhesive conductive member 10 does not change.

【0029】一方加圧力が過大である場合の説明図を図
2(c)に示す。この場合には、加圧力が過大なため圧
着治具およびヒートシール4がたわんで壊れにくい樹脂
ボール7にならう形状となる。このとき、すき間6”が
色素球1”の直径よりも小さくなるため、色素球1’お
よび1”が破壊されて、それぞれ黄色および赤色の色素
をまきちらす。したがって接着導電部材10は黄色と赤
色の混合した色(およそオレンジ色)に見える。
On the other hand, FIG. 2 (c) shows an explanatory view when the applied pressure is excessive. In this case, since the pressing force is excessive, the crimping jig and the heat seal 4 are bent and have a shape following the resin ball 7 which is hard to break. At this time, since the gap 6 "is smaller than the diameter of the dye sphere 1", the dye spheres 1'and 1 "are destroyed and the yellow and red dyes are scattered, respectively. Therefore, the adhesive conductive member 10 is yellow and red. It looks like a mixed color (around orange).

【0030】したがって接着導電部材10の色を見るこ
とで、LCDパネル5とヒートシール4のすき間がある
範囲にあるかどうかを知ることができ、結果としてヒー
トシール接続における加圧力が適当であるかどうかを知
ることができる。
Therefore, by observing the color of the adhesive conductive member 10, it is possible to know whether the gap between the LCD panel 5 and the heat seal 4 is within a certain range, and as a result, whether the pressure applied in the heat seal connection is appropriate. I can know how.

【0031】上記説明は内部に色素を封入した色素球に
ついて説明したが、内容物は色素に限定されるものでは
なく、発色性試薬を封入した色素球を、反応剤を含んだ
接着剤層に対して使用しても、またはその逆でもよい。
このとき色のあるなしがさらにはっきりするため、色に
より加圧力を確認するのにより効果的である。
Although the above description has explained dye spheres in which a dye is enclosed, the contents are not limited to dyes, and dye spheres in which a chromogenic reagent is encapsulated are contained in an adhesive layer containing a reaction agent. It may be used in conversely or vice versa.
At this time, since the presence or absence of color becomes clearer, it is more effective to confirm the applied pressure by color.

【0032】また、上記説明は2種類の色素球を用いる
場合について説明したが、色素球の種類はこれに限定さ
れるものではない。1種類の色素球を用いて、加圧力の
大小を比較することもでき、また複数の種類の色素球を
用いたヒートシールを、あらかじめ色と圧力の関係を校
正した後に使用すればさらに精密な接続が可能となる。
Further, although the above description has explained the case of using two types of dye spheres, the type of dye sphere is not limited to this. It is also possible to compare the magnitude of the pressing force by using one type of dye sphere, and if a heat seal using multiple types of dye spheres is used after calibrating the relationship between color and pressure in advance, it will be more precise. Connection is possible.

【0033】また本発明の実施例は、従来使用していた
ヒートシールに適用することで、ヒートシールの使用と
同時に接続の良否を判断することができるため、接続良
否検査のためのみの工程を除くことも可能で、しかも簡
易に検査が可能となる。また接合面に異物を介在させな
いため、あとで取り除く必要もなく、工程中で作業を止
めることなく常時使用することができる。
In addition, the embodiment of the present invention can be applied to the conventionally used heat seal to judge whether the connection is good or not at the same time as the use of the heat seal. It can be removed, and inspection can be done easily. Further, since no foreign matter is present on the joint surface, there is no need to remove it later, and it can be used at all times without stopping the work during the process.

【0034】[0034]

【発明の効果】本発明は以上のように構成されているの
で、以下に記載されるような効果を奏する。
Since the present invention is constructed as described above, it has the following effects.

【0035】手段1に記載のフレキシブル基板によれ
ば、加圧により発色する発色部材を有するので、適正な
加圧が与えられていれば、発色部材の状態により確実に
接続されているか簡易に判断できる。よってヒートシー
ル接続の品質および接続信頼性が向上する。
According to the flexible substrate of the means 1, since the flexible substrate has a coloring member that develops color by applying pressure, it is possible to easily determine whether or not the connection is surely made, depending on the state of the coloring member, if proper pressure is applied. it can. Therefore, the quality and connection reliability of the heat seal connection are improved.

【0036】これに加え、手段2に記載のフレキシブル
基板によれば、少なくとも2種類の発色部材を用いるこ
とにより加圧力の状態の把握が容易になる。また接続状
態の制御が容易になる。
In addition to this, according to the flexible substrate described in the means 2, by using at least two kinds of coloring members, it becomes easy to grasp the state of the pressing force. Also, the control of the connection state becomes easy.

【0037】更に手段3に記載のフレキシブル基板によ
れば、発色部材が導通素子の径より大きい径からなる第
一の発色部材と、導通素子の径より小さい径からなる第
二の発色部材とを有するので、確実に導通がとれていれ
ば少なくとも導通素子の径より大きい径の発色部材は発
色することになり、発色部材の状態により最適な加圧の
状態であるのか、または最適な接続状態にあるのか判断
が容易になる。
Further, according to the flexible substrate described in the means 3, the first coloring member whose coloring member has a diameter larger than the diameter of the conducting element and the second coloring member having a diameter smaller than that of the conducting element. Therefore, if the conduction is surely established, at least the coloring member having a diameter larger than the diameter of the conducting element will be colored, and the state of the coloring member is in the state of the optimum pressurization or the state of the optimum connection. It will be easier to determine if there is one.

【0038】また手段4乃至6のいずれかに記載のフレ
キシブル基板の接続構造によれば、接着導伝部材の状態
により、接続の良否の判断が可能であり、しかも特別な
装置を用いなくとも目視での接続状態の良否判断も可能
である。
According to the flexible board connection structure according to any one of the means 4 to 6, it is possible to judge whether the connection is good or bad depending on the state of the adhesive conductive member, and moreover, it is possible to visually check without using a special device. It is also possible to judge whether the connection state is good or bad.

【0039】そして手段7に記載のフレキシブル基板の
接続方法によれば、接着導伝部材の発色状態により、接
続の良否の判断が可能である。
According to the flexible board connecting method described in the means 7, it is possible to judge the quality of the connection based on the coloring state of the adhesive conductive member.

【0040】また、本発明の構成をとることにより、圧
力の状態(絶対値、分布等)が容易かつ確実に確認、測
定できるようになった。
Further, by adopting the constitution of the present invention, the state of pressure (absolute value, distribution, etc.) can be confirmed and measured easily and surely.

【0041】また、圧力を測定する面に異物を介在させ
ず、従来のヒートシールと全く同じように使用すること
が出来るため、圧力測定シートを取り除く必要がなく、
ヒートシールの圧着工程で常時圧力測定が(インプロセ
スで)できる。このことからヒートシール接続工程にお
いて接続と圧力測定が同時に出来るため、加工工数およ
び加工時間を合理化できる。 このためヒートシール接
続を用いる電子機器(たとえば携帯用パーソナルコンピ
ュータ等)における信頼性を向上させるとともに、コス
トダウンに効果がある。
Further, since the pressure measuring surface can be used in the same manner as the conventional heat sealing without interposing any foreign matter, it is not necessary to remove the pressure measuring sheet,
Constant pressure measurement (in-process) is possible in the heat seal crimping process. Therefore, in the heat seal connection process, the connection and the pressure measurement can be performed at the same time, and the processing man-hour and the processing time can be rationalized. Therefore, it is possible to improve reliability in an electronic device (for example, a portable personal computer or the like) using the heat seal connection and to reduce the cost.

【0042】更に本発明によれば、ヒートシール接続に
関して、接続信頼性を決定する重要な要因である加圧力
の絶対値および分布を、接続部の色を確認することで容
易かつ確実に把握できる。また、量産工程での様々な要
因による加圧力の不均一さを、工程中で(すなわちイン
プロセスで、測定のために工程を止めることなく)管理
できる。
Further, according to the present invention, regarding the heat seal connection, the absolute value and distribution of the pressing force, which is an important factor for determining the connection reliability, can be easily and surely grasped by checking the color of the connection portion. . Further, it is possible to manage the non-uniformity of the pressing force due to various factors in the mass production process, that is, in-process (that is, in-process without stopping the process for measurement).

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は本発明の発色部材の一実施例を示す図。
図1(a)は本発明の発色部材の構造を示す側面図およ
び断面図。図1(b)は本発明の発色部材を用いたヒー
トシールを接続しようとしている断面図。
FIG. 1 is a diagram showing an embodiment of a coloring member of the present invention.
FIG. 1A is a side view and a sectional view showing the structure of the color forming member of the present invention. FIG. 1B is a cross-sectional view in which a heat seal using the coloring member of the present invention is connected.

【図2】図2は本発明の発色部材を用いたヒートシール
の接続状態の一実施例を示す断面図。図2(a)は本発
明のヒートシールを用いて適正な圧力により接続を行っ
た場合の断面図。図2(b)は本発明のヒートシールを
用いて過少な圧力により接続を行った場合の断面図。図
2(c)は本発明のヒートシールを用いて過大な圧力に
より接続を行った場合の断面図。
FIG. 2 is a cross-sectional view showing an example of a connected state of a heat seal using the coloring member of the present invention. FIG. 2A is a cross-sectional view of the case where the heat seal of the present invention is used and the connection is performed at an appropriate pressure. FIG. 2 (b) is a cross-sectional view of the case where the heat seal of the present invention is used for connection with an excessive pressure. FIG. 2C is a cross-sectional view of the case where the heat seal of the present invention is used for connection with excessive pressure.

【図3】図3は従来のヒートシールを用いて接続を行っ
た場合を示す断面図。
FIG. 3 is a cross-sectional view showing a case where connection is performed using a conventional heat seal.

【符号の説明】[Explanation of symbols]

1・・・発色部材 1’、1”・・・色素球 2・・・球殻 3・・・色素 4・・・フレキシブルテープ 5・・・LCDパネル 6・・・すき間 7・・・樹脂ボール 8・・・ヒートシールの導電パターン 9・・・LCDパネルの透明電極 10・・接着導伝部材 DESCRIPTION OF SYMBOLS 1 ... Coloring member 1 ', 1 "... Dye sphere 2 ... Spherical shell 3 ... Dye 4 ... Flexible tape 5 ... LCD panel 6 ... Gap 7 ... Resin ball 8 ... Heat seal conductive pattern 9 ... LCD panel transparent electrode 10. Adhesive conductive member

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 可撓性を有する基材と、前記基材に配設
された導電パターンと、前記導電パターンに被覆された
接着導電部材とを有するフレキシブル基板であって、 前記接着導電部材には、電気的導通可能な導通素子と、
加圧により発色する発色部材とを有することを特徴とす
るフレキシブル基板。
1. A flexible substrate having a flexible base material, a conductive pattern provided on the base material, and an adhesive conductive member covered with the conductive pattern, wherein the adhesive conductive member is a flexible substrate. Is a conductive element capable of electrical conduction,
A flexible substrate having a coloring member that develops color when pressed.
【請求項2】 前記接着導電部材に散在する前記発色部
材は、少なくとも二種類の発色部材を有することを特徴
とする請求項1記載のフレキシブル基板。
2. The flexible substrate according to claim 1, wherein the coloring member scattered on the adhesive conductive member has at least two kinds of coloring members.
【請求項3】 前記接着導電部材に散在する前記発色部
材は、前記導通素子の径より大きい径からなる第一の発
色部材と、前記導通素子の径より小さい径からなる第二
の発色部材とで構成されていることを特徴とする請求項
2記載のフレキシブル基板。
3. The color-developing members scattered on the adhesive conductive member include a first color-developing member having a diameter larger than the diameter of the conductive element and a second color-developing member having a diameter smaller than the diameter of the conductive element. The flexible substrate according to claim 2, wherein the flexible substrate is formed of
【請求項4】 導電パターンを有するフレキシブル基板
と、 透明電極を有する液晶表示素子と、 外圧により発色する発色部材を有し、前記導電パターン
と前記透明電極との間に介在し前記透明電極と前記フレ
キシブル基板の導電パターンとを電気的に導通可能な導
通素子により接続する接着導電部材とからなり、 前記透明電極と前記フレキシブル基板の導電パターンと
が、発色部材の発色した状態からなる前記接着導電部材
により接続されていることを特徴とするフレキシブル基
板の接続構造。
4. A flexible substrate having a conductive pattern, a liquid crystal display element having a transparent electrode, and a coloring member that develops color by an external pressure. The transparent substrate is interposed between the conductive pattern and the transparent electrode. An adhesive conductive member that connects a conductive pattern of a flexible substrate with a conductive element capable of electrical conduction, wherein the transparent electrode and the conductive pattern of the flexible substrate are in a colored state of a coloring member. A flexible substrate connection structure characterized by being connected by means of.
【請求項5】 前記接着導電部材中には未発色の発色部
材が存在することを特徴とする請求項4記載のフレキシ
ブル基板を用いた接続構造。
5. The connection structure using a flexible substrate according to claim 4, wherein an uncolored coloring member is present in the adhesive conductive member.
【請求項6】 導電パターンを有するフレキシブル基板
と、 透明電極を有する液晶表示素子と、 外圧により発色する発色部材を有し、前記導電パターン
と前記透明電極との間に介在し前記透明電極と前記フレ
キシブル基板の導電パターンとを電気的に導通可能な導
通素子により接続する接着導電部材とからなり、 発色部材が未発色の状態にある前記接着導電部材で前記
透明電極と前記フレキシブル基板の導電パターンとが接
続されていることを特徴とするフレキシブル基板の接続
構造。
6. A flexible substrate having a conductive pattern, a liquid crystal display element having a transparent electrode, and a coloring member that develops color by an external pressure. The transparent substrate is interposed between the conductive pattern and the transparent electrode. The transparent conductive electrode and the conductive pattern of the flexible substrate are composed of an adhesive conductive member that connects the conductive pattern of the flexible substrate with a conductive element capable of electrically conducting, and the coloring conductive member is the adhesive conductive member in the uncolored state. A flexible substrate connection structure characterized by being connected to each other.
【請求項7】 フレキシブル基板の導電パターンと液晶
表示素子の透明電極とを電気的に導通可能な導通素子が
含有された接着導電部材により接続するフレキシブル基
板の接続方法であって、 前記接着導電部材には加圧により発色する発色部材が含
有され、前記発色部材の状態により前記導電パターンと
前記透明電極との接続状態が示されることを特徴とする
フレキシブル基板の接続方法。
7. A method of connecting a flexible substrate, wherein the conductive pattern of the flexible substrate and the transparent electrode of the liquid crystal display element are connected by an adhesive conductive member containing a conductive element capable of electrically conducting. The method for connecting a flexible substrate according to claim 1, wherein the flexible substrate includes a color-developing member that develops color when pressed, and a state of the color-developing member indicates a connection state between the conductive pattern and the transparent electrode.
JP7056327A 1995-03-15 1995-03-15 Flexible board, and structure and method for its connection Pending JPH08255958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7056327A JPH08255958A (en) 1995-03-15 1995-03-15 Flexible board, and structure and method for its connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7056327A JPH08255958A (en) 1995-03-15 1995-03-15 Flexible board, and structure and method for its connection

Publications (1)

Publication Number Publication Date
JPH08255958A true JPH08255958A (en) 1996-10-01

Family

ID=13024098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7056327A Pending JPH08255958A (en) 1995-03-15 1995-03-15 Flexible board, and structure and method for its connection

Country Status (1)

Country Link
JP (1) JPH08255958A (en)

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US6261058B1 (en) * 1997-01-10 2001-07-17 Mitsubishi Heavy Industries, Ltd. Stationary blade of integrated segment construction and manufacturing method therefor
KR100428520B1 (en) * 1999-12-24 2004-04-29 세이코 엡슨 가부시키가이샤 Manufacturing method for liquid crystal device
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JP2009088465A (en) * 2007-09-14 2009-04-23 Hitachi Chem Co Ltd Anisotropically conductive adhesive, anisotropically conductive film, and method of manufacturing circuit connecting structure
JP2010096660A (en) * 2008-10-17 2010-04-30 Dainippon Printing Co Ltd Film for measuring heat sealing pressure
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6261058B1 (en) * 1997-01-10 2001-07-17 Mitsubishi Heavy Industries, Ltd. Stationary blade of integrated segment construction and manufacturing method therefor
KR100572216B1 (en) * 1998-12-31 2006-09-13 삼성전자주식회사 Anisotropic conductive film
WO2001026079A1 (en) * 1999-10-06 2001-04-12 Seiko Epson Corporation Electrooptic device, method for manufacturing electrooptic device, and electronic apparatus
US6646708B1 (en) 1999-10-06 2003-11-11 Seiko Epson Corporation Electrooptic device, manufacturing method therefor with visual confirmation of compression bonding to terminals and electronic apparatus
KR100428520B1 (en) * 1999-12-24 2004-04-29 세이코 엡슨 가부시키가이샤 Manufacturing method for liquid crystal device
JP2009088465A (en) * 2007-09-14 2009-04-23 Hitachi Chem Co Ltd Anisotropically conductive adhesive, anisotropically conductive film, and method of manufacturing circuit connecting structure
JP2010096660A (en) * 2008-10-17 2010-04-30 Dainippon Printing Co Ltd Film for measuring heat sealing pressure
WO2012121070A1 (en) * 2011-03-10 2012-09-13 コニカミノルタアドバンストレイヤー株式会社 Camera module and method for inspecting camera module
CN103503584A (en) * 2011-03-10 2014-01-08 柯尼卡美能达株式会社 Camera module and method for inspecting camera module
JP2017135188A (en) * 2016-01-26 2017-08-03 三菱電機株式会社 Flexible substrate

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