JP2944527B2 - Pressure-sensitive heat seal connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat seal connector, and more particularly, to a method for connecting between two components, for example, between an LCD (liquid crystal display panel) and a TCP (tape carrier package) or between an LCD and a PWB (printed wiring board). The present invention relates to a pressure-sensitive heat seal connector that is electrically connected.

[0002]

2. Description of the Related Art A heat seal connector electrically connects two parts by a thermocompression bonding method. As shown in FIG. 4, a conductive material 3 in which conductive particles 4 are mixed in a base material 2
To form a pattern, which is covered with an insulating adhesive 5.

For example, a heat seal connector 11 and a TC
In the case of thermocompression bonding of P7, heating and pressurization of the heat seal connector 11 by a heater chip for a certain period of time causes the conductive particles 4
Breaks through the insulating adhesive 5 and comes into contact with the opposed TCP pattern 8. This contact state is held by the insulating adhesive 5.

[0004]

The first problem is that it is difficult to non-destructively judge the quality of the heat seal connector thermocompression bonding. The reason is that the quality of the heat seal connector thermocompression bonding depends on the thermocompression conditions (temperature,
Pressure, time). This is because it is impossible to non-destructively determine whether an appropriate temperature and pressure have been applied to the heat seal connector for a certain period of time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pressure-sensitive heat-seal connector in which the quality of the heat-seal connector can be easily determined in appearance without destruction.

[0006]

According to the present invention, a pattern formed on a transparent substrate by a conductive material mixed with conductive particles is covered with an insulating adhesive, and the conductive particles are heated and pressed by thermocompression. Is a pressure-sensitive heat-seal connector that breaks through the insulating adhesive and maintains electrical connection with a counterpart pattern. The quality of the thermocompression bonding is determined in a non-destructive manner based on the distribution of the concentration of the color of the microcapsules that burst.

In this heat seal connector, the correlation between the color density and the pressure can be known in advance, and the value of the applied pressure can be measured.

According to this heat seal connector, the insulating adhesive (5 in FIG. 1) has microcapsules (5a in FIG. 1) that respond to pressure, and when pressure is applied to the heat seal connector, the microcapsules (5a in FIG. 1). 5a) is ruptured, and the encapsulated dye having an easily distinguishable color flows out. The number of ruptured microcapsules (5a) changes according to the magnitude of the pressure, and appears as a color density, and the transparent substrate (FIG. 1)
Discoloration can be observed through 2). In the pressure, which is one of the factors of the thermocompression condition, which is influenced by the quality of the heat seal connector thermocompression, it is possible to easily and non-destructively determine whether or not an appropriate pressure is uniformly applied based on color unevenness, distribution, and density.

[0009]

Next, the present invention will be described with reference to the drawings.

FIGS. 1A and 1B show a structure of an embodiment of the present invention, in which FIG. 1A is a perspective view, FIG. 1B is a sectional view, and FIG. FIGS. 3A and 3B are a plan view and a cross-sectional view, respectively, showing a state in which pressure is not uniform in the operation of this embodiment.

As shown in FIG. 1, the configuration of the heat seal connector of this embodiment is such that a pattern is formed by a conductive material 3 in which conductive particles 4 are scattered on a transparent base material 2, and the pattern is formed by an insulating adhesive. Covered with 5. A microcapsule 5a in which a dye having a color that can be easily identified is sealed is mixed in the insulating adhesive 5. The microcapsules 5a are designed to burst in response to pressure.
Note that the cover film 6 covers a pattern portion that does not directly contact the counterpart pattern.

The operation of the heat seal connector of this embodiment and the thermal compression bonding of a TCP (tape carrier package) will be described with reference to FIG.

When the heat seal connector 1 is heated and pressurized for a predetermined time by the heater chip from the state before the heating and pressurizing shown in FIGS. 2A and 2B, FIGS. 2C and 2D. As shown in the figure, the conductive flow element 4 breaks through the insulating adhesive 5 and comes into contact with the opposing TCP pattern 8. At the same time,
Due to the application of the pressure, the microcapsules 5a rupture, and the encapsulated dye flows out. Depending on the magnitude of the applied pressure, the number of ruptured microcapsules 5a changes, and the amount of dye that flows out changes. Thereby, the pressure received by the heat seal connector 1 can be non-destructively recognized as the color density through the transparent base material 2.

For example, if the heater chip is inclined or deformed and pressure is not uniformly applied to the entire surface of the thermocompression bonding portion, the pressure is low and the conductive particles 4 protrude from the insulating adhesive 5 as shown in FIG. As a result, conduction with the TCP pattern 8 becomes impossible (FIG. 4B). In such a case, the color is lighter at the place where the pressure is low (part B-B in the figure) and darker at the part where the pressure is high (part C-C in the figure). It can be easily recognized that no is added.

Further, by preliminarily correlating the color density with the pressure, the applied pressure value can be measured.

[0016]

The first effect is that quality control can be performed at all times during the thermocompression bonding operation of the heat seal connector, so that outflow of defective products can be prevented, and improvement measures can be promptly implemented by early detection of defects.

The reason is that the quality of the thermocompression bonding of the heat seal connector can be easily judged nondestructively and externally by the color distribution and density of the heat seal.

[Brief description of the drawings]

FIG. 1A is a perspective view and FIG. 1B is a cross-sectional view showing a structure according to an embodiment of the present invention.

FIGS. 2A and 2C are plan views showing states before and after pressurization in the operation of the embodiment of the present invention, respectively.
(B), (d) is sectional drawing.

3 (a) is a plan view showing a state in which pressurization is not uniform in the operation of the embodiment of the present invention, and FIGS. 3 (b) and 3 (c) are lines BB and C of FIG. It is sectional drawing of the -C line.

4A is a perspective view showing a conventional heat seal connector, FIGS. 4B to 4E are views before and after pressurization, and FIGS. 4B and 4D are plan views, respectively. (C),
(E) is a sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 11 Heat seal connector 2 Base material 3 Conductive material 4 Conductive particle 5 Insulating adhesive 5a Microcapsule 6 Cover film 7 TCP 8 TCP pattern

Claims (2)

(57) [Claims] 1. A pattern formed on a transparent substrate with a conductive material mixed with conductive particles is covered with an insulating adhesive, and the conductive particles form the insulating adhesive by heating and pressing by thermocompression bonding. In a pressure-sensitive heat seal connector that breaks through and maintains an electrical connection with a mating pattern, a microcapsule having a dye and reacting to pressure is mixed into the insulating adhesive, and the microcapsule that ruptures by the pressurization is mixed. A pressure-sensitive heat seal connector characterized in that the quality of the thermocompression bonding is determined non-destructively by the distribution of color density. 2. The pressure-sensitive heat seal connector according to claim 1, wherein a correlation between the color density and the pressing force is known in advance, and a value of the applied pressure can be measured.