JPH02291688A - Manufacture of heat seal connector member - Google Patents

Abstract

PURPOSE:To improve the reliability of a product such as the adhesive strength, the electric resistance, and the like in a simple structure and manufacturing process, by screen-printing an anisotropic conduction thermal-welded layer, placing a pin on a circuit opposite to the pin, and moreover, placing the thermal-welded layer and applying a thermal welding to it. CONSTITUTION:On a conductive graphite circuit 3, anisotropic conduction thermal- welded suspension is covered and spread by a screen printing, and dried to form anisotropic conduction thermal-welded layers 4 and 4'. Then, on a striped minute-line form conductive circuit pattern 3 at one end of one side of a base film 1, pins 6 to be inserted along the pattern 3 are loaded leaving the pin heads 6a, contacted integrally to a conductive layer opposite to the thermal-welded layer 4 at one side end of the film 1, and buried there. Then, at both ends of one side of the base film 1 to be thermal-welded, the layer is spread along the whole surface by the screen printing covering even the bases of the pin connectors 6, and a heating and drying process is applied to form a thermal-welded layer 5 at the uppermost layer. After that, said thermal-welded film is welded thermally at a specific temperature and pressure. In such a way, the tips 6a of the pins 6 are inserted directly to a PCB base, and a continuity is also maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a heat-seal connector with pins, and is particularly applicable to liquid crystal display tubes, electrochromic displays (ECD), electrodes of solar cells, and the like. The present invention relates to a method of manufacturing a heat-seal connector member with a bottle that connects a printed circuit board and the other pin connector insertion terminal.

That is, the present invention provides a conductive silver circuit pattern and an overlying conductive silver circuit pattern in order to electrically and mechanically connect the side surface of the connection terminal of an electronic component or printed circuit board to the other side of the non-contact insertion terminal. A conductive graphite circuit pattern coated on a flexible substrate film having a fir-striped connector conductive circuit pattern formed by printing;
A connector pin, a conductive anisotropic pressure bonding layer, and a thermocompression bonding layer are provided on the surface of the end on the bottle attachment side, and the connector pin is inserted into the mating adapter and both conductive terminals are heat-sealed at the same time. The present invention relates to a method for manufacturing a heat seal connector with pins.

(Prior art) Conventionally, the use of this type of heat-seal connector member has made it possible to make equipment and devices smaller, lighter, thinner, and lower in cost, and the reliability of the connector has also been highly evaluated. ing.

However, the conventional manufacturing method for obtaining this type of heat-sealed connector is to apply a conductive anisotropic heat-sealed connector obtained by forming a conductive circuit in the form of vertical stripes and a thermocompression layer by printing and adhering it to an RPC board at a high temperature. 100-200
It was constructed by thermo-compression bonding at a pressure of 1 to 50 kg/cm.However, in that case, the adhesive strength after thermo-compression bonding was quite weak and insufficient, so a separate single-sided adhesive tape was wrapped around it for reinforcement. In many cases, the reliability of the product was obtained through

Furthermore, in order to establish continuity between circuits and connections, it was necessary to use a very special conductive suspension and thermocompression paint, and quality control during the manufacturing process was delicate and extremely difficult.

(Problems to be Solved by the Invention) The present invention provides a solution to these conventional problems, and achieves the required adhesive strength, electrical resistance, etc. with a relatively simple structure and manufacturing process. The present invention aims to provide a method for manufacturing a heat seal connector member with pins that provides product reliability.

(Means for Solving the Problems) As the embodiments of the present invention can be seen in the drawings, the present invention electrically connects the connecting terminal side of an electronic component or printed circuit board and the other pin connector insertion terminal side. For mechanical cross-linking, a conductive silver circuit pattern and a conductive graphite circuit pattern 3 overcoated thereon are formed by printing on a flexible substrate film 1 having a conductive circuit pattern in the form of vertical stripes, Furthermore, the connector pin 6, the conductive anisotropic pressure bonding layer 4.4', and the thermocompression bonding layer 5 on the surface of the end on the pin attachment side are provided, respectively, so that the connector pin 6 can be inserted into the mating adapter at the same time, and both conductive terminals of the connector can be inserted. 4', 5
In the method for manufacturing a heat-sealed connector member with pins configured by heat-sealing, (a) particle size of 0.1 to 60μ
20 to 80% by weight of powder, and 5 to 40% by weight of a rubber-based and thermoplastic resin binder consisting of one or more of chloroprene rubber, chlorosulfonated rubber, polyurethane resin, and polyester resin. , (c) Organic solvent 15 consisting of one or more of dimethylformamide, diacetone alcohol, isophorone, dioxane, diethyl carbitol, butyl carbitol, and turpentine oil.
~80% heavy debt was mixed (A+C) and uniformly dispersed with an apparent specific gravity of 0.9 to 2.3 and a viscosity of 300 to 12.
,000 poise conductive silver suspension paint is used to connect the side surface of the temporary connection terminal of the electronic component or printed circuit board to the pin connector insertion terminal portion of the other side on one side of the flexible insulating substrate film 1. Step (A) of applying and drying the dimple-striped strip pattern 2 (conductive silver circuit), which is the conductive silver circuit to be used, by screen printing;
20 to 80% by weight of electrically conductive fine powder consisting of one or both of graphite powder with a particle diameter of 0.1 μ or less and carbon black powder with a particle size of 0.1 μ or less; Type 1 or 2
Rubber-based and thermoplastic resin-based binders consisting of 5 to 3 species
0% by weight and 15 to 80% by weight of an organic solvent consisting of one or more of dimethylformamide, diacetone alcohol, isophorone, diethyl carbitol, butyl carbyl, and turpentine oil. + Filter) Dissolved and uniformly dispersed apparent specific gravity 0.9 to 2.3
A conductive suspension having a viscosity of 300 to 12,000 poise is used to overcoat the vertically striped conductive circuit pattern 2 formed in the coating and drying step (A), and is coated by screen printing, dried, and conductive. (a) Graphite powder with a particle size of 0.5 to 60μ, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, gold-plated nickel powder, gold-plated copper powder, gold-plated tin powder, and carbon black powder of 0.1 μ or less, or
0.5 to 20% by weight of conductive fine powder consisting of two or more types;
(b) 5 to 60% by weight thermocompression bondable polymer binder consisting of one or more of chloroprene synthetic rubber, ethylene vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. and (c) 30 to 85% by weight of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethyl carbitol, and cellosolve acetate, and (d) calcium carbonate. powder, 0.5 to 5% extender pigment consisting of one or two types of titanium oxide powder, or in addition to these,
(e) A tackifying rule of 0.5 to 15% by weight consisting of one or two of terpene resin and aliphatic hydrocarbon resin is mixed and dissolved with JJu and uniformly dispersed with an apparent specific gravity of 0. .7 to 2.0, viscosity 50 to 1500 poise conductive anisotropic thermocompression bonding ｝U冫蜀｝night (a+b+c+d) or (a
+ b f c 1-1-e) by screen printing and drying to form a conductive anisotropic thermocompression bonding layer 4.4', and plating with solder, nickel or gold. Using a flat connecting pin 6 made of copper or iron, apply a strip along the vertically striped conductive circuit pattern 3 on one end of one side of the substrate film 1 obtained by the coating and drying process (A+B+C). , pin head 6a to be inserted
(i) step (D) of embedding titanium oxide, talc, 5 to 30% by weight of powder consisting of one or more of hydrated alumina and colloidal silica, and (ii) one or more of chloroprene synthetic rubber, polyester resin, ethylene-vinyl acetate copolymer resin, and polyethyl methacrylate resin. 2
(iii) isophorone, diacetone alcohol,
10 to 70% by weight of an organic solvent consisting of one or more of methyl isobutyl ketone, xylene, toluene and diethyl carbitol, and (iv) one or two of terpene resins and aliphatic hydrocarbon resins. Mixture with 0.1 to 20% by weight of tackifier (i + ii + iii
+iv) Dissolved and uniformly dispersed apparent specific gravity 0.8
~1.4, using an insulating thermocompression suspension paint with a viscosity of 150 to 5000 poise, the flexibility is extremely high! Step (E) of applying screen printing to both ends of one side of the substrate film to be thermocompression bonded, covering the entire surface including the base of the connector pin 6, and heating and drying to form a thermocompression bonding layer as the top layer; The thermocompression film was heated at a temperature of 100 to 200°C and a pressure of 1 to 50°C.
The special feature is that it consists of a step (F) of thermo-compression bonding at kg/Cm2 and heat-sealing each of them together with the connecting bottle (Δ+ B 1 C + D f E 1 F). .

Next, the connector pin 6 according to the present invention is preferably flat, as shown in FIGS. 5 and 6.

Steel materials (cu, Fe, etc.) rolled by a rolling mill are
It is obtained by molding for insertion into printed circuit board pin connectors and coating with solder, nickel or gold by electrolytic refining.

For example, the pins have a pitch of 1.251T+m and a length of 9
mm, width 0.5 mm, and thickness 0.3 mm.

Further, the pin is wound up into a roll by fixing it with a hole of φ2 in the width of 4 + nm. The fixing bracket has φ2 holes at a pitch of 2.5mm, and these holes serve as a reference for forming pins at a pitch of 1.25mm, and it is also possible to form pins with various other pinches. It is.

The pin connector 6 formed as described above is pressed (cut) as shown in FIG. 7 in order to be used as a heat seal connector with pins according to the present invention. This is because the heat seal connector with bottle has 18 products placed in a row as shown in FIGS. 8 to 10, and is crimped in each row.

In the present invention, by crimping the pin connector 6, it is possible to temporarily insert the PCB board into Direct 1 and maintain continuity, and it is also possible to advance into the field of other products that use pins. .

In the present invention, the method for attaching the pin is to screen print the conductive anisotropy 4, 4' on the conductive (graphite) circuit, place the pin 6 on the circuit opposite to the pin 6, and further,
The reliability of the product is obtained by placing the thermocompression bonding layer 5 and thermocompression bonding. Unless the thermocompression bonding layer 5 is used, the pin 6 cannot be completely fixed, so the tensile strength as shown in FIG. 12 cannot be obtained, and the reliability of the product cannot be obtained.

Furthermore, the conductive anisotropic thermocompression bonding layer in step (c) exhibits the conductive anisotropy when thermocompression bonded to both sides to be bonded at a pressure of 5 to 40 kg/cm'' in the lateral direction X in the cross section of the thermocompression bonding layer. 5X10” with minimum spacing width of 0.05mm
It exhibits a relatively high insulation property of Ω/cm3, and at the same time, it exhibits a relatively high insulation property of 10 to 1 kΩ/cm at a maximum longitudinal y-spacing width of 0.04 mm.
It shows conductive anisotropy with a conductivity of cm' (
(See Japanese Patent Application Laid-Open No. 170177/1983). Thermocompression bonding layer 4.4'
The composition of the conductive anisotropic thermocompression bonding solution (a
, b, c, d, e) and their respective component proportions. Even if the upper limit of each numerical limitation is exceeded, this condition cannot be satisfied even if it is less than the lower limit.

Next, the reason for the numerical limitations in the present invention will be described very briefly.

For (a), (c), and (c) in step A, the dark blue striped strip pattern, which is a conductive silver circuit, is placed on the film substrate 1.
This is to improve the adhesion and printability when printing on top, and also to obtain a good conductive silver circuit.

Similarly, (i), (ro), and (ha) in step B are also necessary to obtain a good conductive graphite circuit.

Further, regarding each of the components (i), (ii), (iii), and (iv) that are used to form the thermocompression bonding layer 5 in the E step, a good thermocompression bonding layer 5 can be ensured within each limited range. Also, in the process of thermocompression bonding, heeling, sealing, and setting in step F, if the heating temperature exceeds 200°C, it will be too high and will have an adverse effect on the film itself.
The liquefaction flow phenomenon is not possible. On the other hand, 10
If the temperature is less than 0°C, thermocompression bonding may be insufficient.

(Example) The present invention will be further described below with reference to Examples.

Example 1 (a) 50% by weight of silver powder with a particle size of 0.1 to 60μ, (c) 35% by weight of polyurethane resin, (c) isophorone,
Mix 15% by weight of dioxane (1:1) and dissolve (a + ink + c) and use a 3000 poise conductive suspension paint.
As shown in FIG. 1.2, one side of the flexible insulating substrate film 1 is covered with stripes, which are conductive silver circuits to connect the printed circuit board pin connector insertion part 4 and the printed circuit board terminal part 4'. Step (A) of applying and drying the strip pattern 2 by screen printing; (b) 30% by weight of graphite powder with a particle size of 0.1 to 60μ and 15% by weight of carbon blank with a particle size of 0.1μ or less; (l) 25% by weight of polyurethane resin and (l) 30% by weight of isophorone were mixed and melted, and using a 7000 poise conductive suspension paint,
As shown in FIGS. 1 and 2, the conductive circuit pattern 2 formed in the coating and drying step (A) is overcoated, and the conductive circuit pattern 2 is coated by screen printing and dried.
As shown in FIGS. 1 to 12, (a) 30μ graphite powder 8 is applied to the connection pattern on the base surface of the film substrate formed in the printing step (A+B). (b) 25% polyurethane resin, (c) 40% methyl isobutyl ketone, (d) 3% titanium oxide powder, and (e ) Conductive anisotropic thermocompression bonding made of terpene type resin 14% by weight } Step of coating the suspension by screen printing and drying to form conductive anisotropic thermocompression bonding 1'Z4.4' (c
), and the copper connector pin 6 shown in FIGS. 3 and 4, which was formed to be inserted into a pin connector of a printed circuit board and whose surface was solder plated, was subjected to the drying process (A+B+C).
A step (D) of bringing one end of one side of the substrate film 1 obtained by contacting the corresponding conductive layer of the conductive anisotropic pressure bonding layer 4, and (i) 10% by weight of titanium oxide and (11) polyester. 45% by weight of resin and (iii) 30% by weight of diacetone alcohol and 10% by weight of methyl isobutyl ketone.
% by weight and (iv) terpene resin 5 weight 1% (
i + ii + iii + ivN, using an insulating thermocompression suspension of 500 poise, as shown in Figures 3 and 4.
Screen printing is performed to further overcoat both ends of one side of the flexible insulating substrate film 1 to be bonded by thermocompression.
a step (E) of coating the entire surface, also covering the base of the connector pin 6, and heating and drying to form a thermocompression bonding layer 5 as the uppermost layer;
The obtained uppermost thermocompression bonding layer film 5 was heated at a heating temperature of 15
0℃, pressure 30kg/c, heat compression bonding in 10 seconds,
Both the connector pins and the connector pins are obtained by combining them with the step (F) of integrally connecting them.

The heat-sealed connector member with pins thus obtained is set by directly inserting the head 6a of the pin 6 into the pin insertion part of the mating adapter and heat-sealing it to the mating adapter using the thermocompression bonding layer 5. . The other end without the pin 6 is crimped to a desired terminal via the conductive anisotropic crimping layer. In this case, sufficient practical conduction and insulation results were obtained.

When thermocompression bonding is carried out at a temperature of <150°C and a pressure of 30 kg/cm2 as described above, the cross section of the thermocompression bonding layer exhibiting the conductive anisotropy has a width of 5 mm at a minimum width of 0.05 mm in the lateral direction
It exhibits a relatively large insulation property of about X10"Ω/cm',
At the same time, the dark direction y interval width is 1 at a maximum of 0.04 mm.
It exhibited conductivity of the order of kΩ/cm'.

As described above, the heat-seal connector member with a bottle according to the present invention is not intended to simply improve the conventional conductive anisotropic heat-seal connector member. , liquid crystal plate terminal and P
Continuity was maintained by crimping the connector pins to the CB board, but in the present invention, the tips 6a of the connector pins can be directly inserted into the PCB board by crimping the connector pins to the ends of the board film. It became possible to maintain continuity. Furthermore, it has become possible to expand into the field of other products that use bottles.

Additionally, as previously mentioned, the method of attaching these connector pins according to the present invention involves screen printing a conductive anisotropic layer on the overcoated conductive (!I and graphite) circuitry and attaching the pins. Reliability as a connector is obtained by placing a bottle on the circuit facing the circuit, and further placing a thermocompression bonding layer 5 and bonding by thermocompression. If the thermocompression bonding layer 5 is not used, the pins will not be completely fixed, and as shown in FIG. 12, the tensile strength will not be obtained and the reliability of the product will not be obtained. A tensile strength of 500 g or more was obtained for each pin.

[Brief explanation of the drawing]

FIG. 1 is an enlarged plan view showing a pin-equipped heat seal connector member in the manufacturing process according to an embodiment of the present invention, and FIG. 2 is a plan view taken along line I-1' in FIG. FIG. 3 is an enlarged plan view showing a pin-equipped heat-seal connector member according to an embodiment of the present invention; FIG. FIG. 5 is a plan view showing a plurality of connector pins according to an embodiment of the present invention; FIG. FIG. 7 is an enlarged perspective view, FIG. 7 is a plan view showing a plurality of connector pins before thermocompression bonding in an embodiment of the present invention, and FIG. FIG. 9 is a schematic plan view showing one end of the substrate film before thermocompression bonding. FIG. 9 is a schematic plan view showing one end of the substrate film before thermocompression bonding. FIG. 10 is a schematic plan view showing a state before cutting; FIG. 10 is a schematic plan view showing a single piece of a pin-equipped connector member in an embodiment of the present invention; FIG. It is a side schematic view, and furthermore, the first
FIG. 2 is a schematic side view showing a tensile test of the connector pin. ■... Flexible insulation film 2... Conductive silver circuit 3
...Conductive graphite circuit 4...Conductive anisotropic pressure bonding layer (pin connector side) 4...
・Conductive anisotropic pressure bonding layer (printed circuit terminal side) 5...Thermocompression bonding layer 6...Pin connector 6a...Pin connector head Patent applicant Nippon Graphite Industries Co., Ltd.

Claims (1)

[Claims] 1. In order to electrically and mechanically connect the connecting terminal side of an electronic component or a printed circuit board to the other pin connector insertion terminal side, a conductive silver circuit pattern is used. On a flexible substrate film having a conductive circuit pattern formed by printing an overcoated conductive graphite circuit pattern and a vertically striped connector, a connector pin,
A heat-sealed connector with a pin that is constructed by providing a conductive anisotropic pressure bonding layer and a thermocompression bonding layer on the end surface of the pin attachment side, and heat-sealing both conductive terminals of the connector at the same time as the connector pin is inserted into the mating adapter. In the manufacturing method, (a) 20 to 80% by weight of silver powder with a particle size of 0.1 to 60μ, and (b) a rubber consisting of one or more of chloroprene rubber, chlorosulfonated rubber, polyurethane resin, and polyester resin. and (c) an organic solvent consisting of one or more of dimethylformamide, diacetone alcohol, isophorone, dioxane, diethyl carbitol, butyl carbitol, and turpentine oil. ~80% by weight (I+
B+C) Dissolved and uniformly dispersed apparent specific gravity 0.9~
2.3. Using a conductive silver suspension paint with a viscosity of 300 to 12,000 poise, coat one side of the flexible insulating substrate film.
A step of applying and drying a vertically striped strip pattern, which is a conductive silver circuit, by screen printing to connect the side surface of the connection terminal of an electronic component or printed circuit board and the other pin connector insertion terminal part (A ), (i) 20 to 80% by weight of conductive fine powder consisting of one or two of graphite powder with a particle size of 0.1 to 60μ and carbon black powder with a particle size of 0.1μ or less, and (b) chloroprene rubber,
5 to 30% by weight of a rubber-based and thermoplastic resin binder consisting of one or more of chlorosulfonated rubber, polyurethane resin, and polyester resin, and () dimethylformamide, diacetone alcohol, isophorone, diethyl carbitol. , butyl carbitol and 15 to 80% by weight of an organic solvent consisting of one or more of turpentine oil are mixed and dispersed uniformly with an apparent specific gravity of 0.9 to 2.3. A conductive suspension having a viscosity of 300 to 12,000 poise is used to overcoat the vertically striped conductive circuit pattern formed in the coating and drying step (A), and is then coated by screen printing and dried to make it conductive. (a) on the connecting terminal pattern on the surface of the film substrate formed in the step (B) of forming a graphite circuit and the printing drying step (A+B);
Graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, gold-plated nickel powder, gold-plated copper powder, gold-plated tin powder with a particle size of 0.5 to 60μ, and carbon black powder with a particle size of 0.1μ or less 1 type or
0.5 to 20% by weight of conductive fine powder consisting of two or more types,
(b) 5 to 60% by weight thermocompression bondable polymer binder consisting of one or more of chloroprene synthetic rubber, ethylene vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. and (c) 30 to 85% by weight of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethyl carbitol, and cellosolve acetate, and (d) calcium carbonate powder, oxidized 0.5 to 5% by weight of an extender pigment consisting of one or two types of titanium powder, or in addition to these,
(e) 0.5 to 15% by weight of a tackifier consisting of one or two of terpene resin and aliphatic hydrocarbon resin are added, mixed and dissolved, and uniformly dispersed with an apparent specific gravity of 0.
．． 7 to 2.0, viscosity 50 to 1500 poise conductive anisotropic thermocompression bonding suspension (a+b+c+d) or (a+b+c+d
Step (c) of coating +e) by screen printing and drying to form a conductive anisotropic thermocompression bonding layer; Process (A
+B+C)) Place the conductive circuit pattern on one side of the substrate film, leaving the pin heads to be inserted, along these lines, and place the conductive anisotropic pressure bonding layers on both ends of the substrate film. Step (D) of integrally contacting and embedding the conductive layer to be opposed; ii) 20 to 60% by weight of a thermoplastic resin binder consisting of one or more of chloroprene synthetic rubber, polyester resin, ethylene vinyl acetate copolymer resin, and polyethyl methacrylate resin; and (iii) isophorone, diacetone alcohol. , 10 to 70% by weight of an organic solvent consisting of one or more of methyl isobutyl ketone, xylene, toluene and diethyl carbitol;
) Mixed with 0.1 to 20% by weight of a tackifier consisting of one or two of terpene resins and aliphatic hydrocarbon resins (
i+ii+iii+iv) Thermocompression bonding of one side of the flexible insulating substrate film using a dissolved and uniformly dispersed insulating thermocompression suspension paint with an apparent specific gravity of 0.8 to 1.4 and a viscosity of 150 to 5000 poise. Step (E) of coating the entire surface of the connector pin by screen printing on both ends thereof, covering the base of the connector pin, and heating and drying to form a thermocompression bonding layer as the top layer; and heating the thermocompression bonding film at a temperature of 100% A pin characterized in that it is bonded (A+B+C+D+E+F) with a step (F) of thermocompression bonding at ~200°C and a pressure of 1 to 50 kg/cm^2 and heat-sealing the connector pins together with each other. A manufacturing method for heat-sealed connector parts.