JPH04292803A - Anisotropic conductive film - Google Patents

Anisotropic conductive film

Info

Publication number
JPH04292803A
JPH04292803A JP5631291A JP5631291A JPH04292803A JP H04292803 A JPH04292803 A JP H04292803A JP 5631291 A JP5631291 A JP 5631291A JP 5631291 A JP5631291 A JP 5631291A JP H04292803 A JPH04292803 A JP H04292803A
Authority
JP
Japan
Prior art keywords
individual bodies
anisotropic conductive
conductive film
dispersed
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5631291A
Inventor
Akira Tanaka
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5631291A priority Critical patent/JPH04292803A/en
Publication of JPH04292803A publication Critical patent/JPH04292803A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/29198Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298Fillers
    • H01L2224/29499Shape or distribution of the fillers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

PURPOSE: To heighten the electric connection between electrodes so as to further narrow the electrode pitch by using an anisotropic conductive film in which individual bodies each having an insulating coating and containing conductive particles are dispersed and mixed.
CONSTITUTION: In a connecting material to be used between electrodes 4 arranged opposite to each other to make the electric connection, individual bodies each having as an outer wall an insulative film 7 different from the resin component 8 which is a main body of the connecting material are dispersed and mixed in the resin 8 while the individual bodies contain conductive particles 5.
COPYRIGHT: (C)1992,JPO&Japio
JP5631291A 1991-03-20 1991-03-20 Anisotropic conductive film Pending JPH04292803A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5631291A JPH04292803A (en) 1991-03-20 1991-03-20 Anisotropic conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5631291A JPH04292803A (en) 1991-03-20 1991-03-20 Anisotropic conductive film

Publications (1)

Publication Number Publication Date
JPH04292803A true JPH04292803A (en) 1992-10-16

Family

ID=13023637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5631291A Pending JPH04292803A (en) 1991-03-20 1991-03-20 Anisotropic conductive film

Country Status (1)

Country Link
JP (1) JPH04292803A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999034436A1 (en) * 1997-12-24 1999-07-08 Shinko Electric Industries Co., Ltd. Semiconductor device
WO2004064143A1 (en) * 2003-01-08 2004-07-29 Lg Cable Ltd. Method of microelectrode connection and connected structure of use threof
US6940180B1 (en) 1996-09-05 2005-09-06 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
JP2007035979A (en) * 2005-07-28 2007-02-08 Asahi Kasei Electronics Co Ltd Connection structure of conductive particle
US7390732B1 (en) 1997-07-15 2008-06-24 Hitachi, Ltd. Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
JP2012142138A (en) * 2010-12-28 2012-07-26 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material and connection structure
WO2012121070A1 (en) * 2011-03-10 2012-09-13 コニカミノルタアドバンストレイヤー株式会社 Camera module and method for inspecting camera module
JP2013045565A (en) * 2011-08-23 2013-03-04 Dexerials Corp Anisotropic conductive film, method for producing anisotropic conductive film, connection method, and assembly
WO2014156930A1 (en) * 2013-03-28 2014-10-02 デクセリアルズ株式会社 Connection method for circuit member, and assembly

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7084517B2 (en) 1996-09-05 2006-08-01 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
US6940180B1 (en) 1996-09-05 2005-09-06 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
US7390732B1 (en) 1997-07-15 2008-06-24 Hitachi, Ltd. Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
US6303998B1 (en) 1997-12-24 2001-10-16 Shinko Electric Industries Co., Ltd. Semiconductor device having a chip mounted on a rectangular substrate
WO1999034436A1 (en) * 1997-12-24 1999-07-08 Shinko Electric Industries Co., Ltd. Semiconductor device
CN100356536C (en) * 2003-01-08 2007-12-19 Lg电线株式会社 Method of microelectrode connection and connected structure of use thereof
WO2004064143A1 (en) * 2003-01-08 2004-07-29 Lg Cable Ltd. Method of microelectrode connection and connected structure of use threof
JP2007035979A (en) * 2005-07-28 2007-02-08 Asahi Kasei Electronics Co Ltd Connection structure of conductive particle
JP4703306B2 (en) * 2005-07-28 2011-06-15 旭化成イーマテリアルズ株式会社 Conductive particle connection structure
JP2012142138A (en) * 2010-12-28 2012-07-26 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material and connection structure
WO2012121070A1 (en) * 2011-03-10 2012-09-13 コニカミノルタアドバンストレイヤー株式会社 Camera module and method for inspecting camera module
JP2013045565A (en) * 2011-08-23 2013-03-04 Dexerials Corp Anisotropic conductive film, method for producing anisotropic conductive film, connection method, and assembly
CN103748744A (en) * 2011-08-23 2014-04-23 迪睿合电子材料有限公司 Anisotropic conductive film, process for producing anisotropic conductive film, connecting method, and bonded object
US9924599B2 (en) 2011-08-23 2018-03-20 Dexerials Corporation Anisotropic conductive film, anisotropic conductive film production method, connecting method, and bonded structure
WO2014156930A1 (en) * 2013-03-28 2014-10-02 デクセリアルズ株式会社 Connection method for circuit member, and assembly

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