CN103503584A - 相机模块以及相机模块的检查方法 - Google Patents

相机模块以及相机模块的检查方法 Download PDF

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Publication number
CN103503584A
CN103503584A CN201280012005.5A CN201280012005A CN103503584A CN 103503584 A CN103503584 A CN 103503584A CN 201280012005 A CN201280012005 A CN 201280012005A CN 103503584 A CN103503584 A CN 103503584A
Authority
CN
China
Prior art keywords
circuit board
splicing ear
pcb
outer edge
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280012005.5A
Other languages
English (en)
Chinese (zh)
Inventor
清末成宪
片桐祯人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Konica Minolta Advanced Layers Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of CN103503584A publication Critical patent/CN103503584A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
CN201280012005.5A 2011-03-10 2012-02-29 相机模块以及相机模块的检查方法 Pending CN103503584A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-052454 2011-03-10
JP2011052454 2011-03-10
PCT/JP2012/055024 WO2012121070A1 (fr) 2011-03-10 2012-02-29 Module de caméra et procédé de contrôle du module de caméra

Publications (1)

Publication Number Publication Date
CN103503584A true CN103503584A (zh) 2014-01-08

Family

ID=46798038

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280012005.5A Pending CN103503584A (zh) 2011-03-10 2012-02-29 相机模块以及相机模块的检查方法

Country Status (3)

Country Link
JP (1) JPWO2012121070A1 (fr)
CN (1) CN103503584A (fr)
WO (1) WO2012121070A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255958A (ja) * 1995-03-15 1996-10-01 Seiko Epson Corp フレキシブル基板及びその接続構造及びその接続方法
JP2009176792A (ja) * 2008-01-22 2009-08-06 Nec Saitama Ltd 熱圧着接続方法、装置及び配線基板
JP2010192652A (ja) * 2009-02-18 2010-09-02 Konica Minolta Opto Inc プリント配線板の接続構造及びカメラモジュール
CN101836517A (zh) * 2007-10-23 2010-09-15 索尼化学&信息部件株式会社 布线基板的承受台以及使用了它的布线基板的连接装置、连接方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120849B2 (ja) * 1987-06-05 1995-12-20 株式会社リコー 回路基板の接続方法及び装置
JPH03120790A (ja) * 1989-10-03 1991-05-22 Toshiba Corp 配線基板の接続装置
JPH04292803A (ja) * 1991-03-20 1992-10-16 Hitachi Ltd 異方導電性フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255958A (ja) * 1995-03-15 1996-10-01 Seiko Epson Corp フレキシブル基板及びその接続構造及びその接続方法
CN101836517A (zh) * 2007-10-23 2010-09-15 索尼化学&信息部件株式会社 布线基板的承受台以及使用了它的布线基板的连接装置、连接方法
JP2009176792A (ja) * 2008-01-22 2009-08-06 Nec Saitama Ltd 熱圧着接続方法、装置及び配線基板
JP2010192652A (ja) * 2009-02-18 2010-09-02 Konica Minolta Opto Inc プリント配線板の接続構造及びカメラモジュール

Also Published As

Publication number Publication date
JPWO2012121070A1 (ja) 2014-07-17
WO2012121070A1 (fr) 2012-09-13

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140108