WO2012108052A1 - Procédé de production de substrat monocristallin et organe monocristallin renfermant une couche modifiée - Google Patents

Procédé de production de substrat monocristallin et organe monocristallin renfermant une couche modifiée Download PDF

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Publication number
WO2012108052A1
WO2012108052A1 PCT/JP2011/052941 JP2011052941W WO2012108052A1 WO 2012108052 A1 WO2012108052 A1 WO 2012108052A1 JP 2011052941 W JP2011052941 W JP 2011052941W WO 2012108052 A1 WO2012108052 A1 WO 2012108052A1
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Prior art keywords
single crystal
modified layer
layer
crystal member
laser beam
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PCT/JP2011/052941
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English (en)
Japanese (ja)
Inventor
国司　洋介
鈴木　秀樹
利香 松尾
順一 池野
Original Assignee
信越ポリマー株式会社
国立大学法人埼玉大学
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Application filed by 信越ポリマー株式会社, 国立大学法人埼玉大学 filed Critical 信越ポリマー株式会社
Priority to JP2012556739A priority Critical patent/JP6004338B2/ja
Priority to PCT/JP2011/052941 priority patent/WO2012108052A1/fr
Priority to CN201180067352.3A priority patent/CN103380482B/zh
Publication of WO2012108052A1 publication Critical patent/WO2012108052A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686—Pulsed laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a single crystal substrate manufacturing method and an internal modified layer forming single crystal member, and more particularly, to a single crystal substrate manufacturing method and an internal modified layer forming single crystal member for cutting a single crystal substrate thinly and stably.
  • a semiconductor wafer represented by a single crystal silicon (Si) wafer a cylindrical ingot solidified from a silicon melt melted in a quartz crucible is cut into blocks of an appropriate length. Then, the peripheral edge is ground to a target diameter, and then the block-shaped ingot is sliced into a wafer shape with a wire saw to manufacture a semiconductor wafer.
  • Si single crystal silicon
  • the semiconductor wafer manufactured in this way is subjected to various processes such as circuit pattern formation in the previous process in order and used in the subsequent process.
  • the back surface is back-grinded and thinned. Accordingly, the thickness is adjusted to about 750 ⁇ m to 100 ⁇ m or less, for example, about 75 ⁇ m or 50 ⁇ m.
  • a conventional semiconductor wafer is manufactured as described above, and an ingot is cut with a wire saw, and a cutting allowance larger than the thickness of the wire saw is required for cutting, so a thin semiconductor wafer with a thickness of 0.1 mm or less It is very difficult to manufacture the product, and the product rate is not improved.
  • SiC silicon carbide
  • SiC silicon carbide
  • ingots can be easily formed with a wire saw because of its higher hardness than Si.
  • the condensing point of the laser beam is aligned with the inside of the ingot with the condensing lens, and the ingot is relatively scanned with the laser beam to form a planar modified layer by multiphoton absorption inside the ingot.
  • a substrate manufacturing method and a substrate manufacturing apparatus are disclosed in which a part of the ingot is peeled off using the modified layer as a peeling surface.
  • Patent Document 1 discloses a technique of using a multiphoton absorption of a laser beam to form a modified layer inside a silicon ingot and peeling the wafer from the silicon ingot using an electrostatic chuck.
  • a glass plate is attached to the objective lens of NA0.8, a laser beam is irradiated toward the silicon wafer for solar cells, and a modified layer is formed inside the silicon wafer.
  • a technique for fixing an acrylic resin plate with an instantaneous adhesive and peeling it is disclosed.
  • Patent Document 3 discloses, in particular, paragraphs 0003 to 0005, 0057, and 0058, a technique for dicing by forming a microcavity by condensing laser light inside a silicon wafer and causing multiphoton absorption. .
  • Patent Document 1 it is not easy to uniformly peel off a large area substrate (silicon substrate).
  • Patent Document 3 is a technique related to dicing for cutting a silicon wafer into individual chips, and it is not easy to apply this to manufacturing a thin plate-like wafer from a single crystal ingot such as silicon.
  • an object of the present invention is to provide a single crystal substrate manufacturing method and an internal modified layer forming single crystal member capable of easily manufacturing a relatively large and thin single crystal substrate.
  • a laser focusing unit is disposed in a non-contact manner on a single crystal member, and the laser beam is irradiated on the surface of the single crystal member by the laser focusing unit. Irradiating and condensing the laser beam inside the single crystal member, and relatively moving the laser condensing means and the single crystal member, so that a two-dimensional modification is made inside the single crystal member.
  • a method for manufacturing a single crystal substrate comprising: a step of forming a porous layer; and a step of forming a single crystal substrate by separating a single crystal layer separated by the modified layer from an interface with the modified layer Is done.
  • the laser beam irradiated from the outside of the single crystal member and condensed inside the single crystal member is constituted by an aggregate of crack portions parallel to the irradiation axis of the laser beam.
  • An internal modified layer forming single crystal member comprising a two-dimensional modified layer and a single crystal layer adjacent to the modified layer is provided.
  • FIG. 3 is a schematic cross-sectional view showing that a crack is formed inside a single crystal member by laser light irradiation in the first embodiment.
  • FIG. 3 is a schematic cross-sectional view for explaining that the single crystal layer is peeled from the modified layer by bonding a metal substrate to the upper and lower surfaces of the internal modified layer forming single crystal member in the first embodiment.
  • FIG. 3 is a schematic cross-sectional view for explaining that the single crystal layer is peeled from the modified layer by bonding a metal substrate to the upper and lower surfaces of the internal modified layer forming single crystal member in the first embodiment.
  • the typical perspective sectional view explaining the modification of a 1st embodiment The optical microscope photograph which shows the example of the peeling surface of a single crystal layer in 1st Embodiment.
  • FIG. 1 The optical microscope photograph of the cleaved surface of a silicon wafer in Example 1 of Test Example 1.
  • FIG. 2 The typical bird's-eye view of the single crystal member internal processing apparatus used when explaining the single crystal substrate manufacturing method and internal modified layer formation single crystal member which concern on 2nd Embodiment.
  • FIG. 1 is a schematic bird's-eye view for explaining that laser light is condensed in the air by the laser condensing means in this embodiment
  • FIG. 2 is a single crystal member by the laser condensing means in this embodiment. It is a typical bird's-eye view explaining that the laser beam was condensed inside.
  • FIG. 3 is a schematic cross-sectional structure illustrating the single crystal substrate manufacturing method and the internal modified layer forming single crystal member 11 according to the present embodiment.
  • FIG. 4 is a schematic cross-sectional view showing that a crack 12c is formed inside the single crystal member by irradiation with laser light.
  • FIG. 5 is a schematic perspective sectional view showing that the modified layer 12 formed by condensing the laser beam is exposed on the side wall of the internal modified layer forming single crystal member 11.
  • the single crystal substrate manufacturing method includes a step of disposing the condensing lens 15 on the single crystal member 10 as a laser condensing unit (laser condensing unit) in a non-contact manner, The step of irradiating the surface of the member 10 with the laser beam B and condensing the laser beam B inside the single crystal member 10, and the relative movement of the condenser lens 15 and the single crystal member 10, In addition, the step of forming the two-dimensional modified layer 12 and the single crystal layer 10u divided by the modified layer 12 are peeled off from the interface with the modified layer 12 so that the single layer as shown in FIG. Forming a crystal substrate 10s.
  • FIG. 7 is a schematic cross-sectional view for explaining that the single crystal layer 10 u is peeled from the modified layer 12.
  • the condensing lens 15 is configured to correct aberration due to the refractive index of the single crystal member 10. Specifically, as shown in FIG. 1, in the present embodiment, the condensing lens 15 is configured such that when the condensing lens 15 condenses in the air, the laser light that has reached the outer peripheral portion E of the condensing lens 15 is condensed. The laser beam is corrected so as to be condensed on the condensing lens side with respect to the laser light reaching the central portion M. That is, when the light is condensed, the condensing point EP of the laser light reaching the outer peripheral portion E of the condensing lens 15 is condensed compared to the condensing point MP of the laser light reaching the central portion M of the condensing lens 15. The correction is made so that the position is close to the lens 15.
  • the condensing lens 15 includes a first lens 16 that condenses in the air, and a second lens 18 disposed between the first lens 16 and the single crystal member 10. .
  • Both the first lens 16 and the second lens 18 are lenses capable of condensing laser light in a conical shape.
  • the depth (interval) D from the surface 10t (irradiated side surface) of the single crystal member 10 on the side irradiated with the laser beam B to the modified layer 12 is mainly set to the first lens 16 and the surface 10t. It is the structure adjusted with the distance L1. Further, the thickness T of the modified layer 12 is adjusted mainly by the distance L2 between the second lens 18 and the surface 10t.
  • aberration correction in the air is mainly performed by the first lens 16, and aberration correction in the single crystal member 10 is mainly performed by the second lens 18.
  • the distances L1 and L2 are set.
  • the first lens 16 in addition to a spherical or aspherical single lens, a combination lens can be used to correct various aberrations and ensure a working distance, and the NA is 0.3 to 0.7. It is preferable.
  • the NA of the condensing lens 15 in the air defined by the light and its condensing point EP is preferably 0.3 to 0.85, and more preferably 0.5 to 0.85.
  • the thickness of the modified layer 12 is not necessary, it is possible to dispose only one lens instead of the first lens 16 and the second lens 18. In that case, it is preferable to have a structure capable of correcting aberrations in the single crystal member.
  • the size of the single crystal member 10 is not particularly limited, it is preferable that the surface 10t irradiated with the laser beam B is flattened in advance, for example, made of a thick silicon wafer of ⁇ 300 mm.
  • the laser beam B is irradiated not on the peripheral surface of the single crystal member 10 but on the surface 10t from the irradiation device (not shown) through the condenser lens 15.
  • the laser beam B is composed of, for example, a pulse laser beam having a pulse width of 1 ⁇ s or less, and a wavelength of 900 nm or more, preferably 1000 nm or more is selected.
  • a YAG laser or the like is suitable. Used for.
  • a laser oscillator may be disposed above the condensing lens 15 to emit light toward the condensing lens 15, or a reflecting mirror may be disposed above the condensing lens 15 to irradiate laser light toward the reflecting mirror. And you may make it the form reflected toward the condensing lens 15 with a reflective mirror.
  • the laser beam B preferably has a wavelength of light transmittance of 1 to 80% when the single crystal substrate 10 is irradiated to a single crystal substrate having a thickness of 0.625 mm.
  • a single crystal substrate of silicon since laser light having a wavelength of 800 nm or less has a large absorption, only the surface is processed and the internal modified layer 12 cannot be formed.
  • a wavelength of 900 nm or more, preferably 1000 nm or more is selected.
  • a CO 2 laser with a wavelength of 10.64 ⁇ m has a light transmittance that is too high, so that it is difficult to process a single crystal substrate. Therefore, a YAG fundamental wave laser is preferably used.
  • the reason why the wavelength of the laser beam B is preferably 900 nm or more is that if the wavelength is 900 nm or more, the laser beam B is improved in the transmittance of the single crystal substrate made of silicon, and the modified layer 12 is reliably provided inside the single crystal substrate. It is because it can form. Laser light B is applied to the peripheral portion of the surface of the single crystal substrate or from the central portion of the surface of the single crystal substrate toward the peripheral portion.
  • Modified layer formation process As a process of forming the modified layer 12 in the single crystal member 10 by relatively moving the condenser lens 15 and the single crystal member 10, for example, the single crystal member 10 is placed on an XY stage (not shown). The single crystal member 10 is held by a vacuum chuck or an electrostatic chuck.
  • the condenser lens 15 and the single crystal member 10 are moved to the surface of the single crystal member 10 on the side where the condenser lens 15 is disposed.
  • a large number of cracks 12c are formed by the laser beam B condensed inside the single crystal member 10.
  • the aggregate of crack portions 12p having the cracks 12c is the modified layer 12 described above.
  • the internal modified layer forming single crystal member 11 is manufactured.
  • This internal modified layer forming single crystal member 11 includes a modified layer 12 formed inside the single crystal member, a single crystal layer 10u on the upper side of the modified layer 12 (that is, the irradiated side of the laser beam B), A single crystal portion 10d is provided below the material layer 12.
  • the single crystal layer 10 u and the single crystal portion 10 d are formed by dividing the single crystal member 10 by the modified layer 12.
  • laser beam deflecting means such as a galvanometer mirror or a polygon mirror may be used, and laser light scanning within the irradiation area of the condenser lens 15 may be used in combination.
  • the laser beam B is focused on the surface 10t on the irradiated side of the single crystal member 10, that is, the surface 10t of the single crystal layer 10u. A mark indicating the region is attached, and then the single crystal member 10 is cut (cleaved) based on this mark, and the peripheral portion of the modified layer 12 is exposed and the single crystal layer 10u is peeled off as described later. May be performed.
  • a large number of cracks 12c parallel to the irradiation axis BC of the laser beam B are formed as shown in FIG.
  • the size, density, and the like of the crack 12c to be formed are preferably set in consideration of the material of the single crystal member 10 and the like from the viewpoint of easily peeling the single crystal layer 10u from the modified layer 12.
  • the inner modified layer forming single crystal member 11 is cleaved so as to cross the region to be processed by the laser beam B, that is, the modified layer 12, and a cleavage plane (for example, 14a in FIGS. 3 and 5).
  • -D may be confirmed by observing with a scanning electron microscope or a confocal microscope.
  • a Y stage is fed under the same irradiation conditions to a single crystal member (for example, a silicon wafer) of the same material. It may be easily confirmed by performing linear processing inside the member at intervals of 6 to 50 ⁇ m, cleaving across the member, and observing the cleavage plane.
  • the modified layer 12 and the single crystal layer 10u are separated.
  • the modified layer 12 is exposed on the side wall of the internal modified layer forming single crystal member 11.
  • cleavage is performed along a predetermined crystal plane of the single crystal portion 10d and the single crystal layer 10u.
  • FIG. 5 a structure in which the modified layer 12 is sandwiched between the single crystal layer 10u and the single crystal portion 10d is obtained.
  • the surface 10t of the single crystal layer 10u is a surface on the side irradiated with the laser beam B.
  • the exposure work is omitted. It is possible.
  • metal substrates 28u and 28d are bonded to the upper and lower surfaces of the internal modified layer forming single crystal member 11, respectively. That is, the metal substrate 28u is bonded to the surface 10t of the single crystal layer 10u with the adhesive 34u, and the metal substrate 28d is bonded to the surface 10b of the single crystal portion 10d with the adhesive 34d.
  • Oxide layers 29u and 29d are formed on the surfaces of the metal substrates 28u and 28d, respectively.
  • the oxide layer 29u is bonded to the surface 10t
  • the oxide layer 29d is bonded to the surface 10b.
  • a SUS peeling auxiliary plate is used as the metal substrates 28u and 28d.
  • the adhesive an adhesive that is used in a normal semiconductor manufacturing process and is used as a so-called wax for fixing a commercially available silicon ingot is used.
  • the type of adhesive whose adhesive strength decreases when immersed in warm water decreases the adhesive strength of the adhesive when immersed in water.
  • the layer 10u) is preferably used because it can be easily separated.
  • the metal substrate 28u is attached to the surface 10t of the single crystal layer 10u with a temporary fixing adhesive, and the metal substrate 28u is lined and peeled by applying a force.
  • the adhesive strength of the temporary fixing adhesive only needs to be stronger than the force necessary for peeling at the interface 11u between the modified layer 12 and the single crystal layer 10u.
  • the size and density of the crack 12c to be formed may be adjusted.
  • the temporary fixing adhesive for example, an adhesive made of an acrylic two-component monomer component that cures using metal ions as a reaction initiator is used.
  • the uncured monomer and the cured reaction product are water-insoluble, it is possible to prevent the peeling surface 10f (for example, the peeling surface of the silicon wafer) of the single crystal layer 10u exposed when peeling in water from being contaminated. .
  • the coating thickness of the temporary fixing adhesive is preferably 0.1 to 1 mm, more preferably 0.15 to 0.35 mm before curing. If the application thickness of the temporary fixing adhesive is excessively large, it takes a long time to be completely cured, and cohesive failure of the temporary fixing adhesive is likely to occur when the single crystal member (silicon wafer) is cleaved. . Moreover, when application
  • the application thickness of the temporary fixing adhesive may be controlled by using a method of fixing the metal substrates 28u and 28d to be bonded to an arbitrary height, but simply using a shim plate. Can do.
  • the necessary parallelism may be obtained using one or more auxiliary plates.
  • the metal substrates 28u and 28d are bonded to the upper and lower surfaces of the internal modified layer-forming single crystal member 11 with a temporary fixing adhesive, they may be bonded one by one or may be bonded simultaneously on both sides.
  • the metal substrate is bonded to one side and the adhesive is cured, and then the metal substrate is bonded to the other side.
  • the surface to which the temporary fixing adhesive is applied may be the upper surface or the lower surface of the internal modified layer forming single crystal member 11.
  • a resin film not containing metal ions may be used as the cover layer.
  • the metal substrate to be bonded undergoes a peeling process in water, it is preferably passive for the purpose of suppressing contamination of the silicon wafer, and the oxide layer (oxide film layer) that is formed is thin for the purpose of shortening the tact time of peeling in water. Is preferred.
  • the surface of the metal surface is easily obtained by removing the oxide layer on the metal surface by a mechanical or chemical method and providing an anchor effect.
  • a mechanical or chemical method include acid cleaning using chemicals and degreasing treatment.
  • Specific examples of the mechanical method include sand blasting and shot blasting.
  • the method of damaging the surface of a metal substrate with sand paper is the simplest, and the particle size is preferably # 80 to 2000. Considering the surface damage of the substrate made, # 150 to 800 is more preferable.
  • the method for applying the forces Fu and Fd is not particularly limited.
  • the side wall of the internal modified layer forming single crystal member 11 is etched to form grooves 36 in the modified layer 12, and as shown in FIG.
  • the forces Fu and Fd may be generated by press-fitting (for example, a cutter blade).
  • an upward force component Fu and a downward force component Fd may be generated by applying a force F from the angular direction to the internal modified layer forming single crystal member 11.
  • the peeling surface 10f of the single crystal substrate 10s obtained in this way is a rough surface as shown in FIG. 11, for example.
  • FIG. 11 is an optical micrograph of the peeling surface 10f of the single crystal substrate 10s.
  • a surface 10H cleaved in the crystal orientation plane is also generated in part and is shown.
  • the energy of the laser beam B can be concentrated on the thin thickness portion in the single crystal member 10 with the condenser lens 15 having a large NA. Therefore, the internal modified layer forming single crystal member 11 in which the modified layer (working region) 12 having a small thickness T (length along the irradiation axis BC of the laser beam B) is formed in the single crystal member 10 is manufactured. be able to. Then, it is easy to manufacture the thin single crystal substrate 10 s by peeling the single crystal layer 10 u from the modified layer 12. Further, such a thin single crystal substrate 10s can be easily manufactured in a relatively short time. In addition, since the number of single crystal substrates 10 s can be obtained from the single crystal member 10 by suppressing the thickness of the modified layer 12, the product rate can be improved.
  • the modified layer 12 an aggregate of crack portions 12p parallel to the irradiation axis BC of the laser beam B is formed. Thereby, peeling of the modified layer 12 and the single crystal layer 10 is easy.
  • the peeling surface 10f is roughened by peeling from the interface 11u on the laser light irradiated side of the interfaces 11u and 11d.
  • a roughened peeling surface 10f as a surface to be irradiated with sunlight, it is possible to improve the light collection efficiency when applied to a solar cell.
  • the single crystal substrate 10s is obtained by bonding and peeling the metal substrate 28u having the oxide layer 29u on the surface to the surface of the single crystal layer 10u. Therefore, an adhesive used in a normal semiconductor manufacturing process can be used for bonding to a metal substrate, and a cyanoacrylate adhesive having a strong adhesive force used when bonding an acrylic plate must be used. That's it. Moreover, since the adhesive strength of the adhesive is greatly reduced by being immersed in water after peeling, the single crystal substrate 10s can be easily separated from the metal substrate 28u.
  • the metal substrates 28u and 28d are respectively attached to the upper and lower surfaces of the internal modified layer forming single crystal member 11, and the metal substrates 28u and 28d are peeled by applying force to the single crystal substrate. Although it has been described by forming 10 s, it may be removed by removing the modified layer 12 by etching.
  • the single crystal member 10 is not limited to a silicon wafer, but an ingot of a silicon wafer, an ingot of single crystal sapphire, SiC, or a wafer cut from the ingot, or another crystal (GaN, GaAs, InP) on this surface. Etc.) can be applied. Further, the plane orientation of the single crystal member 10 is not limited to (100), and other plane orientations can be used.
  • Example 1 The inventor prepared a single-crystal silicon wafer 10 (thickness: 625 ⁇ m) that was mirror-polished as the single-crystal member 10.
  • the silicon wafer 10 is placed on an XY stage, and the second plano-convex lens is used as the second lens 18 at a distance of 0.34 mm from the surface 10t on the laser beam irradiated side of the silicon wafer 10. 18 was placed.
  • the second plano-convex lens 18 is a lens having a radius of curvature of 7.8 mm, a thickness of 3.8 mm, and a refractive index of 1.58.
  • a first plano-convex lens 16 having an NA of 0.55 is disposed as the first lens 16.
  • the modified layer 12 is formed inside the silicon wafer 10 by irradiating the laser beam B having a wavelength of 1064 nm, a repetition frequency of 100 kHz, a pulse width of 60 seconds, and an output of 1 W, and passing through the first plano-convex lens 16 and the second plano-convex lens 18. did.
  • the depth D from the silicon wafer surface 10t to the processing region, that is, the depth D to the modified layer 12 was controlled by adjusting the mutual position of the first plano-convex lens 16 and the silicon wafer surface 10t.
  • the thickness T of the modified layer 12 was controlled by adjusting the mutual position of the second plano-convex lens 18 and the silicon wafer surface 10t.
  • the laser beam B is irradiated while being moved at a constant speed of 15 mm on the X stage, then sent 1 ⁇ m on the Y stage, and this is repeated to repeat the laser beam in an area of 15 mm ⁇ 15 mm.
  • the modified layer 12 was formed by performing internal irradiation. As a result, the internal modified layer forming single crystal member 11 having the single crystal layer 10u on the upper side of the modified layer 12 (that is, the irradiated side of the laser beam B) and the single crystal part 10d on the lower side of the modified layer 12 is obtained.
  • the single crystal layer 10 u and the single crystal portion 10 d are formed by dividing the silicon wafer 10 by the modified layer 12.
  • the silicon wafer 10 was cleaved so as to cross the modified layer 12, and the cleaved surface was observed with an optical microscope (scanning electron microscope). An optical micrograph of the cleaved surface observed is shown in FIG. It was confirmed that clear cracks 12c were formed at intervals of 1 ⁇ m.
  • the modified layer 12 was formed by changing the above-described implementation conditions only by sending the Y stage at 10 ⁇ m instead of 1 ⁇ m.
  • the silicon wafer 10 was cleaved so as to cross the modified layer 12, and the cleaved surface was observed with an optical microscope (scanning electron microscope). An optical micrograph of the observed cleavage plane is shown in FIG. It was confirmed that clear cracks 12c were formed at intervals of 10 ⁇ m.
  • Example 3 after irradiating the laser beam as in Example 2, the laser beam was repeatedly irradiated while being moved at a constant speed on the Y stage after being fed by 10 ⁇ m on the X stage. That is, the laser beam was irradiated in a lattice shape. Similarly, the silicon wafer 10 was cleaved so as to cross the modified layer 12, and the cleaved surface was observed with an optical microscope (scanning electron microscope). The cracks were formed more clearly than in Example 2.
  • Example 2 ⁇ Test Example 2>
  • the inventor uses the same silicon wafer as the silicon wafer 10 used in Test Example 1 and forms the internal modified layer-forming single crystal member 11 formed by forming the modified layer 12 under the conditions of Example 1.
  • the single crystal layer 10u was peeled off using the metal substrates 28u and 28d to obtain a single crystal substrate 10s.
  • the peeling surface 10f of the single crystal substrate 10s was observed with a laser confocal microscope, the measurement diagram shown in FIG. 14 was obtained, and it was confirmed that irregularities having a particle size of 50 to 100 ⁇ m were formed on the peeling surface 10f.
  • the horizontal axis is the unevenness dimension ( ⁇ m display), and the vertical axis is the surface roughness (% display).
  • FIG. 15 is a schematic bird's-eye view of the single-crystal member internal processing apparatus used for explaining the single-crystal substrate manufacturing method and the internal modified layer-forming single crystal member according to this embodiment.
  • the single crystal member internal processing apparatus 69 used in this embodiment includes a rotary stage 70 that holds the single crystal member 10 placed on the upper surface side, and a rotary stage control means 72 that controls the number of rotations of the rotary stage 70. Substrate rotating means 74 is provided.
  • the single crystal member internal processing device 69 includes a laser light source 76, a condensing lens 15, and a focal position adjusting tool (not shown) that adjusts the distance from the condensing lens 15 to the rotary stage 70. 80.
  • the single crystal member internal processing device 69 includes an X-direction moving stage 84 that relatively moves the rotary stage 70 and the condenser lens 15 between the rotary shaft 70 c of the rotary stage 70 and the outer periphery of the rotary stage 70.
  • a Y-direction moving stage 86 is provided.
  • the single crystal member internal processing apparatus 69 is used to place the single crystal member 10 on the rotary stage 70, and while rotating the single crystal member 10 at a constant speed on the rotary stage 70, Similarly, the laser beam B is irradiated, and then the rotary stage 70 is moved by the X direction moving stage 84 and the Y direction moving stage 86, and the irradiation position of the laser light B is set at a predetermined interval (1 ⁇ m,
  • the two-dimensional modified layer can be formed inside the single crystal member 10 by repeating irradiation after being sent at 5 ⁇ m, 10 ⁇ m, etc.
  • a plurality of square-shaped single crystal members may be arranged on the rotary stage 70 symmetrically with respect to the rotary shaft 70c with an interval.
  • the crack by condensing of the laser beam B can be arrange
  • the thinly cut single crystal substrate can be applied to a solar cell as long as it is a Si substrate, and a sapphire substrate such as a GaN-based semiconductor device.
  • a solar cell as long as it is a Si substrate, and a sapphire substrate such as a GaN-based semiconductor device.

Abstract

La présente invention vise à fournir un procédé de production de substrat monocristallin capable de produire facilement un substrat monocristallin relativement large et mince et un organe monocristallin renfermant une couche modifiée. Le procédé comprend les étapes suivantes: une étape pour la disposition dans un état sans contact sur un organe monocristallin (10) d'un moyen de concentration laser ; une étape pour l'irradiation d'une surface (10t) de l'organe monocristallin (10) avec un faisceau laser (B), et la concentration du faisceau laser (B) sur l'intérieur de l'organe monocristallin (10) ; une étape pour le déplacement du moyen de concentration laser et de l'organe monocristallin (10) l'un par rapport à l'autre, et la formation d'une couche bidimensionnelle modifiée (12) à l'intérieur de l'organe monocristallin (10) ; et une étape pour la formation d'un substrat monocristallin (10s) par la séparation depuis l'interface avec la couche modifiée (12) d'une couche monocristalline (10u) formée en conséquence de la segmentation par la couche modifiée (12).
PCT/JP2011/052941 2011-02-10 2011-02-10 Procédé de production de substrat monocristallin et organe monocristallin renfermant une couche modifiée WO2012108052A1 (fr)

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JP2012556739A JP6004338B2 (ja) 2011-02-10 2011-02-10 単結晶基板製造方法および内部改質層形成単結晶部材
PCT/JP2011/052941 WO2012108052A1 (fr) 2011-02-10 2011-02-10 Procédé de production de substrat monocristallin et organe monocristallin renfermant une couche modifiée
CN201180067352.3A CN103380482B (zh) 2011-02-10 2011-02-10 单结晶基板制造方法及内部改质层形成单结晶部件

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