JP2016519433A - ウェハのシンニング方法及び装置 - Google Patents
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- 238000000227 grinding Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 7
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- 238000005498 polishing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
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- 238000005520 cutting process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
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Abstract
Description
ウェハ(Wafer)の所望する厚さに応じて特定の深さに焦点が合わせられたレーザ ラインビーム(Laser Line beam)をスキャン(Scan)して、界面を形成して、ウェハをクリービング(Cleaving)して簡単に所望する厚さでウェハを切り離す。
2 回路
3 ダイ
5 保護フィルム
10 グラインダ
15 ウェハチャック
20 マウントフィルム
25 ウェハリング
50 ウェハ
55 回路パターン
57 界面
60 ラインビーム
70、75 ウェハチャック
80 衝撃部材
Claims (6)
- ウェハの特定の深さに焦点が合わせられたラインビームを照射する段階と、
前記ラインビームを利用して前記ウェハをスキャンして前記ウェハの特定の深さに界面を形成する段階と、
前記界面が形成されたウェハをパターンウェハとダミーウェハにクリービングする段階とを含むウェハのシンニング方法。 - 前記ラインビームを照射する段階は、
レーザビームを照射する段階と、
前記レーザビームを整形して前記ラインビームを生成する段階とを含む、請求項1に記載のウェハのシンニング方法。 - 前記界面を形成する段階は、
前記ラインビームのスキャン速度及び前記ラインビームの強度のうち少なくとも一つを調整する段階と、
前記ウェハの特定の深さに格子形状のラインを形成する段階とを含む、請求項1に記載のウェハのシンニング方法。 - 前記ダミーウェハに回路パターンを形成してリサイクルする段階をさらに含む、請求項1に記載のウェハのシンニング方法。
- ウェハの一面を支持し、固定するウェハ支持部と、
レーザビームを照射するレーザ光源部と、
前記レーザビームを整形してラインビームを生成し、前記ウェハのサイズに合わせて前記ウェハの特定の深さに前記ラインビームを照射するラインビーム光学部と、
前記ラインビームを利用して前記ウェハをスキャンするために前記ラインビーム光学部及び前記ウェハ支持部のうち少なくとも一つをXY方向に移動させるガントリ部と、
前記ウェハの他面を固定するウェハ固定部と、
前記ウェハ支持部及び前記ウェハ固定部を逆方向に移動させ、前記ラインビームのスキャンによって前記ウェハの特定の深さに形成された界面を中心に前記ウェハをパターンウェハとダミーウェハにクリービングするクリービング移動部とを含む、ウェハのシンニング装置。 - 前記レーザ光源部の出力を制御して前記ラインビームの強度を調整したり、前記ガントリ部を制御して前記ラインビームのスキャン速度を調整する制御部をさらに含む、請求項5に記載のウェハのシンニング装置。
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KR1020130043080A KR101803790B1 (ko) | 2013-04-18 | 2013-04-18 | 웨이퍼의 시닝 방법 및 장치 |
KR10-2013-0043080 | 2013-04-18 | ||
PCT/KR2014/002808 WO2014171649A1 (ko) | 2013-04-18 | 2014-04-02 | 웨이퍼의 시닝 방법 및 장치 |
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JP2016519433A true JP2016519433A (ja) | 2016-06-30 |
JP6105808B2 JP6105808B2 (ja) | 2017-03-29 |
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US (1) | US10319598B2 (ja) |
JP (1) | JP6105808B2 (ja) |
KR (1) | KR101803790B1 (ja) |
WO (1) | WO2014171649A1 (ja) |
Cited By (2)
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WO2020066492A1 (ja) * | 2018-09-25 | 2020-04-02 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
WO2020129734A1 (ja) * | 2018-12-21 | 2020-06-25 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
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JP6428642B2 (ja) * | 2013-12-27 | 2018-11-28 | Agc株式会社 | 脆性板の加工方法、および脆性板の加工装置 |
CN105924478B (zh) * | 2016-05-24 | 2018-05-29 | 济南大学 | 一种三维纸基金属有机框架的制备方法 |
JP6858587B2 (ja) * | 2017-02-16 | 2021-04-14 | 株式会社ディスコ | ウエーハ生成方法 |
KR102046871B1 (ko) * | 2017-08-25 | 2019-11-21 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
KR102637161B1 (ko) * | 2018-12-21 | 2024-02-16 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
US11682600B2 (en) * | 2019-08-07 | 2023-06-20 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Protection layer for panel handling systems |
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