WO2012086483A1 - Dispositif d'application de couche de luminophores, et procédé pour fabriquer un dispositif émetteur de lumière - Google Patents

Dispositif d'application de couche de luminophores, et procédé pour fabriquer un dispositif émetteur de lumière Download PDF

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Publication number
WO2012086483A1
WO2012086483A1 PCT/JP2011/078872 JP2011078872W WO2012086483A1 WO 2012086483 A1 WO2012086483 A1 WO 2012086483A1 JP 2011078872 W JP2011078872 W JP 2011078872W WO 2012086483 A1 WO2012086483 A1 WO 2012086483A1
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Prior art keywords
phosphor
light emitting
emitting element
spray nozzle
led
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PCT/JP2011/078872
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English (en)
Japanese (ja)
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禄人 田口
健一 武中
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コニカミノルタオプト株式会社
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Priority to JP2012549746A priority Critical patent/JPWO2012086483A1/ja
Publication of WO2012086483A1 publication Critical patent/WO2012086483A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • the present invention relates to a light-emitting device having a light-emitting element and a wavelength conversion unit including a phosphor that converts the wavelength of light emitted from the light-emitting element.
  • the present invention relates to a method for manufacturing a light emitting device using a phosphor coating device.
  • LED light source including an LED light-emitting element that emits light of a predetermined color and a wavelength conversion unit in which a phosphor that converts light emitted from the LED light-emitting element into light of a desired color is dispersed is known. ing.
  • a phosphor such as a YAG phosphor is disposed in the vicinity of a gallium nitride (GaN) blue LED (Light Emitting Diode) chip, and the blue light emitted from the blue LED chip and the phosphor are blue light.
  • GaN gallium nitride
  • a technique for obtaining a white LED by mixing with yellow light emitted by secondary light emission in response to the light is widely used.
  • a phosphor dispersed glass in which a phosphor is uniformly dispersed in a transparent resin is used, and an LED light emitting element is formed in this film material. Therefore, it is important to uniformly mix blue light emitted from the fluorescent material and yellow light emitted from the phosphor so as to uniformly emit white light that is mixed color light outside the glass body.
  • the wavelength conversion part (phosphor-dispersed glass) can be prepared, for example, by mixing glass powder and phosphor powder, adding a resin binder, press-molding it into a predetermined shape, and baking it.
  • a phosphor dispersion liquid (wavelength conversion portion) having a predetermined thickness may be formed by spray-coating a liquid phosphor mixture produced by blending phosphor powder with alcohol or a resin binder and then curing the mixture. it can.
  • the phosphor dispersion film can be formed by a spray method.
  • a spray nozzle is disposed on the LED light emitting element, and the phosphor mixture is sprayed downward from the spray nozzle. It is configured to do.
  • the mist of the phosphor mixture liquid sprayed from the spray nozzle adheres to the surface of the LED light emitting element, but in addition to this, the mist that floats and falls in the air is delayed on the surface of the LED light emitting element. May adhere.
  • the mist that floats and falls in the air is affected by the temperature in the spray coating device and the flow of air. This is not preferable because it causes uneven thickness of the dispersion film.
  • the phosphor mixture remaining at the tip of the spray nozzle gathers at the tip and becomes a ball, and the solvent (for example, alcohol) in the mixture evaporates and the phosphor solidifies. It causes nozzle clogging and becomes a problem.
  • the present invention when forming a phosphor dispersion film by the spray method, it is possible to form a phosphor dispersion film having a uniform film thickness with little density unevenness, and the phosphor remains at the tip of the spray nozzle and does not solidify. It is an object of the present invention to provide a body coating apparatus, and to provide a method for manufacturing a light emitting apparatus capable of manufacturing an LED light source having a phosphor dispersion film having a uniform film thickness with little density unevenness using the phosphor coating apparatus. .
  • the present invention is a phosphor coating apparatus used for manufacturing a light emitting device having a light emitting element and a wavelength conversion unit including a phosphor that converts the wavelength of light emitted from the light emitting element.
  • the light emitting element is an LED light emitting element, and a phosphor mixed liquid in which a predetermined phosphor is dispersed is applied to a light emitting surface of the LED light emitting element mounted on an LED substrate by a spray means, and the LED
  • the light emitting surface of the light emitting element faces downward, and a spray nozzle is disposed below the LED light emitting element, and the phosphor mixed liquid is sprayed upward from the spray nozzle, and the phosphor mixed liquid is applied to the light emitting surface. It is characterized by doing.
  • the phosphor mixed solution is sprayed upward and applied, the mist floating in the air naturally falls and does not adhere to the light emitting surface. Therefore, only the phosphor mixture liquid sprayed upward adheres to the light emitting surface, and it becomes possible to form a phosphor dispersion film having a uniform film thickness with little density unevenness. Further, since the spray nozzle is disposed upward, the phosphor is prevented from remaining at the tip of the nozzle, and the phosphor coating apparatus does not remain and solidify.
  • the present invention is the phosphor coating apparatus having the above-described configuration, wherein the phosphor coating apparatus stores an LED support portion that supports the LED substrate with a light emitting surface of the LED light emitting element facing downward, and the phosphor mixed solution.
  • a tank, the spray nozzle, and a pipe for feeding the phosphor mixture stored in the tank to the spray nozzle are provided. According to this configuration, the phosphor mixed liquid stored in the tank can be easily applied to the LED support portion by using the spray nozzle that attaches the LED substrate with the light emitting surface facing downward and sprays upward.
  • the present invention is characterized in that in the phosphor coating apparatus having the above-described configuration, the spray angle of the spray nozzle is upward in the vertical direction or upward in a diagonally upward range inclined by a predetermined angle from the vertical direction. According to this configuration, the phosphor mixture is sprayed vertically upward or obliquely upward, so that the phosphor dispersion film having a uniform film thickness with little unevenness in density is not affected by mist floating in the air. It can be formed.
  • the LED support portion can displace the LED substrate in a vertically downward direction with the light emitting surface inclined in a vertically downward direction and a diagonally downward direction inclined by a predetermined angle from the vertically downward direction. It is characterized by that.
  • the support posture of the LED substrate can be changed according to the shape of the light emitting surface on which the phosphor mixture is applied. Therefore, it is possible to obtain a phosphor coating apparatus that can easily adapt to various shapes and can apply the phosphor.
  • the present invention is characterized in that, in the phosphor coating apparatus having the above-described configuration, the predetermined angle is at most 75 degrees.
  • the predetermined angle is at most 75 degrees.
  • this configuration by adopting a configuration that is inclined at most 75 degrees from the vertical direction, it is possible to form a phosphor dispersion film having a uniform film thickness with little density unevenness corresponding to a light emitting device having a light emitting surface of various shapes.
  • a phosphor coating apparatus can be obtained in which the phosphor remains at the tip of the spray nozzle and does not solidify.
  • the present invention is a method of manufacturing a light emitting device having a light emitting element and a wavelength conversion unit including a phosphor that converts the wavelength of light emitted from the light emitting element, wherein the light emitting element is an LED light emitting element, Using a spray nozzle, a phosphor coating step of applying a phosphor mixed liquid in which a predetermined phosphor is dispersed on the light emitting surface of the LED light emitting element mounted on the LED substrate, and the phosphor mixed liquid applied And firing the phosphor to form the phosphor dispersion film to form the wavelength conversion portion, and the phosphor coating step sprays the phosphor mixture liquid upward from the spray nozzle, and the light emitting surface. It is characterized by being an upward coating process in which the phosphor mixed solution is coated.
  • the spray angle of the spray nozzle in the upward coating step is upward in the vertical direction or upward in a diagonally upward range inclined by a predetermined angle from the vertical direction. It is characterized by. According to this configuration, since the phosphor mixed solution is sprayed vertically upward or obliquely upward, a coating film having a predetermined thickness can be formed without being affected by mist floating in the air.
  • the present invention is characterized in that, in the method for manufacturing a light emitting device having the above-described configuration, the predetermined angle is at most 75 degrees. According to this configuration, the spray angle of the spray nozzle is inclined at most 75 degrees from the vertical direction, thereby forming a phosphor dispersion film with a uniform film thickness corresponding to a light emitting device having a light emitting surface of various shapes. This is a possible method for manufacturing a light emitting device.
  • the mist floating in the air naturally falls and does not adhere to the light emitting surface, but only the phosphor mixed solution sprayed upward is the light emitting surface. It is possible to obtain a phosphor coating apparatus capable of forming a phosphor dispersion film having a uniform film thickness with little density unevenness. For this reason, it is possible to reduce the unevenness of coating of the phosphor dispersion film and suppress the change in chromaticity. In addition, according to the method for manufacturing a light emitting device according to the present invention using this phosphor coating apparatus, it is possible to manufacture an LED light source having a phosphor dispersion film having a uniform film thickness with little density unevenness.
  • the phosphor coating apparatus 10 is an apparatus that coats the phosphor mixed solution 20 on the LED light emitting elements 3 mounted on the LED substrate 1 using a spray unit, and stores the phosphor mixed solution 20.
  • a tank 11, a spray nozzle 14 as a spray means, and a pipe 13 for feeding the phosphor mixture 20 from the tank 11 to the spray nozzle 14 are provided. Further, the phosphor mixed solution 20 sprayed and applied from the spray nozzle 14 is baked to generate a wavelength conversion unit, and the phosphor dispersion film 6 (a predetermined phosphor is dispersed on the light emitting surface of the LED light emitting element 3).
  • a light emitting device LD LED light source; see FIG. 2) having a wavelength conversion unit) is manufactured.
  • the tank 11 has a stirring mechanism 12.
  • the stirring mechanism 12 has a function of stirring and uniformly mixing the phosphor mixed solution 20 in which a phosphor or inorganic fine particles are mixed in an organic solvent.
  • the stirring mechanism 12 is disposed in the tank 11 via magnetic force or electric force.
  • the configuration is not particularly limited as long as the movable blade-shaped movable piece is driven.
  • the phosphor mixed liquid 20 uniformly mixed through the stirring mechanism 12 is pressurized and supplied from the tank 11 to the spray nozzle 14 through the pipe 13 and receives the wind pressure to spray the application target from the spray nozzle tip 14a. Applied. At this time, an opening that can be freely opened and closed is provided at the tip of the spray nozzle 14, and the opening and closing operation is performed to control the on / off of the spraying operation.
  • the phosphor coating apparatus 10 faces the light emitting surface of the LED light emitting element 3 downward in order to reduce the density unevenness of the phosphor in the phosphor dispersion film 6 and suppress the variation in light emission chromaticity. Then, the LED substrate 1 is held via the LED support portion 15 and the phosphor mixed solution is sprayed upward from the spray nozzle 14 disposed below the light emitting surface, so that the phosphor mixed solution 20 is uniformly applied to the light emitting surface. It is set as the structure apply
  • the phosphor mixed solution 20 contains, for example, a phosphor, a layered silicate mineral, and inorganic fine particles in a sol-like mixed solution obtained by mixing an organometallic compound in an organic solvent.
  • the organometallic compound serves as a binder that seals the phosphor, the layered silicate mineral, and the inorganic fine particles.
  • the organometallic compound used in the present embodiment include metal alkoxides, metal acetylacetonates, metal carboxylates, and the like, and metal alkoxides that are easily gelled by hydrolysis and polymerization reaction are preferable.
  • the metal alkoxide may be a single molecule such as tetraethoxysilane, or may be a polysiloxane in which an organic siloxane compound is linked in a chain or a ring, but a polysiloxane that increases the viscosity of the mixed solution is preferable.
  • a translucent glass body can be formed, but it is preferable to contain a silicon
  • the phosphor is excited by the wavelength of the light emitted from the LED light emitting element 3 (excitation wavelength) and emits fluorescence having a wavelength different from the excitation wavelength.
  • excitation wavelength the wavelength of the light emitted from the LED light emitting element 3
  • fluorescence having a wavelength different from the excitation wavelength.
  • a YAG (yttrium, aluminum, garnet) phosphor that converts blue light (wavelength 420 nm to 485 nm) emitted from the blue LED element into yellow light (wavelength 550 nm to 650 nm) is used.
  • Such phosphors use oxides of Y, Gd, Ce, Sm, Al, La, and Ga, or compounds that easily become oxides at high temperatures, and are mixed well in a stoichiometric ratio.
  • a mixed raw material is obtained.
  • a coprecipitated oxide obtained by calcining a solution obtained by coprecipitation of a solution obtained by dissolving a rare earth element of Y, Gd, Ce, or Sm in an acid with a stoichiometric ratio with oxalic acid, and aluminum oxide or gallium oxide.
  • an appropriate amount of fluoride such as ammonium fluoride is mixed with the obtained mixed raw material as a flux and pressed to obtain a molded body.
  • the obtained molded body is packed in a crucible and fired in air at a temperature range of 1350 to 1450 ° C. for 2 to 5 hours to obtain a sintered body having the light emission characteristics of a phosphor.
  • the fired product is ball milled in water, washed, separated and dried, and finally passed through a sieve to obtain a desired phosphor.
  • the composition of the obtained phosphor was examined to confirm that it was a desired phosphor, and the emission wavelength in excitation light of 465 nm was examined. As a result, it was confirmed that the peak wavelength was approximately 570 nm. That is, a phosphor that emits yellow light when irradiated with blue light can be obtained.
  • the YAG phosphor is used.
  • the type of the phosphor is not limited to this.
  • other phosphors such as non-garnet phosphors containing no Ce are used. You can also.
  • the larger the particle size of the phosphor the higher the light emission efficiency (wavelength conversion efficiency).
  • the gap formed at the interface with the organometallic compound is increased, and the film strength of the formed ceramic layer is lowered. Accordingly, in consideration of the size of the gap generated at the interface between the light emission efficiency and the organometallic compound, it is preferable to use one having an average particle diameter of 1 ⁇ m or more and 50 ⁇ m or less.
  • the average particle diameter of the phosphor can be measured, for example, by a Coulter counter method.
  • the layered silicate mineral is preferably a swellable clay mineral having a structure such as a mica structure, a kaolinite structure, or a smectite structure, and particularly preferably a smectite structure rich in swelling properties. This is because, as will be described later, by adding water to the mixed liquid, it takes a card house structure in which water enters and swells between the layers of the smectite structure, so the viscosity of the mixed liquid is greatly increased. It is.
  • the content of the layered silicate mineral in the ceramic layer is less than 0.5% by weight, the effect of increasing the viscosity of the mixed solution cannot be obtained sufficiently.
  • the content of the layered silicate mineral exceeds 20% by weight, the strength of the ceramic layer after heating is lowered. Therefore, the content of the layered silicate mineral is preferably 0.5% by weight or more and 20% by weight or less, and more preferably 0.5% by weight or more and 10% by weight or less.
  • a layered silicate mineral whose surface is modified (surface treatment) with an ammonium salt or the like can be used as appropriate.
  • Inorganic fine particles include a filling effect that fills gaps formed at the interface between the organometallic compound, the phosphor and the layered silicate mineral, a thickening effect that increases the viscosity of the mixed solution before heating, and a ceramic layer film after heating. It has a film strengthening effect that improves strength.
  • Examples of the inorganic fine particles used in the present invention include oxide fine particles such as silicon oxide, titanium oxide and zinc oxide, and fluoride fine particles such as magnesium fluoride.
  • silicon oxide fine particles such as silicon oxide, titanium oxide and zinc oxide
  • fluoride fine particles such as magnesium fluoride.
  • silicon oxide fine particles such as silicon oxide, titanium oxide and zinc oxide
  • fluoride fine particles such as magnesium fluoride.
  • silicon oxide fine particles such as silicon oxide, titanium oxide and zinc oxide
  • fluoride fine particles such as magnesium fluoride.
  • silicon oxide fine particles from the viewpoint of stability with respect to the formed ceramic layer.
  • the content of the inorganic fine particles in the ceramic layer is preferably 0.5 wt% or more and 50 wt% or less, and more preferably 1 wt% or more and 40 wt% or less.
  • the average particle diameter of the inorganic fine particles is preferably 0.001 ⁇ m or more and 50 ⁇ m or less in consideration of the above-described effects.
  • the average particle diameter of the inorganic fine particles can be measured, for example, by a Coulter counter method.
  • a material obtained by treating the surface of inorganic fine particles with a silane coupling agent or a titanium coupling agent can be used as appropriate.
  • a translucent ceramic layer can be obtained by heating a precursor solution in which an organometallic compound is mixed in an organic solvent.
  • a phosphor dispersion film (wavelength conversion unit) is formed by applying and heating a phosphor mixed solution obtained by mixing phosphor, layered silicate mineral, and inorganic fine particles to the precursor solution. Furthermore, by adding water to the mixed solution, water enters between the layers of the layered silicate mineral and the viscosity of the mixed solution increases, so that the phosphor can be prevented from settling.
  • the organic solvent alcohols such as methanol, ethanol, propanol and butanol having excellent compatibility with added water are preferable. Further, when the amount of the organometallic compound mixed with the organic solvent is less than 5% by weight, it becomes difficult to increase the viscosity of the mixed solution, and when the amount of the organometallic compound exceeds 50% by weight, the polymerization reaction is faster than necessary. Proceed. Therefore, the amount of the organometallic compound mixed with the organic solvent is preferably 5% by weight or more and 50% by weight or less, and more preferably 8% by weight or more and 40% by weight or less.
  • the layered silicate mineral when using a surface-treated lipophilic layered silicate mineral, the layered silicate mineral is first added to a solution (precursor solution) in which an organometallic compound is mixed in an organic solvent. Premixing is performed, and then phosphor, inorganic fine particles, and water are mixed.
  • a hydrophilic layered silicate mineral that has not been surface-treated is used, first the layered silicate mineral and water are premixed, and then the phosphor, inorganic fine particles, and precursor solution are mixed. Thereby, a layered silicate mineral can be mixed uniformly and the thickening effect can be heightened more.
  • the preferred viscosity of the mixed solution is 25 to 800 cP, and the most preferred viscosity is 30 to 500 cP.
  • the ratio of water to the total amount of the solvent obtained by adding water to the organic solvent is less than 5% by weight, the above thickening effect cannot be sufficiently obtained, and when the ratio of water exceeds 60% by weight, the thickening effect is obtained.
  • the effect of reducing the viscosity due to excessive mixing of water is greater than that. Therefore, the ratio of water is preferably 5% by weight or more and 60% by weight or less, and more preferably 7% by weight or more and 55% by weight or less with respect to the total amount of solvent.
  • the most preferable composition of the mixed solution is that using polysiloxane as the organometallic compound, and the most preferable composition range of each of the above components contained in the mixed solution is 4 to 30% by weight of the polysiloxane dispersion and layered silica.
  • the acid salt mineral is 1 to 10% by weight
  • the inorganic fine particles are 1 to 40% by weight
  • the water is 10 to 50% by weight.
  • a phosphor mixed solution containing a phosphor, a layered silicate mineral, and inorganic fine particles is used as a sol-like mixed solution obtained by mixing an organometallic compound as a ceramic material in an organic solvent.
  • a ceramic layer containing a phosphor is formed by separately preparing a mixed solution containing phosphor particles and a mixed solution containing an organometallic compound and firing each of them after application. Also good.
  • the dispersion liquid containing phosphor particles may lose dispersion uniformity over time due to sedimentation of the phosphor particles, the dispersion stability is enhanced by additives such as inorganic particles and layered silicate minerals. There is a need. Moreover, the viscosity of a liquid mixture is kept high with these additives.
  • the mixed solution contains an organometallic compound that is a ceramic material
  • the viscosity increases due to the progress of the reaction during storage, and the applicability may deteriorate.
  • the reaction of the ceramic material is generally an irreversible reaction, and when the reaction of the organometallic compound that is the ceramic material proceeds in the mixed solution containing the phosphor particles, the mixture containing the phosphor particles is mixed. All liquids may become unusable. For this reason, the mixed liquid is divided into two or more mixed liquids according to the components and applied, so that the storage stability is improved and expensive phosphor particles are wasted even when the reaction of the ceramic material proceeds. This is the preferred form because it does not.
  • the amount of the organometallic compound serving as a ceramic material such as polysiloxane in the mixed liquid containing the phosphor particles is preferably 1% by weight or less. More preferably, it is more preferably 5% by weight or less, and particularly preferably not contained.
  • a mixed liquid containing an organometallic compound as a ceramic material after applying a mixed liquid containing phosphor particles.
  • a mixed liquid containing ceramic material Before applying the liquid mixture containing phosphor particles, apply the liquid mixture containing ceramic material, apply the liquid mixture containing phosphor particles, and then apply the liquid mixture containing ceramic material again. Also good. Moreover, you may spray-coat these liquid mixture simultaneously.
  • the liquid mixture containing the phosphor particles needs to be applied upward.
  • a predetermined amount of the phosphor mixture 20 obtained as described above is applied to the LED light emitting element 3, and heated and baked to form a phosphor dispersion film 6 (wavelength conversion portion) having a predetermined thickness.
  • the heating temperature is less than 100 ° C., the polymerization reaction of the organometallic compound does not proceed.
  • the heating temperature exceeds 1000 ° C. the layered silicate mineral is thermally decomposed and the layered structure is destroyed. Therefore, the heating temperature of the mixed solution needs to be 100 ° C. or higher and 1000 ° C. or lower, and preferably 250 ° C. to 600 ° C.
  • the thickness of the formed phosphor dispersion film 6 is less than 5 ⁇ m, the wavelength conversion efficiency is lowered and sufficient fluorescence cannot be obtained, and the thickness of the phosphor dispersion film 6 exceeds 500 ⁇ m. In such a case, the film strength is lowered and cracks and the like are likely to occur. Therefore, the thickness of the phosphor dispersion film 6 is preferably 5 ⁇ m or more and 500 ⁇ m or less.
  • the light emitting device LD manufactured as described above will be described with reference to FIG.
  • a metal part 2 is provided on an LED substrate 1 having a concave cross section, and an LED light emitting element 3 is arranged on the metal part 2.
  • the LED light emitting element 3 is provided with a protruding electrode 4 on the surface facing the metal part 2, and the metal part 2 and the LED light emitting element 3 are connected via the protruding electrode 4 (flip chip type).
  • the structure which provides one LED light emitting element 3 with respect to one LED board 1, or the structure which provides several LED light emitting element 3 with respect to one LED board may be sufficient.
  • a blue LED element is used as the LED light emitting element 3.
  • a blue LED element is formed by laminating an n-GaN-based cladding layer, an InGaN light-emitting layer, a p-GaN-based cladding layer, and a transparent electrode on a sapphire substrate.
  • a phosphor dispersion film 6 (wavelength conversion unit) is formed in the concave portion of the LED substrate 1 so as to seal the periphery of the LED light emitting element 3.
  • the phosphor dispersion film 6 (wavelength conversion unit) is a part that converts light having a predetermined wavelength emitted from the LED light emitting element 3 into light having a different wavelength, and the LED light emitting element 3 is included in the translucent ceramic layer.
  • a predetermined phosphor that is excited by the wavelength of the light and emits fluorescence having a wavelength different from the excitation wavelength is added.
  • the phosphor dispersion film 6 may be provided at least around the LED light emitting element 3 (upper surface and side surface), and may not be provided in the other concave portion of the LED substrate 1.
  • a method of providing the phosphor dispersion film 6 (wavelength conversion unit) only around the LED light emitting element 3 a method of masking other than the periphery of the LED light emitting element 3 can be used.
  • the light emitting surface of the LED light emitting element 3 faces downward, the spray nozzle 14 is disposed below the LED light emitting element 3, and the above-mentioned predetermined upward from the spray nozzle 14.
  • the phosphor mixed solution 20 containing the phosphor is sprayed.
  • the phosphor coating apparatus 10 is a phosphor coating apparatus that coats the phosphor mixed liquid 20 in which a predetermined phosphor is dispersed by spray means, and the LED substrate 1 with the light emitting surface of the LED light emitting element 3 facing downward.
  • the tank 11 has a stirring mechanism 12, and the phosphor mixed solution 20 uniformly mixed through the stirring mechanism 12 is supplied with pressure to the spray nozzle 14 from the tank 11 through the pipe 13. In response to the wind pressure, it is sprayed upward from the tip of the spray nozzle and sprayed onto the object to be coated.
  • the phosphor mixed solution 20 in which the phosphors are uniformly mixed is generated and applied by spraying upward from the spray nozzle 14, so that the mist floating in the air is natural. It falls and does not adhere to the light emitting surface. Therefore, only the phosphor mixture 20 sprayed upward adheres to the light emitting surface, and it becomes possible to form the phosphor dispersion film 6 having a uniform film thickness with little density unevenness.
  • the phosphor dispersion film 6 has little density unevenness and the film thickness is uniform, it means that there is little coating unevenness of the phosphor dispersion film 6, so that the phosphor is uniformly dispersed to develop uniform fluorescence. It becomes a structure and the change of chromaticity can be suppressed. Further, since the spray nozzle 14 is disposed upward, it is preferable to provide the phosphor coating apparatus 10 in which the phosphor is prevented from remaining at the tip of the nozzle and the phosphor remains and does not solidify.
  • the third light in which the primary light emitted from the light emitting element and the secondary light emitted from the phosphor are uniformly mixed is used. It emits light, can suppress the change in emission chromaticity, and can manufacture a high-quality light-emitting device (LED light source). That is, by using the phosphor coating apparatus 10 of this embodiment, it is possible to manufacture a high-quality light-emitting device LD having a phosphor dispersion film in which phosphors are uniformly dispersed.
  • the meaning of spraying the phosphor mixture liquid upward using the spray nozzle 14 is not limited to the configuration of spraying upward in the vertical direction, and may be obliquely upward so as not to be affected by mist floating in the air. For example, it may be up to about 75 degrees obliquely. Moreover, it is good also as a structure which inclined the LED substrate side which is a to-be-coated body.
  • FIG. 3 shows a first embodiment in which the spray nozzle is configured to be movable in the vertical direction and obliquely upward
  • FIG. 4 shows a second embodiment in which the LED substrate side that is an object to be coated is inclined.
  • the spray nozzle 14 may be a phosphor such as a spray nozzle 14A sprayed upward in the vertical direction indicated by a solid line in FIG. It is set as the structure which sprays a liquid mixture upwards.
  • the spray nozzle 14A sprays the phosphor mixture liquid so as to face the light emitting surface 3a of the LED light emitting element 3, and the spray nozzle 14B mixes the phosphor toward the angle at which the light emitting surface 3a and the side surface 3b intersect and toward the side surface 3b.
  • the liquid is sprayed, and the spray nozzle 14C sprays the phosphor mixed liquid toward the corner where the light emitting surface 3a and the side surface 3c intersect and the side surface 3c.
  • the angle at which the phosphor mixture is blown upward from the spray nozzle 14 is upward in the vertical direction or upward in a diagonally upward range inclined by a predetermined angle from the vertical direction. If it is this structure, the light emission surface 3a and the side surfaces 3b and 3c of the light emitting element 3 are not affected by the mist which floats in the air by spraying a fluorescent substance liquid mixture vertically upward or diagonally upward. It is possible to form a phosphor dispersion film having a uniform film thickness on the entire circumference.
  • the predetermined angle of spraying upward from the spray nozzle 14 is set to within 75 degrees, that is, at most 75 degrees in order to allow the phosphor mixture liquid to be sprayed without being affected by the mist floating in the air.
  • the spray nozzle 14 is inclined at most 75 degrees from the vertical direction, so that a phosphor dispersion film having a uniform film thickness can be formed corresponding to a light emitting device having a light emitting surface of various shapes.
  • a phosphor coating apparatus that can be formed and does not solidify due to the phosphor remaining at the tip of the spray nozzle can be obtained.
  • the posture of the light emitting surface of the LED light emitting element may be displaced.
  • the LED support portion 15 is configured to be tiltable so that the support posture of the LED substrate is displaced. That is, as shown in FIG. 4, the LED substrate 1A is inclined at a predetermined angle, and the phosphor mixed solution 20 is sprayed upward on the LED light emitting element 3 mounted on the LED substrate 1A using, for example, a spray nozzle 14A.
  • the LED support portion 15 can displace the LED substrate 1 in the vertically downward direction and the obliquely downward direction in which the light emitting surface of the LED light emitting element 3 to be mounted is inclined at a predetermined angle from the vertically downward direction.
  • the predetermined angle is at most about 75 degrees. If it is such a structure, according to the shape of the light emission surface which apply
  • the spray nozzle 14 and the LED board 1 it is good also as a structure which inclines both the spray nozzle 14 and the LED board 1, and sprays the fluorescent substance liquid mixture 20 upwards, According to the shape of a LED board, the shape of a LED light emitting element, the shape of a light emission surface, etc.
  • the first method for inclining the spray nozzle 14 and the second method for inclining the LED substrate 1 are appropriately selected and used in combination.
  • the phosphor mixture is sprayed upward on the light emitting surface 3a of the LED light emitting element 3 by the spray nozzle 14A, and the angle at which the light emitting surface 3a and the side surface 3b intersect by the spray nozzle 14B,
  • the phosphor mixed liquid is sprayed toward the side surface 3b, and the phosphor mixed liquid is sprayed toward the corner where the light emitting surface 3a and the side surface 3c intersect and the side surface 3c by the spray nozzle 14C.
  • the method for manufacturing a light emitting device is a method for manufacturing a light emitting device having a light emitting element and a wavelength conversion unit including a phosphor that converts the wavelength of light emitted from the light emitting element.
  • the light emitting element is an LED light emitting element
  • the phosphor coating process is an upward coating process in which the phosphor mixed liquid is blown upward from the spray nozzle and the phosphor mixed liquid is coated on the light emitting surface of the LED light emitting element.
  • the phosphor mixed solution is sprayed upward from the spray nozzle, it is possible to form a phosphor dispersion film having a uniform film thickness with little density unevenness without being affected by mist floating in the air. It is preferable as a manufacturing method.
  • the spray angle of the spray nozzle in the upward coating process is upward in the vertical direction or upward in a diagonally upward range inclined by a predetermined angle from the vertical direction.
  • the phosphor mixture is sprayed vertically upward or obliquely upward, so that a coating film having a predetermined thickness with little concentration unevenness is formed without being affected by mist floating in the air. can do.
  • the predetermined angle is preferably at most 75 degrees as described above.
  • the spray angle of the spray nozzle is inclined at most 75 degrees from the vertical direction, so that the phosphor dispersion with a uniform film thickness can be applied to light emitting devices having light emitting surfaces of various shapes. This is a method for manufacturing a light-emitting device capable of forming a film.
  • the phosphor coating apparatus when the phosphor dispersion film is formed by the spray method, the phosphor mixture is applied by spraying upward, so that the mist floating in the air is natural.
  • a coating device can be obtained. For this reason, it is possible to reduce the unevenness of coating of the phosphor dispersion film and suppress the change in chromaticity. Further, since the spray nozzle is disposed upward, the phosphor is prevented from remaining at the tip of the nozzle, and the phosphor coating apparatus does not remain and solidify.
  • the phosphor coating device and the light emitting device manufacturing method according to the present invention include a light emitting device (LED that emits third light of a desired color by mixing primary light emitted from an LED light emitting element and secondary light emitted from a phosphor.
  • the phosphor coating device and the light emitting device can be suitably applied to a light source.

Abstract

La présente invention vise à fabriquer un dispositif d'application de couche de luminophores, par lequel dispositif il devient possible de former un film à dispersion de luminophores ayant une irrégularité de concentration réduite et ayant une épaisseur de film uniforme, et d'empêcher le résidu et la solidification d'un luminophore à une pointe d'une buse de pulvérisation dans la formation du film à dispersion de luminophores par une technique de pulvérisation. A cet effet, l'invention porte sur un dispositif d'application de couche de luminophores (10), qui est conçu de telle sorte que la surface émettrice de lumière d'un élément émetteur de lumière à diode électroluminescente (LED) (3) est dirigée dans une direction vers le bas, qu'une buse de pulvérisation (14) est disposée sur le côté inférieur de l'élément émetteur de lumière à diode électroluminescente (LED), et qu'une solution mixte de luminophores (20) est pulvérisée dans une direction vers le haut à travers la buse de pulvérisation de façon à appliquer la solution mixte de luminophores sur la surface émettrice de lumière. L'invention porte également sur un procédé pour fabriquer un dispositif émetteur de lumière, lequel procédé met en œuvre une étape de revêtement vers le haut, consistant à éjecter la solution mixte de luminophores (20) dans une direction vers le haut à travers la buse de pulvérisation (14) à l'aide du dispositif d'application de couche de luminophores afin d'appliquer la solution mixte de luminophores (20) sur la surface émettrice de lumière, ce par quoi il devient possible de fabriquer une source de lumière à diode électroluminescente (LED) comportant un film à dispersion de luminophores ayant une irrégularité de concentration réduite et ayant une épaisseur de film uniforme.
PCT/JP2011/078872 2010-12-21 2011-12-14 Dispositif d'application de couche de luminophores, et procédé pour fabriquer un dispositif émetteur de lumière WO2012086483A1 (fr)

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JP2014127594A (ja) * 2012-12-26 2014-07-07 Nichia Chem Ind Ltd 発光装置の製造方法およびスプレーコーティング装置
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JP2015220392A (ja) * 2014-05-20 2015-12-07 日亜化学工業株式会社 発光装置の製造方法
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JP2015503829A (ja) * 2012-01-03 2015-02-02 アンドリュー ズジンコＡｎｄｒｅｗ Ｚｓｉｎｋｏ エレクトロルミネッセンスデバイス、およびその製造
JP2014019844A (ja) * 2012-07-23 2014-02-03 Konica Minolta Inc 蛍光体分散液及びｌｅｄ装置の製造方法
JP2014127594A (ja) * 2012-12-26 2014-07-07 Nichia Chem Ind Ltd 発光装置の製造方法およびスプレーコーティング装置
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KR20160040929A (ko) * 2014-10-06 2016-04-15 삼성전자주식회사 발광 소자 패키지 제조 방법
WO2017059028A1 (fr) * 2015-10-01 2017-04-06 Cree, Inc. Dispositif d'éclairage à semi-conducteurs à puce retournée à faible pertes optiques
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US11031527B2 (en) 2018-01-29 2021-06-08 Creeled, Inc. Reflective layers for light-emitting diodes
US11387389B2 (en) 2018-01-29 2022-07-12 Creeled, Inc. Reflective layers for light-emitting diodes
US11923481B2 (en) 2018-01-29 2024-03-05 Creeled, Inc. Reflective layers for light-emitting diodes
US10879441B2 (en) 2018-12-17 2020-12-29 Cree, Inc. Interconnects for light emitting diode chips
US11398591B2 (en) 2018-12-17 2022-07-26 Creeled, Inc. Interconnects for light emitting diode chips
US11817537B2 (en) 2018-12-17 2023-11-14 Creeled, Inc. Interconnects for light emitting diode chips
US10985294B2 (en) 2019-03-19 2021-04-20 Creeled, Inc. Contact structures for light emitting diode chips
US11545595B2 (en) 2019-03-19 2023-01-03 Creeled, Inc. Contact structures for light emitting diode chips
US11094848B2 (en) 2019-08-16 2021-08-17 Creeled, Inc. Light-emitting diode chip structures

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