WO2012066998A1 - 熱硬化型シリコーン樹脂組成物、シリコーン樹脂含有構造体、光半導体素子封止体、および、シラノール縮合触媒 - Google Patents
熱硬化型シリコーン樹脂組成物、シリコーン樹脂含有構造体、光半導体素子封止体、および、シラノール縮合触媒 Download PDFInfo
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- WO2012066998A1 WO2012066998A1 PCT/JP2011/075822 JP2011075822W WO2012066998A1 WO 2012066998 A1 WO2012066998 A1 WO 2012066998A1 JP 2011075822 W JP2011075822 W JP 2011075822W WO 2012066998 A1 WO2012066998 A1 WO 2012066998A1
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- compound
- silicone resin
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- zirconium
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- 229920002050 silicone resin Polymers 0.000 title claims abstract description 78
- 239000011342 resin composition Substances 0.000 title claims abstract description 37
- 230000003287 optical effect Effects 0.000 title claims description 65
- 239000004065 semiconductor Substances 0.000 title claims description 63
- 238000009833 condensation Methods 0.000 title claims description 13
- 230000005494 condensation Effects 0.000 title claims description 13
- 239000003054 catalyst Substances 0.000 title claims description 12
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 title claims description 11
- -1 silane compound Chemical class 0.000 claims abstract description 177
- 229910000077 silane Inorganic materials 0.000 claims abstract description 74
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 64
- 150000003752 zinc compounds Chemical class 0.000 claims abstract description 42
- 150000002601 lanthanoid compounds Chemical class 0.000 claims abstract description 38
- 125000005372 silanol group Chemical group 0.000 claims abstract description 31
- 125000005370 alkoxysilyl group Chemical group 0.000 claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 57
- 150000001875 compounds Chemical class 0.000 claims description 54
- 125000004432 carbon atom Chemical group C* 0.000 claims description 42
- 125000000217 alkyl group Chemical group 0.000 claims description 31
- 125000003545 alkoxy group Chemical group 0.000 claims description 27
- 150000002363 hafnium compounds Chemical class 0.000 claims description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 21
- 229910052709 silver Inorganic materials 0.000 claims description 21
- 239000004332 silver Substances 0.000 claims description 21
- 150000003755 zirconium compounds Chemical class 0.000 claims description 21
- 239000003566 sealing material Substances 0.000 claims description 19
- 150000003606 tin compounds Chemical class 0.000 claims description 19
- 125000003118 aryl group Chemical group 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 11
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 10
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 9
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical class OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 7
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 150000007522 mineralic acids Chemical class 0.000 claims description 5
- 150000007524 organic acids Chemical class 0.000 claims description 5
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 claims description 3
- 239000011667 zinc carbonate Substances 0.000 claims description 3
- 235000004416 zinc carbonate Nutrition 0.000 claims description 3
- 229910000010 zinc carbonate Inorganic materials 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 238000013007 heat curing Methods 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical group [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 81
- 229910052726 zirconium Inorganic materials 0.000 description 79
- 239000000203 mixture Substances 0.000 description 73
- 229910052735 hafnium Inorganic materials 0.000 description 36
- 150000002430 hydrocarbons Chemical group 0.000 description 35
- 150000007942 carboxylates Chemical class 0.000 description 28
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical group [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 25
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 21
- 239000011701 zinc Substances 0.000 description 18
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 17
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 16
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 16
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 16
- 229910052725 zinc Inorganic materials 0.000 description 16
- 125000001931 aliphatic group Chemical group 0.000 description 14
- 125000002723 alicyclic group Chemical group 0.000 description 13
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 13
- 125000000524 functional group Chemical group 0.000 description 13
- 125000000962 organic group Chemical group 0.000 description 13
- 238000005486 sulfidation Methods 0.000 description 13
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 10
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 10
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical group C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 8
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229940125904 compound 1 Drugs 0.000 description 8
- 229940125782 compound 2 Drugs 0.000 description 8
- 125000001624 naphthyl group Chemical group 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 7
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- CUFNKYGDVFVPHO-UHFFFAOYSA-N azulene Chemical compound C1=CC=CC2=CC=CC2=C1 CUFNKYGDVFVPHO-UHFFFAOYSA-N 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 6
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 235000014692 zinc oxide Nutrition 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 5
- 229910052747 lanthanoid Inorganic materials 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 125000004433 nitrogen atom Chemical group N* 0.000 description 5
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 5
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 5
- 125000004430 oxygen atom Chemical group O* 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 125000004434 sulfur atom Chemical group 0.000 description 5
- 150000005691 triesters Chemical class 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- MBMLMWLHJBBADN-UHFFFAOYSA-N Ferrous sulfide Chemical compound [Fe]=S MBMLMWLHJBBADN-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 125000002252 acyl group Chemical group 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 125000000753 cycloalkyl group Chemical group 0.000 description 4
- 150000005690 diesters Chemical class 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000005842 heteroatom Chemical group 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 150000003751 zinc Chemical class 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000005639 Lauric acid Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- JIMXXGFJRDUSRO-UHFFFAOYSA-N adamantane-1-carboxylic acid Chemical compound C1C(C2)CC3CC2CC1(C(=O)O)C3 JIMXXGFJRDUSRO-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 235000010338 boric acid Nutrition 0.000 description 3
- 229960002645 boric acid Drugs 0.000 description 3
- 150000001639 boron compounds Chemical class 0.000 description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 3
- 150000001785 cerium compounds Chemical class 0.000 description 3
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 3
- 230000008034 disappearance Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 3
- 150000002602 lanthanoids Chemical group 0.000 description 3
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000005609 naphthenate group Chemical group 0.000 description 3
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 2
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 2
- QWOVEJBDMKHZQK-UHFFFAOYSA-N 1,3,5-tris(3-trimethoxysilylpropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CO[Si](OC)(OC)CCCN1C(=O)N(CCC[Si](OC)(OC)OC)C(=O)N(CCC[Si](OC)(OC)OC)C1=O QWOVEJBDMKHZQK-UHFFFAOYSA-N 0.000 description 2
- 125000006219 1-ethylpentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 2
- PARCMDAOZHNXLU-UHFFFAOYSA-N 2-ethylhexanoic acid;tin Chemical compound [Sn].CCCCC(CC)C(O)=O.CCCCC(CC)C(O)=O PARCMDAOZHNXLU-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 2
- JTRZHCXUXZWCJI-UHFFFAOYSA-N C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.[Zr] Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.[Zr] JTRZHCXUXZWCJI-UHFFFAOYSA-N 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 229930192627 Naphthoquinone Natural products 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- KTBGHSAYBDIBHX-UHFFFAOYSA-N butyl 2-methylpropaneperoxoate;zirconium Chemical compound [Zr].CCCCOOC(=O)C(C)C.CCCCOOC(=O)C(C)C KTBGHSAYBDIBHX-UHFFFAOYSA-N 0.000 description 2
- HQGSPVKMKYMQFD-UHFFFAOYSA-N butyl 7,7-dimethyloctaneperoxoate zirconium Chemical compound [Zr].CCCCOOC(=O)CCCCCC(C)(C)C.CCCCOOC(=O)CCCCCC(C)(C)C HQGSPVKMKYMQFD-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- JBDSSBMEKXHSJF-UHFFFAOYSA-N cyclopentanecarboxylic acid Chemical compound OC(=O)C1CCCC1 JBDSSBMEKXHSJF-UHFFFAOYSA-N 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 2
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 2
- MFGZXPGKKJMZIY-UHFFFAOYSA-N ethyl 5-amino-1-(4-sulfamoylphenyl)pyrazole-4-carboxylate Chemical compound NC1=C(C(=O)OCC)C=NN1C1=CC=C(S(N)(=O)=O)C=C1 MFGZXPGKKJMZIY-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 2
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- 150000002791 naphthoquinones Chemical class 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- MTBVDKSFTCGOTN-UHFFFAOYSA-N octane pentane-2,4-dione tin(4+) Chemical compound [Sn+4].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O.CCCCCCC[CH2-].CCCCCCC[CH2-] MTBVDKSFTCGOTN-UHFFFAOYSA-N 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 150000008301 phosphite esters Chemical class 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 150000003839 salts Chemical group 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- PTCSYKMYHDPUDF-UHFFFAOYSA-N zinc acetyl acetate Chemical compound [Zn+2].C(C)(=O)OC(C)=O PTCSYKMYHDPUDF-UHFFFAOYSA-N 0.000 description 2
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 2
- LFOXXKXKYHIANI-UHFFFAOYSA-L zinc;7,7-dimethyloctanoate Chemical compound [Zn+2].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O LFOXXKXKYHIANI-UHFFFAOYSA-L 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 2
- UVDDHYAAWVNATK-VGKOASNMSA-L (z)-4-[dibutyl-[(z)-4-oxopent-2-en-2-yl]oxystannyl]oxypent-3-en-2-one Chemical compound CC(=O)\C=C(C)/O[Sn](CCCC)(CCCC)O\C(C)=C/C(C)=O UVDDHYAAWVNATK-VGKOASNMSA-L 0.000 description 1
- OZDOQMMXEACZAA-NRFIWDAESA-L (z)-4-butoxy-4-oxobut-2-enoate;dibutyltin(2+) Chemical compound CCCCOC(=O)\C=C/C(=O)O[Sn](CCCC)(CCCC)OC(=O)\C=C/C(=O)OCCCC OZDOQMMXEACZAA-NRFIWDAESA-L 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- XZZWOTQMUOIIFX-UHFFFAOYSA-N 1-(2-diphenoxyphosphanyloxypropoxy)propan-2-yl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC(C)COCC(C)OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 XZZWOTQMUOIIFX-UHFFFAOYSA-N 0.000 description 1
- UUWJHAWPCRFDHZ-UHFFFAOYSA-N 1-dodecoxydodecane;phosphoric acid Chemical compound OP(O)(O)=O.CCCCCCCCCCCCOCCCCCCCCCCCC UUWJHAWPCRFDHZ-UHFFFAOYSA-N 0.000 description 1
- ZFMOJHVRFMOIGF-UHFFFAOYSA-N 2,4,6-trimethoxy-1,3,5,2,4,6-trioxatriborinane Chemical compound COB1OB(OC)OB(OC)O1 ZFMOJHVRFMOIGF-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- XGBMQBPLWXTEPM-UHFFFAOYSA-N 2-cyclopropyl-4,4,5,5-tetramethyl-1,3,2-dioxaborolane Chemical compound O1C(C)(C)C(C)(C)OB1C1CC1 XGBMQBPLWXTEPM-UHFFFAOYSA-N 0.000 description 1
- BVDCARPCJKEQCM-UHFFFAOYSA-K 2-ethylhexanoate ytterbium(3+) Chemical compound [Yb+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O BVDCARPCJKEQCM-UHFFFAOYSA-K 0.000 description 1
- XKZGIJICHCVXFV-UHFFFAOYSA-N 2-ethylhexyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCC(CC)CCCC)OC1=CC=CC=C1 XKZGIJICHCVXFV-UHFFFAOYSA-N 0.000 description 1
- 125000006020 2-methyl-1-propenyl group Chemical group 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- VYVFQBFOMKEKBG-UHFFFAOYSA-L 3,3-dibutyl-2,4,3-benzodioxastannepine-1,5-dione Chemical compound O=C1O[Sn](CCCC)(CCCC)OC(=O)C2=CC=CC=C21 VYVFQBFOMKEKBG-UHFFFAOYSA-L 0.000 description 1
- DGJISSKLLWWXTG-UHFFFAOYSA-N 3,3-diethyloctane Chemical compound CCCCCC(CC)(CC)CC DGJISSKLLWWXTG-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- MRWWWZLJWNIEEJ-UHFFFAOYSA-N 4,4,5,5-tetramethyl-2-propan-2-yloxy-1,3,2-dioxaborolane Chemical compound CC(C)OB1OC(C)(C)C(C)(C)O1 MRWWWZLJWNIEEJ-UHFFFAOYSA-N 0.000 description 1
- QAGAASULGXPVBU-UHFFFAOYSA-N 4,5-dihydrooxaborole Chemical compound O1B=CCC1 QAGAASULGXPVBU-UHFFFAOYSA-N 0.000 description 1
- DRZLVZYYZKVLCK-SEYKUYGWSA-L 4-o-[[(e)-4-ethoxy-4-oxobut-2-enoyl]oxy-dioctylstannyl] 1-o-ethyl (e)-but-2-enedioate Chemical compound CCCCCCCC[Sn](CCCCCCCC)(OC(=O)\C=C\C(=O)OCC)OC(=O)\C=C\C(=O)OCC DRZLVZYYZKVLCK-SEYKUYGWSA-L 0.000 description 1
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 1
- 229920006310 Asahi-Kasei Polymers 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- FIPWRIJSWJWJAI-UHFFFAOYSA-N Butyl carbitol 6-propylpiperonyl ether Chemical compound C1=C(CCC)C(COCCOCCOCCCC)=CC2=C1OCO2 FIPWRIJSWJWJAI-UHFFFAOYSA-N 0.000 description 1
- AJSYUAHPZLFYGV-UHFFFAOYSA-N C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.[Hf] Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.C1(=CC=CC2=CC=CC=C12)C(=O)OOCCCC.[Hf] AJSYUAHPZLFYGV-UHFFFAOYSA-N 0.000 description 1
- XSXNUIIIGCHDIZ-UHFFFAOYSA-J C1(=CC=CC2=CC=CC=C12)C(=O)[O-].C1(=CC=CC2=CC=CC=C12)C(=O)[O-].C1(=CC=CC2=CC=CC=C12)C(=O)[O-].C1(=CC=CC2=CC=CC=C12)C(=O)[O-].[Hf+4] Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)[O-].C1(=CC=CC2=CC=CC=C12)C(=O)[O-].C1(=CC=CC2=CC=CC=C12)C(=O)[O-].C1(=CC=CC2=CC=CC=C12)C(=O)[O-].[Hf+4] XSXNUIIIGCHDIZ-UHFFFAOYSA-J 0.000 description 1
- PHLOPQLVEUJJKD-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(C(O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(C(O)(CCCCCCCCCCCCC)C1=CC=CC=C1)C(O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(O)CCCCCCCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(C(O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(C(O)(CCCCCCCCCCCCC)C1=CC=CC=C1)C(O)(CCCCCCCCCCCCC)C1=CC=CC=C1)(O)CCCCCCCCCCCCC PHLOPQLVEUJJKD-UHFFFAOYSA-N 0.000 description 1
- MXCIMHKVBWUYNT-UHFFFAOYSA-J C1(CCCC1)C(=O)[O-].C1(CCCC1)C(=O)[O-].C1(CCCC1)C(=O)[O-].C1(CCCC1)C(=O)[O-].[Hf+4] Chemical compound C1(CCCC1)C(=O)[O-].C1(CCCC1)C(=O)[O-].C1(CCCC1)C(=O)[O-].C1(CCCC1)C(=O)[O-].[Hf+4] MXCIMHKVBWUYNT-UHFFFAOYSA-J 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LVZWSLJZHVFIQJ-UHFFFAOYSA-N Cyclopropane Chemical compound C1CC1 LVZWSLJZHVFIQJ-UHFFFAOYSA-N 0.000 description 1
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical class CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- QAEPIAHUOVJOOM-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC QAEPIAHUOVJOOM-UHFFFAOYSA-N 0.000 description 1
- MOABYHZDQQELLG-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCCCCCC)C(O)(C(CO)(CO)CO)CCCCCCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCCCCCC)C(O)(C(CO)(CO)CO)CCCCCCCCCCCCC MOABYHZDQQELLG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-N Salicylic acid Natural products OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- LRAMLJMXTWTRIX-UHFFFAOYSA-N [Hf++].CCCC[O-].CCCC[O-] Chemical compound [Hf++].CCCC[O-].CCCC[O-] LRAMLJMXTWTRIX-UHFFFAOYSA-N 0.000 description 1
- CTBWQZWCFDCSOU-UHFFFAOYSA-J [Hf+4].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O Chemical compound [Hf+4].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O CTBWQZWCFDCSOU-UHFFFAOYSA-J 0.000 description 1
- YPRPFZKACVGFIF-UHFFFAOYSA-J [Hf+4].CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O Chemical compound [Hf+4].CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O YPRPFZKACVGFIF-UHFFFAOYSA-J 0.000 description 1
- SDXDHLDNCJPIJZ-UHFFFAOYSA-N [Zr].[Zr] Chemical compound [Zr].[Zr] SDXDHLDNCJPIJZ-UHFFFAOYSA-N 0.000 description 1
- WZZQROOLCLLWTL-UHFFFAOYSA-N [Zr].[Zr].[Zr] Chemical compound [Zr].[Zr].[Zr] WZZQROOLCLLWTL-UHFFFAOYSA-N 0.000 description 1
- CQQXCSFSYHAZOO-UHFFFAOYSA-L [acetyloxy(dioctyl)stannyl] acetate Chemical compound CCCCCCCC[Sn](OC(C)=O)(OC(C)=O)CCCCCCCC CQQXCSFSYHAZOO-UHFFFAOYSA-L 0.000 description 1
- GPDWNEFHGANACG-UHFFFAOYSA-L [dibutyl(2-ethylhexanoyloxy)stannyl] 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)O[Sn](CCCC)(CCCC)OC(=O)C(CC)CCCC GPDWNEFHGANACG-UHFFFAOYSA-L 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- IFMBURWYBLGMDO-UHFFFAOYSA-J adamantane-1-carboxylate hafnium(4+) Chemical compound C12(CC3CC(CC(C1)C3)C2)C(=O)[O-].C23(CC1CC(CC(C2)C1)C3)C(=O)[O-].C31(CC2CC(CC(C3)C2)C1)C(=O)[O-].C12(CC3CC(CC(C1)C3)C2)C(=O)[O-].[Hf+4] IFMBURWYBLGMDO-UHFFFAOYSA-J 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 125000002521 alkyl halide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N beta-methyl-butyric acid Natural products CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- LKXGYGYFPTZHLC-UHFFFAOYSA-N bicyclo[2.2.1]heptane-4-carboxylic acid Chemical compound C1CC2CCC1(C(=O)O)C2 LKXGYGYFPTZHLC-UHFFFAOYSA-N 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- IPWKHHSGDUIRAH-UHFFFAOYSA-N bis(pinacolato)diboron Chemical compound O1C(C)(C)C(C)(C)OB1B1OC(C)(C)C(C)(C)O1 IPWKHHSGDUIRAH-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- PZGVVCOOWYSSGB-UHFFFAOYSA-L but-2-enedioate;dioctyltin(2+) Chemical compound CCCCCCCC[Sn]1(CCCCCCCC)OC(=O)C=CC(=O)O1 PZGVVCOOWYSSGB-UHFFFAOYSA-L 0.000 description 1
- LTBRWBUKPWVGFA-UHFFFAOYSA-N butan-1-olate;hafnium(4+) Chemical compound [Hf+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] LTBRWBUKPWVGFA-UHFFFAOYSA-N 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- HREFQVASMSXADU-UHFFFAOYSA-N butyl benzenecarboperoxoate;zirconium Chemical compound [Zr].CCCCOOC(=O)C1=CC=CC=C1.CCCCOOC(=O)C1=CC=CC=C1 HREFQVASMSXADU-UHFFFAOYSA-N 0.000 description 1
- NHAPOIWOXXOLNP-UHFFFAOYSA-N butyl cyclohexanecarboperoxoate;zirconium Chemical compound [Zr].CCCCOOC(=O)C1CCCCC1.CCCCOOC(=O)C1CCCCC1 NHAPOIWOXXOLNP-UHFFFAOYSA-N 0.000 description 1
- BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical class CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 description 1
- FXNONNRUNQPNLF-UHFFFAOYSA-N cerium;2-ethylhexanoic acid Chemical compound [Ce].CCCCC(CC)C(O)=O.CCCCC(CC)C(O)=O.CCCCC(CC)C(O)=O FXNONNRUNQPNLF-UHFFFAOYSA-N 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000005201 cycloalkylcarbonyloxy group Chemical group 0.000 description 1
- TXWOGHSRPAYOML-UHFFFAOYSA-M cyclobutanecarboxylate Chemical compound [O-]C(=O)C1CCC1 TXWOGHSRPAYOML-UHFFFAOYSA-M 0.000 description 1
- VZFUCHSFHOYXIS-UHFFFAOYSA-N cycloheptane carboxylic acid Natural products OC(=O)C1CCCCCC1 VZFUCHSFHOYXIS-UHFFFAOYSA-N 0.000 description 1
- XFYIPRRMZXTLGJ-UHFFFAOYSA-N cycloheptyl hydrogen carbonate Chemical group OC(=O)OC1CCCCCC1 XFYIPRRMZXTLGJ-UHFFFAOYSA-N 0.000 description 1
- NZNMSOFKMUBTKW-UHFFFAOYSA-M cyclohexanecarboxylate Chemical compound [O-]C(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-M 0.000 description 1
- UUGLEYNXFLZDEY-UHFFFAOYSA-J cyclohexanecarboxylate hafnium(4+) Chemical compound C1(CCCCC1)C(=O)[O-].C1(CCCCC1)C(=O)[O-].C1(CCCCC1)C(=O)[O-].C1(CCCCC1)C(=O)[O-].[Hf+4] UUGLEYNXFLZDEY-UHFFFAOYSA-J 0.000 description 1
- GMVARPAQVYKXMQ-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1.OC(=O)C1CCCCC1 GMVARPAQVYKXMQ-UHFFFAOYSA-N 0.000 description 1
- 125000006639 cyclohexyl carbonyl group Chemical group 0.000 description 1
- FRJZOYQRAJDROR-UHFFFAOYSA-N cyclohexyl hydrogen carbonate Chemical group OC(=O)OC1CCCCC1 FRJZOYQRAJDROR-UHFFFAOYSA-N 0.000 description 1
- JBDSSBMEKXHSJF-UHFFFAOYSA-M cyclopentanecarboxylate Chemical compound [O-]C(=O)C1CCCC1 JBDSSBMEKXHSJF-UHFFFAOYSA-M 0.000 description 1
- 125000006638 cyclopentyl carbonyl group Chemical group 0.000 description 1
- YMGUBTXCNDTFJI-UHFFFAOYSA-M cyclopropanecarboxylate Chemical compound [O-]C(=O)C1CC1 YMGUBTXCNDTFJI-UHFFFAOYSA-M 0.000 description 1
- VXICQNWDKCVFTQ-UHFFFAOYSA-J cyclopropanecarboxylate hafnium(4+) Chemical compound C1(CC1)C(=O)[O-].C1(CC1)C(=O)[O-].C1(CC1)C(=O)[O-].C1(CC1)C(=O)[O-].[Hf+4] VXICQNWDKCVFTQ-UHFFFAOYSA-J 0.000 description 1
- 125000006255 cyclopropyl carbonyl group Chemical group [H]C1([H])C([H])([H])C1([H])C(*)=O 0.000 description 1
- GLOQRSIADGSLRX-UHFFFAOYSA-N decyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCC)OC1=CC=CC=C1 GLOQRSIADGSLRX-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- OSGZEAQLLRZGHT-VGKOASNMSA-L dibutyltin(2+);(z)-4-ethoxy-4-oxobut-2-enoate Chemical compound CCOC(=O)\C=C/C(=O)O[Sn](CCCC)(CCCC)OC(=O)\C=C/C(=O)OCC OSGZEAQLLRZGHT-VGKOASNMSA-L 0.000 description 1
- WNDWDJLPMLWBHW-UDVCPWNYSA-L dibutyltin(2+);(z)-4-methoxy-4-oxobut-2-enoate Chemical compound COC(=O)\C=C/C(=O)O[Sn](CCCC)(CCCC)OC(=O)\C=C/C(=O)OC WNDWDJLPMLWBHW-UDVCPWNYSA-L 0.000 description 1
- TUALPPJDVFLVNQ-KUAKSMGGSA-L dibutyltin(2+);(z)-4-oxo-4-phenylmethoxybut-2-enoate Chemical compound C=1C=CC=CC=1COC(=O)\C=C/C(=O)O[Sn](CCCC)(CCCC)OC(=O)\C=C/C(=O)OCC1=CC=CC=C1 TUALPPJDVFLVNQ-KUAKSMGGSA-L 0.000 description 1
- JNKCYBSAZHJNIZ-LHJYRGMRSA-L dibutyltin(2+);(z)-4-oxo-4-tridecoxybut-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)\C=C/C(=O)O[Sn](CCCC)(CCCC)OC(=O)\C=C/C(=O)OCCCCCCCCCCCCC JNKCYBSAZHJNIZ-LHJYRGMRSA-L 0.000 description 1
- JSBWYSVKZOKTJJ-UHFFFAOYSA-L dibutyltin(2+);2-nonylphenolate Chemical compound CCCC[Sn+2]CCCC.CCCCCCCCCC1=CC=CC=C1[O-].CCCCCCCCCC1=CC=CC=C1[O-] JSBWYSVKZOKTJJ-UHFFFAOYSA-L 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- GNEPOXWQWFSSOU-UHFFFAOYSA-N dichloro-methyl-phenylsilane Chemical compound C[Si](Cl)(Cl)C1=CC=CC=C1 GNEPOXWQWFSSOU-UHFFFAOYSA-N 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 1
- HUDSKKNIXMSHSZ-UHFFFAOYSA-N dihexyl hydrogen phosphate Chemical class CCCCCCOP(O)(=O)OCCCCCC HUDSKKNIXMSHSZ-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- PWEVMPIIOJUPRI-UHFFFAOYSA-N dimethyltin Chemical compound C[Sn]C PWEVMPIIOJUPRI-UHFFFAOYSA-N 0.000 description 1
- SDTDHTCWRNVNAJ-UHFFFAOYSA-L dimethyltin(2+);diacetate Chemical compound CC(=O)O[Sn](C)(C)OC(C)=O SDTDHTCWRNVNAJ-UHFFFAOYSA-L 0.000 description 1
- OGVJEUDMQQIAPV-UHFFFAOYSA-N diphenyl tridecyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCCCCC)OC1=CC=CC=C1 OGVJEUDMQQIAPV-UHFFFAOYSA-N 0.000 description 1
- QVKQJEWZVQFGIY-UHFFFAOYSA-N dipropyl hydrogen phosphate Chemical class CCCOP(O)(=O)OCCC QVKQJEWZVQFGIY-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- ASBGGHMVAMBCOR-UHFFFAOYSA-N ethanolate;zirconium(4+) Chemical compound [Zr+4].CC[O-].CC[O-].CC[O-].CC[O-] ASBGGHMVAMBCOR-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- PHNWGDTYCJFUGZ-UHFFFAOYSA-N hexyl dihydrogen phosphate Chemical class CCCCCCOP(O)(O)=O PHNWGDTYCJFUGZ-UHFFFAOYSA-N 0.000 description 1
- 125000003707 hexyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- JELBFNWRSIMKML-UHFFFAOYSA-N hydroxy-tris(methylperoxy)silane Chemical compound COO[Si](O)(OOC)OOC JELBFNWRSIMKML-UHFFFAOYSA-N 0.000 description 1
- SKOWZLGOFVSKLB-UHFFFAOYSA-N hypodiboric acid Chemical compound OB(O)B(O)O SKOWZLGOFVSKLB-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940070765 laurate Drugs 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- IKGXNCHYONXJSM-UHFFFAOYSA-N methanolate;zirconium(4+) Chemical compound [Zr+4].[O-]C.[O-]C.[O-]C.[O-]C IKGXNCHYONXJSM-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- CYCFYXLDTSNTGP-UHFFFAOYSA-L octadecanoate;tin(2+) Chemical compound [Sn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CYCFYXLDTSNTGP-UHFFFAOYSA-L 0.000 description 1
- 125000005447 octyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- VGTPKLINSHNZRD-UHFFFAOYSA-N oxoborinic acid Chemical compound OB=O VGTPKLINSHNZRD-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 150000004980 phosphorus peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- IKNCGYCHMGNBCP-UHFFFAOYSA-N propan-1-olate Chemical compound CCC[O-] IKNCGYCHMGNBCP-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- 125000001725 pyrenyl group Chemical group 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical class CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- IZRJPHXTEXTLHY-UHFFFAOYSA-N triethoxy(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](OCC)(OCC)OCC IZRJPHXTEXTLHY-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical class CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
- SFENPMLASUEABX-UHFFFAOYSA-N trihexyl phosphate Chemical class CCCCCCOP(=O)(OCCCCCC)OCCCCCC SFENPMLASUEABX-UHFFFAOYSA-N 0.000 description 1
- JBYXACURRYATNJ-UHFFFAOYSA-N trimethoxy(1-trimethoxysilylhexyl)silane Chemical compound CCCCCC([Si](OC)(OC)OC)[Si](OC)(OC)OC JBYXACURRYATNJ-UHFFFAOYSA-N 0.000 description 1
- XLUIBHBNUCWHGE-UHFFFAOYSA-N trimethoxy(1-trimethoxysilyloctyl)silane Chemical compound CCCCCCCC([Si](OC)(OC)OC)[Si](OC)(OC)OC XLUIBHBNUCWHGE-UHFFFAOYSA-N 0.000 description 1
- JFFBPULXPLWPAA-UHFFFAOYSA-N trimethoxy(10-trimethoxysilyldecyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCCC[Si](OC)(OC)OC JFFBPULXPLWPAA-UHFFFAOYSA-N 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- BMQGQVPUOLXPKP-UHFFFAOYSA-N trimethoxy(7-trimethoxysilylheptyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC[Si](OC)(OC)OC BMQGQVPUOLXPKP-UHFFFAOYSA-N 0.000 description 1
- MBIWXZXQMMLFAB-UHFFFAOYSA-N trimethoxy(9-trimethoxysilylnonyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCC[Si](OC)(OC)OC MBIWXZXQMMLFAB-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- 125000003960 triphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C3=CC=CC=C3C12)* 0.000 description 1
- RXPQRKFMDQNODS-UHFFFAOYSA-N tripropyl phosphate Chemical class CCCOP(=O)(OCCC)OCCC RXPQRKFMDQNODS-UHFFFAOYSA-N 0.000 description 1
- ILLOBGFGKYTZRO-UHFFFAOYSA-N tris(2-ethylhexyl) phosphite Chemical compound CCCCC(CC)COP(OCC(CC)CCCC)OCC(CC)CCCC ILLOBGFGKYTZRO-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- JZNDMMGBXUYFNQ-UHFFFAOYSA-N tris(dodecylsulfanyl)phosphane Chemical compound CCCCCCCCCCCCSP(SCCCCCCCCCCCC)SCCCCCCCCCCCC JZNDMMGBXUYFNQ-UHFFFAOYSA-N 0.000 description 1
- YZYKZHPNRDIPFA-UHFFFAOYSA-N tris(trimethylsilyl) borate Chemical compound C[Si](C)(C)OB(O[Si](C)(C)C)O[Si](C)(C)C YZYKZHPNRDIPFA-UHFFFAOYSA-N 0.000 description 1
- QJMMCGKXBZVAEI-UHFFFAOYSA-N tris(trimethylsilyl) phosphate Chemical compound C[Si](C)(C)OP(=O)(O[Si](C)(C)C)O[Si](C)(C)C QJMMCGKXBZVAEI-UHFFFAOYSA-N 0.000 description 1
- VMZOBROUFBEGAR-UHFFFAOYSA-N tris(trimethylsilyl) phosphite Chemical compound C[Si](C)(C)OP(O[Si](C)(C)C)O[Si](C)(C)C VMZOBROUFBEGAR-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- PEXOFOFLXOCMDX-UHFFFAOYSA-N tritridecyl phosphite Chemical compound CCCCCCCCCCCCCOP(OCCCCCCCCCCCCC)OCCCCCCCCCCCCC PEXOFOFLXOCMDX-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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Definitions
- the present invention relates to a thermosetting silicone resin composition, a silicone resin-containing structure and an optical semiconductor element encapsulant obtained using the same, and further to a silanol condensation catalyst.
- a cerium compound is known as a condensation catalyst contained in a silicone resin composition.
- Patent Document 1 states that “an organic polymer having a hydroxyl group and / or a hydrolyzable group bonded to a silicon atom in the molecule and having at least one silicon-containing group that can be crosslinked by forming a siloxane bond”. "A curable composition containing 100 parts by weight and 0.01 to 200 parts by weight of an organic cerium compound” is disclosed ([Claim 1]).
- an object of this invention is to provide the thermosetting silicone resin composition containing the lanthanoid compound excellent in thermosetting.
- the present inventor has found that a silicone resin composition containing a predetermined amount of a lanthanoid compound and a zinc compound in combination is excellent in thermosetting, and the present invention.
- the present invention provides the following (1) to (11).
- the content of the lanthanoid compound (C) is 0.5 to 2000 parts by mass with respect to 100 parts by mass of the organopolysiloxane (A), and the organopolysiloxane (A) and the silane compound.
- the content of the zinc compound (D) is 100 parts by mass of the organopolysiloxane (A) and the silane compound (B).
- a thermosetting silicone resin composition that is 0.01 to 5 parts by mass with respect to parts.
- thermosetting silicone resin composition according to (1) wherein the lanthanoid compound (C) is a compound represented by the following formula (c1).
- R c represents an alkyl group having 1 to 30 carbon atoms, an allyl group or an aryl group, and the plurality of R c may be the same or different.
- the above zinc compound (D) is a compound obtained by reacting 1.5 to 3 mol of an inorganic acid and / or organic acid with respect to 1 mol of zinc oxide and / or zinc carbonate.
- the zirconium compound (E) and / or the hafnium compound (F) is contained in an amount of 0.001 to 5 parts by mass with respect to a total of 100 parts by mass of the organopolysiloxane (A) and the silane compound (B).
- the thermosetting silicone resin composition according to any one of (1) to (3) above.
- the tin compound (G) is contained in an amount of 0.001 to 5 parts by mass with respect to a total of 100 parts by mass of the organopolysiloxane (A) and the silane compound (B).
- the thermosetting silicone resin composition according to any one of 4).
- thermosetting silicone resin composition according to any one of (1) to (5), further comprising a bis (alkoxy) alkane and / or an isocyanurate derivative.
- the organopolysiloxane (A) is composed of R 3 SiO 1/2 units (wherein each R independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 6 carbon atoms) and SiO 4/2 units as repeating units, the ratio of R 3 SiO 1/2 units to 1 mol of SiO 4/2 units is 0.5 to 1.2 mol, and furthermore, to 1 mol of SiO 4/2 units, At least one of R 2 SiO 2/2 units and RSiO 3/2 units (wherein each R independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 6 carbon atoms)
- the above-mentioned including a silicone resin, which may have a unit of 1.0 mol or less and a total of each unit of 1.0 mol or less, and has a silanol group of less than 6.0% by mass
- a curable silicone resin composition Heat according to any one of 1) to (6) A curable silicone resin composition.
- a silicone resin comprising: a member containing silver; and a silicone resin layer obtained by curing the thermosetting silicone resin composition according to any one of (1) to (7), which covers the member. Containing structure.
- a frame having a recess, an optical semiconductor element disposed at the bottom of the recess, a member including silver disposed on an inner surface of the recess, the optical semiconductor element and the above filled in the recess And a sealing material obtained by curing the thermosetting silicone resin composition according to any one of (1) to (7), which seals a member.
- thermosetting silicone resin composition containing a lanthanoid compound and having excellent thermosetting properties.
- thermosetting silicone resin composition of the present invention includes an organopolysiloxane (A) having a silanol group, a silane compound (B) having an alkoxysilyl group, The lanthanoid compound (C) and the zinc compound (D) are contained, and the content of the silane compound (B) is 0.5 to 2000 parts by mass with respect to 100 parts by mass of the organopolysiloxane (A).
- the content of the lanthanoid compound (C) is 0.0001 to 1 part by mass with respect to 100 parts by mass in total of the organopolysiloxane (A) and the silane compound (B), and the zinc compound (D) Is a thermosetting type silicone having a content of 0.01 to 5 parts by mass with respect to a total of 100 parts by mass of the organopolysiloxane (A) and the silane compound (B).
- a resin composition is 0.0001 to 1 part by mass with respect to 100 parts by mass in total of the organopolysiloxane (A) and the silane compound (B)
- the zinc compound (D) Is a thermosetting type silicone having a content of 0.01 to 5 parts by mass with respect to a total of 100 parts by mass of the organopolysiloxane (A) and the silane compound (B).
- the organopolysiloxane (A) contained in the composition of the present invention is an organopolysiloxane having one or more, preferably two or more silanol groups in one molecule.
- the hydrocarbon group of the organopolysiloxane (A) is not particularly limited, and examples thereof include aromatic groups such as phenyl groups; alkyl groups; alkenyl groups;
- the main chain of the organopolysiloxane (A) may be linear, branched, or network. Some of them may have an alkoxysilyl group having 1 to 6 carbon atoms.
- organopolysiloxane (A) examples include organopolydialkylsiloxanes in which two or more silanol groups are bonded to the terminal.
- Such an organopolysiloxane (A) is preferably an organopolydimethylsiloxane in which two silanol groups are bonded to both ends, and a straight chain in which two silanol groups are bonded to both ends. More preferred is a linear organopolydimethylsiloxane (linear organopolydimethylsiloxane- ⁇ , ⁇ -diol), and specific examples thereof include those represented by the following formula (a1).
- R 4 represents an alkyl group or aryl group having 1 to 18 carbon atoms
- n represents an integer of 1 or more
- a plurality of R 4 may be the same or different.
- the alkyl group of R 4 is C 1 -C 18 illustrated, for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, n- butyl group, isobutyl group, etc.
- tert- butyl group represented by R 4
- Examples of the aryl group having 1 to 18 carbon atoms include a phenyl group and a naphthyl group.
- n can be a numerical value corresponding to the weight average molecular weight of the organopolysiloxane (A), and is preferably an integer of 10 to 15,000.
- examples of the organopolysiloxane (A) include silicone resins having a network of main chains.
- examples of such a silicone resin include, for example, R 3 SiO 1/2 units (wherein each R independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 6 carbon atoms) and SiO 4 / Examples include silicone resin A1 having 2 units as a repeating unit.
- R in R 3 SiO 1/2 unit is, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, iso-butyl group, tert-butyl group, pentyl.
- alkyl group such as hexyl group
- cycloalkyl group such as cyclopentyl group, cyclohexyl group
- alkenyl group such as vinyl group, allyl group, isopropenyl group, butenyl group, pentenyl group, hexenyl group
- aryl group such as phenyl group
- Halogenated alkyl groups such as chloromethyl group, 3-chloropropyl group, 1-chloro-2-methylpropyl group, 3,3,3-trifluoropropyl group
- a phenyl group is preferable, and a methyl group is more preferable.
- the ratio of R 3 SiO 1/2 units to 1 mol of SiO 4/2 units is 0.5 to 1.2 mol, preferably 0.65 to 1.15 mol.
- the cured product of the composition of the present invention has appropriate strength and excellent transparency.
- the silicone resin A1 has an R 2 SiO 2/2 unit and an RSiO 3/2 unit (wherein R is independently an unsubstituted or substituted carbon number of 1 to 6 with respect to 1 mol of SiO 4/2 units. At least one of each unit may be 1.0 mol or less and the total of each unit may be 1.0 mol or less, more preferably The R 2 SiO 2/2 unit and the RSiO 3/2 unit are 0.2 to 0.8 mol, and the total of the units is 1.0 mol or less. Thus, if it is a mixture ratio, the composition of this invention is excellent in transparency. Specific examples of such a blending ratio include a combination of 0.2 mol of R 2 SiO 2/2 units and 0.7 mol of RSiO 3/2 units with respect to 1 mol of SiO 4/2 units.
- the silicone resin A1 has a silanol group of less than 6.0% by mass.
- the content of silanol groups is preferably 0.1% by weight or more, and more preferably 0.2 to 3.0% by weight. When the content of the silanol group is within this range, the hardness of the cured product of the composition of the present invention is appropriate, the adhesiveness is good, and the strength is also appropriate.
- the silicone resin A1 may have an alkoxysilyl group. Examples of the resin having a silanol group and an alkoxy group include MK resin (manufactured by Asahi Kasei Wacker Silicone).
- the method for producing the silicone resin A1 is not particularly limited, and can be produced by a conventionally known method.
- the alkoxy group-containing silane compound corresponding to each unit can be substantially hydrolyzed and condensed in an organic solvent. Can be obtained as containing no volatile components.
- R 3 SiOMe and Si (OMe) 4 are co-hydrolyzed and condensed in an organic solvent together with R 2 Si (OMe) 2 and / or RSi (OMe) 3 as desired.
- each R independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 6 carbon atoms, and Me represents a methyl group).
- organic solvent those capable of dissolving organopolysiloxane produced by cohydrolysis / condensation reaction are preferable, and specific examples thereof include toluene, xylene, methylene chloride, naphtha mineral spirit and the like.
- silicone resin A1 a commercially available product can be used, and examples thereof include “SR1000” which is trimethoxysilicic acid manufactured by Momentive Performance Materials Japan LLC.
- the molecular weight of the organopolysiloxane (A) is preferably 1,000 to 1,000,000, more preferably 1,000 to 100,000, from the viewpoint that the physical properties of the composition of the present invention are excellent. preferable.
- the molecular weight of the organopolysiloxane (A) is a weight average molecular weight in terms of polystyrene by gel permeation chromatography (GPC) using chloroform as a solvent.
- GPC gel permeation chromatography
- Organopolysiloxane (A) may be used individually by 1 type, and may use 2 or more types together.
- the composition of the present invention contains 0.5 to 2000 parts by mass of the silane compound (B) with respect to 100 parts by mass of the aforementioned organopolysiloxane (A) from the viewpoint of thermosetting.
- the silane compound (B) contained in the composition of the present invention has one or more, preferably two or more alkoxysilyl groups in one molecule.
- the alkoxysilyl group means a group in which an alkoxy group is directly bonded to a silicon atom.
- silane compound (B) examples include a compound having one silicon atom in one molecule and having two or more alkoxy groups bonded to the silicon atom (hereinafter, also referred to as “silane compound B1”); Organopolysiloxane having two or more silicon atoms in the molecule, the skeleton being a polysiloxane skeleton, and having two or more alkoxy groups bonded to the silicon atom (hereinafter also referred to as “silane compound B2”); etc. Is mentioned.
- the silane compound (B) may have one or more organic groups in one molecule, and may include, for example, at least one heteroatom selected from the group consisting of an oxygen atom, a nitrogen atom, and a sulfur atom.
- Specific examples include an alkyl group (preferably having 1 to 6 carbon atoms), a (meth) acrylate group, an alkenyl group, an aryl group, and combinations thereof.
- Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and an isopropyl group.
- Examples of the alkenyl group include vinyl group, allyl group, propenyl group, isopropenyl group, 2-methyl-1-propenyl group, 2-methylallyl group and the like.
- Examples of the aryl group include a phenyl group and a naphthyl group. Of these, a methyl group, a (meth) acrylate group, and a (meth) acryloxy
- Silane compound B1 As silane compound B1, what is represented by a following formula (b1) is mentioned, for example. Si (OR 5 ) n R 6 4-n (b1) In the formula (b1), n represents 2, 3 or 4, R 5 represents an alkyl group, and R 6 represents an organic group. The organic group represented by R 6 has the same meaning as described as the organic group that the silane compound (B) can have.
- silane compound B1 examples include dialkoxysilanes such as dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diphenyldimethoxysilane, and diphenyldiethoxysilane; methyltrimethoxysilane, methyltriethoxysilane, Trialkoxysilanes such as ethyltrimethoxysilane, ethyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane; tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, and tetraisopropyloxysilane; ⁇ - (meth) acryloxy (Meth) acryloxyalkyltrialkoxysilanes such as propyltrimethoxysilane and
- (meth) acryloxytrialkoxysilane means acryloxytrialkoxysilane or methacryloxytrialkoxysilane. The same applies to (meth) acrylate groups and (meth) acryloxyalkyl groups.
- silane compound B2 examples include compounds represented by the following formula (b2-1).
- R 7 is an organic group
- R 8 is hydrogen and / or an alkyl group
- m is 0 ⁇ m ⁇ 2
- n is 0 ⁇ n ⁇ 2
- m + n is 0 ⁇ m + n ⁇ 3.
- the organic group represented by R 7 has the same meaning as that described as the organic group that the silane compound (B) can have
- the alkyl group represented by R 8 can have the silane compound (B). It is synonymous with what was described as an alkyl group as an organic group.
- Examples of the silane compound B2 include silicone alkoxy oligomers such as methyl methoxy oligomer.
- the silicone alkoxy oligomer is a silicone resin having a main chain of polyorganosiloxane and a molecular terminal blocked with an alkoxysilyl group.
- the methylmethoxy oligomer corresponds to a compound represented by the formula (b2-1), and specific examples thereof include those represented by the following formula (b2-2).
- R 9 represents a methyl group
- a represents an integer of 1 to 100
- b represents an integer of 0 to 100.
- a commercially available product can be used, and examples thereof include x-40-9246 (weight average molecular weight: 6000, manufactured by Shin-Etsu Chemical Co., Ltd.).
- silane compound B3 a compound having at least one alkoxysilyl group at one end and having three or more alkoxy groups (derived from an alkoxysilyl group) in one molecule (hereinafter referred to as “silane compound B3”). Also called).
- Silane compound B3 can be obtained, for example, as a reaction product obtained by dealcoholization condensation of 1 mol or more of a silane compound having an alkoxylyl group with respect to 1 mol of polysiloxane having a silanol group at both ends.
- Examples of the silane compound having an alkoxy group used for producing the silane compound B3 include the compound represented by the formula (b1) and the compound represented by the formula (b2-1) described above. It is done.
- Examples of the silane compound B3 include those represented by the following formula (b3).
- n can be a numerical value corresponding to the molecular weight of the silane compound B3.
- the compound represented by the formula (b3) can be produced, for example, by modifying a polysiloxane having silanol groups at both ends with tetramethoxysilane (corresponding to the compound represented by the formula (b1)). it can.
- silane compound (B) those represented by the formula (b1) and those represented by the formula ((b2-1)) are preferable.
- Tetraalkoxysilane such as tetraethoxysilane; ⁇ - (meth) acryloxy
- (meth) acryloxyalkyltrialkoxysilanes such as propyltrimethoxysilane; methylmethoxy oligomers.
- the silane compound (B) is preferably a (meth) acryl-functional (meth) acryloxyalkyltrialkoxysilane.
- the molecular weight of the silane compound (B) is preferably from 100 to 1,000,000, and preferably from 1000 to 100,000, because the curability of the composition of the present invention and the physical properties of the cured product are excellent. Is more preferable.
- the molecular weight shall be the weight average molecular weight of polystyrene conversion by the gel permeation chromatography (GPC) which uses chloroform as a solvent.
- a silane compound (B) may be used individually by 1 type, and may use 2 or more types together.
- the content of the silane compound (B) is 0.5 to 2000 parts by mass with respect to 100 parts by mass of the organopolysiloxane (A), and 0.5 to 1000 parts by mass from the viewpoint of thermosetting.
- the amount is preferably 0.5 to 500 parts by mass.
- the silanol condensation catalyst contained in the composition of the present invention contains at least a lanthanoid compound (C) and a zinc compound (D) described below, and will be described later. Or the hafnium compound (F) and the tin compound (G) may optionally be included.
- each component contained as a silanol condensation catalyst in the composition of the present invention that is, a lanthanoid compound (C), a zinc compound (D), a zirconium compound (E) and / or a hafnium compound (F),
- a silanol condensation catalyst of the present invention will be described with the description of the tin compound (G).
- the composition of the present invention contains 0.0001 to 1 part by mass of the lanthanoid compound (C) with respect to a total of 100 parts by mass of the organopolysiloxane (A) and the silane compound (B).
- the “lanthanoid compound” refers to a compound having a lanthanoid atom (Ln) such as lanthanum (La), cerium (Ce), dysprosium (Dy), ytterbium (Yb) and the like.
- the lanthanoid compound (C) contained in the composition of the present invention is not particularly limited as long as it is a “lanthanoid compound”. However, because the thermosetting property of the composition of the present invention is more excellent, the following formula (c1) It is preferable that it is a compound represented by these.
- each R c independently represents an alkyl group having 1 to 30 carbon atoms, an allyl group or an aryl group.
- Ln represents a lanthanoid atom.
- Examples of the alkyl group having 1 to 30 carbon atoms represented by R c in the formula (c1) include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, an n-hexyl group, n Linear alkyl groups such as -heptyl group, n-octyl group, n-nonyl group, n-decyl group; isopropyl group, isobutyl group, sec-butyl group, tert-butyl group, sec-pentyl group, isopentyl group, Neopentyl group, 1-methylhexyl group, 1-ethylpentyl group, 1-propylbutyl
- the allyl group represented by R c in formula (c1) is a 2-propenyl group (—CH 2 CH ⁇ CH 2 ).
- the aryl group represented by R c in formula (c1) is preferably an aryl group having 6 to 30 carbon atoms. Specifically, for example, a phenyl group, a naphthyl group, an anthracenyl group, a phenanthrenyl group, a pyrenyl group Perylenyl group, fluorenyl group, biphenyl group, terphenyl group, rubrenyl group, chrycenyl group, triphenylenyl group and the like.
- the group represented by R c in formula (c1) is preferably an alkyl group having 1 to 30 carbon atoms, more preferably an alkyl group having 6 to 18 carbon atoms, and 1-ethyl A pentyl group and a naphthene ring are more preferable.
- Examples of the lanthanoid compound (C) represented by the formula (c1) include lanthanoid 2-ethylhexanoate and lanthanoid naphthenate. Of these, lanthanum, cerium, dysprosium or ytterbium 2-ethylhexanoate is preferred from the viewpoint of better thermosetting of the composition of the present invention, and cerium 2-ethylhexanoate (tris (2-ethyl) Hexanoic acid) cerium) is more preferred.
- the method for producing the lanthanoid compound (C) is not particularly limited, and examples thereof include conventionally known methods.
- a lanthanoid compound (C) may be used individually by 1 type, and may use 2 or more types together.
- the content of the lanthanoid compound (C) is 100 parts by mass in total of the above-described organopolysiloxane (A) and silane compound (B) because the thermosetting property of the composition of the present invention is more excellent and the compatibility is excellent.
- the content is preferably 0.01 to 0.0001 parts by mass, more preferably 0.01 to 0.001 parts by mass.
- composition of the present invention contains 0.01 to 5 parts by mass of the zinc compound (D) with respect to 100 parts by mass in total of the organopolysiloxane (A) and the silane compound (B).
- the composition of the present invention contains the lanthanoid compound (C) and the zinc compound (D) in combination, whereby the zinc compound (D) improves the catalytic activity of the lanthanoid compound (C). Excellent thermosetting.
- the composition of this invention is excellent also in sulfidation resistance by containing a zinc compound (D).
- the zinc compound (D) is a corrosive gas in the air (for example, a gas having an unshared electron pair such as hydrogen sulfide and amines).
- a corrosive gas in the air for example, a gas having an unshared electron pair such as hydrogen sulfide and amines.
- corrosion for example, discoloration
- such a mechanism is speculation, and even another mechanism is within the scope of the present invention.
- the zinc compound (D) contained in the composition of the present invention is not particularly limited as long as it is a compound containing zinc.
- zinc salt such as zinc phosphate; zinc complex; zinc alcoholate; zinc white, zinc stannate Zinc oxides; and the like.
- a zinc salt and / or a zinc complex is preferable from the viewpoint of superior sulfidation resistance and transparency.
- the zinc salt is not particularly limited as long as it is a salt formed from zinc and an acid (including an inorganic acid and an organic acid).
- the zinc complex is not particularly limited as long as it is a chelate compound formed from zinc and a ligand.
- the zinc compound (D) include a zinc compound represented by the following formula (d1) or (d2); a zinc complex of a salicylic acid compound; a zinc complex of a diamine compound;
- the formula (d1) is as follows. Zn (O—CO—R 1 ) 2 (d1)
- R 1 represents an alkyl group having 1 to 18 carbon atoms or an aryl group, and a plurality of R 1 may be the same or different.
- CO is a carbonyl group (C ⁇ O).
- Examples of the alkyl group having 1 to 18 carbon atoms represented by R 1 include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, a 1-ethylpentyl group, and a neononyl group.
- Examples of the aryl group having 1 to 18 carbon atoms represented by R 1 include a phenyl group and a naphthyl group.
- examples of the zinc salt include those represented by the following formula (d1 ′).
- R 1 has the same meaning as R 1 in the formula (d1).
- Examples of the zinc compound (D) represented by the formula (d1) include zinc acetate, zinc 2-ethylhexanoate, zinc octoate, zinc neodecanate, zinc acetyl acetate, zinc (meth) acrylate, and zinc salicylate. It is done.
- Formula (d2) is as follows.
- Zn (R 2 COCHCOR 3 ) 2 (d2) R 2 and R 3 represent a monovalent hydrocarbon group or alkoxy group having 1 to 18 carbon atoms, and a plurality of R 2 and R 3 may be the same or different.
- (R 2 COCHCOR 3 ) is any one of the following formulas, and is bonded to zinc by “C—O—”.
- examples of the zinc complex include those represented by the following formula (d2 ′).
- R 2, R 3 has the same meaning as R 2, R 3 in the formula (d2), R 2, R 3, which are in the same (R 2 COCHCOR 3) is interchanged May be.
- Examples of the monovalent hydrocarbon group having 1 to 18 carbon atoms represented by R 2 and R 3 in formula (d2) include, for example, an alkyl group or aryl group having 1 to 18 carbon atoms (R 1 in formula (d1) And the same meaning as an alkyl group or aryl group having 1 to 18 carbon atoms.
- Examples of the alkoxy group represented by R 2 and R 3 in the formula (d2) include a methoxy group, an ethoxy group, and a propoxy group.
- Examples of the zinc compound (D) represented by the formula (d2) include bis (acetylacetonato) zinc complex, 2,2,6,6,6 tetramethyl-3,5-heptanedionate zinc complex, and the like. Can be mentioned.
- the zinc compound (D) is preferably a compound represented by the formula (d1) or the formula (d2), or a combination thereof, because it is more excellent in thermosetting and more resistant to sulfide.
- a zinc compound (D) may be used individually by 1 type, and may use 2 or more types together.
- Such a zinc compound (D) is a compound obtained by reacting an inorganic acid and / or an organic acid with 1.5 mol or more and less than 3 mol with respect to 1 mol of zinc oxide and / or zinc carbonate. It is more preferable that it is a compound obtained by making it react 1.5 mol or more and 2 mol or less.
- examples of the inorganic acid include phosphoric acid
- examples of the organic acid include stearic acid, palmitic acid, lauric acid, 2-ethylhexanoic acid, (meth) acrylic acid, and neodecanoic acid. .
- the content of the zinc compound (D) is 0 with respect to the total of 100 parts by mass of the organopolysiloxane (A) and the silane compound (B).
- the amount is preferably 1 to 10 parts by mass, more preferably 0.1 to 1 part by mass.
- the content of the zinc compound (D) is such that the mass ratio (C / D) of the lanthanoid compound (C) to the zinc compound (D) is higher because the thermosetting property of the composition of the present invention is more excellent.
- the amount is preferably less than 1, more preferably 0.001 to 0.1.
- the composition of the present invention may further contain a zirconium compound (E) and / or a hafnium compound (F). These are not only silanol condensation catalysts, but also improve the long-term reliability of the composition of the present invention at high temperatures. Moreover, the thermosetting property of the composition of this invention is more excellent by containing a zirconium compound (E) and / or a hafnium compound (F).
- the zirconium compound (E) and / or the hafnium compound (F) acts as a Lewis acid during the initial curing or after the initial curing of the composition of the present invention, and the organopolysiloxane (A) and the silane compound (B). It is thought that the crosslinking reaction with is promoted. More specifically, the zirconium compound (E) and / or the hafnium compound (F) is activated by heating, and a silanol group (for example, a reaction between silanol groups or a reaction between a silanol group and an alkoxysilyl group) Can be condensed. Thus, the composition of the present invention is cured uniformly uniformly by heating. Below, a zirconium compound (E) and a hafnium compound (F) are demonstrated separately.
- the zirconium compound (E) is not particularly limited as long as it is a compound having a zirconium atom and an organic group.
- examples of the organic group possessed by the zirconium compound (E) include organic carboxylates (—O—CO—R); those in which a hydrocarbon group such as an alkoxy group or a phenoxy group is bonded to an oxy group (— O—R); ligands; combinations thereof; and the like.
- examples of the zirconium compound (E) include a compound represented by the following formula (e1) (compound E1) and / or a compound represented by the following formula (e2) (compound E2). .
- R 12 represents a hydrocarbon group having 1 to 18 carbon atoms, and the plurality of R 12 may be the same or different.
- R 13 represents a hydrocarbon group having 1 to 16 carbon atoms
- R 14 represents a hydrocarbon group having 1 to 18 carbon atoms
- m represents an integer of 1 to 3
- Compound E1 is a zirconium metal salt containing zirconyl [(Zr ⁇ O) 2+ ] as a constituent element.
- the composition of this invention is more excellent in thermosetting by containing the compound E1.
- the acid used for producing the zirconium metal salt of compound E1 is not particularly limited, and examples thereof include carboxylic acid. Specific examples of carboxylic acid include acetic acid, propionic acid, octylic acid (2-ethyl ester).
- Hexanoic acid nonanoic acid, stearic acid, lauric acid and the like; alicyclic carboxylic acids such as naphthenic acid and cyclohexanecarboxylic acid; aromatic carboxylic acids such as benzoic acid; and the like.
- aliphatic carboxylate include zirconyl dioctylate and zirconyl dineodecanoate.
- alicyclic carboxylate include zirconyl naphthenate and zirconyl cyclohexane.
- the aromatic carboxylate include zirconyl benzoate. Among these, it is preferable that it is either one or both of zirconyl dioctylate and zirconyl naphthenate because it is more excellent in thermosetting.
- the compound E2 has 1 to 3 acyl groups (R 13 —CO—) as represented by the above formula (e2).
- the acyl group is included in the formula (e2) as a carboxylic acid ester.
- the plurality of R 13 may be the same or different from each other.
- the plurality of R 13 may be the same or different.
- the hydrocarbon group represented by R 13 in the formula (e2) preferably has 3 to 16 carbon atoms, and more preferably 4 to 16 carbon atoms.
- the hydrocarbon group represented by R 13 may be linear or branched, may have an unsaturated bond, and may have a hetero atom (for example, an oxygen atom, a nitrogen atom, a sulfur atom, etc.).
- Examples of the hydrocarbon group represented by R 13 include an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, and combinations thereof.
- Examples of the alicyclic hydrocarbon group include cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group; naphthene ring (cycloparaffin ring derived from naphthenic acid); adamantyl A condensed ring hydrocarbon group such as a group or a norbornyl group;
- Examples of the aromatic hydrocarbon group include a phenyl group, a naphthyl group, and azulene.
- Examples of the aliphatic hydrocarbon group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a pentyl group, a hexyl group, an octyl group, a 2-ethylhexyl group, a nonyl group, a decyl group, and an undecyl group.
- an alicyclic hydrocarbon group and an aromatic hydrocarbon group are preferable, and a cyclopropyl group, a cyclopentyl group, a cyclohexyl group, an adamantyl group, a naphthene ring (naphthate group as R 13 COO—), a phenyl group are more preferable, and a cyclopropyl group, a cyclopentyl group, a cyclohexyl group, an adamantyl group, and a naphthene ring are more preferable.
- R 13 COO— having an alicyclic hydrocarbon group examples include a cyclopropylcarbonyloxy group, a cyclobutylcarbonyloxy group, a cyclopentylcarbonyloxy group, a cyclohexylcarbonyloxy group (cyclohexyl carbonate group), and a cycloheptylcarbonyloxy group.
- R 13 COO— having an aromatic hydrocarbon group include a phenylcarbonyloxy group, a naphthylcarbonyloxy group, an azulylcarboxy group, and the like.
- R 13 COO— having an aliphatic hydrocarbon group examples include acetate, propionate, butyrate, isobutyrate, octylate, 2-ethylhexanoate, nonanoate and laurate.
- R 13 COO- having an alicyclic hydrocarbon group R 13 COO- having an aromatic hydrocarbon group, 2-ethyl hexanoate are preferred, cyclopropylcarbonyl group, cyclopentylcarbonyl group, cyclohexylcarbonyl
- An oxy group, an adamantylcarbonyloxy group, a naphthate group, and a phenylcarbonyloxy group are more preferable, and a cyclopropylcarbonyloxy group, a cyclopentylcarbonyloxy group, a cyclohexylcarbonyloxy group, an adamantylcarbonyloxy group, and a naphthate group are more preferable.
- the number of carbon atoms of the hydrocarbon group represented by R 14 in formula (e2) is preferably 3 to 8.
- the hydrocarbon group represented by R 14 may be linear or branched, may have an unsaturated bond, and may have a hetero atom (for example, an oxygen atom, a nitrogen atom, a sulfur atom, etc.).
- Examples of the hydrocarbon group represented by R 14 include an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, and combinations thereof.
- R 14 O— (alkoxy group) having an aliphatic hydrocarbon group examples include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a pentyloxy group, a hexyloxy group, and an octyloxy group.
- R 14 O— (alkoxy group) having an aliphatic hydrocarbon group is preferably a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, or an isopropoxy group.
- Examples of the compound E2 having an alicyclic hydrocarbon group include zirconium alkoxycyclopropanecarboxylates such as zirconium trialkoxymonocyclopropanecarboxylate, zirconium dialkoxydicyclopropanecarboxylate, and zirconium monoalkoxytricyclopropanecarboxylate; Zirconium alkoxycyclopentane carboxylates such as zirconium trialkoxy monocyclopentane carboxylate, zirconium dialkoxy dicyclopentane carboxylate, zirconium monoalkoxy tricyclopentane carboxylate; zirconium tributoxy monocyclohexane carboxylate, zirconium dibutoxy dicyclohexane carboxylate , Zirconium mono Zirconium alkoxycyclohexanecarboxylates such as toxitricyclohexanecarboxylate, zirconium triisopropoxymonocyclohe
- Examples of the compound E2 having an aromatic hydrocarbon group include zirconium tributoxy monobenzene carboxylate, zirconium dibutoxy dibenzene carboxylate, zirconium monobutoxy tribenzene carboxylate, zirconium triisopropoxy monobenzene carboxylate, zirconium diiso Zirconium alkoxybenzene carboxylates such as propoxydibenzenecarboxylate and zirconium monoisopropoxytribenzenecarboxylate are listed.
- Examples of the compound E2 having an aliphatic hydrocarbon group include zirconium tributoxy monoisobutyrate, zirconium dibutoxy diisobutyrate, zirconium monobutoxy triisobutyrate, zirconium triisopropoxy monoisobutyrate, zirconium diisopropoxy.
- Zirconium alkoxybutyrate such as diisobutyrate, zirconium monoisopropoxytriisobutyrate; zirconium tributoxy mono-2-ethylhexanoate, zirconium dibutoxydi-2-ethylhexanoate, zirconium monobutoxytri-2-ethylhexanoate, zirconium Triisopropoxymono-2-ethylhexanoate, zirconium diisopropoxydi-2-ethylhexanoate, zirconium monoisopropoxytri-2 Zirconium alkoxy 2-ethylhexanoates such as tilhexanoate; zirconium tributoxy mononeodecanate, zirconium dibutoxy dineodecanate, zirconium monobutoxy trineodecanate, zirconium triisopropoxy mononeodecanate, zirconium diiso And zirconium
- the compound E2 having an alicyclic hydrocarbon group and the compound E2 having an aromatic hydrocarbon group are preferable, and zirconium trialkoxy mononaphthate, zirconium trialkoxy monoisobutyrate, zirconium trialkoxy mono 2-ethylhexano , Zirconium trialkoxy monocyclopropane carboxylate, zirconium trialkoxy cyclobutane carboxylate, zirconium trialkoxy monocyclopentane carboxylate, zirconium trialkoxy monocyclohexane carboxylate, zirconium trialkoxy monoadamantane carboxylate, zirconium trialkoxy mononaphthate More preferably, zirconium tributoxy mononaphthate, zirconium tributoxy monoi Butyrate, zirconium tributoxy mono-2-ethylhexanoate, zirconium tributoxy monocyclopropane carboxylate, zir
- the compound E2 is preferably an alkoxy group-containing zirconium metal salt having 1 to 3 acyl groups (ester bonds).
- alkoxy group-containing zirconium metal salt having 1 to 3 acyl groups include zirconium tributoxy mononaphthate, zirconium tributoxy monoisobutyrate, zirconium tributoxy mono 2-ethylhexanoate, zirconium tributoxy mononeo.
- Decanate zirconium dibutoxy dinaphthate, zirconium dibutoxy diisobutyrate, zirconium dibutoxy di-2-ethylhexanoate, zirconium dibutoxy dineodecanate, zirconium monobutoxy trinaphthate, zirconium monobutoxy triisobutyrate, Zirconium monobutoxytri-2-ethylhexanoate, zirconium monobutoxytrineodecanate, among others, zirconium tributoxymononaphthate, zirconium Um tributoxy monoisobutyrate, and it is preferably zirconium tributoxy least one selected from the group consisting of mono-2-ethylhexanoate.
- Zr (OR 14 ) 4 examples include zirconium tetramethoxide, zirconium tetraethoxide, zirconium tetranormal propoxide, zirconium tetraisopropoxide, zirconium tetranormal butoxide and the like.
- Examples of the carboxylic acid that can be used to produce the compound E2 include aliphatic carboxylic acids such as acetic acid, propionic acid, isobutanoic acid, octylic acid, 2-ethylhexanoic acid, nonanoic acid, and lauric acid; naphthenic acid, cyclopropane And alicyclic carboxylic acids such as carboxylic acid, cyclopentanecarboxylic acid, cyclohexylcarboxylic acid (cyclohexanecarboxylic acid), adamantanecarboxylic acid and norbornanecarboxylic acid; aromatic carboxylic acids such as benzoic acid; and the like.
- aliphatic carboxylic acids such as acetic acid, propionic acid, isobutanoic acid, octylic acid, 2-ethylhexanoic acid, nonanoic acid, and lauric acid
- naphthenic acid cyclopropan
- hafnium compound (F) Next, the hafnium compound (F) will be described. Although it will not specifically limit if it is a compound which has a hafnium atom and an organic group as a hafnium compound (F), From the reason that the long-term reliability under high temperature of the composition of this invention is more excellent, following formula (f1) And / or a compound represented by the following formula (f2).
- n represents an integer of 1 to 4
- R 15 represents a hydrocarbon group
- R 16 represents an alkyl group having 1 to 18 carbon atoms.
- m represents an integer of 1 to 4
- R 16 represents an alkyl group having 1 to 18 carbon atoms
- R 17 and R 18 each independently represents a hydrocarbon group or alkoxy having 1 to 18 carbon atoms. It represents a group, when R 17 and R 18 are a plurality, a plurality of R 17 and R 18 may each be the same or different.
- the hydrocarbon group represented by R 15 in the formula (f1) may be linear or branched, may have an unsaturated bond, and has a hetero atom (for example, an oxygen atom, a nitrogen atom, a sulfur atom, etc.). be able to.
- Examples of the hydrocarbon group represented by R 15 include aliphatic hydrocarbon groups having 1 to 18 carbon atoms (including alkyl groups; unsaturated aliphatic hydrocarbon groups such as allyl groups; etc.), and alicyclic hydrocarbon groups. , Aryl groups (aromatic hydrocarbon groups), combinations thereof and the like.
- Examples of the aliphatic hydrocarbon group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a pentyl group, a hexyl group, an octyl group, a 2-ethylhexyl group, a nonyl group, a decyl group, and an undecyl group.
- Examples of the alicyclic hydrocarbon group include cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group; naphthene ring (cycloparaffin ring derived from naphthenic acid); adamantyl A condensed ring hydrocarbon group such as a group or a norbornyl group;
- Examples of the aromatic hydrocarbon group include a phenyl group, a naphthyl group, and azulene.
- an alicyclic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof is preferable, and a cyclopropyl group, a cyclobutyl group, a cyclopentyl group , A cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a naphthene ring, an adamantyl group, a norbornyl group, a phenyl group, a naphthyl group and an azulene, more preferably at least one selected from the group consisting of a cyclopropyl group and a cyclopentyl group , A cyclohexyl group, an adamantyl group, a naphthene ring (naphthate group as R 15 COO—) and a phenyl group are more preferable, and a
- the number of carbon atoms of the alkyl group represented by R 16 in the formula (f1) is 1 to 18, and it is preferably 3 to 8 for the reason that it is excellent in thermosetting and excellent in resistance to sulfidation.
- Examples of the alkyl group represented by R 16 include a methyl group, an ethyl group, a propyl group (n-propyl group, isopropyl group), a butyl group, a pentyl group, a hexyl group, an octyl group, and the like.
- An ethyl group, a propyl group (n-propyl group, isopropyl group), a butyl group, and a pentyl group are preferable.
- hafnium compound (F) represented by the formula (f1) having an alicyclic hydrocarbon group as the hydrocarbon group represented by R 15 include, for example, hafnium alkoxy (mono-tri) cyclopropanecarboxylate.
- Hafnium tetracyclopropane carboxylate hafnium alkoxy (mono-tri) cyclopentane carboxylate, hafnium tetracyclopentane carboxylate, hafnium alkoxy (mono-tri) cyclohexane carboxylate, hafnium tetracyclohexane carboxylate, hafnium alkoxy (mono-tri) )
- hafnium compound (F) represented by the formula (f1) having an aromatic hydrocarbon group as the hydrocarbon group represented by R 15 include, for example, hafnium alkoxy (mono-tri) benzene carboxylate, hafnium And tetrabenzenecarboxylate.
- hafnium compound (F) represented by the formula (f1) having an aliphatic hydrocarbon group as the hydrocarbon group represented by R 15 include, for example, hafnium alkoxy (mono-tri) butyrate, hafnium tetrabutyrate. Rate, hafnium alkoxy (mono-tri) 2-ethyl hexanoate, hafnium tetra 2-ethyl hexanoate, hafnium alkoxy (mono-tri) neodecanate, hafnium tetraneodecanate, and the like.
- (mono to tri) means any one of mono, di and tri.
- hafnium trialkoxy mononaphthate hafnium trialkoxy monoisobutyrate, hafnium trialkoxy mono-2-ethylhexanoate, hafnium trialkoxy monocyclopropane are used because they are superior in thermosetting and sulfidation resistance.
- R 16 in the formula (f2) has the same meaning as R 16 in the formula (f1).
- the hydrocarbon group having 1 to 18 carbon atoms represented by R 17 and R 18 in formula (f2) is the same as the hydrocarbon group represented by R 15 in formula (f1) having 1 to 18 carbon atoms. It is.
- Examples of the alkoxy group represented by R 17 and R 18 in the formula (f2) include an alkoxy group having 1 to 18 carbon atoms such as a methoxy group, an ethoxy group, and a propoxy group.
- R 17 and R 18 in the formula (f2) may have a halogen such as a chlorine atom, a bromine atom, or a fluorine atom. In the formula (f2), R 17 and R 18 may be interchanged.
- hafnium compound (F) represented by the formula (f2) examples include, for example, hafnium alkoxide (mono to tri) 2,4-pentadionate, hafnium-2,4-pentadionate, and hafnium alkyl pentadionate.
- hafnium di-n-butoxide (bis-2,4-pentadionate), hafnium-2,4-pentadionate, hafnium tetramethylpentadionate, hafnium tri Preferably it is a fluoropentadionate.
- the content of the zirconium compound (E) and / or the hafnium compound (F) is the above-described organopolysiloxane (A) and silane compound (for the reason that the long-term reliability at high temperatures of the composition of the present invention is more excellent).
- the total amount of B) is preferably 0.001 to 1 part by mass, more preferably 0.01 to 0.5 part by mass, and 0.001 to 0.05 part by mass. Is more preferable.
- the composition of the present invention may further contain a tin compound (G) because it is excellent in curability.
- the “tin compound” refers to a compound containing tin (Sn). Although it will not specifically limit if it is a "tin compound” as a tin compound (G), It is preferable that it is a bivalent tin compound and a tetravalent organic tin compound.
- divalent tin compound examples include divalent tin carboxylates such as bis (2-ethylhexanoic acid) tin, di (n-octylic acid) tin, tin dinaphthenate, and tin distearate.
- divalent tin carboxylates such as bis (2-ethylhexanoic acid) tin, di (n-octylic acid) tin, tin dinaphthenate, and tin distearate.
- Examples of the tetravalent organotin compound include those represented by the formula (g1); bis type and polymer type represented by the formula (g1).
- R 10 represents an alkyl group
- R 11 represents a hydrocarbon group
- a represents an integer of 1 to 3
- Examples of the alkyl group represented by R 10 include those having 1 or more carbon atoms, and specific examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and an octyl group.
- the hydrocarbon group represented by R 11 is not particularly limited, and may be linear or branched, may have an unsaturated bond, oxygen atom, nitrogen atom, sulfur atom, etc. And, for example, an aliphatic hydrocarbon group such as a methyl group or an ethyl group; an alicyclic hydrocarbon group; an aromatic hydrocarbon group; a combination thereof;
- Examples of the screw type represented by the formula (g1) include those represented by the following formula (g2).
- R 10, R 11 has the same meaning as R 10, R 11 in the formula (g1), a is 1 or 2.
- tetravalent organotin compounds include dimethyltin diacetate, dimethyltin bis (acetylacetonate), dibutyltin dilaurate, dibutyltin maleate, dibutyltin phthalate, dibutyltin dioctanoate, dibutyltin bis (2-ethylhexanoate).
- dibutyltin bis dibutyltin bis (methyl maleate), dibutyltin bis (ethyl maleate), dibutyltin bis (butyl maleate), dibutyltin bis (octyl maleate), dibutyltin bis (tridecyl maleate), dibutyltin bis (benzyl maleate) ), Dibutyltin diacetate, dioctyltin bis (ethyl maleate), dioctyltin bis (octyl maleate), dibutyltin dimethoxide, dibutyltin bis (nonylphenoxide) Dialkyltin compounds such as dibutyltin oxide, dibutyltin bis (acetylacetonate), dibutyltin bis (ethylacetoacetonate), dioctyltin dilaurate, dioctyltin diacetate, dioctyltin
- dioctyltin-based ones are preferable.
- dioctyltin bis (acetylacetonate), a reaction product of dioctyltin salt and normal ethyl silicate, etc. are industrially available. is there.
- a tin compound (G) may be used individually by 1 type, and may use 2 or more types together. It does not specifically limit about the manufacturing method of a tin compound (G), For example, it can manufacture by a conventionally well-known method.
- the content of the tin compound (G) is the above-described organopolysiloxane (A) and silane compound.
- the amount is preferably 0.001 to 5 parts by mass, more preferably 0.01 to 1 part by mass with respect to 100 parts by mass in total of (B).
- the composition of the present invention may further contain a boron compound (H) because it is excellent in long-term reliability at high temperatures.
- a boron compound (H) because it is excellent in long-term reliability at high temperatures.
- it will not specifically limit if it is a compound containing a boron as a boron compound (H),
- they are a boron complex and boric acid ester.
- the boron complex refers to a complex having a boron atom, for example, boron trifluoride complex, preferably boron trifluoride ether complex, boron trifluoride diethyl etherate, boron trifluoride. More preferred is dibutyl etherate.
- the borate ester refers to a compound obtained by a condensation reaction between a boric acid such as orthoboric acid, metaboric acid, and hypoboric acid, and a compound having a hydroxy group (—OH).
- a boric acid such as orthoboric acid, metaboric acid, and hypoboric acid
- a compound having a hydroxy group —OH
- 2-isopropoxy-4,4,5,5-tetramethyl-1,3,2-dioxaborolane tris (trimethylsilyl) borate, 2,4,6-trimethoxyboroxine, bis (pinacolato) diboron
- 2-cyclo Propyl-4,4,5,5-tetramethyl-1,3,2-dioxaborolane 2- (3,5-dimethylphenyl) -4,4,5,5-tetramethyl-1,3,2-oxaborolane
- these may be used, and these may be used alone or in combination of two or more.
- composition of the present invention may further contain a phosphite ester (I1) and / or a phosphate ester (I2) because it has excellent long-term reliability at high temperatures.
- the phosphite ester (I1) is not particularly limited as long as it is an ester of phosphorous acid and an alcohol or an aromatic compound having a hydroxy group (including monoesters, diesters, triesters).
- the phosphate ester (I2) is not particularly limited as long as it is an ester (including monoester, diester, triester) of phosphoric acid and an alcohol or an aromatic compound having a hydroxy group.
- propyl phosphate Monoesters such as esters, butyl phosphates, hexyl phosphates; diesters such as dipropyl phosphates, dibutyl phosphates, dihexyl phosphates; triethyl phosphates, tripropyl phosphates, tributyl phosphates, trihexyl phosphates , Triesters such as tris (trimethylsilyl) phosphate; polyethylene oxide alkyl ether phosphates such as polyethylene oxide dodecyl ether phosphate; and the like. It may be used in combination of two or more.
- the composition of the present invention may further contain an additive as necessary within the range not impairing the object and effects of the present invention.
- the additives include fillers such as inorganic fillers, antioxidants, lubricants, ultraviolet absorbers, thermal light stabilizers, dispersants, antistatic agents, polymerization inhibitors, antifoaming agents, curing accelerators, solvents, Fluorescent substances (inorganic substances, organic substances), anti-aging agents, radical inhibitors, adhesion improvers, flame retardants, surfactants, storage stability improvers, ozone anti-aging agents, thickeners, plasticizers, radiation blockers, Examples include nucleating agents, coupling agents, conductivity imparting agents, phosphorus peroxide decomposing agents, pigments, metal deactivators, physical property modifiers, adhesion imparting agents, and adhesion assistants.
- Examples of the fluorescent substance include a YAG phosphor, a ZnS phosphor, a Y 2 O 2 S phosphor, a red light emitting phosphor, a blue light emitting phosphor, and a green light emitting phosphor.
- adhesion-imparting agent or adhesion assistant examples include known epoxy silane coupling agents such as epoxy silane and epoxy silane oligomer; bis (alkoxy) alkanes; isocyanurate derivatives; ) Alkane and / or isocyanurate derivatives are preferred.
- Examples of the bis (alkoxy) alkane include 1,2-bis (triethoxysilyl) ethane, 1,6-bis (trimethoxysilyl) hexane, 1,7-bis (trimethoxysilyl) heptane, 1,8- It is preferably at least one selected from the group consisting of bis (trimethoxysilyl) octane, 1,9-bis (trimethoxysilyl) nonane and 1,10-bis (trimethoxysilyl) decane.
- Bis (trimethoxysilyl) hexane is more preferred. It is preferable that the isocyanurate derivative is represented by the following formula.
- each R independently represents a monovalent hydrocarbon group having an organic group or an aliphatic unsaturated bond, such as an epoxy group, a glycidoxy group, an alkoxysilyl group, a (meth) acryloyl group, etc. It may have a substituent.
- the organic group represented by R in the formula (j) is not particularly limited, and examples thereof include alkyl groups such as a methyl group, an ethyl group, a propyl group, and a butyl group; a phenyl group, a tolyl group, a xylyl group, a naphthyl group, and the like.
- Aryl groups such as benzyl group and phenethyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group; alkyl halide groups; and the like.
- the monovalent hydrocarbon group having an aliphatic unsaturated bond represented by R in the above formula is not particularly limited, and examples thereof include a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, and a heptenyl group.
- Examples of the isocyanurate derivative represented by the above formula include tris- (3-trimethoxysilylpropyl) isocyanurate.
- attachment imparting agents or adhesion assistant when using bis (alkoxy) alkane, it is 0.1 with respect to a total of 100 mass parts of organopolysiloxane (A) and silane compound (B) mentioned above.
- the amount is preferably 5 parts by mass.
- an isocyanurate derivative when used, it is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass in total of the above-described organopolysiloxane (A) and silane compound (B), and preferably 0.1 to 5 parts by mass. More preferred is part by mass.
- the composition of the present invention preferably contains substantially no water for the reason of excellent storage stability.
- substantially free of water means that the amount of water in the composition of the present invention is 0.1% by mass or less.
- the composition of this invention does not contain a solvent substantially from the reason that it is excellent in working environment property.
- substantially free of solvent means that the amount of the solvent in the composition of the present invention is 1% by mass or less.
- the production method of the composition of the present invention is not particularly limited, and for example, the above-described organopolysiloxane (A), silane compound (B), lanthanoid compound (C), zinc compound (D), and, if desired, The method of manufacturing by mixing the zirconium compound (E) and / or the hafnium compound (F) and tin compound (G) which are contained, and the additive added as needed is mentioned.
- the composition of the present invention can be produced as a one-pack type or a two-pack type.
- the composition of this invention can be used as a sealing material (for example, for optical semiconductor elements), for example.
- a sealing material for example, for optical semiconductor elements
- an optical semiconductor element which can use the composition of this invention as a sealing material a light emitting diode (LED), an organic electroluminescent element (organic EL), a laser diode, an LED array etc. are mentioned, for example.
- the LED include a high power LED, a high luminance LED, and a general luminance LED.
- the composition of the present invention can be used for applications such as display materials, optical recording medium materials, optical equipment materials, optical component materials, optical fiber materials, optical / electronic functional organic materials, and semiconductor integrated circuit peripheral materials. .
- Examples of the adherend of the composition of the present invention include metals (eg, Group 11 metals), glass, rubber, semiconductors (eg, optical semiconductor elements), resins such as polyphthalamide, and the like.
- the Group 11 metal is preferably at least one selected from the group consisting of copper, silver and gold.
- the composition of the present invention is preferably used in the presence of a silver-containing member because it is more excellent in transparency and sulfidation resistance.
- the silicone resin layer obtained from the composition of the present invention can be adhered to an adherend.
- the usage method provided with the hardening process which hardens the composition of this invention in presence of the member containing silver, for example is mentioned.
- the said usage method is demonstrated as a usage method (henceforth "the usage method of this invention") of the composition of this invention.
- Examples of the member containing silver used in the method of use of the present invention include silver and silver plating, and specific examples include a reflector and the like.
- the curing step may be a step of curing the composition of the present invention by heating and / or light irradiation.
- the temperature for heating the composition of the present invention is preferably around 80 ° C. to 150 ° C., more preferably around 150 ° C.
- light used when light irradiating the composition of this invention an ultraviolet-ray, an electron beam etc. are mentioned, for example.
- the silicone resin-containing structure of the present invention includes a member containing silver and a silicone resin layer obtained by curing the composition of the present invention that covers the member.
- the said silicone resin layer may cover the said member directly, and may cover it through another layer (for example, a resin layer, a glass layer, an air layer).
- the silicone resin-containing structure of the present invention preferably has an optical semiconductor element. It does not specifically limit as an optical semiconductor element, For example, what was illustrated as an optical semiconductor element which can use the composition of this invention as a sealing material is mentioned.
- the silicone resin-containing structure of the present invention has an optical semiconductor element, for example, an aspect in which the silicone resin layer covers the member via the optical semiconductor element (that is, the optical semiconductor element is the silicone resin layer). And the above-mentioned member); an embodiment in which the above-mentioned silicone resin layer directly covers the optical semiconductor element and the above-mentioned member arranged in parallel;
- the optical semiconductor element may be arrange
- FIG. 1 is a cross-sectional view schematically showing an example of a laminate as the silicone resin-containing structure of the present invention.
- the laminated body 100 is provided with the member 120 containing silver.
- a silicone resin layer 102 is directly disposed on the member 120.
- FIG. 2 is a cross-sectional view schematically showing another example of a laminate as the silicone resin-containing structure of the present invention.
- the stacked body 200 includes a member 220 containing silver.
- the optical semiconductor element 203 is directly disposed on the member 220, and the silicone resin layer 202 is directly disposed on the optical semiconductor element 203.
- a transparent layer for example, a resin layer, a glass layer, an air layer, etc. (not shown) may be disposed between the silicone resin layer 202 and the optical semiconductor element 203.
- the sealed optical semiconductor element of the present invention includes a frame having a recess, an optical semiconductor element disposed at the bottom of the recess, a member including silver disposed on the inner surface of the recess, and filling the recess. And a sealing material obtained by curing the composition of the present invention, which seals the optical semiconductor element and the member. It does not specifically limit as a member containing silver, For example, what was illustrated as a member containing silver used for the usage method of this invention is mentioned. Moreover, it does not specifically limit as an optical semiconductor element, For example, what was illustrated as an optical semiconductor element which can use the composition of this invention as a sealing material is mentioned.
- the sealed optical semiconductor element of the present invention can have one or two or more of the above optical semiconductor elements per one.
- FIG. 3 is a cross-sectional view schematically showing an example of the sealed optical semiconductor element of the present invention.
- the optical semiconductor element sealing body 300 includes a frame 304 having a recess 302.
- the bottom surface of the recess 302 is open. Therefore, the frame body 304 is formed with end portions (end portion 312 and end portion 314) so as to surround the opening.
- a substrate 310 having an external electrode 309 is disposed below the frame body 304.
- the substrate 310 forms the bottom of the recess 302.
- An optical semiconductor element 303 is disposed at the bottom of the recess 302.
- the optical semiconductor element 303 is disposed in the concave portion 302 so that the upper surface is a light emitting layer (not shown).
- the lower surface of the optical semiconductor element 303 is fixed by the mount member 301.
- the mount member 301 is, for example, silver paste, resin, or the like.
- Each electrode (not shown) of the optical semiconductor element 303 and the external electrode 309 are wire bonded by a conductive wire 307.
- a reflector 320 is disposed as a member containing silver.
- the concave portion 302 is filled with a sealing material 308, and the sealing material 308 seals the optical semiconductor element 303 and the reflector 320.
- the sealing material 308 is obtained by curing the composition of the present invention.
- the sealing material 308 may be filled up to the hatched portion 306 in the recess 302. Further, the portion indicated by 308 in the recess 302 may be another transparent layer, and the sealing material 308 may be disposed only in the hatched portion 306.
- Such a sealing material 308 can contain a fluorescent material or the like.
- the end part (end part 312 and end part 314) of the frame body 304 may be integrally coupled to form the bottom part of the recess 302.
- the reflector 320 is disposed not only on the inner surface of the recess 302 but also on the bottom of the recess 302.
- the optical semiconductor element 303 is disposed on the reflector 320 disposed at the bottom of the recess 302.
- the encapsulating material 308 obtained by curing the composition of the present invention is used in such an optical semiconductor element encapsulant 300, corrosion (for example, discoloration) of the reflector 320, which is a member containing silver, is used. ) Can be suppressed. Further, since the sealing material 308 filled in the recess 302 has low hardness and small curing shrinkage, it can be prevented from being peeled off from the recess 302 due to the curing shrinkage or the conductive wire 307 being disconnected.
- FIG. 4 is a cross-sectional view schematically showing another example of the sealed optical semiconductor element of the present invention.
- a sealed optical semiconductor element 400 shown in FIG. 4 is obtained by arranging a lens 401 on the sealed optical semiconductor element 300 shown in FIG.
- the lens 401 a lens formed using the composition of the present invention can be used.
- FIG. 5 is a cross-sectional view schematically showing still another example of the sealed optical semiconductor element of the present invention.
- a substrate 510 and inner leads 505 are arranged inside a resin 506 having a lamp function.
- the substrate 510 has a frame having a recess, an optical semiconductor element 503 is disposed at the bottom of the recess, and a reflector 520 is disposed on the inner surface of the recess, and the composition of the present invention is cured in the recess.
- a sealing material 502 obtained in this manner is disposed.
- the reflector 520 may be disposed at the bottom of this recess.
- the optical semiconductor element 503 is fixed on the substrate 510 with a mount member 501.
- Each electrode (not shown) of the optical semiconductor element 503 is wire-bonded by a conductive wire 507.
- the resin 506 may be formed using the composition of the present invention.
- FIG. 6 is a schematic view showing an example of an LED display using the composition of the present invention and / or the sealed optical semiconductor element of the present invention.
- An LED display 600 shown in FIG. 6 includes a housing 604 in which a light shielding member 605 is disposed.
- a plurality of optical semiconductor element sealing bodies 601 are arranged in a matrix in the housing 604.
- the optical semiconductor element sealing body 601 is sealed with a sealing material 606.
- the sealing material 606 a sealing material obtained by curing the composition of the present invention can be used.
- the optical semiconductor element sealing body 601 the optical semiconductor element sealing body of this invention can be used.
- silicone resin-containing structure of the present invention and the sealed optical semiconductor element of the present invention examples include automobile lamps (for example, headlamps, tail lamps, directional lamps, etc.), household lighting equipment, and industrial use. Illuminating fixtures, stage lighting fixtures, displays, signals, projectors, and the like.
- thermosetting silicone resin composition ⁇ Manufacture of thermosetting silicone resin composition>
- the components shown in Table 1 below were used in the amounts shown in the same table (unit: parts by mass), and these were uniformly mixed with a vacuum stirrer to produce a thermosetting silicone resin composition.
- the amount of components other than components (A) and (B) is the total amount (100 mass) when the total amount of components (A) and (B) is 100 parts by mass. Part).
- thermosetting silicone resin composition Immediately after being manufactured by mixing the components shown in Table 1 below, the viscosity (initial viscosity) of the thermosetting silicone resin composition at 23 ° C. and the conditions of 55% RH and 23 ° C. and 24 hours have passed since the manufacturing.
- the viscosity of the thermosetting silicone resin composition after being measured was measured using an E-type viscometer under the conditions of 55% RH and 23 ° C., and the ratio of the viscosity after 24 hours to the initial viscosity. (Thickening) was determined.
- thermosetting silicone resin composition whose calculated viscosity increase was within 2 times was cured under the condition of 150 ° C., and the JIS-A hardness after 12 hours was measured.
- the measured JIS-A hardness is 80% or more of the specified value (hardness after curing at 150 ° C. for 168 hours)
- it is evaluated as “ ⁇ ”as being extremely excellent in thermosetting
- 70 When it was% or more, it was evaluated as “ ⁇ ” as being excellent in thermosetting.
- the measured JIS-A hardness was less than 70% of the specified value, it was evaluated as “ ⁇ ” because the deep portion was uncured and slightly inferior in thermosetting.
- the curing does not proceed and it is liquid, or if the JIS-A hardness after curing is not measured because the viscosity increase is more than twice (gel form, etc.), it becomes thermosetting. “X” was evaluated as inferior.
- ⁇ Transparency> A cured product (thickness: 2 mm) obtained by curing the obtained thermosetting silicone resin composition at 150 ° C. for 12 hours, in accordance with JIS K0115: 2004, an ultraviolet / visible absorption spectrum measuring device ( Shimadzu Corporation) was used to measure the transmittance (%) at a wavelength of 400 nm. If the transmittance (%) is 80% or more, it can be evaluated as having excellent transparency. In addition, “ ⁇ ” was described for those in which the cured product was insufficiently cured and the transparency could not be evaluated.
- thermosetting silicone resin composition was applied on silver plating so as to have a thickness of about 1 mm and cured under conditions of 150 ° C. and 12 hours to obtain a cured sample for evaluation of sulfidation resistance.
- Organopolysiloxane 1 Polydimethylsiloxane- ⁇ , ⁇ -diol represented by the following formula (ss10, Shin-Etsu Chemical Co., Ltd., weight average molecular weight: 49000, reactive functional group: silanol group, average number of functional groups: 2)
- Organopolysiloxane 2 Silanol dimethyl silicone oil at both ends (PRX-413, manufactured by Toray Dow Corning, weight average molecular weight: 4000, reactive functional group: silanol group, average number of functional groups: 2)
- Organopolysiloxane 3 Silicone resin (SR1000, manufactured by Momentive Performance Materials Japan GK, weight average molecular weight: 4000, reactive functional group: silanol group)
- Organopolysiloxane 4 Hydrolysis condensate of methylphenyldichlorosilane having a silanol group and a phenyl group (weight average molecular weight: 870, reactive functional group: silanol group)
- Silane compound 1 Trimethoxysilylsiloxane at both ends produced as follows (weight average molecular weight: 55000, reactive functional group: methoxysilyl group, average functional group number: 6) A 500 mL three-necked flask is equipped with a stirrer and a reflux condenser, and 100 parts by mass of polysiloxane having silanol groups at both ends (ss10, manufactured by Shin-Etsu Chemical Co., Ltd.), 10 parts by mass of tetramethoxysilane, and 0 parts of acetic acid. .1 part by mass was added, and the mixture was reacted at 100 ° C. for 6 hours in a nitrogen atmosphere. The disappearance of silanol groups of ss10 was confirmed by 1 H-NMR analysis, and the resulting reaction product was designated as silane compound 1.
- the main structure of the silane compound 1 is represented by the following formula.
- Silane compound 2 terminal polymethoxysilylsiloxane produced as follows (weight average molecular weight: 60000, reactive functional group: methoxysilyl group, average number of functional groups: 14)
- a 500 mL three-necked flask is equipped with a stirrer and a reflux condenser, 100 parts by mass of a polysiloxane having silanol groups at both ends (ss10, manufactured by Shin-Etsu Chemical Co., Ltd.), a partial hydrolyzate of methyltrimethoxysilane (KC) -89, manufactured by Shin-Etsu Chemical Co., Ltd.) and 10 parts by mass of acetic acid and 0.1 part by mass of acetic acid were added and reacted at 140 ° C. for 15 hours in a nitrogen atmosphere, and disappearance of silanol groups possessed by ss10 by 1 H-NMR analysis
- the reaction product thus obtained was designated as Silane Compound 2.
- Silane compound 3 Silicone alkoxy oligomer (x-40-9246, manufactured by Shin-Etsu Chemical Co., Ltd., weight average molecular weight: 6000, reactive functional group: alkoxysilyl group, average functional group number: 0 ⁇ n ⁇ 2)
- Silane compound 4 Silane compound having an alkoxysilyl group produced as follows: In a 500 mL three-necked flask, 100 g of silicone oil having a silanol group at both ends (PRX-413, manufactured by Toray Dow Corning), alkoxy 100 g of an oligomer (XR-31-2733, manufactured by Momentive) and 0.2 g of acetic acid were added, and reacted while refluxing at 100 ° C.
- Silane compound 5 Silicone alkoxy oligomer having an alkoxysilyl group and a phenyl group and no silanol group (KR480, manufactured by Shin-Etsu Chemical Co., Ltd., reactive functional group: alkoxysilyl group)
- Lanthanoid compound 1 Tris (2-ethylhexanoic acid) cerium (manufactured by Gelest) -Lanthanoid compound 2: Lanthanoid-based 2-ethylhexanoic acid mixture containing cerium (Octop®, manufactured by Hope Pharmaceutical Co., Ltd.)
- Zinc compound 1 Compound obtained by reacting 1.6 mol of 2-ethylhexanoic acid with 1 mol of zinc oxide (manufactured by Hope Pharmaceutical Co., Ltd.)
- Zinc compound 2 Compound obtained by reacting 2.0 mol of 2-ethylhexanoic acid with 1 mol of zinc oxide (manufactured by Hope Pharmaceutical Co., Ltd.) ⁇
- Zinc compound 3 Bis (acetylacetonate) zinc complex (manufactured by Kanto Chemical Co., Inc.)
- Zirconium compound 1 zirconium tributoxy mononaphthate produced as follows: 17.5 g (0.026 mol) of zirconium tetrabutoxide (manufactured by Kanto Chemical Co., Inc.) having a concentration of 87.5% by mass, naphthenic acid (manufactured by Tokyo Chemical Industry Co., Ltd., 6.6 g (0.026 mol) of an average number of carbon atoms of the hydrocarbon group bonded to the carboxy group: 15, neutralization value: 220 mg, and the same applies to a three-necked flask, and at room temperature for 2 hours under a nitrogen atmosphere.
- the target compound was obtained by stirring to a certain degree.
- the neutralization value of naphthenic acid is the amount of KOH required to neutralize 1 g of naphthenic acid.
- the qualitative properties of the synthesized product were analyzed using FT-IR. As a result, absorption near 1700 cm ⁇ 1 attributed to COOH derived from carboxylic acid disappeared after the reaction, and a peak derived from COOZr near 1450 to 1560 cm ⁇ 1 was confirmed.
- the resulting composite (zirconium metal salt) was designated as zirconium compound 1.
- the average number of carbon atoms of R in the naphthate group (RCOO—) of the zirconium compound 2 is 15.
- Zirconium compound 2 Zirconyl naphthenate (Naphtex zirconium, manufactured by Nippon Chemical Industry Co., Ltd.)
- Hafnium compound 1 Tributoxy hafnium 2-ethylhexanoate produced as follows: 0.026 mol of hafnium tetrabutoxide (manufactured by Gelest) and 0.026 mol of 2-ethylhexanoic acid were charged into a three-necked flask and room temperature in a nitrogen atmosphere. And stirred for about 2 hours to obtain the target compound. The qualitative properties of the synthesized product were analyzed using FT-IR.
- Hafnium compound 2 hafnium 2,4 pentadionate (Gelest)
- Tin compound 1 Dibutyltin diacetate (Neostan U-200, manufactured by Nitto Kasei)
- Tin compound 2 bis (2-ethylhexanoic acid) tin (Neostan U-28, manufactured by Nitto Kasei Co., Ltd.)
- Adhesion imparting agent 1 bistrimethoxysilylhexane (Z-6830, manufactured by Toray Dow Corning)
- Adhesion imparting agent 2 Tris- (3-trimethoxysilylpropyl) isocyanurate (x-12-965, manufactured by Shin-Etsu Chemical Co., Ltd.)
- Examples 1 to 10 in which the lanthanoid compound and the zinc compound were used in combination were excellent in thermosetting, transparency and sulfidation resistance.
- Examples 4, 6, 8, and 10 that further contain a zirconium compound and / or a hafnium compound and a tin compound in combination are more excellent in thermosetting. I understood that.
- Comparative Examples 1 to 7 containing only the lanthanoid compound were found to be inferior in thermosetting.
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Abstract
Description
そこで、本発明は、熱硬化性に優れた、ランタノイド化合物を含有する熱硬化型シリコーン樹脂組成物を提供することを目的とする。
すなわち、本発明は、以下の(1)~(11)を提供する。
本発明の熱硬化型シリコーン樹脂組成物(以下、「本発明の組成物」ともいう。)は、シラノール基を有するオルガノポリシロキサン(A)と、アルコキシシリル基を有するシラン化合物(B)と、ランタノイド化合物(C)と、亜鉛化合物(D)とを含有し、上記シラン化合物(B)の含有量が、上記オルガノポリシロキサン(A)100質量部に対して0.5~2000質量部であり、上記ランタノイド化合物(C)の含有量が、上記オルガノポリシロキサン(A)および上記シラン化合物(B)の合計100質量部に対して0.0001~1質量部であり、上記亜鉛化合物(D)の含有量が、上記オルガノポリシロキサン(A)および上記シラン化合物(B)の合計100質量部に対して0.01~5質量部である、熱硬化型シリコーン樹脂組成物である。
以下、本発明の組成物が含有する各成分について詳細に説明する。
本発明の組成物に含有されるオルガノポリシロキサン(A)は、シラノール基を1分子中に1個以上、好ましくは2個以上有するオルガノポリシロキサンである。
オルガノポリシロキサン(A)が有する炭化水素基としては、特に限定されず、例えば、フェニル基などの芳香族基;アルキル基;アルケニル基;等が挙げられる。
オルガノポリシロキサン(A)の主鎖は、直鎖状、分岐状、または、網目状のいずれであってもよい。また、一部に炭素数1~6のアルコキシシリル基を有していてもよい。
このようなオルガノポリシロキサン(A)としては、2個のシラノール基が両末端に結合しているオルガノポリジメチルシロキサンであるのが好ましく、2個のシラノール基が両末端に結合している直鎖状のオルガノポリジメチルシロキサン(直鎖状オルガノポリジメチルシロキサン-α,ω-ジオール)であるのがより好ましく、具体例としては、下記式(a1)で表されるものが挙げられる。
R4が示す炭素数1~18のアルキル基としては、例えば、メチル基、エチル基、プロピル基、イソプロピル基、n-ブチル基、イソブチル基、tert-ブチル基等が挙げられ、R4が示す炭素数1~18のアリール基としては、例えば、フェニル基、ナフチル基等が挙げられ、中でも、メチル基、フェニル基であることが好ましく、メチル基であることがより好ましい。
式(a1)中、nは、オルガノポリシロキサン(A)の重量平均分子量に対応する数値とすることができ、10~15,000の整数であるのが好ましい。
また、シリコーンレジンA1は、アルコキシシリル基を有していてもよい。シラノール基およびアルコキシ基を有するレジンとしては、例えば、MKレジン(旭化成ワッカーシリコーン社製)等が挙げられる。
具体的には、例えば、R3SiOMeとSi(OMe)4とを、所望によりR2Si(OMe)2および/またはRSi(OMe)3とともに、有機溶媒中で共加水分解し縮合させればよい(各式中、Rはそれぞれ独立に非置換または置換の炭素数1~6の1価の炭化水素基を表わし、Meはメチル基を表わす)。
有機溶媒としては、共加水分解・縮合反応により生成するオルガノポリシロキサンを溶解することのできるものが好ましく、具体例としては、トルエン、キシレン、塩化メチレン、ナフサミネラルスピリット等を挙げることができる。
オルガノポリシロキサン(A)の分子量は、本発明の組成物の物性が優れるという観点から、1,000~1,000,000であるのが好ましく、1,000~100,000であるのがより好ましい。
なお、本発明において、オルガノポリシロキサン(A)の分子量は、クロロホルムを溶媒とするゲル・パーミエーション・クロマトグラフィー(GPC)によるポリスチレン換算の重量平均分子量である。
オルガノポリシロキサン(A)は、1種単独で用いてもよく2種以上を併用してもよい。
本発明の組成物は、熱硬化性の観点から、上述したオルガノポリシロキサン(A)100質量部に対して0.5~2000質量部のシラン化合物(B)を含有する。
本発明の組成物が含有するシラン化合物(B)は、1分子中に1個以上、好ましくは2個以上のアルコキシシリル基を有する。ここで、アルコキシシリル基とは、ケイ素原子にアルコキシ基が直接結合したものをいう。
シラン化合物(B)としては、例えば、1分子中1個のケイ素原子を有し、ケイ素原子にアルコキシ基が2個以上結合している化合物(以下、「シラン化合物B1」ともいういう);1分子中2個以上のケイ素原子を有し、骨格がポリシロキサン骨格であり、ケイ素原子に結合しているアルコキシ基を2個以上有するオルガノポリシロキサン(以下、「シラン化合物B2」ともいう);等が挙げられる。
シラン化合物B1としては、例えば、下記式(b1)で表されるものが挙げられる。
Si(OR5)nR6 4-n (b1)
式(b1)中、nは2,3または4を示し、R5はアルキル基を示し、R6は有機基を示す。R6が示す有機基は、シラン化合物(B)が有することができる有機基として記載したものと同義である。
なお、(メタ)アクリロキシトリアルコキシシランは、アクリロキシトリアルコキシシランまたはメタクリロキシトリアルコキシシランであることを意味する。(メタ)アクリレート基、(メタ)アクリロキシアルキル基についても同様である。
シラン化合物B2としては、例えば、下記式(b2-1)で表される化合物が挙げられる。
R7 mSi(OR8)nO(4-m-n)/2 (b2-1)
式(b2-1)中、R7は有機基であり、R8は水素および/またはアルキル基であり、mは0<m<2、nは0<n<2、m+nは0<m+n≦3である。ここで、R7が示す有機基は、シラン化合物(B)が有することができる有機基として記載したものと同義であり、R8が示すアルキル基は、シラン化合物(B)が有することができる有機基としてのアルキル基として記載したものと同義である。
メチルメトキシオリゴマーは、市販品を使用することができ、例えば、x-40-9246(重量平均分子量:6000、信越化学工業社製)が挙げられる。
シラン化合物B3は、例えば、両末端シラノール基を有するポリシロキサン1モルに対してアルコキシリル基を有するシラン化合物1モル以上を脱アルコール縮合した反応物として得ることができる。
シラン化合物B3を製造するために使用される、アルコキシ基を有するシラン化合物としては、例えば、上述した、式(b1)で表される化合物、式(b2-1)で表される化合物等が挙げられる。
シラン化合物B3としては、例えば、下記式(b3)で表されるものが挙げられる。
式(b3)で表される化合物は、例えば、両末端にシラノール基を有するポリシロキサンを、テトラメトキシシラン(式(b1)で表される化合物に相当する)で変性することによって製造することができる。
また、上述したオルガノポリシロキサン(A)がシリコーンレジンA1を用いる場合には、シラン化合物(B)としては、(メタ)アクリル官能性の(メタ)アクリロキシアルキルトリアルコキシシランであるのが好ましい。
なお、シラン化合物(B)がシラン化合物B2である場合、その分子量は、クロロホルムを溶媒とするゲル・パーミエーション・クロマトグラフィー(GPC)によるポリスチレン換算の重量平均分子量であるものとする。
シラン化合物(B)は、1種単独で用いてもよく2種以上を併用してもよい。
シラン化合物(B)の含有量は、オルガノポリシロキサン(A)100質量部に対して、0.5~2000質量部であり、熱硬化性の観点から、0.5~1000質量部であるのが好ましく、0.5~500質量部であるのがより好ましい。
なお、本発明の組成物に含有されるシラノール縮合触媒は、少なくとも、以下に説明するランタノイド化合物(C)と亜鉛化合物(D)とを含むものであり、後述する、ジルコニウム化合物(E)および/またはハフニウム化合物(F)、ならびに、スズ化合物(G)を任意で含んでいてもよい。
本明細書においては、本発明の組成物にシラノール縮合触媒として含有される各成分、すなわち、ランタノイド化合物(C)、亜鉛化合物(D)、ジルコニウム化合物(E)および/またはハフニウム化合物(F)、ならびに、スズ化合物(G)の説明をもって、本発明のシラノール縮合触媒の説明とする。
本発明の組成物は、ランタノイド化合物(C)を、上述したオルガノポリシロキサン(A)およびシラン化合物(B)の合計100質量部に対して0.0001~1質量部含有する。
ここで、「ランタノイド化合物」とは、ランタン(La)、セリウム(Ce)、ジスプロシウム(Dy)、イッテルビウム(Yb)などのランタノイド原子(Ln)を有する化合物のことをいう。
本発明の組成物に含有されるランタノイド化合物(C)としては、「ランタノイド化合物」であれば特に限定されないが、本発明の組成物の熱硬化性がより優れるという理由から、下記式(c1)で表される化合物であるのが好ましい。
式(c1)中のRcが示す炭素数1~30のアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、n-ブチル基、n-ペンチル基、n-ヘキシル基、n-ヘプチル基、n-オクチル基、n-ノニル基、n-デシル基などの直鎖状アルキル基;イソプロピル基、イソブチル基、sec-ブチル基、tert-ブチル基、sec-ペンチル基、イソペンチル基、ネオペンチル基、1-メチルヘキシル基、1-エチルペンチル基、1-プロピルブチル基、2-エチル-1-メチルブチル基、1-エチル-3-メチルブチル基、1,2-ジメチルペンチル基、1-エチル-2-メチルブチル基、1-メチルヘプチル基、1-エチルヘキシル基、1-プロピルペンチル基、1-エチル-2-メチルペンチル基、3-メチル-1-プロピルブチル基、2-メチル-1-プロピルブチル基、1-メチルオクチル基、1-エチルヘプチル基、1-プロピルヘキシル基、1-ブチルペンチル基、1,3-ジエチルペンチル基、1,5-ジメチルヘプチル基、1-エチル-3-メチルヘキシル基、1-メチルノニル基、1-エチルオクチル基、1-プロピルヘプチル基、1-ブチルヘキシル基、3-エチル-1-プロピルペンチル基、1,7-ジメチルオクチル基、1-エチル-4-メチルヘプチル基、2-メチル-1-プロピルヘキシル基、ネオノニル基、ネオデシル基などの分岐状アルキル基;シクロペンチル基、シクロヘキシル基、4-メチルシクロヘキシル基、4-エチルシクロヘキシル基、4-tert-ブチルシクロヘキシル基、4-(2-エチルヘキシル)シクロヘキシル基、ボルニル基、イソボルニル基、アダマンチル基などのシクロアルキル基;ナフテン環(ナフテン酸由来のシクロパラフィン環);等が挙げられる。
式(c1)中のRcが示すアリル基は、2-プロペニル基(-CH2CH=CH2)である。
式(c1)中のRcが示すアリール基としては、炭素数6~30のアリール基であるのが好ましく、具体的には、例えば、フェニル基、ナフチル基、アントラセニル基、フェナントレニル基、ピレニル基、ペリレニル基、フルオレニル基、ビフェニル基、ターフェニル基、ルブレニル基、クリセニル基、トリフェニレニル基等が挙げられる。
ランタノイド化合物(C)は、1種単独で用いてもよく、2種以上を併用してもよい。
ランタノイド化合物(C)の含有量は、本発明の組成物の熱硬化性がより優れ、相溶性が優れるという理由から、上述したオルガノポリシロキサン(A)およびシラン化合物(B)の合計100質量部に対して、0.01~0.0001質量部であるのが好ましく、0.01~0.001質量部であるのがより好ましい。
本発明の組成物は、亜鉛化合物(D)を、上述したオルガノポリシロキサン(A)およびシラン化合物(B)の合計100質量部に対して0.01~5質量部含有する。
このように、本発明の組成物は、ランタノイド化合物(C)と亜鉛化合物(D)とを併用して含有することによって、亜鉛化合物(D)がランタノイド化合物(C)の触媒活性を向上させて、熱硬化性が優れる。
これらのうち、耐硫化性、透明性により優れるという観点から、亜鉛塩および/または亜鉛錯体であるのが好ましい。
ここで、亜鉛塩としては、亜鉛と酸(無機酸、有機酸を含む。)とから形成される塩であれば特に限定されない。また、亜鉛錯体としては、亜鉛と配位子とから形成されるキレート化合物であれば特に限定されない。
Zn(O-CO-R1)2 (d1)
式(d1)中、R1は、炭素数1~18のアルキル基またはアリール基を示し、複数のR1は、それぞれ同一であっても異なっていてもよい。また、式(d1)中のCOは、カルボニル基(C=O)である。
R1が示す炭素数1~18のアルキル基としては、例えば、メチル基、エチル基、プロピル基、イソプロピル基、n-ブチル基、イソブチル基、tert-ブチル基、1-エチルペンチル基、ネオノニル基、ネオデシル基等が挙げられる。
R1が示す炭素数1~18のアリール基としては、例えば、フェニル基、ナフチル基等が挙げられる。
式(d1)で表される亜鉛化合物(D)が塩である場合、亜鉛塩としては、例えば、下記式(d1′)で表されるものが挙げられる。
式(d1)で表される亜鉛化合物(D)としては、例えば、亜鉛アセテート、亜鉛2-エチルヘキサノエート、亜鉛オクトエート、亜鉛ネオデカネート、亜鉛アセチルアセテート、亜鉛(メタ)アクリレート、亜鉛サリチレート等が挙げられる。
Zn(R2COCHCOR3)2 (d2)
式(d2)中、R2、R3は、炭素数1~18の1価の炭化水素基またはアルコキシ基を示し、複数のR2およびR3は、それぞれ同一であっても異なっていてもよい。式(d2)中の(R2COCHCOR3)は、それぞれ、下記式のいずれかであり、「C-O-」で亜鉛と結合する。
式(d2)中のR2、R3が示すアルコキシ基としては、例えば、メトキシ基、エトキシ基、プロポキシ基等が挙げられる。
式(d2)で表される亜鉛化合物(D)としては、例えば、ビス(アセチルアセトナート)亜鉛錯体、2,2,6,6,6テトラメチル-3,5-ヘプタンジオネート亜鉛錯体等が挙げられる。
亜鉛化合物(D)は、1種単独で用いてもよく、2種以上を併用してもよい。
このとき、無機酸としては、例えば、リン酸が挙げられ、有機酸としては、例えば、ステアリン酸、パルミチン酸、ラウリル酸、2-エチルヘキサン酸、(メタ)アクリル酸、ネオデカン酸等が挙げられる。
本発明の組成物は、さらに、ジルコニウム化合物(E)および/またはハフニウム化合物(F)を含有してもよい。これらは、シラノール縮合触媒であると同時に、本発明の組成物の高温下での長期信頼性を良好にするものである。また、ジルコニウム化合物(E)および/またはハフニウム化合物(F)を含有することにより、本発明の組成物の熱硬化性はより優れる。
より詳細には、ジルコニウム化合物(E)および/またはハフニウム化合物(F)は、加熱によって活性化され、シラノール基を(例えば、シラノール基どうしの反応やシラノール基とアルコキシシリル基との反応によって)、縮合させることができる。こうして、本発明の組成物は、加熱によって全体的に均一に硬化される。
以下では、ジルコニウム化合物(E)とハフニウム化合物(F)とについて個別に説明する。
まず、ジルコニウム化合物(E)について説明する。ジルコニウム化合物(E)は、ジルコニウム原子と有機基とを有する化合物であれば、特に限定されない。
ここで、ジルコニウム化合物(E)が有する有機基としては、例えば、有機カルボキシレート(-O-CO-R);アルコキシ基、フェノキシ基などの、炭化水素基がオキシ基と結合したのもの(-O-R);配位子;これらの組み合わせ;等が挙げられる。
化合物E1は、ジルコニル[(Zr=O)2+]を構成要素として含むジルコニウム金属塩である。本発明の組成物は、化合物E1を含むことにより、熱硬化性により優れる。
化合物E1のジルコニウム金属塩を製造するために使用される酸としては、特に限定されず、例えば、カルボン酸が挙げられ、カルボン酸の具体例としては、酢酸、プロピオン酸、オクチル酸(2-エチルヘキサン酸)、ノナン酸、ステアリン酸、ラウリン酸などの脂肪族カルボン酸;ナフテン酸、シクロヘキサンカルボン酸などの脂環式カルボン酸;安息香酸などの芳香族カルボン酸;等が挙げられる。
脂肪族カルボン酸塩としては、例えば、ジオクチル酸ジルコニル、ジネオデカン酸ジルコニル等が挙げられる。脂環式カルボン酸塩としては、例えば、ナフテン酸ジルコニル、シクロヘキサン酸ジルコニル等が挙げられる。芳香族カルボン酸塩としては、例えば、安息香酸ジルコニルが挙げられる。
これらのうち、熱硬化性により優れるという理由から、ジオクチル酸ジルコニルおよびナフテン酸ジルコニルのいずれか一方または両方であるのが好ましい。
化合物E2は、上述した式(e2)で表されるように、1~3個のアシル基(R13-CO-)を有する。式(e2)で表される化合物E2において、アシル基はカルボン酸エステルとして式(e2)に含まれる。式(e2)においてmが2以上である場合、複数のR13は、それぞれ同一であっても異なっていてもよい。また、mが1~2である場合、複数のR13は、それぞれ同一であっても異なっていてもよい。
R13が示す炭化水素基は、直鎖状でも分岐状でもよく、不飽和結合を有することができ、ヘテロ原子(例えば、酸素原子、窒素原子、硫黄原子など)を有することができる。
R13が示す炭化水素基としては、例えば、脂肪族炭化水素基、脂環式炭化水素基、芳香族炭化水素基、これらの組み合わせ等が挙げられる。
脂環式炭化水素基としては、例えば、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基などのシクロアルキル基;ナフテン環(ナフテン酸由来のシクロパラフィン環);アダマンチル基、ノルボルニル基などの縮合環系炭化水素基;等が挙げられる。
芳香族炭化水素基としては、例えば、フェニル基、ナフチル基、アズレン等が挙げられる。
脂肪族炭化水素基としては、例えば、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ペンチル基、ヘキシル基、オクチル基、2-エチルヘキシル基、ノニル基、デシル基、ウンデシル基等が挙げられる。
これらのうち、脂環式炭化水素基、芳香族炭化水素基であることが好ましく、シクロプロピル基、シクロペンチル基、シクロヘキシル基、アダマンチル基、ナフテン環(R13COO-としてのナフテート基)、フェニル基がより好ましく、シクロプロピル基、シクロペンチル基、シクロヘキシル基、アダマンチル基、ナフテン環がさらに好ましい。
芳香族炭化水素基を有するR13COO-としては、例えば、フェニルカルボニルオキシ基、ナフチルカルボニルオキシ基、アズリルカルボキシ基等が挙げられる。
脂肪族炭化水素基を有するR13COO-としては、例えば、アセテート、プロピオネート、ブチレート、イソブチレート、オクチル酸エステル、2-エチルヘキサン酸エステル、ノナン酸エステル、ラウリン酸エステル等が挙げられる。
これらのうち、脂環式炭化水素基を有するR13COO-、芳香族炭化水素基を有するR13COO-、2エチルヘキサノエートが好ましく、シクロプロピルカルボニルオキシ基、シクロペンチルカルボニルオキシ基、シクロヘキシルカルボニルオキシ基、アダマンチルカルボニルオキシ基、ナフテート基、フェニルカルボニルオキシ基がより好ましく、シクロプロピルカルボニルオキシ基、シクロペンチルカルボニルオキシ基、シクロヘキシルカルボニルオキシ基、アダマンチルカルボニルオキシ基、ナフテート基がさらに好ましい。
R14が示す炭化水素基としては、直鎖状でも分岐状でもよく、不飽和結合を有することができ、ヘテロ原子(例えば、酸素原子、窒素原子、硫黄原子など)を有することができる。
R14が示す炭化水素基としては、例えば、脂肪族炭化水素基、脂環式炭化水素基、芳香族炭化水素基、これらの組み合わせ等が挙げられる。
1~3個のアシル基を有するアルコシキ基含有ジルコニウム金属塩としては、例えば、ジルコニウムトリブトキシモノナフテート、ジルコニウムトリブトキシモノイソブチレート、ジルコニウムトリブトキシモノ2エチルヘキサノエート、ジルコニウムトリブトキシモノネオデカネート、ジルコニウムジブトキシジナフテート、ジルコニウムジブトキシジイソブチレート、ジルコニウムジブトキシジ2エチルヘキサノエート、ジルコニウムジブトキシジネオデカネート、ジルコニウムモノブトキシトリナフテート、ジルコニウムモノブトキシトリイソブチレート、ジルコニウムモノブトキシトリ2エチルヘキサノエート、ジルコニウムモノブトキシトリネオデカネートが挙げられ、なかでも、ジルコニウムトリブトキシモノナフテート、ジルコニウムトリブトキシモノイソブチレート、およびジルコニウムトリブトキシモノ2エチルヘキサノエートからなる群より選ばれる少なくとも1種であることが好ましい。
Zrアルコラートとカルボン酸との反応については、D.C.Bradley著「Metal alkoxide」Academic Press(1978)を参考することができる。
次に、ハフニウム化合物(F)について説明する。ハフニウム化合物(F)としては、ハフニウム原子と有機基とを有する化合物であれば特に限定されないが、本発明の組成物の高温下での長期信頼性がより優れるという理由から、下記式(f1)で表される化合物および/または下記式(f2)で表される化合物であるのが好ましい。
式(f1)中のR15が示す炭化水素基は、直鎖状でも分岐状でもよく、不飽和結合を有することができ、ヘテロ原子(例えば、酸素原子、窒素原子、硫黄原子など)を有することができる。
R15が示す炭化水素基としては、例えば、炭素数1~18の脂肪族炭化水素基(アルキル基;アリル基などの不飽和脂肪族炭化水素基;等を含む)、脂環式炭化水素基、アリール基(芳香族炭化水素基)、これらの組み合わせ等が挙げられる。
脂肪族炭化水素基としては、例えば、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ペンチル基、ヘキシル基、オクチル基、2-エチルヘキシル基、ノニル基、デシル基、ウンデシル基等が挙げられる。
脂環式炭化水素基としては、例えば、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基などのシクロアルキル基;ナフテン環(ナフテン酸由来のシクロパラフィン環);アダマンチル基、ノルボルニル基などの縮合環系炭化水素基;等が挙げられる。
芳香族炭化水素基としては、例えば、フェニル基、ナフチル基、アズレン等が挙げられる。
これらのうち、熱硬化性により優れ、耐硫化性に優れるという観点から、脂環式炭化水素基、芳香族炭化水素基、これらの組み合わせであるのが好ましく、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基、ナフテン環、アダマンチル基、ノルボルニル基、フェニル基、ナフチル基およびアズレンからなる群から選ばれる少なくとも1種であるのがより好ましく、シクロプロピル基、シクロペンチル基、シクロヘキシル基、アダマンチル基、ナフテン環(R15COO-としてのナフテート基)、フェニル基であるのがさらに好ましく、シクロプロピル基、シクロペンチル基、シクロヘキシル基、アダマンチル基、ナフテン環であるのが特に好ましい。
式(f2)中のR16は、式(f1)中のR16と同義である。
式(f2)中のR17,R18が示す炭素数1~18の炭化水素基は、式(f1)中のR15が示す炭化水素基のうち炭素数が1~18であるものと同様である。
式(f2)中のR17,R18が示すアルコキシ基としては、例えば、メトキシ基、エトキシ基、プロポキシ基などの炭素数1~18のアルコキシ基が挙げられる。
式(f2)中のR17,R18は、塩素原子、臭素原子、フッ素原子などのハロゲンを有していてもよい。
なお、式(f2)において、R17とR18とは、入れ替わってもよい。
本発明の組成物は、さらに、硬化性に優れるという理由から、スズ化合物(G)を含有してもよい。なお、「スズ化合物」とは、スズ(Sn)を含有する化合物のことをいう。
スズ化合物(G)としては、「スズ化合物」であれば特に限定されないが、2価のスズ化合物、4価の有機スズ化合物であるのが好ましい。
R10 a-Sn-[O-CO-R11]4-a (g1)
式(g1)中、R10はアルキル基を示し、R11は炭化水素基を示し、aは1~3の整数を示し、R10および/またはR11が複数ある場合には、複数のR10および/またはR11は、それぞれ同一であっても異なっていてもよい。
R10が示すアルキル基としては、例えば、炭素数1以上のものが挙げられ、具体例としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、オクチル基等が挙げられる。
R11が示す炭化水素基としては、特に限定されず、直鎖状であっても分岐状であってもよく、不飽和結合を有していてもよく、酸素原子、窒素原子、硫黄原子などのヘテロ原子を有していてもよく、例えば、メチル基、エチル基などの脂肪族炭化水素基;脂環式炭化水素基;芳香族炭化水素基;これらの組み合わせ;等が挙げられる。
なお、人体への影響の観点からは、ジオクチルスズ系のものが好ましく、例えば、ジオクチルスズビス(アセチルアセトナート)、ジオクチルスズ塩と正ケイ酸エチルとの反応物等が工業的に入手可能である。
スズ化合物(G)の製造方法については、特に限定されず、例えば、従来公知の方法によって製造することができる。
本発明の組成物は、高温下での長期信頼性に優れるという理由から、さらに、ホウ素化合物(H)を含有していてもよい。
ホウ素化合物(H)としては、ホウ素を含有する化合物であれば特に限定されないが、例えば、ホウ素錯体、ホウ酸エステルであるのが好ましい。
本発明の組成物は、高温下での長期信頼性に優れるという理由から、さらに、亜リン酸エステル(I1)および/またはリン酸エステル(I2)を含有していてもよい。
本発明の組成物は、本発明の目的や効果を損なわない範囲で、必要に応じてさらに添加剤を含有することができる。
添加剤としては、例えば、無機フィラーなどの充填剤、酸化防止剤、滑剤、紫外線吸収剤、熱光安定剤、分散剤、帯電防止剤、重合禁止剤、消泡剤、硬化促進剤、溶剤、蛍光物質(無機物、有機物)、老化防止剤、ラジカル禁止剤、接着性改良剤、難燃剤、界面活性剤、保存安定性改良剤、オゾン老化防止剤、増粘剤、可塑剤、放射線遮断剤、核剤、カップリング剤、導電性付与剤、リン系過酸化物分解剤、顔料、金属不活性化剤、物性調整剤、接着付与剤、接着助剤等が挙げられる。
ビス(アルコキシ)アルカンとしては、例えば、1,2-ビス(トリエトキシシリル)エタン、1,6-ビス(トリメトキシシリル)ヘキサン、1,7-ビス(トリメトキシシリル)ヘプタン、1,8-ビス(トリメトキシシリル)オクタン、1,9-ビス(トリメトキシシリル)ノナンおよび1,10-ビス(トリメトキシシリル)デカンからなる群から選ばれる少なくとも1種であるのが好ましく、1,6-ビス(トリメトキシシリル)へキサンがより好ましい。
イソシアヌレート誘導体としては、下記式で表されるものであるのが好ましい。
上記式(j)中のRが示す有機基としては、特に制限されず、例えば、メチル基、エチル基、プロピル基、ブチル基などのアルキル基;フェニル基、トリル基、キシリル基、ナフチル基などのアリール基;ベンジル基、フェネチル基などのアラルキル基;シクロペンチル基、シクロヘキシル基などのシクロアルキル基;ハロゲン化アルキル基;等が挙げられる。
また、上記式中のRが示す脂肪族不飽和結合を有する一価の炭化水素基としては、特に制限されず、例えば、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基などの炭素数2~8の不飽和炭化水素基が挙げられる。
上記式で表されるイソシアヌレート誘導体としては、例えば、トリス-(3-トリメトキシシリルプロピル)イソシアヌレートが挙げられる。
これらの接着付与剤または接着助剤は、単独でまたは2種以上を組み合わせて使用することができる。
また、本発明の組成物は、作業環境性に優れるという理由から、実質的に溶媒を含まないのが好ましい。本発明において「実質的に溶媒を含まない」とは、本発明の組成物中における溶媒の量が1質量%以下であることをいう。
また、本発明の組成物は、例えば、ディスプレイ材料、光記録媒体材料、光学機器材料、光部品材料、光ファイバー材料、光・電子機能有機材料、半導体集積回路周辺材料等の用途に用いることができる。
本発明の組成物は、透明性、耐硫化性により優れるという理由から、銀を含む部材の存在下で使用されるのが好ましい。本発明の組成物から得られるシリコーン樹脂層は、被着体と接着することができる。
本発明の組成物の使用方法としては、例えば、銀を含む部材の存在下で本発明の組成物を硬化させる硬化工程を備える使用方法が挙げられる。以下、当該使用方法を、本発明の組成物の使用方法(以下、「本発明の使用方法」ともいう。)として説明する。
本発明のシリコーン樹脂含有構造体は、銀を含む部材と、上記部材を覆う、本発明の組成物を硬化させて得られるシリコーン樹脂層と、を備える。上記シリコーン樹脂層は、上記部材を、直接覆ってもよく、別の層(例えば、樹脂層、ガラス層、空気層)を介して覆ってもよい。
本発明のシリコーン樹脂含有構造体が光半導体素子を有する態様としては、例えば、上記シリコーン樹脂層が、光半導体素子を介して、上記部材を覆う態様(すなわち、光半導体素子が、上記シリコーン樹脂層と上記部材との間にある態様);上記シリコーン樹脂層が、並列に配置された光半導体素子と上記部材とを直接覆う態様;等が挙げられる。また、後者の態様においては、間隔を空けて並列に配置された2個の上記部材の間に、光半導体素子が配置されていてもよい。
図1は、本発明のシリコーン樹脂含有構造体としての積層体の一例を模式的に示す断面図である。図1に示すように、積層体100は、銀を含む部材120を備える。部材120の上には、シリコーン樹脂層102が直接的に配置されている。
図2は、本発明のシリコーン樹脂含有構造体としての積層体の別の一例を模式的に示す断面図である。図2に示すように、積層体200は、銀を含む部材220を備える。部材220の上には、光半導体素子203が直接的に配置され、光半導体素子203の上には、シリコーン樹脂層202が直接的に配置されている。なお、シリコーン樹脂層202と光半導体素子203との間に、図示しない透明な層(例えば、樹脂層、ガラス層、空気層等)が配置されていてもよい。
本発明の光半導体素子封止体は、凹部を有する枠体と、上記凹部の底部に配置された光半導体素子と、上記凹部の内側面に配置された銀を含む部材と、上記凹部に充填されて上記光半導体素子と上記部材とを封止する、本発明の組成物を硬化させて得られる封止材と、を備える。
銀を含む部材としては、特に限定されず、例えば、本発明の使用方法に用いられる銀を含む部材として例示したものが挙げられる。また、光半導体素子としては、特に限定されず、例えば、本発明の組成物を封止材として使用できる光半導体素子として例示したものが挙げられる。本発明の光半導体素子封止体は、1個当たり、1または2以上の上記光半導体素子を有することができる。
図3は、本発明の光半導体素子封止体の一例を模式的に示す断面図である。図3に示すように、光半導体素子封止体300は、凹部302を有する枠体304を備える。凹部302の底面は開口している。そのため、枠体304には、この開口を囲うようにして端部(端部312、端部314)が形成されている。枠体304の下方位置には、外部電極309を有する基板310が配置されている。基板310は、凹部302の底部を形成している。凹部302の底部には、光半導体素子303が配置されている。光半導体素子303は、上面が発光層(図示せず)となる向きで、凹部302に配置される。光半導体素子303の下面は、マウント部材301によって固定される。マウント部材301は、例えば、銀ペースト、樹脂等である。光半導体素子303の各電極(図示せず)と外部電極309とは、導電性ワイヤー307によってワイヤーボンディングされている。
封止材308は、凹部302において、斜線部306まで充填されていてもよい。また、凹部302において308で示す部分を他の透明な層とし、封止材308を斜線部306にのみ配置するようにしてもよい。このような封止材308は、蛍光物質等を含有することができる。
また、凹部302に充填された封止材308は、低硬度で硬化収縮が小さいため、硬化収縮によって凹部302から剥がれたり、導電性ワイヤー307が断線したりするのを抑制することができる。
リフレクタ520は、この凹部の底部に配置されていてもよい。光半導体素子503は、基板510上にマウント部材501で固定されている。光半導体素子503の各電極(図示せず)は、導電性ワイヤー507によってワイヤーボンディングされている。樹脂506は、本発明の組成物を用いて形成されてもよい。
図6は、本発明の組成物および/または本発明の光半導体素子封止体を用いたLED表示器の一例を示す模式図である。
図6に示すLED表示器600は、その一部に遮光部材605が配置された筐体604を有する。筐体604の内部には、複数の光半導体素子封止体601がマトリックス状に配置されている。光半導体素子封止体601は、封止材606によって封止されている。
ここで、封止材606としては、本発明の組成物を硬化させて得られる封止材を用いることができる。また、光半導体素子封止体601としては、本発明の光半導体素子封止体を用いることができる。
下記第1表に示す成分を同表に示す量(単位:質量部)で用い、これらを真空かくはん機で均一に混合して熱硬化型シリコーン樹脂組成物を製造した。
なお、下記第1表において、成分(A)および(B)以外の成分の量は、成分(A)と成分(B)との合計量を100質量部とした場合における当該合計量(100質量部)に対する量を示している。
以下に示す方法で、評価を行なった。結果を下記第1表に示す。
下記第1表に示す成分を混合して製造した直後における23℃での熱硬化型シリコーン樹脂組成物の粘度(初期粘度)と、55%RH、23℃の条件下に置き製造から24時間経過した後の熱硬化型シリコーン樹脂組成物の粘度(24時間後粘度)とを、E型粘度計を用いて55%RH、23℃の条件下で測定し、初期粘度に対する24時間後粘度の倍率(増粘度)を求めた。
次に、求めた増粘度が2倍以内であった熱硬化型シリコーン樹脂組成物を、150℃の条件下で硬化させ、12時間経過後のJIS-A硬さを測定した。
測定したJIS-A硬さが規定値(150℃、168時間硬化させた後の硬度)の80%以上であった場合には熱硬化性に非常に優れるものとして「◎」と評価し、70%以上であった場合には熱硬化性に優れるものとして「○」と評価した。また、測定したJIS-A硬さが規定値の70%未満であった場合には深部が未硬化で熱硬化性にやや劣るものとして「△」と評価した。さらに、硬化が進行せずに液状であった場合、または、増粘度が2倍超(ゲル状等)であったため硬化後のJIS-A硬さを測定しなかった場合には熱硬化性に劣るものとして「×」と評価した。
得られた熱硬化型シリコーン樹脂組成物を、150℃で12時間硬化させて得られた硬化物(厚さ:2mm)について、JIS K0115:2004に準拠して、紫外・可視吸収スペクトル測定装置(島津製作所社製)を用いて、波長400nmにおける透過率(%)を測定した。
透過率(%)が80%以上であれば、透明性に優れるものとして評価できる。なお、硬化物の硬化が不十分で透明性を評価し得なかったものについては「-」と記載した。
[硬化サンプル作成]
製造された熱硬化型シリコーン樹脂組成物を、銀メッキ上に厚さ1mm程度になるよう塗布し、150℃、12時間の条件で硬化させて、耐硫化性評価用の硬化サンプルを得た。
10Lのデシケーターの底に、粉状に粉砕した硫化鉄10g程度(塩酸0.5mmolに対して大過剰)を置いた。次に、デシケーター内における硫化鉄の上方位置に、硫化鉄に接触しないように目皿(貫通孔を有する)を取り付け、この目皿上に硬化サンプルを置いた。次に、硫化鉄に塩酸0.5mmolを滴下することにより、硫化水素0.25mmol(濃度:560ppm(理論値として))を発生させた(反応式:FeS+2HCl→FeCl2+H2S)。
上述した耐硫化性試験の開始(硫化水素の発生)から24時間後に、目視により硬化サンプルにおける銀の変色を確認した。変色が確認されなかった場合には、耐硫化性に優れるものとして「○」と評価し、変色が確認された場合には、耐硫化性に劣るものとして「×」と評価した。なお、硬化サンプルの硬化が不十分で耐硫化性を評価し得なかったものについては「-」と記載した。
・オルガノポリシロキサン1:下記式で表されるポリジメチルシロキサン-α,ω-ジオール(ss10、信越化学工業、重量平均分子量:49000、反応性官能基:シラノール基、平均官能基数:2個)
・オルガノポリシロキサン3:シリコーンレジン(SR1000、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、重量平均分子量:4000、反応性官能基:シラノール基)
・オルガノポリシロキサン4:シラノール基およびフェニル基を有する、メチルフェニルジクロロシランの加水分解縮合物(重量平均分子量:870、反応性官能基:シラノール基)
500mLの3つ口フラスコに、攪拌機とリフラックスコンデンサーとを備え付け、両末端にシラノール基を有するポリシロキサン(ss10、信越化学工業社製)100質量部、テトラメトキシシラン10質量部、および、酢酸0.1質量部を添加し、窒素雰囲気下で100℃で6時間反応させ、1H-NMR分析によってss10が有するシラノール基の消失を確認し、得られた反応物をシラン化合物1とした。シラン化合物1の主たる構造は、下記式で示される。
500mLの3つ口フラスコに、攪拌機とリフラックスコンデンサーとを備え付け、両末端にシラノール基を有するポリシロキサン(ss10、信越化学工業社製)100質量部、メチルトリメトキシシランの部分加水分解物(KC-89、信越化学工業社製)10質量部、および、酢酸0.1質量部を添加し、窒素雰囲気下で140℃で15時間反応させ、1H-NMR分析によってss10が有するシラノール基の消失を確認し、得られた反応物をシラン化合物2とした。シラン化合物2の主たる構造は、下記式で示される。
・シラン化合物4:下記のとおり製造したアルコキシシリル基を有するシラン化合物
500mLの3つ口フラスコに、両末端にシラノール基を有するシリコーンオイル(PRX-413、東レ・ダウコーニング社製)100gと、アルコキシオリゴマー(XR-31-2733、モメンティブ社製)100gと、酢酸0.2gとを投入し、100℃、6時間で窒素雰囲気下で環流させながら反応させた。1H-NMR分析によってシラノール基の消失を確認した。その後120℃で減圧トラップすることによって、酢酸および副生成物であるメタノールを除去した。
・シラン化合物5:アルコキシシリル基およびフェニル基を有し、シラノール基を有さないシリコーンアルコキシオリゴマー(KR480、信越化学工業社製、反応性官能基:アルコキシシリル基)
・ランタノイド化合物2:セリウムを含むランタノイド系の2-エチルヘキサン酸混合物(オクトープR、ホープ製薬社製)
・亜鉛化合物1:酸化亜鉛1モルに対して2-エチルヘキサン酸を1.6モル反応させることによって得られる化合物(ホープ製薬社製)
・亜鉛化合物2:酸化亜鉛1モルに対して2-エチルヘキサン酸を2.0モル反応させることによって得られる化合物(ホープ製薬社製)
・亜鉛化合物3:ビス(アセチルアセトナート)亜鉛錯体(関東化学社製)
87.5質量%濃度のジルコニウムテトラブトキシド(関東化学社製)11.4g(0.026mol)と、ナフテン酸(東京化成社製、カルボキシ基に結合する炭化水素基の炭素原子数の平均:15、中和価220mg、以下同様。)6.6g(0.026mol)とを三ツ口フラスコに投入し、窒素雰囲気下、室温で2時間程度攪拌し目的合成物とした。
なお、ナフテン酸の中和価はナフテン酸1gを中和するのに必要なKOHの量である。
合成物の定性はFT-IRを用いてその分析を行った。その結果、カルボン酸由来のCOOHに帰属される1700cm-1付近の吸収が反応後は消失し、1450~1560cm-1付近のCOOZrに由来するピークを確認した。
得られた合成物(ジルコニウム金属塩)をジルコニウム化合物1とした。ジルコニウム化合物2が有するナフテート基(RCOO-)中のRの平均炭素原子数は15である。
・ハフニウム化合物1:下記のとおり製造したトリブトキシハフニウム2エチルヘキサノエート
ハフニウムテトラブトキシド(Gelest社製)0.026molと、2エチルヘキサン酸0.026molとを三ツ口フラスコに投入し窒素雰囲気下、室温で2時間程度攪拌し目的合成物とした。
合成物の定性はFT-IRを用いてその分析を行った。その結果、カルボン酸由来のCOOHに帰属される1700cm-1付近の吸収が反応後は消失し、1450~1560cm-1付近のCOOHfに由来するピークを確認した。得られた合成物をハフニウム化合物1とした。
・スズ化合物1:ジブチルスズジアセテート(ネオスタンU-200、日東化成社製)
・スズ化合物2:ビス(2-エチルヘキサン酸)スズ(ネオスタンU-28、日東化成社製)
・接着付与剤1:ビストリメトキシシリルヘキサン(Z-6830、東レ・ダウコーニング社製)
・接着付与剤2:トリス-(3-トリメトキシシリルプロピル)イソシアヌレート(x-12-965、信越化学工業社製)
また、ランタノイド化合物と亜鉛化合物とのほかに、さらに、ジルコニウム化合物および/またはハフニウム化合物とスズ化合物とを併用して含有している実施例4,6,8、10は、より熱硬化性に優れることが分かった。
これに対して、ランタノイド化合物のみを含有する比較例1~7は、熱硬化性に劣ることが分かった。
102,202 シリコーン樹脂層
120,220 部材
203,303,503 光半導体素子
300,400,500,601 光半導体素子封止体
301,501 マウント部材
302 凹部
304 枠体
306 斜線部
307,507 導電性ワイヤー
308,502,606 封止材(他の透明な層)
309 外部電極
312,314 端部
310,510 基板
320,520 リフレクタ
401 レンズ
506 樹脂
600 LED表示器
604 筐体
605 遮光部材
Claims (11)
- シラノール基を有するオルガノポリシロキサン(A)と、アルコキシシリル基を有するシラン化合物(B)と、ランタノイド化合物(C)と、亜鉛化合物(D)とを含有し、
前記シラン化合物(B)の含有量が、前記オルガノポリシロキサン(A)100質量部に対して0.5~2000質量部であり、
前記ランタノイド化合物(C)の含有量が、前記オルガノポリシロキサン(A)および前記シラン化合物(B)の合計100質量部に対して0.0001~1質量部であり、
前記亜鉛化合物(D)の含有量が、前記オルガノポリシロキサン(A)および前記シラン化合物(B)の合計100質量部に対して0.01~5質量部である、熱硬化型シリコーン樹脂組成物。 - 前記亜鉛化合物(D)が、酸化亜鉛および/または炭酸亜鉛1モルに対して無機酸および/または有機酸を1.5モル以上3モル未満反応させることによって得られる化合物である、請求項1または2に記載の熱硬化型シリコーン樹脂組成物。
- さらに、ジルコニウム化合物(E)および/またはハフニウム化合物(F)を、前記オルガノポリシロキサン(A)および前記シラン化合物(B)の合計100質量部に対して0.001~5質量部含有する、請求項1~3のいずれかに記載の熱硬化型シリコーン樹脂組成物。
- さらに、スズ化合物(G)を、前記オルガノポリシロキサン(A)および前記シラン化合物(B)の合計100質量部に対して0.001~5質量部含有する、請求項1~4のいずれかに記載の熱硬化型シリコーン樹脂組成物。
- さらに、ビス(アルコキシ)アルカンおよび/またはイソシアヌレート誘導体を含有する、請求項1~5のいずれかに記載の熱硬化型シリコーン樹脂組成物。
- 前記オルガノポリシロキサン(A)が、
R3SiO1/2単位(式中、Rはそれぞれ独立に非置換または置換の炭素数1~6の1価の炭化水素基を表わす)およびSiO4/2単位を繰り返し単位とし、SiO4/2単位1モルに対するR3SiO1/2単位の割合が0.5~1.2モルであり、さらに、SiO4/2単位1モルに対し、R2SiO2/2単位およびRSiO3/2単位(各式中、Rはそれぞれ独立に非置換または置換の炭素数1~6の1価の炭化水素基を表わす)のうち少なくとも1つを各単位がそれぞれ1.0モル以下で各単位の合計が1.0モル以下となるように有していてもよく、かつ、シラノール基を6.0質量%未満有する、シリコーンレジンを含む、請求項1~6のいずれかに記載の熱硬化型シリコーン樹脂組成物。 - 銀を含む部材と、
前記部材を覆う、請求項1~7のいずれかに記載の熱硬化型シリコーン樹脂組成物を硬化させて得られるシリコーン樹脂層と、
を備えるシリコーン樹脂含有構造体。 - 凹部を有する枠体と、
前記凹部の底部に配置された光半導体素子と、
前記凹部の内側面に配置された銀を含む部材と、
前記凹部に充填されて前記光半導体素子と前記部材とを封止する、請求項1~7のいずれかに記載の熱硬化型シリコーン樹脂組成物を硬化させて得られる封止材と、
を備える光半導体素子封止体。 - ランタノイド化合物(C)と亜鉛化合物(D)とを含むシラノール縮合触媒。
- 前記亜鉛化合物(D)に対する前記ランタノイド化合物(C)の質量比(C/D)の値が、1未満である、請求項10に記載のシラノール縮合触媒。
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WO2015016000A1 (ja) * | 2013-08-01 | 2015-02-05 | 株式会社ダイセル | 硬化性樹脂組成物及びそれを用いた半導体装置 |
WO2015019767A1 (ja) * | 2013-08-06 | 2015-02-12 | 株式会社ダイセル | 硬化性樹脂組成物及びそれを用いた半導体装置 |
WO2018034222A1 (en) * | 2016-08-19 | 2018-02-22 | Dow Corning Toray Co., Ltd. | Room temperature curable organopolysiloxane composition for protecting electric/electronic parts |
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JP2022532182A (ja) * | 2019-05-10 | 2022-07-13 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 光電素子および光電素子の製造方法 |
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