WO2012015040A1 - 電子部品収納用部品、電子モジュールおよび電子装置 - Google Patents
電子部品収納用部品、電子モジュールおよび電子装置 Download PDFInfo
- Publication number
- WO2012015040A1 WO2012015040A1 PCT/JP2011/067495 JP2011067495W WO2012015040A1 WO 2012015040 A1 WO2012015040 A1 WO 2012015040A1 JP 2011067495 W JP2011067495 W JP 2011067495W WO 2012015040 A1 WO2012015040 A1 WO 2012015040A1
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- WIPO (PCT)
- Prior art keywords
- conductor
- region
- electronic component
- electronic
- wiring conductor
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 235
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000003860 storage Methods 0.000 claims description 28
- 238000009434 installation Methods 0.000 abstract 1
- 239000013307 optical fiber Substances 0.000 description 20
- 230000003287 optical effect Effects 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000007769 metal material Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 230000004308 accommodation Effects 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6694—Optical signal interface included within high-frequency semiconductor device housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the present invention relates to an electronic component storage component, an electronic module, and an electronic device.
- Electronic parts such as semiconductor elements for optical communication are mounted on, for example, electronic part storage parts.
- the electronic component storage component is mounted by being attached to the mounting substrate.
- an electronic component storage component for example, a package described in Patent Document 1 can be cited.
- the package described in Patent Document 1 includes a package substrate (base) on which a semiconductor integrated circuit chip (electronic component) is mounted, via holes (connection conductors) provided from the upper surface to the lower surface of the package substrate, and the lower surface of the package substrate.
- the package described in Patent Document 1 can be used by being fixed to a mounting substrate.
- An electronic component housing component includes a base having a mounting region for mounting the electronic component, and a connection conductor provided from the upper surface to the lower surface of the base and electrically connected to the electronic component. And one end portion provided on the lower surface of the base body is electrically connected to the connection conductor, and the other end portion is provided on the lower surface of the base body with the wiring conductor drawn out to the side of the base body. And a ground conductor that forms a coplanar line together with the wiring conductor, and the lower surface of the wiring conductor is positioned above the lower surface of the ground conductor.
- FIG. 2 is a cross-sectional view of the electronic component storage package shown in FIG.
- FIG. 3A is a bottom view of the electronic component storage component shown in FIG. 3A.
- FIG. 3A is a bottom view which shows the 1st modification of the components for electronic component accommodation of the 1st Embodiment of this invention.
- FIG. 3A is a bottom view which shows the 2nd modification of the components for electronic component accommodation of the 1st Embodiment of this invention.
- FIG. 8B is a bottom view of the electronic component storage component shown in FIG. 8A.
- FIG. 8A is a perspective view which shows the modification of the component for electronic component accommodation of the 2nd Embodiment of this invention.
- FIG. 9A is sectional drawing of the components for electronic component accommodation shown to FIG. 9A. It is a disassembled perspective view which shows the example of the electronic module and electronic device of one Embodiment of this invention.
- FIG. 12 is a cross-sectional view in which the vicinity of the wiring conductor of the electronic device illustrated in FIGS. 10 and 11 is cut in the direction of the coplanar line. It is sectional drawing which cut
- an optical semiconductor element is used as an electronic component.
- the present invention is not limited to this, and an integrated circuit or the like may be used.
- an electronic component storage component (hereinafter also referred to as an electronic component storage package or simply a package) 1 according to a first embodiment of the present invention is an electronic component 2.
- the substrate 11 having a mounting area for mounting the substrate 11, the frame 13 provided on the upper surface of the substrate 11 so as to surround the mounting area, and the electronic component 2 provided from the upper surface to the lower surface of the substrate 11 are electrically connected.
- connection conductor 3 to be connected and the wiring conductor provided on the lower surface of the base body 11 and having one end portion electrically connected to the connection conductor 3 and the other end portion being drawn out to the side of the base body 11 4 and an inner region 92 that is provided on the lower surface of the base body 11 and overlaps with the base body 11 when viewed from the lower surface, and a hole 91 that is located outside the side surface of the base body 11 and is attached to the mounting substrate 15.
- Outer region 93 A mounting member 9 having, provided on the lower surface of the base 11, and a ground conductor 5 to form a coplanar line together with the wiring conductors 4.
- the lower surface of the wiring conductor 4 is positioned above the lower surface of the ground conductor 5. Specifically, the thickness of the ground conductor 5 in the direction perpendicular to the lower surface of the substrate 11 is larger than the thickness of the wiring conductor 4.
- impedance matching can be easily performed when the package 1 is mounted on the mounting substrate.
- the dielectric constant around the region of the wiring conductor 4 located immediately below the base body 11 can be made closer to the dielectric constant around the region of the wiring conductor 4 drawn to the side of the base body 11. This is because, when the package 1 is mounted on the mounting board by bonding the region of the wiring conductor 4 drawn to the side of the base 11 to the mounting board with a connecting member or the like, the wiring conductor 4 is directly below the base 11.
- the dielectric constant around the region of the wiring conductor 4 located immediately below the base body 11 can be made closer to the case where there is a dielectric only on one side in the vertical direction when viewed from the wiring conductor 4. For this reason, it becomes easy to perform impedance matching between these regions.
- the relative permittivity of the wiring conductor 4 and the mounting board is about 10, and the air present in the gap is present.
- the relative dielectric constant of is about 1. That is, the upper dielectric constant is about 1 and the lower dielectric constant is about 10 as viewed from the wiring conductor 4 around the area of the wiring conductor 4 drawn to the side of the base 11. In addition, around the region of the wiring conductor 4 located immediately below the base body 11, the upper dielectric constant is about 10 when viewed from the wiring conductor 4, and a gap having a dielectric constant of about 1 is positioned on the lower side. It will be. A detailed description of the specific thickness of the ground conductor 5 and the thickness of the wiring conductor 4 will be described later.
- the ground conductor 5 comes in contact with the mounting substrate 15 first than the wiring conductor 4. Therefore, the pressing force that the wiring conductor 4 receives from the mounting substrate 15 can be reduced. As a result, the deformation of the wiring conductor 4 due to this pressing force can be suppressed, so that the signal transmission characteristics of the wiring conductor 4 can be kept good.
- the base 11 in the package 1 of the example of the first embodiment has an upper surface, a lower surface, and a plurality of side surfaces located between the upper surface and the lower surface.
- the base body 11 has a quadrangular shape when viewed in plan, and a stepped portion 121 provided with a terminal connection conductor 101 to be described later is in contact with the inner peripheral surface of the frame 13 on the upper surface thereof. Is formed.
- the base 11 has a mounting area on the upper surface of which the electronic component 2 is mounted via the submount 21.
- the base body 11 Since the electronic component 2 is mounted on the mounting region on the upper surface of the base body 11, the base body 11 is required to have high insulation at least in a portion where the electronic component 2 is disposed.
- a dielectric material such as alumina (Al 2 O 3 ) ceramics, aluminum nitride (AlN) ceramics, or mullite (3Al 2 O 3 ⁇ 2SiO 2 ) ceramics is used. it can.
- the frame 13 in the first embodiment is located on the upper surface of the base 11 so as to surround the mounting area.
- a dielectric material can be used in the same manner as the base 11.
- a metal member such as iron (Fe), copper (Cu), nickel (Ni), chromium (Cr), cobalt (Co) or tungsten (W), or these metals are used. You may use the alloy which becomes.
- the frame 13 has a plurality of side surfaces, and a first side surface 111 that is one of the side surfaces has a through hole 131 that opens to the outer peripheral surface and the inner peripheral surface.
- the package 1 of 1st Embodiment has the optical fiber attachment part 8 attached to the through-hole 131 of this frame 13.
- the optical fiber attachment portion 8 in the first embodiment is a cylindrical member.
- the optical fiber attachment portion 8 is fixed to the frame 13 so that one end is located inside the frame 13 and the other end is located outside the frame 13.
- the optical fiber 23 can be positioned by fixing the optical fiber 23 with the optical fiber attachment portion 8.
- the optical fiber attachment portion 8 has a strength that can fix at least the optical fiber 23.
- it can be formed of a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten.
- the frame 13 and the base body 11 may be formed separately or may be formed integrally.
- connection conductor 3 in the first embodiment is provided from the upper surface to the lower surface of the base 11.
- the connection conductor 3 has a function of transmitting an electric signal generated by the electronic component 2 from the upper surface of the base 11 to the lower surface, or a function of transmitting an electric signal input from the outside from the lower surface of the base 11 to the upper surface. .
- One end of the connection conductor 3 is exposed on the upper surface of the base 11.
- the connection conductor 3 and the electronic component 2 are electrically connected via a wiring disposed on the upper surface of the base 11.
- a typical connection method for this electrical connection is wire bonding 30.
- the other end of the connection conductor 3 is exposed on the lower surface of the base 11.
- connection conductor 3 for example, a metal material such as tungsten, molybdenum (Mo) or manganese (Mn) can be used.
- a method for forming the connection conductor 3 there is a method in which a through hole penetrating between the upper surface and the lower surface of the base 11 is formed and a metal paste is disposed in the through hole.
- a known suction method or the like may be used.
- the connection conductor 3 may be formed so that a metal material is filled in the entire inside of the through hole. Moreover, it may be disposed so as to cover the inner wall of the through hole and form a cavity on the inner peripheral side.
- the wiring conductor 4 is provided on the lower surface of the base 11.
- a strip-shaped metal member is used as the wiring conductor 4.
- One end of the wiring conductor 4 is electrically connected to the connection conductor 3, and the other end of the wiring conductor 4 is outside the base 11 than the second side 112, which is one side of the base 11.
- the wiring conductor 4 is made of a metal material such as copper, for example.
- the wiring conductor 4 is attached to the lower surface of the base 11 by joining the connecting conductor 3 and the wiring conductor 4 with a connecting member or the like.
- the package 1 of this example further includes an internal grounding conductor 6 disposed on the upper surface of the base 11.
- the internal ground conductor 6 is disposed on the upper surface of the base 11 so as to surround one end of the connection conductor 3. A predetermined interval is secured between the connection conductor 3 and the internal ground conductor 6 so that the connection conductor 3 and the internal ground conductor 6 are not short-circuited.
- the internal ground conductor 6 can be formed by, for example, a metallization method.
- the internal ground conductor 6 is made of a metal material such as tungsten, molybdenum, or manganese.
- the internal ground conductor 6 is provided in order to reduce dielectric loss when a high-frequency signal is transmitted by the connection conductor 3.
- the package 1 of this example includes a ground conductor 5 (external ground conductor 5) provided on the lower surface of the base 11.
- a strip-shaped metal plate is used as the external ground conductor 5.
- the external ground conductors 5 are provided at two locations on the lower surface of the base body 11 so as to sandwich the wiring conductor 4. A predetermined interval is secured between the external ground conductor 5 and the wiring conductor 4 so that the external ground conductor 5 and the wiring conductor 4 are not electrically short-circuited. Thereby, the external grounding conductor 5 forms a coplanar line together with the wiring conductor 4.
- the attachment of the external ground conductor 5 to the lower surface of the base 11 is performed by joining a ground connection conductor 7 and an external ground conductor 5 described later with a connection member or the like.
- the elastic modulus of the external ground conductor 5 is larger than the elastic modulus of the wiring conductor 4.
- the package 1 of the present example includes a ground connection conductor 7 that is provided from the upper surface to the lower surface of the base 11 and electrically connects the internal ground conductor 6 and the external ground conductor 5.
- the ground connection conductor 7 is provided at two locations from the upper surface to the lower surface of the base body 11 so as to correspond to the two external ground conductors 5 and the internal ground conductor 6, respectively. positioned. A predetermined interval is secured between the ground connection conductor 7 and the connection conductor 3 so that these conductors are not short-circuited.
- One end of the ground connection conductor 7 is exposed on the upper surface of the base 11, and the other end is exposed on the lower surface of the base 11.
- ground connection conductor 7 As a method for forming the ground connection conductor 7, as in the case of the connection conductor 3, there is a method of forming a through hole penetrating between the upper surface and the lower surface of the base 11 and disposing a metal paste in the through hole.
- the “ground” in the internal ground conductor 6, the external ground conductor 5, and the ground connection conductor 7 here is electrically connected to an external reference potential (not shown) as a so-called ground potential. This means that the reference potential does not necessarily have to be 0V.
- the package 1 of this example has a plurality of screwing portions 9 as mounting members disposed on the lower surface of the base body 11.
- Each screwing portion 9 includes an inner region 92 that is provided on the lower surface of the substrate 11 and overlaps with the substrate 11 when the substrate 11 is viewed from below, and an outer region 93 that is located on the outer side of the side surface of the substrate 11.
- Each screwing portion 9 is a rectangular member, and a hole 91 is provided from one main surface of the outer region 93 to the other main surface.
- the package 1 can be fixed to the mounting substrate 15 by attaching the package 1 and a mounting substrate 15 (to be described later) to these screwing portions 9 by screwing.
- the screwing portion 9 is formed of a metal plate such as copper.
- the screwing portion 9 and the base 11 are joined by separately forming a metal film on the lower surface of the base 11 by a metallization method, and joining the metal film and the screwing portion 9 using a connecting member or the like.
- the thickness of the screwing portion 9 in the direction perpendicular to the lower surface of the substrate 11 is larger than the thickness of the wiring conductor 4 in the direction perpendicular to the lower surface of the substrate 11, and the electronic component housing package 1 is mounted.
- the thickness of the external grounding conductor 5 be the same as the thickness in the direction perpendicular to the lower surface of the base 11. Note that the term “same” here includes an error that is inevitable in manufacturing.
- the package 1 in the example of the present embodiment includes a plurality of terminal connection conductors 101 penetrating from the upper surface of the stepped portion 121 in the base body 11 to the lower surface of the base body 11.
- the terminal connection conductor 101 is electrically connected to the electronic component 2 by, for example, wire bonding.
- the lead terminal 102 is a member for electrically connecting the terminal connection conductor 101 and the external wiring.
- the lead terminals 102 are band-shaped members, and a plurality of lead terminals 102 are provided side by side on the lower surface of the base 11. One end of each lead terminal 102 is joined to an end portion of the terminal connection conductor 101 located on the lower surface of the base body 11, and the other end is pulled out to the side of the base body 11.
- the lead terminal 102 is made of a metal material such as copper, for example.
- connection conductor 3 and the wiring conductor 4 are used for transmitting a high-frequency signal, while the terminal connection conductor 101 and the lead terminal 102 are used for supplying power to the electronic component 2.
- the plurality of terminal connection conductors 101 are arranged at predetermined intervals so as not to be electrically short-circuited with each other.
- the terminal connection conductor 101 can be formed by the same method as the connection conductor 3.
- the external ground conductor 5 includes not only the first region 51 that overlaps the base body 11 but also the second region 52 that is located outside the base body 11 when viewed from below. It is desirable to have. As a result, the change in impedance of the coplanar line formed by the wiring conductor 4 and the external ground conductor 5 from directly under the base 11 to the outside of the base 11 can be reduced, and the transmission characteristics of the high-frequency signal are improved. Can do.
- the external ground conductor 5 preferably has a hole 520 in the second region 52 for mounting to the mounting board 15 by screwing.
- the hole 520 may be a through hole provided from the upper surface to the lower surface of the external ground conductor 5, and an opening is provided at the end of the external ground conductor 5 when the external ground conductor 5 is viewed from the bottom. May be good.
- the hole 520 is provided so as to open in a side located on the opposite side of the side facing the wiring conductor 4. Therefore, the change of the parasitic capacitance between the external ground conductor 5 and the wiring conductor 4 is reduced. Therefore, the influence on the transmission characteristic of the high frequency signal is reduced.
- the second region 52 is more than the third region 53 adjacent to the first region 51 and the third region 53.
- a fourth region 54 located outside the base body 11, and the distance between the fourth region 54 and the wiring conductor 4 is larger than the distance between the third region 53 and the wiring conductor 4. desirable.
- the impedance in the transmission circuit formed by the wiring conductor 4 and the external ground conductor 5 can be changed stepwise, the transmission characteristics can be further improved.
- the hole 520 is formed in the external ground conductor 5, it is desirable to form it in the fourth region 54. Thereby, the pressing force applied to the wiring conductor 4 when screwing using the hole 520 can be further reduced. For example, if the distance between the third region 53 and the wiring conductor 4 is 500 to 700 ⁇ m, the distance between the fourth region 54 and the wiring conductor 4 can be set to 1000 to 1200 ⁇ m.
- the third region 53 in the external ground conductor 5 has a larger distance from the wiring conductor 4 as it is farther from the base body 11 when viewed from below.
- the two external ground conductors 5 are integrally formed by being connected, for example, on the lower surface of the base 11.
- the external grounding conductor 5 has a shape surrounding one end of the wiring conductor 4 from three directions, for example.
- the external ground conductor 5 and the screwing portion 9 are integrally formed. Thereby, the stress generated in the screwing portion 9 at the time of screwing can be distributed to the external ground conductor 5. Therefore, the screwing portion 9 can be screwed stably. Therefore, the reliability of the electronic component storage package 1 can be improved. Further, since the external ground conductor 5 and the screwing portion 9 are integrally formed, the number of parts can be reduced.
- the electronic component storage package 10 of the example of the second embodiment includes the wiring conductor 4 in the same manner as the electronic component storage package 1 of the example of the first embodiment. Yes.
- the electronic component storage package 1 of the example of the first embodiment one wiring conductor 4 is provided.
- a plurality of wiring conductors 4 are provided. Is provided.
- the external grounding conductor 5 is positioned with the two wiring conductors 4 interposed therebetween.
- An external ground conductor 5 is sandwiched between the two wiring conductors 4. Thereby, the electromagnetic influence between the wiring conductors 4 can be reduced.
- the external ground conductor 5 located between the wiring conductors 4 and the external ground conductor 5 located between the wiring conductors 4 are, for example, the lower surface of the base body 11. It is preferable that they are integrally formed by being connected at each other. As a result, the potential difference between the external ground conductor 5 positioned between the wiring conductor 4 and the external ground conductor 5 positioned between the wiring conductors 4 is improved while improving the strength of the external grounding conductor 5 against pressure. This can be further reduced, and the transmission characteristics of high-frequency signals can be improved.
- the external ground conductor 5 and the screwing portion 9 as the mounting member are appropriately shaped similarly to the external grounding conductor 5 and the screwing portion 9 in the example of the first embodiment. It is possible to change.
- the electronic module 100 of the example of one embodiment of the present invention includes the electronic component 2 housed in the packages 1 and 10 of the example of the above embodiment, as shown in FIGS. 10 and 11. .
- the optical semiconductor element that is the electronic component 2 in this example is mounted on the electronic component mounting region with the submount 21 interposed therebetween.
- the optical semiconductor element has a function of converting an electrical signal into an optical signal or a function of converting an optical signal into an electrical signal.
- Exemplary optical semiconductor elements include laser diodes and photodiodes.
- the optical semiconductor element may be directly mounted on the electronic component mounting area, but is preferably mounted on the submount 21. This is because the height position of the optical semiconductor element can be adjusted by the submount 21 and the accuracy of optical coupling with the optical fiber 23 can be improved.
- the electronic module 100 of this example includes an optical fiber 23 provided in the optical fiber attachment portion 8.
- the optical fiber 23 is inserted into the optical fiber attachment portion 8 from the outside of the base 11 and installed.
- the optical fiber 23 is optically coupled to the optical semiconductor element.
- the electronic module 100 of this example includes a translucent member 22.
- the translucent member 22 is provided on the upper surface of the submount 21 and is located between the optical fiber 23 and the optical semiconductor element.
- the translucent member 22 has a function of collecting the light emitted from the optical semiconductor element into the optical fiber 23 or a function of collecting the light emitted from the optical fiber 23 into the optical semiconductor element.
- the translucency here does not necessarily mean that the light transmittance is 100%. That is, it is sufficient that the transmittance is sufficient to satisfy the above-described function. For example, a transmittance of about 80% is sufficient.
- the translucent member 22 is a lens formed of, for example, glass or plastic.
- the electronic module 100 of this example includes a lid 14.
- the lid body 14 is a rectangular plate member and is provided on the upper surface of the frame body 13. By joining the lid 14 to the frame 13, the optical semiconductor element is hermetically sealed. Thereby, the reliability of the optical semiconductor element can be improved.
- dielectric materials such as alumina ceramics, aluminum nitride ceramics and mullite ceramics, and metal materials such as iron, nickel, chromium, cobalt and tungsten are used.
- the electronic apparatus 200 includes an electronic module 100 and a mounting substrate 15 to which the electronic module 100 is attached.
- the mounting substrate 15 in the example of the present embodiment is formed of a dielectric material such as resin or ceramics.
- a first circuit pattern 151, a second circuit pattern 152, and a ground pattern 153 are formed on the upper surface of the mounting substrate 15.
- the first circuit pattern 151, the second circuit pattern 152, and the ground pattern 153 are obtained, for example, by sintering a metal paste using molybdenum, manganese, or the like as a raw material.
- the first circuit pattern 151 and the wiring conductor 4 the second circuit pattern 152 and the lead terminal 102, the ground pattern 153, and the external ground conductor 5 are electrically connected. Thus, it is mounted on the mounting substrate 15.
- connection member 16 is provided between the upper surface of the circuit pattern 152 and the lower surface of the lead terminal 102 and between the upper surface of the ground pattern 153 and the lower surface of the external ground conductor 5.
- connection member 16 for example, SnAgCu solder, SnZnBi solder, SnCu solder, SnAgInBi solder, or the like can be used.
- the electronic device 200 includes the electronic module 100 and the mounting substrate 15 to which the electronic module 100 is attached, and a gap S2 between the region of the external ground conductor 5 located immediately below the base body 11 and the mounting substrate 15.
- the gap S1 between the mounting substrate 15 and the region of the wiring conductor 4 located immediately below the base body 11 is larger.
- the dielectric constant around the area of the wiring board 4 that is located immediately below the base body 11 is set to the wiring conductor 4.
- the dielectric constant around the region drawn out to the side of the substrate 11 can be made close. For this reason, it becomes easy to perform impedance matching between these regions.
- the mounting substrate 15 is provided with a hole so as to be continuous with the hole 91 of the mounting member 9.
- the electronic component storage packages 1 and 10 can be firmly fixed to the mounting substrate 15.
- the width of the two wiring conductors 4 is 150 ⁇ m, and the width of the region located between the two wiring conductors 4 of the external grounding conductor 5 and immediately below the side surface of the base 11 is 400 ⁇ m.
- the interval between the two wiring conductors 4 is set to 900 ⁇ m.
- the thickness of the wiring conductor 4 can be set to 100 to 500 ⁇ m, for example, and the thickness of the external grounding conductor 5 is determined so that the size of the gap S1 in the height direction becomes a desired size.
- the gap S1 is excessively increased, resonance of the high-frequency signal may occur inside the gap S1. Therefore, under the above conditions, it is preferable to set the size of the gap S1 in the height direction to 100 to 500 ⁇ m.
- the electronic component housing component 10, the electronic module 100, and the electronic device 200 of the example of the second embodiment of the present invention were manufactured and evaluated.
- the manufactured electronic device 200 is the electronic device 200 shown in FIG.
- the dimensions of the manufactured electronic device 200 are as follows.
- the two wiring conductors 4 have a width of 150 ⁇ m and a thickness of 100 ⁇ m.
- the external ground conductor 5 has a thickness of 200 ⁇ m, and is a region located between the two wiring conductors 4 of the external ground conductor 5, and the width of the region located immediately below the side surface of the base 11 is 400 ⁇ m.
- the distance between this region and the two wiring conductors 4 is 900 ⁇ m.
- the thickness of the first circuit pattern 151 and the ground pattern 153 is 20 ⁇ m.
- the thickness of the connection member 16 provided between the wiring conductor 4 and the first circuit pattern 151 is 150 ⁇ m
- the thickness of the connection member 16 provided between the external ground conductor 5 and the ground pattern 153 is 50 ⁇ m. It is. That is, the size of the gap S1 in the height direction is 170 ⁇ m.
- the reflection loss when a high-frequency signal of 10 GHz was passed was ⁇ 28 dB in the example and ⁇ 23 dB in the comparative example.
- the reflection loss when a high-frequency signal of 20 GHz was passed was ⁇ 30 dB in the example, and ⁇ 21 dB in the comparative example.
- the reflection loss when a high-frequency signal of 30 GHz was passed was ⁇ 22 dB in the example, and ⁇ 16 dB in the comparative example.
- the reflection loss when a high frequency signal of 40 GHz was passed was ⁇ 25 dB in the example, and ⁇ 16 dB in the comparative example.
- the example had a smaller reflection loss than the comparative example. This is because the impedance of the example was better than that of the comparative example. From the above, it was confirmed that impedance matching can be easily performed by using the electronic device 200 of the present invention.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
実施例として、本発明の第2の実施形態の例の電子部品収納用部品10、電子モジュール100および電子装置200を作製して評価を行なった。作製した電子装置200は、図11に示した電子装置200である。
100:電子モジュール
200:電子装置
2:電子部品
3:接続導体
4:配線導体
5:接地導体(外部接地導体)
51:第1の領域
52:第2の領域
520:孔
53:第3の領域
54:第4の領域
9:取付け部材(ネジ止め部)
91:孔
11:基体
13:枠体
15:実装基板
Claims (7)
- 電子部品を搭載するための搭載領域を有する基体と、
前記基体の上面から下面にかけて設けられた、前記電子部品に電気的に接続される接続導体と、
前記基体の下面に設けられた、一方の端部が前記接続導体に電気的に接続されるとともに、他方の端部が前記基体の側方に引き出された配線導体と、
前記基体の下面に設けられた、前記配線導体と共にコプレーナ線路を形成する接地導体とを備え、
前記配線導体の下面が、前記接地導体の下面よりも上方に位置していることを特徴とする電子部品収納用部品。 - 前記接地導体は、下面視したときに、前記基体と重なり合う第1の領域と、前記基体の側面よりも外側に位置する第2の領域とを有していることを特徴とする請求項1に記載の電子部品収納用部品。
- 前記接地導体が、前記実装基板に取り付けるための孔を前記第2の領域に備えていることを特徴とする請求項2に記載の電子部品収納用部品。
- 前記接地導体の前記第2の領域が、下面視したときに、前記第1の領域に隣接する第3の領域と、該第3の領域よりも前記基体の外側に位置する第4の領域とを有し、該第4の領域と前記配線導体との間隔が、前記第3の領域と前記配線導体との間隔よりも大きいことを特徴とする請求項2に記載の電子部品収納用部品。
- 前記接地導体の前記第3の領域が、下面視したときに、前記基体から離れるにしたがって前記配線導体との間隔が大きくなっていることを特徴とする請求項4に記載の電子部品収納用部品。
- 請求項1に記載の電子部品収納用部品と、該電子部品収納用部品の前記搭載領域に搭載された電子部品とを備えた電子モジュール。
- 請求項6に記載の電子モジュールと、該電子モジュールが取りつけられた実装基板とを備えた電子装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180022000.6A CN102884619B (zh) | 2010-07-30 | 2011-07-29 | 电子部件收纳用部件、电子模块及电子装置 |
US13/813,222 US9078347B2 (en) | 2010-07-30 | 2011-07-29 | Electronic component housing unit, electronic module, and electronic device |
JP2012526595A JP5697669B2 (ja) | 2010-07-30 | 2011-07-29 | 電子部品収納用部品、電子モジュールおよび電子装置 |
EP11812629.1A EP2600396B1 (en) | 2010-07-30 | 2011-07-29 | Electronic component housing unit, electronic module and electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-172221 | 2010-07-30 | ||
JP2010172221 | 2010-07-30 |
Publications (1)
Publication Number | Publication Date |
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WO2012015040A1 true WO2012015040A1 (ja) | 2012-02-02 |
Family
ID=45530239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/067495 WO2012015040A1 (ja) | 2010-07-30 | 2011-07-29 | 電子部品収納用部品、電子モジュールおよび電子装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9078347B2 (ja) |
EP (1) | EP2600396B1 (ja) |
JP (1) | JP5697669B2 (ja) |
CN (1) | CN102884619B (ja) |
WO (1) | WO2012015040A1 (ja) |
Cited By (4)
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US20140022734A1 (en) * | 2012-07-17 | 2014-01-23 | Oclaro Japan, Inc. | Optical module |
JP2014060318A (ja) * | 2012-09-19 | 2014-04-03 | Kyocera Corp | 半導体素子収納用パッケージおよび半導体装置 |
CN105655886A (zh) * | 2016-03-14 | 2016-06-08 | 长葛市和合电气有限公司 | 具有备用安装板块的配电柜 |
JP2018137382A (ja) * | 2017-02-23 | 2018-08-30 | 京セラ株式会社 | 配線基板、電子部品用パッケージおよび電子装置 |
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CN104067385B (zh) * | 2012-01-24 | 2017-02-22 | 京瓷株式会社 | 电子部件收纳用封装体以及电子装置 |
WO2015046292A1 (ja) * | 2013-09-25 | 2015-04-02 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
US10141303B1 (en) | 2017-09-20 | 2018-11-27 | Cree, Inc. | RF amplifier package with biasing strip |
WO2021053764A1 (ja) * | 2019-09-18 | 2021-03-25 | 日本電信電話株式会社 | 光モジュール用パッケージ |
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Also Published As
Publication number | Publication date |
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CN102884619B (zh) | 2016-08-17 |
EP2600396B1 (en) | 2017-03-15 |
EP2600396A4 (en) | 2016-01-06 |
EP2600396A1 (en) | 2013-06-05 |
US20130128467A1 (en) | 2013-05-23 |
US9078347B2 (en) | 2015-07-07 |
JP5697669B2 (ja) | 2015-04-08 |
CN102884619A (zh) | 2013-01-16 |
JPWO2012015040A1 (ja) | 2013-09-12 |
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