WO2012002385A1 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- WO2012002385A1 WO2012002385A1 PCT/JP2011/064804 JP2011064804W WO2012002385A1 WO 2012002385 A1 WO2012002385 A1 WO 2012002385A1 JP 2011064804 W JP2011064804 W JP 2011064804W WO 2012002385 A1 WO2012002385 A1 WO 2012002385A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- case
- shield case
- pin
- housing
- Prior art date
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
Definitions
- the present invention relates to an electronic component having a shield case.
- the optical connector 100 that is an electronic component includes an electronic component main body 101 and a shield case 110 that covers the outer periphery of the electronic component main body 101.
- the electronic component body 101 includes a housing 102, a pair of sleeves 103 inserted into a pair of holes in a partition wall (not shown) of the housing 102, and a pair of light guide members inserted into the pair of sleeves 103 from the rear. 104 and an optical transceiver (FOT: Fiber Optical Transceiver) 105 disposed on the rear surface side of the pair of light guide members 104.
- FOT Fiber Optical Transceiver
- the shield case 110 includes three upper surface piece portions 110a, a pair of side surface portions 110b, and a rear surface portion 110c.
- a plurality of ground pins 110d project downward from the lower end surfaces of the pair of side surface portions 110b and the rear surface portion 110c.
- the shield case 110 is mounted on the electronic component main body 101 by covering the outer periphery of the electronic component main body 101 from the case opening on the lower surface side.
- Each ground pin 110d is connected to a predetermined conductor portion (not shown) of a substrate (not shown) to be mounted together with the lead portion 105a of the optical transceiver 105 by soldering or the like.
- the shield case 110 since the shield case 110 only covers a part of the upper surface together with the entire side surface and rear surface of both sides of the electronic component main body 101, a problem that high electromagnetic noise removal performance cannot be obtained. There is. In particular, when the communication speed increases, the conventional shield case 110 may not be able to effectively remove electromagnetic noise.
- the present invention has been made to solve the above-described problems, and an object thereof is to provide an electronic component capable of obtaining high electromagnetic noise removal performance.
- An electronic component main body having an electronic element, a shield case disposed on both sides and a rear surface of the electronic component main body, an auxiliary shield disposed on the front surface of the electronic element and conducted to the shield case
- An electronic component comprising a member.
- FIG. 1 shows an embodiment of the present invention and is a perspective view from the front side of an optical connector.
- FIG. 2 shows an embodiment of the present invention and is a perspective view from the rear side of the optical connector.
- FIG. 3 shows an embodiment of the present invention and is an exploded perspective view from the front side of the optical connector.
- FIG. 4 shows an embodiment of the present invention and is a cross-sectional view taken along line AA of FIG.
- FIG. 5 shows an embodiment of the present invention and is a front view of an option pin.
- 6 is a perspective view showing an embodiment of the present invention, viewed from the bottom side of the optical connector.
- FIG. 7 shows an embodiment of the present invention and is a partially broken perspective view of a shield case and an option pin.
- FIG. 1 shows an embodiment of the present invention and is a perspective view from the front side of an optical connector.
- FIG. 2 shows an embodiment of the present invention and is a perspective view from the rear side of the optical connector.
- FIG. 3 shows an embodiment of the present
- FIG. 8 is a perspective view showing a process of mounting the shield case from above the electronic component body according to the embodiment of the present invention.
- FIG. 9 is a perspective view showing a process of mounting the option pin from the lower surface of the electronic component body according to the embodiment of the present invention.
- FIG. 10 is an exploded perspective view of a conventional optical connector.
- FIG. 11 is a perspective view of a conventional optical connector.
- an optical connector 1 which is an electronic component includes an electronic component body 2 and a shield case 20 that covers the outer periphery of the electronic component body 2.
- the electronic component body 2 includes a housing 3, a pair of lenses 4, an optical transceiver (FOT: Fiber Optical Transceiver) 5 that is a pair of electronic elements, an electronic element cover 6, and an option pin 7 that is an auxiliary shield member. I have.
- FOT Fiber Optical Transceiver
- the housing 3 has a partition wall 30 inside as shown in FIG.
- a connector fitting chamber 31 and a component housing chamber 32 are provided with the partition wall 30 as a boundary.
- a mating connector (not shown) is fitted into the connector fitting chamber 31.
- 1 to 3 show a state in which the dust cap 8 is attached to the connector fitting chamber 31.
- the dust cap 8 is used to prevent entry of dust and the like into the connector fitting chamber 31 when a mating connector (not shown) is not attached.
- a pair of cylindrical optical fiber positioning portions 33 project from the partition wall 30 toward the connector fitting chamber 31.
- the tip portions of a pair of optical fibers (not shown) of the mating connector (not shown) are positioned by the optical fiber positioning portions 33.
- the inside of each optical fiber positioning part 33 is penetrated by the component storage chamber 32.
- a pin press-fit slit 34 is provided at the bottom of the housing 3 from the partition wall 30 on the component housing chamber 32 side (see FIG. 6).
- the pin press-fit slit 34 opens at the bottom surface of the component storage chamber 32.
- a center slit 35 is provided on the upper wall portion of the housing 3 from the partition wall 30 on the component housing chamber 32 side. The center slit 35 is opened on the upper surface of the component housing chamber 32.
- the pair of lenses 4 are arranged in the component housing chamber 32 so as to face the opening of each optical fiber positioning portion 33.
- the pair of lenses 4 are arranged in parallel with at least a position on the extension line of the center slit 35 of the housing 3.
- the pair of optical transceivers 5 is disposed in the component storage chamber 32 at the rear end position of each lens 4.
- one of the pair of optical transceivers 5 is a light emitting element and the other is a light receiving element.
- Each optical transceiver 5 has a plurality of lead portions 5a protruding downward. Each lead portion 5a is connected to a corresponding conductor portion of a board (not shown) to be mounted by soldering or the like.
- the pair of optical transceivers 5 are arranged in parallel with at least a position on the extension line of the center slit 35 of the housing 3.
- the electronic element cover 6 is disposed on both rear surfaces of the pair of optical transceivers 5.
- the electronic element cover 6 is fitted in the housing 3.
- a pair of optical transceivers 5 are fixed to the housing 3 by the electronic element cover 6.
- a cover-side slit 6 c is provided at the center position of the electronic element cover 6.
- the cover-side slit 6c opens at the upper end surface of the electronic element cover 6 and extends vertically downward, but does not reach the lower end surface.
- the cover side slit 6 c is located on an extension line of the center slit 35 of the housing 3. That is, the partition case portion 24 described below of the shield case 20 is arranged using the center slit 35 of the housing 3 and the space on the extension line thereof.
- Position control portions 10 and 11 are provided on the rear surface of each electronic element cover 6 (see FIG. 8).
- the option pin 7 is an optional member that is assembled as necessary.
- the option pin 7 is formed from a conductive metal plate.
- the option pin 7 includes a shield plate portion 7A and a ground pin portion 7B that is a plurality of ground connection portions protruding below the shield plate portion 7A.
- a locking hole 7C is formed in the shield plate portion 7A.
- the option pin 7 is press-fitted into the pin press-fit slit 34 of the housing 3.
- the option pin 7 is electrically connected to the shield case 20 by the locking hole 7 ⁇ / b> C being locked to the locking protrusion 24 b of the shield case 20.
- the shield plate portion 7A of the option pin 7 is disposed on the front surface of the pair of optical transceivers 5 (see FIG. 4).
- Each ground pin portion 7B of the option pin 7 is connected to a ground conductor portion of a substrate (not shown) to be mounted by soldering or the like.
- the option pin 7 can be removed if it is pulled out against the locking force between the locking hole 7C and the locking projection 24b and the pressure input to the housing 3. That is, the option pin 7 is detachably provided on the electronic component main body 2.
- the shield case 20 is formed by punching a conductive metal plate and bending it.
- the shield case 20 has a substantially box shape whose lower surface is a case opening 20a.
- the shield case 20 includes an upper case portion 21, left and right side case portions 22, and a rear case portion 23, and a partition case portion 24 arranged so as to partition the rear of the interior at the center.
- the rear case portion 23 includes two divided case pieces 25 and 26 that are divided.
- the partition case part 24 is formed by bending from the end face on the center side of at least one of the two split case piece parts 25 and 26.
- a locking projection 24 b is provided on the distal end surface of the partition case portion 24.
- Ground pins 22a, 24a, 25a, and 26a serving as ground connection portions project downward from the lower ends of the side case portions 22, the partition case portion 24, and the divided case piece portions 25 and 26.
- Each ground pin 22a, 24a, 25a, 26a is connected to a grounding conductor portion of a substrate (not shown) to be mounted by soldering or the like.
- the left and right side case portions 22 are respectively provided with locking claws 22b by bending inward. Each locking claw 22 b is locked to the housing 3. As a result, the shield case 20 is prevented from being detached from the electronic component main body 2.
- Each of the split case pieces 25 and 26 is provided with position restricted portions 27 and 28 by bending inward. As shown in FIG. 4, the left and right position restricted portions 27 and 28 are respectively engaged with the left and right position restricted portions 10 and 11 of the electronic cover 6.
- the shield case 20 is put on the electronic component main body 2 from the case opening 20a side. Then, both side case portions 22 and the rear case portion 23 of the shield case 20 gradually cover the outer periphery of the electronic component main body 2, and the partition case portion 24 enters the component housing chamber 32 from the center slit 35 of the housing 3. Then, when the upper surface case portion 21 of the shield case 20 is covered to a position where it contacts the upper surface of the electronic component main body 2, the respective locking claws 22 b are locked to the housing 3. Further, the lower end surface of the partition case part 24 enters to the vicinity of the lower end of the cover side slit 6 c of the electronic element cover 6, and the partition case part 24 partitions the pair of optical transceivers 5.
- the optional pin 7 When the optional pin 7 is mounted, the optional pin 7 is press-fitted from the pin press-fit slit 34 of the housing 3 as shown in FIG. When press-fitting to the press-fitting completion position, the locking projection 24 b of the partition case 24 is locked in the locking hole 7 C of the option pin 7.
- the shield plate portion 7A of the option pin 7 is disposed on the front surface of each optical transceiver 5 (see FIG. 4).
- each optical transceiver 5 When the optical connector 1 is mounted on the board, the lead part 5a of each optical transceiver 5, each ground pin 22a, 24a, 25a, 26a of the shield case 20, and the ground pin part 7B of the option pin 7 are a board (not shown). Are connected to the corresponding conductor portions by soldering or the like.
- each optical transceiver 5 has not only the shield case 20 disposed on the upper surface side, both side surfaces, and the rear surface side, but also the shield plate portion 7A of the option pin 7 disposed on the front surface side.
- the option pin 7 conducts to the shield case 20, and noise can be removed by the shield case 20 and the option pin 7 as a whole. As described above, high electromagnetic noise removal performance can be obtained.
- the option pin 7 is detachably provided on the electronic component body 2. Therefore, it is not necessary to mount the electronic component body 2 when it is not necessary. Moreover, since the option pin 7 attached to the electronic component main body 2 can be easily removed at the time of disassembly, it is excellent in consideration of the environment considering easy disassembly.
- the option pin 7 has the ground pin portion 7B, the noise removal performance is improved.
- the electronic component is the optical connector 1, but the present invention can of course be applied to electronic components other than the optical connector 1.
- the electronic component of this invention was demonstrated in detail and with reference to specific embodiment, embodiment mentioned above only showed the typical form of this invention, and this invention is limited to embodiment. Is not to be done. That is, various modifications can be made without departing from the scope of the present invention.
- This application is based on a Japanese patent application filed on June 28, 2010 (Japanese Patent Application No. 2010-146290), the contents of which are incorporated herein by reference.
- the shield case is disposed not only on the upper surface side, both side surfaces and the rear surface side of the electronic element, but also the auxiliary shield member is disposed on the front surface side of the electronic element.
- the auxiliary shield member conducts to the shield case, and noise can be removed by the entire shield case and auxiliary shield member. As described above, high electromagnetic noise removal performance can be obtained.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
(1) 電子素子を有する電子部品本体と、前記電子部品本体の上面と両方の側面と後面に配置されるシールドケースと、前記電子素子の前面に配置され、前記シールドケースに導通される補助シールド部材とを備えた電子部品。
各分割ケース片部25,26には、内側への折り曲げによって位置被規制部27,28がそれぞれ設けられている。左右の位置被規制部27,28は、図4に示すように、電子カバー6の左右の位置規制部10,11にそれぞれ係止されている。
以上、本発明の電子部品を詳細にまた特定の実施形態を参照して説明したが、前述した実施形態は本発明の代表的な形態を示したに過ぎず、本発明は、実施形態に限定されるものではない。即ち、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。
本出願は、2010年6月28日出願の日本特許出願(特願2010-146290)に基づくものであり、その内容はここに参照として取り込まれる。
2 電子部品本体
5 光トランシーバ(電子素子)
7 オプションピン(補助シールド部材)
7B グランドピン部(アース用接続部)
20 シールドケース
Claims (3)
- 電子素子を有する電子部品本体と、
前記電子部品本体の上面と両方の側面と後面に配置されるシールドケースと、
前記電子素子の前面に配置され、前記シールドケースに導通される補助シールド部材と、
を備えた電子部品。 - 請求項1記載の電子部品であって、
前記補助シールド部材は、前記電子部品本体に着脱自在に設けられた電子部品。 - 請求項1又は請求項2記載の電子部品であって、
前記補助シールド部材は、アース用接続部を有する電子部品。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127034344A KR101565207B1 (ko) | 2010-06-28 | 2011-06-28 | 전자 부품 |
EP11800849.9A EP2587909A4 (en) | 2010-06-28 | 2011-06-28 | Electronic component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-146290 | 2010-06-28 | ||
JP2010146290A JP5663212B2 (ja) | 2010-06-28 | 2010-06-28 | 電子部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012002385A1 true WO2012002385A1 (ja) | 2012-01-05 |
Family
ID=45402092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/064804 WO2012002385A1 (ja) | 2010-06-28 | 2011-06-28 | 電子部品 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2587909A4 (ja) |
JP (1) | JP5663212B2 (ja) |
KR (1) | KR101565207B1 (ja) |
WO (1) | WO2012002385A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014098150A1 (ja) * | 2012-12-19 | 2014-06-26 | 矢崎総業株式会社 | ダストキャップおよびコネクタ係合体 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021021778A (ja) | 2019-07-25 | 2021-02-18 | 矢崎総業株式会社 | 光コネクタ、光ファイバの端末構造 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH078811U (ja) * | 1993-07-07 | 1995-02-07 | 住友電装株式会社 | 光ファイバコネクタ |
JP2002221643A (ja) * | 2001-01-26 | 2002-08-09 | Auto Network Gijutsu Kenkyusho:Kk | 光コネクタ及び光コネクタの実装取付部の構造 |
JP2002303766A (ja) * | 2001-04-06 | 2002-10-18 | Auto Network Gijutsu Kenkyusho:Kk | 光コネクタ |
JP2002365487A (ja) * | 2001-01-18 | 2002-12-18 | Auto Network Gijutsu Kenkyusho:Kk | 光コネクタ及び光コネクタ用のシールドケース |
JP2005266130A (ja) * | 2004-03-17 | 2005-09-29 | Yazaki Corp | Fotとシールドケースとの取付補助具、光コネクタ、及びハイブリッドコネクタ |
JP2006215276A (ja) * | 2005-02-03 | 2006-08-17 | Yazaki Corp | 光コネクタ |
JP2009111114A (ja) | 2007-10-30 | 2009-05-21 | Yazaki Corp | シールドケース及び光モジュール |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6585540B2 (en) * | 2000-12-06 | 2003-07-01 | Pulse Engineering | Shielded microelectronic connector assembly and method of manufacturing |
US6659655B2 (en) * | 2001-02-12 | 2003-12-09 | E20 Communications, Inc. | Fiber-optic modules with housing/shielding |
JP2009010117A (ja) * | 2007-06-27 | 2009-01-15 | Fujitsu Ltd | 電子機器のシールド構造 |
JP2009016486A (ja) * | 2007-07-03 | 2009-01-22 | Hitachi Information & Communication Engineering Ltd | 光通信器 |
JP4978408B2 (ja) | 2007-10-02 | 2012-07-18 | 富士ゼロックス株式会社 | 光モジュール |
-
2010
- 2010-06-28 JP JP2010146290A patent/JP5663212B2/ja active Active
-
2011
- 2011-06-28 KR KR1020127034344A patent/KR101565207B1/ko active IP Right Grant
- 2011-06-28 EP EP11800849.9A patent/EP2587909A4/en not_active Withdrawn
- 2011-06-28 WO PCT/JP2011/064804 patent/WO2012002385A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH078811U (ja) * | 1993-07-07 | 1995-02-07 | 住友電装株式会社 | 光ファイバコネクタ |
JP2002365487A (ja) * | 2001-01-18 | 2002-12-18 | Auto Network Gijutsu Kenkyusho:Kk | 光コネクタ及び光コネクタ用のシールドケース |
JP2002221643A (ja) * | 2001-01-26 | 2002-08-09 | Auto Network Gijutsu Kenkyusho:Kk | 光コネクタ及び光コネクタの実装取付部の構造 |
JP2002303766A (ja) * | 2001-04-06 | 2002-10-18 | Auto Network Gijutsu Kenkyusho:Kk | 光コネクタ |
JP2005266130A (ja) * | 2004-03-17 | 2005-09-29 | Yazaki Corp | Fotとシールドケースとの取付補助具、光コネクタ、及びハイブリッドコネクタ |
JP2006215276A (ja) * | 2005-02-03 | 2006-08-17 | Yazaki Corp | 光コネクタ |
JP2009111114A (ja) | 2007-10-30 | 2009-05-21 | Yazaki Corp | シールドケース及び光モジュール |
Non-Patent Citations (1)
Title |
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See also references of EP2587909A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014098150A1 (ja) * | 2012-12-19 | 2014-06-26 | 矢崎総業株式会社 | ダストキャップおよびコネクタ係合体 |
JP2014119691A (ja) * | 2012-12-19 | 2014-06-30 | Yazaki Corp | ダストキャップおよびコネクタ係合体 |
US9417402B2 (en) | 2012-12-19 | 2016-08-16 | Yazaki Corporation | Dust cap and connector engagement body |
Also Published As
Publication number | Publication date |
---|---|
EP2587909A1 (en) | 2013-05-01 |
KR20130021419A (ko) | 2013-03-05 |
KR101565207B1 (ko) | 2015-11-02 |
EP2587909A4 (en) | 2017-05-10 |
JP5663212B2 (ja) | 2015-02-04 |
JP2012009750A (ja) | 2012-01-12 |
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