WO2011158510A1 - ドリル孔あけ用エントリーシート - Google Patents
ドリル孔あけ用エントリーシート Download PDFInfo
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- WO2011158510A1 WO2011158510A1 PCT/JP2011/003453 JP2011003453W WO2011158510A1 WO 2011158510 A1 WO2011158510 A1 WO 2011158510A1 JP 2011003453 W JP2011003453 W JP 2011003453W WO 2011158510 A1 WO2011158510 A1 WO 2011158510A1
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- WIPO (PCT)
- Prior art keywords
- water
- soluble resin
- resin composition
- drill bit
- drilling
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Definitions
- the present invention relates to an entry sheet for drilling used for drilling a copper-clad laminate or a multilayer board.
- a metal support foil alone or a sheet having a resin composition layer formed on the surface of the metal support foil (hereinafter, this sheet is generally referred to as “entry sheet for drilling” in this specification) is used for drilling. The method of doing is generally employed.
- Patent Document 1 proposes a drilling method using a sheet made of a water-soluble resin such as polyethylene glycol.
- a drilling lubricant sheet in which a water-soluble resin layer is formed on a metal foil is proposed.
- Patent Document 3 proposes an entry sheet for punching in which a water-soluble resin layer is formed on an aluminum foil on which a thermosetting resin thin film is formed.
- the demands for copper-clad laminates and multilayer boards, which are printed wiring board materials, are to increase the density, improve productivity, and reduce costs. Specifically, as described below, drilling with improved hole positioning accuracy Workability is required.
- the increase in the density of printed wiring boards is manifested in the transition of the minimum hole diameter.
- the diameter has been reduced to 0.3 mm, 0.25 mm, and 0.2 mm, and those with 0.15 mm and 0.105 mm are drilled.
- laser drilling is adopted for those having a minimum hole diameter of 0.08 mm, 0.075 mm, 0.06 mm, and 0.05 mm. This is because the ultra-small diameter drill bit made of cemented carbide is brittle and easy to break, so the conventional drill hole entry sheet is likely to break the ultra-small diameter drill bit.
- the conventional technique has not been able to prevent drill bits from being broken and drilling holes with high positional accuracy in an extremely small diameter region.
- the drill bit with the resin attached may cause center runout as a result of the center of gravity deviating from its axis during rotation, which may impair the drilling position accuracy.
- the ultra-small diameter drill bit is easy to run out of core due to a small amount of resin wrapped around it.
- the resin dropping position is the same as the drilling position, the drill bit hits the dropped resin, impairing the centripetal property and causing the hole position accuracy to deteriorate or the drill bit to be broken. For this reason, it is necessary to dramatically reduce the amount of resin wrapped around the drill bit with an extremely small diameter drill bit.However, with an extremely small diameter drill bit, the spiral groove that discharges the cut material is thin and shallow, so the resin is applied to the drill bit. It is easy to wind up and cannot be solved by the prior art.
- the said centripetal property refers to the straightness of the cutting direction at the time of cutting.
- the market demands for productivity improvement and cost reduction have much different strength than before, further improving the hole position accuracy and increasing the number of copper clad laminates and multilayer boards that can be punched at once. It was necessary to increase the cost, and it was required to reduce the cost by increasing the productivity and suppressing the investment amount of the drilling machine.
- the conventional technique cannot solve both the cost and the number of stacked sheets that are much more strict than those in the past. Note that increasing the number of stacked sheets means that the position of the hole at the top and bottom of the copper-clad laminate or multilayer board is kept good, as long as the drill bit blade length permits, Refers to stacking boards.
- the object of the present invention is to prevent drill bit breakage, excellent hole position accuracy, and prevent drilling of resin to the drill bit as compared with the conventional drill hole entry sheet. Is to provide an entry sheet.
- the present inventors have found that the surface state of the resin composition layer on the drill bit entry surface, in particular, the average particle diameter of the crystal grains of the water-soluble resin composition and its It was noted that the standard deviation and the surface roughness Sm (average interval of irregularities) of the entrance surface of the drill bit of the resin composition layer are important. And by specifying the cooling conditions at the time of manufacture, the crystallinity of the water-soluble resin composition can be controlled. As a result, a large number of dense crystals with small crystal grains and small standard deviation can be generated, and the surface roughness It was found that Sm can be reduced.
- the present invention has been made based on such findings, and the gist thereof is as follows.
- An entry sheet for drilling in which a layer having a thickness of 0.02 to 0.3 mm made of a crystalline water-soluble resin composition is formed on at least one surface of a metal support foil, the water-soluble resin
- the crystal grains of the composition have an average particle size in the range of 5 to 70 ⁇ m, a standard deviation of 25 ⁇ m or less, and a surface roughness Sm of the drill bit entry surface of the layer made of the water-soluble resin composition of 8 ⁇ m or less.
- the layer made of the water-soluble resin composition is a solution containing the water-soluble resin composition after the heat-dissolved material of the water-soluble resin composition is directly applied on the metal supporting foil.
- the crystal grains of the water-soluble resin composition have an average particle diameter in the range of 5 to 40 ⁇ m and a standard deviation of 17 ⁇ m or less, and the layer made of the water-soluble resin composition has a drill bit entry surface.
- the water-soluble resin composition contains a water-soluble resin (A), and further includes a hydrophobic substance (B1), a substance (B2) having a higher melting point than the water-soluble resin (A), and the above
- the drill drilling entry sheet of the present invention can produce a large number of dense crystals with small crystal grains and small standard deviation in the water-soluble resin composition layer, and can reduce the surface roughness Sm. As a result, the hole can be drilled with high positional accuracy and the resin wound around the drill bit can be reduced. As a result, breakage of the drill bit during drilling can be greatly reduced. As a result, it is possible to perform drilling with high quality and excellent productivity.
- the drill hole entry sheet of the present invention has a drill hole in which a layer made of a water-soluble resin composition having crystallinity (hereinafter referred to as “water-soluble resin composition layer”) is formed on at least one surface of a metal support foil. Entry sheet for opening.
- water-soluble resin composition layer a layer made of a water-soluble resin composition having crystallinity
- the entry sheet for drilling for the water-soluble resin composition, crystal grains having a specific range of particle diameters and a specific range of standard deviation are present on the surface of the entry sheet, and the drill bit enters When the surface has a surface roughness Sm in a specific range, it is possible to contribute to improving the hole position accuracy during drilling, reducing the winding of the resin, and preventing breakage of the drill bit.
- the average particle diameter of the crystal grains of the water-soluble resin composition needs to be in the range of 5 to 70 ⁇ m, and preferably in the range of 5 to 50 ⁇ m, from the viewpoint of improving the hole position accuracy during drilling.
- the range of 5 to 40 ⁇ m is more preferable, the range of 5 to 30 ⁇ m is more preferable, the range of 5 to 20 ⁇ m is particularly preferable, and the range of 5 to 10 ⁇ m is most preferable.
- the average grain size of the crystal grains is less than 5 ⁇ m, the surface of the water-soluble resin composition becomes too uniform, the cutting edge at the tip of the drill bit slides, and the biting property with respect to the entry sheet surface decreases, resulting in centripetalization.
- FIG. 2 is a diagram schematically showing a state when drilling is performed using a conventional drill hole entry sheet
- FIG. 3 is a drill hole entry sheet according to the present invention. It is the figure which showed typically the state when performing a drilling process using.
- the water-soluble resin composition layer 2 according to the present invention is used, the crystal grains 2a to 2g constituting the water-soluble resin composition layer 2 corresponding to the size of the drill bit tip 1 are shown in FIG. Since the average particle diameter is optimized, the bite between the drill bit tip 1 and the water-soluble resin composition layer 2 is good, and the hole position accuracy can be improved.
- the crystal grains 20a to 20c constituting the resin composition layer 20 are larger than the size of the tip 1 of the drill bit as shown in FIG. Therefore, the tip 1 of the drill bit may slip on the surface of each crystal grain 20a to 20c, impair the centripetal property, and deteriorate the hole position accuracy.
- the particle diameter of the crystal grains of the water-soluble resin composition in the present invention is the water-soluble resin composition layer as observed from the vertical upper part of the entry sheet. It is the maximum diameter among the crystal grains present on the surface.
- the surface of the resin composition layer of the entry sheet for drilling is measured with a V-LASER microscope (model number VK-9700, KEYENCE CORPORATION). The maximum diameter of 50 arbitrarily selected crystal grains was measured with the same microscope, and the average value (number average) was determined as the average particle diameter of the water-soluble resin composition. To do. In the present invention, the calculation is performed excluding those having a crystal grain size of less than 1 ⁇ m.
- the crystal grain size of the water-soluble resin composition is optimized, and the standard deviation of the average grain size of the crystal grain is 25 ⁇ m or less. It is necessary that it is 20 ⁇ m or less, more preferably 17 ⁇ m or less, further preferably 15 ⁇ m or less, particularly preferably 10 ⁇ m or less, and most preferably 5 ⁇ m or less.
- the reason for limiting the standard deviation is that the criticality has been found in experiments, and even if the average grain size of the crystal grains is small, if the standard deviation exceeds 25 ⁇ m, particles having large diameters are scattered. This is because the unevenness is large and there is a concern about the deterioration of the hole position accuracy.
- the surface of the resin composition layer of the entry sheet for drilling is applied to a V-LASER microscope (model number VK-9700, KEYENCE-CORPORATION).
- the maximum diameter of 50 arbitrarily selected crystal grains is measured with the same microscope, and the average value is calculated. Furthermore, the standard deviation in each maximum diameter of 50 measured crystal grains can be calculated.
- the layer made of the water-soluble resin composition has a surface roughness of the drill bit entry surface, more specifically, an average interval of irregularities defined in JIS-B0601-1994: Sm is 8 ⁇ m or less. In short, it is preferably 7 ⁇ m or less, more preferably 6 ⁇ m or less, further preferably 5 ⁇ m or less, and most preferably 4 ⁇ m or less.
- Sm is 8 ⁇ m or less. In short, it is preferably 7 ⁇ m or less, more preferably 6 ⁇ m or less, further preferably 5 ⁇ m or less, and most preferably 4 ⁇ m or less.
- the criticality has been found in the experiment, and when the thickness exceeds 8 ⁇ m, the penetration of the drill bit into the entry sheet surface is affected by the unevenness of the surface and impairs the centripetality. .
- the surface of the resin composition layer is observed with a V-LASER microscope (model number VK-9700, KEYENCE-CORRORATION) in a 200-fold field of view, Noise removal and inclination correction (surface inclination correction and height range automatic correction) are performed, and the surface roughness (JIS-B0601: 1994 line roughness) of an evaluation length of 500 ⁇ m in an arbitrary direction in the observed image is measured.
- the same measurement can be performed at five points in the same observation image, and the average value can be set as the Sm.
- the water-soluble resin composition layer used in the entry sheet for drilling according to the present invention is a method in which a hot melt of a water-soluble resin composition is directly applied on the metal supporting foil and cooled, or A solution containing a water-soluble resin composition is applied by a coating method or the like, dried and cooled.
- the water-soluble resin composition used for the entry sheet for drilling according to the present invention is a composition containing a water-soluble resin (A) and has crystallinity.
- a mixture of the water-soluble resin (A) and other substances is exemplified.
- other substances various inorganic compounds, organic compounds, mixtures, composites, complexes, low molecular substances, monomers, oligomers, high molecular substances, polymers, natural resins, fibers, minerals, hydrophobic substances, hydrophilic substances For example.
- the type of the water-soluble resin (A) is not particularly limited as long as it is a water-soluble resin having crystallinity, but is preferably a water-soluble resin having high crystallinity, for example, polyalkylene oxide, poly It is preferable that it is 1 or more types selected from the group which consists of polyester of sodium acrylate, polyacrylamide, carboxymethylcellulose, polytetramethylene glycol, and polyalkylene glycol.
- the polyalkylene oxide include polyethylene oxide and polypropylene oxide. Furthermore, polyethylene oxide that does not cause steric hindrance in the molecular structure is more preferable.
- Polyester of polyalkylene glycol is a condensate obtained by reacting polyalkylene glycol and dibasic acid.
- polyethylene glycol polyethylene glycol, polypropylene glycol, polytetramethylene glycol and glycols exemplified by these copolymers are preferable.
- the dibasic acid is preferably selected from phthalic acid, isophthalic acid, terephthalic acid, sebacic acid, partial esters of polyvalent carboxylic acids such as pyromellitic acid, acid anhydrides, and the like.
- a condensate having polyethylene glycol as the main chain that does not cause steric hindrance in the molecular structure is more preferable.
- the water-soluble resin composition of the present invention comprises a water-soluble resin (A), a hydrophobic substance (B1), a substance (B2) having a higher melting point than the water-soluble resin (A), and the water-soluble resin. It is preferable that it is a composition which consists of at least 1 type of the substance (B3) which improves compatibility with (A) and a solvent.
- the hydrophobic substance (B1) When the hydrophobic substance (B1) is blended in the water-soluble resin composition, the hydrophobic substance (B1) is dispersed in the water-soluble resin composition, and the water-soluble resin composition is solidified by cooling. Since the hydrophobic substance (B1) is hydrophobic, it acts as a nucleus for crystal formation, and a large number of crystal grains of the water-soluble resin composition can be precipitated.
- a substance (B2) having a melting point higher than that of the water-soluble resin (A) By mixing the water-soluble resin composition with a substance (B2) having a melting point higher than that of the water-soluble resin (A), a difference occurs in the solidification rate when the water-soluble resin composition is solidified by cooling. be able to.
- the action of solidifying the substance (B2) having a high melting point at an early timing functions as a nucleus for crystal formation, and a large number of crystal grains of the water-soluble resin composition can be precipitated.
- the substances (B2) having a higher melting point than the water-soluble resin (A) there are substances that not only make the crystal grains smaller, but also have a high effect of reducing the surface roughness Sm of the water-soluble resin composition layer. is there.
- a substance (B3) that enhances the compatibility between the water-soluble resin (A) and the solvent the hydroxy group contained in the molecular structure of (B3) is added to the water-soluble resin.
- the hydrophobic substance (B1), the substance (B2) having a higher melting point than the water-soluble resin (A), and the substance (B3) that enhances the compatibility between the water-soluble resin (A) and the solvent are all used. Even if it comprises a single substance, it may comprise a mixture of two or more substances. Furthermore, the hydrophobic substance (B1), the substance (B2) having a higher melting point than the water-soluble resin (A), and the substance (B3) that enhances the compatibility between the water-soluble resin (A) and the solvent are used in combination. It is also possible to do.
- the hydrophobic substance (B1), the substance (B2) having a higher melting point than the water-soluble resin (A), and the substance (B3) that enhances the compatibility between the water-soluble resin (A) and the solvent are the water-soluble substances. It is necessary to add 0.1 to 5 parts by weight in total with respect to 100 parts by weight of the resin (A), preferably 0.1 to 3 parts by weight, preferably 0.2 parts by weight. More preferably, 3 parts by weight is blended, and 0.2-2 parts by weight is particularly preferred. This is because if the amount is less than 0.1 parts by weight, it may be difficult to achieve a dense crystal formation effect, while if it exceeds 5 parts by weight, there is no economic rationality. It is reasonable to select substances (B1, B2, B3) that exert an effect in a small amount.
- the hydrophobic substance (B1) is not particularly limited as long as it is hydrophobic.
- hydrophobic polymers long chain alcohols, hydrophobic polysaccharides and inorganic compounds can be used.
- a thermoplastic polymer urethane-based, silicon-based, acrylic-based polymers and copolymers thereof, polyetherimide, polyimide, polyvinyl chloride-vinyl acetate, polyamides, polypropylene, polyvinyl acetate , Polybutene, polymethacrylamide, powdered cellulose, cellulose derivatives, polyvinyl ether, phenoxy resin, ethylene-vinyl alcohol copolymer resin, polytetrafluoroethylene powder and fine particles, and thermosetting polymers such as epoxy resin, silicon Resin, phenol resin, urea resin, acrylic resin, polyethylene glycol dimethacrylate resin, bismaleimide resin, bismaleimide triazine resin, cyanate resin, benzoguanamine resin, etc
- Examples of such compounds include lauryl alcohol, cetanol, stearyl alcohol, oleyl alcohol, linoleyl alcohol and the like, and inorganic compounds include talc, molybdenum disulfide, zinc molybdate, graphite, tungsten disulfide, graphite fluoride, boron nitride. These materials may be used, and one or more of these may be used in appropriate mixture. Further, stearyl alcohol, zinc molybdate, graphite, boron nitride and the like are more preferable as the hydrophobic substance (B1) that enhances the effect of the present invention. This is because these are highly dispersible in the water-soluble resin composition solution.
- the substance (B2) having a higher melting point than the water-soluble resin (A) is not particularly limited as long as the melting point is higher than that of the resin (A).
- amino acids, organic acids, organic acid salts, organic salts, organic phosphates, polysaccharides, rosins and inorganic compounds can be used.
- examples of amino acids include sodium glutamate
- examples of organic acids include malic acid, malonic acid, succinic acid, fumaric acid, maleic acid, cyanuric acid, and the like
- organic acid salts include malic acid
- examples include metal salts of organic acids such as malonic acid, succinic acid, fumaric acid, maleic acid, formic acid, acetic acid, propionic acid, stearic acid, and cyanuric acid.
- examples of organic salts include melamine cyanurate, and organic phosphorus.
- acid salts include adenosine triphosphate sodium salt
- polysaccharides include cellulose, chitin, starch, glycogen, agarose, pectin and the like
- rosins include tall rosin, tall oil fatty acid and the like
- inorganic Examples of the compound include sodium chloride, sodium sulfate, magnesium sulfate and the like.
- substance (B2) having a higher melting point than the water-soluble resin (A) that enhances the effect of the present invention sodium glutamate, succinic acid, sodium formate, calcium formate, sodium stearate, calcium stearate, cellulose and the like are more. preferable.
- Examples of the substance (B3) that enhances the compatibility between the water-soluble resin (A) and the solvent include polyhydric alcohols having a hydroxy group in the molecular structure, sugar alcohols, amino acid derivative alcohols, and the like.
- polyhydric alcohol polymers such as polyethylene glycol included in the water-soluble resin (A) are excluded, but as the polyhydric alcohol other than the polymer, trimethylolpropane, pentaerythritol, neopentylglycol, trimethylolethane and the like can be mentioned.
- sugar alcohols include sorbitol, xylitol, and inositol.
- amino acid derivative alcohols examples include oxyaniline, oxytoluidine, tyrosine, and aminodeoxy sugar.
- pentaerythritol, sorbitol, xylitol, inositol, etc. are more preferable as the substance (B3) for improving the compatibility between the water-soluble resin (A) and the solvent for enhancing the effect of the present invention.
- the thickness of the water-soluble resin composition layer varies depending on the diameter of the drill bit used for drilling and the configuration of the copper-clad laminate or multilayer board to be processed, but is usually 0.02 to 0.00. It is in the range of 3 mm, and preferably in the range of 0.02 to 0.2 mm. If the thickness of the water-soluble resin composition layer is less than 0.02 mm, a sufficient lubricating effect cannot be obtained, and the load on the drill bit is increased, and the drill bit may be broken. On the other hand, when the thickness of the water-soluble resin composition layer exceeds 0.3 mm, the winding of the resin around the drill bit may increase.
- the solution used has a boiling point lower than that of water (more preferably Is preferably a solution containing a solvent (lower by 15 ° C. or more).
- the type of the solvent having a boiling point lower than that of water is not particularly limited. Examples thereof include ethanol such as alcohols, methanol and isopropyl alcohol, and low-boiling solvents such as methyl ethyl ketone and acetone can also be used.
- the inclusion of the solvent having a boiling point lower than that of water contributes to the reduction of the crystal grain size and the surface roughness Sm, and has the effect of improving the hole position accuracy.
- Each solvent has its own characteristics. Ethanol contributes to reducing the grain size of crystal grains, and methyl ethyl ketone contributes to reducing the surface roughness Sm. Ethanol is highly effective in improving the hole position accuracy.
- As the low boiling point solvent ethanol and acetone are more preferable. In general, increasing the amount of the low-boiling solvent contributes to reducing the grain size of the crystal grains, reducing the surface roughness Sm, and reducing the standard deviation of the crystal grains. However, if the blending amount of the low boiling point solvent is continuously increased, the effect of improving the hole position accuracy is gradually saturated.
- a low boiling-point solvent is hard to express an effect, when the difference in boiling point with water is less than 15 degreeC.
- the blending ratio of the water and the solvent having a boiling point lower than that of water needs to be in the range of 90/10 to 50/50, preferably in the range of 80/20 to 50/50, and 70/30 to 50 A range of / 50 is most preferred.
- the blending ratio of the solvent having a boiling point lower than that of water is less than 10, it may be difficult to achieve a dense crystal formation effect.
- the blending ratio of the solvent having a boiling point lower than that of water exceeds 50, there is no economic rationality and there is a risk that industrial stable production may be hindered.
- the method for producing the entry sheet is not particularly limited.
- a method for kneading the water-soluble resin composition a general kneading means may be used.
- a biaxial roll a mixer, a double-arm kneader, a plunger extruder, or the like.
- kneading a water-soluble resin composition it is preferable to knead in a nitrogen atmosphere in order to suppress decomposition of the water-soluble resin composition.
- the water-soluble resin composition in order to uniformly disperse the water-soluble resin composition, it is preferable to knead the water-soluble resin composition at a temperature of 120 ° C. to 160 ° C. If the kneading temperature is less than 120 ° C, the water-soluble resin composition becomes non-uniform, which may adversely affect properties such as appearance and hole position accuracy. Decomposition may occur and may adversely affect characteristics such as hole location accuracy.
- the method of coating the water-soluble resin composition directly on the metal supporting foil is not particularly limited.
- a general coating apparatus may be used. For example, it is preferable to use a knife coater, an extrusion coater, a die coater, a curtain coater, or the like. If the thickness of the water-soluble resin composition layer is non-uniform, it may adversely affect characteristics such as hole position accuracy, so apply the heat-dissolved material of the water-soluble resin composition uniformly using the above coater. It is preferable to do.
- the coating method of the entry sheet is not particularly limited, A general coating apparatus may be used.
- a gravure coater, roll coater, knife coater, extrusion coater, die coater, curtain coater, etc. which are general coating means, are used as a coating means for making the thickness of the water-soluble resin composition layer uniform. Is preferred. If the thickness of the water-soluble resin composition layer is non-uniform, it may adversely affect characteristics such as hole position accuracy, so apply the water-soluble resin composition solution uniformly using the above method. Is preferred.
- the thickness and water content of the water-soluble resin composition layer are as follows. It is desirable to optimize by. Specifically, it is necessary to hold and dry at a temperature of 120 ° C. to 160 ° C. for 10 seconds to 600 seconds, preferably at a temperature of 120 ° C. to 160 ° C. for 10 seconds to 500 seconds. It is more preferable that the temperature is 120 ° C. to 160 ° C. for 15 seconds to 400 seconds to dry, and it is particularly preferable that the temperature is 120 ° C. to 150 ° C. for 20 seconds to 300 seconds.
- the solvent may remain inside the water-soluble resin composition layer, or the water-soluble resin composition may be Since the amount of heat necessary for melting is insufficient, there is a possibility that a non-uniform water-soluble resin composition layer is formed.
- the drying temperature is higher than 200 ° C., or when the holding time exceeds 600 seconds, the water-soluble resin composition may be decomposed, which may cause a problem in appearance.
- the concentration of the solvent remaining in the water-soluble resin composition layer obtained after drying is preferably less than 5%. .
- ultrasonic vibration or reduced pressure drying may be used in combination for drying.
- the cooling condition in the present invention is that the cooling is started at a cooling rate of 1.5 ° C./second or more within 60 seconds from the cooling start temperature of 120 ° C. to 160 ° C. to the cooling end temperature of 25 ° C. to 40 ° C. Cost.
- the cooling end temperature exceeds 40 ° C., it is not possible to achieve a reduction in crystal diameter and uniformity, which is a feature of the present application.
- the cooling time exceeds 60 seconds, it is not possible to achieve the reduction in size and uniformity of crystal grains, which is a feature of the present application.
- the cooling end temperature is lower than 15 ° C., the entry sheet is warped and may cause condensation in a subsequent process, which is not preferable.
- the cooling rate is less than 1.5 ° C./second, the cooling time becomes long and may exceed 60 seconds, which is not preferable.
- the cooling condition is that the cooling is performed at a temperature of 2 ° C./second or more within 50 seconds from a temperature of 120 ° C. to 160 ° C. It is preferable to cool at a rate of 120 ° C. to 160 ° C., a temperature of 25 ° C. to 40 ° C. within 40 seconds, more preferably at a cooling rate of 2.5 ° C./second or more, and a temperature of 120 ° C. More preferably, the temperature is decreased from ⁇ 160 ° C. to a temperature of 25 ° C. to 40 ° C. within 30 seconds at a cooling rate of 3 ° C./second or more.
- cooling is more preferable to cool at a cooling rate of 4.5 ° C./second or more within 20 seconds. From a temperature of 120 ° C. to 160 ° C. to a temperature of 25 ° C. to 40 ° C., within 15 seconds, 6 ° C./second or more Most preferably, cooling is performed at a cooling rate.
- the metal support foil used in the entry sheet for drilling of the present invention is not particularly limited as long as it is a metal material that has high adhesion to the water-soluble resin composition and can withstand the impact of a drill bit.
- the metal species of the metal supporting foil for example, aluminum can be used, and the thickness of the metal supporting foil is usually 0.05 to 0.5 mm, preferably 0.05 to 0.3 mm. If the thickness of the aluminum foil is less than 0.05 mm, burrs of the laminated plate are likely to occur during drilling, and if it exceeds 0.5 mm, it may be difficult to discharge chips generated during drilling. .
- As the material of the aluminum foil aluminum having a purity of 95% or more is preferable. 8021 and the like.
- the resin used for the resin film is not particularly limited as long as it can improve the adhesion with the water-soluble resin composition, and either a thermoplastic resin or a thermosetting resin can be used.
- the thermoplastic resin include urethane, vinyl acetate, vinyl chloride, polyester, and copolymers thereof.
- the thermosetting resin include epoxy resins and cyanate resins.
- the metal support foil a commercially available metal foil previously coated with a resin by a known method can be used.
- the entry sheet for drilling of the present invention is used when drilling a printed wiring material, for example, a copper-clad laminate or a multilayer board. Specifically, on the uppermost surface of one or more copper-clad laminates or multilayer boards, the metal support foil side is placed in contact with the printed wiring material, and the water-solubility of the drill hole entry sheet Drilling can be performed from the surface of the resin composition layer.
- polyethylene glycol may be abbreviated as “PEG” and “polyethylene oxide” may be abbreviated as “PEO”.
- Table 1 shows the specifications of the resin, solvent, additive, and metal support foil used for manufacturing the drilling entry sheets of the examples and comparative examples, and the cooling conditions, and the drill used for drilling. The condition of the drill bit diameter of the bit is shown.
- Example 1 80 parts by weight of polyethylene oxide having a number average molecular weight of 150,000 (Altop MG-150, manufactured by Meisei Chemical Co., Ltd.) and 20 parts by weight of polyethylene glycol having a number average molecular weight of 20,000 (PEG 20000, manufactured by Sanyo Chemical Industries, Ltd.) It was dissolved in water so that the solid content was 30%. Furthermore, 0.5 part by weight of sodium formate (manufactured by Mitsubishi Gas Chemical Co., Ltd.) was added to the solid content of the water-soluble resin mixture and completely dissolved.
- a bar coater was used for an aluminum foil (aluminum foil used: 1100, (thickness 0.07 mm) manufactured by Mitsubishi Aluminum Co., Ltd.) in which an epoxy resin film having a thickness of 0.01 mm was formed on one side of the water-soluble resin composition solution.
- the water-soluble resin composition layer after drying is coated to 0.03 mm, dried in a dryer at 120 ° C. for 3 minutes, and further cooled at a cooling rate of 3.1 ° C./sec.
- An entry sheet for drilling was prepared (see Table 2).
- Example 2 the water-soluble resin compositions shown in Tables 1 and 2 were prepared according to Example 1, and applied to an aluminum foil, dried, cooled, and drilled. An entry sheet for drilling was prepared and drilled.
- Example 2 80 parts by weight of polyethylene oxide having a number average molecular weight of 150,000 (Altop MG-150, manufactured by Meisei Chemical Co., Ltd.) and a number average molecular weight of 20,000 polyethylene glycol (PEG 20000, Sanyo Chemical Industries, Ltd.) 20 parts by weight was dissolved in a water / MeOH (methanol) mixed solution so that the resin solid content was 30%.
- Comparative Example 26 is a commercially available Sang-A Frontec Co. “LX120” manufactured by Ltd. and Comparative Example 27 are commercially available from Yong Li Chuan Industrial Co. “AL-100040” manufactured by Ltd., Ltd., and Comparative Example 29 are commercially available from Uniplus Electronics Co. “LAE-1007” manufactured by Ltd. was used.
- Table 3 shows the results of the average particle diameter ( ⁇ m) of crystal grains of the water-soluble resin composition, the standard deviation ( ⁇ m) of the crystal grain diameter, and the surface roughness Sm ( ⁇ m) of the entry sheet.
- FIG. 1 also shows the surface state of the water-soluble resin composition layer for specific samples (Examples 2, 3, 10, 12, and 19 and Comparative Examples 2, 10, 20, 26, and 28). And show.
- Drilling processing In order to evaluate each obtained sample, drilling was performed under the following conditions. Drilling with a drill bit diameter of 0.15 mm ⁇ was performed by stacking four copper-clad laminates (CCL-HL832, copper foil both sides 12 ⁇ m, manufactured by Mitsubishi Gas Chemical Co., Ltd.) with a thickness of 0.2 mm.
- a water-soluble resin composition layer is placed on top, and a backing plate (bake plate) is placed on the lower side of the stacked copper-clad laminate, and a drill bit: 0.15 mm ⁇ (NEU L004 0.15 ⁇ 2.5 Union) Tool Co., Ltd.), rotation speed: 200,000 rpm, feed rate: 20 ⁇ m / rev. Under these conditions, 20 drill holes were drilled at 3,000 hits per drill bit.
- Drilling with a drill bit diameter of 0.105mm ⁇ was performed by stacking six sheets of 0.1mm thick copper clad laminate (CCL-HL832HS, copper foil on both sides 5 ⁇ m, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and water-soluble resin The composition layer is placed on top, and a backing plate (baked plate) is placed on the lower side of the stacked copper-clad laminate.
- Drill bit 0.105 mm ⁇ (KMC L518A 0.105x1.8 Union Two Co., Ltd.) Manufactured), rotation speed: 330,000 rpm, feed rate: 8 ⁇ m / rev. Under these conditions, 20 drill holes were drilled at 3,000 hits per drill bit.
- Drilling of drill bit 0.08mm ⁇ is performed by stacking 4 sheets of 0.1mm thick copper clad laminate (CCL-HL832HS, copper foil both sides 5 ⁇ m, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and water-soluble resin composition Place the object layer up, and place a backing plate (bake plate) on the lower side of the stacked copper clad laminate and drill bit: 0.08mm ⁇ (KMV J948 0.08x1.2 made by Union Tool Co., Ltd.) ), Rotation speed: 330,000 rpm, feed rate: 6 ⁇ m / rev. Under these conditions, 20 drill holes were drilled at 3,000 hits per drill bit.
- CCL-HL832HS copper foil both sides 5 ⁇ m, manufactured by Mitsubishi Gas Chemical Co., Ltd.
- water-soluble resin composition Place the object layer up, and place a backing plate (bake plate) on the lower side of the stacked copper clad laminate and drill bit: 0.08mm ⁇ (KMV J948 0.08x1.2 made by Union Tool Co., Ltd.) ),
- A Crystal grain average grain size 40 ⁇ m or less / Standard deviation of grain average grain size 17 ⁇ m or less / Surface roughness Sm 7 ⁇ m or less, hole position accuracy 23 ⁇ m or less, drill bit breakage, no resin winding
- ⁇ Crystal Average grain size of 70 ⁇ m or less / standard deviation of average grain size of crystal grain of 25 ⁇ m or less / surface roughness Sm of 8 ⁇ m or less, hole position accuracy of 25 ⁇ m or less, no breakage of drill bit, no wrapping of resin
- ⁇ average of crystal grains Grain size / standard deviation of mean grain size of crystal grain / surface roughness Sm does not satisfy claims, hole position accuracy is 25 ⁇ m or less, drill bit is not broken, resin is not wound x: average grain size Diameter / standard deviation of average grain size / surface roughness Sm does not satisfy claims, hole position accuracy exceeds 25 ⁇ m, drill bit is not broken, resin is not wound
- Table 4 shows an excerpt of Example 20 and Comparative Example 21 in which drilling with a drill bit diameter of 0.08 mm was performed from Tables 2 and 3, and from the results of Table 4, the drill bit When processing with a diameter of 0.08 mm, due to the rapid cooling effect in producing a layer made of the water-soluble resin composition, the average grain size and its standard deviation, surface roughness Sm, hole position accuracy, and It can be seen that the resin wrapping shows excellent results.
- Table 5 is an extract of Examples 5 and 6 and Comparative Example 22 that were drilled with a drill bit diameter of 0.105 mm from Tables 2 and 3, but from the results of Table 5.
- the drill bit diameter of 0.105 mm is processed, the average grain size and its standard deviation, the surface roughness Sm, the hole position due to the rapid cooling effect in producing the layer made of the water-soluble resin composition It can be seen that excellent results are shown for accuracy and resin wrapping.
- an entry sheet for drilling that has excellent hole position accuracy and less resin that wraps around the drill bit and reduces breakage of the drill bit as compared with the conventional drill hole entry sheet. And in the extremely small diameter area that was previously the area of laser drilling, drilling with high positional accuracy, reducing the amount of resin wrapped around the drill bit, and reducing the breakage of the drill bit, reduced costs and production This contributes to the improvement of productivity, and its industrial utility value is extremely high.
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Abstract
Description
加えて、グローバル化による競争の激化と新興国需要を取り込むべく、生産性向上及びコスト低減については、これまでより格段に強く要求されている。そのため、孔位置精度をさらに向上させ、一度に孔あけできる重ね枚数を増やせるように、より孔位置精度に優れたドリル孔あけ用エントリーシートの開発が切望されている。
(1)金属支持箔の少なくとも片面に、結晶性の水溶性樹脂組成物からなる厚さ0.02~0.3mmの層が形成されたドリル孔あけ用エントリーシートであって、前記水溶性樹脂組成物の結晶粒は、平均粒径が5~70μmの範囲で、その標準偏差が25μm以下であり、前記水溶性樹脂組成物からなる層のドリルビット進入面の表面粗さSmが8μm以下であり、前記水溶性樹脂組成物からなる層は、前記金属支持箔上に、直接、前記水溶性樹脂組成物の熱溶解物を塗工した後、又は、前記水溶性樹脂組成物を含有する溶液を塗工して乾燥させた後、120℃~160℃の温度から60秒以内に25℃~40℃の温度へと、1.5℃/秒以上の冷却速度で冷却して形成されることを特徴とするドリル孔あけ用エントリーシート。
また、前記水溶性樹脂組成物の結晶粒径の平均値を測定する方法としては、ドリル孔あけ用エントリーシートの樹脂組成物層の表面を、V-LASER顕微鏡(型番VK-9700、KEYENCE CORPORATION)を用いて200倍の視野で観察し、任意に選択した50個の結晶粒の各最大直径について同顕微鏡により実測し、その平均値(個数平均)を前記水溶性樹脂組成物の平均粒径とする。なお、本発明では、結晶粒径が1μm未満のものは除外して算出している。
前記ポリアルキレンオキサイドの例としては、ポリエチレンオキサイド、ポリプロピレンオキサイドなどが好ましい。さらには分子構造中に立体障害を生じないポリエチレンオキサイドが、より好ましい。ポリアルキレングリコールのポリエステルとは、ポリアルキレングリコールと二塩基酸とを反応させて得られる縮合物である。ポリアルキレングリコールの例としては、ポリエチレングリコール、ポリプロピレングリコール、ポリテトラメチレングリコールやこれらの共重合物で例示されるグリコール類などが好ましい。また二塩基酸として、フタル酸、イソフタル酸、テレフタル酸、セバシン酸、及び、ピロメリット酸などの多価カルボン酸の部分エステル、酸無水物、等から選択することが好ましい。さらには、分子構造中に立体障害を生じないポリエチレングリコールを主鎖とする縮合物が、より好ましい。
前記水溶性樹脂組成物に、該水溶性樹脂(A)よりも融点の高い物質(B2)を配合することで、前記水溶性樹脂組成物が冷却で固化する際の固化速度に差が生じさせることができる。すなわち、融点の高い物質(B2)が早いタイミングで固化する作用は、結晶生成の核として機能し、前記水溶性樹脂組成物の結晶粒を小さく多数析出させることができる。前記水溶性樹脂(A)よりも融点の高い物質(B2)のなかには、結晶粒を小さくするだけでなく、さらに、前記水溶性樹脂組成物層の表面粗さSmを低減させる効果の高い物質がある。
前記水溶性樹脂組成物に、該水溶性樹脂(A)と溶媒との相溶性を高める物質(B3)を配合することで、(B3)の分子構造に含まれるヒドロキシ基が、該水溶性樹脂(A)を溶媒中に均一に分散させるため、水溶性樹脂組成物が乾燥、冷却で固化する際に、結晶粒を小さく多数生成させることができる。また、前記水溶性樹脂(A)と溶媒との相溶性を高める物質(B3)の中には、結晶粒を小さくするだけでなく、前記水溶性樹脂組成物層の表面粗さSmを低減させる効果の高い物質がある。
前記水溶性樹脂組成物を混練する方法は、一般的な混練手段を用いて構わず、例えば、2軸ロール、ミキサー、双腕式ニーダー、プランジャー押出機等を用いることが好ましい。また、水溶性樹脂組成物を混練する際、水溶性樹脂組成物の分解を抑制するため、窒素雰囲気下で混練することが好ましい。さらに、前記水溶性樹脂組成物を均一に分散させるために、水溶性樹脂組成物を120℃~160℃の温度で混練することが好ましい。混練の温度が120℃未満の場合、水溶性樹脂組成物が不均一になり、外観および孔位置精度等の特性に悪影響を及ぼす可能性があり、160℃を超える場合、水溶性樹脂組成物の分解が起こり、孔位置精度等の特性に悪影響を及ぼす可能性がある。
一般的なコーティング装置を使用してよく、例えば、ナイフコーター、押出コーター、ダイコーター、カーテンコーター等を用いることが好ましい。水溶性樹脂組成物層の厚みが不均一の場合、孔位置精度等の特性に悪影響を及ぼす可能性があるため、上記コーターを用いて、水溶性樹脂組成物の熱溶解物を均一に塗工することが好ましい。
具体的には、温度120℃~160℃を、10秒~600秒間保持して乾燥させることを要し、温度120℃~160℃を、10秒~500秒間保持して乾燥させることが好ましく、温度120℃~160℃を、15秒~400秒間保持して乾燥させることがより好ましく、温度120℃~150℃を、20秒~300秒間保持して乾燥させることが特に好ましい。乾燥温度が120℃未満の場合、又は、乾燥温度での保持時間が10秒未満の場合、水溶性樹脂組成物層の内部に溶媒が残留する可能性があり、あるいは、水溶性樹脂組成物を溶融させるために必要な熱量が不足するため、不均一な水溶性樹脂組成物層になる可能性がある。一方、乾燥温度が200℃を超えて高い場合、又は、保持時間が600秒を超えた場合には、前記水溶性樹脂組成物の分解を生じ、外観に問題が生じるおそれがある。
なお、水溶性樹脂組成物の溶液を、金属支持箔の上に塗工し、乾燥する際、乾燥後に得られる水溶性樹脂組成物層に残留する溶媒濃度は、5%未満であることが好ましい。
前記冷却終了温度が40℃を超える場合、本願の特徴である結晶粒の小径化及び均一化を達成できない。同様に、前記冷却時間が60秒を超えた場合にも、本願の特徴である結晶粒の小径化及び均一化を達成できない。一方、前記冷却終了温度が15℃を超えて低い場合には、前記エントリーシートに反りが生じ、また、後工程で結露の原因になることがあるため好ましくない。前記冷却速度が1.5℃/秒未満の場合、冷却時間が長くなり、60秒を超えるおそれがあるため好ましくない。
<実施例1>
数平均分子量 150,000のポリエチレンオキサイド(アルトップMG-150、明成化学工業株式会社製) 80重量部と数平均分子量 20,000ポリエチレングリコール(PEG20000、三洋化成工業株式会社製) 20重量部を樹脂固形分が30%になるように、水に溶解させた。さらに、この水溶性樹脂混合物の固形分に対して0.5重量部のギ酸ナトリウム(三菱ガス化学株式会社製)を添加し完全に溶解させた。この水溶性樹脂組成物の溶液を片面に厚み0.01mmのエポキシ樹脂皮膜を形成したアルミニウム箔(使用アルミニウム箔:1100、(厚さ0.07mm)三菱アルミニウム株式会社製)にバーコーターを用いて乾燥後の水溶性樹脂組成物層が0.03mmになるように塗工し、乾燥機にて120℃、3分間乾燥させ、さらに3.1℃/秒の冷却速度で冷却することで、ドリル孔あけ用エントリーシートを作製した(表2を参照。)。
得られたドリル孔あけ用エントリーシートを、厚さ 0.1mmの銅張積層板(CCL-HL832HS、銅箔両面5μm、三菱ガス化学株式会社製)を 6枚重ねた上に、水溶性樹脂組成物の層を上にして配置し、重ねた銅張積層板の下側には当て板(ベーク板)を配置してドリルビット:0.105mmφ(KMC L518A 0.105x1.8 ユニオンツール株式会社製)、回転数:330,000rpm、送り速度:8μm/rev.の条件でドリルビット1本につき 3,000hitsで、20本のドリル孔あけ加工を行った(表2を参照。)。
そして、表3に、水溶性樹脂組成物の結晶粒の平均粒径(μm)、結晶粒径の標準偏差(μm)、エントリーシートの表面粗さSm(μm)の結果を示す。
実施例2~20及び比較例1~36については、実施例1に準じて、表1及び表2に示す水溶性樹脂組成物を調製し、アルミニウム箔に塗工、乾燥、冷却して、ドリル孔あけ用エントリーシートを作製し、孔あけ加工を行った。
例えば、実施例2では、数平均分子量 150,000のポリエチレンオキサイド(アルトップMG-150、明成化学工業株式会社製) 80重量部と数平均分子量 20,000ポリエチレングリコール(PEG20000、三洋化成工業株式会社製)20重量部を樹脂固形分が30%になるように、水/MeOH(メタノール)混合溶液に溶解させた。この時の水とMeOHとの比率を90重量部/10重量部としている。このように、水よりも沸点の低い低沸点溶媒を用いる例もある。
なお、比較例26は、市販のSang-A Flontec Co.,Ltd製「LX120」、比較例27は、市販のYong Li Chuan Industrial Co.,Ltd製「AL-100040」、比較例29は、市販のUniplus Electronics Co.,Ltd製「LAE-1007」を用いた。
そして、表3に、水溶性樹脂組成物の結晶粒の平均粒径(μm)、結晶粒径の標準偏差(μm)、エントリーシートの表面粗さSm(μm)の結果を示す。また、図1に、特定のサンプル(実施例2、3、10、12及び19、並びに、比較例2、10、20、26及び28)についての、水溶性樹脂組成物層の表面状態を拡大して示す。
実施例及び比較例で作製したドリル孔あけ用エントリーシートの各サンプルについて、以下の評価を行った。
(孔あけ加工)
得られた各サンプルについて評価を行うべく、以下の条件で孔あけ加工を行った。
ドリルビット径0.15mmφの孔あけ加工は、厚さ 0.2mmの銅張積層板(CCL-HL832、銅箔両面 12μm、三菱ガス化学株式会社製)を 4枚重ねた上に、各サンプルの水溶性樹脂組成物の層を上にして配置し、重ねた銅張積層板の下側には当て板(ベーク板)を配置してドリルビット:0.15mmφ(NEU L004 0.15x2.5 ユニオンツール株式会社製)、回転数:200,000rpm、送り速度:20μm/rev.の条件でドリルビット1本につき 3,000hitsで、20本のドリル孔あけ加工を行った。
ドリルビット径0.105mmφの孔あけ加工は、厚さ 0.1mmの銅張積層板(CCL-HL832HS、銅箔両面5μm、三菱ガス化学株式会社製)を 6枚重ねた上に、水溶性樹脂組成物の層を上にして配置し、重ねた銅張積層板の下側には当て板(ベーク板)を配置してドリルビット:0.105mmφ(KMC L518A 0.105x1.8 ユニオンツー株式会社製)、回転数:330,000rpm、送り速度:8μm/rev.の条件でドリルビット1本につき 3,000hitsで、20本のドリル孔あけ加工を行った。
ドリルビット0.08mmφの孔あけ加工は、厚さ 0.1mmの銅張積層板(CCL-HL832HS、銅箔両面5μm、三菱ガス化学株式会社製)を 4枚重ねた上に、水溶性樹脂組成物の層を上にして配置し、重ねた銅張積層板の下側には当て板(ベーク板)を配置してドリルビット:0.08mmφ(KMV J948 0.08x1.2 ユニオンツール株式会社製)、回転数:330,000rpm、送り速度:6μm/rev.の条件でドリルビット1本につき3,000hitsで、20本のドリル孔あけ加工を行った。
積み重ねた銅張積層板の最下板の裏面における3,000hitsの孔位置と、指定座標とのズレをホールアナライザー(型番HA-1AM、日立ビアメカニクス株式会社製)を用いて測定し、ドリルビット1本分ごとに平均値及び標準偏差(σ)を計算し、平均値+3σを算出した。そして、ドリル孔あけ加工20回分の“平均値+3σ”の平均値について算出した。
表3に孔位置精度の評価結果を示す。また、図4、図5、及び、図6に、それぞれ、結晶粒の平均粒径、結晶平均粒径の標準偏差及び表面粗さSmと、孔位置精度との関係についてのグラフを示す。
3,000 hitsの孔あけ加工後のドリルビット 20本のそれぞれについて、倍率25倍のマイクロスコープ(型番VHK-100、株式会社キーエンス製)を用いて、ドリルビット径に対する樹脂の巻き付き量を観察した。観察した結果について以下の基準に基づいて評価を行い、評価結果を表3に示す。
○: 樹脂の巻き付いた最大直径が、ドリルビット直径の1.5倍未満である
△: 樹脂の巻き付いた最大直径が、ドリルビット直径の1.5倍以上である
×: ドリルビットに巻き付いた樹脂が、孔あけ加工中にエントリーシート表面に落下する
ドリルビット20本を使用して孔あけ加工を行い、ドリルビットの折損数を数えた。表3にドリルビット折損数の結果を示す。
◎ :結晶粒の平均粒径40μm以下/結晶粒の平均粒径の標準偏差17μm以下/表面粗さSm7μm以下で、孔位置精度が23μm以下、ドリルビットの折損なし、樹脂の巻き付きなし
○ :結晶粒の平均粒径70μm以下/結晶粒の平均粒径の標準偏差25μm以下/表面粗さSm8μm以下で、孔位置精度が25μm以下、ドリルビットの折損なし、樹脂の巻き付きなし
△ :結晶粒の平均粒径/結晶粒の平均粒径の標準偏差/表面粗さSmが、クレーム要件を満足せず、 孔位置精度が25μm以下、ドリルビットの折損なし、樹脂の巻き付きなし
× :結晶粒の平均粒径/結晶粒の平均粒径の標準偏差/表面粗さSmが、クレーム要件を満足せず、孔位置精度が25μm超、ドリルビットの折損なし、樹脂の巻き付きなし
××:結晶粒の平均粒径/結晶粒の平均粒径の標準偏差/表面粗さSmが、クレーム要件を満足せず、ドリルビットの折損あり、ないしは、樹脂の巻き付きあり
また、前記水溶性樹脂組成物の結晶粒径の平均粒径及びその標準偏差が小さい場合には、孔位置精度が優れる傾向があり、前記エントリーシートの表面粗さSmが小さい場合には、樹脂の巻き付きが低減される傾向があることがわかった。
2、20 樹脂組成物層
3 金属支持箔
Claims (6)
- 金属支持箔の少なくとも片面に、結晶性の水溶性樹脂組成物からなる厚さ0.02~0.3mmの層が形成されたドリル孔あけ用エントリーシートであって、
前記水溶性樹脂組成物の結晶粒は、平均粒径が5~70μmの範囲で、その標準偏差が25μm以下であり、
前記水溶性樹脂組成物からなる層のドリルビット進入面の表面粗さSmが8μm以下であり、
前記水溶性樹脂組成物からなる層は、前記金属支持箔上に、直接、前記水溶性樹脂組成物の熱溶解物を塗工した後、又は、前記水溶性樹脂組成物を含有する溶液を塗工して乾燥させた後、120℃~160℃の温度から60秒以内に25℃~40℃の温度へと、1.5℃/秒以上の冷却速度で冷却して形成されることを特徴とするドリル孔あけ用エントリーシート。 - 前記水溶性樹脂組成物の結晶粒は、平均粒径が5~40μmの範囲で、且つその標準偏差が17μm以下であり、
前記水溶性樹脂組成物からなる層は、ドリルビット進入面の表面粗さSmが7μm以下であることを特徴とする請求項1に記載のドリル孔あけ用エントリーシート。 - 前記水溶性樹脂組成物は、水溶性樹脂(A)を含有し、さらに、疎水性物質(B1)、前記水溶性樹脂(A)よりも融点が高い物質(B2)、及び、前記水溶性樹脂(A)との相溶性を高める物質(B3)から選ばれる少なくとも1種を含有することを特徴とする請求項1に記載のドリル孔あけ用エントリーシート。
- 前記水溶性樹脂組成物を含有する溶液は、水、及び、水よりも沸点の低い溶媒を、さらに含有することを特徴とする請求項1に記載のドリル孔あけ用エントリーシート。
- 前記金属支持箔は、厚さが0.05~0.5mmの範囲であることを特徴とする請求項1に記載のドリル孔あけ用エントリーシート。
- 銅張積層板の加工に用いられることを特徴とする請求項1に記載のドリル孔あけ用エントリーシート。
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BR112012032418-7A BR112012032418A2 (pt) | 2010-06-18 | 2011-06-16 | chapa de entrada para perfuração |
CN201180039885.0A CN103079781B (zh) | 2010-06-18 | 2011-06-16 | 钻孔用盖板 |
RU2012155140/02A RU2521908C1 (ru) | 2010-06-18 | 2011-06-16 | Трафарет для высверливания отверстий |
JP2012520298A JP5067519B2 (ja) | 2010-06-18 | 2011-06-16 | ドリル孔あけ用エントリーシート |
KR1020137001330A KR101619749B1 (ko) | 2010-06-18 | 2011-06-16 | 천공 엔트리 시트 |
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Cited By (6)
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WO2013132837A1 (ja) * | 2012-03-09 | 2013-09-12 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート |
WO2013146612A1 (ja) * | 2012-03-27 | 2013-10-03 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート |
JP2014188653A (ja) * | 2013-03-28 | 2014-10-06 | Mitsubishi Gas Chemical Co Inc | ドリル孔あけ用エントリーシート |
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CN208623982U (zh) * | 2017-06-30 | 2019-03-19 | 苏州思诺林电子有限公司 | 一种用于线路板钻孔深度控制的高精度钻孔盖板 |
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CN103079781A (zh) | 2013-05-01 |
KR20130136426A (ko) | 2013-12-12 |
CN103079781B (zh) | 2014-04-09 |
BR112012032418A2 (pt) | 2020-09-01 |
TWI519365B (zh) | 2016-02-01 |
JPWO2011158510A1 (ja) | 2013-08-19 |
JP5067519B2 (ja) | 2012-11-07 |
MY157756A (en) | 2016-07-15 |
RU2521908C1 (ru) | 2014-07-10 |
KR101619749B1 (ko) | 2016-05-12 |
HK1183644A1 (en) | 2014-01-03 |
TW201208793A (en) | 2012-03-01 |
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