KR101619749B1 - 천공 엔트리 시트 - Google Patents

천공 엔트리 시트 Download PDF

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Publication number
KR101619749B1
KR101619749B1 KR1020137001330A KR20137001330A KR101619749B1 KR 101619749 B1 KR101619749 B1 KR 101619749B1 KR 1020137001330 A KR1020137001330 A KR 1020137001330A KR 20137001330 A KR20137001330 A KR 20137001330A KR 101619749 B1 KR101619749 B1 KR 101619749B1
Authority
KR
South Korea
Prior art keywords
water
soluble resin
resin composition
drill bit
grain size
Prior art date
Application number
KR1020137001330A
Other languages
English (en)
Korean (ko)
Other versions
KR20130136426A (ko
Inventor
요우스케 마츠야마
타쿠야 하사키
켄이치 시미즈
레이키 아키타
신야 코마츠
Original Assignee
미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 filed Critical 미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Publication of KR20130136426A publication Critical patent/KR20130136426A/ko
Application granted granted Critical
Publication of KR101619749B1 publication Critical patent/KR101619749B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laminated Bodies (AREA)
  • Drilling And Boring (AREA)
KR1020137001330A 2010-06-18 2011-06-16 천공 엔트리 시트 KR101619749B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010139785 2010-06-18
JPJP-P-2010-139785 2010-06-18
PCT/JP2011/003453 WO2011158510A1 (ja) 2010-06-18 2011-06-16 ドリル孔あけ用エントリーシート

Publications (2)

Publication Number Publication Date
KR20130136426A KR20130136426A (ko) 2013-12-12
KR101619749B1 true KR101619749B1 (ko) 2016-05-12

Family

ID=45347925

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137001330A KR101619749B1 (ko) 2010-06-18 2011-06-16 천공 엔트리 시트

Country Status (9)

Country Link
JP (1) JP5067519B2 (ja)
KR (1) KR101619749B1 (ja)
CN (1) CN103079781B (ja)
BR (1) BR112012032418A2 (ja)
HK (1) HK1183644A1 (ja)
MY (1) MY157756A (ja)
RU (1) RU2521908C1 (ja)
TW (1) TWI519365B (ja)
WO (1) WO2011158510A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103282168B (zh) * 2010-12-28 2015-09-30 三菱瓦斯化学株式会社 钻孔用盖板
KR102090149B1 (ko) * 2012-03-09 2020-03-17 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 드릴 엔트리 시트
IN2014DN07967A (ja) 2012-03-27 2015-05-01 Mitsubishi Gas Chemical Co
WO2014157570A1 (ja) * 2013-03-27 2014-10-02 三菱瓦斯化学株式会社 繊維強化複合材又は金属の切削加工用エントリーシート及び該切削加工方法
JP6206700B2 (ja) * 2013-03-28 2017-10-04 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート及びドリル孔あけ用エントリーシートの製造方法
JP6931996B2 (ja) * 2014-03-31 2021-09-08 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート
JP6707232B2 (ja) * 2016-08-10 2020-06-10 昭北ラミネート工業株式会社 小口径穴あけ加工用エントリーボードおよび小口径穴あけ加工方法
CN208623982U (zh) * 2017-06-30 2019-03-19 苏州思诺林电子有限公司 一种用于线路板钻孔深度控制的高精度钻孔盖板
CN112662314B (zh) * 2020-12-10 2022-08-23 深圳市柳鑫实业股份有限公司 一种环保型pcb钻孔用盖板及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2855824B2 (ja) 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2003136485A (ja) 2001-10-31 2003-05-14 Mitsubishi Gas Chem Co Inc 孔明け用エントリーシート及びドリル孔明け加工法
JP2007222994A (ja) 2006-01-27 2007-09-06 Mitsubishi Gas Chem Co Inc ドリル孔明け加工用エントリーシートの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU924925A1 (ru) * 1979-09-07 1982-04-30 Предприятие П/Я М-5755 Устройство дл пробивки базовых отверстий в фотошаблонах печатных плат
JP2000025000A (ja) * 1998-07-16 2000-01-25 Showa Alum Corp エントリーシート
JP2001232596A (ja) * 2000-02-23 2001-08-28 Mitsubishi Alum Co Ltd プリント基板の穴あけ加工用敷き板
WO2002022329A1 (en) * 2000-09-14 2002-03-21 Ohtomo Chemical Ins., Corp. Entry boards for use in drilling small holes
JP5324037B2 (ja) * 2006-10-12 2013-10-23 大智化学産業株式会社 孔あけ加工用当て板及び孔あけ加工方法
JP5195404B2 (ja) * 2007-12-26 2013-05-08 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
BRPI0909976A2 (pt) * 2008-06-10 2020-06-23 Mitsubishi Gas Chemical Company, Inc. Folha de entrada para perfuração

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2855824B2 (ja) 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2003136485A (ja) 2001-10-31 2003-05-14 Mitsubishi Gas Chem Co Inc 孔明け用エントリーシート及びドリル孔明け加工法
JP2007222994A (ja) 2006-01-27 2007-09-06 Mitsubishi Gas Chem Co Inc ドリル孔明け加工用エントリーシートの製造方法

Also Published As

Publication number Publication date
KR20130136426A (ko) 2013-12-12
TW201208793A (en) 2012-03-01
CN103079781B (zh) 2014-04-09
JPWO2011158510A1 (ja) 2013-08-19
MY157756A (en) 2016-07-15
WO2011158510A1 (ja) 2011-12-22
JP5067519B2 (ja) 2012-11-07
RU2521908C1 (ru) 2014-07-10
HK1183644A1 (en) 2014-01-03
BR112012032418A2 (pt) 2020-09-01
CN103079781A (zh) 2013-05-01
TWI519365B (zh) 2016-02-01

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