WO2011122232A1 - 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、led実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板 - Google Patents
金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、led実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板 Download PDFInfo
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- WO2011122232A1 WO2011122232A1 PCT/JP2011/054916 JP2011054916W WO2011122232A1 WO 2011122232 A1 WO2011122232 A1 WO 2011122232A1 JP 2011054916 W JP2011054916 W JP 2011054916W WO 2011122232 A1 WO2011122232 A1 WO 2011122232A1
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- metal
- support
- metal support
- flexible substrate
- adhesive layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Definitions
- the present invention relates to a metal-supported flexible printed circuit board. More specifically, semiconductor device connection substrates such as tape automated bonding (TAB) and ball grid array (BGA) package interposers used for mounting semiconductor integrated circuits (ICs), LEDs, and power
- TAB tape automated bonding
- BGA ball grid array
- the present invention relates to a metal-supporting flexible substrate for electronic components suitable for producing a substrate for mounting a system device.
- a flexible board is a circuit-forming board that is composed of a support, an adhesive, a circuit-forming conductor layer, etc., and has excellent flexibility. After mounting the desired functional parts on the formed conductor circuit layer, the solder Circuit boards are protected by resists and coverlay films, and are widely used as interposers for wiring various electronic devices and mounting ICs.
- a TAB tape carrier for a liquid crystal display element is proposed in which an adhesive is applied on a base metal as a base base and a copper pattern is formed thereon. ing.
- a base metal as a base base and a copper pattern is formed thereon.
- the present invention has excellent wire bonding and low curl characteristics while maintaining excellent insulation and punching characteristics, so it can be processed reel-to-reel, and metal support for easy packaging design and heat dissipation design.
- An object is to provide a flexible substrate.
- the metal-supported flexible substrate of the present invention has a support composed of a metal foil, and (1) the adhesive layer comprises (A) a polyamide resin containing a dimer acid residue, and (B) A phenol resin is contained.
- the electronic component using the metal-supported flexible substrate of the present invention has chemical resistance necessary for circuit processing and insulation that enables high-voltage driving in the metal-supported substrate circuit.
- the flying lead can be easily formed, and a simple and low-cost heat radiation design can be achieved as compared with the conventional electronic component.
- the adhesive layer contains (A) a polyamide resin containing a dimer acid residue.
- dimer acid in a polyamide resin containing a dimer acid residue is industrially a dibasic acid in the highest molecular weight region, and has a bulky hydrocarbon group, and thus has a high hydrophobicity. Therefore, the dimer acid polyamide resin derived from dimer acid is an organic solvent necessary for realizing the metal-supported flexible substrate of the present invention while maintaining toughness, flexibility and low water absorption because of low crystallinity. It has the solubility of. Furthermore, it has hydrolysis resistance and flame retardancy derived from the strong binding force of the amide bond.
- a polyamide resin having a dimer acid residue having 36 carbon atoms is preferable in terms of toughness, film-forming property and processability. If it is a polyamide resin which has a dimer acid residue, a well-known various thing can be used and you may use 2 or more types.
- a polyamide resin having a dimer acid residue can be obtained by polycondensation of dimer acid and diamine by a conventional method.
- dicarboxylic acid other than dimer acid, azelaic acid and sebacic acid are used as copolymerization components.
- diamine well-known things, such as ethylenediamine, hexamethylenediamine, and piperazine, can be used, and two or more kinds may be used.
- the amine value of the polyamide resin having a dimer acid residue is preferably from 0.5 to 10, and more preferably from 0.5 to 8.
- the amine value here means the mg quantity of potassium hydroxide equivalent to hydrochloric acid required for titrating 1 g of polyamide resin.
- (1) mg quantity of potassium hydroxide equivalent to hydrochloric acid required for titrating 1 g of a resin mixture obtained by mixing each polyamide resin at a content ratio in the adhesive layer is indicated. Refers to the amine value.
- the amine value is 0.5 or more, (1) not only the crosslink density of the adhesive layer is increased, but the chemical resistance and insulation durability of the resulting flexible substrate against an alkali solution or an organic acid mixed solution are improved. It is possible to keep resin deformation to a minimum with respect to wire bonding and flip chip thermal pressure during IC mounting, and it is possible to avoid contact between the metal support layer and the wire. Further, if the amine value is 10 or less, the absolute value of the curl amount of the wiring board obtained after processing can be reduced, and the crosslinking reaction rate of the adhesive can be kept appropriate. It is possible to ensure storage stability in the cured state and stability in the processing step.
- the polyamide resin having a dimer acid residue preferably has a melt viscosity at 190 ° C. of 10 Pa ⁇ s or more, more preferably 20 Pa ⁇ s or more. If the melt viscosity at 190 ° C. is 10 Pa ⁇ s or more, (1) film-forming properties of the adhesive layer and (1) durability against moisture-absorbing moisture foaming during the main curing of the adhesive layer are obtained, so that it is more stable. Can be processed. Further, the melt viscosity at 190 ° C. is preferably 190 Pa ⁇ s or less, and more preferably 100 Pa ⁇ s or less.
- melt viscosity at 190 ° C is 190 Pa ⁇ s or less, there is no need to treat the metal layer for circuit formation at a high temperature, so it is possible to minimize thermal degradation and thermal stress generation of the circuit layer. It becomes.
- the melt viscosity at 190 ° C. can be measured by an apparent viscosity measurement described in Annex C of JIS K7210-1999. When two or more types of polyamide resins are included, the measurement is performed using a resin mixture in which each polyamide resin is mixed at a content ratio in (1) the adhesive layer.
- the polyamide resin having a dimer acid residue preferably contains a polyetheramide resin.
- the polyetheramide resin is highly flexible even when the molecular weight is increased, and the absolute value of the curl amount of the wiring board obtained after processing can be reduced.
- the adhesive layer contains (B) a phenol resin.
- the phenol resin is not particularly limited as long as it contains two or more phenolic hydroxyl groups in one molecule, and any known phenol resin such as novolac type phenol resin and resol type phenol resin can be used.
- alkyl-substituted phenols such as phenol, cresol, pt-butylphenol, nonylphenol, p-phenylphenol, cyclic alkyl-modified phenols such as terpene and dicyclopentadiene, nitro groups, halogen groups, cyano groups
- alkyl-substituted phenols such as phenol, cresol, pt-butylphenol, nonylphenol, p-phenylphenol, cyclic alkyl-modified phenols such as terpene and dicyclopentadiene, nitro groups, halogen groups, cyano groups
- examples thereof include those having a functional group containing a hetero atom such as an amino group, those having a skeleton such as naphthalene and anthracene, and resins made of polyfunctional phenols such as bisphenol F, bisphenol A, bisphenol S, resorcinol, and pyrogallol. Two or more
- the content of the (B) phenol resin is preferably 10 parts by weight or more with respect to 100 parts by weight of the (A) polyamide resin containing a dimer acid residue, and more preferably 30 parts by weight or more. preferable. Also, it is preferably 200 parts by weight or less, and more preferably 160 parts by weight or less. (B) If the content of the phenol resin is 10 parts by weight or more, the insulation reliability and the durability of adhesive strength under high temperature and high humidity treatment are improved, and if it is 200 parts by weight or less, the flexibility is excellent.
- the adhesive layer may contain (C) an epoxy resin.
- the epoxy resin those having two or more epoxy groups are preferable, diglycidyl ethers such as bisphenol A, bisphenol F, bisphenol S, resorcinol, dihydroxynaphthalene, dicyclopentadiene diphenol, dicyclopentadiene dixylenol, and phenol novolacs.
- Cresol novolak trisphenylol methane, epoxidized tetraphenylol ethane, epoxidized metaxylene diamine, cyclohexene oxide, bicycloheptene oxide, cyclopentene oxide and the like are preferable.
- those having a total of 3 or more chemical reaction sites selected from the group consisting of allyl, methallyl, amino, hydroxyl and carboxyl groups are also preferred.
- the total number of all types of chemical reaction sites in the unit molecule is three or more.
- the position of the chemical reaction site is not particularly limited, but preferably has a chemical reaction site at least in the side chain. Two or more of the above epoxy resins may be used.
- the adhesive layer may contain (D) a curing accelerator.
- a curing accelerator for example, known ones such as aromatic polyamines, imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole, dicyandiamide, triphenylphosphine and diazabicycloundecene can be exemplified. Two or more of these may be used.
- the adhesive layer may contain (E) a filler.
- the filler is not particularly limited as long as it does not impair the properties of the adhesive, but as the inorganic filler, metal fine particles such as gold, silver, copper, iron, nickel, aluminum, magnesium hydroxide, aluminum hydroxide, calcium Metal hydroxide such as aluminate hydrate, aluminum oxide, zirconium oxide, zinc oxide, antimony trioxide, antimony pentoxide, aluminum oxide, magnesium oxide, titanium oxide, iron oxide, cobalt oxide, chromium oxide, talc, etc.
- Examples thereof include metal oxides, silicon carbide, titanium carbide silica, aluminum nitride, titanium nitride, silicon nitride, inorganic salts such as calcium carbonate, carbon black, silica, and glass.
- silica, alumina, aluminum nitride, magnesium hydroxide, aluminum hydroxide and the like are preferably used.
- the silica may be either amorphous or crystalline, and it is not limited that the silica can be properly used according to the characteristics of each.
- These inorganic fillers may be subjected to a surface treatment using a silane coupling agent or the like for the purpose of improving adhesiveness or filling properties.
- the particle size of the inorganic filler is not particularly limited, but an average particle size of 0.02 to 30 ⁇ m is preferable from the viewpoints of dispersibility, coatability, transparency, and the like.
- organic fillers examples include crosslinked polymers such as styrene, NBR rubber, acrylic rubber, polyamide, polyimide, and silicone.
- the average particle size of the fine organic filler is preferably 0.2 to 5 ⁇ m in consideration of dispersion stability.
- an antioxidant In addition to the above components, it is not limited at all to contain an antioxidant, an ion scavenger and the like as long as the properties of the adhesive are not impaired.
- the antioxidant is not particularly limited as long as it imparts an antioxidant function.
- Known antioxidants such as a phenol-based antioxidant, a thioether-based antioxidant, a phosphorus-based antioxidant, and an amine-based antioxidant are used.
- An inhibitor can be used. Two or more of these may be used.
- the metal support flexible substrate of the present invention is (2) the support is made of a metal foil.
- the thermal conductivity of the circuit board is improved, and the size of the heat sink can be minimized.
- the metal-supported flexible substrate of the present invention can easily form a device hole by punching or the like, a component to be mounted such as an IC or an LED element can be mounted from the back surface of the circuit formation surface using the device hole.
- the support itself can be used as a heat sink or the thermal conductivity to the heat sink can be improved.
- Copper foil, stainless steel foil, and aluminum foil are preferably used as the metal, but other copper alloy foils such as phosphor bronze, nickel foil, magnesium foil, titanium foil, or alloy foils containing these may be used depending on the application / required function.
- a metal foil having a thermal expansion coefficient of 10 to 30 ppm / ° C. can be suitably selected according to the balance of the entire packaging.
- the thickness of the support can be appropriately selected according to the required flexibility and tear strength, but is preferably 12 ⁇ m to 150 ⁇ m, more preferably 12 ⁇ m to 75 ⁇ m.
- the metal foil as a support is organic (1) for the purpose of imparting easy adhesion and insulation of the adhesive layer, changing the appearance gloss, and avoiding chemical exposure during circuit formation.
- Adhesive layer side and / or opposite side of support (3) Support coating layer May be configured.
- the thickness of the support coating layer is preferably 2 ⁇ m or more as a lower limit from the viewpoint of the balance between the coating strength and the reel handling property and (2) the enhancement of the insulation reliability between the support and the circuit conductor layer. Things are more preferable. Moreover, as an upper limit, it is preferable that it is 100 micrometers or less, and it is more preferable that it is 10 micrometers or less. More preferably, it is less than 5 ⁇ m. (3)
- the layer structure of the support covering layer may be a single layer or a plurality of layers.
- a resin is used for the support coating layer, it is not particularly limited, but a polyimide resin or a polyamideimide resin excellent in heat resistance and chemical resistance is preferably used, and in particular, the polyamideimide resin is chemical resistant. It is preferably used from the viewpoint of imparting and easy adhesion.
- the polyamide-imide resin is particularly preferable because (A) a polyamide resin containing a dimer acid residue and (B) a phenol resin (1) adhesive layer containing a phenol resin can be obtained.
- the polyamideimide resin used for the support coating layer preferably has a Tg (glass transition temperature) of 300 ° C. or higher and a weight average molecular weight of 10,000 or higher from the viewpoint of heat resistance and chemical resistance. In order to obtain a high adhesive force with (1) the adhesive layer of the present invention, it is preferable that the epoxy resin is mixed and cured by 5% by weight or more.
- the support coating layer can be arranged as needed on either the adhesive layer side or the opposite side depending on the purpose, and the peelability can be applied to either or both of them. It may be given. Peelability means that (3) a support covering layer is arranged (2) a part of the support is peeled off from the support (2) or conversely (2) the surface of the support is (3) the support covering This means that (3) the support covering layer can be peeled without leaving a part of the layer or causing peeling at other interfaces.
- the support covering layer has a layer structure of two or more layers
- the first layer in contact with the support is an adhesive material and / or a thermoplastic resin, other than the first layer
- at least one layer is at least one selected from polyester, polyolefin, polyphenylene sulfide, polyvinyl butyral, polyvinyl acetate, polyvinyl alcohol, polycarbonate, polyamide, polyimide, polyamideimide, and polymethyl methacrylate.
- the first layer has releasability, and at least one layer other than the first layer secures the tensile strength at the time of peeling and ensures easy peeling while securing the chemical resistance at the time of circuit processing. Can do.
- a hole cross-section covering layer may be further added.
- a resin is used for the hole cross-section covering layer, an epoxy resin, a polyimide resin, a polyamideimide resin, or an acrylic resin excellent in insulation, heat resistance, and chemical resistance is preferably used.
- Chemicals are often used for circuit formation, but by applying a photoresist to the entire surface of the metal support flexible substrate, (2) on the support there is no (1) no adhesive layer and (2) the support is exposed. The exposed portion can be prevented from being exposed to chemicals, thereby preventing damage to the metal support flexible substrate. Moreover, the chemical
- the metal-supporting flexible substrate of the present invention can be used as a metal-supporting carrier tape by (1) maintaining the adhesive layer in a semi-cured state and (5) arranging a protective film. Also good.
- the protective film is not particularly limited as long as it can be peeled without impairing the form and function of the adhesive layer.
- Metal support carrier tape is formed by punching, etc., after forming the necessary device holes, peeling off the protective film, and arranging the metal layer for circuit formation by the laminating method or pressing method.
- Lead can be formed. If mounting using flying leads, ICs and LED elements can be mounted from either the front or back of the metal support carrier tape, which not only improves the layout and heat dissipation design of the mounted components. Further, the dielectric breakdown of the support metal layer-circuit forming layer due to the compressive breakdown of the insulating layer, which is a problem in the wire bonding method, can be further avoided.
- the resin composition constituting the adhesive layer is dissolved in a solvent to form an adhesive paint, (2) coated on the support and dried (1) to form the adhesive layer.
- a metal-supporting flexible substrate is obtained.
- the thickness of the adhesive layer is not particularly limited as long as it satisfies each required function such as adhesion, insulation, and thermal conductivity, but it is applied to be 2 to 200 ⁇ m in order to maintain flexibility. It is preferable to apply so that the thickness is 2 to 50 ⁇ m.
- the application method is not particularly limited, but general application equipment such as a comma method, a lip method, a roll method, a Mayer bar method, and a gravure method may be appropriately used in accordance with the paint properties.
- the drying conditions are usually 100 to 200 ° C.
- Solvents are not particularly limited, but aromatics such as toluene, xylene and chlorobenzene, ketones such as methyl ethyl ketone and methyl isobutyl ketone, aprotics such as dimethylformamide, dimethylacetamide and N methylpyrrolidone, ethanol, methanol and isopropyl alcohol Alcohol solvents such as N butanol and benzyl alcohol are suitable, and two or more of these may be used.
- the metal support flexible substrate of the present invention may be obtained by laminating a protective film (5) having a releasability, if necessary, on the adhesive layer formed by the method described in (a). In order to further increase the adhesive thickness, the paint may be applied again, or the formed (1) adhesive layer may be laminated a plurality of times. Alternatively, (5) an adhesive layer may be formed in advance on (5) a protective film, and (2) a support may be laminated to obtain the metal-supported flexible substrate of the present invention.
- (3) a coating material in which the resin that becomes the support coating layer is dissolved or dispersed in an organic solvent is prepared in advance; It is preferable to apply (3) a support covering layer by coating and drying at a predetermined thickness.
- a support covering layer (3) having releasability is provided, a releasable resin layer is provided. It is preferable that a multilayer structure obtained by applying and drying a film for maintaining the tensile strength necessary for peeling is previously bonded to (2) a support by a laminating method or the like.
- the conditions for laminating the (1) adhesive layer on the support are usually a temperature of 50 to 160 ° C. and a pressure of 0.1 to 0.5 MPa.
- the laminating temperature is preferably 140 ° C. or lower. It can be judged that it is good if it is 120 ° C. or lower, and very good if it is 100 ° C. or lower.
- the adhesive layer is laminated, and in that case, it is preferable to laminate under the same conditions as in the case of (2) directly laminating the adhesive layer on the support.
- heat treatment may be performed at 40 to 100 ° C. for about 20 to 300 hours.
- the degree of curing of the adhesive layer may be adjusted. By adjusting the degree of curing, it is possible to prevent excessive flow of the adhesive when the circuit-forming metal layer is disposed on the metal-supporting flexible substrate and to prevent foaming due to moisture during heat curing.
- Electrodeposition coating methods include: (2) Cathodic electrodeposition in which a negative voltage is applied to the support and positively polarized epoxy resin or polyimide resin is deposited on the hole cross section of the support. It is preferable to employ a coating method. Moreover, it is preferable to heat-fix the electrodeposition paint after applying it.
- the electronic component using the metal-supported flexible substrate of the present invention has chemical resistance necessary for circuit processing and insulation necessary for the metal-supported substrate, so that reel-to-reel processing, punching processing, and formation of flying leads are easy. Thus, a simpler and lower cost heat radiation design can be achieved compared to conventional electronic components.
- Insulation reliability evaluation of metal-supported flexible circuit board 100V voltage at 130 ° C. and 85% RH on metal-supported flexible circuit board (conductor width 50 ⁇ m, distance between conductors 50 ⁇ m) obtained in each example and comparative example The time until the resistance value decreased to 10 6 ⁇ or less was defined as the insulation durability time.
- the insulation durability time is preferably 250 hours or more.
- Rank C When satisfying the following requirement (i) when immersed in the chemical solution of 1 for 3 minutes, then in the chemical solution of 2 for 3 minutes, and further in the chemical solution of 3 for 3 minutes, the requirement of (ii) below is satisfied. If not.
- F rank When all the requirements (i) and (ii) below are not satisfied when immersed in the chemical solution of 1 for 3 minutes, then in the chemical solution of 2 for 3 minutes, and further in the chemical solution of 3 for 3 minutes.
- the (3) support coating layer is not formed on the opposite side of the (1) adhesive layer of the (2) support, (2) the (1) adhesive layer on the opposite side of the support The surface appearance of the surface is not significantly damaged by the chemical solution.
- a rank When immersed in the chemical solution of 1 for 5 minutes, then in the chemical solution of 2 for 5 minutes, and further in the chemical solution of 3 for 5 minutes, the following (i) When all the requirements of (iii) are satisfied.
- a ′ rank The above A rank requirement is not satisfied, but when immersed in the chemical solution 1 for 3 minutes, then in the chemical solution 2 for 3 minutes, and further in the chemical solution 3 for 3 minutes, the following (i) to (iii) ) When all the requirements are met.
- Rank B When immersed in the chemical solution of 1 for 3 minutes, then in the chemical solution of 2 for 3 minutes, and further in the chemical solution of 3 for 3 minutes, any of the following requirements (i) to (iii) are satisfied .
- Rank C When satisfying one of the following requirements (i) to (iii) when immersed in the chemical solution of 1 for 3 minutes, then in the chemical solution of 2 for 3 minutes, and further in the chemical solution of 3 for 3 minutes. If.
- F rank When all of the following requirements (i) to (iii) are not satisfied when immersed in the chemical solution of 1 for 3 minutes, then in the chemical solution of 2 for 3 minutes, and further in the chemical solution of 3 for 3 minutes.
- Adhesive strength of metal-supported flexible circuit board Using the metal-supported flexible circuit board (conductor width 50 ⁇ m) obtained in each of the examples and comparative examples, the conductor was made to Tensilon UTM-11-5HR (manufactured by Toyo Baldwin). Then, the film was peeled off at a speed of 50 mm / min in the direction of 90 °, and the peeling strength at that time was measured. It can be judged that it is very good if it is 8 N / cm or more, and good if it is 6 N / cm or more.
- Example 1 Preparation of adhesive layer sheet
- Dimer acid polyamide resin (“Sunmide” (registered trademark) HT-100G, manufactured by Air Products Japan, amine value 1, melt viscosity 7.0 Pa ⁇ s) 100 parts by weight
- B 50 parts by weight of a resol phenol resin (CKM1634 Showa High Polymer Co., Ltd.)
- C 80 parts by weight of an epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.)
- a curing accelerator Ethanol / toluene mixed solvent (mixing weight ratio ethanol 1: toluene 4) was added to 2 parts by weight of 2-ethyl-4-methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd., and stirred and mixed at 30 ° C.
- a weight percent adhesive composition was prepared.
- the adhesive composition was applied to a protective film (5) a protective film (polyethylene terephthalate film having a thickness of 25 ⁇ m with a silicone release agent (“Film Vina” (registered trademark) GT manufactured by Fujimori Kogyo Co., Ltd.)) of about 12 ⁇ m using a bar coater.
- a protective film polyethylene terephthalate film having a thickness of 25 ⁇ m with a silicone release agent (“Film Vina” (registered trademark) GT manufactured by Fujimori Kogyo Co., Ltd.)
- a bar coater After applying to dry thickness and drying at 150 ° C. for 4 minutes, (5) protective film is sandwiched on both sides by attaching another (5) protective film to the formed (1) adhesive layer surface
- An adhesive layer sheet was prepared.
- the protective film of the metal-supported flexible substrate was peeled off, and an 18 ⁇ m electrolytic copper foil was laminated under the conditions of 140 ° C. and 0.3 MPa pressure. Subsequently, heat treatment was sequentially performed in an air oven at 80 ° C. for 3 hours, at 100 ° C. for 5 hours, and at 150 ° C. for 5 hours to produce a metal-supporting flexible substrate with a copper foil for circuit formation. Photoresist film formation, etching, and resist stripping are performed on the surface of the obtained copper foil for circuit formation of the metal-supported flexible substrate with copper foil for circuit formation by a conventional method to form a counter electrode circuit with a wiring pitch of 100 ⁇ m (conductor width: 50 ⁇ m).
- the film was immersed in an electroless tin plating solution of a borofluoric acid type (made by Rohm and Haas, tin plating solution (trade name) “TINPOSIT” (registered trademark) LT-34) at 70 ° C. for 5 minutes, and a 0.5 ⁇ m thick plating was performed. As a result, a metal-supported flexible circuit board was produced.
- a borofluoric acid type made by Rohm and Haas, tin plating solution (trade name) “TINPOSIT” (registered trademark) LT-34)
- the evaluations (1) to (7) were performed using the metal support flexible substrate for evaluation, the metal support flexible substrate with copper foil for circuit formation, and the metal support flexible circuit substrate obtained by the above method.
- Example 2 In preparing the adhesive layer sheet, (A) dimer acid polyamide resin (“Tomide” (registered trademark) TXC-232C, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 10.0, melt viscosity as components (A) to (D) 24.0 Pa ⁇ s) 100 parts by weight, (B) Resole phenol resin (CKM1634, Showa High Polymer Co., Ltd.) 50 parts by weight, (C) Epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.) 80 It was prepared in the same manner as in Example 1 except that 2 parts by weight of (D) curing accelerator (2 ethyl-4-methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) was used. 7) The evaluation described above was performed.
- TXC-232C manufactured by Fuji Kasei Kogyo Co., Ltd.
- amine value 10.0 melt viscosity as
- Example 3 In preparing the adhesive layer sheet, as components (A) to (D), (A) dimer acid polyetheramide resin (“Tomide” (registered trademark) PA-200, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 3, melt viscosity) 40.0 Pa ⁇ s) 100 parts by weight, (B) 50 parts by weight of resole phenolic resin (CKM1634 Showa High Polymer Co., Ltd.), (C) epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.) 80 It was prepared in the same manner as in Example 1 except that 2 parts by weight of (D) curing accelerator (2 ethyl-4-methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) was used. 7) The evaluation described above was performed.
- Dimer acid polyetheramide resin (“Tomide” (registered trademark) PA-200, manufactured by Fuji Kasei Kogyo Co., Ltd.
- Example 4 In preparing the adhesive layer sheet, as components (A) to (D), (A) dimer acid polyetheramide resin (“Tomide” (registered trademark) PA-200, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 3, melt viscosity) 40.0 Pa ⁇ s) 100 parts by weight, (B) 50 parts by weight of resole phenolic resin (CKM1634 Showa High Polymer Co., Ltd.), (C) epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.) 80 Parts by weight, (D) 2 parts by weight of a curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.), and in an ethanol / toluene mixed solvent (mixing weight ratio ethanol 1: toluene 4) (E) Alumina filler (“Admafine” (registered trademark) AO-502, average particle size 0.7
- a sprocket hole (a square with a hole diameter of 1.98 mm ⁇ 1.98 mm, a pitch of 4.75 mm) was formed on the metal-supporting flexible board by punching one row at each end to obtain a metal-supporting flexible board with sprocket holes.
- the protective film (5) of the metal-supported flexible substrate with sprocket holes was peeled off, and an 18 ⁇ m electrolytic copper foil was laminated under conditions of 140 ° C. and 0.3 MPa pressure. Subsequently, heat treatment was sequentially performed in an air oven at 80 ° C. for 3 hours, at 100 ° C. for 5 hours, and at 150 ° C. for 5 hours to produce a metal-supporting flexible substrate with a copper foil for circuit formation.
- the photoresist film is formed, exposed and developed on the entire surface of the circuit-forming copper foil side of the obtained metal-supported flexible board with copper foil for circuit formation by conventional methods, and then a backing material is brushed on the entire back surface.
- the sprocket hole was filled with a backing material.
- etching, resist peeling, and backing material peeling are performed to form a counter electrode circuit with a wiring pitch of 100 ⁇ m (conductor width: 50 ⁇ m), and then a borofluoric acid-based (tin plating solution (trade name) “TINPOSIT” manufactured by Rohm and Haas) (Registered trademark) LT-34) was immersed in an electroless tin plating solution at 70 ° C. for 5 minutes and plated with a thickness of 0.5 ⁇ m to produce a metal-supported flexible circuit board.
- the metal support flexible substrate for evaluation Using the metal support flexible substrate for evaluation, the metal support flexible substrate with sprocket holes, the metal support flexible substrate with copper foil for circuit formation, and the metal support flexible circuit substrate obtained by the above method, the above (1) to (7) Evaluation was performed.
- Example 6 (2) Both sides of an aluminum foil (50 ⁇ m thickness (manufactured by Sumikara Aluminum Co., Ltd.) linear expansion coefficient 22.0 ppm) as a support, (3) Tg 300 ° C., weight average molecular weight 11000, epoxy resin mixture as a support coating layer It was produced in the same manner as in Example 5 except that the one coated with 3.0 ⁇ m of polyamideimide resin at a ratio of 10% was used, and the evaluations described in the above (1) to (7) were performed.
- Example 7 (2) Both sides of an aluminum foil (50 ⁇ m thickness (manufactured by Sumikara Aluminum Co., Ltd.) linear expansion coefficient 22.0 ppm) as a support, (3) Tg 300 ° C., weight average molecular weight 11000, epoxy resin mixture as a support coating layer It was produced in the same manner as in Example 5 except that a 10% ratio polyamide imide resin coated with 1.5 ⁇ m was used, and the evaluations described in (1) to (7) above were performed.
- Example 8 (2) Both sides of an aluminum foil (50 ⁇ m thick (manufactured by Sumikara Aluminum Co., Ltd.) linear expansion coefficient 22.0 ppm) as a support, (3) Tg 250 ° C., weight average molecular weight 8000, epoxy resin mixture as a support coating layer It was produced in the same manner as in Example 5 except that the one coated with 3.0 ⁇ m of polyamideimide resin at a ratio of 10% was used, and the evaluations described in the above (1) to (7) were performed.
- Example 9 (2) Both sides of an aluminum foil (50 ⁇ m thickness (manufactured by Sumikara Aluminum Co., Ltd.) linear expansion coefficient 22.0 ppm) as a support, (3) Polyimide resin 3 having a Tg of 300 ° C. and a weight average molecular weight of 12,000 as a support coating layer A sample was prepared in the same manner as in Example 5 except that the one coated with 0.0 ⁇ m was used, and the evaluations described in the above (1) to (7) were performed.
- Example 10 In preparation of the adhesive layer sheet, (A) dimer acid polyamide resin (“Tomide” (registered trademark) PA-100, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 0, melt viscosity 180.0 Pa ⁇ s) as component (A) A sample was prepared in the same manner as in Example 6 except that 100 parts by weight was used, and the evaluations described in (1) to (7) were performed.
- Tomide registered trademark
- PA-100 manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 0, melt viscosity 180.0 Pa ⁇ s
- Example 11 In preparation of the adhesive layer sheet, (A) dimer acid polyamide resin (“Tomide” (registered trademark) PA-100, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 0, melt viscosity 180.0 Pa ⁇ s) as component (A) It was produced in the same manner as in Example 7 except that 100 parts by weight was used, and the evaluations described in (1) to (7) were performed.
- Tomide registered trademark
- PA-100 manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 0, melt viscosity 180.0 Pa ⁇ s
- Example 12 (2) (1) Adhesive layer side of aluminum foil (50 ⁇ m thickness (manufactured by Sumikara Aluminum Co., Ltd.) linear expansion coefficient 22.0 ppm) as a support, (3) Tg 300 ° C., weight average as support support layer Backing tape KT-50 (manufactured by Kawamura Sangyo Co., Ltd.) (coverable pressure-sensitive adhesive layer 20 ⁇ m, polyethylene terephthalate film 50 ⁇ m) covered with 3 ⁇ m of polyimide resin with a molecular weight of 11000 and the opposite side of which is made of polyethylene terephthalate film with adhesive. It was produced by the same method as in Example 5 except that a roll laminate at 0 ° C. was used, and the evaluations described in the above (1) to (7) were performed.
- Example 13 In the production of the metal-supported flexible substrate with sprocket holes, an electrodeposition paint Elecoat AMG (made by Shimizu Co., Ltd.) whose resin content is epoxy resin is electrodeposited on the cross section of the sprocket holes to a film thickness of 10 ⁇ m, at 100 ° C. for 15 minutes. It was produced by the same method as in Example 6 except that (4) a hole cross-section covering layer was formed by performing a drying treatment, and the evaluations described in the above (1) to (7) were performed.
- Elecoat AMG made by Shimizu Co., Ltd.
- Example 14 In the production of the metal-supporting flexible substrate with sprocket holes, (4) the same as in Example 13 except that the hole cross-section coating layer was an electrodeposition paint Elecoat PI (manufactured by Shimizu Co., Ltd.) whose resin content is a polyimide resin system. It was fabricated by the method, and the evaluations described in the above (1) to (7) were performed.
- Elecoat PI manufactured by Shimizu Co., Ltd.
- Example 15 In preparing the adhesive layer sheet, as components (A) to (D), (A) dimer acid polyetheramide resin (“Tomide” (registered trademark) PA-200, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 3, melt viscosity) 40.0 Pa ⁇ s) 100 parts by weight, (B) 50 parts by weight of resole phenolic resin (CKM1634 Showa High Polymer Co., Ltd.), (C) epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.) 80 Parts by weight, (D) 2 parts by weight of a curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.), and in an ethanol / toluene mixed solvent (mixing weight ratio ethanol 1: toluene 4) (E) Alumina filler (“Admafine” (registered trademark) AO-502, average particle
- Example 16 In preparing the adhesive layer sheet, as components (A) to (D), (A) dimer acid polyetheramide resin (“Tomide” (registered trademark) PA-200, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 3, melt viscosity) 40.0 Pa ⁇ s) 100 parts by weight, (B) 50 parts by weight of resole phenolic resin (CKM1634 Showa High Polymer Co., Ltd.), (C) epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.) 80 Parts by weight, (D) 2 parts by weight of a curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.), and in an ethanol / toluene mixed solvent (mixing weight ratio ethanol 1: toluene 4) (E) Alumina filler (“Admafine” (registered trademark) AO-502, average particle
- Example 17 In preparing the adhesive layer sheet, as components (A) to (D), (A) dimer acid polyetheramide resin (“Tomide” (registered trademark) PA-200, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 3, melt viscosity) 40.0 Pa ⁇ s) 100 parts by weight, (B) 50 parts by weight of resole phenolic resin (CKM1634 Showa High Polymer Co., Ltd.), (C) epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.) 80 Parts by weight, (D) 2 parts by weight of a curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.), and in an ethanol / toluene mixed solvent (mixing weight ratio ethanol 1: toluene 4) (E) In order to add 300 parts by weight of aluminum nitride filler (H, average particle size
- Example 18 In preparing the adhesive layer sheet, (A) dimer acid polyetheramide resin (“Tomide” (registered trademark) PA-200, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 1, melt viscosity) as components (A) to (D) 40.0 Pa ⁇ s), dimer acid polyamide resin (“Tomide” (registered trademark) PA-100, manufactured by Fuji Kasei Kogyo Co., Ltd., amine number 0, melt viscosity 180.0 Pa ⁇ s) and dimer acid polyamide resin (“Tomide”).
- Tomide dimer acid polyetheramide resin
- PA-200 manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 1, melt viscosity
- (Registered trademark) 535 manufactured by Fuji Kasei Kogyo Co., Ltd., amine number 50, melt viscosity 1.0 Pa.s) 2: 1: 0.5 mixture (amine number 7.1 melt viscosity 80 Pa.s) ( Dimer acid polyetheramide resin 1) 100 parts by weight, (B) resol phenol resin (CKM1634 Showa High Polymer Co., Ltd.) 50 parts by weight, (C) epoxy resin (“Epicoat” ( (Registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 80 parts by weight, (D) curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Kasei Co., Ltd.) 2 parts by weight The above-mentioned methods (1) to (7) were evaluated.
- Example 19 In preparing the adhesive layer sheet, (A) dimer acid polyamide resin (“Macromelt” (registered trademark) 6900, manufactured by Henkel Japan, amine value 0, melt viscosity 10 Pa ⁇ s) as components (A) to (D) 100 parts by weight, (B) 50 parts by weight of resole phenolic resin (CKM1634 Showa High Polymer Co., Ltd.), (C) 80 parts by weight of epoxy resin (“Epicoat” (registered trademark) YL980, Japan Epoxy Resin Co., Ltd.), (D) A curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) was used in the same manner as in Example 1 except that 2 parts by weight was used, and the evaluations described in (1) to (7) were performed. went.
- Dimer acid polyamide resin (“Macromelt” (registered trademark) 6900, manufactured by Henkel Japan, amine value 0, melt viscosity 10 Pa ⁇
- Example 20 In the production of the adhesive layer sheet, (A) dimer acid polyamide resin (“Tomide” (registered trademark) 1350, manufactured by Fuji Kasei Kogyo Co., Ltd., amine value 10, melt viscosity 3.0 Pa ⁇ s) 100 parts by weight; (B) 50 parts by weight of a resole phenolic resin (CKM1634 Showa High Polymer Co., Ltd.); (C) an epoxy resin (“Epicoat” (registered trademark) YL980; manufactured by Japan Epoxy Resin Co., Ltd.) 80 parts by weight; D) A curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.) was used in the same manner as in Example 1 except that 2 parts by weight was used, and described in (1) to (7) above. Evaluation was performed.
- a curing accelerator (2ethyl-4methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.
- (Comparative Example 1) In preparing the adhesive layer sheet, (A) dimer acid polyamide resin ("Macromelt” (registered trademark) 6900, manufactured by Henkel Japan, as amine component, melt viscosity) as components (A), (C) and (D) 10 Pa ⁇ s) 100 parts by weight, (C) epoxy resin (“Epicoat” (registered trademark) YL980, manufactured by Japan Epoxy Resin Co., Ltd.) 80 parts by weight, (D) a curing accelerator (2 ethyl-4 methylimidazole (2E4MZ), It was prepared in the same manner as in Example 1 except that 2 parts by weight (manufactured by Tokyo Chemical Industry Co., Ltd.) was used and the component (B) was not used, and the evaluations described in the above (1) to (7) were performed.
- Dimer acid polyamide resin (“Macromelt” (registered trademark) 6900, manufactured by Henkel Japan, as amine component, melt viscosity) as components (A),
- Comparative Example 3 (2) A support was prepared in the same manner as in Comparative Example 2 except that an aluminum foil (50 ⁇ m thick (manufactured by Sumikara Aluminum Co., Ltd.) linear expansion coefficient 22.0 ppm) was used, and the above (1) to (7) The described evaluation was performed.
- an aluminum foil 50 ⁇ m thick (manufactured by Sumikara Aluminum Co., Ltd.) linear expansion coefficient 22.0 ppm) was used, and the above (1) to (7) The described evaluation was performed.
- Tables 1 and 2 show (1) adhesive layer, (2) support, (3) support coating layer, and (4) hole cross-section coating layer used in each example and comparative example.
- Tables 3 and 4 show the laminating temperature and the measurement results of the circuit forming copper foil.
- the electronic component using the metal-supported flexible substrate of the present invention has chemical resistance necessary for circuit processing and insulation that enables high-voltage driving in the metal-supported substrate circuit.
- the flying lead can be easily formed, and a simple and low-cost heat radiation design can be achieved as compared with the conventional electronic component.
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Abstract
Description
は、(2)支持体に(3)支持体被覆層が配されたものに(1)接着剤層をラミネートすることになるが、その場合も(2)支持体へ(1)接着剤層を直接ラミネートする場合と同様の条件でラミネートすることが好ましい。
各実施例および比較例において得られた金属支持フレキシブル回路基板(導体幅50μm、導体間距離50μm)に130℃、85%RH環境下で100V電圧を印加し、抵抗値が106Ω以下まで低下するまでの時間を絶縁耐久時間とした。絶縁耐久時間は250時間以上であることが好ましい。
各実施例および比較例において得られた回路形成用銅箔付き金属支持フレキシブル基板の回路形成用銅箔を、塩化第二鉄を用いたサブトラクティブ法(エッチング)にて取り除いた後、35mm×190mmに裁断しカール量評価用金属支持フレキシブル基板とした。カール量評価用金属支持フレキシブル基板を23℃/55%RHにて24時間調湿を行った後、カールした基板の端部を上向きにガラスプレート上に静置した状態で、硬化済みカバーレイフィルム被着回路基板のガラスプレートからの最高高さ位置を計測しカール量とした。カール量は7mm以下であれば良好、3mm以下であれば極めて良好と判断できる。
上記(2)カール量評価用金属支持フレキシブル基板の(1)接着剤層を、金属顕微鏡にて観察し発泡評価を行った。直径5μm以上のものを発泡とし、全く発泡の無かったものを○、直径5μm以上50μm未満の発泡が1~10個以内で確認されたものを△、直径50μm以上の発泡が確認されたか、直径5μm以上50μm未満の発泡が11個以上確認されたものを×とした。△以上であれば良好判断出来、○であれば極めて良好と判断できる。
各実施例および比較例において得られた金属支持フレキシブル回路基板(導体幅50μm、導体間距離50μm)にACFボンダー(TCW-125、日本アビオニクス株式会社製)で、200℃、1秒間、ツール圧力は配線一本当たり50g/2500μm2となるように熱圧を与え、ワイヤーボンディング等の耐圧接性評価を行った。耐圧接用サンプルのツール圧接面の回路パターン銅の沈み込み量を計測し、3.0μm以内であれば合格、2.0μm以内であれば良好、1.0μm以内であれば極めて良好であると判断できる。
各実施例および比較例において得られた金属支持フレキシブル基板を、プレス金型にて0.250mmφ、0.350mmφ、0.500mmφの丸穴を開け、その切断面を観察し、打ち抜き性評価とした。穴の断面に、長さ10μm以上の(1)接着剤層ダレやバリ、もしくは長さ10μm以上の(1)接着剤層割れや欠け、穴の周囲に(2)支持体との剥がれが無ければ、フライングリード形成やデバイス設計性の為にデバイスホールやビアホールを良好に形成する事が極めて良好、長さ20μm以上の(1)接着剤層ダレやバリ、もしくは長さ20μm以上の(1)接着剤層割れや欠け、穴の周囲に(2)支持体との剥がれが無ければ良好、穴の断面に、長さ20μm以上の(1)接着剤層ダレやバリ、もしくは長さ20μm以上の(1)接着剤層割れや欠け、穴の周囲に(2)支持体との剥がれ、が生じた場合には不良と判断できる。
各実施例および比較例において得られた金属支持フレキシブル基板、スプロケットホール付き金属支持フレキシブル基板を、1、塩化第二鉄溶液(40℃、37%)、2、水酸化ナトリウム液(30℃、1N)、3、無電解錫めっき液(70℃、“Timposit”LT-34、ロームアンドハース社製)にそれぞれ浸漬した後の外観を観察する事で薬液耐性評価とした。判断基準は以下のとおりである。
Aランク:1の薬液に5分間、次に2の薬液に5分間、さらに3の薬液に5分間順次浸漬した際に、下記(i)および(ii)の要件をいずれも満たす場合。
Bランク:上記Aランクの要件は満たさないが、1の薬液に3分間、次に2の薬液に3分間、さらに3の薬液に3分間順次浸漬した際に、下記(i)および(ii)の要件をいずれも満たす場合。
Cランク:1の薬液に3分間、次に2の薬液に3分間、さらに3の薬液に3分間順次浸漬した際に、下記(i)の要件は満たすが、下記(ii)の要件は満たさない場合。
Fランク:1の薬液に3分間、次に2の薬液に3分間、さらに3の薬液に3分間順次浸漬した際に、下記(i)および(ii)の要件をいずれも満たさない場合。
(i)(1)接着剤層の表面外観に薬液による著しい損傷が見られない。
(ii)(3)支持体被覆層を(2)支持体の(1)接着剤層の反対側に形成していない場合は、(2)支持体の(1)接着剤層と反対側の面の表面外観に薬液による著しい損傷が見られない。また(3)支持体被覆層を(2)支持体の(1)接着剤層の反対側に形成している場合は、(2)支持体の(1)接着剤層の反対側に形成した(3)支持体被覆層の(2)支持体と反対側の面の表面外観に薬液による著しい損傷が見られない。
Aランク:1の薬液に5分間、次に2の薬液に5分間、さらに3の薬液に5分間順次浸漬した際に、下記(i)~(iii)の要件を全て満たす場合。
A’ランク:上記Aランクの要件は満たさないが、1の薬液に3分間、次に2の薬液に3分間、さらに3の薬液に3分間順次浸漬した際に、下記(i)~(iii)の要件を全て満たす場合。
Bランク:1の薬液に3分間、次に2の薬液に3分間、さらに3の薬液に3分間順次浸漬した際に、下記(i)~(iii)の要件のいずれか2つを満たす場合。
Cランク:1の薬液に3分間、次に2の薬液に3分間、さらに3の薬液に3分間順次浸漬した際に、下記(i)~(iii)の要件のいずれか1つだけを満たす場合。
Fランク:1の薬液に3分間、次に2の薬液に3分間、さらに3の薬液に3分間順次浸漬した際に、下記(i)~(iii)の要件を全て満たさない場合。
(i)(1)接着剤層の表面外観に薬液による著しい損傷が見られない。
(ii)(3)支持体被覆層を(2)支持体の(1)接着剤層の反対側に形成していない場合は、(2)支持体の(1)接着剤層と反対側の面の表面外観に薬液による著しい損傷が見られない。また(3)支持体被覆層を(2)支持体の(1)接着剤層の反対側に形成している場合は、(2)支持体の(1)接着剤層の反対側に形成した(3)支持体被覆層の(2)支持体と反対側の面の表面外観に薬液による著しい損傷が見られない。
(iii)ホール断面に薬液による著しい損傷が見られない。
各実施例および比較例において得られた金属支持フレキシブル回路基板(導体幅50μm)を用いて、導体をテンシロンUTM-11-5HR(東洋ボールドウィン社製)にて90度方向に50mm/分の速度で引き剥がし、その際の引き剥がし強度を測定した。8N/cm以上であれば極めて良好、6N/cm以上であれば良好と判断できる。
(a)接着剤層シートの作製
(A)ダイマー酸ポリアミド樹脂(“サンマイド”(登録商標)HT-100G、エアープロダクツジャパン社製、アミン価1、溶融粘度7.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部に、エタノール/トルエン混合溶剤(混合重量比率 エタノール1:トルエン4)を加え、30℃で撹拌、混合して固形分濃度25重量%接着剤組成物を作製した。この接着剤組成物をバーコータで、(5)保護フィルム(シリコーン離型剤付きの厚さ25μmのポリエチレンテレフタレートフィルム(藤森工業(株)製“フィルムバイナ”(登録商標)GT))に約12μmの乾燥厚さとなるように塗布し、150℃で4分間乾燥した後、形成された(1)接着剤層面に別の(5)保護フィルムを貼り合わせる事で両側を(5)保護フィルムでサンドされた接着剤層シートを作製した。
上記(a)に記載の方法で得られた接着剤層シートの(5)保護フィルムの片側を剥離し、(2)支持体(圧延銅箔(BHY-22B-T 70μm厚(日鉱金属株式会社製)線膨張係数16.0ppm/℃)に100℃、0.3MPaの条件でラミネートし、金属支持フレキシブル基板を得た。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリアミド樹脂(“トーマイド”(登録商標)TXC-232C、富士化成工業社製、アミン価10.0、溶融粘度24.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリエーテルアミド樹脂(“トーマイド”(登録商標)PA-200、富士化成工業社製、アミン価3、溶融粘度40.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリエーテルアミド樹脂(“トーマイド”(登録商標)PA-200、富士化成工業社製、アミン価3、溶融粘度40.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用い、また、エタノール/トルエン混合溶剤(混合重量比率 エタノール1:トルエン4)に、(E)アルミナ充填材(“アドマファイン”(登録商標)AO-502、平均粒径 0.7μm、株式会社アドマテックス社製)300重量部が添加されるよう、予めサンドミルで分散処理した混合溶剤を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(a)接着剤層シートの作製
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリエーテルアミド樹脂(“トーマイド”(登録商標)PA-200、富士化成工業社製、アミン価3、溶融粘度40.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で接着剤シートを作製した。
上記(a)に記載の方法で得られた接着剤層シートを30mm幅にカットした後、(5)保護フィルムの片側を剥離し、(2)支持体(アルミ箔 50μm厚 35mm幅(住軽アルミ株式会社製)線膨張係数 22.0ppm)に100℃、0.3MPaの条件でラミネートし、金属支持フレキシブル基板を得た。
(2)支持体であるアルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)の両面を、(3)支持体被覆層としてTg300℃、重量平均分子量11000、エポキシ樹脂混合比率10%のポリアミドイミド樹脂3.0μmで被覆したものを用いた以外は実施例5と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(2)支持体であるアルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)の両面を、(3)支持体被覆層としてTg300℃、重量平均分子量11000、エポキシ樹脂混合比率10%のポリアミドイミド樹脂1.5μmで被覆したものを用いた以外は実施例5と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(2)支持体であるアルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)の両面を、(3)支持体被覆層としてTg250℃、重量平均分子量8000、エポキシ樹脂混合比率10%のポリアミドイミド樹脂3.0μmで被覆したものを用いた以外は実施例5と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(2)支持体であるアルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)の両面を、(3)支持体被覆層としてTg300℃、重量平均分子量12000のポリイミド樹脂3.0μmで被覆したものを用いた以外は実施例5と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)成分として(A)ダイマー酸ポリアミド樹脂(“トーマイド”(登録商標)PA-100、富士化成工業社製、アミン価0、溶融粘度180.0Pa・s)100重量部を用いた以外は実施例6と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)成分として(A)ダイマー酸ポリアミド樹脂(“トーマイド”(登録商標)PA-100、富士化成工業社製、アミン価0、溶融粘度180.0Pa・s)100重量部を用いた以外は実施例7と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(2)支持体であるアルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)の(1)接着剤層側を、(3)支持体被覆層としてTg300℃、重量平均分子量11000のポリイミド樹脂3μmで被覆し、反対面側をポリエチレンテレフタレートフィルムに粘着剤が構成された裏打ちテープKT-50(河村産業社製)(剥離性粘着剤層20μm、ポリエチレンテレフタレートフィルム50μm)を30℃でロールラミネートしたものを用いた以外は実施例5と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
スプロケットホール付き金属支持フレキシブル基板の作製に当たり、スプロケットホール断面に、樹脂分がエポキシ樹脂系である電着塗料エレコートAMG(株式会社シミズ製)を膜厚10μmに電着し、100℃、15分の乾燥処理を行い、(4)ホール断面被覆層を形成した以外は、実施例6と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
スプロケットホール付き金属支持フレキシブル基板の作製に当たり、(4)ホール断面被覆層を、樹脂分がポリイミド樹脂系である電着塗料エレコートPI(株式会社シミズ製)とした以外は、実施例13と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリエーテルアミド樹脂(“トーマイド”(登録商標)PA-200、富士化成工業社製、アミン価3、溶融粘度40.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用い、また、エタノール/トルエン混合溶剤(混合重量比率 エタノール1:トルエン4)に、(E)アルミナ充填材(“アドマファイン”(登録商標)AO-502、平均粒径 0.7μm、株式会社アドマテックス社製)300重量部が添加されるよう、予めサンドミルで分散処理した混合溶剤を用い、更に(2)支持体として、SUS316箔(70μm厚(東洋精箔株式会社製)線膨張係数 18.5ppm)を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリエーテルアミド樹脂(“トーマイド”(登録商標)PA-200、富士化成工業社製、アミン価3、溶融粘度40.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用い、また、エタノール/トルエン混合溶剤(混合重量比率 エタノール1:トルエン4)に、(E)アルミナ充填材(“アドマファイン”(登録商標)AO-502、平均粒径 0.7μm、株式会社アドマテックス社製)300重量部が添加されるよう、予めサンドミルで分散処理した混合溶剤を用い、更に(2)支持体として、アルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリエーテルアミド樹脂(“トーマイド”(登録商標)PA-200、富士化成工業社製、アミン価3、溶融粘度40.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用い、また、エタノール/トルエン混合溶剤(混合重量比率 エタノール1:トルエン4)に、(E)窒化アルミニウム充填材(H、平均粒径 1.7μm、株式会社トクヤマ社製)300重量部が添加されるよう、予めサンドミルで分散処理した混合溶剤を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリエーテルアミド樹脂(“トーマイド”(登録商標)PA-200、富士化成工業社製、アミン価1、溶融粘度40.0Pa・s)と、ダイマー酸ポリアミド樹脂(“トーマイド”(登録商標)PA-100、富士化成工業社製、アミン価0、溶融粘度180.0Pa・s)とダイマー酸ポリアミド樹脂(“トーマイド”(登録商標)535、富士化成工業社製、アミン価50、溶融粘度1.0Pa・s)との重量比2:1:0.5混合物(アミン価7.1 溶融粘度 80Pa・s)(ダイマー酸ポリエーテルアミド樹脂1)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(実施例19)
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリアミド樹脂(“マクロメルト”(登録商標)6900、ヘンケルジャパン社製、アミン価0、溶融粘度10Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリアミド樹脂(“トーマイド”(登録商標)1350、富士化成工業社製、アミン価10、溶融粘度3.0Pa・s)100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として(A)ダイマー酸ポリアミド樹脂(“トーマイド”(登録商標)PA-100、富士化成工業社製、アミン価0、溶融粘度180.0Pa・s)100重量部、(B)フェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)、(C)、(D)成分として(A)ダイマー酸ポリアミド樹脂(“マクロメルト”(登録商標)6900、ヘンケルジャパン社製、アミン価0、溶融粘度10Pa・s)100重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用い、(B)成分を用いなかった以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
接着剤層シートの作製に当たり、(A)~(D)成分として、(A)アクリロニトリルポリブタジエン樹脂(“Nipol”(登録商標)1043、日本ゼオン社製、100重量部、(B)レゾールフェノール樹脂(CKM1634 昭和高分子社製)50重量部、(C)エポキシ樹脂(“エピコート”(登録商標)YL980、ジャパンエポキシレジン社製)80重量部、(D)硬化促進剤(2エチル-4メチルイミダゾール(2E4MZ)、東京化成社製)2重量部を用いた以外は実施例1と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(2)支持体としてアルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)を用いた以外は比較例2と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
(2)支持体であるアルミ箔(50μm厚(住軽アルミ株式会社製)線膨張係数 22.0ppm)の両面を、(3)支持体被覆層としてTg300℃、重量平均分子量11000、エポキシ樹脂混合比率10%のポリアミドイミド樹脂3.0μmで被覆したものを用いた以外は比較例2と同様の方法で作製し、前記(1)~(7)記載の評価を行った。
Claims (10)
- (1)接着剤層と、(2)支持体から構成される金属支持フレキシブル基板において、(2)支持体が金属箔にて構成されており、かつ、(1)接着剤層が、(A)ダイマー酸残基を含むポリアミド樹脂および、(B)フェノール樹脂を含有する事を特徴とする金属支持フレキシブル基板。
- (2)支持体の(1)接着剤層側および/またはその反対側に(3)支持体被覆層が構成されている事を特徴とする請求項1に記載の金属支持フレキシブル基板。
- (3)支持体被覆層が(2)支持体に対して剥離性を有する事を特徴とする請求項2に記載の金属支持フレキシブル基板。
- (3)支持体被覆層の厚みが2μm以上100μm以下である事を特徴とする請求項2または3に記載の金属支持フレキシブル基板。
- (3)支持体被覆層がポリアミドイミド樹脂を含有する事を特徴とする請求項2~4のいずれかに記載の金属支持フレキシブル基板。
- (A)ダイマー酸残基を含むポリアミド樹脂のアミン価が、0.5~10である事を特徴とする請求項1~5いずれかに記載の金属支持フレキシブル基板。
- (2)支持体が、銅箔、ステンレス箔、アルミニウム箔およびニッケル箔から選ばれる一つである事を特徴とする請求項1~6いずれかに記載の金属支持フレキシブル基板。
- 請求項1~7いずれか記載の金属支持フレキシブル基板を用いた、テープオートメーテッドボンディング用金属支持キャリアテープ。
- 請求項1~7いずれか記載の金属支持フレキシブル基板を用いた、LED実装用金属支持フレキシブル回路基板。
- 請求項1~7いずれか記載の金属支持フレキシブル基板を用いた回路形成用銅箔積層済み金属支持フレキシブル回路基板であって、回路形成用の金属層によって形成された回路が、フライングリード構造を有している事を特徴とする、回路形成用銅箔積層済み金属支持フレキシブル回路基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127025274A KR20130018717A (ko) | 2010-03-30 | 2011-03-03 | 금속 지지 플렉시블 기판 및 그것을 이용한 테이프 오토메이티드 본딩용 금속 지지 캐리어 테이프, led 실장용 금속 지지 플렉시블 회로 기판 및 회로 형성용 동박 적층된 금속 지지 플렉시블 회로 기판 |
JP2011512767A JP5682554B2 (ja) | 2010-03-30 | 2011-03-03 | 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、led実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板 |
SG2012071130A SG184257A1 (en) | 2010-03-30 | 2011-03-03 | Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit |
CN2011800167659A CN102822953A (zh) | 2010-03-30 | 2011-03-03 | 金属支持挠性基板及使用其的带式自动接合用金属支持载带、led安装用金属支持挠性电路基板及已层压电路形成用铜箔的金属支持挠性电路基板 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-077064 | 2010-03-30 | ||
JP2010077064 | 2010-03-30 |
Publications (1)
Publication Number | Publication Date |
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WO2011122232A1 true WO2011122232A1 (ja) | 2011-10-06 |
Family
ID=44711961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/054916 WO2011122232A1 (ja) | 2010-03-30 | 2011-03-03 | 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、led実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5682554B2 (ja) |
KR (1) | KR20130018717A (ja) |
CN (1) | CN102822953A (ja) |
SG (1) | SG184257A1 (ja) |
TW (1) | TW201207968A (ja) |
WO (1) | WO2011122232A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI748740B (zh) * | 2020-11-11 | 2021-12-01 | 宸寰科技有限公司 | 散熱導電軟板 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI627875B (zh) | 2012-07-18 | 2018-06-21 | 鐘化股份有限公司 | 導電層一體型軟性印刷基板 |
TWI586230B (zh) | 2012-07-18 | 2017-06-01 | 鐘化股份有限公司 | 補強板一體型軟性印刷基板 |
TWI800261B (zh) * | 2022-02-15 | 2023-04-21 | 台虹科技股份有限公司 | 卷狀層疊體的製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138167A (en) * | 1981-02-19 | 1982-08-26 | Sanyo Electric Co Ltd | Manufacture of semiconductor device |
JP2004031931A (ja) * | 2002-05-09 | 2004-01-29 | Toray Ind Inc | 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置 |
JP2006108174A (ja) * | 2004-09-30 | 2006-04-20 | Ajinomoto Co Inc | 回路基板用金属付きポリアミドイミドフィルム及びその製造方法 |
JP2008130772A (ja) * | 2006-11-20 | 2008-06-05 | Mitsui Mining & Smelting Co Ltd | 可撓性配線基板製造用複合積層体およびその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57120361A (en) * | 1981-01-17 | 1982-07-27 | Sanyo Electric Co Ltd | Structure of film substrate |
KR100621550B1 (ko) * | 2004-03-17 | 2006-09-14 | 삼성전자주식회사 | 테이프 배선 기판의 제조방법 |
JP2007035869A (ja) * | 2005-07-26 | 2007-02-08 | Nitto Denko Corp | Tab用テープキャリア |
CN1972557A (zh) * | 2005-10-14 | 2007-05-30 | 三井金属矿业株式会社 | 挠性覆铜层压板和薄膜载带及其制造方法、以及挠性印刷电路板、半导体装置 |
-
2011
- 2011-03-03 CN CN2011800167659A patent/CN102822953A/zh active Pending
- 2011-03-03 KR KR1020127025274A patent/KR20130018717A/ko not_active Application Discontinuation
- 2011-03-03 WO PCT/JP2011/054916 patent/WO2011122232A1/ja active Application Filing
- 2011-03-03 SG SG2012071130A patent/SG184257A1/en unknown
- 2011-03-03 JP JP2011512767A patent/JP5682554B2/ja not_active Expired - Fee Related
- 2011-03-29 TW TW100110739A patent/TW201207968A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138167A (en) * | 1981-02-19 | 1982-08-26 | Sanyo Electric Co Ltd | Manufacture of semiconductor device |
JP2004031931A (ja) * | 2002-05-09 | 2004-01-29 | Toray Ind Inc | 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置 |
JP2006108174A (ja) * | 2004-09-30 | 2006-04-20 | Ajinomoto Co Inc | 回路基板用金属付きポリアミドイミドフィルム及びその製造方法 |
JP2008130772A (ja) * | 2006-11-20 | 2008-06-05 | Mitsui Mining & Smelting Co Ltd | 可撓性配線基板製造用複合積層体およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI748740B (zh) * | 2020-11-11 | 2021-12-01 | 宸寰科技有限公司 | 散熱導電軟板 |
Also Published As
Publication number | Publication date |
---|---|
SG184257A1 (en) | 2012-11-29 |
CN102822953A (zh) | 2012-12-12 |
JP5682554B2 (ja) | 2015-03-11 |
KR20130018717A (ko) | 2013-02-25 |
JPWO2011122232A1 (ja) | 2013-07-08 |
TW201207968A (en) | 2012-02-16 |
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