WO2011116563A1 - Dispositif de dépôt en phase vapeur sous vide - Google Patents

Dispositif de dépôt en phase vapeur sous vide Download PDF

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Publication number
WO2011116563A1
WO2011116563A1 PCT/CN2010/074951 CN2010074951W WO2011116563A1 WO 2011116563 A1 WO2011116563 A1 WO 2011116563A1 CN 2010074951 W CN2010074951 W CN 2010074951W WO 2011116563 A1 WO2011116563 A1 WO 2011116563A1
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WO
WIPO (PCT)
Prior art keywords
vacuum
cavity
transmission
evaporation
sub
Prior art date
Application number
PCT/CN2010/074951
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English (en)
Chinese (zh)
Inventor
杨明生
王曼媛
刘惠森
范继良
王勇
张华�
Original Assignee
东莞宏威数码机械有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞宏威数码机械有限公司 filed Critical 东莞宏威数码机械有限公司
Publication of WO2011116563A1 publication Critical patent/WO2011116563A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

Definitions

  • the present invention relates to an auxiliary device in the organic light emitting diode production industry, and more particularly to a vacuum evaporation device for coating a substrate in the organic light emitting diode industry. Background technique
  • the 0LED display is a new product in the digital products
  • 0LED is the organic light-emitting diode (Organic light-emitting diode) (organic light-emitting diode (Organic light-emitting diode), because of the characteristics of light and thin, power saving, so in the display of digital products It has been widely used and has a large market potential.
  • OLED organic light-emitting diode
  • the application of OLED in the world is focused on flat panel displays, because 0LED is the only technology that can be compared with TFT-LCD in application, and is currently all display technologies.
  • the only display technology that can make large-size, high-brightness, high-resolution soft screen can be as thick as paper; but 0LEI) display (organic light-emitting display) and traditional TFT-LCD display (liquid crystal) The display) is different, it does not require a backlight, it uses a very thin coating of organic material and a glass substrate. When there is current, these organic materials will illuminate, and the OLED display can be made lighter and thinner. The viewing angle is larger and can save significant power. Accordingly, all devices that manufacture devices in the OLED industry must ensure OLEDs. Accuracy requirements, wherein, in the sector of the OLED device in the vacuum vapor deposition of the vapor deposition apparatus that is required to use one device of the device during manufacture 0LEI) in the industry.
  • a more common method is to deposit one or more layers of a film on the surface of the component by a "vapor deposition process".
  • the so-called “evaporation treatment” is mainly through an evaporation chamber for performing evaporation, and a group for providing evaporation.
  • a vacuum system with a vacuum and a system of vacuum power transmission systems for transporting glass substrates.
  • the vapor deposition material is placed in the evaporation boat in the evaporation chamber, and the evaporation boat is connected to the external power source.
  • the heat generated by the resistance effect of the evaporation boat is heated, and the evaporation material in the evaporation boat is heated until the melting point of the evaporation material is close to generate vapor, and the vapor evaporated, that is, :
  • the material of the vapor deposition material can be deposited on the surface of the substrate not far from the evaporation source to complete the coating of the 0LEI) device.
  • the known technical solution is to continuously rotate the substrate to be plated, and the rotation of the substrate may involve the alignment problem of the mask plate, thereby making the structural design of the vapor deposition processing device relatively complicated. And the film thickness uniformity is also difficult to effectively guarantee.
  • the thickness uniformity of the film layer is improved relative to the dot evaporation technique, but the conventional wire evaporation technology known in the prior art needs to be moved for loading in order to improve the precision of the vapor deposition film layer.
  • the evaporation boat of the evaporation source further needs additional configuration, for example: the sliding rail of the evaporation source, etc., so the wire evaporation device is bulky, and the cost of the wire evaporation device is increased, and the construction cost of the clean room is also occupied. .
  • An object of the present invention is to provide a vacuum vapor deposition apparatus which is simple in structure and can effectively improve coating precision.
  • the technical solution of the present invention is: Providing a vacuum evaporation device suitable for the evaporation process of a substrate in the organic light emitting diode industry, characterized in that the vacuum evaporation device comprises a transmission mechanism and steaming Plating mechanism>sensing control device and vacuum mechanism, the transmission mechanism includes a main cavity, The gate, the transmission component and the driver, the main cavity has a hollow structure, the two sides of the main cavity are respectively opposite to each other, and the two gates are respectively installed at the two gates, and the bottom of the main cavity is also opened.
  • the evaporation mechanism includes a sub-cavity, a baffle, a power assembly, an evaporation boat, and at least one evaporation source, wherein the sub-cavity has a hollow structure, and the evaporation boat is installed In the sub-chamber, the evaporation source is placed in the evaporation boat, and the sub-cavity is opposite to the connection port of the main cavity, and the baffle is mounted on the interface.
  • the baffle and the hollow structure of the sub-cavity form a sub-sealing cavity, the baffle and the main cavity Hollow knot Forming a main sealing cavity, the driver driving the baffle to open or close; when the baffle is opened, the main sealing cavity and the sub-sealing cavity are in communication with each other; when the baffle is closed, The main sealing cavity and the auxiliary sealing cavity are sealed independently of each other;
  • the sensing control device comprises a sensor and a controller electrically connected to the sensor, the sensor is installed in the main cavity, the control
  • the vacuum mechanism includes a rough pumping pipe, a vacuum pump and a gate valve, one end of the rough pumping pipe is in communication with the sub-cavity, and the other end of the rough pumping pipe is The vacuum pump is connected, and the crucible is installed between the vacuum pump and the sub-cavity.
  • the vacuum evaporation apparatus of the present invention comprises an evaporation mechanism, a transmission mechanism sensor and a vacuum mechanism.
  • the overall structure is simple and compact, which reduces the manufacturing and running costs of the vacuum evaporation apparatus to some extent.
  • the vacuum evaporation device can automatically control the temperature of the evaporation boat and control the operation speed of the transmission assembly, thereby controlling the coating degree of the vacuum evaporation device on the substrate, and effectively controlling the film thickness of the substrate.
  • the present invention is applicable to a vacuum evaporation device for vapor deposition process of a substrate in the organic light emitting diode industry, which is not only simple and compact in structure, but also capable of fully automatic monitoring of the vapor deposition film thickness of the substrate, thereby effectively improving the precision of the plating film and improving the vacuum evaporation.
  • Plating process efficiency and coating qualityong is not only simple and compact in structure, but also capable of fully automatic monitoring of the vapor deposition film thickness of the substrate, thereby effectively improving the precision of the plating film and improving the vacuum evaporation.
  • the vacuum evaporation apparatus further includes a damper mechanism, and the damper mechanism is coupled to the vacuum pump.
  • the damper mechanism in the vacuum evaporation device includes a spring and a bellows, and the spring and the bellows are both installed between the gate valve and the vacuum pump.
  • the shock absorbing mechanism with the spring and the bellows facilitates placing the vacuum evaporation device in a stable working environment, thereby improving the quality of the vapor deposited film layer and improving the overall vacuum evaporation. The service life of the device.
  • the vacuum evaporation apparatus of the present invention further comprises a vacuum gauge adapted to detect a vacuum state of the vacuum evaporation apparatus.
  • the vacuum gauge can detect the vacuum state of the vacuum evaporation apparatus at any time and convert it into real-time vacuum related data to instantly adjust the vacuum parameters.
  • the transmission assembly includes an input member, a transmission member, and a rack, the input member is coupled to the transmission member, and the transmission member is pivotally coupled to the rack, the tooth
  • the strip carries and transports the substrate.
  • the transmission component includes a first transmission shaft, a plurality of bevel gears, a plurality of second transmission shafts, and a transmission gear, the first transmission shaft is pivotally connected to the input member, and the bevel gear is pivotally connected to Each of the bevel gears is coupled to the end of each of the second transmission shafts, and the other end of each of the second transmission shafts is coupled to the transmission gear.
  • a transmission gear is pivotally coupled to the rack.
  • the vacuum evaporation apparatus of the present invention further includes a magnetic fluid that connects the driver to the input member.
  • the senor in the vacuum evaporation apparatus of the present invention is a crystal oscillation sensor.
  • the evaporation source includes a main evaporation source and a plurality of secondary evaporation sources, and the secondary evaporation source is located at a periphery of the main evaporation source, and the setting is such that the vacuum evaporation of the present invention is performed.
  • the evaporation of the substrate by the device is more uniform and the quality is higher.
  • the senor is located above the gate.
  • Figure i is a schematic view showing the structure of a vacuum evaporation apparatus of the present invention. detailed description
  • the present invention provides a vacuum evaporation apparatus, the vacuum evaporation apparatus junction
  • the structure is simple and compact, and can effectively improve the precision of the coating, and is suitable for the evaporation process of the substrate in the organic light emitting diode industry.
  • the structure of the present invention will be described below with reference to the drawings.
  • FIG. 1 is a schematic view showing the structure of a vacuum evaporation apparatus of the present invention.
  • the vacuum evaporation device is used for vapor-depositing a film on a substrate in an organic light-emitting diode industry, and the vacuum evaporation device 1 includes: a vaporization mechanism of a transmission mechanism, a sensing control device, and a vacuum mechanism portion.
  • the structure and the overall structure are compact.
  • the transport mechanism includes a main cavity 14 gate, a transmission assembly 143, and a driver (not shown).
  • the main cavity 141 has a hollow structure, and two sides of the main cavity are respectively opposite to each other with a gate (not shown), and the two gates are respectively installed at the two gates, and the bottom of the main cavity 141 A connection port 145 is also provided, and the transmission component 43 is connected between the two gates.
  • Two of the doors are mounted on the main cavity 141.
  • the shutter includes an entrance gate 1421 and a gate 1422 which are respectively mounted on opposite sides of the main cavity 141.
  • the driver is coupled to the inlet gate 1421, the outlet gate 1422, the transmission assembly 143, and the power assembly 133, and drives the inlet gate 1421, the outlet gate 1422, the transmission assembly, and the power assembly 133 accordingly.
  • the driver is connected to the gate and the transmission component 143. Specifically, the driver drives the inlet gate 1421 and the outlet gate 1422 to open or close relative to the main cavity 141;
  • the drive unit drives the transport assembly to transport the substrate 144; when the driver drives the power assembly 133 to control the baffle 132 to be in an open state relative to the sub-cavity 131, the main cavity 141 is coupled to the sub-cavity 131 through.
  • the transmission assembly 143 includes a magnetic fluid (not shown) input member 1431, a transmission member, and a rack 1432.
  • the transmission component includes a first transmission shaft 1433, six bevel gears 1434, six second transmission shafts 1435, and six transmission gears 1436.
  • the magnetic fluid is connected to and controlled by the driver, the magnetic fluid is connected to and controls the input member 1431, the input member 1431 is coupled to the first transmission shaft 1433, and the six bevel gears 1434 Pivotly connected to the first transmission shaft 1433, specifically, six bevel gears 1434 are respectively pivotally connected to the first transmission shaft 1433 at even intervals, each of the male gears 14 34 and each of the One end of the second transmission shaft 1435 is connected, the other end of each of the second transmission shafts 1435 is connected to the transmission gear 1436, the transmission gear 1436 is coupled with the rack 1432, and the transmission Gears 1436 are also pivotally coupled to the rack 1432 at even intervals.
  • the racks 1432 carry and transport the substrate 144. It should be noted that bevel gears, The second transmission shaft and the transmission gear are correspondingly connected in a matching form, and the number of the three is not limited to the number in the embodiment, depending on the shape and size of the substrate to be transported,
  • the vapor deposition mechanism includes a sub-chamber 13 JU baffle 132, a power assembly 133, an evaporation boat 135, and an evaporation source.
  • the sub-cavity 131 has a hollow structure
  • the evaporation boat 135 is installed in the sub-cavity i3 i
  • the evaporation source is placed in the evaporation boat 135 .
  • the evaporation source includes a primary evaporation source 1341 and two secondary evaporation sources 1342, both of which are located at a central location of the secondary cavity 131. Two of the secondary evaporation sources 1342 are located in a peripheral region of the primary evaporation source 1341.
  • two of the secondary evaporation sources 1342 are located on both sides of the primary evaporation source 1341, and are disposed symmetrically, the secondary cavity
  • the body 131 is opposite to the connecting port 145 of the main cavity 141 and is provided with a pair of interfaces 1311.
  • the baffle 132 is mounted between the port 145 and the pair of interfaces 1311.
  • the baffle 132 and the hollow structure of the sub-cavity 131 form a sub-sealing cavity
  • the baffle 132 and the hollow structure of the main cavity 141 form a main sealing cavity.
  • the evaporation source is located in the secondary sealing cavity, the power component 133 is connected to the baffle 132, and the power component 133 controls the baffle 132 to open or close relative to the sub cavity 131. status.
  • the driver drives the baffle 132 to open or close; when the baffle 132 is opened, the main sealing cavity and the sub-sealing cavity communicate with each other, the main evaporation source 1341 and the secondary evaporation source 1342: performing an evaporation process on the substrate 144; when the baffle 132 is closed, the main sealing cavity and the sub-sealing cavity are sealed independently of each other.
  • the secondary evaporation source may be three or more than three, depending on the specific situation.
  • a vacuum evaporation apparatus i of the present invention includes a sensing control apparatus.
  • the sensing control apparatus includes a sensor 12 and a controller (not shown) electrically connected to the sensor.
  • the sensor 12 is a crystal oscillating sensor and is mounted in the main cavity 141.
  • the controller electrically connects the evaporation boat 135 and the transmission assembly.
  • the setting of the sensor 12 can automatically control the temperature of the evaporation boat 135, thereby controlling the temperature of the evaporation source and controlling the operating speed of the transmission assembly, thereby controlling the degree of coating of the substrate 144 by the vacuum evaporation device i, and effectively controlling the coating thickness of the substrate 144.
  • the working environment of the vacuum evaporation apparatus 1 of the present invention is a vacuum state, and therefore the vacuum evaporation apparatus includes a vacuum mechanism.
  • the vacuum evaporation apparatus 1 includes a roughing pipe 151, a vacuum pump 152, and a valve 153.
  • the vacuum evaporation apparatus 1 further includes a shock absorbing mechanism, and the reduction
  • the shock mechanism includes a spring 161 and a bellows 162, and the shock absorbing mechanism is coupled to the vacuum pump 152.
  • the bellows 162 is connected to the vacuum pump 152 and communicates with the vacuum pump 152, and the bellows 162 is mounted in contact between the gate valve 153 and the vacuum pump 152.
  • a spring 161 is disposed around the vacuum pump 152, and a spring 161 is connected to the gate valve 153, and the other end is connected to the vacuum pump 152.
  • One end of the rough pumping pipe 151 is in communication with the sub-cavity 131, and the other end of the rough pumping pipe 151 is connected to the vacuum pump 152.
  • the gate valve 153 is mounted on the vacuum pump 152 and the sub-cavity. Between body 131.
  • the arrangement of the shock absorbing mechanism having the spring i61 and the bellows 162 reduces the vibration of the vacuum mechanism, facilitating placing the vacuum vapor deposition device i in a stable state. Working environment, thereby improving the quality of the vapor deposited film layer and improving the service life of the overall vacuum evaporation device 1
  • the vacuum evaporation apparatus 1 further includes a vacuum gauge 17.
  • the vacuum gauge 17 is disposed on the sensor 12, and the vacuum gauge 17 is adapted to detect the vacuum evaporation apparatus. 1 vacuum state.
  • the vacuum gauge 17 can detect the vacuum state of the vacuum evaporation apparatus 1 at any time and convert it into real-time vacuum related data, so as to adjust the vacuum parameter of the vacuum evaporation apparatus 1 in time to adjust the appropriate vacuum state,
  • the driver drives the inlet door 1421 to be opened relative to the main cavity while the power main member 33 is in the drive.
  • the baffle 132 mounted on the sub-cavity 131 is also in an open state with respect to the sub-cavity 131.
  • the main cavity 141 and the sub-chamber 31 are connected through the connection port 145 and the pair interface 1311.
  • the main evaporation source 1341 and the secondary evaporation source 1342 are always in an evaporation state in the evaporation boat 135 having a constant heat.
  • the driver is transmitted to the i-input part M3 i through the external force of the magnetic fluid, and the input part 1431 drives the first transmission shaft 1433 connected thereto to rotate, and then the first transmission shaft 1433 drives the six bevel gears distributedly connected thereto. 434 rotates at the same time, the bevel gear 1434 synchronously drives the corresponding second transmission shaft 1435 to rotate, and then the second rotation gear 1435 drives the rack 1432 to move, and the rack 1432 finally drives the carrier for steaming thereon.
  • the plated substrate 144 moves. During the movement of the substrate 144, the primary evaporation source 1341 and the secondary evaporation source 1342 vaporize the organic material onto the base 144.
  • the vacuum mechanism maintains the main cavity 141 and the sub-cavity 131 in a proper vacuum state, and the vacuum gauge 17 detects the vacuum at any time.
  • the vacuum state of the vapor deposition apparatus 1 is converted into real-time vacuum-related data, and the vacuum parameters of the vacuum evaporation apparatus i are immediately adjusted to adjust an appropriate vacuum state.
  • the vacuum evaporation apparatus 1 of the present invention is further provided with a sensor 12, which can automatically control the temperature of the main evaporation source 1341 and the secondary evaporation source 1342 and control the operation speed of the transmission component during the evaporation process, thereby controlling the vacuum evaporation
  • the degree of plating of the substrate 144 by the device 1 effectively controls the thickness of the deposited film of the substrate 144.
  • the driver drives the gate 1422 to be in an open state relative to the main cavity 141, and the rack 1432 carries the substrate 144 away from the main cavity 141.
  • the vacuum evaporation apparatus of the present invention comprises a vapor deposition mechanism transmission mechanism, a sensor and a vacuum mechanism.
  • the overall structure is simple and compact, which reduces the manufacturing and running costs of the vacuum evaporation apparatus to some extent.
  • the vacuum evaporation apparatus employs a sensor, the temperature of the evaporation boat can be automatically controlled and the operation speed of the transmission unit can be controlled, thereby controlling the degree of coating of the substrate by the vacuum evaporation apparatus, and effectively controlling the film thickness of the substrate.
  • the present invention is applicable to a vacuum evaporation apparatus for a vapor deposition process of a substrate in the organic light emitting diode industry, which is not only simple and compact in structure, but also capable of fully realizing the thickness of the vapor deposition film of the substrate, and effectively improving the precision of the coating from 3 ⁇ 4.
  • the efficiency of the evaporation process and the quality of the coating is applicable to a vacuum evaporation apparatus for a vapor deposition process of a substrate in the organic light emitting diode industry, which is not only simple and compact in structure, but also capable of fully realizing the thickness of the vapor deposition film of the substrate, and effectively improving the precision of the coating from 3 ⁇ 4.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Un dispositif de dépôt en phase vapeur sous vide (1) comprend un mécanisme de transmission, un mécanisme de dépôt en phase vapeur, un contrôleur capteur et un mécanisme sous vide, le mécanisme de transmission comprenant un corps de chambre principale (141), des obturateurs, un ensemble de transmission (143) et un dispositif d'entraînement, des ouvertures d'obturateur étant ménagées de part et d'autre du corps de chambre principale (141). Une ouverture de liaison (145) est ménagée sur la partie inférieure du corps de chambre principale (141), le dispositif d'entraînement étant relié aux obturateurs et à l'ensemble de transmission (143) et entraînant la plaque de substrat (144) pour la déplacer sur l'ensemble de transmission (143). Le mécanisme de dépôt en phase vapeur comprend un corps de sous-chambre (131), un écran (132), un ensemble de puissance (133), des cuves de dépôt en phase vapeur (135) et des sources de dépôt en phase vapeur, les cuves de dépôt en phase vapeur (135) dans lesquelles sont disposées les sources de dépôt en phase vapeur, sont montées dans le corps de sous-chambre (131). Une ouverture de butée (1311) est placée là où le corps de sous-chambre (131) fait face à l'ouverture de liaison (145) du corps de chambre principale (145). L'écran est, quant à lui, placé entre l'ouverture de liaison (145) et l'ouverture de butée (1311). Le contrôleur capteur comprend un capteur (12) et un contrôleur, le contrôleur étant électriquement connecté à l'ensemble de transmission (143) et la cuve de dépôt en phase vapeur (135). Le mécanisme sous vide comprend des tubes de dépôt préliminaire en phase vapeur (151), une pompe sous vide (152) et des robinets vanne (153), les tubes de dépôt préliminaire en phase vapeur (151) étant en communication avec le corps de sous-chambre (131) et connectés à la pompe sous vide (152).
PCT/CN2010/074951 2010-03-23 2010-07-03 Dispositif de dépôt en phase vapeur sous vide WO2011116563A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2010101319938A CN101876058B (zh) 2010-03-23 2010-03-23 真空蒸镀装置
CN201010131993.8 2010-03-23

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WO2011116563A1 true WO2011116563A1 (fr) 2011-09-29

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WO (1) WO2011116563A1 (fr)

Cited By (1)

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WO2015062311A1 (fr) * 2013-10-30 2015-05-07 京东方科技集团股份有限公司 Appareil de dépôt sous vide

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CN102703867A (zh) * 2012-01-13 2012-10-03 东莞宏威数码机械有限公司 电子轰击镀膜机
CN203741405U (zh) * 2014-03-26 2014-07-30 宋玉琪 真空炉体
CN104018122B (zh) * 2014-06-10 2016-04-20 京东方科技集团股份有限公司 一种收集装置
CN105296935B (zh) * 2015-12-02 2017-11-21 苏州奥夫特光学技术有限公司 滤光片真空蒸镀设备

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WO2015062311A1 (fr) * 2013-10-30 2015-05-07 京东方科技集团股份有限公司 Appareil de dépôt sous vide
US10316401B2 (en) 2013-10-30 2019-06-11 Boe Technology Group Co., Ltd. Vacuum evaporation device

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CN101876058B (zh) 2012-07-11
CN101876058A (zh) 2010-11-03

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