WO2011116563A1

WO2011116563A1 - Vacuum vapor deposition apparatus

Info

Publication number: WO2011116563A1
Application number: PCT/CN2010/074951
Authority: WO
Inventors: 杨明生; 王曼媛; 刘惠森; 范继良; 王勇; 张华�
Original assignee: 东莞宏威数码机械有限公司
Priority date: 2010-03-23
Filing date: 2010-07-03
Publication date: 2011-09-29
Also published as: CN101876058B; CN101876058A

Abstract

A vacuum vapor deposition apparatus (1) comprising a transmission mechanism, a vapor deposition mechanism, a sensor controller and a vacuum mechanism. The transmission mechanism comprises a main chamber (141), shutters, a transmission assembly (143) and a driver, wherein shutter gates, on which the shutters are installed, are set on both sides of the main chamber (141); a connection opening (145) is set on the bottom of the main chamber (141); the driver is connected with the shutters and the transmission assembly (143) and drives the substrate plate (144) to travel on the transmission assembly (143). The vapor deposition mechanism comprises a sub-chamber (131), a shield (132), a power assembly (133), evaporation boats (135) and vapor sources, wherein the evaporation boats (135), in which the vapor sources are disposed, are mounted in the sub-chamber (131); an abutting opening (1311) is set at the place the sub-chamber (131) faces the connection opening (145) of the main chamber (141); and the shield (132) is set between the connection opening (145) and the abutting opening (1311). The sensor controller comprises a sensor (12) and a controller, the controller is electrically connected with the transmission assembly (143) and the evaporation boat (135). The vacuum mechanism comprises preliminary-vacuumizing tubes (151), a vacuum pump (152) and gate valves (153), the preliminary-vacuumizing tubes (151) are in communication with the sub-chamber (131) and connected with the vacuum pump (152).

Description

Vacuum evaporation device

The present invention relates to an auxiliary device in the organic light emitting diode production industry, and more particularly to a vacuum evaporation device for coating a substrate in the organic light emitting diode industry. Background technique

With the continuous development of the economy, the continuous advancement of science and technology, and the decreasing energy of the world, people pay more and more attention to energy conservation and utilization efficiency in production, which makes people and nature develop harmoniously to meet the requirements of China's new industrialization road.

In the display industry of digital products, in order to save energy and reduce production costs, enterprises have increased investment in research and development and are constantly pursuing energy-saving new products. Among them, the 0LED display is a new product in the digital products, 0LED is the organic light-emitting diode (Organic light-emitting diode) (organic light-emitting diode (Organic light-emitting diode), because of the characteristics of light and thin, power saving, so in the display of digital products It has been widely used and has a large market potential. At present, the application of OLED in the world is focused on flat panel displays, because 0LED is the only technology that can be compared with TFT-LCD in application, and is currently all display technologies. Among them, the only display technology that can make large-size, high-brightness, high-resolution soft screen can be as thick as paper; but 0LEI) display (organic light-emitting display) and traditional TFT-LCD display (liquid crystal) The display) is different, it does not require a backlight, it uses a very thin coating of organic material and a glass substrate. When there is current, these organic materials will illuminate, and the OLED display can be made lighter and thinner. The viewing angle is larger and can save significant power. Accordingly, all devices that manufacture devices in the OLED industry must ensure OLEDs. Accuracy requirements, wherein, in the sector of the OLED device in the vacuum vapor deposition of the vapor deposition apparatus that is required to use one device of the device during manufacture 0LEI) in the industry.

At present, in the field of OLED manufacturing, in order to impart certain characteristics to the components to be manufactured, a more common method is to deposit one or more layers of a film on the surface of the component by a "vapor deposition process". The so-called "evaporation treatment" is mainly through an evaporation chamber for performing evaporation, and a group for providing evaporation. A vacuum system with a vacuum and a system of vacuum power transmission systems for transporting glass substrates. The vapor deposition material is placed in the evaporation boat in the evaporation chamber, and the evaporation boat is connected to the external power source. When the appropriate power source flows into the evaporation boat, the heat generated by the resistance effect of the evaporation boat is heated, and the evaporation material in the evaporation boat is heated until the melting point of the evaporation material is close to generate vapor, and the vapor evaporated, that is, : The material of the vapor deposition material can be deposited on the surface of the substrate not far from the evaporation source to complete the coating of the 0LEI) device.

Among the well-known evaporation methods of OLED devices in the industry, "point evaporation", "line evaporation", "organic vapor phase depos it ion (OVPD)" and "scanning deposition process (Depos) are commonly used. It ion Scan Proces s; DSP) " , of which the more mature coating technology is "dot evaporation" and "line evaporation". The existing spot evaporation technique is likely to cause a difference in the thickness of the film layer due to a large difference in the direction of the vapor during the vapor deposition process. In order to improve the thickness of the film layer, the known technical solution is to continuously rotate the substrate to be plated, and the rotation of the substrate may involve the alignment problem of the mask plate, thereby making the structural design of the vapor deposition processing device relatively complicated. And the film thickness uniformity is also difficult to effectively guarantee. For the wire evaporation technology, the thickness uniformity of the film layer is improved relative to the dot evaporation technique, but the conventional wire evaporation technology known in the prior art needs to be moved for loading in order to improve the precision of the vapor deposition film layer. The evaporation boat of the evaporation source further needs additional configuration, for example: the sliding rail of the evaporation source, etc., so the wire evaporation device is bulky, and the cost of the wire evaporation device is increased, and the construction cost of the clean room is also occupied. .

Therefore, there is a need for a vacuum evaporation apparatus which is simple in structure and can improve the precision of coating to overcome the above drawbacks. Summary of the invention

SUMMARY OF THE INVENTION An object of the present invention is to provide a vacuum vapor deposition apparatus which is simple in structure and can effectively improve coating precision.

In order to achieve the above, the technical solution of the present invention is: Providing a vacuum evaporation device suitable for the evaporation process of a substrate in the organic light emitting diode industry, characterized in that the vacuum evaporation device comprises a transmission mechanism and steaming Plating mechanism>sensing control device and vacuum mechanism, the transmission mechanism includes a main cavity, The gate, the transmission component and the driver, the main cavity has a hollow structure, the two sides of the main cavity are respectively opposite to each other, and the two gates are respectively installed at the two gates, and the bottom of the main cavity is also opened. a connection port, the transmission component is connected between the two gates, the driver is connected to the gate and the transmission component, and the driver drives the opening or closing of the gate relative to the gate, the driver Driving the substrate to move on the transport assembly; the evaporation mechanism includes a sub-cavity, a baffle, a power assembly, an evaporation boat, and at least one evaporation source, wherein the sub-cavity has a hollow structure, and the evaporation boat is installed In the sub-chamber, the evaporation source is placed in the evaporation boat, and the sub-cavity is opposite to the connection port of the main cavity, and the baffle is mounted on the interface. Between the connection port and the pair of interfaces, and the baffle is connected to the power component, the baffle and the hollow structure of the sub-cavity form a sub-sealing cavity, the baffle and the main cavity Hollow knot Forming a main sealing cavity, the driver driving the baffle to open or close; when the baffle is opened, the main sealing cavity and the sub-sealing cavity are in communication with each other; when the baffle is closed, The main sealing cavity and the auxiliary sealing cavity are sealed independently of each other; the sensing control device comprises a sensor and a controller electrically connected to the sensor, the sensor is installed in the main cavity, the control The vacuum mechanism includes a rough pumping pipe, a vacuum pump and a gate valve, one end of the rough pumping pipe is in communication with the sub-cavity, and the other end of the rough pumping pipe is The vacuum pump is connected, and the crucible is installed between the vacuum pump and the sub-cavity.

Compared with the prior art, the vacuum evaporation apparatus of the present invention comprises an evaporation mechanism, a transmission mechanism sensor and a vacuum mechanism. The overall structure is simple and compact, which reduces the manufacturing and running costs of the vacuum evaporation apparatus to some extent. In addition, the vacuum evaporation device can automatically control the temperature of the evaporation boat and control the operation speed of the transmission assembly, thereby controlling the coating degree of the vacuum evaporation device on the substrate, and effectively controlling the film thickness of the substrate. Therefore, the present invention is applicable to a vacuum evaporation device for vapor deposition process of a substrate in the organic light emitting diode industry, which is not only simple and compact in structure, but also capable of fully automatic monitoring of the vapor deposition film thickness of the substrate, thereby effectively improving the precision of the plating film and improving the vacuum evaporation. Plating process efficiency and coating quality „

In an embodiment of the invention, the vacuum evaporation apparatus further includes a damper mechanism, and the damper mechanism is coupled to the vacuum pump. Optionally, the damper mechanism in the vacuum evaporation device includes a spring and a bellows, and the spring and the bellows are both installed between the gate valve and the vacuum pump. When the vacuum pump is in operation, the shock absorbing mechanism with the spring and the bellows facilitates placing the vacuum evaporation device in a stable working environment, thereby improving the quality of the vapor deposited film layer and improving the overall vacuum evaporation. The service life of the device.

Preferably, the vacuum evaporation apparatus of the present invention further comprises a vacuum gauge adapted to detect a vacuum state of the vacuum evaporation apparatus. The vacuum gauge can detect the vacuum state of the vacuum evaporation apparatus at any time and convert it into real-time vacuum related data to instantly adjust the vacuum parameters.

In another embodiment of the present invention, the transmission assembly includes an input member, a transmission member, and a rack, the input member is coupled to the transmission member, and the transmission member is pivotally coupled to the rack, the tooth The strip carries and transports the substrate. Preferably, the transmission component includes a first transmission shaft, a plurality of bevel gears, a plurality of second transmission shafts, and a transmission gear, the first transmission shaft is pivotally connected to the input member, and the bevel gear is pivotally connected to Each of the bevel gears is coupled to the end of each of the second transmission shafts, and the other end of each of the second transmission shafts is coupled to the transmission gear. A transmission gear is pivotally coupled to the rack. The transmission assembly is simple and compact in structure, which is advantageous in saving the cost of the vacuum evaporation apparatus of the present invention.

Optionally, the vacuum evaporation apparatus of the present invention further includes a magnetic fluid that connects the driver to the input member.

Preferably, the sensor in the vacuum evaporation apparatus of the present invention is a crystal oscillation sensor.

Preferably, in the vacuum evaporation apparatus of the present invention, the evaporation source includes a main evaporation source and a plurality of secondary evaporation sources, and the secondary evaporation source is located at a periphery of the main evaporation source, and the setting is such that the vacuum evaporation of the present invention is performed. The evaporation of the substrate by the device is more uniform and the quality is higher.

Preferably, in the vacuum evaporation apparatus of the present invention, the sensor is located above the gate. i diagram description

Figure i is a schematic view showing the structure of a vacuum evaporation apparatus of the present invention. detailed description

Embodiments of the present invention will now be described in detail with reference to the drawings, As described above, the present invention provides a vacuum evaporation apparatus, the vacuum evaporation apparatus junction The structure is simple and compact, and can effectively improve the precision of the coating, and is suitable for the evaporation process of the substrate in the organic light emitting diode industry. The structure of the present invention will be described below with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of a vacuum evaporation apparatus of the present invention. Referring to FIG. 1 , the vacuum evaporation device is used for vapor-depositing a film on a substrate in an organic light-emitting diode industry, and the vacuum evaporation device 1 includes: a vaporization mechanism of a transmission mechanism, a sensing control device, and a vacuum mechanism portion. The structure and the overall structure are compact.

Referring to FIG. 1, the transport mechanism includes a main cavity 14 gate, a transmission assembly 143, and a driver (not shown). The main cavity 141 has a hollow structure, and two sides of the main cavity are respectively opposite to each other with a gate (not shown), and the two gates are respectively installed at the two gates, and the bottom of the main cavity 141 A connection port 145 is also provided, and the transmission component 43 is connected between the two gates. Two of the doors are mounted on the main cavity 141. The shutter includes an entrance gate 1421 and a gate 1422 which are respectively mounted on opposite sides of the main cavity 141. The driver is coupled to the inlet gate 1421, the outlet gate 1422, the transmission assembly 143, and the power assembly 133, and drives the inlet gate 1421, the outlet gate 1422, the transmission assembly, and the power assembly 133 accordingly. The driver is connected to the gate and the transmission component 143. Specifically, the driver drives the inlet gate 1421 and the outlet gate 1422 to open or close relative to the main cavity 141; The drive unit drives the transport assembly to transport the substrate 144; when the driver drives the power assembly 133 to control the baffle 132 to be in an open state relative to the sub-cavity 131, the main cavity 141 is coupled to the sub-cavity 131 through. The transmission assembly 143 includes a magnetic fluid (not shown) input member 1431, a transmission member, and a rack 1432. The transmission component includes a first transmission shaft 1433, six bevel gears 1434, six second transmission shafts 1435, and six transmission gears 1436. The magnetic fluid is connected to and controlled by the driver, the magnetic fluid is connected to and controls the input member 1431, the input member 1431 is coupled to the first transmission shaft 1433, and the six bevel gears 1434 Pivotly connected to the first transmission shaft 1433, specifically, six bevel gears 1434 are respectively pivotally connected to the first transmission shaft 1433 at even intervals, each of the male gears ₁₄ 34 and each of the One end of the second transmission shaft 1435 is connected, the other end of each of the second transmission shafts 1435 is connected to the transmission gear 1436, the transmission gear 1436 is coupled with the rack 1432, and the transmission Gears 1436 are also pivotally coupled to the rack 1432 at even intervals. The racks 1432 carry and transport the substrate 144. It should be noted that bevel gears, The second transmission shaft and the transmission gear are correspondingly connected in a matching form, and the number of the three is not limited to the number in the embodiment, depending on the shape and size of the substrate to be transported,

Referring to Figure 1, the vapor deposition mechanism includes a sub-chamber 13 JU baffle 132, a power assembly 133, an evaporation boat 135, and an evaporation source. In this embodiment, the sub-cavity 131 has a hollow structure, the evaporation boat 135 is installed in the sub-cavity i3 i , and the evaporation source is placed in the evaporation boat 135 . The evaporation source includes a primary evaporation source 1341 and two secondary evaporation sources 1342, both of which are located at a central location of the secondary cavity 131. Two of the secondary evaporation sources 1342 are located in a peripheral region of the primary evaporation source 1341. Specifically, two of the secondary evaporation sources 1342 are located on both sides of the primary evaporation source 1341, and are disposed symmetrically, the secondary cavity The body 131 is opposite to the connecting port 145 of the main cavity 141 and is provided with a pair of interfaces 1311. The baffle 132 is mounted between the port 145 and the pair of interfaces 1311. The baffle 132 and the hollow structure of the sub-cavity 131 form a sub-sealing cavity, and the baffle 132 and the hollow structure of the main cavity 141 form a main sealing cavity. The evaporation source is located in the secondary sealing cavity, the power component 133 is connected to the baffle 132, and the power component 133 controls the baffle 132 to open or close relative to the sub cavity 131. status. In detail, the driver drives the baffle 132 to open or close; when the baffle 132 is opened, the main sealing cavity and the sub-sealing cavity communicate with each other, the main evaporation source 1341 and the secondary evaporation source 1342: performing an evaporation process on the substrate 144; when the baffle 132 is closed, the main sealing cavity and the sub-sealing cavity are sealed independently of each other. It should be noted that the secondary evaporation source may be three or more than three, depending on the specific situation.

Referring to Fig. 1, a vacuum evaporation apparatus i of the present invention includes a sensing control apparatus. In the present embodiment, the sensing control apparatus includes a sensor 12 and a controller (not shown) electrically connected to the sensor. The sensor 12 is a crystal oscillating sensor and is mounted in the main cavity 141. The controller electrically connects the evaporation boat 135 and the transmission assembly. The setting of the sensor 12 can automatically control the temperature of the evaporation boat 135, thereby controlling the temperature of the evaporation source and controlling the operating speed of the transmission assembly, thereby controlling the degree of coating of the substrate 144 by the vacuum evaporation device i, and effectively controlling the coating thickness of the substrate 144. .

The working environment of the vacuum evaporation apparatus 1 of the present invention is a vacuum state, and therefore the vacuum evaporation apparatus includes a vacuum mechanism. Referring to FIG. 1, the vacuum evaporation apparatus 1 includes a roughing pipe 151, a vacuum pump 152, and a valve 153. In this embodiment, the vacuum evaporation apparatus 1 further includes a shock absorbing mechanism, and the reduction The shock mechanism includes a spring 161 and a bellows 162, and the shock absorbing mechanism is coupled to the vacuum pump 152. Specifically, the bellows 162 is connected to the vacuum pump 152 and communicates with the vacuum pump 152, and the bellows 162 is mounted in contact between the gate valve 153 and the vacuum pump 152. A spring 161 is disposed around the vacuum pump 152, and a spring 161 is connected to the gate valve 153, and the other end is connected to the vacuum pump 152. One end of the rough pumping pipe 151 is in communication with the sub-cavity 131, and the other end of the rough pumping pipe 151 is connected to the vacuum pump 152. The gate valve 153 is mounted on the vacuum pump 152 and the sub-cavity. Between body 131. When the vacuum pump 152 is operated with the rough pumping pipe 151, the arrangement of the shock absorbing mechanism having the spring i61 and the bellows 162 reduces the vibration of the vacuum mechanism, facilitating placing the vacuum vapor deposition device i in a stable state. Working environment, thereby improving the quality of the vapor deposited film layer and improving the service life of the overall vacuum evaporation device 1

Referring to FIG. 1, the vacuum evaporation apparatus 1 further includes a vacuum gauge 17. In the embodiment, the vacuum gauge 17 is disposed on the sensor 12, and the vacuum gauge 17 is adapted to detect the vacuum evaporation apparatus. 1 vacuum state. The vacuum gauge 17 can detect the vacuum state of the vacuum evaporation apparatus 1 at any time and convert it into real-time vacuum related data, so as to adjust the vacuum parameter of the vacuum evaporation apparatus 1 in time to adjust the appropriate vacuum state,

The working principle of the vacuum evaporation apparatus of the present invention will be described in detail below with reference to the accompanying drawings: Referring to the drawings, first, the driver drives the inlet door 1421 to be opened relative to the main cavity while the power main member 33 is in the drive. Under the driving, the baffle 132 mounted on the sub-cavity 131 is also in an open state with respect to the sub-cavity 131. At this time, the main cavity 141 and the sub-chamber 31 are connected through the connection port 145 and the pair interface 1311. The main evaporation source 1341 and the secondary evaporation source 1342 are always in an evaporation state in the evaporation boat 135 having a constant heat. Then, the driver is transmitted to the i-input part M3 i through the external force of the magnetic fluid, and the input part 1431 drives the first transmission shaft 1433 connected thereto to rotate, and then the first transmission shaft 1433 drives the six bevel gears distributedly connected thereto. 434 rotates at the same time, the bevel gear 1434 synchronously drives the corresponding second transmission shaft 1435 to rotate, and then the second rotation gear 1435 drives the rack 1432 to move, and the rack 1432 finally drives the carrier for steaming thereon. The plated substrate 144 moves. During the movement of the substrate 144, the primary evaporation source 1341 and the secondary evaporation source 1342 vaporize the organic material onto the base 144. In this process, the vacuum mechanism maintains the main cavity 141 and the sub-cavity 131 in a proper vacuum state, and the vacuum gauge 17 detects the vacuum at any time. The vacuum state of the vapor deposition apparatus 1 is converted into real-time vacuum-related data, and the vacuum parameters of the vacuum evaporation apparatus i are immediately adjusted to adjust an appropriate vacuum state. Moreover, the vacuum evaporation apparatus 1 of the present invention is further provided with a sensor 12, which can automatically control the temperature of the main evaporation source 1341 and the secondary evaporation source 1342 and control the operation speed of the transmission component during the evaporation process, thereby controlling the vacuum evaporation The degree of plating of the substrate 144 by the device 1 effectively controls the thickness of the deposited film of the substrate 144. Finally, when the substrate 144 reaches a predetermined degree of coating of the coating, the driver drives the gate 1422 to be in an open state relative to the main cavity 141, and the rack 1432 carries the substrate 144 away from the main cavity 141. Thus far, the vapor deposition process of the vacuum evaporation apparatus 1 of the present invention is completed.

Compared with the prior art, the vacuum evaporation apparatus of the present invention comprises a vapor deposition mechanism transmission mechanism, a sensor and a vacuum mechanism. The overall structure is simple and compact, which reduces the manufacturing and running costs of the vacuum evaporation apparatus to some extent. Further, since the vacuum evaporation apparatus employs a sensor, the temperature of the evaporation boat can be automatically controlled and the operation speed of the transmission unit can be controlled, thereby controlling the degree of coating of the substrate by the vacuum evaporation apparatus, and effectively controlling the film thickness of the substrate. Therefore, the present invention is applicable to a vacuum evaporation apparatus for a vapor deposition process of a substrate in the organic light emitting diode industry, which is not only simple and compact in structure, but also capable of fully realizing the thickness of the vapor deposition film of the substrate, and effectively improving the precision of the coating from 3⁄4. The efficiency of the evaporation process and the quality of the coating

The above disclosure is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes made by the scope of the present invention remain within the scope of the present invention.

Claims

Demand

A vacuum evaporation apparatus suitable for an evaporation process of a substrate in the organic light emitting diode industry, characterized in that the vacuum evaporation apparatus comprises:

a transmission mechanism, the transmission mechanism comprises a main cavity, a width π, a transmission component and a driver, wherein the main cavity has a hollow structure, and the main cavity is respectively opposite to each other with a gate, and the two gates are respectively installed in the two At the gate, the bottom of the main cavity is further provided with a connection port, the transmission component is connected between the two gates, and the driver is connected with the gate and the transmission component, the drive drive station The opening or closing of the gate relative to the gate, the driver driving the substrate to move on the transmission assembly;

An evaporation mechanism, the vapor deposition mechanism includes a sub-cavity, a baffle, a power assembly, an evaporation boat, and at least one evaporation source, wherein the sub-cavity has a hollow structure, and the evaporation vessel is installed in the sub-cavity The evaporation source is placed in the evaporation boat, and the auxiliary cavity is provided with a pair of interfaces at the connection port of the main cavity, and the baffle is mounted on the connection port and the pair of interfaces Between the baffle and the power assembly, the baffle and the hollow structure of the sub-cavity form a sub-sealing cavity, and the baffle forms a main seal with the hollow structure of the main cavity a cavity, the driver driving the baffle to open or close; when the baffle is opened, the main sealing cavity and the sub-sealing cavity are in communication with each other; when the baffle is closed, the main seal is empty The cavity and the auxiliary sealing cavity are sealed independently of each other;

a sensing control device, comprising: a sensor and a controller electrically connected to the sensor, the sensor being installed in the main cavity, the controller being electrically connected to the transmission component and the evaporation boat ; as well as

a vacuum mechanism, the vacuum mechanism includes a rough pumping pipe, a vacuum pump, and a gate valve, one end of the rough pumping pipe is in communication with the auxiliary cavity, and the other end of the rough pumping pipe is connected to the vacuum pump, and the gate valve is installed Between the vacuum pump and the secondary cavity.

2. A vacuum evaporation apparatus according to claim 1, further comprising a damper mechanism, said damper mechanism being coupled to said vacuum pump.

3. The vacuum evaporation apparatus according to claim 2, wherein the damper mechanism comprises a spring and a bellows, and the spring and the bellows are both installed between the gate valve and the vacuum pump.

4. The vacuum evaporation apparatus according to claim 1, further comprising a vacuum gauge adapted to detect a vacuum state of the vacuum evaporation apparatus.

5. The vacuum evaporation apparatus according to claim 1, wherein said transmission assembly comprises an input member, a transmission member, and a rack, said input member being coupled to said transmission member, said transmission member being coupled to said transmission member A rack that carries and transports the substrate.

6. The vacuum evaporation apparatus according to claim 5, wherein the transmission member comprises a first transmission shaft, a plurality of bevel gears, a plurality of second transmission shafts, and a transmission gear, and the first transmission shaft 抠Connected to the input member, the bevel gear is pivotally connected to the first transmission shaft, and each of the bevel gears is connected to one end of each of the second transmission shafts, and each of the second transmission shafts The other end is connected to the transmission gear, and the transmission gear is pivotally connected to the rack.

7. The vacuum evaporation apparatus according to claim 5, further comprising a magnetic fluid, the magnetic fluid connecting the driver and the input member.

The vacuum evaporation apparatus according to claim 1, wherein said evaporation source comprises a primary evaporation source and a plurality of secondary evaporation sources, said secondary evaporation source being located at a periphery of said primary evaporation source.

9. The vacuum evaporation apparatus according to claim 1, wherein the sensor is a crystal oscillation sensor.

10. The vacuum evaporation apparatus according to claim 1, wherein said sensor is located above said idle.