WO2011111965A3 - Oled 디바이스용 감광성 유기 절연재 조성물 - Google Patents
Oled 디바이스용 감광성 유기 절연재 조성물 Download PDFInfo
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- WO2011111965A3 WO2011111965A3 PCT/KR2011/001562 KR2011001562W WO2011111965A3 WO 2011111965 A3 WO2011111965 A3 WO 2011111965A3 KR 2011001562 W KR2011001562 W KR 2011001562W WO 2011111965 A3 WO2011111965 A3 WO 2011111965A3
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- WO
- WIPO (PCT)
- Prior art keywords
- organic insulation
- photosensitive organic
- composition
- precursor
- polyimide
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/62—Insulating-layers or insulating-films on metal bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Electroluminescent Light Sources (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 화학식 1 또는 화학식 2로 표시되는 폴리이미드 또는 그 전구체 및 이를 포함하는 감광성 유기 절연재 조성물에 관한 것이다. 상기 폴리이미드 또는 그 전구체는 폴리알킬렌옥사이드를 포함하는 디아민으로부터 제조되는 것을 특징으로 한다. 본 발명의 감광성 유기 절연재 조성물은 OLED 디바이스용으로 사용시 저온경화 및 경화시간이 단축되고, 낮은 테이퍼 앵글을 형성할 수 있으며, 고감도 및 고잔막 구현이 가능하다. 또한, 포지티브 감광성 조성물로서 노광부의 알칼리 용액에 대한 용해도가 우수하여 현상이물의 발생을 최소한으로 줄일 수 있다.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11753570.8A EP2546697A4 (en) | 2010-03-11 | 2011-03-07 | Photosensitive organic insulation composition for an oled device |
JP2012556967A JP5649242B2 (ja) | 2010-03-11 | 2011-03-07 | 絶縁膜 |
CN201180023554.8A CN102893214B (zh) | 2010-03-11 | 2011-03-07 | 用于oled器件的光敏有机绝缘组合物 |
US13/046,319 US20110223538A1 (en) | 2010-03-11 | 2011-03-11 | Photosensitive organic insulator composition for oled device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100021946 | 2010-03-11 | ||
KR10-2010-0021946 | 2010-03-11 | ||
KR1020110015963A KR101304590B1 (ko) | 2010-03-11 | 2011-02-23 | Oled 디바이스용 감광성 유기 절연재 조성물 |
KR10-2011-0015963 | 2011-02-23 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/046,319 Continuation US20110223538A1 (en) | 2010-03-11 | 2011-03-11 | Photosensitive organic insulator composition for oled device |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011111965A2 WO2011111965A2 (ko) | 2011-09-15 |
WO2011111965A3 true WO2011111965A3 (ko) | 2012-01-05 |
Family
ID=44954298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/001562 WO2011111965A2 (ko) | 2010-03-11 | 2011-03-07 | Oled 디바이스용 감광성 유기 절연재 조성물 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110223538A1 (ko) |
EP (1) | EP2546697A4 (ko) |
JP (2) | JP5649242B2 (ko) |
KR (1) | KR101304590B1 (ko) |
CN (1) | CN102893214B (ko) |
TW (1) | TWI446107B (ko) |
WO (1) | WO2011111965A2 (ko) |
Families Citing this family (9)
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US9454078B2 (en) | 2012-09-25 | 2016-09-27 | Toray Industries, Inc. | Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same |
KR101700994B1 (ko) | 2013-07-01 | 2017-01-31 | 주식회사 엘지화학 | 광활성 물질의 분리방법 |
DE102014106885B4 (de) * | 2014-05-15 | 2022-01-20 | Pictiva Displays International Limited | Verfahren zur Herstellung einer Isolatorschicht, Verfahren zur Herstellung eines organischen optoelektronischen Bauelements umfassend eine Isolatorschicht und organisches optoelektronisches Bauelement umfassend eine Isolatorschicht |
JP2016076481A (ja) * | 2014-10-02 | 2016-05-12 | セントラル硝子株式会社 | 有機エレクトロルミネッセンス用基板およびそれを用いた有機エレクトロルミネッセンスディスプレイ |
CN104693466B (zh) * | 2015-02-05 | 2017-12-12 | 湘潭大学 | 一种易去除涂层调控液晶嵌段共聚物薄膜畴区取向的方法 |
CN107849362B (zh) * | 2015-10-23 | 2020-09-15 | 东丽株式会社 | 显示器基板用树脂组合物、以及使用其的耐热性树脂膜、有机el显示器基板及有机el显示器的制造方法 |
KR102066549B1 (ko) * | 2016-12-01 | 2020-01-15 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치 |
JP7095676B2 (ja) * | 2017-02-23 | 2022-07-05 | Hdマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化パターンの製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜、及び電子部品 |
JP7268595B2 (ja) * | 2017-03-03 | 2023-05-08 | 日産化学株式会社 | 異物除去用コーティング膜形成組成物 |
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CN102597061B (zh) * | 2009-11-16 | 2014-06-04 | 旭化成电子材料株式会社 | 聚酰亚胺前体和包含该聚酰亚胺前体的感光性树脂组合物 |
-
2011
- 2011-02-23 KR KR1020110015963A patent/KR101304590B1/ko active IP Right Grant
- 2011-03-07 CN CN201180023554.8A patent/CN102893214B/zh active Active
- 2011-03-07 EP EP11753570.8A patent/EP2546697A4/en not_active Withdrawn
- 2011-03-07 WO PCT/KR2011/001562 patent/WO2011111965A2/ko active Application Filing
- 2011-03-07 JP JP2012556967A patent/JP5649242B2/ja active Active
- 2011-03-11 US US13/046,319 patent/US20110223538A1/en not_active Abandoned
- 2011-03-11 TW TW100108280A patent/TWI446107B/zh active
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2014
- 2014-07-18 JP JP2014148191A patent/JP2014225031A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100405301B1 (ko) * | 1999-09-10 | 2003-11-12 | 주식회사 엘지화학 | 새로운 폴리이미드 전구체 및 이를 이용한 감광성 수지 조성물 |
KR100548625B1 (ko) * | 2003-03-24 | 2006-01-31 | 주식회사 엘지화학 | 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물 |
KR20070105692A (ko) * | 2006-04-27 | 2007-10-31 | 에스케이에너지 주식회사 | 폴리이미드 합성용 단량체, 및 이를 포함하는 폴리이미드전구체 조성물 및 연성 금속박 적층체 |
KR20090073141A (ko) * | 2007-10-26 | 2009-07-02 | 아사히 가세이 가부시키가이샤 | 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물 |
Also Published As
Publication number | Publication date |
---|---|
US20110223538A1 (en) | 2011-09-15 |
EP2546697A4 (en) | 2017-01-25 |
KR101304590B1 (ko) | 2013-09-05 |
CN102893214B (zh) | 2015-11-25 |
JP5649242B2 (ja) | 2015-01-07 |
KR20110102819A (ko) | 2011-09-19 |
CN102893214A (zh) | 2013-01-23 |
TW201135359A (en) | 2011-10-16 |
TWI446107B (zh) | 2014-07-21 |
WO2011111965A2 (ko) | 2011-09-15 |
JP2013522660A (ja) | 2013-06-13 |
EP2546697A2 (en) | 2013-01-16 |
JP2014225031A (ja) | 2014-12-04 |
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