WO2011111965A3 - Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물 - Google Patents

Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물 Download PDF

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Publication number
WO2011111965A3
WO2011111965A3 PCT/KR2011/001562 KR2011001562W WO2011111965A3 WO 2011111965 A3 WO2011111965 A3 WO 2011111965A3 KR 2011001562 W KR2011001562 W KR 2011001562W WO 2011111965 A3 WO2011111965 A3 WO 2011111965A3
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Prior art keywords
organic insulation
photosensitive organic
composition
precursor
polyimide
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PCT/KR2011/001562
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English (en)
French (fr)
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WO2011111965A2 (ko
Inventor
김상우
안경호
김경준
신세진
정혜원
박찬효
조정호
김유나
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주식회사 엘지화학
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Priority to EP11753570.8A priority Critical patent/EP2546697A4/en
Priority to JP2012556967A priority patent/JP5649242B2/ja
Priority to CN201180023554.8A priority patent/CN102893214B/zh
Priority to US13/046,319 priority patent/US20110223538A1/en
Publication of WO2011111965A2 publication Critical patent/WO2011111965A2/ko
Publication of WO2011111965A3 publication Critical patent/WO2011111965A3/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

본 발명은 화학식 1 또는 화학식 2로 표시되는 폴리이미드 또는 그 전구체 및 이를 포함하는 감광성 유기 절연재 조성물에 관한 것이다. 상기 폴리이미드 또는 그 전구체는 폴리알킬렌옥사이드를 포함하는 디아민으로부터 제조되는 것을 특징으로 한다. 본 발명의 감광성 유기 절연재 조성물은 OLED 디바이스용으로 사용시 저온경화 및 경화시간이 단축되고, 낮은 테이퍼 앵글을 형성할 수 있으며, 고감도 및 고잔막 구현이 가능하다. 또한, 포지티브 감광성 조성물로서 노광부의 알칼리 용액에 대한 용해도가 우수하여 현상이물의 발생을 최소한으로 줄일 수 있다.
PCT/KR2011/001562 2010-03-11 2011-03-07 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물 WO2011111965A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11753570.8A EP2546697A4 (en) 2010-03-11 2011-03-07 Photosensitive organic insulation composition for an oled device
JP2012556967A JP5649242B2 (ja) 2010-03-11 2011-03-07 絶縁膜
CN201180023554.8A CN102893214B (zh) 2010-03-11 2011-03-07 用于oled器件的光敏有机绝缘组合物
US13/046,319 US20110223538A1 (en) 2010-03-11 2011-03-11 Photosensitive organic insulator composition for oled device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0021946 2010-03-11
KR20100021946 2010-03-11
KR1020110015963A KR101304590B1 (ko) 2010-03-11 2011-02-23 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물
KR10-2011-0015963 2011-02-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/046,319 Continuation US20110223538A1 (en) 2010-03-11 2011-03-11 Photosensitive organic insulator composition for oled device

Publications (2)

Publication Number Publication Date
WO2011111965A2 WO2011111965A2 (ko) 2011-09-15
WO2011111965A3 true WO2011111965A3 (ko) 2012-01-05

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ID=44954298

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PCT/KR2011/001562 WO2011111965A2 (ko) 2010-03-11 2011-03-07 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물

Country Status (7)

Country Link
US (1) US20110223538A1 (ko)
EP (1) EP2546697A4 (ko)
JP (2) JP5649242B2 (ko)
KR (1) KR101304590B1 (ko)
CN (1) CN102893214B (ko)
TW (1) TWI446107B (ko)
WO (1) WO2011111965A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2902847B1 (en) 2012-09-25 2019-05-08 Toray Industries, Inc. Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition
KR101700994B1 (ko) 2013-07-01 2017-01-31 주식회사 엘지화학 광활성 물질의 분리방법
DE102014106885B4 (de) * 2014-05-15 2022-01-20 Pictiva Displays International Limited Verfahren zur Herstellung einer Isolatorschicht, Verfahren zur Herstellung eines organischen optoelektronischen Bauelements umfassend eine Isolatorschicht und organisches optoelektronisches Bauelement umfassend eine Isolatorschicht
JP2016076481A (ja) * 2014-10-02 2016-05-12 セントラル硝子株式会社 有機エレクトロルミネッセンス用基板およびそれを用いた有機エレクトロルミネッセンスディスプレイ
CN104693466B (zh) * 2015-02-05 2017-12-12 湘潭大学 一种易去除涂层调控液晶嵌段共聚物薄膜畴区取向的方法
WO2017068936A1 (ja) * 2015-10-23 2017-04-27 東レ株式会社 ディスプレイ基板用樹脂組成物、並びに、それを用いた耐熱性樹脂フィルム、有機ｅｌディスプレイ基板及び有機ｅｌディスプレイの製造方法
KR102066549B1 (ko) * 2016-12-01 2020-01-15 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
CN110325912B (zh) * 2017-02-23 2023-07-14 艾曲迪微系统股份有限公司 感光性树脂组合物、图案的制造方法、固化物、层间绝缘膜、覆盖涂层、保护膜和电子部件
CN110366768B (zh) * 2017-03-03 2023-09-26 日产化学株式会社 用于异物除去的涂膜形成用组合物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100405301B1 (ko) * 1999-09-10 2003-11-12 주식회사 엘지화학 새로운 폴리이미드 전구체 및 이를 이용한 감광성 수지 조성물
KR100548625B1 (ko) * 2003-03-24 2006-01-31 주식회사 엘지화학 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물
KR20070105692A (ko) * 2006-04-27 2007-10-31 에스케이에너지 주식회사 폴리이미드 합성용 단량체, 및 이를 포함하는 폴리이미드전구체 조성물 및 연성 금속박 적층체
KR20090073141A (ko) * 2007-10-26 2009-07-02 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3535281B2 (ja) * 1995-08-31 2004-06-07 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
JP3677191B2 (ja) * 1999-03-15 2005-07-27 株式会社東芝 感光性ポリイミド用現像液、ポリイミド膜パターン形成方法、及び電子部品
JP4171777B2 (ja) * 1999-05-31 2008-10-29 株式会社ピーアイ技術研究所 脂肪族ポリイミド組成物及び画像形成法
WO2002010253A1 (fr) * 2000-07-27 2002-02-07 Mitsui Chemicals, Inc. Acide polyamique, polyimide, leur procede de production, et film de polyimide
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
JP4078478B2 (ja) * 2001-10-30 2008-04-23 株式会社カネカ 感光性樹脂組成物及びそれを用いた感光性ドライフィルムレジスト
TW581991B (en) * 2002-10-25 2004-04-01 Ritdisplay Corp OLED device and packaging method thereof
WO2004088707A1 (ja) * 2003-03-31 2004-10-14 Mitsui Chemicals Inc. 画像表示装置用真空外囲器および画像表示装置用封着材
JP2005196130A (ja) * 2003-12-12 2005-07-21 Hitachi Cable Ltd 感光性ポリイミド樹脂組成物、それを用いた絶縁膜、絶縁膜の製造方法および絶縁膜を使用した電子部品
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
KR100969014B1 (ko) * 2005-07-14 2010-07-09 미쓰이 가가쿠 가부시키가이샤 포지티브형 감광성 수지 조성물 및 패턴 형성방법
US7592119B2 (en) * 2007-02-09 2009-09-22 Sony Corporation Photosensitive polyimide resin composition
JP4957583B2 (ja) * 2007-02-22 2012-06-20 新日本理化株式会社 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス
CN101681628B (zh) * 2007-04-18 2012-01-11 大日本印刷株式会社 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器
JP5061792B2 (ja) * 2007-08-21 2012-10-31 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置。
KR101102256B1 (ko) * 2007-12-14 2012-01-03 주식회사 엘지화학 폴리이미드계 고분자 화합물 및 이를 포함하는 포지티브형폴리이미드 감광성 수지 조성물
CN101960382B (zh) * 2008-03-07 2014-01-01 株式会社Lg化学 正性光敏聚酰亚胺组合物
US8729402B2 (en) * 2008-05-20 2014-05-20 Kaneka Corporation Polyimide precursor composition, use of the of the same, and production method of the same
JP2010169944A (ja) * 2009-01-23 2010-08-05 Mitsui Chemicals Inc ネガ型感光性樹脂組成物、それを用いたネガ型パターンの形成方法、回路基板材料および回路基板用カバーレイ
JP5201155B2 (ja) * 2009-01-27 2013-06-05 新日本理化株式会社 ポリ（アミド酸―イミド）樹脂
JP5450658B2 (ja) * 2009-07-15 2014-03-26 エルジー ケム． エルティーディ． 感光性ポリイミドおよびそれを含む感光性樹脂組成物
US8559831B2 (en) * 2009-11-13 2013-10-15 Eastman Kodak Company Sheet registration for a multipass electrophotographic printer
CN102597061B (zh) * 2009-11-16 2014-06-04 旭化成电子材料株式会社 聚酰亚胺前体和包含该聚酰亚胺前体的感光性树脂组合物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100405301B1 (ko) * 1999-09-10 2003-11-12 주식회사 엘지화학 새로운 폴리이미드 전구체 및 이를 이용한 감광성 수지 조성물
KR100548625B1 (ko) * 2003-03-24 2006-01-31 주식회사 엘지화학 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물
KR20070105692A (ko) * 2006-04-27 2007-10-31 에스케이에너지 주식회사 폴리이미드 합성용 단량체, 및 이를 포함하는 폴리이미드전구체 조성물 및 연성 금속박 적층체
KR20090073141A (ko) * 2007-10-26 2009-07-02 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물

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