WO2008133072A1 - サスペンション用基板、その製造方法、磁気ヘッドサスペンションおよびハードディスクドライブ - Google Patents

サスペンション用基板、その製造方法、磁気ヘッドサスペンションおよびハードディスクドライブ Download PDF

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Publication number
WO2008133072A1
WO2008133072A1 PCT/JP2008/057245 JP2008057245W WO2008133072A1 WO 2008133072 A1 WO2008133072 A1 WO 2008133072A1 JP 2008057245 W JP2008057245 W JP 2008057245W WO 2008133072 A1 WO2008133072 A1 WO 2008133072A1
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WIPO (PCT)
Prior art keywords
suspension
substrate
producing
hard disk
disk drive
Prior art date
Application number
PCT/JP2008/057245
Other languages
English (en)
French (fr)
Inventor
Yoichi Hitomi
Shinji Kumon
Terutoshi Momose
Katsuya Sakayori
Kiyohiro Takachi
Yoichi Miura
Tsuyoshi Yamazaki
Original Assignee
Dai Nippon Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co., Ltd. filed Critical Dai Nippon Printing Co., Ltd.
Priority to CN2008800122410A priority Critical patent/CN101681628B/zh
Priority to US12/528,676 priority patent/US8927122B2/en
Publication of WO2008133072A1 publication Critical patent/WO2008133072A1/ja
Priority to US14/551,663 priority patent/US9564153B2/en
Priority to US15/389,679 priority patent/US20170103777A1/en

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3109—Details
    • G11B5/313—Disposition of layers
    • G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/1157—Substrate composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/1171—Magnetic recording head with defined laminate structural detail
    • Y10T428/1179—Head with slider structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

　サスペンション用基材１０は金属基板１と、金属基板１に上形成された絶縁層２と、絶縁層２上に形成された配線層３と、配線層３を覆うカバー層４とを備えている。絶縁層２の材料とカバー層４の材料は異なる材料からなり、両者の吸湿膨張係数は３×１０－６／％ＲＨ～３０×１０－６／％ＲＨの範囲内にある。両者の吸湿膨張係数の差は、５×１０－６／％ＲＨ以下の範囲内にある。
PCT/JP2008/057245 2007-04-18 2008-04-14 サスペンション用基板、その製造方法、磁気ヘッドサスペンションおよびハードディスクドライブ WO2008133072A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800122410A CN101681628B (zh) 2007-04-18 2008-04-14 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器
US12/528,676 US8927122B2 (en) 2007-04-18 2008-04-14 Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive
US14/551,663 US9564153B2 (en) 2007-04-18 2014-11-24 Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive
US15/389,679 US20170103777A1 (en) 2007-04-18 2016-12-23 Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-109279 2007-04-18
JP2007109279 2007-04-18
JP2007126588 2007-05-11
JP2007-126588 2007-05-11

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/528,676 A-371-Of-International US8927122B2 (en) 2007-04-18 2008-04-14 Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive
US14/551,663 Division US9564153B2 (en) 2007-04-18 2014-11-24 Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive

Publications (1)

Publication Number Publication Date
WO2008133072A1 true WO2008133072A1 (ja) 2008-11-06

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Country Status (3)

Country Link
US (3) US8927122B2 (ja)
CN (2) CN101681628B (ja)
WO (1) WO2008133072A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101900940A (zh) * 2009-05-27 2010-12-01 日东电工株式会社 负型感光性材料、感光性基材及负型图案形成方法
JP2011243271A (ja) * 2010-04-19 2011-12-01 Dainippon Printing Co Ltd 回路基板、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
CN102893214A (zh) * 2010-03-11 2013-01-23 株式会社Lg化学 用于oled器件的光敏有机绝缘组合物

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CN101681628B (zh) 2007-04-18 2012-01-11 大日本印刷株式会社 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器
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WO2011126076A1 (ja) * 2010-04-09 2011-10-13 大日本印刷株式会社 薄膜トランジスタ基板
US8758910B2 (en) * 2010-06-29 2014-06-24 Dai Nippon Printing Co., Ltd. Substrate for suspension, and production process thereof
JP2012063645A (ja) 2010-09-17 2012-03-29 Nitto Denko Corp 感光性樹脂組成物およびそれを用いた金属支持体付回路基板
JP5592740B2 (ja) * 2010-09-22 2014-09-17 日東電工株式会社 ハードディスクドライブのスライダ用回路付きサスペンション基板
JP5793849B2 (ja) * 2010-11-02 2015-10-14 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
JP5781773B2 (ja) 2011-01-12 2015-09-24 日東電工株式会社 回路付サスペンション基板
JP6015024B2 (ja) * 2012-02-20 2016-10-26 大日本印刷株式会社 サスペンション用基板の製造方法
JP6000073B2 (ja) * 2012-11-08 2016-09-28 日東電工株式会社 回路付きサスペンション基板集合体シートおよびその製造方法
JP6427063B2 (ja) * 2015-04-24 2018-11-21 日本発條株式会社 薄板配線基板及びその製造方法
KR102206906B1 (ko) * 2017-11-13 2021-01-25 주식회사 엘지화학 디스플레이 기판용 폴리이미드 필름
US20210247691A1 (en) * 2020-02-12 2021-08-12 Hutchinson Technology Incorporated Method For Forming Components Without Adding Tabs During Etching
CN113709988A (zh) * 2021-09-02 2021-11-26 大同共聚(西安)科技有限公司 一种含有聚酰亚胺悬浮电路基板的制造方法

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WO2004073975A1 (ja) * 2003-02-18 2004-09-02 Mitsui Chemicals, Inc. ポリイミド金属積層体
JP2006270029A (ja) * 2005-02-23 2006-10-05 Nippon Steel Chem Co Ltd 配線基板用積層体
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101900940A (zh) * 2009-05-27 2010-12-01 日东电工株式会社 负型感光性材料、感光性基材及负型图案形成方法
US8728705B2 (en) 2009-05-27 2014-05-20 Nitto Denko Corporation Negative photosensitive material, photosensitive board employing the negative photosensitive material, and negative pattern forming method
CN102893214A (zh) * 2010-03-11 2013-01-23 株式会社Lg化学 用于oled器件的光敏有机绝缘组合物
CN102893214B (zh) * 2010-03-11 2015-11-25 株式会社Lg化学 用于oled器件的光敏有机绝缘组合物
JP2011243271A (ja) * 2010-04-19 2011-12-01 Dainippon Printing Co Ltd 回路基板、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ

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Publication number Publication date
US8927122B2 (en) 2015-01-06
US20150079424A1 (en) 2015-03-19
CN102290054A (zh) 2011-12-21
CN102290054B (zh) 2014-12-24
CN101681628B (zh) 2012-01-11
US20100047626A1 (en) 2010-02-25
US9564153B2 (en) 2017-02-07
CN101681628A (zh) 2010-03-24
US20170103777A1 (en) 2017-04-13

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