WO2011105409A1 - 実装基板及びその実装構造 - Google Patents
実装基板及びその実装構造 Download PDFInfo
- Publication number
- WO2011105409A1 WO2011105409A1 PCT/JP2011/053936 JP2011053936W WO2011105409A1 WO 2011105409 A1 WO2011105409 A1 WO 2011105409A1 JP 2011053936 W JP2011053936 W JP 2011053936W WO 2011105409 A1 WO2011105409 A1 WO 2011105409A1
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- WIPO (PCT)
- Prior art keywords
- hole
- electrode patterns
- pair
- mounting substrate
- mounting
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 185
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims description 51
- 238000004080 punching Methods 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000007789 sealing Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 101100460719 Mus musculus Noto gene Proteins 0.000 description 1
- 101100187345 Xenopus laevis noto gene Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Definitions
- the present invention relates to a mounting board for mounting electronic components such as ICs and light emitting diodes, and more particularly to a mounting board for mounting electronic components from the lower surface side of the mounting board and a mounting structure for mounting electronic components on the mounting board. Is.
- the light emitting diode 2 includes a light emitting element 4, a substrate 6 on which the light emitting element 4 is mounted, and a pair of electrode patterns 8 and 10 or a pair of through-hole electrodes 12 formed to extend from the upper surface of the substrate 6 to the side surface.
- the light emitting element 4 is electrically connected to the pair of electrode patterns 8 and 10 or the pair of through-hole electrodes 12 and sealed with resin.
- the light emitting portion of the light emitting diode 2 includes a light emitting element 4 and a resin portion that seals the light emitting element 4.
- the mounting substrate 16 has a through hole 14, and the light emitting portion of the light emitting diode 2 is inserted into the through hole 14 of the mounting substrate 16.
- the light emitting portion of the light emitting diode 2 is inserted into the through-hole 14, and a part of the upper surface of the substrate 6 on which the light emitting element 4 is mounted is brought into contact with the lower surface of the mounting substrate 16 such as a circuit substrate, so that a pair of electrode patterns 8 or 10 or a pair of through-hole electrodes 12 are respectively soldered to a pair of electrode patterns 18 provided on the lower surface of the mounting substrate 16 to form a solder fillet 20 (for example, patent document). 1).
- the light emitting diode 2 when the light emitting diode 2 is mounted by bringing a part of the upper surface of the substrate 6 of the light emitting diode 2 into contact with the lower surface of the mounting substrate 16, the light emitting diode composed of the light emitting element 4 and the resin portion that seals the light emitting element 4. Since the two light emitting portions are accommodated in the through hole 14 of the mounting substrate 16, it is possible to make the entire thickness thinner than mounting the light emitting diode 2 on the surface of the mounting substrate 16 without using the through hole. Become.
- solder fillet 20 to which the light emitting diode 2 is soldered is located on the lower surface side of the mounting substrate 16, it cannot be seen from the upper surface side of the mounting substrate 16, and the solder fillet 20 may not be visually confirmed. In order to inspect the state of the solder, it was necessary to turn the mounting substrate 16 over. In addition, as shown in FIG. 11, when the solder 21 is positioned between the lower surface of the mounting substrate 16 and the upper surface of the substrate 6 of the light emitting diode, it cannot be visually confirmed from the outside, and is inspected using X-rays or the like. There was a problem that it was necessary.
- the wiring board 24 is set to be larger than the base 22 so that the pair of electrode portions 26 provided at the pair of opposite ends of the wiring board 24 protrude.
- the light emitting diode shown in FIG. 12 also has a problem that it is difficult to visually confirm the solder portion even if the heat sink 30 is attached to the base 22 even if it is turned over. Further, the portion where the wiring board 24 protrudes has low strength, and there is a possibility that it will be damaged when a load such as the base 22 or the heat sink 30 is applied.
- the problem to be solved by the present invention is to solve the above-mentioned problems of the prior art, and visually confirm the state of solder, which is a joint portion between the mounted electronic component board and the mounting board, from the upper surface side of the mounting board. It is an object of the present invention to provide a mounting substrate and a mounting structure thereof.
- the mounting board of the present invention is a mounting board on which an electronic component is mounted, and more specifically, a mounting board on which the upper surface of the electronic component is mounted on the lower surface of the mounting board having a through hole.
- a connection portion between at least a pair of electrode patterns provided on the substrate of the electronic component and at least a pair of electrode patterns of the mounting substrate is located inside a peripheral side surface that defines a through hole of the mounting substrate.
- At least a part of at least a pair of electrode patterns of the electronic component and at least a part of at least a pair of electrode patterns of the mounting board are arranged inside a peripheral side surface defining a through hole, and the through
- the at least one pair of electrode patterns in the mounting substrate is provided along a through hole penetrating the upper surface and the lower surface of the mounting substrate, and the peripheral side surface defining the through hole from the upper surface of the mounting substrate (the mounting in the through hole). (Cross section of the substrate) and extends to the lower surface of the mounting substrate.
- At least a pair of electrode patterns on the mounting substrate is composed of a plurality of electrode patterns, and each is independently provided along the through hole. Specifically, by providing a plurality of through grooves that cut through the upper surface and the lower surface in the mounting substrate from the peripheral side surface that defines the through hole, the plurality of electrode patterns are electrically separated to provide a plurality of independent plurality of grooves. It is formed as an electrode pattern.
- the through-hole is composed of an assembly of a plurality of independent small through-holes smaller than the through-holes and punched holes for punching and connecting the mounting substrate at positions adjacent to the plurality of small through-holes.
- Each electrode pattern is formed so as to extend from the upper surface of the mounting substrate to the lower surface of the mounting substrate through a peripheral side surface defining a plurality of independent small through holes.
- the electrode pattern extending on the peripheral side surface of the small through hole extends from the upper surface of the mounting substrate to the lower surface through each peripheral side surface defining a plurality of small through holes.
- the connecting portion is disposed so as to be located inside each peripheral side surface defining a plurality of small through holes.
- the punched hole is formed at a position corresponding to the center of the electronic component, and a light emitting part is accommodated in the punched hole, for example, if it is a light emitting diode.
- at least a pair of electrode patterns of the mounting substrate is provided along the through hole of the mounting substrate, and is formed to extend from the upper surface of the mounting substrate to the peripheral side surface defining the through hole and the lower surface of the mounting substrate. Are in contact with at least a pair of electrode patterns disposed on the upper surface of the substrate of the electronic component.
- At least a pair of electrode patterns on the mounting substrate is disposed on the upper surface of the substrate of the electronic component inside the peripheral side surface that defines the through hole, and extends beyond the peripheral side surface that defines the through hole of the mounting substrate.
- the solder connection portion appears in the through hole of the mounting board, and is visible from the upper surface of the mounting board.
- the plurality of through grooves are formed so as to be radially cut into the mounting substrate from the peripheral side surface defining the through hole, and the electrode pattern formed between the plurality of through grooves is formed around the through hole. It is provided along. Furthermore, on the surface of the mounting substrate, a wiring pattern extending radially from each of the plurality of electrode patterns around the through hole may be provided from each of the electrode patterns.
- the electronic component is made of a light emitting diode, for example.
- the electronic component is a base made of metal, and a board comprising a wiring board disposed on the upper surface of the base and having at least a pair of electrode patterns,
- the mounting substrate is mounted with at least one pair of electrode patterns, an upper surface, and at least one semiconductor element facing the upper surface.
- the semiconductor element may be a light emitting element.
- the mounting substrate for mounting the electronic component of the present invention includes an upper surface, a lower surface, a through hole penetrating the upper surface and the lower surface, a peripheral side surface defining the through hole, and a peripheral side surface from the upper surface along the through hole. At least a pair of electrode patterns extending through the bottom surface.
- the upper surface of the substrate of the electronic component is mounted on the lower surface of the mounting substrate, and at least a part of at least a pair of electrode patterns provided on the upper surface of the electronic component exceeds the peripheral side surface that defines the through hole of the mounting substrate. And is disposed so as to be located in the through hole.
- the conductive portion and the connection portion of the electrode pattern are mounted by soldering inside the peripheral side surface defining the through hole. For this reason, when viewed from the upper surface side of the mounting substrate, a solder fillet as a connecting portion can be seen in the through hole, and the state of the solder can be easily visually inspected.
- the plurality of electrode patterns provided along the through hole of the mounting substrate are separated by a plurality of through grooves that cut through the upper surface and the lower surface from the peripheral side surface defining the through hole into the mounting substrate.
- a plurality of electrode patterns are formed. For this reason, it is possible to easily cope with substrates of electronic components having different numbers and positions of electrode patterns only by changing the number and positions of the through grooves.
- the mounting substrate of the present invention it is possible to easily mount even an electronic component such as a light emitting diode using a base made of a metal on which formation of a through-hole electrode is difficult. Become. Furthermore, by forming a wiring pattern for circuit routing on the upper surface side of the mounting substrate, a sufficient withstand voltage distance between the wiring pattern and the electronic component can be secured, and the reliability can be improved. .
- the electrode pattern on the light emitting surface side of the light emitting diode is almost hidden under the mounting substrate, so that the appearance of the light emitting surface side of the light emitting diode can be made clear.
- FIG. 4 is an enlarged view of a portion A in FIG. 3 showing a state in which a solder fillet is formed at a connection portion between an electrode pattern of a mounting board and an electrode of an electronic component. It is a perspective view which shows the mounting substrate which concerns on Example 2 of this invention, and the light emitting diode as an electronic component.
- FIG. 4 is an enlarged view of a portion A in FIG. 3 showing a state in which a solder fillet is formed at a connection portion between an electrode pattern of a mounting board and an electrode of an electronic component.
- FIG. 6 is a perspective view showing a positional relationship between a plurality of small through holes and punched holes shown in FIG. 5. It is a perspective view which shows the example which changed the planar shape of the punching hole shown in FIG.
- FIG. 8 is a perspective view showing a positional relationship between a plurality of small through holes and punched holes shown in FIG. 7.
- the mounting board of the present invention has a through hole into which at least a part of the upper surface of the electronic component mounted on the lower surface of the mounting board and the electrode pattern enter.
- the mounting substrate and the electronic component are overlapped so that the connection portion of the electronic component and the electrode pattern is placed in the through hole, and the connection portion of the electrode pattern and the through hole are aligned.
- the connection is made by soldering the connection portion of the electrode pattern provided on the provided mounting board. Thereby, the solder in the through hole can be confirmed from the upper surface side of the mounting substrate.
- Example 1 1 is a cross-sectional view showing a state in which the top surface of a light emitting diode as an electronic component is mounted on the bottom surface of a mounting substrate according to Embodiment 1 of the present invention
- FIG. 2 is an exploded perspective view of the mounting substrate and the light emitting diode
- FIG. FIG. 4 is a perspective view showing a state in which the light emitting diode is mounted on the mounting substrate
- Reference numeral 32 denotes a mounting substrate, and the upper surface of the electronic component substrate is mounted on the lower surface of the mounting substrate 32.
- Reference numeral 34 denotes a light emitting diode as an electronic component.
- the light-emitting diode 34 in this embodiment includes a base plate 42 made of a metal such as aluminum and a substrate 46 that is arranged on the upper surface of the base plate and includes a wiring board 44 having at least a pair of electrode patterns. At least one light emitting element 50 electrically connected to at least a pair of electrode patterns is provided.
- the light emitting element 50 is mounted on the upper surface of the base 42 that can be seen from the through hole provided in the wiring board 44 of the substrate 46 of the light emitting diode, and is electrically connected to at least a pair of electrode patterns on the upper surface of the wiring board 44. . Specifically, the light emitting element 50 is die-bonded from the through hole 44a of the wiring board 44 to the center of the upper surface of the base 42 and is electrically connected to at least a pair of electrode patterns 54 on the wiring board 44 by a wire. It is sealed with a sealing resin 52 having translucency. In FIG. 1, only one light emitting element 50 is shown in the drawing, but a light emitting diode in which a plurality of light emitting elements are arranged in a plurality of rows may be used.
- At least a pair of electrode patterns 54 are provided on the upper surface of the wiring board 44.
- Reference numeral 48 denotes a wire bonding portion that is electrically connected to the light emitting element 50. Although not shown, the bonding portion 48 is electrically connected to at least a pair of electrode patterns 54 on the wiring board 44.
- the light emitting portion of the light emitting diode in this embodiment is composed of a light emitting element 50 and a substantially cylindrical sealing resin 52 that seals the light emitting element.
- At least a pair of electrode patterns 54 are disposed on the upper surface of the substrate of the light emitting diode.
- the electrode pattern 54 has a substantially rectangular planar shape, and a portion close to the sealing resin 52 is in contact with the mounting substrate 32. It becomes the connection part 54a.
- the wiring board 44 of the light emitting diode substrate is made of an insulating member.
- the mounting substrate 32 is made of an insulating substrate such as an alumina substrate whose outer shape in the planar direction is larger than that of the light emitting diode 34, and a plurality of through holes may be provided to mount a plurality of electronic components.
- One electronic component may be mounted as shown in FIG.
- the mounting substrate 32 in this embodiment has a substantially square planar shape, and has a through hole 36 in the center.
- at least a pair of electrode patterns on the mounting substrate is provided. Specifically, at least each of the pair of electrode patterns is formed to extend from the upper surface of the mounting substrate to the lower surface of the mounting substrate through the peripheral side surface 38 (cross section of the mounting substrate in the through hole) that defines the through hole. Yes.
- the through hole 36 is at least a part of a light emitting portion of the light emitting diode 34 and at least a pair of electrode patterns 54 provided on the upper surface of the substrate of the light emitting diode, and is connected to at least a pair of electrode patterns on the mounting substrate.
- the diameter is set so that the connecting portion 54a to be inserted can enter.
- the light emitting portion of the light emitting diode 34 includes a light emitting element 50 and a sealing resin 52 that seals the light emitting element and transmits light from the light emitting element.
- At least a pair of electrode patterns 40 is formed on the peripheral side surface (cross section of the mounting substrate in the through hole) of the mounting substrate 32 that defines the through hole 36.
- the electrode pattern 40 is formed by an electrode pattern 40 a located on the peripheral side surface defining the through hole 36, an electrode pattern 40 b located on the upper surface of the mounting substrate 32, and an electrode pattern 40 c located on the lower surface of the mounting substrate 32.
- the mounting substrate 32 has a plurality of through grooves 56 cut into the mounting substrate 32 through the upper and lower surfaces of the mounting substrate 32 from the peripheral side surface defining the through hole 36 (cross section of the mounting substrate in the through hole).
- At least a pair of electrode patterns 40 provided on the mounting substrate 32 are four independent electrode patterns divided by four through grooves 56. Note that the number of electrode patterns independent by the through groove 56 can be set according to the number of electrode patterns of the electronic component to be mounted. In the present embodiment, since the number of electrode patterns of the light emitting diode is four, the number of electrode patterns 40 on the mounting substrate 32 is also set to four.
- a plurality of wiring patterns 58 are provided that are drawn out radially from the electrode pattern 40 with the through hole 36 as the center.
- the wiring pattern 58 can be used when connected to and mounted on a circuit, a power source, or the like.
- the through-hole 36 is formed in the mounting substrate 32, and the electrode pattern 40 is covered with a resist except for the portion where the electrode pattern 40 is to be formed.
- the electrode pattern 40 is formed by, for example, and the resist is removed to form an electrode pattern similar to a general through-hole electrode.
- the through groove 56 by forming the through groove 56 using a mold or a router, the integrated electrode pattern 40 is divided to form a plurality of independent electrode patterns 40.
- a connecting portion 54a which is at least a part of at least a pair of electrode patterns 54 provided on the upper surface of the substrate 46 of the light emitting diode also enters the through hole 36.
- the electrode pattern 40 c at a position extending to the lower surface of the mounting substrate 32 and the substrate 46 of the light emitting diode 34.
- At least a pair of electrode patterns 54 provided on the upper surface come into contact with each other.
- the electrode pattern 40a located on the peripheral side surface defining the through hole 36 becomes a connection portion, and the connection portion 40a of the electrode pattern 40 and the substrate of the light emitting diode 34
- a connection portion 54a which is at least a part of at least a pair of electrode patterns 54 provided on the upper surface of 46 is connected by solder.
- connection portion 60 formed at this time is a solder fillet, and indicates a connection portion between the electrode pattern connection portion of the mounting substrate 32 and the electrode pattern connection portion provided on the upper surface of the substrate of the electronic component. As shown in FIGS. 1 and 4, since the connection portion 60 can be seen from the upper surface side of the mounting substrate 32, it is possible to easily confirm the state of solder visually.
- the mounting board 32 in this embodiment may be mounted on a circuit board or the like using this, or a circuit or the like may be formed on the mounting board 32.
- the through hole 36 in the first embodiment is at least a part of the light emitting portion of the light emitting diode and at least a pair of electrode patterns 54 provided on the upper surface of the substrate 46 of the light emitting diode 34.
- the diameter was set so that the connection portion 54a connected to the electrode pattern 54 was inserted, and the planar shape of the through hole 36 was substantially circular. For this reason, it is necessary to form larger than the through-hole in which the general through-hole electrode which only conducts the upper and lower surfaces is formed.
- the through hole 66 of the mounting substrate 32 shown in FIG. 5 is provided with a plurality of small through holes 68 having a smaller diameter than the through hole 66 as shown in FIG. 68 is formed by an assembly of punching holes for punching and connecting the mounting substrate 32 at positions adjacent to the mounting board 32.
- the through-hole 66 is formed of four small through-holes 68 that are partially overlapped with and connected to the four corners of the punching hole with a planar shape of the punching hole 70 as a center.
- the plurality of small through holes 68 are respectively disposed at positions corresponding to connection portions 54 a of at least a pair of electrode patterns 54 provided on the upper surface of the substrate of the light emitting diode 34.
- four small through holes 68 are also provided correspondingly.
- the small through-holes 68 extend from the upper surface of the mounting substrate 32 to the lower surface through the peripheral side surfaces (the cross-section of the mounting substrate in the small through-holes) that define the respective small through-holes 68.
- a portion extending inward beyond the peripheral side surface to be defined is a connection portion 54a.
- the diameter of the through hole 66 of the mounting substrate is set so that the connection portions 54a of the plurality of electrode patterns 54 provided on the upper surface of the substrate of the light emitting diode 34 enter the inside of the through hole 66, respectively.
- the punching hole 70 is formed by punching the center of the mounting substrate 32 with its corners oriented so as to partially overlap the small through holes 68. For this reason, the plurality of small through holes 68 are connected by the punching hole 70 to form one through hole 66.
- the through hole 66 in the present embodiment is composed of an assembly in which a plurality of small through holes 68 and punched holes 70 are combined.
- the electrode pattern 74 is originally provided along the small through-hole 68 that is independent, and is partially cut and separated by the punching hole 70.
- the connection portions of the plurality of electrode patterns 74 of the mounting substrate 32 and the upper surface of the substrate of the light emitting diode 34 are provided. This can be performed by soldering the connection portions 54 a of the plurality of electrode patterns 54 in the small through holes 68.
- the number of small through-holes 68 that determine the number of electrode patterns on the mounting board and the planar shape of the punched holes 70 are set according to the number of electrode patterns provided on the board of the electronic component to be mounted. For example, if there are three electrode patterns 54 of electronic components to be mounted, three small through holes 68 are formed, and the plan shape of the punched hole 70 is formed so that three small through holes and three vertices are partially overlapped. Set to a triangle. When the number of electrode patterns 54 of electronic components to be mounted and the number of small through holes 68 corresponding thereto are large, the planar shape of the punching hole 70 is set to a polygon according to the number, or As shown, the planar shape of the punched hole 70 may be set to a circle.
- a planar shape is formed so as to partially overlap each of the plurality of small through holes 68 formed so as to correspond to the number of electrode patterns 54 provided on the substrate of the electronic component.
- the plurality of small through holes 68 can be arbitrarily arranged along the circumference of the punching hole 80 as long as the positions of the small through holes 68 partially overlap the punching hole 80. For this reason, it becomes possible to raise the freedom degree of the position and number of the small through-holes 68.
- the punching holes 70 and 80 are also easy to form because the shape and positioning are easier than the through groove 56 in the first embodiment.
- a space for soldering at least a pair of electrode patterns 54 provided on the upper surface of the substrate of the light emitting diode 34 and at least a pair of electrode patterns 74 of the mounting substrate 32 is small.
- the size of the through holes can be increased and workability can be improved.
- the mounting space can be further expanded toward the center of the mounting substrate 32, so that the work can be performed more easily. can do.
- the light emitting diode is taken as an example of the electronic component.
- other electronic components such as IC and LSI are similarly soldered as long as they are electronic components mounted on the substrate. Can be mounted on a mounting board while ensuring the visibility.
- the mounting board of the present invention may be incorporated into various devices such as electronic devices such as personal computers and mobile phones, home appliances, automobile meters and panels.
- various devices such as electronic devices such as personal computers and mobile phones, home appliances, automobile meters and panels.
- the mounting substrate of the present invention into these various devices, in those devices, the electrode pattern provided on the upper surface of the electronic component substrate from the upper surface side of the mounting substrate, the electrode pattern of the mounting substrate, It is possible to check the connection status of the connection part
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
図1は本発明の実施例1に係る実装基板の下面に電子部品としての発光ダイオードの基板上面を実装した状態を示す断面図、図2は実装基板と発光ダイオードの分解斜視図、図3は実装基板に発光ダイオードを実装した状態を示す斜視図、図4は図3のA部拡大図である。32は実装基板であり、この実装基板32の下面に電子部品の基板の上面が実装されている。34は電子部品としての発光ダイオードである。本実施例における発光ダイオード34は、アルミ等の金属から成る基台42と基台の上面に配置されて、少なくとも一対の電極パターンを有する配線板44とからなる基板46と、前記配線板44の少なくとも一対の電極パターンと電気的に接続される少なくとも一つの発光素子50を備えている。
次に、図5乃至図8に基づいて、貫通孔36を変更した実装基板32の実施例2を説明する。なお、本実施例においては、貫通孔の構成が実施例1と一部異なるだけであり、その他の構成、各部の材質、実装状態等については実施例1と同一であるので、実施例1と同一部分には同一の符号を付して詳細な説明を省略する。実施例1における貫通孔36は、その中に発光ダイオードの発光部と、発光ダイオード34の基板46の上面に設けられた少なくとも一対の電極パターン54の少なくとも一部であって、実装基板32の複数の電極パターン54と接続される接続部分54aが入るように径が設定され、貫通孔36の平面形状は実質的に円形となっていた。このため、単に上下面の導通を図る一般的なスルーホール電極が形成される貫通孔よりも大きく形成することが必要となる。
4 発光素子
6 電子部品の基板
8,10 電極パターン
12 スルーホール電極
14 貫通孔
16 実装基板
18 電極パターン
20 半田フィレット
21 半田
22 基台
24 配線板
26 電極部
28 実装基板
30 放熱板
32 実装基板
34 発光ダイオード
36 貫通孔
38 貫通孔を画定する周側面
40 電極パターン
40a 貫通孔の周側面上に位置する電極パターン
40b 実装基板の上面に位置する電極パターン
40c 実装基板の下面に位置する電極パターン
42 基台
44 配線板
46 電子部品の基板
48 ワイヤーボンディング部
50 発光素子
52 封止樹脂
54 電極パターン
54a 接続部分
56 貫通溝
58 配線パターン
60 接続部(半田フィレット)
66 貫通孔
68 小さな貫通孔
70,80 打ち抜き孔
72 貫通孔を画定する周側面
74 電極パターン
Claims (18)
- 少なくとも一対の電極パターンと、上面と、上面に対向し電子部品の基板の上面が実装される下面と、上面と下面を貫通する少なくとも一つの貫通孔と、貫通孔を画定する周側面とを有し、前記少なくとも一対の電極パターンの少なくとも一部が前記貫通孔を画定する周側面の内側に位置するように配置されており、
前記少なくとも一対の電極パターンと電子部品の基板の上面に設けられた少なくとも一対の電極パターンとが接続される接続部が、前記貫通孔を画定する周側面の内側に配置される実装基板。 - 前記少なくとも一対の電極パターンは、それぞれが前記上面から貫通孔を画定する周側面上を通って下面へと延びている請求項1に記載の実装基板。
- 前記少なくとも一対の電極パターンは、複数の電極パターンから成り、それぞれが独立して前記貫通孔に沿って設けられて、前記上面から貫通孔を画定する周側面上を通って下面へと延びている請求項1に記載の実装基板。
- 前記少なくとも一つの貫通孔は貫通孔を画定する周側面から上面および下面を貫通して実装基板内に切り込む複数の貫通溝を有し、前記複数の貫通溝は少なくとも一対の電極パターンを電気的に分断する請求項1に記載の実装基板。
- 前記少なくとも一つの貫通孔は、実装基板に設けられた貫通孔より小さい複数の独立した小さな貫通孔と、複数の小さな貫通孔に隣接する位置で実装基板を打ち抜いて連結する打ち抜き孔との集合体からなり、
前記少なくとも一対の電極パターンは、前記上面から複数の小さな貫通孔を画定する周側面上を通って下面へと延びている請求項1に記載の実装基板。 - 前記少なくとも一対の電極パターンは、それぞれが前記上面から貫通孔を画定する周側面上を通って実装基板の下面に延びており、実装基板の下面において、電子部品の基板の上面に配置された少なくとも一対の電極パターンと当接されている請求項1に記載の実装基板。
- 前記接続部は、実装基板の貫通孔を画定する周側面を越えて前記少なくとも一つの貫通孔の内側に延びる、電子部品の基板の上面に配置された少なくとも一対の電極パターンの接続部分と、実装基板の貫通孔を画定する周側面上にある実装基板の少なくとも一対の電極パターンの接続部分とを半田により接続する請求項1に記載の実装基板。
- 前記貫通溝は、貫通孔を画定する周側面から放射状に形成される請求項4に記載の実装基板。
- 前記少なくとも一対の電極パターンは、前記複数の貫通溝の間に、貫通孔に沿って放射状に形成される請求項8に記載の実装基板。
- 前記電子部品が発光ダイオードである請求項1に記載の実装基板。
- 前記実装基板の表面において、少なくとも一対の電極パターンのそれぞれから、貫通孔を中心として放射状に延びる配線パターンをさらに有する、請求項1に記載の実装基板。
- 金属から成る基台と、前記基台の上面に配置されて少なくとも一対の電極パターンを有する配線板とから成る基板と、前記配線板の少なくとも一対の電極パターンと電気的に接続される少なくとも一つの半導体素子を備えた電子部品と、
少なくとも一対の電極パターンと、上面と、上面に対向し少なくとも一つの半導体素子が搭載された電子部品の基板の上面が実装される下面と、上面と下面を貫通する少なくとも一つの貫通孔と、貫通孔を画定する周側面とを有する実装基板と、を備え、
前記実装基板の少なくとも一対の電極パターンの少なくとも一部が、前記貫通孔を画定する周側面の内側に位置するように配置されており、
前記実装基板の少なくとも一対の電極パターンと前記電子部品の少なくとも一対の電極パターンとが接続される接続部が、前記貫通孔を画定する周側面の内側に配置される実装基板の実装構造。 - 前記実装基板の少なくとも一対の電極パターンが複数の電極パターンから成り、それぞれが独立して前記貫通孔に沿って設けられ、前記実装基板の上面から貫通孔を画定する周側面上を通って下面へと延びている請求項12に記載の実装基板の実装構造。
- 前記接続部は、実装基板の貫通孔を画定する周側面を越えて前記少なくとも一つの貫通孔の内側に延びる、電子部品の基板の上面に配置された少なくとも一対の電極パターンと実装基板の少なくとも一対の電極パターンとが、貫通孔を画定する周側面内において周側面に隣接する位置で、半田により接続されている請求項12に記載の実装基板。
- 前記半導体素子が発光素子である請求項12に記載の実装基板の実装構造。
- 前記接続部分は、前記少なくとも一つの貫通孔内に現れており、実装基板の上面から見る場合に目視される請求項12に記載の実装基板の実装構造。
- 前記少なくとも一つの貫通孔は貫通孔を画定する周側面から上面および下面を貫通して実装基板内に切り込む複数の貫通溝を有し、前記複数の貫通溝は少なくとも一対の電極パターンを電気的に分断する請求項12に記載の実装構造。
- 前記少なくとも一つの貫通孔は、実装基板に設けられた貫通孔より小さい複数の独立した小さな貫通孔と、複数の小さな貫通孔に隣接する位置で実装基板を打ち抜いて連結する打ち抜き孔との集合体からなり、
前記少なくとも一対の電極パターンは、前記上面から複数の小さな貫通孔を画定する周側面上を通って下面へと延びている請求項12に記載の実装構造。
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