WO2011104790A1 - 移載装置及びワーク載置装置 - Google Patents
移載装置及びワーク載置装置 Download PDFInfo
- Publication number
- WO2011104790A1 WO2011104790A1 PCT/JP2010/006307 JP2010006307W WO2011104790A1 WO 2011104790 A1 WO2011104790 A1 WO 2011104790A1 JP 2010006307 W JP2010006307 W JP 2010006307W WO 2011104790 A1 WO2011104790 A1 WO 2011104790A1
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- WIPO (PCT)
- Prior art keywords
- guide
- work
- workpiece
- guide members
- transfer device
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S294/00—Handling: hand and hoist-line implements
- Y10S294/902—Gripping element
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
Definitions
- the present invention relates to a transfer device for transferring a work and a work placement device used together with the transfer device.
- Patent Document 1 discloses a transfer device (transfer device) using a Bernoulli chuck that generates a suction force by ejecting high pressure air.
- the transfer device disclosed in Patent Document 1 takes out a sheet-like substrate (work) from a flat stage and transfers it, and a Bernoulli chuck as a suction means and a work disposed on the flat stage. And a control guide for controlling the position of the workpiece.
- the control guide includes a control unit having an inclined surface formed thereon, and when the sheet-like work is sucked by the Bernoulli chuck by bringing the end of the work into contact with the inclined surface formed on the control unit, It prevents the two from contacting each other. Furthermore, the control guide regulates the movement of the work in the planar direction by the inclined surface of the control unit when the work is transported in a suctioned state.
- a solar cell wafer as a work, an electrode of a lithium ion battery, etc. are thin and weak in strength.
- the sheet-like substrate is moved by the Bernoulli chuck by bringing the end portion of the sheet-like work into contact with the inclined surface formed in the control unit. When it is aspirated, it prevents both from contacting. Therefore, when taking out a sheet-like work from a flat stage, there is a possibility that breakage such as breakage of the work may occur.
- the present invention has been made to solve the above-mentioned problems, and when taking out and holding a work from the work mounting device on which the work is mounted, and the work mounting device holding the work
- a transfer device capable of preventing a guide member for preventing lateral displacement of a workpiece from coming into contact with the peripheral portion of the workpiece during transfer, and a workpiece mounting device used together with the transfer device. Intended to be provided.
- the transfer apparatus when the work is transported around the non-contact holding unit, the non-contact holding unit for holding the work in a non-contact state, the base member to which the non-contact holding unit is attached
- the plurality of guide members are spaced apart from each other so as to surround the work, and have a plurality of guide members protruding from the base member, and a moving mechanism for moving the base member in the space, the plurality of guide members being at least
- the parts are configured to be movable in directions away from each other, and when the work is taken out from the work mounting device on which the work is mounted, or the held work is mounted on the work mounting device
- the non-contact holding unit approaches the workpiece placement surface of the workpiece placement device, at least a portion of the plurality of guide members is formed in the workpiece placement device. Along, thus being moved away from each other.
- the periphery of the non-contact holding unit is approached as the non-contact holding unit approaches the workpiece mounting surface of the workpiece mounting apparatus on which the workpiece is placed or on which the workpiece is placed.
- a plurality of guide members arranged in the direction move in the direction away from each other along a guide guide formed in the work placement device. Therefore, when taking out the work or placing the work, each of the plurality of guide members is spread outside the periphery of the work.
- the guide member is the peripheral portion of the workpiece and It is possible to prevent contact.
- the plurality of guide members be disposed to face each other across the non-contact holding unit. This arrangement makes it possible to effectively prevent lateral displacement of the work held by the non-contact holding unit at the time of work conveyance.
- the transfer device includes an urging member that applies an urging force to the plurality of guide members to move the guide members toward each other as the plurality of guide members move away from each other, and the plurality of guide members As the non-contact holding unit is separated from the workpiece mounting surface of the workpiece mounting device, the biasing members of the biasing member move along the guide guide formed in the workpiece mounting device in a direction approaching each other. preferable.
- the plurality of guide members expanded when taking out the work move closer to each other by the biasing force of the biasing member as the non-contact holding unit is separated from the workpiece mounting surface of the workpiece mounting device. For example, it moves to a position substantially in contact with the periphery of the workpiece. Therefore, when the held work is transported, it is possible to appropriately restrict the lateral movement of the work.
- the guide member preferably includes a cylindrical proximal end and a conical distal end continuous from the proximal end. In this way, when transporting the workpiece, the contact area between the peripheral portion of the workpiece and the guide member can be further reduced. In addition, when the guide member is guided to the guide guide portion formed in the work placement device, it is possible to move more smoothly.
- the biasing member is preferably a torsion spring.
- the spring force of the torsion spring it is possible to apply an urging force to the respective guide members, which causes the respective guide members to approach each other as the plurality of guide members move away from each other.
- the movable mechanism can be made smaller and lighter.
- the guide member is preferably formed of an elastic body.
- the elasticity of the elastic body can be used to expand each of the plurality of guide members outside the peripheral edge of the work.
- the plurality of guide members are deformed to be separated from each other by utilizing the restoring force of the elastic body, it is possible to apply an urging force to the respective guide members 40 which acts in the direction in which the plurality of guide members approach each other.
- the guide member is preferably a plate-like member having a constant width in the direction along the outer edge of the workpiece to be held. In this way, the guide member can be easily deformed and expanded. In addition, lateral movement of the workpiece can be stably regulated when the workpiece is transported.
- the transfer device it is preferable to use a Bernoulli chuck as the non-contact holding unit.
- the Bernoulli effect is generated by the high pressure air ejected from the Bernoulli chuck being discharged from between the workpiece and the workpiece, and a suction force is generated.
- the workpiece can be held in a noncontact manner.
- the transfer device it is preferable to use, as the movement mechanism, a parallel mechanism robot that moves the base member horizontally while keeping the base member horizontal via a plurality of links.
- the parallel mechanism robot has features that there are no actuators in the movable part, can be reduced in weight, and can be driven at high speed and with high precision, so the base member to which the noncontact holding unit and guide member are attached is moved at high speed. be able to. Therefore, by using the parallel mechanism robot as the moving mechanism, it is possible to transfer the work at high speed while preventing lateral displacement of the work.
- a work placement device is a work placement device used together with any of the above-described transfer devices, and a plurality of guides as the non-contact holding unit constituting the transfer device approaches the work placement surface. It is characterized by having a guide guide part which guides each guide member in a direction in which the members move away from each other.
- the non-contact holding unit is mounted on the work mounting surface by guiding the plurality of guide members disposed around the non-contact holding unit along the guide guide portion.
- a plurality of guide members can be moved away from each other. Therefore, when taking out a work or placing a work, it becomes possible to extend a plurality of guide members outside the periphery of the work.
- the present invention when the workpiece is taken out from the workpiece placement device on which the workpiece is placed and held, and when the workpiece being held is placed on the workpiece placement device, lateral displacement of the workpiece at the time of transportation It is possible to prevent the guide member preventing the contact with the peripheral portion of the work.
- FIG. 6 is a cross-sectional view of the work-loading tray on the removal side, taken along line VI-VI of FIG. 5; It is a top view of the workpiece mounting tray by the side of mounting.
- FIG. 1 is a perspective view showing an entire configuration of a parallel mechanism robot 100 to which the noncontact holding device 1 is attached.
- FIG. 2 is a view showing the parallel mechanism robot 100 viewed from the direction of arrow A1 in FIG.
- the parallel mechanism robot 100 has a base portion 102 at the top.
- the parallel mechanism robot 100 is supported by fixing a flat mounting surface 102a (see FIG. 2) formed on the lower surface side of the base portion 102 to, for example, a horizontal ceiling or the like.
- three support members 103 are provided on the lower surface side of the base portion 102.
- Each support member 103 supports an electric motor 104, respectively.
- the electric motor 104 is supported such that the axis C2 of the motor shaft is parallel (i.e., horizontal) to the mounting surface 102 a of the base portion 102.
- each electric motor 104 is also centered on the vertical axis C1 of the base portion 102. They are placed at equal angles (120 degrees) (see FIG. 2).
- each electric motor 104 On the output shaft of each electric motor 104, an arm support member 105 having a substantially hexagonal column shape is fixed coaxially with the axis C2. The arm support member 105 rotates about the axis C2 by driving the electric motor 104.
- Each electric motor 104 is connected to an electronic control unit 130 including a motor driver, and the rotation of the output shaft of the electric motor 104 is controlled by the electronic control unit 130.
- the parallel mechanism robot 100 has three arm bodies 106, and each arm body 106 is configured to include a first arm 107 and a second arm 108.
- the first arm 107 is a long hollow cylindrical member formed of, for example, carbon fiber reinforced plastic (CFRP).
- CFRP carbon fiber reinforced plastic
- the proximal end of the first arm 107 is attached to the side surface of the arm support member 105.
- the first arm 107 is fixed so that its axis is orthogonal to the above-mentioned axis C2.
- the base end of the second arm 108 is connected to the free end of the first arm 107 so that the second arm 108 can swing around the free end of the first arm 107.
- the second arm 108 is configured to include a pair of elongated rods 109 and 109, and the pair of rods 109 and 109 are arranged to be parallel to each other in the longitudinal direction.
- the rod 109 is also a long hollow cylindrical member formed of, for example, carbon fiber reinforced plastic (CFRP) or the like.
- CFRP carbon fiber reinforced plastic
- the proximal end of each rod 109 is connected to the free end of the first arm 107 by a pair of ball joints 110, 110.
- the axis C3 connecting between the ball joints 110 and 110 at the base end of each rod 109 is disposed parallel to the axis C2 of the electric motor 104.
- one rod 109 and the other rod 109 are connected to each other by the connecting member 111 near the base end of the second arm 108, and one rod 109 and the other are connected near the free end of the second arm 108.
- the rod 109 is connected to each other by a connecting member 112.
- the connecting member 111 and the connecting member 112 each have, for example, a tension coil spring as a biasing member, and bias the pair of rods 109 and 109 in a direction to draw each other.
- the connecting member 111 and the connecting member 112 may have different structures, but preferably have the same structure from the viewpoint of low cost.
- Each connecting member 111, 112 has a function to prevent each rod 109 from rotating about an axis parallel to its own longitudinal direction.
- the parallel mechanism robot 100 also has a bracket 114 for rotatably mounting the noncontact holding device 1 (details will be described later).
- the bracket 114 is a plate-like member having a substantially regular triangle shape.
- the mounting surface 114a (the lower surface of the bracket 114 in FIG. 1) of the non-contact holding device 1 of the bracket 114 becomes parallel (that is, horizontal) to the mounting surface 102a of the base portion 102 by the three arm bodies 106. To be held.
- each mounting piece 115 is a free end portion of each arm main body 106 (a free end portion of a pair of rods 109 and 109 constituting the second arm 108
- the bracket 114 swings relative to each arm body 106 about the free end of each arm body 106.
- each end of each mounting piece 115 of the bracket 114 is connected to the free end of each corresponding rod 109, 109 by each ball joint 116, 116.
- the axis C4 (see FIG. 2) connecting the pair of ball joints 116, 116 is parallel to the axis C3 corresponding to each arm body 106 because the distances between the ball joints 110 and 116 of each rod 109 are all equal.
- bracket 114 swings with respect to each arm main body 106 by moving in parallel with the horizontal plane.
- the bracket 114 is supported by the three arm bodies 106 so as to be able to move parallel to the horizontal plane on all sides of the substantially regular triangular bracket 114.
- the distance between the pair of ball joints 110 at the connecting portion between the first arm 107 and the second arm 108 and the pair of balls at the connecting portion between each rod 109 of the second arm 108 and the bracket 114 The distance between the joints 116, 116 is set equal. Therefore, the pair of rods 109 and 109 constituting the second arm are always disposed parallel to each other over the entire length in the longitudinal direction.
- the bracket since all of the axes C2, C3, and C4 are parallel to the mounting surface 102a of the base portion 102, the bracket is provided regardless of how each of the three first arms 107 rotates about the axis C2.
- the parallel relationship between the mounting surface 114 a of the non-contact holding device 1 114 and the mounting surface 102 a of the base portion 102 is maintained.
- the rotational position of the arm support member 105 fixed to the output shaft of each electric motor 104 is controlled in accordance with the command from the electronic control unit 130, whereby the position of the free end of each first arm 107 It is controlled.
- the position of the free end of each second arm 108 follows the position of the controlled free end of each first arm 107, and as a result, the position of the mounting surface 114a of the non-contact holding device 1 of the bracket 114 is Uniquely determined. At this time, as described above, the bracket 114 moves while maintaining the horizontal posture.
- the parallel mechanism robot 100 has, at its center, a pivot rod 120 extending downward from the base portion 102 and an electric motor 121 for rotating the pivot rod 120.
- the electric motor 121 is fixed to the base portion 102 with its axis output directed vertically downward.
- One end of the pivot rod 120 is connected to the output shaft of the electric motor 121 via a universal joint (hereinafter referred to as "universal joint") 122 and a reduction gear 124 configured by a combination of a plurality of gears.
- the reduction gear ratio of the reduction gear 124 is five.
- the other end of the pivot rod 120 is connected to the noncontact holding device 1 via the universal joint 123.
- the lower connection portions of the non-contact holding device 1 and the universal joint 123 are rotatably fixed to the bracket 114 via a bearing or the like so that the central axes thereof are in the vertical direction.
- the pivot rod 120 is realized by a rod 120 a and a cylinder 120 b and is configured to be extensible.
- the pivot rod 120 is a ball spline and can transmit the rotation of the rod 120a to the cylinder 120b.
- the universal joints 122 and 123 are adopted at both ends of the pivot rod 120, the pivot rod is moved even if the bracket 114 is moved to the predetermined position vertically and horizontally by the drive of the three electric motors 104. 120 can move following the predetermined position.
- a configuration including the pivot rod 120 and the universal joints 122 and 123 will be referred to as a pivot 125.
- the electronic control unit 130 drives the arm body 106 by controlling the three electric motors 104 to move the noncontact holding device 1 to the target position. Further, the electronic control device 130 drives the pivot rod 120 by controlling the electric motor 121, and rotates the non-contact holding device 1 to the target rotation angle position.
- a programmable logic controller PLC
- the electronic control unit 130 is configured of a microprocessor that performs computations, a ROM that stores programs and the like for causing the microprocessors to execute each process, and a RAM that temporarily stores various data such as computation results.
- the electronic control unit 130 is connected with an input / output device 131 as a setting means for receiving an operation input by the operator and a display means for displaying the state of the parallel mechanism robot 100 and the setting contents.
- an input / output device 131 for example, a touch panel display, a liquid crystal display, and a keyboard are preferably used.
- the operator can set control data of the electric motors 104 and 121 using the input / output device 131.
- the electronic control device 130 drives the electric motor 104 and the electric motor 121 by executing the program stored in the ROM using the set control data, and thereby the position of the non-contact holding device 1 in the three-dimensional space Control (x, y, z) and rotation angle ( ⁇ ).
- FIG. 3 is a perspective view of the noncontact holding device 1 as viewed from the bottom side.
- the noncontact holding device 1 ejects high pressure air to generate suction force, and a Bernoulli chuck 20 for holding a workpiece 80 (see FIG. 8 etc.) in a noncontact state, and a predetermined distance around the Bernoulli chuck 20. And a plurality of (eight in the present embodiment) guide members 30 for preventing lateral displacement of the work 80 during conveyance of the work 80, and a chuck base to which the Bernoulli chuck 20 and the guide member 30 are attached And 10).
- the chuck base 10 is a square plate-like member whose outer dimension is formed one size larger than the workpiece 80 to be held.
- the chuck base 10 is formed of an industrial plastic or the like which is light in weight and excellent in strength.
- the shape, size, and the like of the chuck base 10 are preferably set in accordance with the shape, size, and the like of the workpiece to be held.
- An attachment 12 is attached to the center of the upper surface of the chuck base 10.
- the chuck base 10 is connected to the pivot rod 120 via the bracket 114 by the attachment 12, and is configured to be pivotable by the pivot rod 120.
- the Bernoulli chuck 20 has a cylindrical main body 21 attached to the lower surface side of the chuck base 10. A recess 22 is formed on the end face of the cylindrical main body 21.
- the Bernoulli chuck 20 is mounted such that the opening surface of the recess 22 formed in the main body 21 faces the workpiece 80 to be held, that is, the opening surface of the recess 22 faces downward.
- the opening surface of the main body 21 of the Bernoulli chuck 20 forms a workpiece holding surface for holding the workpiece 80 in a noncontact manner.
- a plurality of (three at an interval of 90 degrees in this embodiment) ejection holes 23 for ejecting high pressure air into the recess 22 are formed on the surface of the main body 21 facing the recess 22, a plurality of (three at an interval of 90 degrees in this embodiment) ejection holes 23 for ejecting high pressure air into the recess 22 are formed.
- the jet holes 23 are formed so as to penetrate the main body 21 obliquely downward in a direction in contact with the inner peripheral surface of the recess 22 from the side surface of the main body 21 to the bottom surface of the recess 22.
- An air pipe (not shown) is attached to each jet hole 23.
- the air pipe is connected to an air pump (not shown) for supplying high pressure air.
- the Bernoulli chuck 20 functions as a noncontact holding unit described in the claims.
- a plurality of (eight in the present embodiment) pin-shaped guide members 30 are provided to protrude in the vertical direction with respect to the chuck base 10.
- the eight guide members 30 are arranged around the Bernoulli chuck 20 so as to surround the workpiece 80 when the workpiece 80 is transported. More specifically, the guide members 30 are arranged in pairs (two in total) at intervals at the end of each side of the chuck base 10 (four sets in total), and the guide members 30 of each set are the Bernoulli chuck 20. It is disposed so as to face each other.
- the guide member 30 and the respective sides of the work 80 have a clearance of about 0.1 to 0.2 mm so that the guide member 30 substantially contacts the held work 80 in a steady state.
- the arrangement of the guide member 30 is preferably set according to the shape of the work 80 or the like.
- Each guide member 30 is configured to include a cylindrical proximal end 30 a whose one end is attached to the chuck base 10 and a substantially conical distal end 30 b continuous from the proximal end 30 a.
- the total length of each guide member 30 is set longer than the dimension in the height direction of the Bernoulli chuck 20, and the tip of each guide member 30 protrudes below the workpiece holding surface of the Bernoulli chuck 20.
- Each guide member 30 is, for example, filled with UHPE (Ultra High Molecular Weight Polyethylene: ultra high molecular weight polyethylene), PEEK (polyether ether ketone), or PTFE (tetrafluoroethylene) or the like to reduce friction. It is formed of a polymer material or the like.
- the opposing guide members 30 are configured to be movable in directions away from each other, and the work 80 is taken out from the work placement tray 70 (see FIGS. 5 and 6) on the removal side on which the work 80 is placed. Or when the workpiece 80 being held is placed on the workpiece placement tray 71 on the placement side (see FIG. 7), the workpiece placement surface 75 of the workpiece placement trays 70 and 71 is held in a non-contact manner As the apparatus 1 (Bernoulli chuck 20) approaches, it moves away from each other along the guide guide holes 72 formed in the work placement trays 70 and 71.
- the work placement trays 70 and 71 correspond to the work placement device described in the claims.
- the guide guide hole 72 corresponds to the guide guide part as described in a claim.
- FIG. 4 is a schematic view showing the movable mechanism of one guide member 30 in an enlarged manner.
- the movable mechanism of the other guide member 30 is also set as the same structure.
- a long hole 11 is formed in the direction orthogonal to the side.
- the guide member 30 is provided such that the upper end thereof penetrates the elongated hole 11 and two washers 31 and 32 disposed so as to sandwich the chuck base 10 from above and below.
- the guide member 30 and the washers 31 and 32 are fastened by screws 33 from the upper end side of the guide member 30.
- the pin-shaped guide member 30 is attached to the long hole 11 so as to be slidable along the long hole 11 without coming off the long hole 11.
- a torsion spring 34 is attached to the top surface of the chuck base 10.
- the torsion spring 34 is disposed inside the elongated hole 11 along the axis of the elongated hole 11 so that a biasing force (tensile force) is generated in the inward direction along the axial direction of the elongated hole 11.
- One end of the torsion spring 34 is locked to the upper surface of the chuck base 10 through a pin 36, and the other end is locked to a washer 31 attached to the upper surface of the chuck base 10 through a pin 37.
- the other end of the torsion spring 34 may be coaxially engaged with the head of the screw 33.
- the torsion spring 34 applies an urging force to the guide member 30 which acts in a direction in which the guide member 30 abuts on one end (inner side) of the elongated hole 11.
- the guide member 30 is in contact with one end side (inner side) of the long hole in the steady state. More specifically, the guide member 30 and the respective sides of the work 80 have a clearance of about 0.1 to 0.2 mm so that the guide member 30 substantially contacts the held work 80 in a steady state.
- guide guide holes 72 formed in the workpiece placement trays 70 and 71. The opposing guide members 30 move along the elongated holes 11 in a direction (outside) away from each other.
- the torsion springs 34 apply an urging force to the guide members 30 so that the guide members 30 move closer to each other. Therefore, after taking out the work 80 from the work mounting tray 70 or after mounting the work 80 on the work mounting tray 71, the Bernoulli chuck 20 is separated from the work mounting surface of the work mounting trays 70 and 71.
- the opposing guide members 30 move in directions approaching each other along the guide guide holes 72 formed in the work placement trays 70 and 71 by the biasing force of the torsion springs 34, and return to the steady position.
- FIG. 5 is a plan view of the work placement tray 70 on the takeout side
- FIG. 6 is a longitudinal cross-sectional view of the work placement tray 70 along the line VI-VI in FIG.
- FIG. 7 is a plan view of the work placement tray 71 on the placement side.
- the take-out work placement tray 70 on which the work 80 to be held is placed and the work placement tray 71 on the placement side on which the held work 80 is placed may be placed The only difference is the number of work pieces 80 that can be made, and the other configurations are the same.
- the work placement tray 70 on the take-out side has two work placement surfaces 75 so that two works 80 can be placed.
- the workpiece placement tray 71 on the placement side has six (2 ⁇ 3) workpiece placement surfaces 75 so that six workpieces 80 can be placed.
- FIG. 5 shows a state in which the work 80 is mounted only on the work mounting surface 75 on the left side of the drawing.
- FIG. 6 the state in which the workpiece
- a square work placement surface 75 on which the work 80 is placed is formed on the upper surfaces of the work placement trays 70 and 71.
- the workpiece mounting surface 75 is formed to have substantially the same dimensions as the dimensions of the workpiece 80.
- a substantially rectangular guide guide hole 72 for guiding the guide member 30 is formed along each side on the outer side of the substantially central portion of each side of the work placement surface 75.
- the inner side surface of the guide guide hole 72 is an inclined portion (inclined region) 72a which is inclined from the opening toward the center of the hole, and a vertical portion (vertical region) which smoothly continues downward from the inclined portion 72a. And 72b.
- the guide guide holes 72 guide the respective guide members 30 in the direction in which the opposing guide members 30 move away from each other along the inclined portion 72a as the Bernoulli chuck 20 descends and approaches the workpiece mounting surface 75. Further, the guide guide holes 72 guide the respective guide members 30 in the direction in which the opposing guide members 30 approach each other along the inclined portion 72a as the Bernoulli chuck 20 is lifted and separated from the work placement surface 75. Note that two guide members 30 can enter into one guide guide hole 72.
- work guide protrusions 74 having a trapezoidal cross section are provided along the respective sides of the work placement surface 75.
- the work guide projection 74 guides the work 80 to a predetermined position when the work 80 is placed. That is, when the work 80 held by the Bernoulli chuck 20 is placed, it is guided along the inclined surface of the work guide projection 74 and placed at a predetermined position of the work placement surface 75.
- a circular through hole 73 is formed in the central portion of the workpiece mounting surface 75.
- the through holes 73 are provided to prevent the work placement trays 70 and 71 from being pulled by a negative pressure by supplying air from the lower side when the work 80 is taken out by the Bernoulli chuck 20. , Air vent holes.
- FIG. 8 is a view for explaining the operation of the guide member 30 of the non-contact holding device 1, and the motion of the guide member 30 when the Bernoulli chuck 20 takes out the work 80 in chronological order from the top It is shown.
- the Bernoulli chuck 20 descends in the vertical direction (arrow A2) and approaches the workpiece placement surface 75 of the workpiece placement tray 70.
- the Bernoulli chuck 20 holds the work 80 in a noncontact manner in a state where the opposing guide members 30 are expanded by the guide guide holes 72. Therefore, the workpiece 80 can be held and taken out without the guide member 30 coming into contact with the peripheral portion of the workpiece 80.
- the opposing guide member 30 is attached with a torsion spring 34. By the force, it moves in a direction approaching each other along the inner side surface of the guide guide hole 72 formed in the work mounting tray 70, and returns to the steady position.
- the workpiece 80 is held by suction by the Bernoulli chuck 20, and the relative position between the workpiece 80 and the guide member 30 does not change in the height direction, and the clearance gradually decreases. Therefore, the movement of the workpiece 80 in the lateral direction is restricted without being rubbed in the axial direction of the guide member 30. This prevents lateral displacement of the workpiece 80 during transport.
- the noncontact holding device 1 (Bernoulli chuck 20) takes out the solar cell wafer 230 from the work placement tray 70 on the takeout side, and then the solar cell wafer 230
- the case of conveying to the workpiece placement tray 71 on the placement side while aligning the rotational angle position of the above will be described as an example.
- the movement operation after transfer of the solar cell wafer 230 to removal of the next solar cell wafer 230 is the same as or similar to the operation to be described below except that the operation direction is reversed. I omit explanation.
- FIG. 9 is a bird's-eye view for demonstrating the outline
- the first conveyor 200 and the second conveyor 201 are arranged in parallel with each other, and the parallel mechanism robot 100 is installed above the two conveyors.
- Each of the first conveyor 200 and the second conveyor 201 is moved by pitch feeding while repeating a predetermined speed or pause from the right side to the left side of the drawing.
- a solar cell wafer 230 placed on the work placement tray 70 on the take-off side is flowing.
- the solar cell wafer 230 is, for example, a square thin plate of length 156 ⁇ width 156 ⁇ thickness 0.1 to 0.2 mm.
- a work placement tray 71 on the placement side on which the solar battery wafers 230 are aligned and stored is carried on the second conveyor 201 and is flowing.
- the workpiece placement tray 71 on the placement side has six (2 ⁇ 3) workpiece placement surfaces 75 partitioned in a grid shape, and is placed on the workpiece placement tray 70 by the parallel mechanism robot 100.
- the disposed solar cell wafer 230 is transferred to each work mounting surface 75 of the work mounting tray 71.
- the parallel mechanism robot 100 drives the arm body 106 to move the non-contact holding device 1 (Bernoulli chuck 20), and after approaching the solar cell wafer 230 mounted on the work mounting tray 70, the solar cell
- the operation of taking out the wafer 230 by the non-contact holding device 1 and conveying it to the work mounting tray 71 is repeatedly executed.
- the parallel mechanism robot 100 rotates the non-contact holding device 1 when holding and transporting the solar cell wafer 230 in the direction of the square solar cell wafer 230 so that the work mounting surface of the work mounting tray 71
- the solar cell wafer 230 is stored in the workpiece mounting surface 75 of the workpiece mounting tray 71 in accordance with the direction 75.
- the first conveyor 200 is provided with a first encoder 210 for detecting the amount of movement of the first conveyor 200.
- the first encoder 210 outputs the detected movement amount of the first conveyor 200 to the electronic control device 130.
- a second encoder 211 for detecting the amount of movement of the second conveyor 201 is attached to the second conveyor 201.
- the second encoder 211 outputs the detected amount of movement of the second conveyor 201 to the electronic control device 130.
- an imaging device 220 such as a CCD camera is attached above the first conveyor 200.
- the image pickup device 220 picks up an image of the solar cell wafer 230 placed on the flowing work placement tray 70, obtains the center of gravity position and direction (angle) of the solar cell wafer 230, and outputs it to the electronic control device 130. .
- an optical sensor 221 for detecting the leading end of the work placement tray 71 is attached to the second conveyor 201.
- the optical sensor 221 outputs a detection signal to the electronic control unit 130.
- the work placement tray 70 flows on the first conveyor 200 at an uneven pitch or an arbitrary direction (angle) by the rotation of the non-contact holding device 1 and the position detection of the imaging device 220. Even in this case, the electronic control device 130 can appropriately control the position of the noncontact holding device 1 and take out the solar cell wafer 230.
- the electronic control unit 130 calculates the position of the solar cell wafer 230 based on the position of the center of gravity of the solar cell wafer 230 and the amount of movement of the first conveyor 200. Further, the electronic control unit 130 calculates the position of the work placement tray 71 based on the detection signal of the tip of the work placement tray 71 and the movement amount of the second conveyor 201. The electronic control unit 130 rotates the respective electric motors 104 to drive the arm main body 106 based on the determined position of the solar cell wafer 230 and the position of the work mounting tray 71, and is horizontal to the work mounting tray 70. The solar cell wafer 230 placed on top is accessed from the top to take out the solar cell wafer 230, and then the inside of the space is transported, and the work cell mounting tray 71 is accessed from the top and held. The tray 71 is horizontally placed.
- the Bernoulli chuck 20 descends in the vertical direction and approaches the work placement surface 75 of the work placement tray 70. Thereafter, the guide member 30 contacts the inner side surface of the guide guide hole 72, and as the Bernoulli chuck 20 descends and approaches the work placement surface 75, the guide member 30 facing along the inclined portion 72a of the guide guide hole 72. Are gradually expanded in the direction away from each other. Then, with the guide member 30 expanded by the guide guide hole 72, the Bernoulli chuck 20 holds the solar cell wafer 230 in a noncontact manner. Therefore, the solar cell wafer 230 can be held and taken out without the guide member 30 coming into contact with the peripheral portion of the solar cell wafer 230.
- the opposing guide member 30 is biased by the torsion spring 34. It moves in a direction approaching each other along the inner side surface of the guide guide hole 72 formed in the work mounting tray 70 and returns to the steady position. This prevents lateral displacement of the solar cell wafer 230 during transport.
- the Bernoulli chuck 20 holding the solar cell wafer 230 descends in the vertical direction, and the work mounting surface 75 of the work mounting tray 71 is approach. Thereafter, the guide member 30 contacts the inner side surface of the guide guide hole 72, and as the Bernoulli chuck 20 descends and approaches the work placement surface 75, the guide member 30 facing along the inclined portion 72a of the guide guide hole 72. Are gradually expanded in the direction away from each other. Then, the Bernoulli chuck 20 places the solar cell wafer 230 on the workpiece placement surface 75 of the workpiece placement tray 71 in a state where the guide member 30 is expanded by the guide guide hole 72.
- the solar cell wafer 230 can be mounted without the guide member 30 coming into contact with the peripheral portion of the solar cell wafer 230.
- guide member 30 opposed by the urging force of torsion spring 34 as Bernoulli chuck 20 separates from work mounting surface 75 of work mounting tray 71. It moves in a direction approaching each other along the inner side surface of the guide guide hole 72 formed in the work mounting tray 71 and returns to the steady position.
- the electronic control device 130 drives the electric motor 121 based on the obtained orientation of the solar cell wafer 230 while transporting the solar cell wafer 230, and the pivot shaft (that is, the noncontact holding device 1) To align the direction of the solar cell wafer 230 with the workpiece mounting surface 75 of the workpiece mounting tray 71.
- the above operation is repeatedly performed in real time, so that the solar cell wafer 230 placed on the work placement tray 70 flowing on the first conveyor 200 flows on the second conveyor 201.
- the tray 71 is aligned and stored.
- the hand position accuracy of the parallel mechanism robot 100 When taking out the solar cell wafer 230 from the work placement tray 70 or placing it on the work placement tray 71, the hand position accuracy of the parallel mechanism robot 100, the position accuracy of the first conveyor 200 and the second conveyor 201, imaging In addition to the detection position accuracy of the device 220, the relative position between the non-contact holding device 1 and the work placement trays 70 and 71 slightly deviates due to vibration of each part of the device. According to the present embodiment, by the extension of the guide member 30, it is possible to absorb the displacement and take it out or place it without contacting the peripheral portion of the solar cell wafer 230.
- the workpiece mounting tray 20 approaches the workpiece mounting tray It moves in the direction away from each other along the guide guide holes 72 formed in 70 and 71. Therefore, when taking out the work 80 or placing the work 80, each of the eight guide members 30 is spread outside the peripheral edge of the work 80. As a result, when the work 80 is taken out from the work placement tray 70 on which the work 80 is placed, or when the held work 80 is placed on the work placement tray 71, the guide member 30 Can be prevented from coming into contact with the peripheral portion of the work 80. As a result, it is possible to prevent the deterioration of the performance due to the damage to the edge of the workpiece, for example, when taking out or placing the workpiece such as a solar cell wafer.
- the eight guide members 30 are disposed to face each other with the Bernoulli chuck 20 interposed therebetween. Therefore, the lateral displacement of the workpiece 80 held by the Bernoulli chuck 20 is effective when the workpiece 80 is transported. Can be prevented.
- the eight guide members 30 expanded when taking out the workpiece 80 move away from the workpiece loading surface 75 of the workpiece loading tray 70 from the Bernoulli chuck 20, the biasing force of the torsion spring 34 Thus, they move in directions approaching each other, and move, for example, to a position substantially in contact with the peripheral portion of the workpiece 80. Therefore, when the held work 80 is transported, it is possible to appropriately restrict the lateral movement of the work 80.
- the guide member 30 is composed of the cylindrical proximal end 30a and the conical distal end 30b continuous from the proximal end 30a, when transporting the workpiece 80, The contact area between the peripheral portion of the work 80 and the guide member 30 can be further reduced. Further, when the guide member 80 is guided to the guide guide holes 72 formed in the work placement trays 70 and 71, it can be moved more smoothly.
- the urging forces are applied to the respective guide members 30 such that the guide members 30 move closer to one another as the eight guide members 30 move away from one another by utilizing the spring force of the torsion spring 34.
- the movable mechanism can be reduced in size and weight.
- the high pressure air jetted from the Bernoulli chuck 20 is discharged from between the workpiece 80 and the workpiece 80 to generate the Bernoulli effect, and a suction force is generated.
- the workpiece 80 can be held in a noncontact manner.
- the parallel mechanism robot 100 has features that there is no actuator at the movable part, can be reduced in weight, and can be driven at high speed and with high precision. Therefore, the base member 10 to which the Bernoulli chuck 20 and the guide member 30 are attached is very fast. Can be moved by Therefore, by using the parallel mechanism robot 100 as the movement mechanism, it is possible to transfer the work 80 at high speed while preventing lateral displacement of the work 80.
- the work placement surface is provided by guiding the eight guide members 30 disposed around the Bernoulli chuck 20 along the guide guide holes 72. As the Bernoulli chuck 20 approaches 75, the eight guide members 30 can be moved away from one another. Therefore, when the workpiece 80 is taken out or when the workpiece 80 is mounted, the eight guide members 30 can be spread outside the peripheral edge of the workpiece 80.
- FIG. 10 is a side view showing the configuration of the noncontact holding device 2.
- FIG. 11 is a perspective view of the non-contact holding device 2 holding the work 80 as viewed from the bottom side. 10 and 11, the same or equivalent components as or to those of the first embodiment are denoted by the same reference numerals.
- the noncontact holding device 2 is different from the noncontact holding device 1 in that the noncontact holding device 2 includes a plate shaped guide member 40 formed of an elastic body instead of the pin shaped guide member 30.
- the noncontact holding device 2 is different from the noncontact holding device 1 in that the noncontact holding device 2 does not have the movable mechanism shown in FIG.
- the other configuration is the same as that of the non-contact holding device 1 described above, and thus the description thereof is omitted here.
- the configuration of the parallel mechanism robot other than the non-contact holding device 2 is also the same as that of the parallel mechanism robot 100 according to the first embodiment described above, and thus the description thereof is omitted here.
- a plurality of (four in the present embodiment) plate-like guide members 40 are vertically provided to protrude from the lower surface of the chuck base 10A.
- the four guide members 40 are arranged at intervals around the Bernoulli chuck 20 so as to surround the workpiece 80 when the workpiece 80 is transported. More specifically, the guide members 40 are disposed at the end of each side of the chuck base 10A, and the guide members 40 are disposed to face each other with the Bernoulli chuck 20 interposed therebetween. Further, in more detail, the guide member 40 and each side of the work 80 have a clearance of about 0.1 to 0.2 mm so that the guide member 40 substantially contacts the held work 80 in a steady state. Are arranged to have The arrangement of the guide member 40 is preferably set in accordance with the shape of the work 80 or the like.
- each guide member 40 is set longer than the dimension in the height direction of the Bernoulli chuck 20, and the tip of each guide member 40 protrudes below the workpiece holding surface of the Bernoulli chuck 20.
- the tip of the guide member 40 is obliquely cut on the inside. Thereby, the inner side surface of the guide guide hole 72 can be smoothly contacted.
- the guide member 40 has a constant width (for example, about 35 mm) in the direction along the outer edge of the workpiece 80 to be held.
- Each guide member 40 is formed of, for example, an elastic body such as fluorine rubber, urethane rubber or silicone rubber.
- the surface may be provided with, for example, a DLC (diamond like carbon) coating or the like in order to improve sliding and to improve abrasion resistance.
- the opposing guide members 40 are configured to be able to deform (move) in the direction in which the lower end portions thereof are separated from each other by utilizing its elasticity. Therefore, when the work 80 is taken out from the work placement tray 70 on the take-out side on which the work 80 is placed and placed, or the held work 80 is placed on the work placement tray 71 on the placement side
- the non-contact holding device 2 (Bernoulli chuck 20) approaches the work placement surface 75 of the work placement trays 70 and 71, along the guide guide holes 72 formed in the work placement trays 70 and 71.
- the lower end portions of the opposing guide members 40 are deformed so as to warp in the direction away from each other.
- the opposing guide members 40 deform in directions away from each other, a restoring force (biasing force) is generated in the directions in which the opposing guide members 40 approach each other. Therefore, after taking out the work 80 from the work mounting tray 70 or after mounting the work 80 on the work mounting tray 71, the Bernoulli chuck 20 is separated from the work mounting surface of the work mounting trays 70 and 71.
- the opposing guide members 40 move in directions approaching each other by their own restoring force (biasing force) along the guide guide holes 72 formed in the work placement trays 70 and 71, and return to the steady position. That is, the guide member 40 also functions as a biasing member described in the claims.
- FIG. 12 is a diagram for explaining the movement of the guide member 40 of the noncontact holding device 2.
- the Bernoulli chuck 20 descends in the vertical direction and approaches the workpiece placement surface 75 of the workpiece placement tray 70.
- the Bernoulli chuck 20 descends and approaches the work placement surface 75, the lower end of the guide member 40 along the inclined portion 72a of the guide guide hole 72. The parts gradually deform away from one another.
- the Bernoulli chuck 20 holds the work 80 in a noncontact manner. Therefore, the workpiece 80 can be held and taken out without the guide member 40 coming into contact with the peripheral portion of the workpiece 80.
- the guide members 40 facing each other have their own restoring force as the Bernoulli chuck 20 ascends in the vertical direction and moves away from the workpiece mounting surface 75 Due to the biasing force, it moves in the direction approaching each other along the inner side surface of the guide guide hole 72 formed in the work mounting tray 70, and returns to the steady position. This prevents lateral displacement of the workpiece 80 during transport.
- the guide member 40 is formed of a plate-like elastic body. Therefore, when taking out the work 80 or placing the work 80, it is possible to expand each of the four guide members 40 outside the peripheral portion of the work 80 by utilizing the elasticity of the elastic body. Also, as the four guide members 40 are deformed so as to be separated from each other by utilizing the restoring force of the elastic body, it is possible to apply an urging force to the respective guide members 40 which acts in the direction in which the guide members 40 approach each other. .
- the guide member 40 is formed in a plate shape having a constant width in the direction along the outer edge of the workpiece 80 to be held, the guide member 40 can be easily deformed and expanded. it can. In addition, when the workpiece 80 is transported, lateral movement of the workpiece 80 can be stably restricted.
- the structure can be simplified, and therefore, the size, weight, and cost can be further reduced.
- the shape, size, number, and arrangement of the guide member 30 and the guide member 40, the shape, size, and material of the base members 10 and 10A, and the size, number, arrangement, and the like of the Bernoulli chuck 20 are as described above. It is not limited and can be set arbitrarily according to the shape, size, weight, etc. of the workpiece 80 to be held.
- the guide members do not necessarily have to be disposed opposite to each other.
- three guide members are arranged at intervals of 120 ° around the circular work. It may be arranged. In that case, the guide guide holes of the work placement tray are formed in accordance with the arrangement of the guide members.
- two pin-shaped guide members 30 are inserted into one rectangular guide guide hole 72, but the guide guide hole 72 may be formed into two circular or elliptical guide guide holes. Alternatively, one pin-shaped guide member may enter into each of the guide guide holes.
- a tray (work placement trays 70 and 71) for placing one work 80 flatly and stored is used as a work placement device for placing the work 80 thereon, but in place of the tray, A cassette that stacks and accommodates a large number of works 80 may be used.
- the application range of the parallel mechanism robot 100 is not limited to the palletizing process of the solar cell wafer 230.
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Abstract
Description
まず、図1及び図2を併せて用いて、第1実施形態に係る、非接触保持装置1が取り付けられたパラレルメカニズムロボット100(特許請求の範囲に記載の移載装置に相当)の全体構成について説明する。図1は、非接触保持装置1が取り付けられたパラレルメカニズムロボット100の全体構成を示す斜視図である。また、図2は、図1中の矢印A1方向から見たパラレルメカニズムロボット100を示す図である。
上述した非接触保持装置1ではピン状のガイド部材30を用いたが、ピン状のガイド部材30に代えて、板状のガイド部材を用いることもできる。次に、図10及び図11を用いて、第2実施形態に係る非接触保持装置2の構成について説明する。図10は、非接触保持装置2の構成を示す側面図である。また、図11は、ワーク80を保持した非接触保持装置2を底面側から見た斜視図である。なお、図10,11において第1実施形態と同一又は同等の構成要素については同一の符号が付されている。
10,10A チャックベース
20 ベルヌーイチャック
21 本体
22 凹部
23 噴出孔
30,40 ガイド部材
70,71 ワーク載置トレイ
72 ガイド案内孔
80 ワーク
100 パラレルメカニズムロボット
Claims (20)
- ワークを非接触状態で保持する非接触保持ユニットと、
前記非接触保持ユニットが取り付けられたベース部材と、
前記非接触保持ユニットの周囲に、ワークが搬送される際に該ワークを包囲するように互いに間隔を空けて配置されて、前記ベース部材に突設された複数のガイド部材と、
前記ベース部材を空間内で移動させる移動機構と、を備え、
前記複数のガイド部材は、少なくとも一部分が互いに離れる方向に移動可能に構成されており、
ワークが載置されているワーク載置装置からワークが取出される際、又は、保持されているワークがワーク載置装置に載置される際に、ワーク載置装置のワーク載置面に前記非接触保持ユニットが近づくに従って、前記複数のガイド部材の少なくとも一部分が、ワーク載置装置に形成されているガイド案内部に沿って、互いに離れる方向に移動することを特徴とする移載装置。 - 前記複数のガイド部材は、前記非接触保持ユニットを挟んで、対向して配置されていることを特徴とする請求項1に記載の移載装置。
- 前記複数のガイド部材が互いに離れる程、前記複数のガイド部材が互いに近づく方向に作用する付勢力を各ガイド部材に付与する付勢部材を備え、
前記複数のガイド部材は、前記ワーク載置装置のワーク載置面から前記非接触保持ユニットが離れるに従って、前記ワーク載置装置に形成されているガイド案内部に沿って、前記付勢部材の付勢力により、互いに近づく方向に移動することを特徴とする請求項1に記載の移載装置。 - 前記ガイド部材は、円筒状の基端部と、該基端部から連続する円錐状の先端部とを含むことを特徴とする請求項1に記載の移載装置。
- 前記付勢部材は、トーションバネであることを特徴とする請求項3に記載の移載装置。
- 前記ガイド部材は、弾性体から形成されていることを特徴とする請求項1に記載の移載装置。
- 前記ガイド部材は、保持される前記ワークの外縁に沿った方向に一定の幅を有する板状部材であることを特徴とする請求項6に記載の移載装置。
- 前記非接触保持ユニットは、ベルヌーイチャックであることを特徴とする請求項1に記載の移載装置。
- 前記移動機構は、複数のリンクを介して、前記ベース部材を水平に保ったまま移動させるパラレルメカニズムロボットであることを特徴とする請求項1に記載の移載装置。
- 請求項1に記載の移載装置と共に用いられるワーク載置装置であって、
前記移載装置を構成する前記非接触保持ユニットがワーク載置面に近づくに従って、前記複数のガイド部材が互いに離れる方向に各ガイド部材を案内するガイド案内部を有することを特徴とするワーク載置装置。 - 前記複数のガイド部材が互いに離れる程、前記複数のガイド部材が互いに近づく方向に作用する付勢力を各ガイド部材に付与する付勢部材を備え、
前記複数のガイド部材は、前記ワーク載置装置のワーク載置面から前記非接触保持ユニットが離れるに従って、前記ワーク載置装置に形成されているガイド案内部に沿って、前記付勢部材の付勢力により、互いに近づく方向に移動することを特徴とする請求項2に記載の移載装置。 - 前記ガイド部材は、円筒状の基端部と、該基端部から連続する円錐状の先端部とを含むことを特徴とする請求項2に記載の移載装置。
- 前記ガイド部材は、円筒状の基端部と、該基端部から連続する円錐状の先端部とを含むことを特徴とする請求項3に記載の移載装置。
- 前記ガイド部材は、弾性体から形成されていることを特徴とする請求項2に記載の移載装置。
- 前記ガイド部材は、弾性体から形成されていることを特徴とする請求項3に記載の移載装置。
- 前記非接触保持ユニットは、ベルヌーイチャックであることを特徴とする請求項2に記載の移載装置。
- 前記非接触保持ユニットは、ベルヌーイチャックであることを特徴とする請求項3に記載の移載装置。
- 前記移動機構は、複数のリンクを介して、前記ベース部材を水平に保ったまま移動させるパラレルメカニズムロボットであることを特徴とする請求項2に記載の移載装置。
- 前記移動機構は、複数のリンクを介して、前記ベース部材を水平に保ったまま移動させるパラレルメカニズムロボットであることを特徴とする請求項3に記載の移載装置。
- 請求項3に記載の移載装置と共に用いられるワーク載置装置であって、
前記移載装置を構成する前記非接触保持ユニットがワーク載置面に近づくに従って、前記複数のガイド部材が互いに離れる方向に各ガイド部材を案内するガイド案内部を有することを特徴とするワーク載置装置。
Priority Applications (4)
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KR1020127019023A KR101389895B1 (ko) | 2010-02-23 | 2010-10-26 | 이재장치 및 공작물 재치장치 |
EP10846458.7A EP2541592A4 (en) | 2010-02-23 | 2010-10-26 | TRANSMISSION DEVICE AND DEVICE FOR ASSEMBLING WORKPIECES |
CN201080064661.0A CN102770953B (zh) | 2010-02-23 | 2010-10-26 | 移动载置装置以及工件载置装置 |
US13/580,663 US8882437B2 (en) | 2010-02-23 | 2010-10-26 | Transfer device, and workpiece mounting device |
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JP2010-037904 | 2010-02-23 | ||
JP2010037904A JP5488037B2 (ja) | 2010-02-23 | 2010-02-23 | 移載装置及びワーク載置装置 |
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PCT/JP2010/006307 WO2011104790A1 (ja) | 2010-02-23 | 2010-10-26 | 移載装置及びワーク載置装置 |
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US (1) | US8882437B2 (ja) |
EP (1) | EP2541592A4 (ja) |
JP (1) | JP5488037B2 (ja) |
KR (1) | KR101389895B1 (ja) |
CN (1) | CN102770953B (ja) |
TW (1) | TWI464099B (ja) |
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CN108511550A (zh) * | 2016-05-06 | 2018-09-07 | 应用材料意大利有限公司 | 夹持器及方法 |
US11482640B2 (en) | 2016-05-06 | 2022-10-25 | Applied Materials Italia S.R.L. | Apparatus for manufacture of at least two solar cell arrangements, system for manufacture of at least two shingled solar cells, and method for manufacture of at least two solar cell arrangements |
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JP7075814B2 (ja) * | 2018-05-21 | 2022-05-26 | 株式会社荏原製作所 | 基板保持装置、基板研磨装置、弾性部材および基板保持装置の製造方法 |
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JP7486093B2 (ja) * | 2019-11-12 | 2024-05-17 | パナソニックIpマネジメント株式会社 | 位置決め装置 |
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- 2010-10-26 WO PCT/JP2010/006307 patent/WO2011104790A1/ja active Application Filing
- 2010-10-26 US US13/580,663 patent/US8882437B2/en not_active Expired - Fee Related
- 2010-10-26 KR KR1020127019023A patent/KR101389895B1/ko not_active IP Right Cessation
- 2010-10-26 EP EP10846458.7A patent/EP2541592A4/en not_active Withdrawn
- 2010-12-27 TW TW099146062A patent/TWI464099B/zh not_active IP Right Cessation
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108511550A (zh) * | 2016-05-06 | 2018-09-07 | 应用材料意大利有限公司 | 夹持器及方法 |
CN108511550B (zh) * | 2016-05-06 | 2022-02-11 | 应用材料意大利有限公司 | 夹持器及方法 |
US11482640B2 (en) | 2016-05-06 | 2022-10-25 | Applied Materials Italia S.R.L. | Apparatus for manufacture of at least two solar cell arrangements, system for manufacture of at least two shingled solar cells, and method for manufacture of at least two solar cell arrangements |
US11527672B2 (en) | 2016-05-06 | 2022-12-13 | Applied Materials Italia S.R.L. | Apparatus for manufacture of at least two solar cell arrangements, system for manufacture of at least two shingled solar cells, and method for manufacture of at least two solar cell arrangements |
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Also Published As
Publication number | Publication date |
---|---|
TW201139248A (en) | 2011-11-16 |
CN102770953B (zh) | 2015-04-08 |
TWI464099B (zh) | 2014-12-11 |
KR20120112612A (ko) | 2012-10-11 |
US8882437B2 (en) | 2014-11-11 |
CN102770953A (zh) | 2012-11-07 |
JP5488037B2 (ja) | 2014-05-14 |
EP2541592A4 (en) | 2014-06-25 |
US20120313388A1 (en) | 2012-12-13 |
EP2541592A1 (en) | 2013-01-02 |
KR101389895B1 (ko) | 2014-04-30 |
JP2011176053A (ja) | 2011-09-08 |
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