WO2011071006A1 - Flux pour pâte à braser et pâte à braser - Google Patents

Flux pour pâte à braser et pâte à braser Download PDF

Info

Publication number
WO2011071006A1
WO2011071006A1 PCT/JP2010/071808 JP2010071808W WO2011071006A1 WO 2011071006 A1 WO2011071006 A1 WO 2011071006A1 JP 2010071808 W JP2010071808 W JP 2010071808W WO 2011071006 A1 WO2011071006 A1 WO 2011071006A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
flux
meth
rosin
solder
Prior art date
Application number
PCT/JP2010/071808
Other languages
English (en)
Japanese (ja)
Inventor
栄治 岩村
和志 後藤
進介 長坂
孝恭 吉岡
公孝 宇都野
充男 中村
輝雄 大河内
真佐樹 三治
拓士 助川
健志 池戸
善之 安藤
武史 白井
公章 森
理枝 和田
研介 中西
正巳 相原
聖史 隈元
Original Assignee
荒川化学工業株式会社
トヨタ自動車株式会社
株式会社デンソー
富士通テン株式会社
株式会社弘輝
ハリマ化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荒川化学工業株式会社, トヨタ自動車株式会社, 株式会社デンソー, 富士通テン株式会社, 株式会社弘輝, ハリマ化成株式会社 filed Critical 荒川化学工業株式会社
Priority to US13/513,880 priority Critical patent/US20120291921A1/en
Priority to EP10835926.6A priority patent/EP2511043B1/fr
Priority to KR1020127016875A priority patent/KR101414296B1/ko
Priority to CA2781958A priority patent/CA2781958C/fr
Priority to CN201080055183.7A priority patent/CN102770232B/zh
Publication of WO2011071006A1 publication Critical patent/WO2011071006A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Definitions

  • the present invention relates to a solder paste flux and a solder paste.
  • a screen printing process in a soldering process in which a solder paste is used is mainly classified into four processes shown in FIGS. 1A to 1D.
  • First, an appropriate amount of solder paste 16 is applied onto a so-called stencil mask plate 14 made of metal that opens above the electrode 12 disposed on the substrate 10 to be soldered.
  • the solder paste 16 is imprinted into the aforementioned opening by a urethane or metal spatula jig called a squeegee 20 (FIG. 1A).
  • the solder paste 16 is transferred and applied onto the electrode 12 (FIG. 1B).
  • various electronic components 30 are mounted (FIG. 1C).
  • the solder metal is melted through a heating temperature raising process called reflow, whereby the electronic component 30 and the electrode 12 on the substrate 10 are joined (FIG. 1D).
  • a solder paste is a viscoelastic material having both solid and liquid properties.
  • the solder paste exhibits solid properties when left on a stencil mask.
  • the solder paste is fluidized by expressing the liquid property in a state where the shearing force is applied by the squeegee.
  • the solder paste can be filled in the opening of the mask.
  • the solder paste is brought into a stationary state without a load of a shearing force, so that a solid property is expressed again, so that the transferred shape can be maintained.
  • solder paste since the solder paste has a solid property and a liquid property as basic physical properties, both properties are required to be appropriately expressed in the screen printing process. If the solder paste is too fluid, bleeding due to printing occurs. On the other hand, if the solder paste is solid and too hard, there may be a problem that a predetermined amount cannot be imprinted in the opening.
  • the above process is repeated for a large number of substrates. Specifically, the process of leaving the solder paste after being subjected to a shearing force load by a squeegee is repeated.
  • the viscoelastic properties of the solder paste deteriorate due to fatigue and its fluidity increases.
  • there have been problems such as bleeding during screen printing, progress of “sag” due to heating, or separation of solder metal and flux. Further, since the screen printing process is usually performed in the atmosphere, the solder metal is repeatedly exposed to the atmosphere.
  • solder paste needs to have sufficient resistance to these problems.
  • improvement in mass productivity of component mounting has been demanded, and there is an increasing demand for continuous use of solder paste, in other words, realization of solder paste that can withstand long-time printing.
  • Patent Document 1 a method using a compound having a triazole structure as a stabilizer
  • Patent Document 2 a method using a polyhemiacetal ester resin
  • Patent Document 3 a method of coating the solder metal surface with an oxide film
  • Patent Document 4 a method of applying a polymer solution containing silicon to the solder metal powder
  • Patent Document 5 a soldering flux using a rosin resin as a main component and using a methacrylic ester or an acrylic ester as a solvent has been proposed.
  • a solder paste composition for circuit board soldering which does not cause cracks in the flux residue film even when used in an environment where the temperature difference is severe, it does not cause short circuit or corrosion of the circuit of the narrow pitch printed circuit board.
  • a solder paste composition for soldering a circuit board using a solder paste flux containing a resin and a rosin resin has been proposed (Patent Document 6).
  • a flux for cream solder (Patent Document 7) characterized by containing a copolymer having a rosin structure has been proposed.
  • the solderability is deteriorated because the melting of the solder metal is inhibited in the subsequent reflow process.
  • an effective measure for improving the fatigue deterioration of the solder paste due to the shear force load repeatedly applied during screen printing has not been confirmed.
  • flux and solder paste for solder paste that have moderate fluidity even when repeated shearing force is applied by a screen printing method and suppress fatigue deterioration of viscoelastic properties and various performance deteriorations associated therewith. Providing a strong response to market demands.
  • the present invention greatly contributes to the practical application of flux and solder paste that can be sufficiently applied to the mass production of electronic circuit parts, which have been remarkably advanced in recent years, by solving the above technical problems.
  • the inventors of the present invention have made extensive studies in order to obtain a solder paste flux and a solder paste that achieve good printability. As a result, it has been found that the printability can be improved by focusing on the mixing ratio of the acrylic resin and the rosin contained in the flux and the solder paste, and giving a specific environment or condition to the solder paste.
  • the present invention was created from such a viewpoint.
  • One solder paste flux of the present invention is obtained by radical copolymerization of a (meth) acrylate ester having an alkyl group of C 6 or more and C 15 or less and a (meth) acrylate ester other than the (meth) acrylate ester.
  • the obtained acrylic resin and rosins are included, and the weight ratio of the above-mentioned acrylic resin when the rosins are 1 is 0.5 or more and 1.2 or less, and the shearing force is 10 Pa or more and 150 Pa or less. Fluidize by giving
  • This flux for solder paste contributes to continuous solder paste printability improvement in mass production because fatigue deterioration of viscoelastic properties is suppressed. Moreover, since the solder paste using this flux is fluidized under a specific shear force load environment during screen printing, fatigue deterioration of its viscoelastic characteristics can be suppressed. Therefore, an excellent solder paste can be obtained in that performance degradation can be suppressed even during continuous printing over a long period of time. As a result, it is possible to obtain a flux and a solder paste that can be sufficiently applied to mass production of electronic circuit components that have made remarkable progress in miniaturization.
  • solder paste flux of the present invention and one solder paste of the present invention the printability of continuous solder paste during mass production is improved.
  • the solder paste flux of the present invention and the solder paste of the present invention can be sufficiently applied to the mass production of electronic circuit components that have made remarkable progress in miniaturization.
  • the solder paste flux of the present embodiment is a radical of a (meth) acrylic acid ester having a C 6 or more and C 15 or less alkyl group and a (meth) acrylic acid ester other than the (meth) acrylic acid ester.
  • An acrylic resin obtained by copolymerization and rosins are included.
  • the weight ratio of the acrylic resin described above when the rosin is 1 is 0.5 or more and 1.2 or less. If it is less than 0.5, the solid property as the solder paste becomes dominant, and there is a risk of fatigue deterioration.
  • solder paste flux of this embodiment is fluidized by applying a shearing force of 10 Pa to 150 Pa.
  • this acrylic resin is obtained by radical copolymerization of a (meth) acrylic acid ester having an alkyl group of C 6 or more and C 15 or less and a (meth) acrylic acid ester other than the (meth) acrylic acid ester. .
  • (meth) acrylic acid ester having an alkyl group of C 6 or more and C 15 or less are hexyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth ) Isononyl acrylate, isobornyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, myristyl (meth) acrylate, cyclohexyl (meth) acrylate, and the like.
  • (meth) acrylic acid esters other than the above (meth) acrylic acid esters are methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and (meth) acrylic acid n.
  • typical radical polymerization is a bulk polymerization method, a liquid polymerization method, a suspension polymerization method or an emulsion polymerization method using a radical polymerization initiator such as peroxide as a catalyst, but other known polymerization methods. Can also be applied.
  • the weight average molecular weight of the acrylic resin is 6000 or more and 12000 or less and the number average molecular weight is 4000 or more and 6000 or less, from the viewpoint of obtaining excellent crack resistance and excellent viscoelastic properties. It is an aspect. Moreover, it is preferable from the viewpoint of improving the crack resistance and solderability of the flux residue that the content of the acrylic resin contained in the solder paste flux of the present embodiment is 15 wt% or more and 30 wt% or less.
  • typical examples of the above-mentioned rosin are ordinary gum rosin, tall oil rosin, or wood rosin.
  • Representative examples of the derivatives include resins obtained by heat-treating rosin, disproportionated rosin, polymerized rosin, hydrogenated rosin, formylated rosin, rosin ester, rosin-modified maleic resin, rosin-modified phenolic resin, acrylic acid-added rosin, Or a rosin modified alkyd resin. These rosins and derivatives thereof can be dominant components that affect the viscoelastic properties of the flux and the solder paste using the flux as a base resin of the flux.
  • the above-mentioned rosins are at least one selected from the group consisting of acrylic acid-added rosins, disproportionated rosins, polymerized rosins, and hydrogenated rosins, combined with the specific acrylic resin described above.
  • This is another preferred embodiment from the viewpoint of controlling the viscoelastic characteristics of the flux and the solder paste using the flux, and suppressing fatigue deterioration under repeated shear load application.
  • the solder paste is used for screen printing, it is possible to provide appropriate hardness and deformability and ensure good solderability, so that the content of the rosin is 15% by weight or more. It is another preferred embodiment that it is 30% by weight or less.
  • the well-known component which can be used at the time of flux preparation other than each above-mentioned component can be added to the flux of this embodiment.
  • known activators, polyolefins, waxes, solvents and the like can be applied as additives.
  • the flux of this embodiment is obtained, for example, by radical copolymerization of a (meth) acrylic acid ester having an alkyl group of C 6 or more and C 15 or less and a (meth) acrylic acid ester other than the (meth) acrylic acid ester.
  • Acrylic resin (Arakawa Chemical Industries, Ltd .: weight average molecular weight of about 9000, acid value of 0, glass transition temperature of ⁇ 60 ° C.) and rosins (acrylic acid-added rosin, disproportionated rosin, polymerized rosin mixture: Arakawa Chemical Industry Co., Ltd.), diethylene glycol monohexyl ether (manufactured by Nippon Emulsifier Co., Ltd.), adipic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), dichlorobenzoic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), unsaturated Fatty acid dimer (manufactured by Harima Kasei Co., Ltd.), diphenylguanidine hydrobromide (manufactured by Nakao Pharmaceutical Co., Ltd.), high density polyethylene (manufactured by Mitsui Chemicals, Inc.) Ethylenebis 12-hydroxystearic acid amide (manufactured by N
  • each component described above is heated and dissolved and / or mixed at one time or sequentially, and then cooled.
  • a known apparatus such as a kneading apparatus, a vacuum stirring apparatus, a homodisper, a three-one motor, or a planetary mixer can be applied as an apparatus for dissolving or mixing the above-described components.
  • the mixing temperature of each above-mentioned component is not specifically limited. However, it is a preferable embodiment to dissolve the above-mentioned components by heating at a temperature lower than the boiling point of the solvent used for mixing. Other known flux manufacturing processes can also be applied to this embodiment.
  • solder paste of this embodiment a solder powder having a composition ratio in which tin is 96.5% by weight, silver is 3.0% by weight, and copper is 0.5% by weight.
  • each above-mentioned numerical value shows the weight ratio of each metal.
  • the solder paste of this embodiment is kneaded and blended with one or a plurality of types of solder paste fluxes of this embodiment including the preferred mode disclosed in the first embodiment and the above-described solder powder by a known means.
  • a known means such as a vacuum stirring device, a kneading device, or a planetary mixer can be applied as a device for kneading and blending the above-described components.
  • the manufacturing method of this embodiment is not specifically limited. However, the treatment is preferably performed at 5 ° C. or more and 50 ° C.
  • the manufacturing method of this embodiment is not specifically limited. However, from the viewpoint of printing workability and paste stability, it is preferable that the weight ratio of the solder powder is 80 or more and 95 or less with respect to the weight ratio of 5 or more and 20 or less.
  • solder paste of the present embodiment is an antioxidant, a matting agent, a colorant, an antifoaming agent, a dispersion stabilizer, a chelating agent, etc.
  • the composition of the solder powder used in the solder paste of the present embodiment is not particularly limited to the above-described solder powder.
  • solder powder tin (Sn), copper (Cu), zinc (Zn), silver (Ag), antimony (Sb), lead (Pb), indium (In), bismuth (Bi), nickel (Ni),
  • solder powder containing one or more selected from the group consisting of aluminum (Al), gold (Au), and germanium (Ge).
  • tin / lead alloys tin / silver alloys, tin / silver / copper alloys, tin / silver / bismuth / indium, tin / copper alloys, tin / copper / nickel, tin / zinc alloys, tin / zinc / bismuth.
  • One or two selected from the group consisting of alloys, tin / zinc / aluminum alloys, tin / zinc / bismuth / aluminum alloys, tin / zinc / bismuth / indium alloys, tin / bismuth alloys, and tin / indium alloys Solder powder containing more than a seed is another example.
  • the shape of the solder powder is preferably a perfect sphere or a substantially true sphere. Moreover, if the particle size of the solder powder is normal, it can be mixed with the flux disclosed in the first embodiment. For example, when true spherical solder powder is employed, it is preferable that solder powder having a diameter of 5 ⁇ m or more and 60 ⁇ m or less is employed in terms of achieving high precision in mounting of minute electronic components. Further, the composition ratio of the composition constituting the solder powder is not particularly limited. For example, Sn63 / Pb37, Sn96.5 / Ag3.5, Sn96 / Ag3.5 / Cu0.5, Sn96.6 / Ag2.9 / Cu0.5, Sn96.5 / Ag3.0 / Cu0.5, etc. An example of a suitable solder powder is mentioned. In addition, each above-mentioned numerical value shows the weight ratio of each metal.
  • the solder paste of this embodiment manufactured by the above-described method is very excellent in the printability of the continuous solder paste at the time of mass production.
  • mode that the elasticity modulus in the normal temperature of the solder paste of this embodiment is 1000 Pa or more and 100000 Pa or less. It is.
  • a solvent may be used as necessary.
  • the kind of solvent is not specifically limited. However, it is preferable that a solvent having a boiling point of 150 ° C. or higher is used because it is difficult to evaporate during the manufacture of the solder paste.
  • triethylene glycol monomethyl ether triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, diethylene glycol monobutyl acetate, Dipropylene glycol, diethylene glycol-2-ethylhexyl ether, ⁇ -terpineol, benzyl alcohol, 2-hexyldecanol, butyl benzoate, diethyl adipate, diethyl phthalate, dodecane, tetradecene, dodecylbenzene, ethylene glycol, diethylene glycol, dipropylene Glycol, triethylene glycol, hexylene glycol, 1,5-pentanediol, methyl carbitol, butyl carbitol.
  • a preferred example of the solvent used in the present embodiment is a polar solvent that can be easily made into a solution by dissolving components such as an activator and a resin.
  • an alcohol type is used, and particularly, diethylene glycol monoethers are excellent in volatility and solubility of the active agent.
  • the usage-amount of the solvent is not restrict
  • the solvent is 15 parts by weight or more and 40 parts by weight or less with respect to 100 parts by weight of the flux.
  • the total amount of these solvents is preferably within the above-mentioned range. Further, from the above viewpoint, it is more preferable that the solvent is 20 parts by weight or more and 35 parts by weight or less.
  • solder paste flux prepared using each component listed in Table 1, and solder powder (tin: 96.5% by weight, silver: 3.0) whose particle size distribution corresponds to Type 4 in the IPC standard
  • a solder paste was prepared by mixing 89 parts by weight of copper (0.5% by weight, copper: 0.5% by weight) with a planetary mixer.
  • the average particle diameter of the high-density polyethylene used for the preparation of the solder paste flux was about 20 ⁇ m
  • the viscosity molecular weight was about 3000
  • the melting point was 120 ° C.
  • the acid value was 0,
  • glass transition temperature was ⁇ 50 ° C.
  • the acrylic resin had a weight average molecular weight of about 9000, an acid value of 0, and a glass transition temperature of ⁇ 60 ° C.
  • Example 1 the point at which the dynamic storage elastic modulus and the dynamic loss elastic modulus measured as described above become equal is that the solid substance changes to a liquid substance when an extremely low shear stress is applied. Evaluate to be the fluidization point.
  • Example 2 solder paste (sample) of Example 1 for 4 hours. Specifically, using a polyurethane rubber squeegee (hardness 90), squeezing was continuously performed for 4 hours under the conditions of a squeegee angle of 60 °, a printing tact time of 30 seconds, and a stroke of 300 mm. Note that the amount of sample input was 500 g. The dynamic viscoelasticity measurement similar to that described above was performed on the sample after continuous rolling obtained in this manner.
  • Example 2 The solder paste of Example 2 is manufactured in the same manner as Example 1.
  • the solder paste of Example 2 is the same as Example 1 except that the composition ratio of the acrylic resin and the rosins in the solder paste flux is different from that of Example 1. Therefore, the overlapping description is omitted.
  • Example 3 The solder paste of Example 3 is manufactured in the same manner as Example 1.
  • the solder paste of Example 3 is the same as Example 1 except that the composition ratio of the acrylic resin and the rosins in the solder paste flux is different from that of Example 1. Therefore, the overlapping description is omitted.
  • Example 4 The solder paste of Example 4 is manufactured in the same manner as Example 1.
  • the solder paste of Example 4 is the same as Example 1 except that the composition ratio of acrylic resin and rosins in the solder paste flux is different from that of Example 1. Therefore, the overlapping description is omitted.
  • Comparative Example 1 The solder paste of Comparative Example 1 is manufactured in the same manner as in Example 1.
  • the solder paste of Comparative Example 1 is the same as Example 1 except that the composition ratio of the acrylic resin and the rosin of the solder paste flux is different from those of Example 1. Therefore, the overlapping description is omitted.
  • Comparative Example 2 The solder paste of Comparative Example 2 is manufactured in the same manner as in Example 1.
  • the solder paste of Comparative Example 2 is the same as Example 1 except that the composition ratio of the acrylic resin and the rosin in the solder paste flux is different from that of Example 1. Therefore, the overlapping description is omitted.
  • FIG. 2 is a graph showing the dynamic viscoelasticity measurement results of the solder paste (hereinafter also referred to as sample 1A) in Example 1.
  • Table 2 is a table that simply shows the results of measurement of the solder paste dynamic viscoelasticity of Examples 1 to 4, Comparative Example 1, and Comparative Example 2.
  • Table 3 is a table that briefly shows each performance of Examples 1 to 4, Comparative Example 1, and Comparative Example 2.
  • the dynamic storage elastic modulus when a shear stress of 9.9 Pa was applied was 4950 Pa. It was. Moreover, since the dynamic storage elastic modulus at that time is larger than the dynamic loss elastic modulus, it can be determined that the sample 1A is a solid substance. However, when a shearing stress of 59.6 Pa is applied to the sample 1A, the dynamic storage elastic modulus and the dynamic loss elastic modulus are the same value (1176 Pa), so this shear stress value is determined as the flow start point. it can.
  • the above-mentioned continuous rolling (squeezing) test was performed on the sample 1A for 4 hours.
  • the dynamic storage elastic modulus when a shear stress of 9.9 Pa was applied was 7570 Pa.
  • the dynamic storage elastic modulus at that time is larger than the dynamic loss elastic modulus, it can be determined that the sample 1B is a solid substance.
  • the dynamic storage elastic modulus and the dynamic loss elastic modulus are the same value (1228 Pa), so this shear stress value is determined as the flow start point. it can.
  • the flow start point is slightly shifted to the high shear stress side, but the shift amount (hereinafter also referred to as S value) is only 100 Pa or less. That is, it can be seen that the solder paste of Example 1 contains a flux with a very small change in viscoelastic properties, that is, fatigue suppression. Therefore, it has been clarified that the use of the solder flux of Example 1 greatly suppresses deterioration of printability and solderability of the continuous solder paste.
  • Example 1 the dynamic viscoelasticity of the solder pastes of Examples 2 to 4 was measured.
  • each of the solder pastes of Example 2 to Example 4 contains a flux having a very small amount of change in viscoelastic characteristics, that is, a fatigue deterioration-suppressed, like the solder paste of Example 1. I understood that. Therefore, even when any solder flux of Example 2 to Example 4 was used, it became clear that deterioration of printability and solderability of continuous solder paste was greatly suppressed. .
  • the solder paste of Comparative Example 1 had an S value of 100 Pa or more.
  • the solder paste of Comparative Example 1 has a large amount of change in viscoelastic properties, that is, contains a flux that causes fatigue deterioration, and therefore has poor printability and solderability of continuous solder paste during mass production.
  • the storage elastic modulus was already smaller than the loss elastic modulus in the initial state before continuous rolling, in other words, there was no S value.
  • the solder paste of Comparative Example 2 had a liquid high fluidity, and maintained high fluidity even after 4 hours of continuous rolling. Therefore, such a material having high fluidity is not preferable as a solder paste used for screen printing because the paste transferred onto the substrate cannot maintain its form.
  • high density polyethylene is contained in the flux or solder paste as a resin additive.
  • the particle size, particle size distribution, or shape of the particulate high density polyethylene satisfy at least one of the following conditions a) to d): It is. a) The average particle diameter of the longest diameter of the high density polyethylene is 0.001 ⁇ m or more and 50 ⁇ m or less.
  • the number of solder paste fluxes selected at random is 3.1 mm ⁇ 2.3 mm when observed with an optical microscope at a magnification of 100 times.
  • the number of high-density polyethylene having a longest particle diameter in the field of view of 100 ⁇ m or more is 1% or less of the total number of the high-density polyethylene.
  • the high-density polyethylene is polyhedral. Satisfaction with heating is improved by satisfying the above-mentioned conditions.
  • the probability that the high-density polyethylene in the flux or solder paste is arranged on the miniaturized electrode or the like is increased, the applicability to miniaturization of electronic circuit components and the like is further increased.
  • Many high density polyethylenes are polyhedral. It is more preferable to satisfy two or more of the above conditions a) to d) at the same time, and it is more preferable to satisfy all the conditions at the same time.
  • the viscosity molecular weight of the high-density polyethylene is 1500 or more and 4500 or less. If this viscosity molecular weight range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the melting point of the high-density polyethylene is 110 ° C. or higher and 130 ° C. or lower. If this melting point range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the acid value of the high-density polyethylene is 1 or less. If this acid value range is satisfied, it is possible to prevent a decrease in insulation reliability due to the addition of high-density polyethylene.
  • the glass transition temperature of the high-density polyethylene is ⁇ 50 ° C. or lower. If the range of this glass transition temperature is satisfied, it is possible to suppress the deterioration of the crack resistance of the flux residue, which is particularly required for pastes for in-vehicle electronic components.
  • the particle size, particle size distribution, or shape of the particulate polypropylene satisfies at least one of the following conditions a) to d). a) The average particle diameter of the longest diameter of the polypropylene is 0.001 ⁇ m or more and 50 ⁇ m or less.
  • the viscosity molecular weight of polypropylene is 5000 or more and 20000 or less. If this viscosity molecular weight range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the melting point of polypropylene is 130 ° C. or higher and 160 ° C. or lower. If this melting point range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the acid value of polypropylene is 1 or less. If this acid value range is satisfied, a decrease in insulation reliability due to the addition of polypropylene can be prevented.
  • the glass transition temperature of polypropylene is 0 ° C. or lower. If the range of this glass transition temperature is satisfied, it is possible to suppress the deterioration of the crack resistance of the flux residue, which is particularly required for pastes for in-vehicle electronic components.
  • solder paste containing the above-mentioned high-density polyethylene and / or the above-mentioned polypropylene has a melting point of 100 ° C. or higher obtained by dehydrating higher aliphatic monocarboxylic acid, polybasic acid, and diamine. It is another preferred embodiment to further include a waxy product. This waxy product can assist the action of the high density polyethylene or polypropylene described above.
  • solder paste flux and solder paste of the present invention are extremely useful for solder connection for various uses such as electronic circuit components.

Abstract

L'invention concerne une pâte à braser présentant une fluidité adéquate même après qu'une force de cisaillement a été appliquée de façon répétée à celle-ci par un procédé de sérigraphie ou similaire. Plus précisément, l'invention concerne un flux pour pâte à braser contenant : une résine acrylique obtenue par copolymérisation radicale d'un ester d'acide (méth)acrylique comprenant un group alkyle C6-C15 et d'un ester d'acide (méth)acrylique autre que l'ester d'acide (méth)acrylique susmentionné ; et une colophane. Lorsque la masse de la colophane est de 1, le rapport de masse de la résine acrylique est de 0,5 à 1,2 (inclus) et le flux pour pâte à braser est fluidisé par l'application d'une force de cisaillement de 10 à 150 Pa (inclus).
PCT/JP2010/071808 2009-12-08 2010-12-06 Flux pour pâte à braser et pâte à braser WO2011071006A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US13/513,880 US20120291921A1 (en) 2009-12-08 2010-12-06 Flux for solder paste, and solder paste
EP10835926.6A EP2511043B1 (fr) 2009-12-08 2010-12-06 Flux pour pâte à braser et pâte à braser
KR1020127016875A KR101414296B1 (ko) 2009-12-08 2010-12-06 땜납 페이스트용 플럭스 및 땜납 페이스트
CA2781958A CA2781958C (fr) 2009-12-08 2010-12-06 Flux pour pate a braser et pate a braser
CN201080055183.7A CN102770232B (zh) 2009-12-08 2010-12-06 焊膏用助焊剂及焊膏

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-278210 2009-12-08
JP2009278210A JP5486282B2 (ja) 2009-12-08 2009-12-08 はんだペースト用フラックス及びはんだペースト

Publications (1)

Publication Number Publication Date
WO2011071006A1 true WO2011071006A1 (fr) 2011-06-16

Family

ID=44145550

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/071808 WO2011071006A1 (fr) 2009-12-08 2010-12-06 Flux pour pâte à braser et pâte à braser

Country Status (9)

Country Link
US (1) US20120291921A1 (fr)
EP (1) EP2511043B1 (fr)
JP (1) JP5486282B2 (fr)
KR (1) KR101414296B1 (fr)
CN (1) CN102770232B (fr)
CA (1) CA2781958C (fr)
MY (1) MY156299A (fr)
TW (1) TWI488705B (fr)
WO (1) WO2011071006A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022270282A1 (fr) * 2021-06-25 2022-12-29 千住金属工業株式会社 Pâte à braser et procédé de production de dispositif électronique

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6196036B2 (ja) * 2012-12-26 2017-09-13 ハリマ化成株式会社 フラックスおよびはんだペースト
JP6215633B2 (ja) 2013-09-30 2017-10-18 株式会社タムラ製作所 ロジン含有量を低減させたはんだ付け用フラックスおよびはんだペースト組成物
JP6259623B2 (ja) * 2013-09-30 2018-01-10 株式会社タムラ製作所 低酸価アクリル樹脂含有はんだ付け用フラックスおよびはんだペースト組成物
EP3112080A4 (fr) * 2014-02-24 2017-11-29 Koki Company Limited Alliage de soudure sans plomb, matériau de soudure et structure assemblée
CN107052614A (zh) * 2016-11-30 2017-08-18 安徽华众焊业有限公司 无银黄铜焊料
CN106736010A (zh) * 2016-11-30 2017-05-31 安徽华众焊业有限公司 铜锌钎焊膏
JP6560283B2 (ja) * 2017-03-17 2019-08-14 株式会社タムラ製作所 フラックス組成物及びソルダペースト
EP4063061B1 (fr) 2018-01-16 2024-04-24 Senju Metal Industry Co., Ltd. Flux et pâte de soudure
EP3950983A4 (fr) * 2019-03-29 2023-04-19 Senju Metal Industry Co., Ltd. Composition de résine pour soudage, composition de soudage ainsi que soudure à noyau de flux de résine, et flux ainsi que pâte à braser
EP3834980B1 (fr) * 2019-12-10 2023-02-22 Heraeus Deutschland GmbH & Co. KG Pâte à brassage
CN111940946A (zh) * 2020-08-17 2020-11-17 惠州市源德智科技有限公司 一种快速固化的无铅锡膏及其制备方法
CN116529021B (zh) * 2020-11-18 2024-03-08 千住金属工业株式会社 助焊剂及焊膏
CN115401358B (zh) * 2022-09-13 2023-12-19 苏州优诺电子材料科技有限公司 一种光固化焊锡膏及其制备方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61199598A (ja) 1985-02-28 1986-09-04 Sony Corp はんだ付用フラツクス及びクリ−ムはんだ
JP2001150184A (ja) 1999-12-01 2001-06-05 Tamura Kaken Co Ltd リフローはんだ付用ソルダーペースト組成物及び回路基板
JP2003164992A (ja) 2001-11-29 2003-06-10 Nippon Handa Kk はんだ付け用フラックスおよびクリームはんだ
JP2004209494A (ja) 2002-12-27 2004-07-29 Mitsui Mining & Smelting Co Ltd はんだペースト用はんだ粉
JP2006088205A (ja) 2004-09-24 2006-04-06 Toshiba Corp 接合材の製造方法及びその製造方法により得られた接合材
JP2006205203A (ja) 2005-01-27 2006-08-10 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2007222932A (ja) * 2006-02-27 2007-09-06 Arakawa Chem Ind Co Ltd プリコート用鉛フリーソルダーペースト、プリコート用鉛フリーソルダーペーストに用いるフラックス
JP2008062242A (ja) * 2006-09-04 2008-03-21 Harima Chem Inc はんだ付け用フラックスおよびはんだペースト組成物
JP2008110369A (ja) * 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ
JP2008110370A (ja) * 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ
JP2008110365A (ja) 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3378139B2 (ja) * 1996-03-19 2003-02-17 株式会社デンソー はんだ付け用のフラックス
JP4485652B2 (ja) * 2000-06-07 2010-06-23 昭和電工株式会社 ハンダペースト用フラックスの製造方法
JP2002336992A (ja) * 2001-05-14 2002-11-26 Nec Corp 回路基板はんだ付用はんだ加工物及び回路基板
JP2008062253A (ja) * 2006-09-05 2008-03-21 Denso Corp はんだ付け用フラックスおよびはんだペースト組成物
CN100528462C (zh) * 2007-07-17 2009-08-19 西安理工大学 用于SnAgCu系无铅焊膏的低松香免清洗助焊剂及其制备方法
CN100479975C (zh) * 2007-07-17 2009-04-22 西安理工大学 一种用于锡铅焊膏的低松香免清洗助焊剂及其制备方法
CN101939130B (zh) * 2008-02-22 2013-05-08 播磨化成株式会社 焊接接合结构及钎焊用焊剂
CN101486095B (zh) * 2009-02-27 2012-08-15 北京工业大学 焊粉抗氧化有机包覆方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61199598A (ja) 1985-02-28 1986-09-04 Sony Corp はんだ付用フラツクス及びクリ−ムはんだ
JP2001150184A (ja) 1999-12-01 2001-06-05 Tamura Kaken Co Ltd リフローはんだ付用ソルダーペースト組成物及び回路基板
JP2003164992A (ja) 2001-11-29 2003-06-10 Nippon Handa Kk はんだ付け用フラックスおよびクリームはんだ
JP2004209494A (ja) 2002-12-27 2004-07-29 Mitsui Mining & Smelting Co Ltd はんだペースト用はんだ粉
JP2006088205A (ja) 2004-09-24 2006-04-06 Toshiba Corp 接合材の製造方法及びその製造方法により得られた接合材
JP2006205203A (ja) 2005-01-27 2006-08-10 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2007222932A (ja) * 2006-02-27 2007-09-06 Arakawa Chem Ind Co Ltd プリコート用鉛フリーソルダーペースト、プリコート用鉛フリーソルダーペーストに用いるフラックス
JP2008062242A (ja) * 2006-09-04 2008-03-21 Harima Chem Inc はんだ付け用フラックスおよびはんだペースト組成物
JP2008110369A (ja) * 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ
JP2008110370A (ja) * 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ
JP2008110365A (ja) 2006-10-30 2008-05-15 Arakawa Chem Ind Co Ltd クリームはんだ用フラックスおよびクリームはんだ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022270282A1 (fr) * 2021-06-25 2022-12-29 千住金属工業株式会社 Pâte à braser et procédé de production de dispositif électronique

Also Published As

Publication number Publication date
CN102770232A (zh) 2012-11-07
CN102770232B (zh) 2015-05-27
EP2511043A4 (fr) 2016-06-29
CA2781958C (fr) 2015-04-07
JP2011121059A (ja) 2011-06-23
CA2781958A1 (fr) 2011-06-16
TWI488705B (zh) 2015-06-21
JP5486282B2 (ja) 2014-05-07
KR101414296B1 (ko) 2014-07-02
TW201124226A (en) 2011-07-16
EP2511043A1 (fr) 2012-10-17
KR20120092683A (ko) 2012-08-21
MY156299A (en) 2016-01-29
EP2511043B1 (fr) 2018-07-11
US20120291921A1 (en) 2012-11-22

Similar Documents

Publication Publication Date Title
JP5486282B2 (ja) はんだペースト用フラックス及びはんだペースト
JP6310894B2 (ja) はんだ組成物および電子基板の製造方法
TWI517929B (zh) Solder paste
JP5238088B1 (ja) はんだ合金、ソルダペーストおよび電子回路基板
US8679263B2 (en) Solder bonding structure and soldering flux
US10099321B2 (en) Flux and solder paste
WO2012056753A1 (fr) Alliage de soudure à faible teneur en argent et composition de pâte à souder
JP2014028391A (ja) はんだ合金、ソルダペーストおよび電子回路基板
JP5856747B2 (ja) はんだ付け用フラックスおよびはんだペースト組成物
JP2012004347A (ja) はんだバンプ形成方法
US20060043157A1 (en) Flux for soldering, soldering method, and printed circuit board
JP5481753B2 (ja) フラックス組成物及びはんだペースト組成物
JP2020006402A (ja) 低残渣ソルダペースト
JP6383587B2 (ja) フラックス組成物、はんだ組成物、および電子基板の製造方法
JP2017185541A (ja) はんだペースト
JP7220694B2 (ja) フラックス組成物、およびはんだ組成物、並びに、電子基板の製造方法
JP7324024B2 (ja) フラックス及びソルダペースト
JP2024046430A (ja) フラックス組成物、はんだ組成物、および電子基板
EP4144477A1 (fr) Composition de soudure et procédé de fabrication de plaque electronique
JP2024052526A (ja) フラックス組成物、はんだ組成物、および電子基板
JP2004058104A (ja) はんだ付け用フラックス及びはんだペースト

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080055183.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10835926

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2781958

Country of ref document: CA

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1201002676

Country of ref document: TH

WWE Wipo information: entry into national phase

Ref document number: 2010835926

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20127016875

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 13513880

Country of ref document: US