WO2011071005A1 - Pâte à braser - Google Patents

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Publication number
WO2011071005A1
WO2011071005A1 PCT/JP2010/071807 JP2010071807W WO2011071005A1 WO 2011071005 A1 WO2011071005 A1 WO 2011071005A1 JP 2010071807 W JP2010071807 W JP 2010071807W WO 2011071005 A1 WO2011071005 A1 WO 2011071005A1
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WO
WIPO (PCT)
Prior art keywords
solder paste
density polyethylene
flux
less
acid
Prior art date
Application number
PCT/JP2010/071807
Other languages
English (en)
Japanese (ja)
Inventor
栄治 岩村
和志 後藤
史男 石賀
孝恭 吉岡
公孝 宇都野
充男 中村
輝雄 大河内
真佐樹 三治
拓士 助川
健志 池戸
善之 安藤
武史 白井
公章 森
理枝 和田
研介 中西
正巳 相原
聖史 隈元
Original Assignee
荒川化学工業株式会社
トヨタ自動車株式会社
株式会社デンソー
富士通テン株式会社
株式会社弘輝
ハリマ化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荒川化学工業株式会社, トヨタ自動車株式会社, 株式会社デンソー, 富士通テン株式会社, 株式会社弘輝, ハリマ化成株式会社 filed Critical 荒川化学工業株式会社
Priority to CA2781956A priority Critical patent/CA2781956C/fr
Priority to CN201080055186.0A priority patent/CN102770233B/zh
Priority to EP10835925.8A priority patent/EP2524763B1/fr
Priority to KR1020127016874A priority patent/KR101414418B1/ko
Priority to US13/514,076 priority patent/US20120291922A1/en
Publication of WO2011071005A1 publication Critical patent/WO2011071005A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention relates to a solder paste.
  • solder pastes are used for soldering electronic circuit components and the like.
  • the flux contained in the solder paste is used as a material for removing metal oxides on the solder surface and the circuit board surface and preventing reoxidation of the metal during soldering.
  • this flux also plays an important role in reducing the surface tension of the solder and achieving good soldering.
  • solder paste flux hereinafter also simply referred to as a flux.
  • a flux with poor heat dripping resistance may cause frequent solder balls in chip components. Therefore, when the solder ball falls off, the solder ball enters between the component leads whose pitch is narrowed by miniaturization of the component, so that the possibility of causing a short circuit failure is increased.
  • the above-mentioned market requirements are particularly severe for in-vehicle electronic components.
  • JP 2002-336993 A JP-A-6-7989 Japanese Unexamined Patent Publication No. 7-88675 JP-A-9-253484
  • the flux in the solder paste composition that has been used so far uses an organic acid as an activator, particularly a dibasic acid having a relatively low molecular weight (for example, having a molecular weight of 250 or less) in terms of activity.
  • an organic acid as an activator
  • dibasic acid having a relatively low molecular weight (for example, having a molecular weight of 250 or less) in terms of activity.
  • solder pastes require a higher activity than solder pastes using conventional tin-lead alloys, and therefore the above dibasic acids must be used in large amounts.
  • the organic acid metal salt generated by the reaction between the dibasic acid and the metal oxide cannot be completely dissolved in the flux residue. It will be deposited in the shape of Since the organic acid is easily dissociated by the moisture, the precipitate causes corrosion and insulation deterioration.
  • the present invention greatly contributes to the realization and practical application of a solder paste that can be sufficiently applied to electronic circuit components that have been remarkably advanced in recent years by solving the above technical problems.
  • the inventors have conducted intensive research, particularly focusing on improving the functionality of the activator and base resin contained in the solder paste flux and solder paste. went.
  • a solder paste containing an activator comprising a plurality of types of dibasic acids and one type of monobasic acid within a certain molecular weight range and a specific resin additive.
  • good solderability and also found to lead to improved resistance to heat dripping.
  • the inventors have confirmed that the solder paste takes into consideration the burden on the environment without increasing the manufacturing cost.
  • the present invention was created based on such a viewpoint and history.
  • One solder paste of the present invention includes an activator having a dibasic acid having a molecular weight of 250 or less, a monobasic acid having a molecular weight of 150 to 300, and a dibasic acid having a molecular weight of 300 to 600, a high density At least one resin additive selected from the group consisting of polyethylene and polypropylene is contained in the flux, and when the total amount of the above-mentioned flux is 100% by weight, the resin additive is 4% by weight to 12% by weight. % Or less.
  • the viscosity of the above-described solder paste at 80 ° C. is 400 Pa ⁇ S or more.
  • solder paste having the above-mentioned activator can achieve both high reliability and excellent solderability.
  • at least one selected from the group consisting of high-density polyethylene and polypropylene it contributes to increasing the viscosity of the solder paste under high-temperature (80 ° C.) conditions, so that the resistance to heat dripping can be improved. . In other words, “sag” due to heating can be suppressed.
  • the heat dripping resistance is improved. In other words, “sag” due to heating can be suppressed.
  • the solder paste flux of this embodiment includes a dibasic acid having a molecular weight of 250 or less, a monobasic acid having a molecular weight of 150 to 300, and a dibasic acid having a molecular weight of 300 to 600. Has an active agent. Further, the solder paste flux of the present embodiment also includes at least one resin additive selected from the group consisting of high-density polyethylene and polypropylene. When the total flux is 100% by weight, it is 4% by weight or more and 12% by weight or less. In addition, the viscosity of the solder paste of the present embodiment at 80 ° C. is 400 Pa ⁇ s or more.
  • the high density polyethylene in the present invention has a density of 942 kg / m 3 or more as described in JIS K6922-1: 1997.
  • medium density polyethylene has a density of less than 930 kg / m 3 or more 942kg / m 3
  • the low density polyethylene has a density of less than 910 kg / m 3 or more 930 kg / m 3.
  • the above-mentioned activator can contribute to the improvement of the heat dripping resistance, in other words, the suppression of “dripping” by heating.
  • either or both of high-density polyethylene and polypropylene contribute to increasing the viscosity of the flux and the solder paste at 80 ° C. at which softening of a general solder paste flux starts. Therefore, for example, in a process generally called reflow for soldering the substrate electrode and the electronic component by heating and melting the solder, “sagging” due to heating can be suppressed. Then, since such a solder paste can suppress generation
  • dibasic acid having a molecular weight of 250 or less a dibasic acid having a molecular weight of 90 or more is preferable.
  • dibasic acids having a molecular weight of 250 or less include malonic acid, succinic acid, glutaric acid, adipic acid, suberic acid, sebacic acid, phthalic acid, hexahydrophthalic acid, aminosuccinic acid, and diphenic acid. Can be selected.
  • monobasic acids having a molecular weight of 150 to 300 are selected from the group consisting of decanoic acid, stearic acid, oleic acid, anisic acid, benzoylbenzoic acid, dichlorobenzoic acid, dibromosalicylic acid, diphenylacetic acid, and cumic acid. Can be done.
  • dibasic acids having a molecular weight of 300 to 600 are model number SL-20 (manufactured by Okamura Oil), esterification reaction product of diethylene glycol and succinic anhydride, (meth) acrylic acid adduct of unsaturated fatty acid, And can be selected from the group of dimers of unsaturated fatty acids.
  • Examples of other active agents that can be used include hydrogen halide hydrochloric acid such as ethylamine, propylamine, diethylamine, triethylamine, diphenylguanidine, ethylenediamine, and aniline, lactic acid, or citric acid.
  • hydrogen halide hydrochloric acid such as ethylamine, propylamine, diethylamine, triethylamine, diphenylguanidine, ethylenediamine, and aniline, lactic acid, or citric acid.
  • the above-mentioned dibasic acid having a molecular weight of 250 or less, a monobasic acid having a molecular weight of 150 to 300, and a dibasic acid having a molecular weight of 300 to 600 are not particularly limited. However, with respect to 100 parts by weight of a dibasic acid having a molecular weight of 250 or less, setting the monobasic acid of a molecular weight of 150 or more and 300 or less to about 100 parts by weight or more is intended to achieve both solderability and reliability. It is preferable from the viewpoint.
  • the monobasic acid having a molecular weight of 150 to 300 is about 150 to 350 parts by weight with respect to 100 parts by weight of the dibasic acid having a molecular weight of 250 or less.
  • the dibasic acid having a molecular weight of 300 to 600 is about 80 to 400 parts by weight with respect to 100 parts by weight of the dibasic acid having a molecular weight of 250 or less.
  • the dibasic acid having a molecular weight of 300 to 600 is about 80 to 300 parts by weight with respect to 100 parts by weight of the dibasic acid having a molecular weight of 250 or less.
  • the amount of use of either high density polyethylene or polypropylene or both of them may be in the range of 4 wt% or more and 12 wt% or less when the total flux is 100 wt%.
  • either or both of the high-density polyethylene and the polypropylene are about 5 to 9 parts by weight, which makes it easy to prevent dripping and adjust the viscosity of the solder paste.
  • the particle size, particle size distribution, or shape of the particulate high-density polyethylene in the solder paste flux satisfies the following conditions a) to d). Among these, it is a preferable aspect to satisfy at least one. a) The average particle diameter of the longest diameter of the high density polyethylene is 0.001 ⁇ m or more and 50 ⁇ m or less.
  • C) is a random selection of 3.1 mm ⁇ 2.3 mm of the above solder paste flux when observed at 100 ⁇ magnification with an optical microscope.
  • the number of high-density polyethylene having a maximum particle diameter of 100 ⁇ m or more in the field of view is 1% or less of the total number of the high-density polyethylene.
  • the high-density polyethylene is polyhedral.
  • FIG. 1 is an optical micrograph of a flux constituting a part of the solder paste of this embodiment.
  • high-density polyethylene having a plurality of particle sizes included in the aforementioned range is observed in the flux.
  • the longest diameter of the high-density polyethylene is about 50 ⁇ m or less.
  • Many high density polyethylenes are polyhedral. It is more preferable to satisfy two or more of the above conditions a) to d) at the same time, and it is more preferable to satisfy all the conditions at the same time.
  • the viscosity molecular weight of the high-density polyethylene is 1500 or more and 4500 or less. If this viscosity molecular weight range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the melting point of the high-density polyethylene is 110 ° C. or higher and 130 ° C. or lower. If this melting point range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the acid value of the high-density polyethylene is 1 or less. If this acid value range is satisfied, it is possible to prevent a decrease in insulation reliability due to the addition of high-density polyethylene.
  • the glass transition temperature of the high-density polyethylene is ⁇ 50 ° C. or lower. If the range of this glass transition temperature is satisfied, it is possible to suppress the deterioration of the crack resistance of the flux residue, which is particularly required for pastes for in-vehicle electronic components.
  • the particle size, particle size distribution, or shape of the particulate polypropylene in the solder paste flux is at least one of the following conditions a) to d): It is a preferable aspect to satisfy one. a) The average particle diameter of the longest diameter of the polypropylene is 0.001 ⁇ m or more and 50 ⁇ m or less.
  • the accuracy of arranging the polypropylene in the flux on the miniaturized electrode or the like increases, so that the applicability to miniaturization of electronic circuit components and the like is further enhanced. It is more preferable to satisfy two or more of the above conditions a) to d) at the same time, and it is more preferable to satisfy all the conditions at the same time.
  • the viscosity molecular weight of polypropylene is 5000 or more and 20000 or less. If this viscosity molecular weight range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the melting point of polypropylene is 130 ° C. or higher and 160 ° C. or lower. If this melting point range is satisfied, the “sagging” suppressing action during heating is further improved.
  • the acid value of polypropylene is 1 or less. If this acid value range is satisfied, a decrease in insulation reliability due to the addition of polypropylene can be prevented.
  • the glass transition temperature of polypropylene is 0 ° C. or lower. If the range of this glass transition temperature is satisfied, it is possible to suppress the deterioration of the crack resistance of the flux residue, which is particularly required for pastes for in-vehicle electronic components.
  • solder paste containing both high-density polyethylene or polypropylene not only a solder paste containing only one of high-density polyethylene or polypropylene, but also a solder paste flux containing both of them is a preferable embodiment. If the solder paste containing both high-density polyethylene and polypropylene satisfies the above-described preferable ranges, the above-described effects can be achieved.
  • each of the above-mentioned solder pastes further includes a wax-like product obtained by dehydrating a higher aliphatic monocarboxylic acid, a polybasic acid, and a diamine having a melting point of 100 ° C. or higher.
  • This waxy product can assist the action of the high density polyethylene or polypropylene described above.
  • the activity of a dibasic acid having a molecular weight of 250 or less is enhanced. Therefore, good solderability is ensured.
  • the monobasic acid having a molecular weight of 150 to 300 and the dibasic acid having a molecular weight of 300 to 600 promote the active action.
  • the monobasic acid and dibasic acid used in combination with a dibasic acid having a molecular weight of 250 or less uniformly disperse the metal salt of the low molecular weight dibasic acid in the residue of the flux,
  • the metal salt can be encapsulated by a hydrophobic base resin such as a resin.
  • the metal salt of a low molecular weight dibasic acid is a metal salt produced at the time of soldering and having low solubility in a flux residue. Therefore, not only the decomposition and ionization of the organic acid metal salt in the residue due to moisture can be significantly suppressed, but also the ionization of the remaining organic acid can be suppressed. As a result, a flux capable of further suppressing electrical insulation failure and corrosion occurrence is obtained. In addition, a solder paste containing such a flux has good solderability and high reliability.
  • a resin typified by an acrylic resin excellent in flexibility can be applied from the viewpoint of improving the crack resistance of the residue.
  • any one or both of rosin conventionally used and derivatives thereof are additionally added.
  • the amount of either or both of rosin and its derivatives used is not particularly limited.
  • either or both of rosin and its derivative is 15 parts by weight or more and 30 parts by weight or less with respect to 100 parts by weight of the flux.
  • typical examples of the above-mentioned rosin are ordinary gum rosin, tall oil rosin, or wood rosin.
  • Representative examples of the derivatives include heat-treated resins, polymerized rosins, hydrogenated rosins, formylated rosins, rosin esters, rosin-modified maleic resins, rosin-modified phenol resins, acrylic acid-added rosins, or rosin-modified alkyd resins. is there. These rosins and their derivatives are used as binders for uniformly coating the active agent on the metal.
  • a typical example of the above-mentioned acrylic resin is a thermoplastic acrylic resin obtained by polymerizing a monomer having a polymerizable unsaturated group by radical polymerization.
  • typical examples of the monomer having a polymerizable unsaturated group include (meth) acrylic acid, various esters thereof, crotonic acid, itaconic acid, (anhydrous) maleic acid and esters thereof, (meth) acrylonitrile, (meth).
  • Acrylamide, vinyl chloride, and vinyl acetate are examples of the monomer having a polymerizable unsaturated group by radical polymerization.
  • typical examples of the monomer having a polymerizable unsaturated group include (meth) acrylic acid, various esters thereof, crotonic acid, itaconic acid, (anhydrous) maleic acid and esters thereof, (meth) acrylonitrile, (meth).
  • Acrylamide, vinyl chloride, and vinyl acetate include (meth) acrylic acid, various esters thereof
  • Typical radical polymerization is a bulk polymerization method using a peroxide or the like as a catalyst, a liquid polymerization method, a suspension polymerization method, or an emulsion polymerization method, but other known polymerization methods can be applied.
  • the weight average molecular weight of the acrylic resin is 6000 or more and 12000 or less and the number average molecular weight is 4000 or more and 6000 or less.
  • a preferred example of the solvent used in the present embodiment is a polar solvent that can be easily made into a solution by dissolving components such as an activator and a resin.
  • an alcohol type is used, and particularly, diethylene glycol monoethers are excellent in volatility and solubility of the active agent.
  • the usage-amount of the solvent is not restrict
  • the solvent is 15 parts by weight or more and 40 parts by weight or less with respect to 100 parts by weight of the flux.
  • the total amount of these solvents is preferably within the above-mentioned range. Further, from the above viewpoint, it is more preferable that the solvent is 20 parts by weight or more and 35 parts by weight or less.
  • a solvent may be used as necessary.
  • the kind of solvent is not specifically limited. However, it is preferable that a solvent having a boiling point of 150 ° C. or higher is used because it is difficult to evaporate during the manufacture of the solder paste.
  • triethylene glycol monomethyl ether triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, diethylene glycol monobutyl acetate, Dipropylene glycol, diethylene glycol-2-ethylhexyl ether, ⁇ -terpineol, benzyl alcohol, 2-hexyldecanol, butyl benzoate, diethyl adipate, diethyl phthalate, dodecane, tetradecene, dodecylbenzene, ethylene glycol, diethylene glycol, dipropylene Glycol, triethylene glycol, hexylene glycol, 1,5-pentanediol, methyl carbitol, butyl carbitol.
  • the flux of the present embodiment is obtained by dissolving or mixing the above-described components by a known method. For example, first, the above-described components are heated, dissolved and / or mixed at once or sequentially, and then cooled. Thereafter, a physical impact force is applied by a mechanical pulverization process or an impact deformation fracture process. This physical impact force may be applied to either or both of the high-density polyethylene and polypropylene before the above-described melting step.
  • the flux of this embodiment is obtained by mixing each component using the method described above.
  • a known apparatus such as a kneading apparatus, a vacuum stirring apparatus, a homodisper, a three-one motor, or a planetary mixer can be applied as an apparatus for mixing the above-described components.
  • the mixing temperature of each component described above is not particularly limited. However, it is a preferable embodiment to dissolve the above-mentioned components by heating at a temperature lower than the boiling point of the solvent used for mixing.
  • the composition of the solder powder used in the solder paste of this embodiment is not particularly limited. Specifically, tin (Sn), copper (Cu), zinc (Zn), silver (Ag), antimony (Sb), lead (Pb), indium (In), bismuth (Bi), nickel (Ni),
  • solder powder containing one or more selected from the group consisting of aluminum (Al), gold (Au), and germanium (Ge).
  • tin / lead alloys tin / silver alloys, tin / silver / copper alloys, tin / silver / bismuth / indium, tin / copper alloys, tin / copper / nickel, tin / zinc alloys, tin / zinc / bismuth.
  • One or two selected from the group consisting of alloys, tin / zinc / aluminum alloys, tin / zinc / bismuth / aluminum alloys, tin / zinc / bismuth / indium alloys, tin / bismuth alloys, and tin / indium alloys Solder powder containing more than a seed is another example.
  • the shape of the solder powder is preferably a perfect sphere or a substantially true sphere. Moreover, if the particle size of a solder powder is a normal thing, it can be mixed with the above-mentioned flux. For example, when true spherical solder powder is employed, it is preferable that solder powder having a diameter of 5 ⁇ m or more and 60 ⁇ m or less is employed in terms of achieving high precision in mounting of minute electronic components. Further, the composition ratio of the composition constituting the solder powder is not particularly limited.
  • Sn63 / Pb37, Sn96.5 / Ag3.5, Sn96 / Ag3.5 / Cu0.5, Sn96.6 / Ag2.9 / Cu0.5, Sn96.5 / Ag3.0 / Cu0.5, Sn42 / Bi58, Sn99.3 / Cu0.7, Sn91 / Zn9, Sn89 / Zn8 / Bi3, and the like are listed as examples of suitable solder powders.
  • each above-mentioned numerical value shows the weight ratio of each metal.
  • the solder paste of the present embodiment can be manufactured by kneading and mixing the above-described flux and the above-described solder powder by a known means.
  • a known device such as a vacuum stirring device, a kneading device, or a planetary mixer can be applied as a device for kneading and blending the above-described components.
  • the treatment temperature and conditions when kneading and blending are performed are not particularly limited. However, the treatment is preferably performed at 5 ° C. or more and 50 ° C. or less from the viewpoint of absorption of moisture from the external environment, oxidation of solder metal particles, thermal degradation of the flux due to temperature rise, and the like.
  • the weight ratio between the flux and the solder powder is not particularly limited. However, from the viewpoint of printing workability and paste stability, it is preferable that the weight ratio of the solder powder is 80 or more and 95 or less with respect to the weight ratio of 5 or more and 20 or less.
  • solder paste of the present embodiment is an antioxidant, a matting agent, a colorant, an antifoaming agent, a dispersion stabilizer, a chelating agent, etc.
  • the viscosity molecular weight of polyethylene or polypropylene in the present application is a viscosity molecular weight Mv measured by a viscosity method using an Ubbelohde improved viscometer.
  • the specific measurement of viscosity molecular weight is as follows.
  • decalin is added to the measurement sample and dissolved by shaking at 140 ° C. for 30 minutes.
  • the intrinsic viscosity ([ ⁇ ]) is obtained by measuring the number of seconds flowing down at 135 ⁇ 0.2 ° C. of this heated and dissolved sample solution with a viscometer. Then, for each of polyethylene and polypropylene, the viscosity molecular weight is calculated by substituting [ ⁇ ] into the following formula.
  • Examples 1 and 2 and Comparative Example 1 In Examples 1 and 2 and Comparative Example 1, a solder paste containing high-density polyethylene is manufactured by the manufacturing method disclosed in the above-described embodiment. Table 1 shows the compositions of the solder pastes of Examples 1 and 2 and Comparative Example 1 and their composition ratios. Here, the average particle diameter of the longest diameter of the high-density polyethylene used in the solder pastes of Examples 1 and 2 and Comparative Example 1 is about 35 ⁇ m, and their viscosity molecular weight is about 2000. Have a melting point of 120 ° C., an acid value of 0, a glass transition temperature of ⁇ 120 ° C. and a density of 970 kg / m 3 . FIG. 2 is a graph showing the particle size distribution of the high-density polyethylene used in Examples 1 and 2 and Comparative Example 1.
  • the weight average molecular weight is about 9000 and the number average molecular weight is 5000.
  • the acid value is 0 and the glass transition temperature is ⁇ 60 ° C.
  • the softening point is 140 degreeC and the acid value is 145.
  • silver is 3.0 weight% with respect to 96.5 weight% of tin, and copper is 0.5 weight%.
  • the particle size distribution of the solder powder of Example 1 is not less than 25 ⁇ m and not more than 38 ⁇ m.
  • description about a solder powder may be abbreviate
  • Examples 3 and 4 The solder pastes of Examples 3 and 4 are manufactured in the same manner as Example 1.
  • Table 1 also shows the compositions and composition ratios of the solder pastes of Examples 3 and 4.
  • the average particle diameter of the longest diameter of the high-density polyethylene used in the solder paste of Example 3 is about 5 ⁇ m
  • the average particle diameter of the longest diameter of the high-density polyethylene used in the solder paste of Example 4 is about 5 ⁇ m. Is about 45 ⁇ m.
  • the physical property values of the high-density polyethylene are all the same as those in Example 1 except for the average particle diameter of the longest diameter. Therefore, the overlapping description is omitted.
  • Example 5 The solder paste of Example 5 is manufactured in the same manner as Example 1. Table 1 also shows the composition and composition ratio of the solder paste of Example 5.
  • the high-density polyethylene used in the solder paste of Example 5 has a viscosity molecular weight of about 4000, a melting point of 130 ° C., a glass transition temperature of ⁇ 100 ° C., and a density of 980 kg / m 3. It is.
  • the physical property values of high-density polyethylene are all the same as those of Example 1 except for the viscosity molecular weight, melting point, glass transition temperature, and density. Therefore, the overlapping description is omitted.
  • Example 6 The solder paste of Example 6 is also manufactured in the same manner as Example 1. Table 1 also shows the composition and composition ratio of the solder paste of Example 6. In addition to the composition of Example 5, the solder paste of Example 6 contains 0.1% by weight of a waxy product (trade name: Light Amide WH-255, manufactured by Kyoeisha Chemical Co., Ltd.). Further, the physical property values of the high density polyethylene are all the same as those of Example 5. Therefore, the overlapping description is omitted.
  • a waxy product trade name: Light Amide WH-255, manufactured by Kyoeisha Chemical Co., Ltd.
  • solder pastes of Comparative Examples 2 and 3 are manufactured in the same manner as in Example 1.
  • Table 1 also shows the compositions and composition ratios of the solder pastes of Comparative Examples 2 and 3.
  • the average particle diameter of the longest diameter of the low density polyethylene used in the solder paste of Comparative Example 2 is about 40 ⁇ m
  • the viscosity molecular weight is about 2500
  • the melting point is 105 ° C.
  • the acid value is 0, and its glass transition temperature is ⁇ 110 ° C.
  • the average particle diameter of the longest diameter of the low density polyethylene used in the solder paste of Comparative Example 3 is about 38 ⁇ m, its viscosity molecular weight is about 4500, its melting point is 105 ° C., and its acid value is 0, and its glass transition temperature is ⁇ 100 ° C.
  • the density of both the low density polyethylene A of Comparative Example 2 and the low density polyethylene B of Comparative Example 3 is 920 kg / m 3 .
  • Examples 7 and 8 and Comparative Examples 4 to 6 In Examples 7 and 8, a solder paste containing polypropylene A is manufactured by the manufacturing method disclosed in the above-described embodiment. Table 2 shows the compositions of the solder pastes of Examples 7 and 8 and their composition ratios. As comparative examples, the compositions of Comparative Examples 4 to 6 and their composition ratios are shown in Table 2. The solder pastes of Comparative Examples 4 to 6 are also manufactured by the manufacturing method disclosed in the above embodiment.
  • the average particle diameter of the longest diameter of polypropylene A used in the solder paste of Examples 7 and 8 is about 30 ⁇ m, their viscosity molecular weight is about 10,000, and their melting point is 145 ° C., Their acid number is 0 and their glass transition temperature is about ⁇ 20 ° C.
  • the solder paste of Comparative Example 4 hardened castor oil is mixed instead of polypropylene A and B.
  • the solder paste of Comparative Example 5 has an average particle diameter of the longest diameter of about 33 ⁇ m, a viscosity molecular weight of about 2700, and a melting point of 110 ° C.
  • the solder paste of Comparative Example 6 does not contain polypropylene A and B, but contains 0.9% by weight of hexamethylenebis12hydroxystearic acid amide.
  • the weight average molecular weight is about 9000, and the number average molecular weight is 5000.
  • the acid value is 3, and the glass transition temperature is ⁇ 55 ° C.
  • the hydrogenated rosin contained in the solder pastes of Examples 7 to 13 has a softening point of 81 ° C. and an acid value of 165.
  • the solder powder of Example 7 is the same as the solder powder of Example 1.
  • or Comparative Example 6 are also the same as that of this Example 11, description about solder powder is abbreviate
  • Example 9 and 10 The solder pastes of Examples 9 and 10 are manufactured in the same manner as Example 7. Table 2 also shows the composition and composition ratio of the solder pastes of Examples 9 and 10.
  • the average particle diameter of the longest diameter of the polypropylene A used in the solder paste of Example 9 is about 8 ⁇ m
  • the average particle diameter of the longest diameter of the polypropylene A used in the solder paste of Example 10 is about 8 ⁇ m. 42 ⁇ m.
  • the physical property values of polypropylene are all the same as those of Example 7 except for the average particle diameter of the longest diameter. Therefore, the overlapping description is omitted.
  • Example 11 The solder paste of Example 11 is manufactured in the same manner as Example 7. Table 2 also shows the composition and composition ratio of the solder paste of Example 11.
  • the average particle diameter of the longest diameter of polypropylene B used in the solder paste of Example 11 is about 20 ⁇ m, its viscosity molecular weight is about 19000, its melting point is 147 ° C., and its acid value is 0. And its glass transition temperature is ⁇ 25 ° C.
  • Example 12 The solder paste of Example 12 is manufactured in the same manner as Example 7. Table 2 also shows the composition and composition ratio of the solder paste of Example 12. In addition to the composition of Example 11, the solder paste of Example 12 contains 0.1% by weight of a waxy product (trade name: Light Amide WH-255, manufactured by Kyoeisha Chemical Co., Ltd.). All the physical properties of polypropylene B are the same as those of Example 11. Therefore, the overlapping description can be omitted.
  • a waxy product trade name: Light Amide WH-255, manufactured by Kyoeisha Chemical Co., Ltd.
  • Example 13 The solder paste of Example 13 is manufactured in the same manner as Example 7. Table 2 also shows the composition and composition ratio of the solder paste of Example 13. The solder paste of Example 13 contains 0.4% by weight of the high-density polyethylene A used in Example 1 and the polypropylene A used in Example 7.
  • solder pastes of Examples 1 to 13 were all resistant to each other as shown in Table 3. It was confirmed that it contributes to the improvement of heat dripping.
  • the solder pastes of Examples 1 to 13 all had a viscosity at 80 ° C. of 400 Pa ⁇ s or higher. Since the solder paste at the time of heating has a high viscosity, good results were also obtained in a heating droop test using the solder paste after 4 hours of continuous printing. Furthermore, the solder pastes of Examples 1 to 13 described above maintained a high insulation resistance value. In Table 3, the unit of “heating droop” is mm, and the unit of “insulation resistance” value is ⁇ .
  • the viscosity of the solder paste at 80 ° C. in Comparative Example 1, Comparative Example 4, and Comparative Example 6 was 400 Pa ⁇ s or less, and it was confirmed that heating was inferior to each of the above-described Examples. .
  • the viscosity of the solder paste in 80 degreeC of the comparative example 2, the comparative example 3, and the comparative example 5 was 400 Pa.s or more, those insulation is inferior compared with the insulation of each above-mentioned Example. It was confirmed.
  • the measurement of the solder paste viscosity in this application was measured using the viscoelasticity measuring apparatus. Specifically, it is as follows. (1) A solder paste as a sample is sandwiched between a sample stage of a measuring device and a stainless steel parallel plate having a diameter of 25 mm of a measuring jig. (2) A gap between the sample stage and the parallel plate is set to 1.0 mm. (3) Frequency Strain is applied under conditions of 5 Hz and a swing angle of 0.1%, and the viscosity at 80 ° C. is measured.
  • solder paste of the present invention is extremely useful for solder connection for various uses such as electronic circuit components.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une pâte à braser qui comprend, au sein d'un flux, un activateur comportant : un acide dibasique dont le poids moléculaire ne dépasse pas 250, un monoacide dont le poids moléculaire se situe entre 150 et 300, et un acide dibasique dont le poids moléculaire se situe entre 300 et 600; et au moins un additif de résine choisi dans le groupe constitué des polyéthylènes haute densité et des polypropylènes. La pâte à braser comprend entre 4% et 12% en masse d'additif de résine au sein du flux, et la viscosité de la pâte à braser à 80°C est d'au moins 400 Pa·s.
PCT/JP2010/071807 2009-12-08 2010-12-06 Pâte à braser WO2011071005A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CA2781956A CA2781956C (fr) 2009-12-08 2010-12-06 Pate a braser
CN201080055186.0A CN102770233B (zh) 2009-12-08 2010-12-06 焊膏
EP10835925.8A EP2524763B1 (fr) 2009-12-08 2010-12-06 Pâte à braser
KR1020127016874A KR101414418B1 (ko) 2009-12-08 2010-12-06 땜납 페이스트
US13/514,076 US20120291922A1 (en) 2009-12-08 2010-12-06 Solder paste

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JP2009278209A JP5486281B2 (ja) 2009-12-08 2009-12-08 はんだペースト
JP2009-278209 2009-12-08

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CN (1) CN102770233B (fr)
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WO2020203794A1 (fr) * 2019-03-29 2020-10-08 千住金属工業株式会社 Composition de résine pour soudage, composition de soudage ainsi que soudure à noyau de flux de résine, et flux ainsi que pâte à braser

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JP5766668B2 (ja) * 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
JP6138464B2 (ja) * 2012-11-22 2017-05-31 株式会社タムラ製作所 レーザーはんだ付け用はんだ組成物およびそれを用いた実装方法
JP6401912B2 (ja) * 2014-01-31 2018-10-10 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板の製造方法
EP3112080A4 (fr) * 2014-02-24 2017-11-29 Koki Company Limited Alliage de soudure sans plomb, matériau de soudure et structure assemblée
JP2015208779A (ja) * 2014-04-30 2015-11-24 住友金属鉱山株式会社 はんだ用フラックスおよびはんだペースト
JP6913064B2 (ja) * 2018-09-13 2021-08-04 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
JP6851352B2 (ja) * 2018-09-20 2021-03-31 株式会社タムラ製作所 レーザーはんだ付け用はんだ組成物および電子基板
JP7331579B2 (ja) * 2018-09-28 2023-08-23 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト
JP6609073B1 (ja) * 2019-01-15 2019-11-20 株式会社日本マイクロニクス プローブ基板及び電気的接続装置
JP6638841B1 (ja) * 2019-03-29 2020-01-29 千住金属工業株式会社 フラックス及びソルダペースト
CN110303273A (zh) * 2019-06-26 2019-10-08 浙江强力控股有限公司 用于散热模组的无卤低温环保焊锡膏及其制备方法
HUE061641T2 (hu) * 2019-12-10 2023-07-28 Heraeus Deutschland Gmbh & Co Kg Forrasztópaszta
CN112872521B (zh) * 2021-01-08 2023-03-28 广西贺州和展电子有限公司 一种数据线接口焊接工艺及其制备方法

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JP2011121058A (ja) 2011-06-23
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MY158763A (en) 2016-11-15
CA2781956A1 (fr) 2011-06-16
CN102770233A (zh) 2012-11-07
TW201124225A (en) 2011-07-16
JP5486281B2 (ja) 2014-05-07
EP2524763A4 (fr) 2016-10-05
KR20120088875A (ko) 2012-08-08
CN102770233B (zh) 2015-03-11
EP2524763B1 (fr) 2018-12-05
CA2781956C (fr) 2014-02-11
US20120291922A1 (en) 2012-11-22
EP2524763A1 (fr) 2012-11-21

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