Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
  • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
  • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
  • H01L29/76—Unipolar devices, e.g. field effect transistors
  • H01L29/772—Field effect transistors
  • H01L29/78—Field effect transistors with field effect produced by an insulated gate
  • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
  • H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
  • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
  • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
  • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
  • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
  • H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
  • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
  • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
  • H01L29/76—Unipolar devices, e.g. field effect transistors
  • H01L29/772—Field effect transistors
  • H01L29/78—Field effect transistors with field effect produced by an insulated gate
  • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
  • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device

Definitions

• the present invention relates to a field effect transistor including an oxide semiconductor.
• an oxide semiconductor has attracted attention as a novel semiconductor material having high mobility, which is an advantage of poiysilicon, and a uniform element characteristic, which is an advantage of amorphous silicon.
• Patent Document 1 a field effect transistor which includes, as an oxide semiconductor, an oxide including indium (In), zinc (Zn), and gallium (Ga) (a material having an In-Ga-Zn-O composition) has been proposed.
• Patent Document 1 Japanese Published Patent Application No. 2006-173580
• a material having an In-Ga-Zn-0 composition includes an expensive raw material and thus has a problem of high cost.
• An oxide including indium (In), silicon (Si), and zinc (Zn) (a material having an In-Si-Zn-O composition) is used as an oxide semiconductor material.
• the content of Si in the oxide semiconductor film is greater than or equal to 4 mol% and less than or equal to 8 mol%.
• An embodiment of the present invention is a field effect transistor including a gate electrode, a gate insulating film, an oxide semiconductor film, a source electrode, and a drain electrode.
• the oxide semiconductor film is an oxide including indium, silicon, and zinc, and the content of silicon in the oxide semiconductor film is greater than or equal to 4 mol% and less than or equal to 8 mol%.
• FIG. 1 is a cross-sectional schematic view of a field effect transistor including an oxide semiconductor
• FIG. 2 is a graph showing results of comparison between the Si content in an
• FIG. 3 is a graph showing results of measuring an In-Si-Zn-O film by an X-ray diffraction (XRD) analysis method
• FIG. 4 is a graph showing dependence of Hall effect mobility of an In-Si-Zn-O film on the Si content in the film;
• FIG. 7 is a graph showing initial characteristics of a field effect transistor ([1]
• FIG. 16 is a graph showing initial characteristics of a field effect transistor ([4]
• FIGS. 25A to 25D illustrate a manufacturing process of the field effect transistor illustrated in FIG. 1 ;
• FIGS. 26A to 26D illustrate the manufacturing process of the field effect transistor illustrated in FIG. 1.
• FIG. 1 is a cross-sectional schematic view of a field effect transistor including an oxide semiconductor.
• the field effect transistor includes a substrate 10, a base insulating film 20, a gate electrode 30, a gate insulating film 40, an oxide semiconductor film 50, and a metal film 60.
• the oxide semiconductor film 50 is an In-Si-Zn-0 film.
• the field effect transistor illustrated in FIG 1 has a channel-etched bottom-gate structure. Note that the structure of the field effect transistor is not limited thereto, and can be a desired top-gate or bottom-gate structure.
• a glass substrate is used as the substrate 10.
• a glass substrate whose strain point is 730 °C or higher is preferably used.
• a glass substrate which includes more barium oxide (BaO) than boron oxide (B 2 C>3) is preferably used.
• a substrate formed using an insulator such as a ceramic substrate, a quartz glass substrate, a quartz substrate, or a sapphire substrate may also be used as the substrate 10 instead of the glass substrate.
• a crystallized glass substrate or the like can be used as the substrate 10.
• the base insulating film 20 has a function of preventing diffusion of an impurity element from the substrate 10.
• the base insulating film 20 can be formed using one or more films selected from a silicon oxide film, a silicon nitride film, a silicon oxynitride film, and a silicon nitride oxide film.
• the base insulating film 20 does not need to be provided. That is, the gate electrode 30 may be formed over the substrate 10 having an insulating surface.
• a metal conductive film can be used as the gate electrode 30.
• a material of the metal conductive film an element selected from aluminum (Al), chromium (Cr), copper (Cu), tantalum (Ta), titanium (Ti), molybdenum (Mo), and tungsten (W); an alloy including any of these elements as a component; or the like can be used.
• a three-layer structure of a titanium film, an aluminum film, and a titanium film; a three-layer structure of a molybdenum film, an aluminum film, and a molybdenum film; or the like can be employed.
• the metal conductive film is not limited to a three-layer structure, and may have a single-layer structure, a two-layer structure, or a stacked structure of four or more layers.
• the gate insulating film 40 is in contact with the oxide semiconductor film 50 and thus is preferably a dense film with high withstand voltage. Therefore, it is particularly preferable that the gate insulating film 40 be formed by a high-density plasma CVD method using a microwave (2.45 GHz). This is for reduction of plasma damage in the formation of the gate insulating film 40. As a result, defects generated in the gate insulating film 40 can be reduced, and the condition of an interface with the oxide semiconductor film 50 formed later can be favorable.
• a dangling bond generated when a bond between an impurity and a main component of the oxide semiconductor is cut causes a shift in threshold voltage in a bias-temperature (BT) test, which is a typical test for evaluating reliability of a field effect transistor.
• BT bias-temperature
• the gate insulating film 40 include impurities such as moisture and hydrogen as little as possible.
• the gate insulating film 40 can be formed using a film of silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, aluminum oxide, aluminum nitride, aluminum oxynitride, aluminum nitride oxide, hafnium oxide, or the like.
• the oxide semiconductor film 50 is the In-Si-Zn-0 film as described above, and the Si content in the film is greater than or equal to 4 mol% and less than or equal to 8 mol%.
• Impurities such as hydrogen, moisture, a hydroxyl group, and hydroxide also referred to as a hydrogen compound
• oxygen which is simultaneously reduced in the step of removing these impurities is supplied to the oxide semiconductor film 50.
• the oxide semiconductor film 50 is purified and becomes electrically i-type (intrinsic). The purpose of this treatment is to suppress fluctuation in electric characteristics of the field effect transistor.
• the concentration of hydrogen included in the oxide semiconductor film 50 is preferably 5 x 10 19 atoms/cm 3 or lower, more preferably 5 x 10 18 atoms/cm 3 or lower, still more preferably 5 x 10 17 atoms/cm 3 or lower, further more preferably lower than 5 x 10 16 atoms/cm 3 .
• the concentration of hydrogen can be measured by secondary ion mass spectrometry (SIMS).
• the density of minority carriers is low and the minority carriers are less likely to be induced.
• tunnel current is difficult to be generated; consequently, off-state current is difficult to flow.
• the field effect transistor including the oxide semiconductor film 50 has resistance to hot carrier deterioration. This is because hot carrier deterioration is mainly caused by increase in the number of carriers due to avalanche breakdown and by injection of the carriers accelerated to high speed to the gate insulating film.
• the metal film 60 is used as a source electrode or a drain electrode.
• a metal material such as aluminum (Al), chromium (Cr), copper (Cu), tantalum (Ta), titanium (Ti), molybdenum (Mo), or tungsten (W); or an alloy material including any of these metal materials as a component can be used.
• the metal film 60 may have a structure in which a film of refractory metal such as chromium (Cr), tantalum (Ta), titanium (Ti), molybdenum (Mo), or tungsten (W) is stacked on one side or both sides of a metal film of aluminum (Al), copper (Cu), or the like.
• an aluminum material to which an element that prevents generation of hillocks or whiskers in an aluminum film such as silicon (Si), titanium (Ti), tantalum (Ta), tungsten (W), molybdenum (Mo), chromium (Cr), neodymium (Nd), scandium (Sc), or yttrium (Y), is added is used, whereby the metal film 60 with high heat resistance can be obtained.
• FIG. 1 A manufacturing process of a field effect transistor having the structure illustrated in FIG. 1 will be described with reference to FIGS. 25A to 25D and FIGS. 26A to 26D.
• the base insulating film 20 is formed over the substrate 10.
• a conductive film 35 is formed over the base insulating film 20.
• the gate electrode 30 is formed in a first photolithography process.
• the gate insulating film 40 is formed over the gate electrode 30.
• an oxide semiconductor film 55 is formed over the gate insulating film 40.
• the oxide semiconductor film 55 is etched so that the oxide semiconductor film 50 is formed.
• a metal film 65 is formed over the oxide semiconductor film 50.
• the metal film 65 is etched so that the metal film 60 is formed.
• the field effect transistor illustrated in FIG. 1 is obtained through the above steps.
• a resist mask used in the first photolithography process may be formed by an inkjet method.
• the resist mask is formed by an inkjet method, a photomask is not used; therefore, manufacturing cost can be reduced.
• the gate insulating film 40 is formed by a sputtering method, for example. It is preferable that, as pretreatment performed before the film formation, the substrate 10 provided with the gate electrode 30 be preheated in a preheating chamber of a sputtering apparatus so that impurities such as hydrogen and moisture adsorbed to the substrate 10 may be removed and eliminated.
• the purpose of this preheating is to prevent the impurities such as hydrogen and moisture from being included in the gate insulating film 40 and the oxide semiconductor film 50 which are formed later as much as possible
• the substrate 10 over which films up to the gate insulating film 40 are formed may be preheated.
• the appropriate temperature of the preheating is higher than or equal to 100 °C and lower than or equal to 400 °C.
• a temperature of higher than or equal to 150 °C and lower than or equal to 300 °C is more preferable.
• a cryopump is preferably used as an evacuation unit in the preheating chamber.
• the oxide semiconductor film 55 is formed by a sputtering method.
• the substrate 10 Before the oxide semiconductor film 55 is formed, the substrate 10 is held in a treatment chamber in a reduced pressure state, and the substrate 10 is heated to a temperature of higher than or equal to room temperature and lower than 400 °C. Then, while a sputtering gas from which hydrogen and moisture are removed is introduced in the state where moisture remaining in the treatment chamber is removed, voltage is applied between the substrate 10 and a target, so that the oxide semiconductor film 55 is formed over the substrate 10.
• an entrapment vacuum pump is used as the evacuation unit for removing moisture remaining in the treatment chamber.
• a cryopump, an ion pump, and a titanium sublimation pump can be given.
• a turbo pump provided with a cold trap can be used as the evacuation unit.
• a compound including a hydrogen atom such as water (H 2 0), or the like (more preferably, also a compound including a carbon atom) is eliminated; thus, the concentration of impurities included in the oxide semiconductor film 55 which is formed in the treatment chamber can be reduced.
• the temperature of the substrate 10 at the time of forming the oxide semiconductor film 55 can be set higher than or equal to room temperature and lower than 400 °C.
• the reverse sputtering refers to a method in which a substrate surface is cleaned with reactive plasma generated by voltage application to the substrate side using an RF power source without voltage application to a target side. Note that the reverse sputtering is performed in an argon atmosphere. Alternatively, nitrogen, helium, oxygen, or the like may be used instead of argon.
• heat treatment for dehydration or dehydrogenation of the oxide semiconductor film 50 is performed. It is appropriate that the heat treatment for dehydration or dehydrogenation is performed at a temperature of higher than or equal to 350 °C and lower than or equal to 750 °C.
• the heat treatment for dehydration or dehydrogenation is performed in a nitrogen atmosphere by putting the substrate 10 provided with the oxide semiconductor film 50 in an electric furnace which is a kind of heat treatment apparatus.
• a high-purity oxygen gas, a high-purity dinitrogen monoxide (N 2 0) gas, or ultra-dry air (a gas in which nitrogen and oxygen are mixed at a ratio of 4: 1 and which has a dew point of -40 °C or lower, preferably -60 °C or lower) is introduced into the same furnace and cooling is performed.
• a high-purity oxygen gas, a high-purity dinitrogen monoxide (N 2 0) gas, or ultra-dry air a gas in which nitrogen and oxygen are mixed at a ratio of 4: 1 and which has a dew point of -40 °C or lower, preferably -60 °C or lower
• water, hydrogen, and the like be not included in the oxygen gas or the N 2 0 gas.
• the purity of an oxygen gas or an N 2 0 gas is 6N (99.9999 %) or higher, preferably 7N (99.99999 %) or higher (i.e., the concentration of impurities in the oxygen gas or the N 2 0 gas is 1 ppm or lower, more preferably 0.1 ppm or lower).
• the heat treatment apparatus is not limited to the electric furnace; for example, a rapid thermal anneal (RTA) apparatus such as a gas rapid thermal anneal (GRTA) apparatus or a lamp rapid thermal anneal (LRTA) apparatus can be used.
• RTA rapid thermal anneal
• GRTA gas rapid thermal anneal
• LRTA lamp rapid thermal anneal
• heat treatment for dehydration or dehydrogenation may be performed after the formation step of the oxide semiconductor film illustrated in FIG 26 A.
• In-Si-Zn-O films Four kinds of In-Si-Zn-O films were formed using targets having different compositions, and characteristics of the In-Si-Zn-O films were compared.
• the compositions of the targets are the following [1 ] to [4]:
• FIG 2 is a graph showing results of comparison between the Si content in an In-Si-Zn-O target and the Si content in an In-Si-Zn-O film.
• the horizontal axis represents the Si content (mol%) in the target
• the vertical axis represents the Si content (mol%) in the film. This graph shows that the Si content in the target is substantially equal to the Si content in the film.
• the Si content in the target shown in the graph of FIG. 2 was obtained by calculation.
• the Si content in the film was measured by Rutherford backscattering spectrometry (RBS).
• FIG. 3 is a graph showing results of measuring an In-Si-Zn-O film by an X-ray diffraction (XRD) analysis method.
• the horizontal axis represents the irradiation angle of an X ray
• the vertical axis represents the intensity of a peak.
• This graph shows that as the Si content in the film is increased, the intensity of a broad peak at 30 deg. to 35 deg. due to In-Zn-O is weakened.
• FIG. 4 is a graph showing dependence of Hall effect mobility of an In-Si-Zn-O film on the Si content in the film.
• the horizontal axis represents the Si content in the film
• the left vertical axis represents the Hall effect mobility
• the right vertical axis represents the carrier density.
• This graph shows that as the Si content in the film is increased, the Hall effect mobility (indicated by a circle in the graph) and the carrier density (indicated by a cross in the graph) are decreased.
• the graph of FIG. 4 shows the following results: when the Si content is 4 mol%, the carrier density is lower than or equal to 1 x 10 20 /cm 3 ; similarly, when the Si content is 4 moI%, the Hall effect mobility is lower than or equal to 20 cm 2 /Vs.
• a sample used in the measurement for obtaining the results shown in the graphs of FIG. 3 and FIG. 4 is a 150-nm-thick In-Si-Zn-O film which has been subjected to heat treatment at 450 °C for 1 hour in an N 2 atmosphere.
• FIG. 5, FIG. 6, FIG. 7, FIG 8, FIG. 9, FIG. 10, FIG. 1 1 , FIG. 12, FIG. 13, FIG. 14, FIG. 1 5, and FIG. 16 are graphs showing h-V g characteristics [ ⁇ og(h)-V % ] of the field effect transistor illustrated in FIG. 1.
• the horizontal axis represents the level of gate voltage V g [V]
• the left vertical axis represents the amount of drain current h [A] (indicated by a solid line in the graphs)
• the right vertical axis represents the field effect mobility ⁇ [cm 2 /Vs] (indicated by a dashed line in the graphs).
• the h- V g characteristics were measured under the condition that the level of drain voltage [V] was 1 V or 10 V and a gate voltage V g [V] of -30 V to 30 V was applied.
• SiON film was used as the gate insulating film 40 and a 100-nm-thick Ti film was used as the metal film 60.
• the thickness of the oxide semiconductor film 50 was 20 nm
• the channel length L was 10 ⁇
• the channel width W was 50 ⁇ .
• the field effect transistor of FIG. 5 was subjected to heat treatment at 350 °C for 1 hour in an N 2 atmosphere.
• the field effect transistor of FIG 6 was subjected to heat treatment at 450 °C for 1 hour in an N 2 atmosphere.
• FIG 5 and FIG. 6 show that the off-state current of each of these field effect transistors is 1 x 1 CT 13 A or less, the on-state current thereof is 1 x 10 ⁇ 5 A or more, and the on/off ratio thereof is 10 8 or more; thus, excellent switching characteristics are obtained. Further, the field effect mobility ⁇ reaches 45 cmVVs.
• FIG. 7 shows that the field effect transistor does not have a sufficient on/off ratio. Further, the field effect transistor is normally on.
• the field effect transistor of FIG. 8 was subjected to heat treatment at 350 °C for 1 hour in an N 2 atmosphere.
• the field effect transistor of FIG. 9 was subjected to heat treatment at 450 °C for 1 hour in an N 2 atmosphere.
• FIG 8 and FIG. 9 show that the off-state current of each of these field effect transistors is 1 x l O -13 A or less, the on-state current thereof is 1 x l O -5 A or more, and the on/off ratio thereof is 10 or more; thus, excellent switching characteristics are obtained. Further, the field effect mobility ⁇ reaches 22 cm /Vs.
• FIG. 10 shows that the field effect transistor does not have a sufficient on/off ratio. Further, the field effect transistor is normally on.
• the field effect transistor of FIG. 1 1 was subjected to heat treatment at 350 °C for 1 hour in an N 2 atmosphere.
• the field effect transistor of FIG. 12 was subjected to heat treatment at 450 °C for 1 hour in an N 2 atmosphere.
• FIG. 1 1 , FIG. 12, and FIG. 13 show that the off-state current of each of these field effect transistors is 1 x 10 ⁇ 13 A or less, the on-state current thereof is 1 ⁇ 10 ⁇ 5 A or more, and the on/off ratio thereof is 10 8 or more; thus, excellent switching characteristics are obtained. Further, the field effect mobility ⁇ reaches 10 cm 2 /Vs.
• the field effect transistor of FIG. 14 was subjected to heat treatment at 350 °C for 1 hour in an N 2 atmosphere.
• the field effect transistor of FIG. 15 was subjected to heat treatment at 450 °C for 1 hour in an N 2 atmosphere.
• FIG. 14, FIG. 15, and FIG. 16 show that the off-state current of each of these field effect transistors is 1 ⁇ 10 -13 A or less, the on-state current thereof is 1 x 10 -6 A or more, and the on/off ratio thereof is 10 7 or more; thus, excellent switching characteristics are obtained.
• the field effect mobility ⁇ is very low.
• FIG. 17, FIG. 18, FIG. 19, FIG. 20, FIG. 21 , FIG. 22, FIG. 23, and FIG. 24 are graphs showing results of bias-temperature (BT) tests performed on the transistor illustrated in FIG. 1.
• the horizontal axis represents the level of gate voltage V % [V]
• the left vertical axis represents the amount of drain current Id [A] (in the graphs, a heavy solid line shows results before the test and a heavy dashed line shows results after the test)
• the right vertical axis represents the field effect mobility ⁇ [cm 2 /Vs] (in the graphs, a solid line shows results before the test and a dashed line shows results after the test).
• the field effect transistor used for the measurement was manufactured in the following manner.
• a 100-nm-thick Ti film was formed as the metal film 60, and then heat treatment was performed at 250 °C for 1 hour in an N 2 atmosphere.
• the channel length L of the field effect transistor was 20 ⁇ and the channel width W thereof was 20 ⁇ .
• the BT tests was performed under the condition that a gate voltage of 20 V (+BT) or a gate voltage of -20 V (-BT) was applied at 150 °C for 1 hour. Note that in the BT test, the level of drain voltage V d [V] was set at 1 V or 10 V.
• FIG. 17 shows results of a +BT test, and the amount of shift in the threshold voltage is 2.66 V.
• FIG. 18 shows results of a -BT test, and the amount of shift in the threshold voltage is -3.42 V.
• FIG. 19 shows results of a +BT test, and the amount of shift in the threshold voltage is 2.90 V.
• FIG. 20 shows results of a -BT test, and the amount of shift in the threshold voltage is -2.59 V.
• FIG. 21 shows results of a +BT test, and the amount of shift in the threshold voltage is 6.04 V.
• FIG. 22 shows results of a -BT test, and the amount of shift in the threshold voltage is -0.22 V.
• FIG. 23 shows results of a +BT test, and the amount of shift in the threshold voltage is 14.48 V.
• FIG. 24 shows results of a -BT test, and the amount of shift in the threshold voltage is -0.12 V.

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