WO2011052639A1 - Dispositif d'éclairage à diode électroluminescente - Google Patents

Dispositif d'éclairage à diode électroluminescente Download PDF

Info

Publication number
WO2011052639A1
WO2011052639A1 PCT/JP2010/069073 JP2010069073W WO2011052639A1 WO 2011052639 A1 WO2011052639 A1 WO 2011052639A1 JP 2010069073 W JP2010069073 W JP 2010069073W WO 2011052639 A1 WO2011052639 A1 WO 2011052639A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
lighting device
led lighting
case
power supply
Prior art date
Application number
PCT/JP2010/069073
Other languages
English (en)
Japanese (ja)
Inventor
智一 岡▲崎▼
勝 伊垣
広宣 金子
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム株式会社 filed Critical ローム株式会社
Publication of WO2011052639A1 publication Critical patent/WO2011052639A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Definitions

  • the present invention relates to an LED lighting device used by being attached to a ceiling, for example.
  • FIG. 40 shows an example of a conventional LED lighting device.
  • the LED lighting device 90 shown in the figure is used as a downlight while attached to the ceiling 600.
  • the LED lighting device 90 includes a case 92 and a plurality of LED modules 93 and a power supply unit 94 housed in the case 92.
  • the light from the LED module 93 is radiated toward the indoor floor after the directivity is enhanced by the reflector 91.
  • the power supply unit 94 converts, for example, commercial AC 100V power into DC 24V power and supplies the converted power to the LED module 93.
  • the case 92 that houses the power supply unit 94 projects to the opposite side of the LED module 93 in the light irradiation direction, and the height is relatively high. For this reason, in order to suitably attach the LED lighting device 90 to the ceiling 600, it is necessary to form the opening 100 in the ceiling 600 and embed the LED lighting device 90 in the ceiling 600. Such an installation work is troublesome. Further, once the opening 100 is provided, it is very difficult to change the mounting position of the LED lighting device 90. Further, when there is a strong beam inside the ceiling 600, the opening 100 cannot be provided at a desired position, and therefore the LED lighting device 90 cannot be attached at the desired position.
  • the present invention has been conceived under the above circumstances, and an object thereof is to provide an LED lighting device that can be easily attached to a ceiling or the like.
  • an LED illumination device including a plurality of LED chips.
  • the LED lighting device includes: an LED substrate that supports the plurality of LED chips; and a power supply unit that supplies power to the plurality of LED chips and has a portion that does not overlap the LED substrate in an in-plane direction of the LED substrate. Prepare.
  • the power supply unit includes first and second units.
  • the first and second units are located on opposite sides of the LED board in the in-plane direction of the LED board.
  • the first unit has a first power supply substrate parallel to the LED substrate
  • the second unit has a second power supply substrate parallel to the LED substrate.
  • At least one of the first and second units has an elongated electrical component arranged so that the longitudinal direction is included in the in-plane direction of the LED substrate.
  • a notch for accommodating at least a part of the elongated electrical component is formed in the first and second power supply boards on which the elongated electrical component is mounted. Has been.
  • a case having a mounting surface on which the LED substrate is mounted, a power supply accommodating portion that accommodates the power supply portion, and an emission port that allows light from the plurality of LED chips to pass through. Further prepare.
  • the case has a back surface slit formed on the back surface side opposite to the front surface side on which the emission port is provided.
  • the back slit is provided at a position that does not overlap the power supply accommodating portion in the in-plane direction of the LED substrate.
  • the back slit is provided at a position overlapping the mounting surface in the in-plane direction of the LED substrate.
  • the case has an internal slit extending inward from a side surface connecting the front surface and the back surface.
  • the internal slit is provided at a position that does not overlap the mounting surface and the power supply accommodating portion in the in-plane direction of the LED substrate.
  • At least one connector connected to the power supply unit is further provided, and the case is formed with a connector housing portion for housing the connector.
  • the two connectors are provided, and the case has two connector housing portions adjacent to each other.
  • the case has a rectangular shape in plan view, and the two connector housing portions are arranged along two sides connected to the same corner of the case. And a cable opening provided at the corner and exposing the two connector housing portions.
  • the case is circular in plan view, and the connector housing portion houses the two connectors in a parallel arrangement with each other.
  • the case further includes a cable opening provided at the corner and exposing the two connector housing portions.
  • the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip. Against.
  • the surface of the cover having the opening and the surface having the upper end are connected by a slope portion, and the angle formed by the outer surface of the slope portion and the mounting surface is an obtuse angle.
  • the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip, and the cover is located behind the mounting surface together with the case. And a frame portion that engages with the mounting surface.
  • the cover further includes a reflector surrounding the opening.
  • the LED illumination device can be made relatively flat. Thereby, it is possible to attach the said LED lighting apparatus, without providing an opening etc. in a ceiling. Therefore, the LED lighting device can be easily attached. Moreover, even after once attaching, the attachment position of an LED lighting apparatus can be changed by a comparatively simple operation
  • FIG. 3 is a sectional view taken along line III-III in FIG. 1.
  • FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. It is a top view which shows the 2nd unit of the power supply part of the LED lighting apparatus shown in FIG. It is a top view which shows the 1st unit of the power supply part of the LED lighting apparatus shown in FIG. It is a perspective view which shows the LED lighting apparatus based on 2nd Embodiment of this invention.
  • FIG. 16 is a cross-sectional view taken along line XVII-XVII in FIG. 15. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is a top view which shows the back case, power supply part, LED board, and LED module of the LED lighting apparatus shown in FIG.
  • FIG. It is a perspective view which shows the LED lighting apparatus based on 3rd Embodiment of this invention. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is a perspective view which shows the modification of the LED lighting apparatus based on 1st thru
  • the LED lighting device A1 of the present embodiment includes a case 1, an LED substrate 2, a plurality of LED modules 3, a power supply unit 4, and a light-transmitting plate 5, and is used as a downlight in a state of being attached to a ceiling 600, for example. It is done.
  • the translucent plate 5 is omitted for the sake of understanding.
  • the case 1 accommodates the LED substrate 2, the LED module 3, the power supply unit 4, and the translucent plate 5.
  • the case 1 is made of, for example, aluminum and has a thin rectangular parallelepiped shape with a plan view dimension of about 98 mm square and a height of about 16 mm. Case 1 is constituted by front case 1A and back case 1B.
  • the front case 1A is formed with an emission port 11, a first power supply accommodating recess 131A, and a second power supply accommodating recess 132A.
  • the emission port 11 is formed substantially at the center of the front case 1 ⁇ / b> A, and is for emitting light from the LED module 3 to the outside of the case 1.
  • the diameter of the emission port 11 is 50 mm, for example.
  • the emission port 11 is formed in a portion slightly retracted inward from the front side of the front case 1 ⁇ / b> A. As shown in FIG.
  • the first power supply receiving recess 131 ⁇ / b> A and the second power supply receiving recess 132 ⁇ / b> A are arranged on opposite sides of the emission port 11 in the diagonal direction of the front case 1 ⁇ / b> A.
  • Each of the first power supply recess portion 131A and the second power supply recess portion 132A has a shape defined by five straight portions (a shape lacking one side of the hexagon), and its depth is about 5.6 mm. is there.
  • the back case 1B is formed with a plurality of back slits 14, first power supply recesses 131B, and second power supply recesses 132B.
  • the back case 1 ⁇ / b> B has a mounting base 12 for mounting the LED substrate 2 at substantially the center thereof.
  • the mounting base 12 has a substantially square shape in plan view and has a mounting surface 12a.
  • the first power supply receiving recess 131B and the second power supply receiving recess 132B are arranged on opposite sides of the mounting base 12 in the diagonal direction of the back case 1B.
  • the first power supply receiving recess 131B and the second power supply receiving recess 132B are both substantially hexagonal and have a depth of about 7.4 mm.
  • the back slit 14 is formed on the surface of the back case 1B opposite to the surface on which the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B are formed.
  • the back slit 14 is formed at a position that does not overlap with the mounting base 12, the first power supply receiving recess 131 ⁇ / b> B, and the second power supply receiving recess 132 ⁇ / b> B in plan view.
  • Each back slit 14 extends in the diagonal direction of the back case 1B, and has a width of about 1.5 mm and a depth of about 5 mm.
  • the case 1 is configured by superposing and joining a front case 1A and a back case 1B.
  • the first power supply accommodating portion 131 is formed by the combination of the first power supply accommodating recess 131A of the front case 1A and the first power supply recess 131B of the back case 1B.
  • the second power supply accommodating portion 132 is configured by coupling the two power supply accommodating recesses 132A and the second power supply accommodating recess 132B of the back case 1B.
  • the LED substrate 2 includes a base material 21 and a wiring pattern 22 formed on the base material 21.
  • the base material 21 is made of, for example, a glass epoxy resin having a relatively good thermal conductivity by mixing a filler having a high thermal conductivity.
  • the wiring pattern 22 is for electrically connecting the plurality of LED modules 3 to each other.
  • the plurality of LED modules 3 are mounted in a substantially circular region having a diameter of about 50 to 60 mm, for example.
  • each LED module 3 includes an LED chip 31, a resin package 32, a substrate 33, and a pair of mounting terminals 34.
  • the LED module 3 is a small and very thin LED module having a width of 0.8 mm, a length of 1.6 mm, and a thickness of about 0.5 mm.
  • the substrate 33 is an insulating substrate having a substantially rectangular shape in plan view made of, for example, glass epoxy resin.
  • the LED chip 31 is mounted on the front surface of the substrate 33, and a pair of mounting terminals 34 are formed on the back surface of the substrate 33.
  • the thickness of the substrate 33 is about 0.08 to 0.1 mm.
  • the LED chip 31 is a light source of the LED module 3 and can emit visible light, for example.
  • the resin package 32 protects the LED chip 31.
  • the resin package 32 is formed by molding a resin that transmits light from the LED chip 31, such as an epoxy resin.
  • the resin package 32 may be formed by molding a translucent resin containing a fluorescent material that emits light of a different wavelength when excited by light from the LED chip 31.
  • the LED module 3 can emit white light by mixing blue light from the LED chip 31 and yellow light from the fluorescent material included in the resin package 32.
  • a fluorescent substance that emits yellow light a fluorescent substance that emits red light and a fluorescent substance that emits green light may be mixed and used.
  • 603 LED modules 3 are arranged on the LED substrate 2 in a staggered manner.
  • a voltage Vf of about 3.0 V and a current If of about 4.0 mA are applied to each LED chip 31.
  • the LED substrate 2 is attached to the mounting base 12 of the back case 1B. Specifically, the surface of the LED substrate 2 opposite to the surface supporting the LED module 3 is attached to the mounting surface 12 a of the mounting base 12. As shown in FIG. 1, the LED module 3 faces the outside through the opening 11.
  • the power supply unit 4 converts, for example, commercial AC 100V power into DC 24V power, and supplies it to the plurality of LED modules 3.
  • the power supply unit 4 includes a first unit 41 as shown in FIG. 14 and a second unit 42 as shown in FIG.
  • the first unit 41 includes a first power supply board 411 and a plurality of electrical components 412.
  • the first power supply substrate 411 has a substantially rectangular shape in plan view, and is made of, for example, a glass epoxy resin.
  • a cutout 411 a is formed in the first power supply substrate 411.
  • the plurality of electrical components 412 are components for realizing the function of the power supply unit 4.
  • the electrical component 412A is a capacitor.
  • the capacitor 412A has a main body 412Aa and a lead 412Ab.
  • the main body 412Aa has an elongated cylindrical shape.
  • the lead 412Ab protrudes from the main body 412Aa.
  • the main body 412Aa is mounted such that its long axis extends in parallel with the first power supply substrate 411, and a part thereof is accommodated in the notch 411a.
  • the lead 412Ab is bent at a substantially right angle, and the tip thereof is joined to the first power supply substrate 411 by soldering, for example.
  • the electrical component 412A is an example of an elongated electrical component referred to in the present invention.
  • An electrical component 412B shown in FIG. 14 is a surge absorber and functions to protect other electrical components 412 and 422 from an excessive voltage.
  • the second unit 42 includes a second power supply board 421 and a plurality of electrical components 422.
  • Second power supply substrate 421 has a substantially hexagonal shape in plan view, and is made of, for example, glass epoxy resin.
  • the electrical component 422A is a coil
  • the electrical component 422B is a power MOSFET used for switching purposes
  • the electrical component 422C is a driver IC for driving the LED module 3.
  • the first unit 41 and the second unit 42 are accommodated in the first power supply accommodating portion 131 and the second power supply accommodating portion 132 of the case 1, respectively. Therefore, the first unit 41 and the second unit 42 are arranged on opposite sides in the diagonal direction of the case 1 with the plurality of LED modules 3 (mounting base 12) interposed therebetween.
  • the translucent plate 5 is made of a translucent or transparent glass plate and transmits light from the LED module 3. As shown in FIG. 3, the translucent plate 5 is provided between the opening 11 and the LED substrate 2.
  • the power supply unit 4 is arranged side by side in the in-plane direction of the LED substrate 2 with respect to the plurality of LED modules 3.
  • the LED lighting device A1 can be formed into a very flat shape having a size of about 98 mm square in plan view and a height of about 16 mm. Therefore, as shown in FIG. 3, the LED lighting device A1 can be attached without providing an opening or the like in the ceiling 600. Therefore, the mounting operation of the LED lighting device A1 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A1 can be changed by a comparatively simple operation
  • the power supply unit 4 By configuring the power supply unit 4 with the first unit 41 and the second unit 42, the power supply unit 4 can be disposed relatively compactly in plan view so as to sandwich the plurality of LED modules 3. This contributes to downsizing of the LED lighting device A1.
  • the height of the LED lighting device A1 can be reduced.
  • the downsizing of the LED lighting device A1 can be further promoted.
  • the heat generated from the plurality of LED modules 3 is quickly transmitted to the mounting table 12. Thereby, it can avoid that the some LED module 3 deteriorates by high temperature.
  • the back slit 14 of the back case 1B is suitable for dissipating the heat transmitted to the mounting base 12 to the outside.
  • the back slit 14 functions to introduce outside air between the ceiling 600 and the back case 1B. This contributes to efficient heat dissipation.
  • the back slit 14 is provided at a position that does not overlap the first power supply recess 131B and the second power supply recess 132B in plan view. If the back slit 14 is to be formed at a position overlapping the first power supply recess 131B and the second power supply recess 132B in plan view, the back case 1B needs to have a large thickness, and the height of the LED lighting device A1 is high. Leads to an increase.
  • the configuration of the present embodiment in which the rear slit 14 does not overlap the first power supply receiving recess 131B and the second power supply receiving recess 132B is suitable for reducing the height of the LED lighting device A1.
  • the LED lighting device A2 of the present embodiment is different from the above-described embodiment in that it has an internal slit 15 and the arrangement of the back slit 14.
  • the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.
  • the case 1 is formed with a plurality of internal slits 15 extending from the side surface of the case 1 toward the inside.
  • a plurality of half slits 15A are formed in the front case 1A.
  • the half slit 15A is provided at a position avoiding the opening 11, the first power supply accommodating recess 131A, and the second power supply accommodating recess 132A.
  • the half slits 15A are divided and arranged on both sides of the opening 11 in the diagonal direction of the front case 1A.
  • Each half slit 15A has a width of about 2.5 mm and a depth of about 4.6 mm.
  • a plurality of half slits 15B are formed in the back case 1B.
  • the half slit 15B is provided at a position on the back case 1B away from the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B.
  • the half slits 15B are divided and arranged on both sides of the mounting base 12 in the diagonal direction of the back case 1B.
  • Each half slit 15B has a width of about 2.5 mm and a depth of about 5 mm.
  • the half slit 15A and the half slit 15B are configured to overlap when the front case 1A and the back case 1B are combined.
  • the internal slit 15 is configured by the combination of the half slit 15A and the half slit 15B.
  • the back surface slit 14 is also formed on the back surface of the mounting table 12. All the back slits 14 extend in the diagonal direction of the back case 1B.
  • the LED lighting device A2 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A2 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A2 can be changed by a comparatively simple operation
  • the internal slit 15 heat radiation to the outside can be further promoted. Since the internal slit 15 is provided at a position that avoids the mounting base 12 and the power supply unit 4, heat dissipation can be promoted without increasing the height of the LED lighting device A ⁇ b> 2. By providing the back surface slit 14 on the back side of the mounting table 12, the heat transmitted to the mounting table 12 can be dissipated more efficiently.
  • the LED lighting device A3 of the present embodiment is different from the above-described embodiment in that two connectors 43 are provided and two connector housings 133 are formed in the case 1.
  • the front case 1A of the present embodiment has the same shape as the front case 1A of the above-described embodiment when viewed from the front side.
  • two connector housing recesses 133A are formed in the front case 1A.
  • Each connector housing recess 133A has a size that just houses the connector 43 shown in FIG.
  • the two connector housing recesses 133A are arranged in the vicinity of the corners along two sides forming one corner of the front case 1A.
  • each connector housing recess 133B has a size that just houses the connector 43 shown in FIG.
  • the two connector housing recesses 133B are arranged in the vicinity of the corners along two sides forming one corner of the back case 1B.
  • Each connector accommodating part 133 is comprised by combining the connector accommodating recessed part 133A and the connector accommodating recessed part 133B. As shown in FIG. 24, a cable opening 16 is further formed in the case 1.
  • the cable opening 16 exposes the two connector recesses 133 ⁇ / b> A and 133 ⁇ / b> B, and allows the cable 700 from the outside to be connected to the connector 43 in the connector housing portion 133.
  • each connector 43 is housed in a connector housing recess 133 ⁇ / b> B (connector housing portion 133), and is connected to the power supply unit 4 (first unit 41 or second unit 42) via a cable 44.
  • the LED lighting device A3 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A3 can be easily performed.
  • the cable 700 can be inserted from the side of an apparatus. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to form a hole in the ceiling 600 for passing the cable 700.
  • FIG. 30 shows a modification of the LED lighting devices A1 to A3.
  • a cover 51 is further provided for housing the LED lighting devices A1 to A3.
  • the cover 51 as a whole has a rectangular shape in plan view and a box shape with a relatively low height.
  • the cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes.
  • the upper end edge of the cover 51 is configured to contact the ceiling 600 or to face each other with a slight gap.
  • the cover 51 has a flat surface portion in which the opening 51a is formed and four slope portions surrounding the flat surface portion.
  • the outer surface of the slope portion and the ceiling 600 form an obtuse angle. In the present embodiment, this obtuse angle is about 135 degrees.
  • the LED illumination device according to this modification can make the appearance of the ceiling 600 better than the LED illumination device that does not include a cover.
  • a cover 51 that houses the LED lighting devices A1 to A3 and a metal fitting 52 are further provided.
  • the cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes.
  • the cover 51 has an embedded portion 51b and a frame portion 51c.
  • the embedded portion 51b surrounds the LED lighting devices A1 to A3.
  • the embedded part 51 b is a part embedded in the ceiling 600.
  • the frame portion 51c has a rectangular frame shape in plan view, and is connected to the periphery of the embedded portion 51b.
  • the frame portion 51 c is a portion that engages with the surface of the ceiling 600.
  • the metal fitting 52 is formed by bending a band-shaped metal plate, and prevents the cover 51 from coming off from the ceiling 600.
  • the LED lighting devices A1 to A3 are relatively low in height, and the height of the embedded portion 51b embedded in the ceiling 600 is significantly smaller than that of a conventional downlight. For this reason, it is not necessary to ensure a large space inside the ceiling 600 in order to accommodate the LED lighting device. Therefore, even if the buildings have the same height, a larger distance can be ensured between the floor (not shown) and the ceiling 600.
  • FIG. 33 shows another modification of the LED lighting devices A1 to A3.
  • This modification differs from the above-described modification in that a reflector 51d is provided on the cover 51.
  • the reflector 51d has a parabolic shape and enhances the directivity of light from the plurality of LED modules 3.
  • a translucent plate 53 is disposed between the reflector 51d and the LED lighting devices A1 to A3.
  • the translucent plate 53 is made of, for example, acrylic resin.
  • the LED illumination device can emit light with higher directivity, and can irradiate light intensively to a narrower area of the floor surface, for example.
  • the reflector 51d is provided, the height is still significantly lower than the conventional downlight. For this reason, it is not necessary to secure a large accommodation space inside the ceiling 600.
  • FIGS. 34 to 38 show an LED illumination device according to the fourth embodiment of the present invention.
  • the LED lighting device A4 of this embodiment is different from the above-described embodiment in that the planar view is circular.
  • the front case 1A and the back case 1B are also circular in plan view.
  • the first power supply accommodating portion 131 and the second power supply accommodating portion 132 are provided at positions shifted by 90 degrees in the circumferential direction of the case 1.
  • the connector housing part 133 houses two connectors 43 in parallel.
  • the LED lighting device A4 without providing an opening or the like in the ceiling 600. Therefore, attachment work can be performed easily. Also in the LED lighting device A4, the cable 700 can be inserted from the side of the device. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to provide a hole in the ceiling 600 for passing the cable 700. Note that the modifications shown in FIGS. 31 to 33 may be applied to the LED illumination device A4 of the present embodiment.
  • the LED lighting device according to the present invention is not limited to the above-described embodiment.
  • the specific configuration of each part of the LED lighting device according to the present invention can be variously modified.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un dispositif d'éclairage à diode électroluminescente facile à installer sur un plafond ou analogue. Ledit dispositif d'éclairage à diode électroluminescente (A1) est équipé: (A1) d'une pluralité de modules de diode électroluminescente (3) ; d'un substrat de diode électroluminescente (2) qui assure le support de la pluralité de modules de diode électroluminescente ; et d'une unité d'alimentation (4) qui alimente de l'énergie à la pluralité de modules de diode électroluminescente (3) et présente une section qui, même projetée dans le plan du substrat de diode électroluminescente (2), ne recouvre pas le substrat de diode électroluminescente (2).
PCT/JP2010/069073 2009-10-27 2010-10-27 Dispositif d'éclairage à diode électroluminescente WO2011052639A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009246757 2009-10-27
JP2009-246757 2009-10-27
JP2010051143A JP5547520B2 (ja) 2009-10-27 2010-03-08 Ｌｅｄ照明装置
JP2010-051143 2010-03-08

Publications (1)

Publication Number Publication Date
WO2011052639A1 true WO2011052639A1 (fr) 2011-05-05

Family

ID=43922064

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/069073 WO2011052639A1 (fr) 2009-10-27 2010-10-27 Dispositif d'éclairage à diode électroluminescente

Country Status (2)

Country Link
JP (1) JP5547520B2 (fr)
WO (1) WO2011052639A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046319A1 (fr) * 2011-09-27 2013-04-04 東芝ライテック株式会社 Lampe et appareil d'éclairage
JP2013118292A (ja) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
JP2016503968A (ja) * 2013-01-10 2016-02-08 モレックス エルエルシー Ｌｅｄアセンブリ
EP3037721A1 (fr) * 2014-12-22 2016-06-29 STEINEL GmbH Dispositif d'éclairage commandé par capteur

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101177470B1 (ko) 2012-03-19 2012-08-24 엘지전자 주식회사 조명 장치
JP2013206850A (ja) * 2012-03-29 2013-10-07 Toshiba Lighting & Technology Corp 照明装置
JP5988219B2 (ja) * 2013-01-31 2016-09-07 パナソニックＩｐマネジメント株式会社 照明装置
CN104235641B (zh) * 2013-06-09 2016-04-06 四川新力光源股份有限公司 超薄式led光引擎
JP5695238B2 (ja) * 2013-07-29 2015-04-01 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP5538609B2 (ja) * 2013-09-06 2014-07-02 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP6202441B2 (ja) * 2014-02-20 2017-09-27 パナソニックＩｐマネジメント株式会社 Ｌｅｄ照明器具
JP5793268B1 (ja) * 2014-04-09 2015-10-14 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP5820048B1 (ja) * 2014-04-22 2015-11-24 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP5701424B2 (ja) * 2014-04-28 2015-04-15 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP5701422B2 (ja) * 2014-04-28 2015-04-15 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP5793269B1 (ja) * 2014-05-19 2015-10-14 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP5793272B1 (ja) * 2014-06-19 2015-10-14 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP2014232737A (ja) * 2014-09-08 2014-12-11 アイリスオーヤマ株式会社 Ｌｅｄ照明装置
JP6391005B2 (ja) * 2014-09-10 2018-09-19 パナソニックＩｐマネジメント株式会社 照明装置及びそれを用いた照明器具
JP2018125164A (ja) * 2017-02-01 2018-08-09 パナソニックＩｐマネジメント株式会社 光源装置
JP7065325B2 (ja) * 2018-01-29 2022-05-12 パナソニックＩｐマネジメント株式会社 照明器具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3126337U (ja) * 2006-08-10 2006-10-19 超▲ちょ▼科技股▲ふん▼有限公司 大型ｌｅｄランプ
JP2009004131A (ja) * 2007-06-19 2009-01-08 Sharp Corp 照明装置
JP2009064636A (ja) * 2007-09-05 2009-03-26 Toshiba Lighting & Technology Corp 照明装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593075U (ja) * 1992-05-25 1993-12-17 松下電工株式会社 電気部品の取付け構造
JP2007027056A (ja) * 2005-07-21 2007-02-01 Sony Corp バックライト装置及び液晶表示装置
JP4367388B2 (ja) * 2005-08-23 2009-11-18 パナソニック電工株式会社 Ｌｅｄ照明器具
JP2008166331A (ja) * 2006-12-27 2008-07-17 Lecip Corp 電子機器装置及びその電子機器装置の製造方法
JP2009009804A (ja) * 2007-06-27 2009-01-15 Sharp Corp 照明装置
JP5106179B2 (ja) * 2008-02-29 2012-12-26 シャープ株式会社 照明装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3126337U (ja) * 2006-08-10 2006-10-19 超▲ちょ▼科技股▲ふん▼有限公司 大型ｌｅｄランプ
JP2009004131A (ja) * 2007-06-19 2009-01-08 Sharp Corp 照明装置
JP2009064636A (ja) * 2007-09-05 2009-03-26 Toshiba Lighting & Technology Corp 照明装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046319A1 (fr) * 2011-09-27 2013-04-04 東芝ライテック株式会社 Lampe et appareil d'éclairage
CN103732977A (zh) * 2011-09-27 2014-04-16 东芝照明技术株式会社 灯及照明器具
JP2013118292A (ja) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
US9335035B2 (en) 2011-12-02 2016-05-10 Citizen Electronics Co., Ltd. Lighting device including light-emitting element
JP2016503968A (ja) * 2013-01-10 2016-02-08 モレックス エルエルシー Ｌｅｄアセンブリ
US10390399B2 (en) 2013-01-10 2019-08-20 Molex, Llc LED assembly having base insert molded about terminals and substrate with a plurality of LED chips positioned on said substrate
EP3037721A1 (fr) * 2014-12-22 2016-06-29 STEINEL GmbH Dispositif d'éclairage commandé par capteur

Also Published As

Publication number Publication date
JP2011119206A (ja) 2011-06-16
JP5547520B2 (ja) 2014-07-16

Similar Documents

Publication Publication Date Title
WO2011052639A1 (fr) Dispositif d'éclairage à diode électroluminescente
JP4854798B2 (ja) 照明装置
JP5052647B2 (ja) 照明装置
WO2011152137A1 (fr) Dispositif d'éclairage
CN104246353A (zh) 灯和照明装置
JP2011159447A (ja) 照明装置
JP2013077493A (ja) Ｌｅｄ照明装置
JP5971504B2 (ja) 照明用光源及び照明装置
JP6135908B2 (ja) 照明用光源及び照明装置
JP6620984B2 (ja) 照明器具
JP2018085212A (ja) 照明装置
JP2014179332A (ja) 照明用光源及び照明装置
JP6108304B2 (ja) 照明用光源及び照明装置
JP2017139133A (ja) 照明器具
JP2014143021A (ja) 照明用光源及び照明装置
JP7022945B2 (ja) 照明器具
JP5914839B2 (ja) 発光装置及びそれを備えた照明器具
JP5799218B2 (ja) Ｌｅｄユニットおよびそれを用いた照明器具
WO2013128733A1 (fr) Dispositif électroluminescent, et appareil d'éclairage l'utilisant
JP2017027865A (ja) 照明器具
JP6029067B2 (ja) 照明用光源及び照明装置
JP6112451B2 (ja) 照明用光源及び照明装置
JP6191942B2 (ja) 照明用光源及び照明装置
JP6135986B2 (ja) 照明用光源及び照明装置
JP2015050165A (ja) 照明用光源及び照明装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10826771

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10826771

Country of ref document: EP

Kind code of ref document: A1