WO2011052639A1 - Led lighting device - Google Patents

Led lighting device Download PDF

Info

Publication number
WO2011052639A1
WO2011052639A1 PCT/JP2010/069073 JP2010069073W WO2011052639A1 WO 2011052639 A1 WO2011052639 A1 WO 2011052639A1 JP 2010069073 W JP2010069073 W JP 2010069073W WO 2011052639 A1 WO2011052639 A1 WO 2011052639A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
lighting device
led lighting
case
power supply
Prior art date
Application number
PCT/JP2010/069073
Other languages
French (fr)
Japanese (ja)
Inventor
智一 岡▲崎▼
勝 伊垣
広宣 金子
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム株式会社 filed Critical ローム株式会社
Publication of WO2011052639A1 publication Critical patent/WO2011052639A1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Definitions

  • the present invention relates to an LED lighting device used by being attached to a ceiling, for example.
  • FIG. 40 shows an example of a conventional LED lighting device.
  • the LED lighting device 90 shown in the figure is used as a downlight while attached to the ceiling 600.
  • the LED lighting device 90 includes a case 92 and a plurality of LED modules 93 and a power supply unit 94 housed in the case 92.
  • the light from the LED module 93 is radiated toward the indoor floor after the directivity is enhanced by the reflector 91.
  • the power supply unit 94 converts, for example, commercial AC 100V power into DC 24V power and supplies the converted power to the LED module 93.
  • the case 92 that houses the power supply unit 94 projects to the opposite side of the LED module 93 in the light irradiation direction, and the height is relatively high. For this reason, in order to suitably attach the LED lighting device 90 to the ceiling 600, it is necessary to form the opening 100 in the ceiling 600 and embed the LED lighting device 90 in the ceiling 600. Such an installation work is troublesome. Further, once the opening 100 is provided, it is very difficult to change the mounting position of the LED lighting device 90. Further, when there is a strong beam inside the ceiling 600, the opening 100 cannot be provided at a desired position, and therefore the LED lighting device 90 cannot be attached at the desired position.
  • the present invention has been conceived under the above circumstances, and an object thereof is to provide an LED lighting device that can be easily attached to a ceiling or the like.
  • an LED illumination device including a plurality of LED chips.
  • the LED lighting device includes: an LED substrate that supports the plurality of LED chips; and a power supply unit that supplies power to the plurality of LED chips and has a portion that does not overlap the LED substrate in an in-plane direction of the LED substrate. Prepare.
  • the power supply unit includes first and second units.
  • the first and second units are located on opposite sides of the LED board in the in-plane direction of the LED board.
  • the first unit has a first power supply substrate parallel to the LED substrate
  • the second unit has a second power supply substrate parallel to the LED substrate.
  • At least one of the first and second units has an elongated electrical component arranged so that the longitudinal direction is included in the in-plane direction of the LED substrate.
  • a notch for accommodating at least a part of the elongated electrical component is formed in the first and second power supply boards on which the elongated electrical component is mounted. Has been.
  • a case having a mounting surface on which the LED substrate is mounted, a power supply accommodating portion that accommodates the power supply portion, and an emission port that allows light from the plurality of LED chips to pass through. Further prepare.
  • the case has a back surface slit formed on the back surface side opposite to the front surface side on which the emission port is provided.
  • the back slit is provided at a position that does not overlap the power supply accommodating portion in the in-plane direction of the LED substrate.
  • the back slit is provided at a position overlapping the mounting surface in the in-plane direction of the LED substrate.
  • the case has an internal slit extending inward from a side surface connecting the front surface and the back surface.
  • the internal slit is provided at a position that does not overlap the mounting surface and the power supply accommodating portion in the in-plane direction of the LED substrate.
  • At least one connector connected to the power supply unit is further provided, and the case is formed with a connector housing portion for housing the connector.
  • the two connectors are provided, and the case has two connector housing portions adjacent to each other.
  • the case has a rectangular shape in plan view, and the two connector housing portions are arranged along two sides connected to the same corner of the case. And a cable opening provided at the corner and exposing the two connector housing portions.
  • the case is circular in plan view, and the connector housing portion houses the two connectors in a parallel arrangement with each other.
  • the case further includes a cable opening provided at the corner and exposing the two connector housing portions.
  • the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip. Against.
  • the surface of the cover having the opening and the surface having the upper end are connected by a slope portion, and the angle formed by the outer surface of the slope portion and the mounting surface is an obtuse angle.
  • the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip, and the cover is located behind the mounting surface together with the case. And a frame portion that engages with the mounting surface.
  • the cover further includes a reflector surrounding the opening.
  • the LED illumination device can be made relatively flat. Thereby, it is possible to attach the said LED lighting apparatus, without providing an opening etc. in a ceiling. Therefore, the LED lighting device can be easily attached. Moreover, even after once attaching, the attachment position of an LED lighting apparatus can be changed by a comparatively simple operation
  • FIG. 3 is a sectional view taken along line III-III in FIG. 1.
  • FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. It is a top view which shows the 2nd unit of the power supply part of the LED lighting apparatus shown in FIG. It is a top view which shows the 1st unit of the power supply part of the LED lighting apparatus shown in FIG. It is a perspective view which shows the LED lighting apparatus based on 2nd Embodiment of this invention.
  • FIG. 16 is a cross-sectional view taken along line XVII-XVII in FIG. 15. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is a top view which shows the back case, power supply part, LED board, and LED module of the LED lighting apparatus shown in FIG.
  • FIG. It is a perspective view which shows the LED lighting apparatus based on 3rd Embodiment of this invention. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is a perspective view which shows the modification of the LED lighting apparatus based on 1st thru
  • the LED lighting device A1 of the present embodiment includes a case 1, an LED substrate 2, a plurality of LED modules 3, a power supply unit 4, and a light-transmitting plate 5, and is used as a downlight in a state of being attached to a ceiling 600, for example. It is done.
  • the translucent plate 5 is omitted for the sake of understanding.
  • the case 1 accommodates the LED substrate 2, the LED module 3, the power supply unit 4, and the translucent plate 5.
  • the case 1 is made of, for example, aluminum and has a thin rectangular parallelepiped shape with a plan view dimension of about 98 mm square and a height of about 16 mm. Case 1 is constituted by front case 1A and back case 1B.
  • the front case 1A is formed with an emission port 11, a first power supply accommodating recess 131A, and a second power supply accommodating recess 132A.
  • the emission port 11 is formed substantially at the center of the front case 1 ⁇ / b> A, and is for emitting light from the LED module 3 to the outside of the case 1.
  • the diameter of the emission port 11 is 50 mm, for example.
  • the emission port 11 is formed in a portion slightly retracted inward from the front side of the front case 1 ⁇ / b> A. As shown in FIG.
  • the first power supply receiving recess 131 ⁇ / b> A and the second power supply receiving recess 132 ⁇ / b> A are arranged on opposite sides of the emission port 11 in the diagonal direction of the front case 1 ⁇ / b> A.
  • Each of the first power supply recess portion 131A and the second power supply recess portion 132A has a shape defined by five straight portions (a shape lacking one side of the hexagon), and its depth is about 5.6 mm. is there.
  • the back case 1B is formed with a plurality of back slits 14, first power supply recesses 131B, and second power supply recesses 132B.
  • the back case 1 ⁇ / b> B has a mounting base 12 for mounting the LED substrate 2 at substantially the center thereof.
  • the mounting base 12 has a substantially square shape in plan view and has a mounting surface 12a.
  • the first power supply receiving recess 131B and the second power supply receiving recess 132B are arranged on opposite sides of the mounting base 12 in the diagonal direction of the back case 1B.
  • the first power supply receiving recess 131B and the second power supply receiving recess 132B are both substantially hexagonal and have a depth of about 7.4 mm.
  • the back slit 14 is formed on the surface of the back case 1B opposite to the surface on which the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B are formed.
  • the back slit 14 is formed at a position that does not overlap with the mounting base 12, the first power supply receiving recess 131 ⁇ / b> B, and the second power supply receiving recess 132 ⁇ / b> B in plan view.
  • Each back slit 14 extends in the diagonal direction of the back case 1B, and has a width of about 1.5 mm and a depth of about 5 mm.
  • the case 1 is configured by superposing and joining a front case 1A and a back case 1B.
  • the first power supply accommodating portion 131 is formed by the combination of the first power supply accommodating recess 131A of the front case 1A and the first power supply recess 131B of the back case 1B.
  • the second power supply accommodating portion 132 is configured by coupling the two power supply accommodating recesses 132A and the second power supply accommodating recess 132B of the back case 1B.
  • the LED substrate 2 includes a base material 21 and a wiring pattern 22 formed on the base material 21.
  • the base material 21 is made of, for example, a glass epoxy resin having a relatively good thermal conductivity by mixing a filler having a high thermal conductivity.
  • the wiring pattern 22 is for electrically connecting the plurality of LED modules 3 to each other.
  • the plurality of LED modules 3 are mounted in a substantially circular region having a diameter of about 50 to 60 mm, for example.
  • each LED module 3 includes an LED chip 31, a resin package 32, a substrate 33, and a pair of mounting terminals 34.
  • the LED module 3 is a small and very thin LED module having a width of 0.8 mm, a length of 1.6 mm, and a thickness of about 0.5 mm.
  • the substrate 33 is an insulating substrate having a substantially rectangular shape in plan view made of, for example, glass epoxy resin.
  • the LED chip 31 is mounted on the front surface of the substrate 33, and a pair of mounting terminals 34 are formed on the back surface of the substrate 33.
  • the thickness of the substrate 33 is about 0.08 to 0.1 mm.
  • the LED chip 31 is a light source of the LED module 3 and can emit visible light, for example.
  • the resin package 32 protects the LED chip 31.
  • the resin package 32 is formed by molding a resin that transmits light from the LED chip 31, such as an epoxy resin.
  • the resin package 32 may be formed by molding a translucent resin containing a fluorescent material that emits light of a different wavelength when excited by light from the LED chip 31.
  • the LED module 3 can emit white light by mixing blue light from the LED chip 31 and yellow light from the fluorescent material included in the resin package 32.
  • a fluorescent substance that emits yellow light a fluorescent substance that emits red light and a fluorescent substance that emits green light may be mixed and used.
  • 603 LED modules 3 are arranged on the LED substrate 2 in a staggered manner.
  • a voltage Vf of about 3.0 V and a current If of about 4.0 mA are applied to each LED chip 31.
  • the LED substrate 2 is attached to the mounting base 12 of the back case 1B. Specifically, the surface of the LED substrate 2 opposite to the surface supporting the LED module 3 is attached to the mounting surface 12 a of the mounting base 12. As shown in FIG. 1, the LED module 3 faces the outside through the opening 11.
  • the power supply unit 4 converts, for example, commercial AC 100V power into DC 24V power, and supplies it to the plurality of LED modules 3.
  • the power supply unit 4 includes a first unit 41 as shown in FIG. 14 and a second unit 42 as shown in FIG.
  • the first unit 41 includes a first power supply board 411 and a plurality of electrical components 412.
  • the first power supply substrate 411 has a substantially rectangular shape in plan view, and is made of, for example, a glass epoxy resin.
  • a cutout 411 a is formed in the first power supply substrate 411.
  • the plurality of electrical components 412 are components for realizing the function of the power supply unit 4.
  • the electrical component 412A is a capacitor.
  • the capacitor 412A has a main body 412Aa and a lead 412Ab.
  • the main body 412Aa has an elongated cylindrical shape.
  • the lead 412Ab protrudes from the main body 412Aa.
  • the main body 412Aa is mounted such that its long axis extends in parallel with the first power supply substrate 411, and a part thereof is accommodated in the notch 411a.
  • the lead 412Ab is bent at a substantially right angle, and the tip thereof is joined to the first power supply substrate 411 by soldering, for example.
  • the electrical component 412A is an example of an elongated electrical component referred to in the present invention.
  • An electrical component 412B shown in FIG. 14 is a surge absorber and functions to protect other electrical components 412 and 422 from an excessive voltage.
  • the second unit 42 includes a second power supply board 421 and a plurality of electrical components 422.
  • Second power supply substrate 421 has a substantially hexagonal shape in plan view, and is made of, for example, glass epoxy resin.
  • the electrical component 422A is a coil
  • the electrical component 422B is a power MOSFET used for switching purposes
  • the electrical component 422C is a driver IC for driving the LED module 3.
  • the first unit 41 and the second unit 42 are accommodated in the first power supply accommodating portion 131 and the second power supply accommodating portion 132 of the case 1, respectively. Therefore, the first unit 41 and the second unit 42 are arranged on opposite sides in the diagonal direction of the case 1 with the plurality of LED modules 3 (mounting base 12) interposed therebetween.
  • the translucent plate 5 is made of a translucent or transparent glass plate and transmits light from the LED module 3. As shown in FIG. 3, the translucent plate 5 is provided between the opening 11 and the LED substrate 2.
  • the power supply unit 4 is arranged side by side in the in-plane direction of the LED substrate 2 with respect to the plurality of LED modules 3.
  • the LED lighting device A1 can be formed into a very flat shape having a size of about 98 mm square in plan view and a height of about 16 mm. Therefore, as shown in FIG. 3, the LED lighting device A1 can be attached without providing an opening or the like in the ceiling 600. Therefore, the mounting operation of the LED lighting device A1 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A1 can be changed by a comparatively simple operation
  • the power supply unit 4 By configuring the power supply unit 4 with the first unit 41 and the second unit 42, the power supply unit 4 can be disposed relatively compactly in plan view so as to sandwich the plurality of LED modules 3. This contributes to downsizing of the LED lighting device A1.
  • the height of the LED lighting device A1 can be reduced.
  • the downsizing of the LED lighting device A1 can be further promoted.
  • the heat generated from the plurality of LED modules 3 is quickly transmitted to the mounting table 12. Thereby, it can avoid that the some LED module 3 deteriorates by high temperature.
  • the back slit 14 of the back case 1B is suitable for dissipating the heat transmitted to the mounting base 12 to the outside.
  • the back slit 14 functions to introduce outside air between the ceiling 600 and the back case 1B. This contributes to efficient heat dissipation.
  • the back slit 14 is provided at a position that does not overlap the first power supply recess 131B and the second power supply recess 132B in plan view. If the back slit 14 is to be formed at a position overlapping the first power supply recess 131B and the second power supply recess 132B in plan view, the back case 1B needs to have a large thickness, and the height of the LED lighting device A1 is high. Leads to an increase.
  • the configuration of the present embodiment in which the rear slit 14 does not overlap the first power supply receiving recess 131B and the second power supply receiving recess 132B is suitable for reducing the height of the LED lighting device A1.
  • the LED lighting device A2 of the present embodiment is different from the above-described embodiment in that it has an internal slit 15 and the arrangement of the back slit 14.
  • the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.
  • the case 1 is formed with a plurality of internal slits 15 extending from the side surface of the case 1 toward the inside.
  • a plurality of half slits 15A are formed in the front case 1A.
  • the half slit 15A is provided at a position avoiding the opening 11, the first power supply accommodating recess 131A, and the second power supply accommodating recess 132A.
  • the half slits 15A are divided and arranged on both sides of the opening 11 in the diagonal direction of the front case 1A.
  • Each half slit 15A has a width of about 2.5 mm and a depth of about 4.6 mm.
  • a plurality of half slits 15B are formed in the back case 1B.
  • the half slit 15B is provided at a position on the back case 1B away from the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B.
  • the half slits 15B are divided and arranged on both sides of the mounting base 12 in the diagonal direction of the back case 1B.
  • Each half slit 15B has a width of about 2.5 mm and a depth of about 5 mm.
  • the half slit 15A and the half slit 15B are configured to overlap when the front case 1A and the back case 1B are combined.
  • the internal slit 15 is configured by the combination of the half slit 15A and the half slit 15B.
  • the back surface slit 14 is also formed on the back surface of the mounting table 12. All the back slits 14 extend in the diagonal direction of the back case 1B.
  • the LED lighting device A2 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A2 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A2 can be changed by a comparatively simple operation
  • the internal slit 15 heat radiation to the outside can be further promoted. Since the internal slit 15 is provided at a position that avoids the mounting base 12 and the power supply unit 4, heat dissipation can be promoted without increasing the height of the LED lighting device A ⁇ b> 2. By providing the back surface slit 14 on the back side of the mounting table 12, the heat transmitted to the mounting table 12 can be dissipated more efficiently.
  • the LED lighting device A3 of the present embodiment is different from the above-described embodiment in that two connectors 43 are provided and two connector housings 133 are formed in the case 1.
  • the front case 1A of the present embodiment has the same shape as the front case 1A of the above-described embodiment when viewed from the front side.
  • two connector housing recesses 133A are formed in the front case 1A.
  • Each connector housing recess 133A has a size that just houses the connector 43 shown in FIG.
  • the two connector housing recesses 133A are arranged in the vicinity of the corners along two sides forming one corner of the front case 1A.
  • each connector housing recess 133B has a size that just houses the connector 43 shown in FIG.
  • the two connector housing recesses 133B are arranged in the vicinity of the corners along two sides forming one corner of the back case 1B.
  • Each connector accommodating part 133 is comprised by combining the connector accommodating recessed part 133A and the connector accommodating recessed part 133B. As shown in FIG. 24, a cable opening 16 is further formed in the case 1.
  • the cable opening 16 exposes the two connector recesses 133 ⁇ / b> A and 133 ⁇ / b> B, and allows the cable 700 from the outside to be connected to the connector 43 in the connector housing portion 133.
  • each connector 43 is housed in a connector housing recess 133 ⁇ / b> B (connector housing portion 133), and is connected to the power supply unit 4 (first unit 41 or second unit 42) via a cable 44.
  • the LED lighting device A3 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A3 can be easily performed.
  • the cable 700 can be inserted from the side of an apparatus. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to form a hole in the ceiling 600 for passing the cable 700.
  • FIG. 30 shows a modification of the LED lighting devices A1 to A3.
  • a cover 51 is further provided for housing the LED lighting devices A1 to A3.
  • the cover 51 as a whole has a rectangular shape in plan view and a box shape with a relatively low height.
  • the cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes.
  • the upper end edge of the cover 51 is configured to contact the ceiling 600 or to face each other with a slight gap.
  • the cover 51 has a flat surface portion in which the opening 51a is formed and four slope portions surrounding the flat surface portion.
  • the outer surface of the slope portion and the ceiling 600 form an obtuse angle. In the present embodiment, this obtuse angle is about 135 degrees.
  • the LED illumination device according to this modification can make the appearance of the ceiling 600 better than the LED illumination device that does not include a cover.
  • a cover 51 that houses the LED lighting devices A1 to A3 and a metal fitting 52 are further provided.
  • the cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes.
  • the cover 51 has an embedded portion 51b and a frame portion 51c.
  • the embedded portion 51b surrounds the LED lighting devices A1 to A3.
  • the embedded part 51 b is a part embedded in the ceiling 600.
  • the frame portion 51c has a rectangular frame shape in plan view, and is connected to the periphery of the embedded portion 51b.
  • the frame portion 51 c is a portion that engages with the surface of the ceiling 600.
  • the metal fitting 52 is formed by bending a band-shaped metal plate, and prevents the cover 51 from coming off from the ceiling 600.
  • the LED lighting devices A1 to A3 are relatively low in height, and the height of the embedded portion 51b embedded in the ceiling 600 is significantly smaller than that of a conventional downlight. For this reason, it is not necessary to ensure a large space inside the ceiling 600 in order to accommodate the LED lighting device. Therefore, even if the buildings have the same height, a larger distance can be ensured between the floor (not shown) and the ceiling 600.
  • FIG. 33 shows another modification of the LED lighting devices A1 to A3.
  • This modification differs from the above-described modification in that a reflector 51d is provided on the cover 51.
  • the reflector 51d has a parabolic shape and enhances the directivity of light from the plurality of LED modules 3.
  • a translucent plate 53 is disposed between the reflector 51d and the LED lighting devices A1 to A3.
  • the translucent plate 53 is made of, for example, acrylic resin.
  • the LED illumination device can emit light with higher directivity, and can irradiate light intensively to a narrower area of the floor surface, for example.
  • the reflector 51d is provided, the height is still significantly lower than the conventional downlight. For this reason, it is not necessary to secure a large accommodation space inside the ceiling 600.
  • FIGS. 34 to 38 show an LED illumination device according to the fourth embodiment of the present invention.
  • the LED lighting device A4 of this embodiment is different from the above-described embodiment in that the planar view is circular.
  • the front case 1A and the back case 1B are also circular in plan view.
  • the first power supply accommodating portion 131 and the second power supply accommodating portion 132 are provided at positions shifted by 90 degrees in the circumferential direction of the case 1.
  • the connector housing part 133 houses two connectors 43 in parallel.
  • the LED lighting device A4 without providing an opening or the like in the ceiling 600. Therefore, attachment work can be performed easily. Also in the LED lighting device A4, the cable 700 can be inserted from the side of the device. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to provide a hole in the ceiling 600 for passing the cable 700. Note that the modifications shown in FIGS. 31 to 33 may be applied to the LED illumination device A4 of the present embodiment.
  • the LED lighting device according to the present invention is not limited to the above-described embodiment.
  • the specific configuration of each part of the LED lighting device according to the present invention can be variously modified.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

Disclosed is an LED lighting device that is easy to install on a ceiling or the like. Said LED lighting device (A1) is provided with: a plurality of LED modules (3); an LED substrate (2) that supports the plurality of LED modules (3); and a power-supply unit (4) that supplies power to the plurality of LED modules (3) and has a section that, if projected into the plane of the LED substrate (2), does not overlap the LED substrate (2).

Description

ＬＥＤ照明装置LED lighting device
　本発明は、たとえば天井に取り付けられて用いられるＬＥＤ照明装置に関する。 The present invention relates to an LED lighting device used by being attached to a ceiling, for example.
　図４０は、従来のＬＥＤ照明装置の一例を示している。同図に示されたＬＥＤ照明装置９０は、天井６００に取り付けられた状態でダウンライトとして用いられる。ＬＥＤ照明装置９０は、ケース９２と、当該ケース９２内に収容された複数のＬＥＤモジュール９３及び電源部９４とを有する。ＬＥＤモジュール９３からの光は、リフレクタ９１によって指向性を高められた後に室内の床面に向けて照射される。電源部９４は、たとえば商用の交流１００Ｖ電力を直流２４Ｖ電力に変換し、ＬＥＤモジュール９３に供給する。 FIG. 40 shows an example of a conventional LED lighting device. The LED lighting device 90 shown in the figure is used as a downlight while attached to the ceiling 600. The LED lighting device 90 includes a case 92 and a plurality of LED modules 93 and a power supply unit 94 housed in the case 92. The light from the LED module 93 is radiated toward the indoor floor after the directivity is enhanced by the reflector 91. The power supply unit 94 converts, for example, commercial AC 100V power into DC 24V power and supplies the converted power to the LED module 93.
　ＬＥＤ照明装置９０は、電源部９４を収容するケース９２が、光照射方向においてＬＥＤモジュール９３の反対側に突出しており、高さが比較的高い。このため、ＬＥＤ照明装置９０を天井６００に好適に取り付けるためには、天井６００に開口１００を形成し天井６００の内部にＬＥＤ照明装置９０を埋め込む必要がある。このような取り付け作業は手間がかかる。また、いったん開口１００を設けた後には、ＬＥＤ照明装置９０の取り付け位置を変更することは非常に困難である。また、天井６００の内部に強固な梁があった場合、所望の位置に開口１００を設けることができず、従って、所望の位置にＬＥＤ照明装置９０を取り付けることができない。 In the LED lighting device 90, the case 92 that houses the power supply unit 94 projects to the opposite side of the LED module 93 in the light irradiation direction, and the height is relatively high. For this reason, in order to suitably attach the LED lighting device 90 to the ceiling 600, it is necessary to form the opening 100 in the ceiling 600 and embed the LED lighting device 90 in the ceiling 600. Such an installation work is troublesome. Further, once the opening 100 is provided, it is very difficult to change the mounting position of the LED lighting device 90. Further, when there is a strong beam inside the ceiling 600, the opening 100 cannot be provided at a desired position, and therefore the LED lighting device 90 cannot be attached at the desired position.
特開２００９－６４６３６号公報JP 2009-64636 A
　本発明は、上記した事情のもとで考え出されたものであって、天井などに容易に取り付けることができるＬＥＤ照明装置を提供することをその課題とする。 The present invention has been conceived under the above circumstances, and an object thereof is to provide an LED lighting device that can be easily attached to a ceiling or the like.
　本発明によれば、複数のＬＥＤチップを備えるＬＥＤ照明装置が提供される。ＬＥＤ照明装置は、上記複数のＬＥＤチップを支持するＬＥＤ基板と、上記複数のＬＥＤチップに電力供給し、かつ上記ＬＥＤ基板の面内方向において上記ＬＥＤ基板と重ならない部分を有する電源部と、を備える。 According to the present invention, an LED illumination device including a plurality of LED chips is provided. The LED lighting device includes: an LED substrate that supports the plurality of LED chips; and a power supply unit that supplies power to the plurality of LED chips and has a portion that does not overlap the LED substrate in an in-plane direction of the LED substrate. Prepare.
　本発明の好ましい実施の形態においては、上記電源部は、第１および第２ユニットを含む。 In a preferred embodiment of the present invention, the power supply unit includes first and second units.
　本発明の好ましい実施の形態においては、上記第１および第２ユニットは、上記ＬＥＤ基板の面内方向において上記ＬＥＤ基板を挟んで互いに反対側に位置する。 In a preferred embodiment of the present invention, the first and second units are located on opposite sides of the LED board in the in-plane direction of the LED board.
　本発明の好ましい実施の形態においては、上記第１ユニットは、上記ＬＥＤ基板と平行である第１電源基板を有し、上記第２ユニットは、上記ＬＥＤ基板と平行である第２電源基板を有する。 In a preferred embodiment of the present invention, the first unit has a first power supply substrate parallel to the LED substrate, and the second unit has a second power supply substrate parallel to the LED substrate. .
　本発明の好ましい実施の形態においては、上記第１および第２ユニットの少なくともいずれかは、上記ＬＥＤ基板の面内方向に長手方向が含まれるように配置された細長状電気部品を有する。 In a preferred embodiment of the present invention, at least one of the first and second units has an elongated electrical component arranged so that the longitudinal direction is included in the in-plane direction of the LED substrate.
　本発明の好ましい実施の形態においては、上記第１および第２電源基板のうち上記細長状電気部品が搭載されているものには、上記細長状電気部品の少なくとも一部を収容する切り欠きが形成されている。 In a preferred embodiment of the present invention, a notch for accommodating at least a part of the elongated electrical component is formed in the first and second power supply boards on which the elongated electrical component is mounted. Has been.
　本発明の好ましい実施の形態においては、上記ＬＥＤ基板を搭載する搭載面と、上記電源部を収容する電源収容部と、上記複数のＬＥＤチップからの光を通過させる出射口と、を有するケースをさらに備える。 In a preferred embodiment of the present invention, there is provided a case having a mounting surface on which the LED substrate is mounted, a power supply accommodating portion that accommodates the power supply portion, and an emission port that allows light from the plurality of LED chips to pass through. Further prepare.
　本発明の好ましい実施の形態においては、上記ケースは、上記出射口が設けられた表面側とは反対側の裏面側に形成された裏面スリットを有する。 In a preferred embodiment of the present invention, the case has a back surface slit formed on the back surface side opposite to the front surface side on which the emission port is provided.
　本発明の好ましい実施の形態においては、上記裏面スリットは、上記ＬＥＤ基板の面内方向において、上記電源収容部とは重ならない位置に設けられている。 In a preferred embodiment of the present invention, the back slit is provided at a position that does not overlap the power supply accommodating portion in the in-plane direction of the LED substrate.
　本発明の好ましい実施の形態においては、上記裏面スリットは、上記ＬＥＤ基板の面内方向において、上記搭載面と重なる位置に設けられている。 In a preferred embodiment of the present invention, the back slit is provided at a position overlapping the mounting surface in the in-plane direction of the LED substrate.
　本発明の好ましい実施の形態においては、上記ケースは、上記表面および裏面をつなぐ側面から内方に延びる内部スリットを有する。 In a preferred embodiment of the present invention, the case has an internal slit extending inward from a side surface connecting the front surface and the back surface.
　本発明の好ましい実施の形態においては、上記内部スリットは、上記ＬＥＤ基板の面内方向において、上記搭載面および上記電源収容部とは重ならない位置に設けられている。 In a preferred embodiment of the present invention, the internal slit is provided at a position that does not overlap the mounting surface and the power supply accommodating portion in the in-plane direction of the LED substrate.
　本発明の好ましい実施の形態においては、上記電源部につながる少なくとも１つのコネクタをさらに備えており、上記ケースには、上記コネクタを収容するコネクタ収容部が形成されている。 In a preferred embodiment of the present invention, at least one connector connected to the power supply unit is further provided, and the case is formed with a connector housing portion for housing the connector.
　本発明の好ましい実施の形態においては、２つの上記コネクタを備えており、上記ケースは、互いに隣接する２つの上記コネクタ収容部を有する。 In a preferred embodiment of the present invention, the two connectors are provided, and the case has two connector housing portions adjacent to each other.
　本発明の好ましい実施の形態においては、上記ケースは平面視矩形状であり、上記２つのコネクタ収容部は、上記ケースの同一の角につながる２辺に沿って配置されており、上記ケースには、上記角に設けられており、かつ上記２つのコネクタ収容部を露出させるケーブル開口をさらに有する。 In a preferred embodiment of the present invention, the case has a rectangular shape in plan view, and the two connector housing portions are arranged along two sides connected to the same corner of the case. And a cable opening provided at the corner and exposing the two connector housing portions.
　本発明の好ましい実施の形態においては、２つの上記コネクタを備えており、上記ケースは平面視円形であり、上記コネクタ収容部は、上記２つのコネクタを互いに平行な配置で収容しており、上記ケースには、上記角に設けられており、かつ上記２つのコネクタ収容部を露出させるケーブル開口をさらに有する。 In a preferred embodiment of the present invention, two connectors are provided, the case is circular in plan view, and the connector housing portion houses the two connectors in a parallel arrangement with each other. The case further includes a cable opening provided at the corner and exposing the two connector housing portions.
　本発明の好ましい実施の形態においては、上記ケースを覆い、かつ上記ＬＥＤチップからの光を出射させる開口を有するカバーをさらに備えており、上記カバーは、その上端が被取付け面に接し、または正対している。 In a preferred embodiment of the present invention, the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip. Against.
　本発明の好ましい実施の形態においては、上記カバーの上記開口を有する面と上記上端を有する面とが斜面部分で連なり、上記斜面部分の外面と上記被取付け面とがなす角は、鈍角である。 In a preferred embodiment of the present invention, the surface of the cover having the opening and the surface having the upper end are connected by a slope portion, and the angle formed by the outer surface of the slope portion and the mounting surface is an obtuse angle. .
　本発明の好ましい実施の形態においては、上記ケースを覆い、かつ上記ＬＥＤチップからの光を出射させる開口を有するカバーをさらに備えており、上記カバーは、上記ケースとともに被取付け面よりも奥方に位置する埋設部と、上記被取付け面に係合する額縁部とを有する。 In a preferred embodiment of the present invention, the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip, and the cover is located behind the mounting surface together with the case. And a frame portion that engages with the mounting surface.
　本発明の好ましい実施の形態においては、上記カバーは、上記開口を囲むリフレクタをさらに有する。 In a preferred embodiment of the present invention, the cover further includes a reflector surrounding the opening.
　このような構成によれば、上記ＬＥＤ照明装置を比較的扁平な形状とすることができる。これにより、天井に開口などを設けることなく上記ＬＥＤ照明装置を取り付けることが可能である。したがって、上記ＬＥＤ照明装置は、取り付け作業が容易である。また、いったん取り付けた後でも、ＬＥＤ照明装置の取り付け位置を比較的簡易な作業によって変更することができる。また、天井に開口を設ける場合であっても、天井の内部に埋設される部分の高さを低くすることができる。これにより、天井の内部に確保すべき設置スペースを縮小することが可能である。 According to such a configuration, the LED illumination device can be made relatively flat. Thereby, it is possible to attach the said LED lighting apparatus, without providing an opening etc. in a ceiling. Therefore, the LED lighting device can be easily attached. Moreover, even after once attaching, the attachment position of an LED lighting apparatus can be changed by a comparatively simple operation | work. Further, even when an opening is provided in the ceiling, the height of the portion embedded in the ceiling can be reduced. Thereby, it is possible to reduce the installation space which should be ensured inside the ceiling.
　本発明のその他の特徴および利点は、添付図面を参照して以下に行う詳細な説明によって、より明らかとなろう。 Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.
本発明の第１実施形態に基づくＬＥＤ照明装置を示す斜視図である。It is a perspective view which shows the LED lighting apparatus based on 1st Embodiment of this invention. 図１に示すＬＥＤ照明装置を示す分解斜視図である。It is a disassembled perspective view which shows the LED lighting apparatus shown in FIG. 図１のＩＩＩ－ＩＩＩ線に沿う断面図である。FIG. 3 is a sectional view taken along line III-III in FIG. 1. 図１に示すＬＥＤ照明装置の表ケースを示す平面図である。It is a top view which shows the front case of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置の表ケースを示す底面図である。It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置の裏ケースを示す平面図である。It is a top view which shows the back case of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置の裏ケースを示す底面図である。It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置の裏ケースおよび電源部を示す平面図である。It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置の裏ケース、電源部、ＬＥＤ基板、およびＬＥＤモジュールを示す平面図である。It is a top view which shows the back case, power supply part, LED board, and LED module of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置のＬＥＤ基板およびＬＥＤモジュールを示す平面図である。It is a top view which shows the LED board and LED module of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置のＬＥＤモジュールを示す平面図である。It is a top view which shows the LED module of the LED lighting apparatus shown in FIG. 図１１のＸＩＩ－ＸＩＩ線に沿う断面図である。FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 図１に示すＬＥＤ照明装置の電源部の第２ユニットを示す平面図である。It is a top view which shows the 2nd unit of the power supply part of the LED lighting apparatus shown in FIG. 図１に示すＬＥＤ照明装置の電源部の第１ユニットを示す平面図である。It is a top view which shows the 1st unit of the power supply part of the LED lighting apparatus shown in FIG. 本発明の第２実施形態に基づくＬＥＤ照明装置を示す斜視図である。It is a perspective view which shows the LED lighting apparatus based on 2nd Embodiment of this invention. 図１５に示すＬＥＤ照明装置を示す分解斜視図である。It is a disassembled perspective view which shows the LED lighting apparatus shown in FIG. 図１５のＸＶＩＩ－ＸＶＩＩ線に沿う断面図である。FIG. 16 is a cross-sectional view taken along line XVII-XVII in FIG. 15. 図１５に示すＬＥＤ照明装置の表ケースを示す平面図である。It is a top view which shows the front case of the LED lighting apparatus shown in FIG. 図１５に示すＬＥＤ照明装置の表ケースを示す底面図である。It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. 図１５に示すＬＥＤ照明装置の裏ケースを示す平面図である。It is a top view which shows the back case of the LED lighting apparatus shown in FIG. 図１５に示すＬＥＤ照明装置の裏ケースを示す底面図である。It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. 図１５に示すＬＥＤ照明装置の裏ケースおよび電源部を示す平面図である。It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. 図１５に示すＬＥＤ照明装置の裏ケース、電源部、ＬＥＤ基板、およびＬＥＤモジュールを示す平面図である。It is a top view which shows the back case, power supply part, LED board, and LED module of the LED lighting apparatus shown in FIG. 本発明の第３実施形態に基づくＬＥＤ照明装置を示す斜視図である。It is a perspective view which shows the LED lighting apparatus based on 3rd Embodiment of this invention. 図２４に示すＬＥＤ照明装置の表ケースを示す平面図である。It is a top view which shows the front case of the LED lighting apparatus shown in FIG. 図２４に示すＬＥＤ照明装置の表ケースを示す底面図である。It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. 図２４に示すＬＥＤ照明装置の裏ケースを示す平面図である。It is a top view which shows the back case of the LED lighting apparatus shown in FIG. 図２４に示すＬＥＤ照明装置の裏ケースを示す底面図である。It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. 図２４に示すＬＥＤ照明装置の裏ケースおよび電源部を示す平面図である。It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. 本発明の第１ないし第３実施形態に基づくＬＥＤ照明装置の変形例を示す斜視図である。It is a perspective view which shows the modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. 本発明の第１ないし第３実施形態に基づくＬＥＤ照明装置の他の変形例を示す側面図である。It is a side view which shows the other modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. 本発明の第１ないし第３実施形態に基づくＬＥＤ照明装置の他の変形例を示す平面図である。It is a top view which shows the other modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. 本発明の第１ないし第３実施形態に基づくＬＥＤ照明装置のさらに他の変形例を示す断面図である。It is sectional drawing which shows the further another modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. 本発明の第４実施形態に基づくＬＥＤ照明装置を示す平面図である。It is a top view which shows the LED lighting apparatus based on 4th Embodiment of this invention. 図３４に示すＬＥＤ照明装置の表ケースを示す平面図である。It is a top view which shows the front case of the LED lighting apparatus shown in FIG. 図３４に示すＬＥＤ照明装置の表ケースを示す底面図である。It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. 図３４に示すＬＥＤ照明装置の裏ケースを示す平面図である。It is a top view which shows the back case of the LED lighting apparatus shown in FIG. 図３４に示すＬＥＤ照明装置の裏ケースを示す底面図である。It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. 図３４に示すＬＥＤ照明装置の裏ケースおよび電源部を示す平面図である。It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. 従来のＬＥＤ照明装置の一例を示す断面図である。It is sectional drawing which shows an example of the conventional LED lighting apparatus.
　以下、本発明の好ましい実施の形態につき、図面を参照して具体的に説明する。 Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.
　図１～図１４は、本発明の第１実施形態に基づくＬＥＤ照明装置を示している。本実施形態のＬＥＤ照明装置Ａ１は、ケース１、ＬＥＤ基板２、複数のＬＥＤモジュール３、電源部４、および透光板５を備えており、たとえば天井６００に取り付けられた状態でダウンライトとして用いられる。なお、図３以外の図においては、透光板５を理解の便宜上省略している。 1 to 14 show an LED illumination device according to the first embodiment of the present invention. The LED lighting device A1 of the present embodiment includes a case 1, an LED substrate 2, a plurality of LED modules 3, a power supply unit 4, and a light-transmitting plate 5, and is used as a downlight in a state of being attached to a ceiling 600, for example. It is done. In the drawings other than FIG. 3, the translucent plate 5 is omitted for the sake of understanding.
　ケース１は、ＬＥＤ基板２、ＬＥＤモジュール３、電源部４、および透光板５を収容している。ケース１は、たとえばアルミ製であり、平面視寸法が９８ｍｍ角程度、高さが１６ｍｍ程度の薄型の直方体形状である。ケース１は、表ケース１Ａおよび裏ケース１Ｂによって構成されている。 The case 1 accommodates the LED substrate 2, the LED module 3, the power supply unit 4, and the translucent plate 5. The case 1 is made of, for example, aluminum and has a thin rectangular parallelepiped shape with a plan view dimension of about 98 mm square and a height of about 16 mm. Case 1 is constituted by front case 1A and back case 1B.
　図４および図５に示すように、表ケース１Ａには、出射口１１、第１電源収容凹部１３１Ａ、および第２電源収容凹部１３２Ａが形成されている。出射口１１は、表ケース１Ａのほぼ中央に形成されており、ＬＥＤモジュール３からの光をケース１の外部に出射させるためのものである。出射口１１の直径はたとえば５０ｍｍである。図３に示すように、出射口１１は、表ケース１Ａの表側から若干内方に後退した部分に形成されている。図５に示すように、第１電源収容凹部１３１Ａと第２電源収容凹部１３２Ａとは、表ケース１Ａの対角線方向において出射口１１を挟んで互いに反対側に配置されている。第１電源収容凹部１３１Ａおよび第２電源収容凹部１３２Ａは、いずれも５つの直線部で規定された形状（六角形の一辺を欠いた形状）とされており、その深さは５．６ｍｍ程度である。 As shown in FIGS. 4 and 5, the front case 1A is formed with an emission port 11, a first power supply accommodating recess 131A, and a second power supply accommodating recess 132A. The emission port 11 is formed substantially at the center of the front case 1 </ b> A, and is for emitting light from the LED module 3 to the outside of the case 1. The diameter of the emission port 11 is 50 mm, for example. As shown in FIG. 3, the emission port 11 is formed in a portion slightly retracted inward from the front side of the front case 1 </ b> A. As shown in FIG. 5, the first power supply receiving recess 131 </ b> A and the second power supply receiving recess 132 </ b> A are arranged on opposite sides of the emission port 11 in the diagonal direction of the front case 1 </ b> A. Each of the first power supply recess portion 131A and the second power supply recess portion 132A has a shape defined by five straight portions (a shape lacking one side of the hexagon), and its depth is about 5.6 mm. is there.
　図６および図７に示すように、裏ケース１Ｂには、複数の裏面スリット１４、第１電源収容凹部１３１Ｂ、および第２電源収容凹部１３２Ｂが形成されている。図２に示すように、裏ケース１Ｂは、そのほぼ中央に、ＬＥＤ基板２を搭載するための搭載台１２を有している。搭載台１２は平面視略正方形状であり、搭載面１２ａを有している。第１電源収容凹部１３１Ｂと第２電源収容凹部１３２Ｂとは、裏ケース１Ｂの対角線方向において搭載台１２を挟んで互いに反対側に配置されている。第１電源収容凹部１３１Ｂおよび第２電源収容凹部１３２Ｂは、いずれも略六角形状とされており、その深さは７．４ｍｍ程度である。裏面スリット１４は、裏ケース１Ｂにおける、搭載台１２、第１電源収容凹部１３１Ｂ、および第２電源収容凹部１３２Ｂが形成された面とは反対側の面に形成されている。本実施形態においては、裏面スリット１４は、平面視において搭載台１２、第１電源収容凹部１３１Ｂ、および第２電源収容凹部１３２Ｂとは重ならない位置に形成されている。各裏面スリット１４は、裏ケース１Ｂの対角線方向に延びており、幅が１．５ｍｍ程度、深さが５ｍｍ程度である。 As shown in FIGS. 6 and 7, the back case 1B is formed with a plurality of back slits 14, first power supply recesses 131B, and second power supply recesses 132B. As shown in FIG. 2, the back case 1 </ b> B has a mounting base 12 for mounting the LED substrate 2 at substantially the center thereof. The mounting base 12 has a substantially square shape in plan view and has a mounting surface 12a. The first power supply receiving recess 131B and the second power supply receiving recess 132B are arranged on opposite sides of the mounting base 12 in the diagonal direction of the back case 1B. The first power supply receiving recess 131B and the second power supply receiving recess 132B are both substantially hexagonal and have a depth of about 7.4 mm. The back slit 14 is formed on the surface of the back case 1B opposite to the surface on which the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B are formed. In the present embodiment, the back slit 14 is formed at a position that does not overlap with the mounting base 12, the first power supply receiving recess 131 </ b> B, and the second power supply receiving recess 132 </ b> B in plan view. Each back slit 14 extends in the diagonal direction of the back case 1B, and has a width of about 1.5 mm and a depth of about 5 mm.
　図２に示すように、ケース１は、表ケース１Ａと裏ケース１Ｂとを互いに重ね合わせて接合することにより構成されている。図２および図３からわかるように、表ケース１Ａの第１電源収容凹部１３１Ａと裏ケース１Ｂの第１電源収容凹部１３１Ｂとの結合によって第１電源収容部１３１が形成され、表ケース１Ａの第２電源収容凹部１３２Ａと裏ケース１Ｂの第２電源収容凹部１３２Ｂとの結合によって第２電源収容部１３２が構成される。 As shown in FIG. 2, the case 1 is configured by superposing and joining a front case 1A and a back case 1B. As can be seen from FIGS. 2 and 3, the first power supply accommodating portion 131 is formed by the combination of the first power supply accommodating recess 131A of the front case 1A and the first power supply recess 131B of the back case 1B. The second power supply accommodating portion 132 is configured by coupling the two power supply accommodating recesses 132A and the second power supply accommodating recess 132B of the back case 1B.
　複数のＬＥＤモジュール３はＬＥＤ基板２に実装されている。図１０に示すように、ＬＥＤ基板２は、基材２１、および基材２１上に形成された配線パターン２２からなる。基材２１は、たとえば高熱伝導率のフィラーが混入されることにより比較的熱伝導率が良好とされたガラスエポキシ樹脂によって形成される。配線パターン２２は、複数のＬＥＤモジュール３を互いに導通させるためのものである。複数のＬＥＤモジュール３は、たとえば直径５０～６０ｍｍ程度の略円形の領域内に実装される。 A plurality of LED modules 3 are mounted on the LED substrate 2. As shown in FIG. 10, the LED substrate 2 includes a base material 21 and a wiring pattern 22 formed on the base material 21. The base material 21 is made of, for example, a glass epoxy resin having a relatively good thermal conductivity by mixing a filler having a high thermal conductivity. The wiring pattern 22 is for electrically connecting the plurality of LED modules 3 to each other. The plurality of LED modules 3 are mounted in a substantially circular region having a diameter of about 50 to 60 mm, for example.
　図１１および図１２に示すように、各ＬＥＤモジュール３は、ＬＥＤチップ３１、樹脂パッケージ３２、基板３３、および１対の実装端子３４を備えている。ＬＥＤモジュール３は、幅が０．８ｍｍ、長さが１．６ｍｍ、厚さが０．５ｍｍ程度の小型かつ非常に薄型のＬＥＤモジュールである。 11 and 12, each LED module 3 includes an LED chip 31, a resin package 32, a substrate 33, and a pair of mounting terminals 34. The LED module 3 is a small and very thin LED module having a width of 0.8 mm, a length of 1.6 mm, and a thickness of about 0.5 mm.
　基板３３は、たとえばガラスエポキシ樹脂からなる平面視略矩形状の絶縁基板である。ＬＥＤチップ３１は基板３３の表面に搭載されており、１対の実装端子３４は基板３３の裏面に形成されている。基板３３の厚さは、０．０８～０．１ｍｍ程度である。ＬＥＤチップ３１は、ＬＥＤモジュール３の光源であり、たとえば可視光を出射可能である。樹脂パッケージ３２は、ＬＥＤチップ３１を保護する。樹脂パッケージ３２は、たとえばエポキシ樹脂等の、ＬＥＤチップ３１からの光を透過する樹脂を成形することによって形成される。あるいは、樹脂パッケージ３２は、ＬＥＤチップ３１からの光によって励起されると異なる波長の光を発する蛍光物質を含む透光樹脂を成形することによって形成してもよい。たとえば、ＬＥＤチップ３１からの青色光と、樹脂パッケージ３２に含まれる蛍光物質からの黄色光とを混合することにより、ＬＥＤモジュール３は、白色光を出射することができる。黄色光を発する蛍光物質に代えて、赤色光を発する蛍光物質と緑色光を発する蛍光物質とを混合して用いてもよい。 The substrate 33 is an insulating substrate having a substantially rectangular shape in plan view made of, for example, glass epoxy resin. The LED chip 31 is mounted on the front surface of the substrate 33, and a pair of mounting terminals 34 are formed on the back surface of the substrate 33. The thickness of the substrate 33 is about 0.08 to 0.1 mm. The LED chip 31 is a light source of the LED module 3 and can emit visible light, for example. The resin package 32 protects the LED chip 31. The resin package 32 is formed by molding a resin that transmits light from the LED chip 31, such as an epoxy resin. Alternatively, the resin package 32 may be formed by molding a translucent resin containing a fluorescent material that emits light of a different wavelength when excited by light from the LED chip 31. For example, the LED module 3 can emit white light by mixing blue light from the LED chip 31 and yellow light from the fluorescent material included in the resin package 32. Instead of the fluorescent substance that emits yellow light, a fluorescent substance that emits red light and a fluorescent substance that emits green light may be mixed and used.
　本実施形態においては、６０３個のＬＥＤモジュール３が、ＬＥＤ基板２上に千鳥状に配置されている。ＬＥＤモジュール３を発光させるには、各ＬＥＤチップ３１に電圧Ｖｆが３．０Ｖ程度、電流Ｉｆが４．０ｍＡ程度印加される。それぞれが点光源として機能する複数のＬＥＤモジュール３を高密度に実装することにより、当該ＬＥＤモジュール３が実装された領域は面状光源部を構成している。 In the present embodiment, 603 LED modules 3 are arranged on the LED substrate 2 in a staggered manner. In order to cause the LED module 3 to emit light, a voltage Vf of about 3.0 V and a current If of about 4.0 mA are applied to each LED chip 31. By mounting a plurality of LED modules 3 each functioning as a point light source at a high density, the area in which the LED modules 3 are mounted constitutes a planar light source unit.
　図２、図３および図９に示すように、ＬＥＤ基板２は、裏ケース１Ｂの搭載台１２に取り付けられる。具体的には、ＬＥＤ基板２おける、ＬＥＤモジュール３を支持している面とは反対側の面が、搭載台１２の搭載面１２ａに取り付けられる。図１に示すように、ＬＥＤモジュール３は、開口１１を介して外部に臨んでいる。 As shown in FIG. 2, FIG. 3 and FIG. 9, the LED substrate 2 is attached to the mounting base 12 of the back case 1B. Specifically, the surface of the LED substrate 2 opposite to the surface supporting the LED module 3 is attached to the mounting surface 12 a of the mounting base 12. As shown in FIG. 1, the LED module 3 faces the outside through the opening 11.
　電源部４は、たとえば商用の交流１００Ｖ電力を直流２４Ｖ電力に変換し、複数のＬＥＤモジュール３に供給する。本実施形態においては、電源部４は、図１４に示すような第１ユニット４１および図１３に示すような第２ユニット４２によって構成されている。 The power supply unit 4 converts, for example, commercial AC 100V power into DC 24V power, and supplies it to the plurality of LED modules 3. In the present embodiment, the power supply unit 4 includes a first unit 41 as shown in FIG. 14 and a second unit 42 as shown in FIG.
　図１４に示すように、第１ユニット４１は、第１電源基板４１１および複数の電気部品４１２からなる。第１電源基板４１１は、平面視略矩形状であり、たとえばガラスエポキシ樹脂からなる。第１電源基板４１１には、切り欠き４１１ａが形成されている。複数の電気部品４１２は、電源部４の機能を実現するための構成部品である。複数の電気部品４１２のうち、電気部品４１２Ａは、コンデンサである。コンデンサ４１２Ａは本体４１２Ａａおよびリード４１２Ａｂを有する。本体４１２Ａａは、細長の円柱形状である。リード４１２Ａｂは、本体４１２Ａａから突出している。本実施形態においては、本体４１２Ａａは、その長軸が第１電源基板４１１と平行に延びるように実装されており、その一部が切り欠き４１１ａに収容されている。図３に示すように、リード４１２Ａｂは略直角に折り曲げられており、その先端が、たとえばハンダ付けによって、第１電源基板４１１に接合されている。電気部品４１２Ａは、本発明で言う細長状電気部品の一例である。図１４に示す電気部品４１２Ｂは、サージアブソーバであり、過大な電圧から他の電気部品４１２，４２２を保護する機能を果たす。 As shown in FIG. 14, the first unit 41 includes a first power supply board 411 and a plurality of electrical components 412. The first power supply substrate 411 has a substantially rectangular shape in plan view, and is made of, for example, a glass epoxy resin. A cutout 411 a is formed in the first power supply substrate 411. The plurality of electrical components 412 are components for realizing the function of the power supply unit 4. Of the plurality of electrical components 412, the electrical component 412A is a capacitor. The capacitor 412A has a main body 412Aa and a lead 412Ab. The main body 412Aa has an elongated cylindrical shape. The lead 412Ab protrudes from the main body 412Aa. In the present embodiment, the main body 412Aa is mounted such that its long axis extends in parallel with the first power supply substrate 411, and a part thereof is accommodated in the notch 411a. As shown in FIG. 3, the lead 412Ab is bent at a substantially right angle, and the tip thereof is joined to the first power supply substrate 411 by soldering, for example. The electrical component 412A is an example of an elongated electrical component referred to in the present invention. An electrical component 412B shown in FIG. 14 is a surge absorber and functions to protect other electrical components 412 and 422 from an excessive voltage.
　図１３に示すように、第２ユニット４２は、第２電源基板４２１および複数の電気部品４２２からなる。第２電源基板４２１は、平面視略六角形状であり、たとえばガラスエポキシ樹脂からなる。複数の電気部品４２２のうち、電気部品４２２Ａはコイルであり、電気部品４２２Ｂはスイッチング用途に用いられるパワーＭＯＳＦＥＴであり、電気部品４２２Ｃは、ＬＥＤモジュール３を駆動するためのドライバＩＣである。 As shown in FIG. 13, the second unit 42 includes a second power supply board 421 and a plurality of electrical components 422. Second power supply substrate 421 has a substantially hexagonal shape in plan view, and is made of, for example, glass epoxy resin. Of the plurality of electrical components 422, the electrical component 422A is a coil, the electrical component 422B is a power MOSFET used for switching purposes, and the electrical component 422C is a driver IC for driving the LED module 3.
　図２、図３および図８に示すように、第１ユニット４１および第２ユニット４２は、ケース１の第１電源収容部１３１及び第２電源収容部１３２にそれぞれ収容されている。したがって、第１ユニット４１及び第２ユニット４２は、複数のＬＥＤモジュール３（搭載台１２）を挟んでケース１の対角線方向において互いに反対側に配置されている。 As shown in FIGS. 2, 3, and 8, the first unit 41 and the second unit 42 are accommodated in the first power supply accommodating portion 131 and the second power supply accommodating portion 132 of the case 1, respectively. Therefore, the first unit 41 and the second unit 42 are arranged on opposite sides in the diagonal direction of the case 1 with the plurality of LED modules 3 (mounting base 12) interposed therebetween.
　透光板５は、半透明、もしくは透明なガラス板からなり、ＬＥＤモジュール３からの光を透過させる。図３に示すように、透光板５は、開口１１とＬＥＤ基板２との間に設けられている。 The translucent plate 5 is made of a translucent or transparent glass plate and transmits light from the LED module 3. As shown in FIG. 3, the translucent plate 5 is provided between the opening 11 and the LED substrate 2.
　次に、ＬＥＤ照明装置Ａ１の作用について説明する。 Next, the operation of the LED lighting device A1 will be described.
　本実施形態によれば、電源部４が複数のＬＥＤモジュール３に対してＬＥＤ基板２の面内方向に並んで配置されている。このような配置により、ＬＥＤ照明装置Ａ１を、平面視サイズ９８ｍｍ角程度、高さ１６ｍｍ程度の非常に扁平な形状にすることができる。したがって、図３に示すように、ＬＥＤ照明装置Ａ１は、天井６００に開口などを設けることなく取り付けることが可能である。したがって、ＬＥＤ照明装置Ａ１の取り付け作業は容易に行うことができる。また、いったん取り付けた後でも、ＬＥＤ照明装置Ａ１の取り付け位置を比較的簡易な作業によって変更することができる。 According to the present embodiment, the power supply unit 4 is arranged side by side in the in-plane direction of the LED substrate 2 with respect to the plurality of LED modules 3. With such an arrangement, the LED lighting device A1 can be formed into a very flat shape having a size of about 98 mm square in plan view and a height of about 16 mm. Therefore, as shown in FIG. 3, the LED lighting device A1 can be attached without providing an opening or the like in the ceiling 600. Therefore, the mounting operation of the LED lighting device A1 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A1 can be changed by a comparatively simple operation | work.
　電源部４を、第１ユニット４１および第２ユニット４２によって構成することにより、電源部４を、複数のＬＥＤモジュール３を挟むように、平面視において比較的コンパクトに配置することが可能である。これは、ＬＥＤ照明装置Ａ１の小型化に資する。 By configuring the power supply unit 4 with the first unit 41 and the second unit 42, the power supply unit 4 can be disposed relatively compactly in plan view so as to sandwich the plurality of LED modules 3. This contributes to downsizing of the LED lighting device A1.
　細長である電気部品４１２Ａを第１電源基板４１１に対して平行に配置することにより、ＬＥＤ照明装置Ａ１の高さを小さくすることができる。第１電源基板４１１の切り欠き４１１ａに電気部品４１２Ａの一部を収容することにより、ＬＥＤ照明装置Ａ１の小型化をさらに促進することができる。 By disposing the elongated electrical component 412A in parallel to the first power supply substrate 411, the height of the LED lighting device A1 can be reduced. By accommodating a part of the electrical component 412A in the notch 411a of the first power supply board 411, the downsizing of the LED lighting device A1 can be further promoted.
　複数のＬＥＤモジュール３から発生した熱は、搭載台１２へと速やかに伝達される。これにより、複数のＬＥＤモジュール３が高温によって劣化してしまうことを回避することができる。裏ケース１Ｂの裏面スリット１４は、搭載台１２に伝えられた熱を、外部へと放散するのに好適である。特に、ＬＥＤ照明装置Ａ１が天井６００に取り付けられた際、裏面スリット１４は、天井６００と裏ケース１Ｂとの間に外気を導入する機能を果たす。これは、効率的な放熱に資する。 The heat generated from the plurality of LED modules 3 is quickly transmitted to the mounting table 12. Thereby, it can avoid that the some LED module 3 deteriorates by high temperature. The back slit 14 of the back case 1B is suitable for dissipating the heat transmitted to the mounting base 12 to the outside. In particular, when the LED lighting device A1 is attached to the ceiling 600, the back slit 14 functions to introduce outside air between the ceiling 600 and the back case 1B. This contributes to efficient heat dissipation.
　裏面スリット１４は、平面視において、第１電源収容凹部１３１Ｂおよび第２電源収容凹部１３２Ｂとは重ならない位置に設けられている。裏面スリット１４を平面視において第１電源収容凹部１３１Ｂ及び第２電源収容凹部１３２Ｂと重なる位置に形成しようとすると、裏ケース１Ｂはそれだけ大きな厚みを有する必要があり、ＬＥＤ照明装置Ａ１の高さの増加につながる。裏面スリット１４が第１電源収容凹部１３１Ｂおよび第２電源収容凹部１３２Ｂとは重ならない本実施例の構成は、ＬＥＤ照明装置Ａ１の高さを小さくするのに適している。 The back slit 14 is provided at a position that does not overlap the first power supply recess 131B and the second power supply recess 132B in plan view. If the back slit 14 is to be formed at a position overlapping the first power supply recess 131B and the second power supply recess 132B in plan view, the back case 1B needs to have a large thickness, and the height of the LED lighting device A1 is high. Leads to an increase. The configuration of the present embodiment in which the rear slit 14 does not overlap the first power supply receiving recess 131B and the second power supply receiving recess 132B is suitable for reducing the height of the LED lighting device A1.
　図１５～図２３は、本発明の第２実施形態に基づくＬＥＤ照明装置を示している。本実施形態のＬＥＤ照明装置Ａ２は、内部スリット１５を有している点および裏面スリット１４の配置が上述した実施形態とは異なっている。なお、これらの図において、上記実施形態と同一または類似の要素には、上記実施形態と同一の符号を付している。 15 to 23 show an LED lighting device according to the second embodiment of the present invention. The LED lighting device A2 of the present embodiment is different from the above-described embodiment in that it has an internal slit 15 and the arrangement of the back slit 14. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.
　図１５に示すように、ケース１には、ケース１の側面から内部に向かって延びる複数の内部スリット１５が形成されている。図１９に示すように、表ケース１Ａには、複数の半スリット１５Ａが形成されている。半スリット１５Ａは、開口１１、第１電源収容凹部１３１Ａおよび第２電源収容凹部１３２Ａを避けた位置に設けられている。半スリット１５Ａは、表ケース１Ａの対角線方向において開口１１の両側に分割して配置されている。各半スリット１５Ａは、幅が２．５ｍｍ程度、深さが４．６ｍｍ程度である。図２０に示すように、裏ケース１Ｂには、複数の半スリット１５Ｂが形成されている。半スリット１５Ｂは、裏ケース１Ｂにおける、搭載台１２、第１電源収容凹部１３１Ｂおよび第２電源収容凹部１３２Ｂを避けた位置に設けられている。半スリット１５Ｂは、裏ケース１Ｂの対角線方向において搭載台１２の両側に分割して配置されている。各半スリット１５Ｂは、幅が２．５ｍｍ程度、深さが５ｍｍ程度である。 As shown in FIG. 15, the case 1 is formed with a plurality of internal slits 15 extending from the side surface of the case 1 toward the inside. As shown in FIG. 19, a plurality of half slits 15A are formed in the front case 1A. The half slit 15A is provided at a position avoiding the opening 11, the first power supply accommodating recess 131A, and the second power supply accommodating recess 132A. The half slits 15A are divided and arranged on both sides of the opening 11 in the diagonal direction of the front case 1A. Each half slit 15A has a width of about 2.5 mm and a depth of about 4.6 mm. As shown in FIG. 20, a plurality of half slits 15B are formed in the back case 1B. The half slit 15B is provided at a position on the back case 1B away from the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B. The half slits 15B are divided and arranged on both sides of the mounting base 12 in the diagonal direction of the back case 1B. Each half slit 15B has a width of about 2.5 mm and a depth of about 5 mm.
　図１５、図１６、図１９および図２０から理解されるように、半スリット１５Ａと半スリット１５Ｂとは、表ケース１Ａと裏ケース１Ｂとを合体させた時に、重なり合うように構成されている。半スリット１５Ａと半スリット１５Ｂとの結合によって、内部スリット１５が構成される。 As can be understood from FIGS. 15, 16, 19, and 20, the half slit 15A and the half slit 15B are configured to overlap when the front case 1A and the back case 1B are combined. The internal slit 15 is configured by the combination of the half slit 15A and the half slit 15B.
　図２１に示すように、本実施形態においては、裏面スリット１４が、搭載台１２の裏面にも形成されている。すべての裏面スリット１４は、裏ケース１Ｂの対角線方向に延びる。 As shown in FIG. 21, in the present embodiment, the back surface slit 14 is also formed on the back surface of the mounting table 12. All the back slits 14 extend in the diagonal direction of the back case 1B.
　本実施形態によっても、天井６００に開口などを設けることなくＬＥＤ照明装置Ａ２を取り付けることが可能である。したがって、ＬＥＤ照明装置Ａ２の取り付け作業は容易に行うことができる。また、いったん取り付けた後でも、ＬＥＤ照明装置Ａ２の取り付け位置を比較的簡易な作業によって変更することができる。 Also according to this embodiment, it is possible to attach the LED lighting device A2 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A2 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A2 can be changed by a comparatively simple operation | work.
　また、内部スリット１５を設けることにより、外部への放熱をさらに促進することができる。内部スリット１５は、搭載台１２および電源部４を避けた位置に設けられているため、ＬＥＤ照明装置Ａ２の高さを大きくすることなく放熱を促進することができる。搭載台１２の裏側に裏面スリット１４を設けたことによっても、搭載台１２に伝わった熱をより効率良く放散させることができる。 Also, by providing the internal slit 15, heat radiation to the outside can be further promoted. Since the internal slit 15 is provided at a position that avoids the mounting base 12 and the power supply unit 4, heat dissipation can be promoted without increasing the height of the LED lighting device A <b> 2. By providing the back surface slit 14 on the back side of the mounting table 12, the heat transmitted to the mounting table 12 can be dissipated more efficiently.
　図２４～図２９は、本発明の第３実施形態に基づくＬＥＤ照明装置を示している。本実施形態のＬＥＤ照明装置Ａ３は、２つのコネクタ４３が設けられている点、及び、ケース１に２つのコネクタ収容部１３３が形成されている点が上述した実施形態と異なっている。 24 to 29 show an LED illumination device according to the third embodiment of the present invention. The LED lighting device A3 of the present embodiment is different from the above-described embodiment in that two connectors 43 are provided and two connector housings 133 are formed in the case 1.
　図２５に示すように、本実施形態の表ケース１Ａは、表面側から見た際には、上述した実施形態の表ケース１Ａと同様の形状を有する。図２６に示すように、表ケース１Ａには、２つのコネクタ収容凹部１３３Ａが形成されている。各コネクタ収容凹部１３３Ａは、図２９に示すコネクタ４３をちょうど収容する大きさを有する。２つのコネクタ収容凹部１３３Ａは、表ケース１Ａにおける１つの角部を形成している２つの辺に沿って、当該角部の近傍に配置されている。 As shown in FIG. 25, the front case 1A of the present embodiment has the same shape as the front case 1A of the above-described embodiment when viewed from the front side. As shown in FIG. 26, two connector housing recesses 133A are formed in the front case 1A. Each connector housing recess 133A has a size that just houses the connector 43 shown in FIG. The two connector housing recesses 133A are arranged in the vicinity of the corners along two sides forming one corner of the front case 1A.
　図２７に示すように、裏ケース１Ｂには、２つのコネクタ収容凹部１３３Ｂが形成されている。各コネクタ収容凹部１３３Ｂは、図２９に示すコネクタ４３をちょうど収容する大きさを有する。２つのコネクタ収容凹部１３３Ｂは、裏ケース１Ｂにおける１つの角部を形成している２つの辺に沿って、当該角部の近傍に配置されている。 As shown in FIG. 27, two connector housing recesses 133B are formed in the back case 1B. Each connector housing recess 133B has a size that just houses the connector 43 shown in FIG. The two connector housing recesses 133B are arranged in the vicinity of the corners along two sides forming one corner of the back case 1B.
　各コネクタ収容部１３３は、コネクタ収容凹部１３３Ａとコネクタ収容凹部１３３Ｂとを結合することにより構成されている。図２４に示すように、ケース１には、さらにケーブル開口１６が形成されている。ケーブル開口１６は、２つのコネクタ凹部１３３Ａ及び１３３Ｂを露出させており、外部からのケーブル７００をコネクタ収容部１３３内のコネクタ４３に接続することを可能にしている。 Each connector accommodating part 133 is comprised by combining the connector accommodating recessed part 133A and the connector accommodating recessed part 133B. As shown in FIG. 24, a cable opening 16 is further formed in the case 1. The cable opening 16 exposes the two connector recesses 133 </ b> A and 133 </ b> B, and allows the cable 700 from the outside to be connected to the connector 43 in the connector housing portion 133.
　図２９に示すように、本実施形態におけるＬＥＤ基板２および電源部４は、図９に示したものと同様に配置される。各コネクタ４３はコネクタ収容凹部１３３Ｂ（コネクタ収容部１３３）に収容され、ケーブル４４を介して電源部４（第１ユニット４１又は第２ユニット４２）に接続されている。 As shown in FIG. 29, the LED substrate 2 and the power supply unit 4 in the present embodiment are arranged in the same manner as shown in FIG. Each connector 43 is housed in a connector housing recess 133 </ b> B (connector housing portion 133), and is connected to the power supply unit 4 (first unit 41 or second unit 42) via a cable 44.
　本実施形態によっても、天井６００に開口などを設けることなくＬＥＤ照明装置Ａ３を取り付けることが可能である。したがって、ＬＥＤ照明装置Ａ３の取り付け作業は容易に行うことができる。また、本実施形態のＬＥＤ照明装置Ａ３では、ケーブル７００を装置の側方から差し込むことができる。このため、ケーブル７００を天井６００に沿わせることが可能であり、ケーブル７００を通すための穴を天井６００に形成する必要が無い。 Also according to this embodiment, it is possible to attach the LED lighting device A3 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A3 can be easily performed. Moreover, in LED lighting apparatus A3 of this embodiment, the cable 700 can be inserted from the side of an apparatus. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to form a hole in the ceiling 600 for passing the cable 700.
　図３０は、ＬＥＤ照明装置Ａ１～Ａ３の変形例を示している。この変形例においては、ＬＥＤ照明装置Ａ１～Ａ３を収容するカバー５１をさらに備えている。カバー５１は、全体として平面視矩形状で比較的高さの低い箱状である。カバー５１には、ＬＥＤモジュール３からの光を通す円形の開口５１ａが形成されている。カバー５１の上端縁は、天井６００に接するか、あるいはわずかな隙間を隔てて正対するように構成されている。カバー５１は、開口５１ａが形成された平面部分と、この平面部分を囲む４つの斜面部分を有している。斜面部分の外面と天井６００とは鈍角をなす。本実施形態においては、この鈍角は１３５度程度である。このような変形例によれば、放熱効果を促進するための裏面スリット１４などが外部から見えない。したがって、本変形例によるＬＥＤ照明装置は、カバーを備えないＬＥＤ照明装置に比べて、天井６００の外観をより良いものにすることができる。 FIG. 30 shows a modification of the LED lighting devices A1 to A3. In this modification, a cover 51 is further provided for housing the LED lighting devices A1 to A3. The cover 51 as a whole has a rectangular shape in plan view and a box shape with a relatively low height. The cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes. The upper end edge of the cover 51 is configured to contact the ceiling 600 or to face each other with a slight gap. The cover 51 has a flat surface portion in which the opening 51a is formed and four slope portions surrounding the flat surface portion. The outer surface of the slope portion and the ceiling 600 form an obtuse angle. In the present embodiment, this obtuse angle is about 135 degrees. According to such a modification, the back slit 14 and the like for promoting the heat dissipation effect cannot be seen from the outside. Therefore, the LED illumination device according to this modification can make the appearance of the ceiling 600 better than the LED illumination device that does not include a cover.
　図３１および図３２は、ＬＥＤ照明装置Ａ１～Ａ３の他の変形例を示している。この変形例においては、ＬＥＤ照明装置Ａ１～Ａ３を収容するカバー５１と、金具５２とをさらに備えている。カバー５１には、ＬＥＤモジュール３からの光を通す円形の開口５１ａが形成されている。カバー５１は、埋設部５１ｂ及び額縁部５１ｃを有している。埋設部５１ｂは、ＬＥＤ照明装置Ａ１～Ａ３を囲んでいる。埋設部５１ｂは、天井６００の内部に埋め込まれる部分である。額縁部５１ｃは平面視矩形のフレーム状であり、埋設部５１ｂの周縁につながっている。額縁部５１ｃは、天井６００の表面に係合する部分である。金具５２は、帯状の金属板を折り曲げ加工することによって形成されており、天井６００からカバー５１が抜け出ることを防止する。 31 and 32 show other modified examples of the LED illumination devices A1 to A3. In this modification, a cover 51 that houses the LED lighting devices A1 to A3 and a metal fitting 52 are further provided. The cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes. The cover 51 has an embedded portion 51b and a frame portion 51c. The embedded portion 51b surrounds the LED lighting devices A1 to A3. The embedded part 51 b is a part embedded in the ceiling 600. The frame portion 51c has a rectangular frame shape in plan view, and is connected to the periphery of the embedded portion 51b. The frame portion 51 c is a portion that engages with the surface of the ceiling 600. The metal fitting 52 is formed by bending a band-shaped metal plate, and prevents the cover 51 from coming off from the ceiling 600.
　ＬＥＤ照明装置Ａ１～Ａ３は、上述したとおり比較的高さが低く、天井６００に埋め込まれる埋設部５１ｂの高さは、従来のダウンライトと比べると顕著に小さい。このため、ＬＥＤ照明装置を収容するために大きなスペースを天井６００の内部に確保する必要は無い。したがって、同じ高さの建築物であっても、床面（図示略）と天井６００との間に、より大きな距離を確保することができる。 As described above, the LED lighting devices A1 to A3 are relatively low in height, and the height of the embedded portion 51b embedded in the ceiling 600 is significantly smaller than that of a conventional downlight. For this reason, it is not necessary to ensure a large space inside the ceiling 600 in order to accommodate the LED lighting device. Therefore, even if the buildings have the same height, a larger distance can be ensured between the floor (not shown) and the ceiling 600.
　図３３は、ＬＥＤ照明装置Ａ１～Ａ３の他の変形例を示している。この変形例においては、カバー５１にリフレクタ５１ｄが設けられている点が、上述した変形例と異なっている。リフレクタ５１ｄは、パラボラ状であり、複数のＬＥＤモジュール３からの光の指向性を高める。また、リフレクタ５１ｄとＬＥＤ照明装置Ａ１～Ａ３の間には、透光板５３が配置されている。透光板５３は、たとえばアクリル樹脂からなる。 FIG. 33 shows another modification of the LED lighting devices A1 to A3. This modification differs from the above-described modification in that a reflector 51d is provided on the cover 51. The reflector 51d has a parabolic shape and enhances the directivity of light from the plurality of LED modules 3. Further, a translucent plate 53 is disposed between the reflector 51d and the LED lighting devices A1 to A3. The translucent plate 53 is made of, for example, acrylic resin.
　このような変形例によるＬＥＤ照明装置は、より指向性が高められた光を出射可能であり、たとえば床面のより狭い領域に集中的に光を照射することができる。また、リフレクタ５１ｄを備えているものの、従来のダウンライトと比べると依然として高さが顕著に低い。このため、天井６００の内部に大きな収容スペースを確保する必要が無い。 The LED illumination device according to such a modification can emit light with higher directivity, and can irradiate light intensively to a narrower area of the floor surface, for example. Although the reflector 51d is provided, the height is still significantly lower than the conventional downlight. For this reason, it is not necessary to secure a large accommodation space inside the ceiling 600.
　図３４～図３９は、本発明の第４実施形態に基づくＬＥＤ照明装置を示している。本実施形態のＬＥＤ照明装置Ａ４は、平面視が円形状である点が上述した実施形態と異なっている。図３４～図３８に示すように、表ケース１Ａおよび裏ケース１Ｂも平面視円形状である。本実施形態においては、第１電源収容部１３１と第２電源収容部１３２とは、ケース１の周方向に９０度ずれた位置に設けられている。図３９に示すように、コネクタ収容部１３３は、２つのコネクタ４３を並列に収容している。 34 to 39 show an LED illumination device according to the fourth embodiment of the present invention. The LED lighting device A4 of this embodiment is different from the above-described embodiment in that the planar view is circular. As shown in FIGS. 34 to 38, the front case 1A and the back case 1B are also circular in plan view. In the present embodiment, the first power supply accommodating portion 131 and the second power supply accommodating portion 132 are provided at positions shifted by 90 degrees in the circumferential direction of the case 1. As shown in FIG. 39, the connector housing part 133 houses two connectors 43 in parallel.
　本実施形態によっても、天井６００に開口などを設けることなくＬＥＤ照明装置Ａ４を取り付けることが可能である。したがって、取り付け作業を容易に行うことができる。また、ＬＥＤ照明装置Ａ４においても、装置の側方からケーブル７００を差し込むことが可能である。このため、ケーブル７００を天井６００に沿わせることが可能であり、ケーブル７００を通すための穴を天井６００に設ける必要が無い。なお、図３１～図３３に示す変形例を本実施形態のＬＥＤ照明装置Ａ４に適用してもよい。 Also according to this embodiment, it is possible to attach the LED lighting device A4 without providing an opening or the like in the ceiling 600. Therefore, attachment work can be performed easily. Also in the LED lighting device A4, the cable 700 can be inserted from the side of the device. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to provide a hole in the ceiling 600 for passing the cable 700. Note that the modifications shown in FIGS. 31 to 33 may be applied to the LED illumination device A4 of the present embodiment.
　本発明に係るＬＥＤ照明装置は、上述した実施形態に限定されるものではない。本発明に係るＬＥＤ照明装置の各部の具体的な構成は、種々に設計変更可能である。 The LED lighting device according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the LED lighting device according to the present invention can be variously modified.

Claims (20)

  1. 　複数のＬＥＤチップを備えるＬＥＤ照明装置であって、
    　上記複数のＬＥＤチップを支持するＬＥＤ基板と、
    　上記複数のＬＥＤチップに電力供給し、かつ上記ＬＥＤ基板の面内方向において上記ＬＥＤ基板と重ならない部分を有する電源部と、
    を備えることを特徴とする、ＬＥＤ照明装置。     An LED lighting device comprising a plurality of LED chips,
    An LED substrate that supports the plurality of LED chips;
    A power supply unit that supplies power to the plurality of LED chips and has a portion that does not overlap the LED substrate in an in-plane direction of the LED substrate;
    An LED lighting device comprising:
  2. 　上記電源部は、第１および第２ユニットを含む、請求項１に記載のＬＥＤ照明装置。 The LED power unit according to claim 1, wherein the power supply unit includes first and second units.
  3. 　上記第１および第２ユニットは、上記ＬＥＤ基板の面内方向において上記ＬＥＤ基板を挟んで互いに反対側に位置する、請求項２に記載のＬＥＤ照明装置。 The LED lighting device according to claim 2, wherein the first and second units are located on opposite sides of the LED board in the in-plane direction of the LED board.
  4. 　上記第１ユニットは、上記ＬＥＤ基板と平行である第１電源基板を有し、上記第２ユニットは、上記ＬＥＤ基板と平行である第２電源基板を有する、請求項３に記載のＬＥＤ照明装置。 4. The LED lighting device according to claim 3, wherein the first unit includes a first power supply substrate parallel to the LED substrate, and the second unit includes a second power supply substrate parallel to the LED substrate. .
  5. 　上記第１および第２ユニットの少なくともいずれかは、上記ＬＥＤ基板の面内方向に長手方向が含まれるように配置された細長状電気部品を有する、請求項４に記載のＬＥＤ照明装置。 5. The LED lighting device according to claim 4, wherein at least one of the first and second units has an elongated electrical component disposed so that a longitudinal direction is included in an in-plane direction of the LED substrate.
  6. 　上記第１および第２電源基板のうち上記細長状電気部品が搭載されているものには、上記細長状電気部品の少なくとも一部を収容する切り欠きが形成されている、請求項５に記載のＬＥＤ照明装置。 The notch which accommodates at least one part of the said elongate electric component is formed in the thing in which the said elongate electric component is mounted among the said 1st and 2nd power supply boards. LED lighting device.
  7. 　上記ＬＥＤ基板を搭載する搭載面と、上記電源部を収容する電源収容部と、上記複数のＬＥＤチップからの光を通過させる出射口と、を有するケースをさらに備える、請求項１に記載のＬＥＤ照明装置。 The LED according to claim 1, further comprising a case having a mounting surface on which the LED substrate is mounted, a power storage unit that stores the power supply unit, and an emission port that allows light from the plurality of LED chips to pass through. Lighting device.
  8. 　上記ケースは、上記出射口が設けられた表面側とは反対側の裏面側に形成された裏面スリットを有する、請求項７に記載のＬＥＤ照明装置。 The LED lighting device according to claim 7, wherein the case has a back surface slit formed on a back surface side opposite to the front surface side on which the emission port is provided.
  9. 　上記裏面スリットは、上記ＬＥＤ基板の面内方向において、上記電源収容部とは重ならない位置に設けられている、請求項８に記載のＬＥＤ照明装置。 The LED lighting device according to claim 8, wherein the back slit is provided at a position that does not overlap with the power supply accommodating portion in the in-plane direction of the LED substrate.
  10. 　上記裏面スリットは、上記ＬＥＤ基板の面内方向において、上記搭載面と重なる位置に設けられている、請求項８に記載のＬＥＤ照明装置。 The LED illumination device according to claim 8, wherein the back slit is provided at a position overlapping the mounting surface in an in-plane direction of the LED substrate.
  11. 　上記ケースは、上記表面および裏面をつなぐ側面から内方に延びる内部スリットを有する、請求項７に記載のＬＥＤ照明装置。 The LED lighting device according to claim 7, wherein the case has an internal slit extending inward from a side surface connecting the front surface and the back surface.
  12. 　上記内部スリットは、上記ＬＥＤ基板の面内方向において、上記搭載面および上記電源収容部とは重ならない位置に設けられている、請求項１１に記載のＬＥＤ照明装置。 12. The LED lighting device according to claim 11, wherein the internal slit is provided at a position that does not overlap the mounting surface and the power supply housing portion in an in-plane direction of the LED substrate.
  13. 　上記電源部につながる少なくとも１つのコネクタをさらに備えており、上記ケースには、上記コネクタを収容するコネクタ収容部が形成されている、請求項７に記載のＬＥＤ照明装置。 The LED lighting device according to claim 7, further comprising at least one connector connected to the power supply unit, wherein the case is formed with a connector housing unit that houses the connector.
  14. 　２つの上記コネクタを備えており、上記ケースは、互いに隣接する２つの上記コネクタ収容部を有する、請求項１３に記載のＬＥＤ照明装置。 The LED lighting device according to claim 13, comprising two connectors, wherein the case has two connector housing portions adjacent to each other.
  15. 　上記ケースは平面視矩形状であり、上記２つのコネクタ収容部は、上記ケースの同一の角につながる２辺に沿って配置されており、上記ケースには、上記角に設けられており、かつ上記２つのコネクタ収容部を露出させるケーブル開口をさらに有する、請求項１４に記載のＬＥＤ照明装置。 The case has a rectangular shape in plan view, the two connector housing portions are arranged along two sides connected to the same corner of the case, the case is provided at the corner, and The LED lighting device according to claim 14, further comprising a cable opening exposing the two connector housing portions.
  16. 　２つの上記コネクタを備えており、上記ケースは平面視円形であり、上記コネクタ収容部は、上記２つのコネクタを互いに平行な配置で収容しており、上記ケースには、上記角に設けられており、かつ上記２つのコネクタ収容部を露出させるケーブル開口をさらに有する、請求項１３に記載のＬＥＤ照明装置。 The two connectors are provided, the case is circular in plan view, and the connector housing portion houses the two connectors in a mutually parallel arrangement, and the case is provided at the corner. The LED lighting device according to claim 13, further comprising a cable opening that exposes the two connector housing portions.
  17. 　上記ケースを覆い、かつ上記ＬＥＤチップからの光を出射させる開口を有するカバーをさらに備えており、上記カバーは、その上端が、被取付け面に接し、または正対している、請求項７に記載のＬＥＤ照明装置。 The cover according to claim 7, further comprising a cover that covers the case and has an opening that emits light from the LED chip, the upper end of the cover being in contact with or facing the mounting surface. LED lighting device.
  18. 　上記カバーの上記開口を有する面と上記上端を有する面とが斜面部分で連なり、上記斜面部分の外面と上記被取付け面とがなす角は、鈍角である、請求項１７に記載のＬＥＤ照明装置。 The LED illumination device according to claim 17, wherein a surface having the opening and a surface having the upper end of the cover are continuous at an inclined portion, and an angle formed by an outer surface of the inclined portion and the attached surface is an obtuse angle. .
  19. 　上記ケースを覆い、かつ上記ＬＥＤチップからの光を出射させる開口を有するカバーをさらに備えており、上記カバーは、上記ケースとともに被取付け面よりも奥方に位置する埋設部と、上記被取付け面に係合する額縁部とを有する、請求項７に記載のＬＥＤ照明装置。 The cover further includes a cover that covers the case and has an opening that emits light from the LED chip, and the cover is provided on the mounting surface with an embedded portion that is located behind the mounting surface together with the case. The LED lighting device according to claim 7, further comprising a frame portion to be engaged.
  20. 　上記カバーは、上記開口を囲むリフレクタをさらに有する、請求項１９に記載のＬＥＤ照明装置。 The LED illumination device according to claim 19, wherein the cover further includes a reflector surrounding the opening.
PCT/JP2010/069073 2009-10-27 2010-10-27 Led lighting device WO2011052639A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009-246757 2009-10-27
JP2009246757 2009-10-27
JP2010051143A JP5547520B2 (en) 2009-10-27 2010-03-08 LED lighting device
JP2010-051143 2010-03-08

Publications (1)

Publication Number Publication Date
WO2011052639A1 true WO2011052639A1 (en) 2011-05-05

Family

ID=43922064

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/069073 WO2011052639A1 (en) 2009-10-27 2010-10-27 Led lighting device

Country Status (2)

Country Link
JP (1) JP5547520B2 (en)
WO (1) WO2011052639A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046319A1 (en) * 2011-09-27 2013-04-04 東芝ライテック株式会社 Lamp and illuminating apparatus
JP2013118292A (en) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Led light-emitting device
JP2016503968A (en) * 2013-01-10 2016-02-08 モレックス エルエルシー LED assembly
EP3037721A1 (en) * 2014-12-22 2016-06-29 STEINEL GmbH Sensor-controlled lighting device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101177470B1 (en) 2012-03-19 2012-08-24 엘지전자 주식회사 Lighting apparatus
JP2013206850A (en) * 2012-03-29 2013-10-07 Toshiba Lighting & Technology Corp Lighting system
JP5988219B2 (en) * 2013-01-31 2016-09-07 パナソニックＩｐマネジメント株式会社 Lighting device
CN104235641B (en) * 2013-06-09 2016-04-06 四川新力光源股份有限公司 Ultrathin type LED light engine
JP5695238B2 (en) * 2013-07-29 2015-04-01 アイリスオーヤマ株式会社 LED lighting device
JP5538609B2 (en) * 2013-09-06 2014-07-02 アイリスオーヤマ株式会社 LED lighting device
JP6202441B2 (en) * 2014-02-20 2017-09-27 パナソニックＩｐマネジメント株式会社 LED lighting fixtures
JP5793268B1 (en) * 2014-04-09 2015-10-14 アイリスオーヤマ株式会社 LED lighting device
JP5820048B1 (en) * 2014-04-22 2015-11-24 アイリスオーヤマ株式会社 LED lighting device
JP5701424B2 (en) * 2014-04-28 2015-04-15 アイリスオーヤマ株式会社 LED lighting device
JP5701422B2 (en) * 2014-04-28 2015-04-15 アイリスオーヤマ株式会社 LED lighting device
JP5793269B1 (en) * 2014-05-19 2015-10-14 アイリスオーヤマ株式会社 LED lighting device
JP5793272B1 (en) * 2014-06-19 2015-10-14 アイリスオーヤマ株式会社 LED lighting device
JP2014232737A (en) * 2014-09-08 2014-12-11 アイリスオーヤマ株式会社 Led lighting device
JP6391005B2 (en) * 2014-09-10 2018-09-19 パナソニックＩｐマネジメント株式会社 Lighting apparatus and lighting apparatus using the same
JP2018125164A (en) * 2017-02-01 2018-08-09 パナソニックＩｐマネジメント株式会社 Light source device
JP7065325B2 (en) * 2018-01-29 2022-05-12 パナソニックＩｐマネジメント株式会社 lighting equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3126337U (en) * 2006-08-10 2006-10-19 超▲ちょ▼科技股▲ふん▼有限公司 Large LED lamp
JP2009004131A (en) * 2007-06-19 2009-01-08 Sharp Corp Lighting system
JP2009064636A (en) * 2007-09-05 2009-03-26 Toshiba Lighting & Technology Corp Lighting device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593075U (en) * 1992-05-25 1993-12-17 松下電工株式会社 Mounting structure for electrical components
JP2007027056A (en) * 2005-07-21 2007-02-01 Sony Corp Backlight unit and liquid crystal display device
JP4367388B2 (en) * 2005-08-23 2009-11-18 パナソニック電工株式会社 LED lighting fixtures
JP2008166331A (en) * 2006-12-27 2008-07-17 Lecip Corp Electronic apparatus and its manufacturing method
JP2009009804A (en) * 2007-06-27 2009-01-15 Sharp Corp Lighting apparatus
JP5106179B2 (en) * 2008-02-29 2012-12-26 シャープ株式会社 Lighting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3126337U (en) * 2006-08-10 2006-10-19 超▲ちょ▼科技股▲ふん▼有限公司 Large LED lamp
JP2009004131A (en) * 2007-06-19 2009-01-08 Sharp Corp Lighting system
JP2009064636A (en) * 2007-09-05 2009-03-26 Toshiba Lighting & Technology Corp Lighting device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046319A1 (en) * 2011-09-27 2013-04-04 東芝ライテック株式会社 Lamp and illuminating apparatus
CN103732977A (en) * 2011-09-27 2014-04-16 东芝照明技术株式会社 Lamp and illuminating apparatus
JP2013118292A (en) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Led light-emitting device
US9335035B2 (en) 2011-12-02 2016-05-10 Citizen Electronics Co., Ltd. Lighting device including light-emitting element
JP2016503968A (en) * 2013-01-10 2016-02-08 モレックス エルエルシー LED assembly
US10390399B2 (en) 2013-01-10 2019-08-20 Molex, Llc LED assembly having base insert molded about terminals and substrate with a plurality of LED chips positioned on said substrate
EP3037721A1 (en) * 2014-12-22 2016-06-29 STEINEL GmbH Sensor-controlled lighting device

Also Published As

Publication number Publication date
JP2011119206A (en) 2011-06-16
JP5547520B2 (en) 2014-07-16

Similar Documents

Publication Publication Date Title
WO2011052639A1 (en) Led lighting device
JP4854798B2 (en) Lighting device
JP5052647B2 (en) Lighting device
WO2011152137A1 (en) Illumination device
CN104246353A (en) Lamp and lighting apparatus
JP2011159447A (en) Lighting system
JP2013077493A (en) Led lighting device
JP5971504B2 (en) Illumination light source and illumination device
JP6135908B2 (en) Illumination light source and illumination device
JP6620984B2 (en) lighting equipment
JP2018085212A (en) Luminaire
JP2014179332A (en) Light source for illumination and lighting device
JP6108304B2 (en) Illumination light source and illumination device
JP2017139133A (en) Lighting fixture
JP2014143021A (en) Illumination light source and lighting apparatus
JP7022945B2 (en) lighting equipment
JP5914839B2 (en) LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE SAME
JP5799218B2 (en) LED unit and lighting apparatus using the same
WO2013128733A1 (en) Light-emitting device, and illumination apparatus using same
JP2017027865A (en) Lighting apparatus
JP6029067B2 (en) Illumination light source and illumination device
JP6112451B2 (en) Illumination light source and illumination device
JP6191942B2 (en) Illumination light source and illumination device
JP6135986B2 (en) Illumination light source and illumination device
JP2015050165A (en) Light source for lighting and lighting device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10826771

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10826771

Country of ref document: EP

Kind code of ref document: A1