WO2011052639A1 - Led lighting device - Google Patents

Led lighting device Download PDF

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Publication number
WO2011052639A1
WO2011052639A1 PCT/JP2010/069073 JP2010069073W WO2011052639A1 WO 2011052639 A1 WO2011052639 A1 WO 2011052639A1 JP 2010069073 W JP2010069073 W JP 2010069073W WO 2011052639 A1 WO2011052639 A1 WO 2011052639A1
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WO
WIPO (PCT)
Prior art keywords
led
lighting device
led lighting
power supply
case
Prior art date
Application number
PCT/JP2010/069073
Other languages
French (fr)
Japanese (ja)
Inventor
智一 岡▲崎▼
勝 伊垣
広宣 金子
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009-246757 priority Critical
Priority to JP2009246757 priority
Priority to JP2010051143A priority patent/JP5547520B2/en
Priority to JP2010-051143 priority
Application filed by ローム株式会社 filed Critical ローム株式会社
Publication of WO2011052639A1 publication Critical patent/WO2011052639A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/04Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

Disclosed is an LED lighting device that is easy to install on a ceiling or the like. Said LED lighting device (A1) is provided with: a plurality of LED modules (3); an LED substrate (2) that supports the plurality of LED modules (3); and a power-supply unit (4) that supplies power to the plurality of LED modules (3) and has a section that, if projected into the plane of the LED substrate (2), does not overlap the LED substrate (2).

Description

LED lighting device

The present invention relates to an LED lighting device used by being attached to a ceiling, for example.

FIG. 40 shows an example of a conventional LED lighting device. The LED lighting device 90 shown in the figure is used as a downlight while attached to the ceiling 600. The LED lighting device 90 includes a case 92 and a plurality of LED modules 93 and a power supply unit 94 housed in the case 92. The light from the LED module 93 is radiated toward the indoor floor after the directivity is enhanced by the reflector 91. The power supply unit 94 converts, for example, commercial AC 100V power into DC 24V power and supplies the converted power to the LED module 93.

In the LED lighting device 90, the case 92 that houses the power supply unit 94 projects to the opposite side of the LED module 93 in the light irradiation direction, and the height is relatively high. For this reason, in order to suitably attach the LED lighting device 90 to the ceiling 600, it is necessary to form the opening 100 in the ceiling 600 and embed the LED lighting device 90 in the ceiling 600. Such an installation work is troublesome. Further, once the opening 100 is provided, it is very difficult to change the mounting position of the LED lighting device 90. Further, when there is a strong beam inside the ceiling 600, the opening 100 cannot be provided at a desired position, and therefore the LED lighting device 90 cannot be attached at the desired position.

JP 2009-64636 A

The present invention has been conceived under the above circumstances, and an object thereof is to provide an LED lighting device that can be easily attached to a ceiling or the like.

According to the present invention, an LED illumination device including a plurality of LED chips is provided. The LED lighting device includes: an LED substrate that supports the plurality of LED chips; and a power supply unit that supplies power to the plurality of LED chips and has a portion that does not overlap the LED substrate in an in-plane direction of the LED substrate. Prepare.

In a preferred embodiment of the present invention, the power supply unit includes first and second units.

In a preferred embodiment of the present invention, the first and second units are located on opposite sides of the LED board in the in-plane direction of the LED board.

In a preferred embodiment of the present invention, the first unit has a first power supply substrate parallel to the LED substrate, and the second unit has a second power supply substrate parallel to the LED substrate. .

In a preferred embodiment of the present invention, at least one of the first and second units has an elongated electrical component arranged so that the longitudinal direction is included in the in-plane direction of the LED substrate.

In a preferred embodiment of the present invention, a notch for accommodating at least a part of the elongated electrical component is formed in the first and second power supply boards on which the elongated electrical component is mounted. Has been.

In a preferred embodiment of the present invention, there is provided a case having a mounting surface on which the LED substrate is mounted, a power supply accommodating portion that accommodates the power supply portion, and an emission port that allows light from the plurality of LED chips to pass through. Further prepare.

In a preferred embodiment of the present invention, the case has a back surface slit formed on the back surface side opposite to the front surface side on which the emission port is provided.

In a preferred embodiment of the present invention, the back slit is provided at a position that does not overlap the power supply accommodating portion in the in-plane direction of the LED substrate.

In a preferred embodiment of the present invention, the back slit is provided at a position overlapping the mounting surface in the in-plane direction of the LED substrate.

In a preferred embodiment of the present invention, the case has an internal slit extending inward from a side surface connecting the front surface and the back surface.

In a preferred embodiment of the present invention, the internal slit is provided at a position that does not overlap the mounting surface and the power supply accommodating portion in the in-plane direction of the LED substrate.

In a preferred embodiment of the present invention, at least one connector connected to the power supply unit is further provided, and the case is formed with a connector housing portion for housing the connector.

In a preferred embodiment of the present invention, the two connectors are provided, and the case has two connector housing portions adjacent to each other.

In a preferred embodiment of the present invention, the case has a rectangular shape in plan view, and the two connector housing portions are arranged along two sides connected to the same corner of the case. And a cable opening provided at the corner and exposing the two connector housing portions.

In a preferred embodiment of the present invention, two connectors are provided, the case is circular in plan view, and the connector housing portion houses the two connectors in a parallel arrangement with each other. The case further includes a cable opening provided at the corner and exposing the two connector housing portions.

In a preferred embodiment of the present invention, the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip. Against.

In a preferred embodiment of the present invention, the surface of the cover having the opening and the surface having the upper end are connected by a slope portion, and the angle formed by the outer surface of the slope portion and the mounting surface is an obtuse angle. .

In a preferred embodiment of the present invention, the apparatus further includes a cover that covers the case and has an opening that emits light from the LED chip, and the cover is located behind the mounting surface together with the case. And a frame portion that engages with the mounting surface.

In a preferred embodiment of the present invention, the cover further includes a reflector surrounding the opening.

According to such a configuration, the LED illumination device can be made relatively flat. Thereby, it is possible to attach the said LED lighting apparatus, without providing an opening etc. in a ceiling. Therefore, the LED lighting device can be easily attached. Moreover, even after once attaching, the attachment position of an LED lighting apparatus can be changed by a comparatively simple operation | work. Further, even when an opening is provided in the ceiling, the height of the portion embedded in the ceiling can be reduced. Thereby, it is possible to reduce the installation space which should be ensured inside the ceiling.

Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a perspective view which shows the LED lighting apparatus based on 1st Embodiment of this invention. It is a disassembled perspective view which shows the LED lighting apparatus shown in FIG. FIG. 3 is a sectional view taken along line III-III in FIG. 1. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is a top view which shows the back case, power supply part, LED board, and LED module of the LED lighting apparatus shown in FIG. It is a top view which shows the LED board and LED module of the LED lighting apparatus shown in FIG. It is a top view which shows the LED module of the LED lighting apparatus shown in FIG. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. It is a top view which shows the 2nd unit of the power supply part of the LED lighting apparatus shown in FIG. It is a top view which shows the 1st unit of the power supply part of the LED lighting apparatus shown in FIG. It is a perspective view which shows the LED lighting apparatus based on 2nd Embodiment of this invention. It is a disassembled perspective view which shows the LED lighting apparatus shown in FIG. FIG. 16 is a cross-sectional view taken along line XVII-XVII in FIG. 15. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is a top view which shows the back case, power supply part, LED board, and LED module of the LED lighting apparatus shown in FIG. It is a perspective view which shows the LED lighting apparatus based on 3rd Embodiment of this invention. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is a perspective view which shows the modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. It is a side view which shows the other modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. It is a top view which shows the other modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. It is sectional drawing which shows the further another modification of the LED lighting apparatus based on 1st thru | or 3rd embodiment of this invention. It is a top view which shows the LED lighting apparatus based on 4th Embodiment of this invention. It is a top view which shows the front case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the front case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case of the LED lighting apparatus shown in FIG. It is a bottom view which shows the back case of the LED lighting apparatus shown in FIG. It is a top view which shows the back case and power supply part of the LED lighting apparatus shown in FIG. It is sectional drawing which shows an example of the conventional LED lighting apparatus.

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

1 to 14 show an LED illumination device according to the first embodiment of the present invention. The LED lighting device A1 of the present embodiment includes a case 1, an LED substrate 2, a plurality of LED modules 3, a power supply unit 4, and a light-transmitting plate 5, and is used as a downlight in a state of being attached to a ceiling 600, for example. It is done. In the drawings other than FIG. 3, the translucent plate 5 is omitted for the sake of understanding.

The case 1 accommodates the LED substrate 2, the LED module 3, the power supply unit 4, and the translucent plate 5. The case 1 is made of, for example, aluminum and has a thin rectangular parallelepiped shape with a plan view dimension of about 98 mm square and a height of about 16 mm. Case 1 is constituted by front case 1A and back case 1B.

As shown in FIGS. 4 and 5, the front case 1A is formed with an emission port 11, a first power supply accommodating recess 131A, and a second power supply accommodating recess 132A. The emission port 11 is formed substantially at the center of the front case 1 </ b> A, and is for emitting light from the LED module 3 to the outside of the case 1. The diameter of the emission port 11 is 50 mm, for example. As shown in FIG. 3, the emission port 11 is formed in a portion slightly retracted inward from the front side of the front case 1 </ b> A. As shown in FIG. 5, the first power supply receiving recess 131 </ b> A and the second power supply receiving recess 132 </ b> A are arranged on opposite sides of the emission port 11 in the diagonal direction of the front case 1 </ b> A. Each of the first power supply recess portion 131A and the second power supply recess portion 132A has a shape defined by five straight portions (a shape lacking one side of the hexagon), and its depth is about 5.6 mm. is there.

As shown in FIGS. 6 and 7, the back case 1B is formed with a plurality of back slits 14, first power supply recesses 131B, and second power supply recesses 132B. As shown in FIG. 2, the back case 1 </ b> B has a mounting base 12 for mounting the LED substrate 2 at substantially the center thereof. The mounting base 12 has a substantially square shape in plan view and has a mounting surface 12a. The first power supply receiving recess 131B and the second power supply receiving recess 132B are arranged on opposite sides of the mounting base 12 in the diagonal direction of the back case 1B. The first power supply receiving recess 131B and the second power supply receiving recess 132B are both substantially hexagonal and have a depth of about 7.4 mm. The back slit 14 is formed on the surface of the back case 1B opposite to the surface on which the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B are formed. In the present embodiment, the back slit 14 is formed at a position that does not overlap with the mounting base 12, the first power supply receiving recess 131 </ b> B, and the second power supply receiving recess 132 </ b> B in plan view. Each back slit 14 extends in the diagonal direction of the back case 1B, and has a width of about 1.5 mm and a depth of about 5 mm.

As shown in FIG. 2, the case 1 is configured by superposing and joining a front case 1A and a back case 1B. As can be seen from FIGS. 2 and 3, the first power supply accommodating portion 131 is formed by the combination of the first power supply accommodating recess 131A of the front case 1A and the first power supply recess 131B of the back case 1B. The second power supply accommodating portion 132 is configured by coupling the two power supply accommodating recesses 132A and the second power supply accommodating recess 132B of the back case 1B.

A plurality of LED modules 3 are mounted on the LED substrate 2. As shown in FIG. 10, the LED substrate 2 includes a base material 21 and a wiring pattern 22 formed on the base material 21. The base material 21 is made of, for example, a glass epoxy resin having a relatively good thermal conductivity by mixing a filler having a high thermal conductivity. The wiring pattern 22 is for electrically connecting the plurality of LED modules 3 to each other. The plurality of LED modules 3 are mounted in a substantially circular region having a diameter of about 50 to 60 mm, for example.

11 and 12, each LED module 3 includes an LED chip 31, a resin package 32, a substrate 33, and a pair of mounting terminals 34. The LED module 3 is a small and very thin LED module having a width of 0.8 mm, a length of 1.6 mm, and a thickness of about 0.5 mm.

The substrate 33 is an insulating substrate having a substantially rectangular shape in plan view made of, for example, glass epoxy resin. The LED chip 31 is mounted on the front surface of the substrate 33, and a pair of mounting terminals 34 are formed on the back surface of the substrate 33. The thickness of the substrate 33 is about 0.08 to 0.1 mm. The LED chip 31 is a light source of the LED module 3 and can emit visible light, for example. The resin package 32 protects the LED chip 31. The resin package 32 is formed by molding a resin that transmits light from the LED chip 31, such as an epoxy resin. Alternatively, the resin package 32 may be formed by molding a translucent resin containing a fluorescent material that emits light of a different wavelength when excited by light from the LED chip 31. For example, the LED module 3 can emit white light by mixing blue light from the LED chip 31 and yellow light from the fluorescent material included in the resin package 32. Instead of the fluorescent substance that emits yellow light, a fluorescent substance that emits red light and a fluorescent substance that emits green light may be mixed and used.

In the present embodiment, 603 LED modules 3 are arranged on the LED substrate 2 in a staggered manner. In order to cause the LED module 3 to emit light, a voltage Vf of about 3.0 V and a current If of about 4.0 mA are applied to each LED chip 31. By mounting a plurality of LED modules 3 each functioning as a point light source at a high density, the area in which the LED modules 3 are mounted constitutes a planar light source unit.

As shown in FIG. 2, FIG. 3 and FIG. 9, the LED substrate 2 is attached to the mounting base 12 of the back case 1B. Specifically, the surface of the LED substrate 2 opposite to the surface supporting the LED module 3 is attached to the mounting surface 12 a of the mounting base 12. As shown in FIG. 1, the LED module 3 faces the outside through the opening 11.

The power supply unit 4 converts, for example, commercial AC 100V power into DC 24V power, and supplies it to the plurality of LED modules 3. In the present embodiment, the power supply unit 4 includes a first unit 41 as shown in FIG. 14 and a second unit 42 as shown in FIG.

As shown in FIG. 14, the first unit 41 includes a first power supply board 411 and a plurality of electrical components 412. The first power supply substrate 411 has a substantially rectangular shape in plan view, and is made of, for example, a glass epoxy resin. A cutout 411 a is formed in the first power supply substrate 411. The plurality of electrical components 412 are components for realizing the function of the power supply unit 4. Of the plurality of electrical components 412, the electrical component 412A is a capacitor. The capacitor 412A has a main body 412Aa and a lead 412Ab. The main body 412Aa has an elongated cylindrical shape. The lead 412Ab protrudes from the main body 412Aa. In the present embodiment, the main body 412Aa is mounted such that its long axis extends in parallel with the first power supply substrate 411, and a part thereof is accommodated in the notch 411a. As shown in FIG. 3, the lead 412Ab is bent at a substantially right angle, and the tip thereof is joined to the first power supply substrate 411 by soldering, for example. The electrical component 412A is an example of an elongated electrical component referred to in the present invention. An electrical component 412B shown in FIG. 14 is a surge absorber and functions to protect other electrical components 412 and 422 from an excessive voltage.

As shown in FIG. 13, the second unit 42 includes a second power supply board 421 and a plurality of electrical components 422. Second power supply substrate 421 has a substantially hexagonal shape in plan view, and is made of, for example, glass epoxy resin. Of the plurality of electrical components 422, the electrical component 422A is a coil, the electrical component 422B is a power MOSFET used for switching purposes, and the electrical component 422C is a driver IC for driving the LED module 3.

As shown in FIGS. 2, 3, and 8, the first unit 41 and the second unit 42 are accommodated in the first power supply accommodating portion 131 and the second power supply accommodating portion 132 of the case 1, respectively. Therefore, the first unit 41 and the second unit 42 are arranged on opposite sides in the diagonal direction of the case 1 with the plurality of LED modules 3 (mounting base 12) interposed therebetween.

The translucent plate 5 is made of a translucent or transparent glass plate and transmits light from the LED module 3. As shown in FIG. 3, the translucent plate 5 is provided between the opening 11 and the LED substrate 2.

Next, the operation of the LED lighting device A1 will be described.

According to the present embodiment, the power supply unit 4 is arranged side by side in the in-plane direction of the LED substrate 2 with respect to the plurality of LED modules 3. With such an arrangement, the LED lighting device A1 can be formed into a very flat shape having a size of about 98 mm square in plan view and a height of about 16 mm. Therefore, as shown in FIG. 3, the LED lighting device A1 can be attached without providing an opening or the like in the ceiling 600. Therefore, the mounting operation of the LED lighting device A1 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A1 can be changed by a comparatively simple operation | work.

By configuring the power supply unit 4 with the first unit 41 and the second unit 42, the power supply unit 4 can be disposed relatively compactly in plan view so as to sandwich the plurality of LED modules 3. This contributes to downsizing of the LED lighting device A1.

By disposing the elongated electrical component 412A in parallel to the first power supply substrate 411, the height of the LED lighting device A1 can be reduced. By accommodating a part of the electrical component 412A in the notch 411a of the first power supply board 411, the downsizing of the LED lighting device A1 can be further promoted.

The heat generated from the plurality of LED modules 3 is quickly transmitted to the mounting table 12. Thereby, it can avoid that the some LED module 3 deteriorates by high temperature. The back slit 14 of the back case 1B is suitable for dissipating the heat transmitted to the mounting base 12 to the outside. In particular, when the LED lighting device A1 is attached to the ceiling 600, the back slit 14 functions to introduce outside air between the ceiling 600 and the back case 1B. This contributes to efficient heat dissipation.

The back slit 14 is provided at a position that does not overlap the first power supply recess 131B and the second power supply recess 132B in plan view. If the back slit 14 is to be formed at a position overlapping the first power supply recess 131B and the second power supply recess 132B in plan view, the back case 1B needs to have a large thickness, and the height of the LED lighting device A1 is high. Leads to an increase. The configuration of the present embodiment in which the rear slit 14 does not overlap the first power supply receiving recess 131B and the second power supply receiving recess 132B is suitable for reducing the height of the LED lighting device A1.

15 to 23 show an LED lighting device according to the second embodiment of the present invention. The LED lighting device A2 of the present embodiment is different from the above-described embodiment in that it has an internal slit 15 and the arrangement of the back slit 14. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

As shown in FIG. 15, the case 1 is formed with a plurality of internal slits 15 extending from the side surface of the case 1 toward the inside. As shown in FIG. 19, a plurality of half slits 15A are formed in the front case 1A. The half slit 15A is provided at a position avoiding the opening 11, the first power supply accommodating recess 131A, and the second power supply accommodating recess 132A. The half slits 15A are divided and arranged on both sides of the opening 11 in the diagonal direction of the front case 1A. Each half slit 15A has a width of about 2.5 mm and a depth of about 4.6 mm. As shown in FIG. 20, a plurality of half slits 15B are formed in the back case 1B. The half slit 15B is provided at a position on the back case 1B away from the mounting base 12, the first power supply accommodating recess 131B, and the second power supply accommodating recess 132B. The half slits 15B are divided and arranged on both sides of the mounting base 12 in the diagonal direction of the back case 1B. Each half slit 15B has a width of about 2.5 mm and a depth of about 5 mm.

As can be understood from FIGS. 15, 16, 19, and 20, the half slit 15A and the half slit 15B are configured to overlap when the front case 1A and the back case 1B are combined. The internal slit 15 is configured by the combination of the half slit 15A and the half slit 15B.

As shown in FIG. 21, in the present embodiment, the back surface slit 14 is also formed on the back surface of the mounting table 12. All the back slits 14 extend in the diagonal direction of the back case 1B.

Also according to this embodiment, it is possible to attach the LED lighting device A2 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A2 can be easily performed. Moreover, even after once attaching, the attachment position of LED lighting apparatus A2 can be changed by a comparatively simple operation | work.

Also, by providing the internal slit 15, heat radiation to the outside can be further promoted. Since the internal slit 15 is provided at a position that avoids the mounting base 12 and the power supply unit 4, heat dissipation can be promoted without increasing the height of the LED lighting device A <b> 2. By providing the back surface slit 14 on the back side of the mounting table 12, the heat transmitted to the mounting table 12 can be dissipated more efficiently.

24 to 29 show an LED illumination device according to the third embodiment of the present invention. The LED lighting device A3 of the present embodiment is different from the above-described embodiment in that two connectors 43 are provided and two connector housings 133 are formed in the case 1.

As shown in FIG. 25, the front case 1A of the present embodiment has the same shape as the front case 1A of the above-described embodiment when viewed from the front side. As shown in FIG. 26, two connector housing recesses 133A are formed in the front case 1A. Each connector housing recess 133A has a size that just houses the connector 43 shown in FIG. The two connector housing recesses 133A are arranged in the vicinity of the corners along two sides forming one corner of the front case 1A.

As shown in FIG. 27, two connector housing recesses 133B are formed in the back case 1B. Each connector housing recess 133B has a size that just houses the connector 43 shown in FIG. The two connector housing recesses 133B are arranged in the vicinity of the corners along two sides forming one corner of the back case 1B.

Each connector accommodating part 133 is comprised by combining the connector accommodating recessed part 133A and the connector accommodating recessed part 133B. As shown in FIG. 24, a cable opening 16 is further formed in the case 1. The cable opening 16 exposes the two connector recesses 133 </ b> A and 133 </ b> B, and allows the cable 700 from the outside to be connected to the connector 43 in the connector housing portion 133.

As shown in FIG. 29, the LED substrate 2 and the power supply unit 4 in the present embodiment are arranged in the same manner as shown in FIG. Each connector 43 is housed in a connector housing recess 133 </ b> B (connector housing portion 133), and is connected to the power supply unit 4 (first unit 41 or second unit 42) via a cable 44.

Also according to this embodiment, it is possible to attach the LED lighting device A3 without providing an opening or the like in the ceiling 600. Therefore, the attaching operation of the LED lighting device A3 can be easily performed. Moreover, in LED lighting apparatus A3 of this embodiment, the cable 700 can be inserted from the side of an apparatus. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to form a hole in the ceiling 600 for passing the cable 700.

FIG. 30 shows a modification of the LED lighting devices A1 to A3. In this modification, a cover 51 is further provided for housing the LED lighting devices A1 to A3. The cover 51 as a whole has a rectangular shape in plan view and a box shape with a relatively low height. The cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes. The upper end edge of the cover 51 is configured to contact the ceiling 600 or to face each other with a slight gap. The cover 51 has a flat surface portion in which the opening 51a is formed and four slope portions surrounding the flat surface portion. The outer surface of the slope portion and the ceiling 600 form an obtuse angle. In the present embodiment, this obtuse angle is about 135 degrees. According to such a modification, the back slit 14 and the like for promoting the heat dissipation effect cannot be seen from the outside. Therefore, the LED illumination device according to this modification can make the appearance of the ceiling 600 better than the LED illumination device that does not include a cover.

31 and 32 show other modified examples of the LED illumination devices A1 to A3. In this modification, a cover 51 that houses the LED lighting devices A1 to A3 and a metal fitting 52 are further provided. The cover 51 is formed with a circular opening 51a through which light from the LED module 3 passes. The cover 51 has an embedded portion 51b and a frame portion 51c. The embedded portion 51b surrounds the LED lighting devices A1 to A3. The embedded part 51 b is a part embedded in the ceiling 600. The frame portion 51c has a rectangular frame shape in plan view, and is connected to the periphery of the embedded portion 51b. The frame portion 51 c is a portion that engages with the surface of the ceiling 600. The metal fitting 52 is formed by bending a band-shaped metal plate, and prevents the cover 51 from coming off from the ceiling 600.

As described above, the LED lighting devices A1 to A3 are relatively low in height, and the height of the embedded portion 51b embedded in the ceiling 600 is significantly smaller than that of a conventional downlight. For this reason, it is not necessary to ensure a large space inside the ceiling 600 in order to accommodate the LED lighting device. Therefore, even if the buildings have the same height, a larger distance can be ensured between the floor (not shown) and the ceiling 600.

FIG. 33 shows another modification of the LED lighting devices A1 to A3. This modification differs from the above-described modification in that a reflector 51d is provided on the cover 51. The reflector 51d has a parabolic shape and enhances the directivity of light from the plurality of LED modules 3. Further, a translucent plate 53 is disposed between the reflector 51d and the LED lighting devices A1 to A3. The translucent plate 53 is made of, for example, acrylic resin.

The LED illumination device according to such a modification can emit light with higher directivity, and can irradiate light intensively to a narrower area of the floor surface, for example. Although the reflector 51d is provided, the height is still significantly lower than the conventional downlight. For this reason, it is not necessary to secure a large accommodation space inside the ceiling 600.

34 to 39 show an LED illumination device according to the fourth embodiment of the present invention. The LED lighting device A4 of this embodiment is different from the above-described embodiment in that the planar view is circular. As shown in FIGS. 34 to 38, the front case 1A and the back case 1B are also circular in plan view. In the present embodiment, the first power supply accommodating portion 131 and the second power supply accommodating portion 132 are provided at positions shifted by 90 degrees in the circumferential direction of the case 1. As shown in FIG. 39, the connector housing part 133 houses two connectors 43 in parallel.

Also according to this embodiment, it is possible to attach the LED lighting device A4 without providing an opening or the like in the ceiling 600. Therefore, attachment work can be performed easily. Also in the LED lighting device A4, the cable 700 can be inserted from the side of the device. For this reason, the cable 700 can be routed along the ceiling 600, and there is no need to provide a hole in the ceiling 600 for passing the cable 700. Note that the modifications shown in FIGS. 31 to 33 may be applied to the LED illumination device A4 of the present embodiment.

The LED lighting device according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the LED lighting device according to the present invention can be variously modified.

Claims (20)

  1. An LED lighting device comprising a plurality of LED chips,
    An LED substrate that supports the plurality of LED chips;
    A power supply unit that supplies power to the plurality of LED chips and has a portion that does not overlap the LED substrate in an in-plane direction of the LED substrate;
    An LED lighting device comprising:
  2. The LED power unit according to claim 1, wherein the power supply unit includes first and second units.
  3. The LED lighting device according to claim 2, wherein the first and second units are located on opposite sides of the LED board in the in-plane direction of the LED board.
  4. 4. The LED lighting device according to claim 3, wherein the first unit includes a first power supply substrate parallel to the LED substrate, and the second unit includes a second power supply substrate parallel to the LED substrate. .
  5. 5. The LED lighting device according to claim 4, wherein at least one of the first and second units has an elongated electrical component disposed so that a longitudinal direction is included in an in-plane direction of the LED substrate.
  6. The notch which accommodates at least one part of the said elongate electric component is formed in the thing in which the said elongate electric component is mounted among the said 1st and 2nd power supply boards. LED lighting device.
  7. The LED according to claim 1, further comprising a case having a mounting surface on which the LED substrate is mounted, a power storage unit that stores the power supply unit, and an emission port that allows light from the plurality of LED chips to pass through. Lighting device.
  8. The LED lighting device according to claim 7, wherein the case has a back surface slit formed on a back surface side opposite to the front surface side on which the emission port is provided.
  9. The LED lighting device according to claim 8, wherein the back slit is provided at a position that does not overlap with the power supply accommodating portion in the in-plane direction of the LED substrate.
  10. The LED illumination device according to claim 8, wherein the back slit is provided at a position overlapping the mounting surface in an in-plane direction of the LED substrate.
  11. The LED lighting device according to claim 7, wherein the case has an internal slit extending inward from a side surface connecting the front surface and the back surface.
  12. 12. The LED lighting device according to claim 11, wherein the internal slit is provided at a position that does not overlap the mounting surface and the power supply housing portion in an in-plane direction of the LED substrate.
  13. The LED lighting device according to claim 7, further comprising at least one connector connected to the power supply unit, wherein the case is formed with a connector housing unit that houses the connector.
  14. The LED lighting device according to claim 13, comprising two connectors, wherein the case has two connector housing portions adjacent to each other.
  15. The case has a rectangular shape in plan view, the two connector housing portions are arranged along two sides connected to the same corner of the case, the case is provided at the corner, and The LED lighting device according to claim 14, further comprising a cable opening exposing the two connector housing portions.
  16. The two connectors are provided, the case is circular in plan view, and the connector housing portion houses the two connectors in a mutually parallel arrangement, and the case is provided at the corner. The LED lighting device according to claim 13, further comprising a cable opening that exposes the two connector housing portions.
  17. The cover according to claim 7, further comprising a cover that covers the case and has an opening that emits light from the LED chip, the upper end of the cover being in contact with or facing the mounting surface. LED lighting device.
  18. The LED illumination device according to claim 17, wherein a surface having the opening and a surface having the upper end of the cover are continuous at an inclined portion, and an angle formed by an outer surface of the inclined portion and the attached surface is an obtuse angle. .
  19. The cover further includes a cover that covers the case and has an opening that emits light from the LED chip, and the cover is provided on the mounting surface with an embedded portion that is located behind the mounting surface together with the case. The LED lighting device according to claim 7, further comprising a frame portion to be engaged.
  20. The LED illumination device according to claim 19, wherein the cover further includes a reflector surrounding the opening.
PCT/JP2010/069073 2009-10-27 2010-10-27 Led lighting device WO2011052639A1 (en)

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JP2009-246757 2009-10-27
JP2009246757 2009-10-27
JP2010051143A JP5547520B2 (en) 2009-10-27 2010-03-08 LED lighting device
JP2010-051143 2010-03-08

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